A wafer film laminating and degassing device and a processing method

Abstract

The present invention discloses a wafer film pasting and defoaming device and a processing method, which specifically relates to the technical field of wafer film pasting and defoaming. The wafer film pasting and defoaming device includes a base, and a material guiding, film pasting and defoaming assembly is arranged on the base. The material guiding, film pasting and defoaming assembly includes a heating box arranged on one side of the top of the base, and a turntable is arranged on one side of the heating box. Through the corresponding cooperation of each structure, the pasting slope can be in contact with the outer side of the wafer, and it is easy for the rotating film body of the second material roll to pass through the limiting film pasting of the pressing rod and the pasting slope on the outer side of the wafer. After the film pasting is completed, the wafer can be conveyed to the bottom of the pressing shaft, which is conducive to continuous film pasting production of the wafer. The contact between the pressing shaft and the outer side of the wafer presses the film on the wafer, so that the bubbles generated during film pasting can be pressed out. By resetting the heating plate and heating it through the heating box, it is easy for the film to fully adhere to the wafer, ensuring the film pasting quality.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer film laminating and degassing, and more specifically, the present invention relates to a wafer film laminating and degassing device and a processing method. Background Art

[0002] A wafer refers to a silicon wafer used for fabricating silicon semiconductor circuits, and is also known as a silicon wafer. Its raw material is silicon, which undergoes a series of complex processing processes, such as cutting, polishing, slicing, etc., and finally forms a round wafer with a specific diameter, that is, a wafer. A wafer is a carrier used for manufacturing integrated circuits, and can be classified into specifications such as 4 inches, 5 inches, 6 inches, 8 inches, etc. according to its diameter. Recently, wafers with a diameter of 12 inches or even larger have been developed. The main processing methods of wafers are single-wafer processing and batch processing, processing one or more wafers simultaneously.

[0003] Problems such as contamination and scratches on the wafer surface will affect the product quality. Wafer film laminating is an effective method to avoid these problems. By covering a thin film on the wafer surface, the wafer can be protected from contamination, scratches, etc. during the manufacturing process and storage. However, some bubbles that cannot be removed will inevitably appear during the film laminating process, thus affecting the product quality and causing defective products. Therefore, a wafer film laminating and degassing device is provided. Summary of the Invention

[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides a wafer film laminating and degassing device and a processing method, aiming to solve the problems raised in the above background art.

[0005] The present invention is implemented as follows. The present invention provides the following technical solutions:

[0006] A wafer film laminating and degassing device includes a base, and a material guiding, film laminating and degassing assembly is arranged on the base; the material guiding, film laminating and degassing assembly includes a heating box arranged on one side of the top of the base, a turntable is arranged on one side of the heating box, a plurality of support shaft seats are distributed on the outer side of the turntable, and a vertical plate is arranged on the side of the turntable away from the heating box; a pressing rod is arranged on one side of the vertical plate, the pressing rod is slidably connected to the vertical plate, and a film laminating slope is formed on one side of the bottom of the pressing rod; an L-shaped rod located on one side of the turntable is arranged between the heating box and the turntable, an electric push rod is arranged on one side of the top of the L-shaped rod, a connecting plate is arranged at the output end of the electric push rod, a guiding seat is arranged at the bottom of the connecting plate, a pressing frame is arranged at the bottom of the guiding seat, and two pressing shafts are rotatably connected to the bottom of the pressing frame.

[0007] It can be seen that in the above technical solution, the wafer is placed on the support shaft seat. The turntable rotates to drive the displacement of multiple support shaft seats, so that the support shaft seat can be displaced to one end of the pressing rod. The hydraulic rod is activated to drive the displacement of the pressing rod, so that the pasting slope can be in contact with the outer side of the wafer. It is easy for the rotating film body of the second reel to be limited by the pressing rod and the pasting slope to be pasted on the outer side of the wafer, and the waste is wound on the second reel;

[0008] Optionally, in a possible implementation manner, a first reel is provided on one side of the top of the vertical plate. A second reel is provided at the bottom of the first reel. A hydraulic rod is provided at the top of the pressing rod. The output end of the hydraulic rod extends to the pressing rod. A film body is provided on the first reel. One end of the film body is wound around the second reel from the end of the pressing rod;

[0009] Optionally, in a possible implementation manner, two vertical rods are provided on the top of the lower pressing frame. The vertical rods extend to the guiding seat and are slidably connected to the guiding seat. Springs are sleeved on the outer sides of the vertical rods. A lead screw transmission module is provided on one side of the heating box. The lead screw transmission module is installed on the base. A material taking gripper is provided on the lead screw transmission module. A conveyor belt is provided at the bottom of the material taking gripper. The conveyor belt is installed on the base. A plurality of backing plates are provided in the heating box. Heating plates are provided on the tops of the backing plates. An electric slide rail is provided between the backing plate and the heating plate. The heating plate is slidably connected to the electric slide rail. An electric actuator is provided on the backing plate;

[0010] It can be seen that in the above technical solution, the wafer is placed on the support shaft seat. The turntable rotates to drive the displacement of multiple support shaft seats, so that the support shaft seat can be displaced to one end of the pressing rod. The hydraulic rod is activated to drive the displacement of the pressing rod, so that the pasting slope can be in contact with the outer side of the wafer. It is easy for the rotating film body of the second reel to be limited by the pressing rod and the pasting slope to be pasted on the outer side of the wafer, and the waste is wound on the second reel. At the same time, when the pressing shaft is in contact with the wafer, the pressing shaft is limited by the wafer, and the vertical rod is displaced and the spring is compressed to buffer when the pressing shaft is in contact with the wafer. The material taking gripper clamps it, so that the wafer can be conveyed to the conveyor belt. The electric actuator is activated to drive the electric slide rail to run, and then the heating plate extends out of the heating box. Then the wafer is placed on the heating plate. The heating plate is reset and heated through the heating box, which is easy for the film to fit well with the wafer and ensure the film pasting quality.

[0011] The present invention also provides a processing method, using the above wafer film pasting and degassing equipment, including the following steps:

[0012] Step 1: The staff installs the device at the designated position. When laminating the wafer, place the wafer on the support shaft seat. Drive the displacement of multiple support shaft seats through the rotation of the turntable, so that the support shaft seat can be displaced to one end of the pressure rod. Start the hydraulic rod to drive the displacement of the pressure rod, so that the laminating slope can contact the outer side of the wafer, which is conducive to the rotation of the second coil reel to limit the film body to be laminated on the outer side of the wafer, and the waste can be wound on the second coil reel;

[0013] Step 2: After the wafer laminating is completed, rotate the turntable to convey the wafers on the remaining support shaft seats to the bottom of the pressure rod for laminating. After the laminating is completed, the wafers can be conveyed to the bottom of the pressing shaft. Start the electric push rod to drive the connecting plate to drive the guide seat, the lower pressing frame and the pressing shaft to move downward. The contact between the pressing shaft and the outer side of the wafer presses the film on the wafer, so that the bubbles generated during laminating can be pressed out;

[0014] Step 3: At the same time, when the pressing shaft contacts the wafer, the pressing shaft is limited by the wafer, causing the vertical rod to displace and the spring to compress, buffering when the pressing shaft contacts the wafer to avoid damage to the film;

[0015] Step 4: After the wafer is de-bubbled by extrusion of the pressing shaft, rotate the turntable, clamp it with the picking gripper, so that the wafer can be conveyed to the conveyor belt. Start the electric actuator to drive the electric slide rail to run, and then the heating plate extends out of the heating box. Then place the wafer on the heating plate, and the heating plate returns through the heating box for heating, which is conducive to the film being fully attached to the wafer to ensure the laminating quality.

[0016] The technical effects and advantages of the present invention:

[0017] 1. In the present invention, the wafer is placed on the support shaft seat, and the rotation of the turntable drives the displacement of multiple support shaft seats, so that the support shaft seat can be displaced to one end of the pressure rod. Start the hydraulic rod to drive the displacement of the pressure rod, so that the laminating slope can contact the outer side of the wafer, which is conducive to the rotation of the second coil reel to limit the film body to be laminated on the outer side of the wafer through the limitation of the pressure rod and the laminating slope, and the waste can be wound on the second coil reel;

[0018] 2. In the present invention, the turntable rotates to convey the wafers on the remaining support shaft seats to the bottom of the pressure rod for laminating. After the laminating is completed, the wafers can be conveyed to the bottom of the pressing shaft, which is conducive to continuous wafer laminating production;

[0019] 3. In the present invention, start the electric push rod to drive the connecting plate to drive the guide seat, the lower pressing frame and the pressing shaft to move downward. The contact between the pressing shaft and the outer side of the wafer presses the film on the wafer, so that the bubbles generated during laminating can be pressed out to ensure the laminating quality;

[0020] 4. In the present invention, the electric actuator is started to drive the electric slide rail to operate, so that the heating plate extends out of the heating box. Then, the wafer is placed on the heating plate, and the heating plate is reset to pass through the heating box for heating, which is conducive to the film being fully attached to the wafer and ensuring the film attachment quality.

[0021] In summary, the overall design is simple and the structure is reasonable. Through the corresponding cooperation of each structure, the displacement of the pressure rod enables the laminating slope to contact the outer side of the wafer. It is easy for the rotating film body of the second material roll to be limited by the pressure rod and the laminating slope to be laminated on the outer side of the wafer, while the waste material can be wound on the second material roll. The wafers on the other support pedestals are transported to the bottom of the pressure rod for lamination, and the wafers after lamination can be transported to the bottom of the pressing shaft, which is conducive to continuous wafer lamination production. The contact between the pressing shaft and the outer side of the wafer presses the film on the wafer, so that the bubbles generated during lamination can be pressed out. The heating plate is reset to pass through the heating box for heating, which is conducive to the film being fully attached to the wafer and ensuring the film attachment quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only the drawings of some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual dimensions of the products, the actual processes of the methods, the actual timings of the signals, etc. involved in the embodiments of the present disclosure.

[0023] Figure 1 It is the front view of the overall structure of the present invention.

[0024] Figure 2 It is the side view of the overall structure of the present invention.

[0025] Figure 3 It is the top view of the overall structure of the present invention.

[0026] Figure 4 It is the side view of the connecting plate, guiding seat and lower pressing frame of the present invention.

[0027] Figure 5 It is the three-dimensional view of the heating box, backing plate and electric slide rail of the present invention.

[0028] Figure 6 It is the three-dimensional view of the backing plate, electric slide rail and heating plate of the present invention.

[0029] In the figure: 1, base; 2, heating box; 3, turntable; 4, support shaft seat; 5, vertical plate; 6, first material coil reel; 7, second material coil reel; 8, pressure bar; 9, laminating slope; 10, hydraulic rod; 11, film body; 12, L-shaped rod; 13, electric push rod; 14, connecting plate; 15, guiding seat; 16, downward pressing frame; 17, pressing shaft; 18, vertical rod; 19, spring; 20, screw drive module; 21, material picking gripper; 22, backing plate; 23, heating plate; 24, electric slide rail; 25, electric actuator; 26, conveyor belt. Detailed implementation mode

[0030] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0031] As shown in the attached Figure 1-6 A wafer laminating and defoaming device. Through the feeding, laminating and defoaming assembly arranged on the base 1, by the displacement of the pressure bar 8, the laminating slope 9 can be in contact with the outer side of the wafer. It is easy for the film body 11 rotated by the second material coil reel 7 to pass through the limiting laminating of the pressure bar 8 and the laminating slope 9 on the outer side of the wafer, and the waste material can be wound on the second material coil reel 7. The wafers on the rest of the support shaft seats 4 are transported to the bottom of the pressure bar 8 for laminating. After the laminating is completed, the wafers can be transported to the bottom of the pressing shaft 17, which is conducive to continuous laminating production of the wafers. The contact between the pressing shaft 17 and the outer side of the wafer presses the bubbles generated during laminating, and the heating plate 23 is reset to be heated through the heating box 2, which is conducive to the film being fully adhered to the wafer to ensure the laminating quality. The specific structure of the assembly is as follows;

[0032] The feeding, laminating and defoaming assembly includes a heating box 2 arranged on one side of the top of the base 1. A turntable 3 is arranged on one side of the heating box 2. A plurality of support shaft seats 4 are distributed on the outer side of the turntable 3. A vertical plate 5 is arranged on the side of the turntable 3 away from the heating box 2;

[0033] A pressure bar 8 is arranged on one side of the vertical plate 5. The pressure bar 8 is slidably connected to the vertical plate 5. A laminating slope 9 is opened on one side of the bottom of the pressure bar 8;

[0034] An L-shaped rod 12 is arranged between the heating box 2 and the turntable 3 on one side of the turntable 3. An electric push rod 13 is arranged on one side of the top of the L-shaped rod 12. The output end of the electric push rod 13 is provided with a connecting plate 14. A guiding seat 15 is arranged at the bottom of the connecting plate 14. A downward pressing frame 16 is arranged at the bottom of the guiding seat 15. Two pressing shafts 17 are rotatably connected to the bottom of the downward pressing frame 16.

[0035] On one side of the top of the vertical plate 5, a first material reel 6 is provided. At the bottom of the first material reel 6, a second material reel 7 is provided. At the top of the pressing rod 8, a hydraulic rod 10 is provided. The output end of the hydraulic rod 10 extends to the pressing rod 8. On the first material reel 6, a film body 11 is provided. One end of the film body 11 is wound around the second material reel 7 from the end of the pressing rod 8;

[0036] On the top of the lower pressing frame 16, two vertical rods 18 are provided. The vertical rods 18 extend to the guiding seat 15 and are slidably connected to the guiding seat 15. A spring 19 is sleeved outside the vertical rods 18. On one side of the heating box 2, a screw rod transmission module 20 is provided. The screw rod transmission module 20 is installed on the base 1. On the screw rod transmission module 20, a material taking gripper 21 is provided. At the bottom of the material taking gripper 21, a conveyor belt 26 is provided. The conveyor belt 26 is installed on the base 1. In the heating box 2, a plurality of cushion plates 22 are provided, and on the top of each cushion plate 22, a heating plate 23 is provided. Between the cushion plate 22 and the heating plate 23, an electric slide rail 24 is provided. The heating plate 23 is slidably connected to the electric slide rail 24. On the cushion plate 22, an electric actuator 25 is provided;

[0037] The present invention also provides a processing method, using the above-mentioned wafer film pasting and defoaming device, which specifically includes the following steps:

[0038] Step 1, the staff installs the device at a designated position. When pasting a film on a wafer, the wafer is placed on the support shaft seat 4. Driven by the rotation of the turntable 3, multiple support shaft seats 4 are displaced, so that the support shaft seat 4 can be displaced to one end of the pressing rod 8. The hydraulic rod 10 is started to drive the pressing rod 8 to displace, so that the pasting slope 9 can contact the outside of the wafer, facilitating the film body 11 rotated by the second material reel 7 to be limitedly pasted on the outside of the wafer, and the waste material can be wound on the second material reel 7;

[0039] Step 2, after the wafer film pasting is completed, the turntable 3 rotates to convey the wafers on the remaining support shaft seats 4 to the bottom of the pressing rod 8 for film pasting. After the film pasting is completed, the wafer can be conveyed to the bottom of the pressing shaft 17. The electric push rod 13 is started to drive the connecting plate 14 to drive the guiding seat 15, the lower pressing frame 16 and the pressing shaft 17 to displace downward. The pressing shaft 17 contacts the outside of the wafer to press the film on the wafer, so that the bubbles generated during film pasting can be pressed out;

[0040] Step 3, at the same time when the pressing shaft 17 contacts the wafer, the pressing shaft 17 is limited by the wafer, and the vertical rod 18 is displaced and the spring 19 is compressed to buffer when the pressing shaft 17 contacts the wafer, avoiding damage to the film;

[0041] Step four, after the wafer is squeezed and defoamed by the pressing shaft 17, it is rotated by the turntable 3 and clamped by the material grabber 21, so that the wafer can be transported to the conveyor belt 26, and the electric actuator 25 starts to drive the electric slide rail 24 to make the heating plate 23 extend from the heating box 2, and then the wafer is placed on the heating plate 23. The heating plate 23 is reset and heated by the heating box 2, so that the film can be easily attached to the wafer and the quality of the film can be ensured.

[0042] According to the above structure, when in use, the wafer is placed on the support shaft seat 4, and the turntable 3 rotates to drive the multiple support shaft seats 4 to move, so that the support shaft seat 4 can move to one end of the pressure rod 8, and the hydraulic rod 10 is used to start the pressure rod 8 to move, so that the side slope 9 can contact the outside of the wafer, and the second material reel 7 can rotate so that the film body 11 can pass through the pressure rod 8 and the side slope 9 to stick the film on the outside of the wafer, and the waste material can be rolled up on the second material reel 7;

[0043] After the wafer film is attached, the turntable 3 rotates to transport the remaining wafers on the support shaft seat 4 to the bottom of the pressure rod 8 for film attachment, and the wafers after film attachment can be transported to the bottom of the pressure shaft 17, and the electric push rod 13 starts to drive the connecting plate 14 to drive the guide seat 15, the lower pressure frame 16 and the pressure shaft 17 to move downward, and the pressure shaft 17 contacts the outer side of the wafer to pressurize the film on the wafer, so that the bubbles generated during film attachment can be pressed out;

[0044] At the same time, when the pressing shaft 17 contacts the wafer, the pressing shaft 17 is limited by the wafer, and the vertical rod 18 is displaced and the spring 19 is compressed, so as to buffer the pressing shaft 17 when it contacts the wafer to avoid damage to the film. After the wafer is squeezed and defoamed by the pressing shaft 17, it is rotated by the turntable 3 and clamped by the material grabber 21, so that the wafer can be transported to the conveyor belt 26, and the electric actuator 25 starts to drive the electric slide rail 24 to operate, so that the heating plate 23 is extended from the heating box 2, and then the wafer is placed on the heating plate 23, and the heating plate 23 is reset to be heated by the heating box 2, so that the film is easy to fully fit with the wafer and the quality of the film is ensured.

[0045] Different from the prior art, the present application discloses a wafer film laminating and degassing device and a processing method. By the displacement of the pressing rod 8, the laminating slope 9 can be brought into contact with the outer side of the wafer, facilitating the rotation of the second coil reel 7 so that the film body 11 can pass through the limiting film lamination of the pressing rod 8 and the laminating slope 9 on the outer side of the wafer, and the waste material can be wound on the second coil reel 7. The wafers on the remaining support shaft seats 4 are transported to the bottom of the pressing rod 8 for film lamination, and the wafers after film lamination can be transported to the bottom of the pressing shaft 17, facilitating continuous film lamination production of the wafers. The contact between the pressing shaft 17 and the outer side of the wafer presses the film on the wafer, so that the bubbles generated during film lamination can be pressed out. By the reset of the heating plate 23 and passing through the heating box 2 for heating, it is easy for the film to fully adhere to the wafer, ensuring the film lamination quality.

[0046] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A wafer film laminating and degassing device, comprising a base (1), characterized in that: A material guiding, film pasting and defoaming assembly is provided on the base (1); the material guiding, film pasting and defoaming assembly includes a heating box (2) arranged on one side of the top of the base (1), a turntable (3) is arranged on one side of the heating box (2), a plurality of support shaft seats (4) are distributed on the outer side of the turntable (3), and a vertical plate (5) is arranged on the side of the turntable (3) away from the heating box (2); a pressing rod (8) is arranged on one side of the vertical plate (5), the pressing rod (8) is slidably connected with the vertical plate (5), and a film pasting slope (9) is formed on one side of the bottom of the pressing rod (8); an L-shaped rod (12) located on one side of the turntable (3) is arranged between the heating box (2) and the turntable (3), an electric push rod (13) is arranged on one side of the top of the L-shaped rod (12), a connecting plate (14) is arranged at the output end of the electric push rod (13), a guiding seat (15) is arranged at the bottom of the connecting plate (14), a pressing frame (16) is arranged at the bottom of the guiding seat (15), and two pressing shafts (17) are rotatably connected to the bottom of the pressing frame (16). A first material roll (6) is arranged on one side of the top of the vertical plate (5), a second material roll (7) is arranged at the bottom of the first material roll (6), and a hydraulic rod (10) is arranged at the top of the pressing rod (8). The output end of the hydraulic rod (10) extends to the pressing rod (8), a film body (11) is arranged on the first material roll (6), and one end of the film body (11) is wound around the second material roll (7) from the end of the pressing rod (8). Two vertical rods (18) are arranged on the top of the pressing frame (16), the vertical rods (18) extend to the guiding seat (15) and are slidably connected with the guiding seat (15), and a spring (19) is sleeved on the outer side of the vertical rods (18). A lead screw drive module (20) is arranged on one side of the heating box (2), the lead screw drive module (20) is installed on the base (1), and a material taking gripper (21) is arranged on the lead screw drive module (20). A conveyor belt (26) is arranged at the bottom of the material taking gripper (21), and the conveyor belt (26) is installed on the base (1). A plurality of backing plates (22) are arranged in the heating box (2), and heating plates (23) are arranged on the tops of the backing plates (22). An electric slide rail (24) is arranged between the backing plate (22) and the heating plate (23), the heating plate (23) is slidably connected with the electric slide rail (24), and an electric actuator (25) is arranged on the backing plate (22).

2. A processing method, using the wafer film laminating and degassing device according to claim 1, characterized in that, It includes the following steps: Step 1, place the wafer on the support shaft seat (4), drive the displacement of a plurality of support shaft seats (4) through the rotation of the turntable (3), so that the support shaft seat (4) can be displaced to one end of the pressing rod (8), start to drive the displacement of the pressing rod (8) through the hydraulic rod (10), so that the film pasting slope (9) can be in contact with the outer side of the wafer, and it is easy for the second material roll (7) to rotate and the film body (11) to be limitedly pasted on the outer side of the wafer, while the waste material can be wound on the second material roll (7). Step 2: Rotate the turntable (3) again to convey the wafers on the remaining support pedestals (4) to the bottom of the pressing rod (8) for film pasting. After the film pasting is completed, the wafers can be conveyed to the bottom of the pressing shaft (17). By contacting the outside of the wafer with the pressing shaft (17), the film pasting on the wafer is pressurized, so that the bubbles generated during film pasting can be pressed out; Step 3: At the same time, when the pressing shaft (17) contacts the wafer, the pressing shaft (17) is limited by the wafer, causing the vertical rod (18) to displace and the spring (19) to compress, buffering the contact between the pressing shaft (17) and the wafer; Step 4: After the wafer is de-bubbled by the extrusion of the pressing shaft (17), it rotates through the turntable (3) and is clamped by the picking gripper (21), so that the wafer can be conveyed onto the conveyor belt (26). The electric actuator (25) is started to drive the electric slide rail (24) to run, and then the heating plate (23) extends out of the heating box (2). Then the wafer is placed on the heating plate (23), and the heating plate (23) is reset and heated in the heating box (2), which is conducive to the film pasting being fully adhered to the wafer to ensure the film pasting quality.

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