Infrared temperature measurement method and system suitable for environmental temperature changes

Abstract

The present application relates to a kind of infrared temperature measurement method and system suitable for environmental temperature change, it includes: constructing mapping relationship;Infrared thermal imaging equipment is moved from first temperature environment to second temperature environment, and real-time acquisition several shutter temperature and several focal plane temperature, the Y16 value that is inquired by the focal plane temperature mean value;Infrared thermal imaging equipment in shutdown state is moved to second temperature environment, and shutter temperature rise amount is acquired;Compensation coefficient in first infrared temperature measurement result compensation model is obtained by least square method;Current Y16 value obtained by infrared thermal imaging equipment is compensated based on second infrared temperature measurement result compensation model.The present application can guarantee that infrared thermal imaging equipment is not affected by environmental temperature change in use, when the environmental temperature where infrared thermal imaging equipment is located changes, target temperature can be quickly and accurately acquired, and the target temperature measured meets error requirement, can meet temperature measurement accuracy requirement.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of infrared temperature measurement technology, and in particular to an infrared temperature measurement method and system suitable for changes in ambient temperature. BACKGROUND

[0002] At present, infrared devices are widely used in many fields, especially for measuring the temperature of a target using an infrared device. However, when using an infrared temperature measurement device to measure the temperature, it is affected by many conditions, such as atmospheric humidity, the emissivity of the target, the distance between the target and the device, and whether the ambient temperature of the device is constant. In particular, when the infrared temperature measurement device is moved from a constant ambient temperature to another ambient temperature, it is usually necessary to shut down the device for a period of time or to place the device at another ambient temperature for more than half an hour to ensure the accuracy of the temperature measurement, thereby affecting the work efficiency. SUMMARY

[0003] The present application aims to provide an infrared temperature measurement method and system suitable for changes in ambient temperature, which can ensure that the infrared thermal imaging device is not affected by changes in ambient temperature during use, and can quickly and accurately obtain the target temperature when the ambient temperature of the infrared thermal imaging device changes, and the measured target temperature meets the error requirement, thereby meeting the temperature measurement accuracy requirement.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0005] In one aspect, an infrared temperature measurement method suitable for changes in ambient temperature is provided, comprising:

[0006] A mapping relationship ftemp=f(Y16,FpaTemp) is constructed, wherein f temp is the target temperature output by the infrared thermal imaging device, Y16 is the Y16 value obtained by converting the infrared radiation signal of the target object by the infrared thermal imaging device, and FpaTemp is the focal plane temperature of the infrared detector of the infrared thermal imaging device;

[0007] The infrared thermal imaging device is moved from a first temperature environment to a second temperature environment, and the infrared thermal imaging device is operated in the second temperature environment and outputs the current target temperature f temp0 , and a plurality of shutter temperatures and a plurality of focal plane temperatures FpaTemp0 are obtained in real time;

[0008] The plurality of focal plane temperatures FpaTemp0 are averaged to obtain the average focal plane temperature FpaTemp0', and the mapping relationship f tempY16=f(Y16', FpaTemp), Y16 is the Y16 value of the infrared thermal imaging device in the second temperature environment by inquiring the average focal plane temperature FpaTemp0' of the infrared thermal imaging device in the second temperature environment;

[0009] The infrared thermal imaging device in the shutdown state is moved to the second temperature environment, and is powered on after being placed in the second temperature environment for a period of time, and the shutter temperature rise is obtained after being powered on;

[0010] The compensation coefficients K1, K2 and K3 in the first infrared temperature measurement result compensation model are obtained by the least square method, and the expression of the infrared temperature measurement result compensation model is as follows:

[0011] Y16=Y16'+K1·ΔTemp·abs(ΔTemp)+K2·S rate +K3

[0012] Wherein, Y16 and Y16' are the compensated Y16 value and the Y16 value before compensation respectively; ΔTemp=(T e +T m -T s ), wherein T e is the temperature of the second temperature environment, T s is the real-time shutter temperature of the infrared thermal imaging device at the current time t; S rate is the shutter temperature rise rate at the current time t; abs(*) represents taking the absolute value;

[0013] The current Y16 value obtained by the infrared thermal imaging device is compensated based on the second infrared temperature measurement result compensation model to obtain the compensated Y16 value, and the compensated target temperature is output according to the compensated Y16 value, and the expression of the second infrared temperature measurement result compensation model is as follows:

[0014] Y160=Y160'+K1·ΔTemp0·abs(ΔTemp0)+K2·S rate0 +K3

[0015] Wherein, Y160 and Y160' are the compensated Y16 value and the current Y16 value obtained by the infrared thermal imaging device respectively; ΔTemp0=(T e0 +T m -T s0 ), wherein T e0 is the temperature of the environment in which the infrared thermal imaging device is currently located, T s0 is the real-time shutter temperature of the infrared thermal imaging device at the current time t0; S rate0 is the shutter temperature rise rate at the current time t0; abs(*) represents taking the absolute value.

[0016] Preferably, the infrared thermal imaging device is in a power-off state before moving from the first temperature environment to the second temperature environment, and is powered on after moving to the second temperature environment, or the infrared thermal imaging device is in a continuous power-on state before moving from the first temperature environment to the second temperature environment, and continues to work after moving to the second temperature environment.

[0017] Preferably, the infrared thermal imaging device in the power-off state is moved to the second temperature environment, and is powered on after being placed in the second temperature environment for more than 1-2 hours.

[0018] Preferably, the shutter temperature rise amount is obtained according to formula (1):

[0019] T m = T ms -T m0 (1)

[0020] Wherein, T m is the shutter temperature rise amount, T m0 and T ms are shutter temperatures when the infrared thermal imaging device in the power-off state is moved to the second temperature environment and powered on after being placed for a certain period of time, and the shutter temperature when the infrared thermal imaging device works in the second temperature environment for t2 time in a stable working state.

[0021] Preferably, the shutter temperature rise rate S rate = |(T q -T p )| / ΔT, ΔT is a predetermined time interval before the current time t, T p and T q are the first shutter temperature and the last shutter temperature recorded in the predetermined time interval ΔT.

[0022] Preferably, the shutter temperature rise rate S rate0 = |(T q0 -T p0) | / ΔT0, ΔT0 is a predetermined time interval before the current time t0, T p0 and T q0 are the first shutter temperature and the last shutter temperature recorded in the predetermined time interval ΔT0.

[0023] Preferably, the compensated target temperature T is obtained according to T=g(Y160), wherein g(*) is a curve formed by target Y16 data-target temperature T.

[0024] In another aspect, an infrared temperature measurement system is also provided, which comprises:

[0025] a mapping relationship construction module, configured to construct a mapping relationship f temp = f(Y16, FpaTemp), and store the result.

[0026] a data query module, configured to, when the infrared thermal imaging device is moved from the first temperature environment to the second temperature environment and is working in the second temperature environment, inversely query the Y16 value of the infrared thermal imaging device working in the second temperature environment according to the mean value FpaTemp0' of the focal plane temperature.

[0027] a shutter temperature rise amount acquisition module, configured to move the infrared thermal imaging device in the shutdown state to the second temperature environment, and acquire the shutter temperature rise amount when working in the second temperature environment.

[0028] a compensation coefficient determination module, configured to acquire the compensation coefficients K1, K2 and K3 in the first infrared temperature measurement result compensation model by the least square method.

[0029] and a compensation module, configured to compensate the current Y16 value acquired by the infrared thermal imaging device based on the second infrared temperature measurement result compensation model to obtain a compensated Y16 value, and output the compensated target temperature according to the compensated Y16 value.

[0030] Compared with the prior art, the present application has the following beneficial effects:

[0031] The infrared temperature measurement result compensation model in the present application can ensure that the infrared thermal imaging device is not affected by the change of the environment temperature during use, and the target temperature can be quickly and accurately acquired when the environment temperature of the infrared thermal imaging device changes, and the measured target temperature meets the error requirement and can meet the temperature measurement accuracy requirement. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 is a step flow chart of the infrared temperature measurement method in the present application.

[0033] Figure 2 is the blackbody temperature output by the untreated infrared thermal imaging device and the blackbody temperature processed by the second infrared temperature measurement result compensation model in the present application.

[0034] Figure 3 is a structure schematic diagram of the infrared temperature measurement system in the present application. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0036] Example 1

[0037] like Figure 1 As shown, this embodiment provides an infrared temperature measurement method suitable for ambient temperature changes, wherein the infrared temperature measurement process is completed based on an infrared thermal imaging device. The infrared thermal imaging device includes an infrared detector, which can sense the infrared radiation of the target object and convert it into an electrical signal. The temperature distribution of the target object is simulated by further processing the electrical signal, thereby obtaining the temperature of the target object. On this basis, the infrared temperature measurement method includes the following steps:

[0038] S1. Construct a mapping relationship ftemp=f(Y16,FpaTemp), where f temp is the target temperature output by the infrared thermal imaging device, Y16 is the Y16 value obtained by converting the infrared radiation signal of the target object by the infrared thermal imaging device, and FpaTemp is the focal plane temperature of the infrared detector of the infrared thermal imaging device; f(*) can be any function, including but not limited to a linear function, a quadratic polynomial function, etc.;

[0039] Place the infrared thermal imaging device in a corresponding working environment (such as a constant temperature environment) to detect the target temperature and output the target temperature f temp , and during the working process, the focal plane temperature FpaTemp and Y16 value at different times can be recorded in real time, and finally the above mapping relationship can be constructed by fitting and other methods;

[0040] S2, move the infrared thermal imaging device from the first temperature environment to the second temperature environment, and make the infrared thermal imaging device work for t1 time in the second temperature environment, and during the working time t1, the infrared thermal imaging device outputs the current target temperature f temp0 , and obtain several shutter temperatures and several focal plane temperatures FpaTemp0 in real time; wherein, the first temperature environment and the second temperature environment are both constant temperature environments, and the temperature difference between the two is greater than or equal to 3° C.;

[0041] Meanwhile, the infrared thermal imaging device is in a shutdown state before moving from the first temperature environment to the second temperature environment, and is started up again after moving to the second temperature environment, or the infrared thermal imaging device is in a continuous startup state before moving from the first temperature environment to the second temperature environment, and continues to work after moving to the second temperature environment;

[0042] S3, averaging the focal plane temperatures FpaTemp0 of the infrared thermal imaging device in the second temperature environment to obtain a focal plane temperature average FpaTemp0', and based on the mapping relationship f temp = f (Y16, FpaTemp), the Y16 value of the infrared thermal imaging device in the second temperature environment is obtained by back calculation through the focal plane temperature average FpaTemp0';

[0043] Because the Y16 value of the infrared thermal imaging device changes with the change of the focal plane temperature during work, the focal plane temperature average FpaTemp0' can be substituted into the mapping relationship in this embodiment to further back calculate the corresponding Y16 value, which is a fixed value and can be used to determine the subsequent coefficients K1, K2 and K3;

[0044] S4, moving the infrared thermal imaging device in the shutdown state to the second temperature environment, starting up after being placed in the second temperature environment for a period of time (such as 1-2 hours or more), and recording the shutter temperature T m0 at startup;

[0045] And after startup, the infrared thermal imaging device works in the second temperature environment for a time t2, and in the working time t2, the shutter temperature T ms of the infrared thermal imaging device in a stable working state (i.e. steady state) is obtained;

[0046] And the shutter temperature rise amount is obtained according to formula (1):

[0047] T m = T ms -T m0 (1)

[0048] Wherein, T m is the shutter temperature rise amount, T m0 , T msThe shutter temperature of the infrared thermal imaging device in the second temperature environment when the infrared thermal imaging device in the shutdown state is moved into the second temperature environment and is turned on after being placed for a period of time, and the shutter temperature of the infrared thermal imaging device when the infrared thermal imaging device works in the second temperature environment for t2 hours in a stable working state (i.e., a steady state);

[0049] S5, obtaining compensation coefficients K1, K2 and K3 in the first infrared temperature measurement result compensation model by a least square method, wherein an expression of the infrared temperature measurement result compensation model is as follows:

[0050] Y16=Y16'+K1·ΔTemp·abs(ΔTemp)+K2·S rate +K3

[0051] Wherein Y16 and Y16' are compensated Y16 values and uncompensated Y16 values, respectively, in this embodiment, the compensated Y16 value is the Y16 value of the infrared thermal imaging device when working in the second temperature environment obtained by inversely searching the focal plane temperature mean value FpaTemp0' in step S2, and the uncompensated Y16 value can be obtained by real-time conversion of the infrared radiation signal of the infrared thermal imaging device to the target object; ΔTemp=(T e +T m -T s ), wherein T e is the temperature of the second temperature environment, T s is the real-time shutter temperature of the infrared thermal imaging device at the current time t when working in the second temperature environment for t2 hours; S rate is the shutter temperature rise rate of the infrared thermal imaging device at the current time t when working in the second temperature environment for t2 hours, and S rate =|(T q -T p )| / ΔT, ΔT is a predetermined time interval (such as 30s) before the current time t, and ΔT is a constant value for different times, T p and T q are the first shutter temperature and the last shutter temperature recorded in the predetermined time interval ΔT, respectively; K1 is a coefficient acting on the difference between the shutter temperature of the infrared thermal imaging device in the stable working state and the real-time shutter temperature under the current environment temperature; K2 is a coefficient acting on the shutter temperature rise rate; K3 is a bias coefficient acting on the compensation result; abs(*) represents taking an absolute value; Y16, Y16', S rate , and ΔTemp are known values;

[0052] Due to the change of ambient temperature, the change of focal plane temperature of the infrared thermal imaging device, etc., there is a difference between the Y16 value before compensation (i.e. Y16') and the Y16 value after compensation (i.e. Y16). Thus, the three compensation coefficients K1, K2 and K3 are determined by the least square method in the embodiment, so that the Y16' at any moment is close to the Y16 value after compensation (when the difference between the Y16 value after compensation and the Y16 value before compensation meets the predetermined condition, it is considered that the Y16' is close to the Y16), so that the temperature measurement result is constant;

[0053] S6, compensating the current Y16 value obtained by the infrared thermal imaging device based on the second infrared temperature measurement result compensation model to obtain the Y16 value after compensation, and outputting the target temperature after compensation according to the Y16 value after compensation;

[0054] The expression of the second infrared temperature measurement result compensation model is as follows:

[0055] Y160 = Y160' + K1·ΔTemp0·abs(ΔTemp0) + K2·S rate0 + K3

[0056] Y160, Y160' are the Y16 value after compensation and the current Y16 value (i.e. the Y16 value before compensation) obtained by the infrared thermal imaging device, respectively; ΔTemp0 = (T e0 + T m - T s0 ), wherein T e0 is the temperature of the environment where the infrared thermal imaging device is currently located, T s0 is the real-time shutter temperature of the infrared thermal imaging device at the current time t0 when the infrared thermal imaging device works in the current environment; S rate0 is the shutter temperature rise rate at the current time t0 when the infrared thermal imaging device works in the current environment, and S rate0 = |(T q0 - T p0 )| / ΔT0, ΔT0 is a predetermined time interval (such as 30s) before the current time t0, and ΔT0 is a constant value for different times, T p0 , T q0 are the 1st shutter temperature and the last shutter temperature recorded in the predetermined time interval ΔT0, respectively; K1, K2 and K3 are determined by step S4, and have the same meaning as in step S4; abs(*) represents taking absolute value; Y160', S rate0 , ΔTemp0 are known values, which can be obtained by real-time calculation;

[0057] Further, the compensated target temperature T can be obtained according to T=g(Y160), wherein g(*) is a curve formed by the target Y16 data-target temperature T, which can be obtained by pre-construction.

[0058] As shown in Figure 2 , a black body with a temperature of 20°C is selected as the target object, the infrared thermal imaging device is placed in a 13°C ambient temperature for 1-2 hours, then taken out, transferred to a 23°C ambient temperature, powered on, and the temperature of the black body is detected. Figure 2 The part (a) in the figure is the black body temperature output by the infrared thermal imaging device without being processed by the second infrared temperature measurement result compensation model in this embodiment, and the part (b) is the black body temperature output by the infrared thermal imaging device after being processed by the second infrared temperature measurement result compensation model in this embodiment. It can be seen that, as the working time of the device is prolonged, the output black body temperature without processing is not within the error range (i.e. within the range of 18°C-22°C between the red lines), and the output black body temperature after processing by the model in this embodiment is basically within the range of 18°C-20°C, which meets the error requirement.

[0059] It can be seen that the second infrared temperature measurement result compensation model in this embodiment can ensure that the infrared thermal imaging device is not affected by the change of the ambient temperature during use, and the target temperature can be quickly and accurately obtained when the ambient temperature of the infrared thermal imaging device changes, and the measured target temperature meets the error requirement, which can meet the temperature measurement accuracy requirement, and the method is simple and easy to operate, and can be implemented on multiple platforms.

[0060] Embodiment 2:

[0061] This embodiment provides an infrared temperature measurement system for implementing the infrared temperature measurement method of embodiment 1, as shown in Figure 3 , the infrared temperature measurement system comprises:

[0062] a mapping relationship construction module 1 for constructing a mapping relationship f temp =f(Y16, FpaTemp) and storing it;

[0063] a data query module 2 for, when the infrared thermal imaging device is moved from a first temperature environment to a second temperature environment and the infrared thermal imaging device works in the second temperature environment for t1 time, inversely inquiring the Y16 value of the infrared thermal imaging device working in the second temperature environment according to the focal plane temperature mean value FpaTemp0', the process of which is the same as step S2;

[0064] a shutter temperature rise amount acquisition module 3 for, when the infrared thermal imaging device in the off state is moved to the second temperature environment and works in the second temperature environment for t2 time, acquiring the shutter temperature rise amount, the process of which is the same as step S3;

[0065] a compensation coefficient determination module 4, which is configured to obtain compensation coefficients K1, K2 and K3 in the first infrared temperature measurement result compensation model by a least square method, and the process is the same as that in step S4;

[0066] and a compensation module 5, which is configured to compensate the current Y16 value obtained by the infrared thermal imaging device based on the second infrared temperature measurement result compensation model to obtain a compensated Y16 value, and output a compensated target temperature according to the compensated Y16 value, and the process is the same as that in step S5.

[0067] In summary, the infrared temperature measurement result compensation model in the present application can ensure that the infrared thermal imaging device is not affected by the change of the ambient temperature during use, and the target temperature can be quickly and accurately obtained when the ambient temperature of the infrared thermal imaging device changes, and the measured target temperature meets the error requirement, can meet the temperature measurement accuracy requirement, and the method is simple and easy to operate, and can be implemented on multiple platforms.

[0068] The above only describes the preferred embodiments of the present application and is not intended to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An infrared temperature measurement method suitable for ambient temperature changes, characterized in that: include: Construct the mapping relationship f temp =f(Y16,FpaTemp), where f temp is the target temperature output by the infrared thermal imaging device, Y16 is the Y16 value obtained by converting the infrared radiation signal of the target object by the infrared thermal imaging device, and FpaTemp is the focal plane temperature of the infrared detector of the infrared thermal imaging device; Move the infrared thermal imaging device from the first temperature environment to the second temperature environment, and make the infrared thermal imaging device work in the second temperature environment, and output the current target temperature f temp0 , and obtain several shutter temperatures and several focal plane temperatures FpaTemp0 in real time; Take the average of several focal plane temperatures FpaTemp0 to obtain the focal plane temperature mean FpaTemp0', and based on the mapping relationship f temp =f(Y16, FpaTemp), and obtaining the Y16 value of the infrared thermal imaging device when operating in the second temperature environment by reversely looking up the focal plane temperature mean FpaTemp0′; Move the infrared thermal imaging device in a powered-off state to a second temperature environment, place it in the second temperature environment for a period of time, then power it on, and obtain the shutter temperature rise after powering it on; The compensation coefficients K1, K2, and K3 in the first infrared temperature measurement result compensation model are obtained by the least square method, wherein the expression of the infrared temperature measurement result compensation model is as follows: Y16=Y16'+K1·ΔTemp·abs(ΔTemp)+K2·S rate +K3 The current Y16 value obtained by the infrared thermal imaging device is compensated based on the second infrared temperature measurement result compensation model to obtain a compensated Y16 value, and a compensated target temperature is output according to the compensated Y16 value. The expression of the second infrared temperature measurement result compensation model is as follows; Y160=Y160'+K1·ΔTemp0·abs(ΔTemp0)+K2·S rate0 +K3 Wherein, Y160 and Y160' are the compensated Y16 value and the current Y16 value obtained by the infrared thermal imaging device respectively; ΔTemp0=(T e0 +T m -T s0 ), where T e0 is the temperature of the environment where the infrared thermal imaging device is currently located, T s0 is the real-time shutter temperature of the infrared thermal imaging device at the current time t0, T m is the shutter temperature rise; S rate0 is the shutter temperature rise rate at the current time t0; abs(*) indicates the absolute value.

2. The infrared temperature measurement method according to claim 1, wherein: The infrared thermal imaging device is in a shutdown state before being moved out of the first temperature environment and moved to the second temperature environment, and is turned on again after the infrared thermal imaging device is moved to the second temperature environment, or the infrared thermal imaging device is in a continuously powered-on state before being moved out of the first temperature environment and moved to the second temperature environment, and is continued to work after the infrared thermal imaging device is moved to the second temperature environment.

3. The infrared temperature measurement method according to claim 1, wherein: Move the infrared thermal imaging device that is in a turned-off state to a second temperature environment, and leave it in the second temperature environment for more than 1-2 hours before turning it on.

4. The infrared temperature measurement method according to claim 2, wherein: According to formula (1), the shutter temperature rise is obtained: T m =T ms -T m0 (1) Among them, T m is the shutter temperature rise, T m0 、T ms They are respectively the shutter temperature when the infrared thermal imaging device in the off state is moved to the second temperature environment and turned on after being placed for a certain period of time, and the shutter temperature when the infrared thermal imaging device is in a stable working state during working time t2 in the second temperature environment.

5. The infrared temperature measurement method according to claim 1, wherein: The shutter temperature rise rate S rate =|(T q -T p )| / ΔT, ΔT is the predetermined time interval before the current time t, T p 、T q They are respectively the first shutter temperature and the last shutter temperature recorded within the predetermined time interval ΔT.

6. The infrared temperature measurement method according to claim 1, wherein: The shutter temperature rise rate S rate0 =|(T q0 -T p0) | / ΔT0, ΔT0 is the predetermined time interval before the current time t0, T p0 、T q0 They are respectively the first shutter temperature and the last shutter temperature recorded within the predetermined time interval ΔT0.

7. The infrared temperature measurement method according to claim 1, wherein: The compensated target temperature T is obtained according to T=g(Y160), where g(*) is a curve formed by target Y16 data-target temperature T.

8. The infrared temperature measurement method according to claim 1, wherein: Obtaining the compensation coefficients K1, K2, and K3 in the infrared temperature measurement result compensation model by the least squares method includes the following steps: Move the infrared thermal imaging device from the first temperature environment to the second temperature environment, and make the infrared thermal imaging device work in the second temperature environment, and output the current target temperature f temp0 , and obtain several shutter temperatures and several focal plane temperatures FpaTemp0 in real time; Based on the mapping relationship between the focal plane temperature and the Y16 value, the Y16 value of the infrared thermal imaging device when working in the second temperature environment is obtained by reversely looking up the focal plane temperature average FpaTemp0' of the plurality of focal plane temperatures FpaTemp0; Move the infrared thermal imaging device in the off state to a second temperature environment, and turn it on after being placed in the second temperature environment for a period of time, and obtain the shutter temperature rise T after turning it on m ; Based on the following model, the compensation coefficients K1, K2, and K3 are obtained by the least squares method: Y16=Y16'+K1·ΔTemp·abs(ΔTemp)+K2·S rate +K3 Wherein, Y16 and Y16' are respectively the Y16 value of the infrared thermal imaging device when working in the second temperature environment and the Y16 value before compensation obtained by reversely checking the focal plane temperature average FpaTemp0'; ΔTemp=(T e +T m -T s ), where T e is the temperature of the second temperature environment, T s S is the real-time shutter temperature of the infrared thermal imaging device at the current time t when the infrared thermal imaging device works for t2 time in the second temperature environment; rate It is the shutter temperature rise rate at the current time t when the infrared thermal imaging device works in the second temperature environment for t2; abs(*) represents the absolute value.

9. The infrared temperature measurement method according to claim 8, characterized in that: S rate =|(T q -T p )| / ΔT, ΔT is the predetermined time interval before the current time t, T p 、T q They are respectively the first shutter temperature and the last shutter temperature recorded within the predetermined time interval ΔT.

10. An infrared temperature measurement system for implementing the infrared temperature measurement method according to any one of claims 1 to 9, characterized in that: include: Mapping relationship building module, which is used to build the mapping relationship f temp =f(Y16,FpaTemp) and store; a data query module for, when the infrared thermal imaging device is moved from a first temperature environment to a second temperature environment and the infrared thermal imaging device is operated in the second temperature environment, retrieving the Y16 value of the infrared thermal imaging device when it is operating in the second temperature environment based on the focal plane temperature mean FpaTemp0'; A shutter temperature rise acquisition module is used to move the infrared thermal imaging device in a shutdown state to a second temperature environment, and acquire the shutter temperature rise when the device is operating in the second temperature environment; A compensation coefficient determination module, which is used to obtain compensation coefficients K1, K2 and K3 in the first infrared temperature measurement result compensation model by least square method; And a compensation module, which is used to compensate the current Y16 value obtained by the infrared thermal imaging device based on the second infrared temperature measurement result compensation model to obtain a compensated Y16 value, and output a compensated target temperature according to the compensated Y16 value.

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