Semiconductor device performance detection device and detection process

Abstract

The invention relates to a semiconductor device performance detection device and a detection process, and relates to the technical field of detection equipment, the semiconductor device performance detection device comprises an equipment support and a detection box clamped on the equipment support, one side of the detection box is slidably provided with a rectangular cover plate through a plurality of side position round rods, and the rectangular cover plate and the detection box are internally provided with a detection device; the detection device comprises a servo motor installed on the equipment support through a motor base, a cross-shaped back plate connected with the end of a rotating shaft of the servo motor is arranged in the detection box, an annular base is arranged on the cross-shaped back plate in a sliding mode through a plurality of square rods, a monitoring assembly is arranged on the annular base, and a plurality of buckling mechanisms are arranged in the detection box. According to the invention, accelerated aging and performance stability testing can be carried out on a plurality of semiconductor devices at one time under different environmental conditions, and the overall performance and quality of the semiconductor devices can be comprehensively detected and evaluated, so that the transfer link of the semiconductor devices between devices with different detection functions can be simplified.

Description

Technical Field

[0001] The present application relates to the technical field of testing equipment, and in particular to a semiconductor device performance testing device and a testing process. Background Art

[0002] Semiconductor devices are electronic devices with conductivity between good conductors and insulators. They use the special electrical properties of semiconductor materials to complete specific functions. They can be used to generate, control, receive, transform, amplify signals and perform energy conversion. Usually, semiconductor devices need to undergo various performance tests before leaving the factory to evaluate the performance of the device under different working conditions, including temperature, humidity, mechanical stress, etc., so as to ensure its stability and reliability in long-term use and guarantee product performance and quality.

[0003] For example, in the existing Chinese patent with the publication number CN219609129U, a semiconductor device high temperature performance test device is disclosed, which includes a box body, a placement table is fixed on the bottom inner wall of the box body, two plug-in slots are provided on the top outer wall of the placement table, a detection metal contact piece is installed on the bottom inner wall of the plug-in slot, a signal transmitter is installed on one side of the box body, and an oscilloscope is installed on the outer wall of the box body on the signal transmitter side; a wind hood is fixed on the top inner wall of the box body, and a plurality of air inlet holes are provided on the outer wall of the wind hood. Through the above-mentioned prior art, the semiconductor device contacts the detection metal contact piece, and the cooperation of the heating wire and the temperature controller can heat the semiconductor device and perform high temperature performance testing.

[0004] However, the above prior art has the following technical defects: When the above-mentioned prior art is used, the contact on the semiconductor device is inserted into the plug slot to contact the detection metal contact piece, the second rotating motor is operated to drive the turntable to rotate, and the two sliders are driven to move relative to each other under the cooperation of the limit block and the limit slot, and the semiconductor device is clamped and fixed by the L-shaped clamping plate, and the temperature controller controls the heating wire to heat the semiconductor device. The first rotating motor drives the fan blade to rotate to improve the heating efficiency of the semiconductor device, and the signal fed back by the oscilloscope is observed to judge the high-temperature performance of the semiconductor device. The above-mentioned device mainly blows the heat energy generated by the heating wire to the semiconductor device through the rotation of the fan blade. There is a certain distance between the heating wire and the semiconductor device. The temperature controller can control the temperature of the heating wire, but when the heat energy of the heating wire acts on the semiconductor device through wind blowing, its heat energy will be dispersed and reduced, that is, the temperature during detection cannot be controlled, so that the data obtained by the above-mentioned device is not accurate.

[0005] Secondly, the above-mentioned device can only perform high-temperature testing on one semiconductor device. It has a single function and low detection efficiency. It cannot meet the simultaneous testing of multiple devices under various environmental conditions, such as accelerated aging and performance stability testing under low temperature, high humidity and other environmental conditions, to detect and evaluate the overall performance of the device under different working conditions.

[0006] Based on this, on the basis of the existing semiconductor device high temperature performance test device, in order to overcome the above technical defects, there is still room for improvement. Summary of the invention

[0007] In order to perform accelerated aging and performance stability tests on multiple semiconductor devices under different environmental conditions at one time, comprehensively test and evaluate the overall performance and quality of semiconductor devices, and simplify the transportation of semiconductor devices between equipment with different testing functions, the present application provides a semiconductor device performance testing device and testing process.

[0008] In a first aspect, the present application provides a semiconductor device performance detection device, which adopts the following technical solution: A semiconductor device performance testing device, comprising a device support and a testing box mounted on the device support, a rectangular cover plate being slidably provided on one side of the testing box through a plurality of side round rods, round rod holes for inserting and installing the side round rods are symmetrically provided on the testing box, and a testing device is provided in the rectangular cover plate and the testing box; The detection device includes a servo motor installed on the equipment support through a motor seat, and the servo motor rotating shaft penetrates the detection box and extends into the interior thereof. The detection box is provided with a circular shaft hole for the servo motor rotating shaft to penetrate. A cross back plate connected to the end of the servo motor rotating shaft is provided in the detection box. An annular seat is slidably provided on the cross back plate through a plurality of square rods. The annular seat is symmetrically provided with square holes adapted to the square rods. A monitoring component is provided on the annular seat. A plurality of groups of snap-fit ​​mechanisms are provided in the detection box.

[0009] Preferably, the monitoring assembly includes a monitoring element board installed on the side of the annular seat facing the cross back plate, a plurality of placement seats connected to the monitoring element board are arranged on the outer ring surface of the annular seat, the placement seat has a docking portion connected to the semiconductor device, and queue holes are opened on both sides of the placement seat on the annular seat.

[0010] Preferably, the snap-fitting mechanism includes a plurality of magnet side seats slidably arranged on the inner wall of the detection box through side blocks, the inner wall of the detection box is provided with a plurality of side sliding grooves for installing the side blocks, and the side sliding grooves are provided with inner circular rods passing through the side blocks, the side blocks are provided with through holes adapted to the inner circular rods, and the inner circular rods are provided with push springs connected to the side blocks.

[0011] Preferably, several of the magnet side seats are respectively connected to a bottom side frame, a side frame one and a side frame two, the ends of the cross back plate are provided with rectangular slots adapted to the magnet side seats, and the cross back plate is provided with an electromagnet block at the rectangular slot.

[0012] Preferably, a temperature testing unit is provided on the bottom side frame and the side frame one, and the temperature testing unit includes a U-shaped plate installed on the bottom side frame, and a heating tube is provided on the U-shaped plate. An L-shaped plate is provided on the side frame one, and two small fans are symmetrically installed on the L-shaped plate. The bottom of the detection box is symmetrically provided with air outlets.

[0013] Preferably, the detection device also includes a high humidity test unit arranged in the rectangular cover plate and the detection box, the high humidity test unit includes a thermal energy plate and an L-shaped insulation plate installed on the side of the rectangular cover plate facing the detection box, and a condensation assembly is provided on the detection box and the side frame 2.

[0014] Preferably, a water tank is provided on the detection box, and two folding hoses connected to the water tank are installed on the outer wall of the rectangular cover plate through an external pipe seat, and two middle pipes respectively connected to the two folding hoses are provided on the rectangular cover plate, and the middle pipe is located above the thermal energy plate, and a circular pipe hole for the installation of the two middle pipes is opened on the rectangular cover plate.

[0015] Preferably, the end of the middle connecting pipe away from the folding hose is connected to a control pipe, a water outlet pipe toward the thermal energy plate is installed on the control pipe, an adjusting cap is threadedly connected to one end of the control pipe, and an inner round bead connected to the adjusting cap is provided in the inner cavity of the control pipe.

[0016] Preferably, the condensation assembly includes a condensation plate installed on the top of the inner cavity of the detection box, a small air cooler is mounted on the side wall of the detection box, an assembly port for installing the small air cooler and an exhaust port for discharging cold air are opened on the side wall of the detection box, a U-shaped sponge and an arc-shaped guide plate are installed on the side frame 2, a vent is penetrated through the arc-shaped guide plate, and a guide groove is provided on the side of the arc-shaped guide plate facing the condensation plate.

[0017] On the other hand, the present application also discloses a semiconductor device performance detection process, which includes the following steps: S1, device placement: multiple semiconductor devices to be tested are placed in each position of the monitoring component in sequence, and the rectangular cover is pushed to close the test box; S2, multi-position buckling: start several sets of buckling mechanisms in the test box to operate and perform various performance tests on semiconductor devices at different positions at the same time; S3, shift detection: the servo motor drives the cross back plate to rotate, driving multiple semiconductor devices to shift synchronously for the next performance test; S4, performance evaluation: During the performance tests, the monitoring components monitor and record the operating data of each semiconductor device in real time, so that the staff can evaluate the overall performance and quality of the semiconductor devices.

[0018] In summary, the present application includes at least one of the following beneficial technical effects: Through the setting of four placement seats, four semiconductor devices can be placed in the test box for testing at the same time. The electromagnet blocks installed at different positions on the cross back plate are started at the same time, which can synchronously drive multiple magnet side seats to enter the corresponding rectangular slots respectively, so that the bottom side frame, side frame one and side frame two are respectively buckled on the corresponding placement seats, and covered on the semiconductor devices to facilitate subsequent performance tests.

[0019] The semiconductor devices located at the bottom side frame can be tested at high temperature. In conjunction with the operation of the servo motor, each semiconductor device can be driven to change position at the same time. The semiconductor devices moved to a side frame can be tested for rapid cooling. The monitoring component board can record the operating data of the semiconductor devices in the process of rapidly changing from high temperature to low temperature.

[0020] Under the action of the control tube, the water in the water tank can slowly drip onto the thermal energy plate in the form of water droplets, and form water vapor through high-temperature evaporation. The water vapor is distributed upward around the upper placement seat and on the condensation plate, and finally condenses into water droplets and drips onto the U-shaped sponge under the guidance of the arc guide plate, so that the U-shaped sponge is in a wet state. The water vapor and the wet U-shaped sponge can be used to perform different forms of high-humidity environment tests on the semiconductor device on the placement seat below the condensation plate and the semiconductor device at the second side frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 The present invention is a schematic diagram of the whole Figure 1 .

[0022] Figure 2 The present invention is a schematic diagram of the whole Figure 2 (View from bottom to top).

[0023] Figure 3 It is a schematic diagram of the motor base and the servo motor of the present invention (viewed from the back to the front).

[0024] Figure 4 It is a schematic diagram of some components of the detection device of the present invention.

[0025] Figure 5 It is an exploded view of some components of the detection device of the present invention.

[0026] Figure 6 It is a schematic diagram of the monitoring component of the present invention.

[0027] Figure 7 The buckle mechanism of the present invention is a cross-sectional view Figure 1 .

[0028] Figure 8 The present invention Figure 7 A magnified image of area A.

[0029] Fig. 9 The buckle mechanism of the present invention is a cross-sectional view Figure 2 .

[0030] Fig.10 It is a cross-sectional view of the temperature testing unit of the present invention.

[0031] Fig.11 It is a schematic diagram of a high humidity test unit of the present invention.

[0032] Fig.12 It is a cross-sectional view of some components of the high humidity test unit of the present invention.

[0033] Fig.13 Schematic diagram of the condensation assembly of the present invention (viewed from bottom to top).

[0034] Fig.14 It is a cross-sectional view of the condensation component of the present invention.

[0035] Fig.15 It is a schematic diagram of some components of the condensation assembly of the present invention.

[0036] Fig.16 The present invention is a schematic diagram of the fastening member Figure 1 .

[0037] Fig.17 The present invention is a schematic diagram of the fastening member Figure 2 .

[0038] Fig.18 It is a detection process flow chart of the present invention.

[0039] Explanation of the reference numerals: 1. Equipment support; 11. Detection box; 12. Side round rod; 13. Rectangular cover plate; 111. Round rod hole; 2. Detection device; 21. Motor seat; 22. Servo motor; 112. Round shaft hole; 23. Cross back plate; 24. Square rod; 25. Ring seat; 251. Square hole; 3. Monitoring component; 4. Snap-fit ​​mechanism; 31. Monitoring element board; 32. Placement seat; 321. Docking part; 252. Queue hole; 41. Side block; 42. Magnet side seat; 113. Side slide groove; 43. Inner round rod; 411. Through hole; 44. Push spring; 45. Bottom side frame; 46. Side frame one; 47. Side frame two; 231. Rectangular notch; 48. Electromagnet block; 5. Temperature test unit; 51. U-shaped plate; 52. Heating Tube; 53, L-shaped plate; 54, small fan; 114, air outlet; 6, high humidity test unit; 60, thermal energy plate; 61, L-shaped insulation board; 7, condensation assembly; 62, water storage tank; 63, external pipe seat; 64, folding hose; 65, middle pipe; 131, round pipe hole; 66, control pipe; 67, water outlet pipe; 68, adjustment cap; 69, inner round ball; 71, condensation plate; 72, small air cooler; 115, assembly port; 116, discharge port; 73, U-shaped sponge; 74, arc guide plate; 741, vent hole; 742, guide groove; 8, fastening piece; 81, square transmission rod; 132, limit slide groove; 82, rubber push rod; 83, limit block; 84, configuration seat; 85, two-way threaded rod; 811, internal threaded hole; 86, drive sleeve wheel. DETAILED DESCRIPTION

[0040] The following is combined with Figure 1-Figure 18 This application is described in further detail.

[0041] The embodiments of the present application disclose a semiconductor device performance testing device and a testing process, which can perform accelerated aging and performance stability tests on multiple semiconductor devices under different environmental conditions at one time, and comprehensively test and evaluate the overall performance and quality of the semiconductor devices to simplify the transportation of semiconductor devices between devices with different testing functions.

[0042] Reference Figure 1 and Figure 2As shown, in the first aspect, the present application provides a semiconductor device performance detection device, including an equipment support 1 and a detection box 11 mounted on the equipment support 1. In the present embodiment, a rectangular cover 13 is preferably provided on one side of the detection box 11 through four side round rods 12 for sliding. It should be noted that the four side round rods 12 are divided into two groups and fixedly installed on one side of the rectangular cover 13; round rod holes 111 for inserting and installing the side round rods 12 are symmetrically opened on the detection box 11, and a detection device 2 is provided in the rectangular cover 13 and the detection box 11; the semiconductor devices to be tested are placed in the detection box 11 in turn, and then the rectangular cover 13 is pushed to close the detection box 11. The operation of the detection device 2 can alternately test multiple semiconductor devices under different environmental conditions at the same time. According to different detection times, long-term accelerated aging detection or short-term performance stability test can be achieved.

[0043] Reference Figures 3 to 5 As shown, specifically, the detection device 2 includes a servo motor 22 installed on the equipment support 1 through a motor seat 21, and the rotating shaft of the servo motor 22 penetrates the detection box 11 and extends into the interior thereof. The detection box 11 is provided with a circular shaft hole 112 for the rotating shaft of the servo motor 22 to penetrate, and the detection box 11 is provided with a cross back plate 23 connected to the end of the rotating shaft of the servo motor 22. It should be noted that the servo motor 22 is set to rotate 90 degrees each time it operates, that is, each operation can drive the cross back plate 23 to rotate 90 degrees. In this embodiment, preferably, an annular seat 25 is slidably provided on the cross back plate 23 through four square rods 24, and square holes 251 adapted to the square rods 24 are symmetrically provided on the annular seat 25.

[0044] Four square rods 24 are divided into two groups and symmetrically fixedly installed on one side of the cross back plate 23. The annular seat 25 can be limitedly slidably set on the square rod 24 through the square hole 251 opened. The technical effect to be achieved is that when the cross back plate 23 is driven by the servo motor 22 to rotate, the annular seat 25 can be driven to rotate together, and when the annular seat 25 is subjected to force, it can also slide on one side of the cross back plate 23. A monitoring component 3 is provided on the annular seat 25, which is used to place multiple semiconductor devices at the same time and monitor their operating status; in this embodiment, preferably, three groups of buckling mechanisms 4 are provided in the detection box 11, and the three groups of buckling mechanisms 4 are respectively located below and on the left and right sides of the annular seat 25.

[0045] When placing semiconductor devices to be tested into the test box 11, the annular seat 25 can be pulled outward for a certain distance first so that multiple semiconductor devices can be docked and placed on the monitoring component 3 in sequence. Then, the annular seat 25 is pushed into the test box 11 to reset, and the rectangular cover 13 is pushed to close the test box 11. The operation of the snap-fit ​​mechanism 4 can snap related test components with different functions onto semiconductor devices at corresponding positions for testing. In conjunction with the operation of the servo motor 22, each semiconductor device can be driven to change position regularly to achieve performance testing of semiconductor devices with different functions.

[0046] Reference Figure 6 As shown, considering the need to connect with the semiconductor device and place it, so that the semiconductor device can be accelerated aging and performance stability test in the startup operation state, the monitoring component 3 includes a monitoring element board 31 installed on the side of the annular seat 25 facing the cross back plate 23. In this embodiment, four placement seats 32 connected to the monitoring element board 31 are preferably arranged on the outer ring surface of the annular seat 25, and the placement seat 32 has a docking portion 321 connected to the semiconductor device, and the annular seat 25 is provided with queue holes 252 on both sides of the placement seat 32. The monitoring element board 31 has integrated circuits and controllers. When the semiconductor device is placed on the placement seat 32 and connected to the docking portion 321, the monitoring element board 31 can control the operation of the semiconductor device and monitor the operation of the semiconductor device in real time. Since this is a prior art, it will not be described in detail here. When placing semiconductor devices for testing, four semiconductor devices can be placed on four placement seats 32 at one time and connected to each docking portion 321 respectively. The placement seat 32 and the annular seat 25 are fixedly connected, so when the annular seat 25 slides due to the driving force, it can drive the placement seat 32 and the monitoring element board 31 to move synchronously, so as to facilitate the placement and removal of semiconductor devices.

[0047] Reference Figure 7 and Figure 8 As shown, in order to better perform performance testing of semiconductor devices at various positions under different environmental conditions, the snap-fit ​​mechanism 4 includes three magnet side seats 42 slidably arranged on the inner wall of the detection box 11 through the side block 41, and the three magnet side seats 42 are respectively located below and on the left and right sides of the cross back plate 23; three side slide grooves 113 for installing the side block 41 are opened on the inner wall of the detection box 11, and the side slide grooves 113 are provided with inner round rods 43 penetrating the side block 41, and the side block 41 has a through hole 411 adapted to the inner round rod 43, and the inner round rod 43 is sleeved with a push spring 44 connected to the side block 41. The push spring 44 always has a driving force to push the side block 41 to slide in a direction away from the cross back plate 23, that is, in the absence of other external forces, there is always a certain distance between the three magnet side seats 42 and the cross back plate 23, which will not hinder the rotation of the cross back plate 23.

[0048] Reference Fig. 9 and Fig.10 As shown, since it is necessary to synchronously drive the magnet side seats 42 at three different positions to move toward the cross back plate 23 without affecting the rotation of the cross back plate 23, the three magnet side seats 42 are respectively connected with a bottom side frame 45, a side frame one 46 and a side frame two 47, the bottom side frame 45 is located below the annular seat 25, and the side frame one 46 and the side frame two 47 are respectively located on the left and right sides of the annular seat 25; the ends of the cross back plate 23 are provided with rectangular slots 231 adapted to the magnet side seats 42, it should be noted that the cross back plate 23 is in the shape of a cross, and thus has four ends, each of which is provided with a rectangular slot 231; the cross back plate 23 is provided with an electromagnet block 48 at the rectangular slot 231. When the electromagnet block 48 is powered on and started, it will generate suction on the magnet side seat 42, and then drive the magnet side seat 42 into the rectangular slot 231. At this time, the bottom side frame 45, side frame one 46 and side frame two 47 installed on the three magnet side seats 42 will be respectively engaged with the placement seat 32 at the corresponding position, and the cover is set on the semiconductor device.

[0049] Continue to refer to Fig.10 As shown, considering the need to test the performance stability of semiconductor devices in a high temperature environment and the quality test when the semiconductor devices are rapidly reduced from a high temperature state to a low temperature state, a temperature test unit 5 is provided on the bottom side frame 45 and the side frame 1 46. The temperature test unit 5 includes a U-shaped plate 51 installed on the bottom side frame 45, a heating tube 52 is provided on the U-shaped plate 51, an L-shaped plate 53 is provided on the side frame 1 46, two small fans 54 are symmetrically installed on the L-shaped plate 53, and an air outlet 114 is symmetrically opened at the bottom of the detection box 11. First, the electromagnet block 48 is energized to drive the three magnet side seats 42 to enter the corresponding rectangular notches 231 respectively, driving the bottom side frame 45, the side frame 1 46 and the side frame 2 47 to buckle at the corresponding placement seat 32; start the heating tube 52 and the small fan 54 to operate, and the semiconductor device located at the bottom side frame 45 can be tested at high temperature, while the semiconductor device located at the side frame 1 46 can be tested by wind. By cooperating with the air outlet 114 , the operation of the small fan 54 can also discharge the high-temperature air in the detection box 11 to prevent the temperature in the detection box 11 from being too high.

[0050] After the test is completed, the electromagnet block 48 is turned off to release the suction force on the magnet side seat 42. At this time, under the action of the push spring 44, each magnet side seat 42 will slide away from the rectangular notch 231 in the direction away from the cross back plate 23, so that the bottom side frame 45, the side frame 1 46 and the side frame 2 47 are reset and no longer engaged with the placement seat 32. The servo motor 22 is started to run clockwise for 90 degrees, so that the semiconductor device after the high temperature test can be transferred to the side frame 1 46, and then the electromagnet block 48 is powered on again to drive the bottom side frame 45, the side frame 1 46 and the side frame 2 47 to engage again and cover the corresponding semiconductor device. At this time, the operation of the small fan 54 can quickly cool down the high-temperature semiconductor device, so as to detect the operation of the semiconductor device when it changes from high temperature to low temperature.

[0051] Reference Fig.11 As shown, on the basis of the first embodiment, in order to be able to perform stability tests on semiconductor devices in different high-humidity environments, the detection device 2 also includes a high-humidity test unit 6 disposed in the rectangular cover 13 and the detection box 11. The high-humidity test unit 6 includes a thermal energy plate 60 and an L-shaped thermal insulation plate 61 installed on the side of the rectangular cover 13 facing the detection box 11. After the rectangular cover 13 is pushed to close the detection box 11, the thermal energy plate 60 and the L-shaped thermal insulation plate 61 will be in the annular seat 25. The surface temperature of the thermal energy plate 60 is relatively high when it is started, and the L-shaped thermal insulation plate 61 can provide thermal insulation protection for the monitoring element board 31. The detection box 11 and the second side frame 47 are provided with a condensation assembly 7, which is used to cooperate with the thermal energy plate 60 to form a high-humidity environment at the second side frame 47, so as to perform performance tests on the semiconductor devices at this position under the high-humidity environment.

[0052] Continue to refer to Fig.11 As shown, the detection box 11 is provided with a water storage tank 62, and two folding hoses 64 connected to the water storage tank 62 are installed on the outer wall of the rectangular cover plate 13 through an external pipe seat 63. Two middle pipes 65 connected to the two folding hoses 64 are respectively provided on the rectangular cover plate 13, and the middle pipes 65 are located above the thermal energy plate 60. A circular pipe hole 131 for installing the two middle pipes 65 is opened on the rectangular cover plate 13. When the rectangular cover plate 13 is pulled and pushed normally, the folding hose 64 can be extended and contracted accordingly. The water in the water storage tank 62 can flow into the two middle pipes 65 through the two folding hoses 64.

[0053] Reference Fig.12As shown, considering that the water in the water tank 62 needs to be dripped slowly onto the thermal energy plate 60 in the form of water drops, the end of the middle pipe 65 away from the folding hose 64 is connected to a control pipe 66, and a water outlet pipe 67 toward the thermal energy plate 60 is installed on the control pipe 66. An adjustment cap 68 is threadedly connected to one end of the control pipe 66, and an inner round bead 69 connected to the adjustment cap 68 is provided in the inner cavity of the control pipe 66. It should be noted that the diameter of the inner round bead 69 is adapted to the inner cavity of the control pipe 66, and the position of the inner round bead 69 in the control pipe 66 can be adjusted by rotating the adjustment cap 68, and the flow rate is adjusted through the pores, so that the water can slowly drip onto the thermal energy plate 60 in the form of drops. Since the surface temperature of the thermal energy plate 60 is relatively high, when water drops onto the thermal energy plate 60, water vapor is generated. The water vapor passes upward through the queue holes 252 and is dispersed around the placement seat 32 above the thermal energy plate 60. Under the action of the water vapor, a high humidity environment is formed here, so that the performance stability of the semiconductor devices here can be tested in a humidity environment.

[0054] Reference Figures 13 to 15 As shown, since the water vapor needs to be reused to condense, another form of high humidity environment is formed at the position of the second side frame 47, and the performance of the semiconductor device is tested in a humidity environment. The condensation component 7 includes a condensation plate 71 installed on the top of the inner cavity of the detection box 11, and a small air cooler 72 is fixed on the side wall of the detection box 11. The side wall of the detection box 11 is provided with an assembly port 115 for installing the small air cooler 72, and an exhaust port 116 for discharging cold air. A U-shaped sponge 73 and an arc-shaped guide plate 74 are installed on the second side frame 47. A vent 741 is opened through the arc-shaped guide plate 74, and the arc-shaped guide plate 74 has a guide groove 742 on the side facing the condensation plate 71. The operation of the small air cooler 72 can keep the surface of the condensation plate 71 at a low temperature at all times. After the water vapor contacts the low-temperature surface of the condensation plate 71 through the vent holes 741 on the arc-shaped guide plate 74, it can be condensed. The condensed water droplets can flow to the U-shaped sponge 73 through the guidance of the guide grooves 742 on the condensation plate 71 and the arc-shaped guide plate 74, making the U-shaped sponge 73 wet. When the side frame 47 is buckled on the placement seat 32 at the corresponding position, the wet U-shaped sponge 73 will cover the semiconductor device arranged there to form another humid environment, thereby realizing performance testing of the semiconductor device in a humid environment.

[0055] When the cross back plate 23 is stationary, the four placed semiconductor devices will be in four different environments: high temperature environment, windy environment, water vapor high humidity environment, and humid environment; so that the semiconductor devices can be tested for performance in a single specific environment, and can also be tested alternately in different environments with the drive of the servo motor 22 to detect the overall performance stability of the semiconductor devices in different environments. In addition, when a long-term cycle alternating test is performed, the purpose of accelerating the aging test of the semiconductor devices can be achieved.

[0056] Reference Fig.16 and Fig.17 As shown, on the basis of the first and second embodiments, in order to facilitate the placement and removal of semiconductor devices, when the inspection is completed, the staff pulls out the rectangular cover 13 to open the inspection box 11, and the annular seat 25 can be taken out synchronously. A fastening member 8 is provided on the rectangular cover 13, and the fastening member 8 includes a square transmission rod 81 that is symmetrically slidably arranged on the rectangular cover 13. The rectangular cover 13 is symmetrically provided with a limiting slide groove 132 for limiting the sliding of the two square transmission rods 81. A rubber fastening rod 82 is provided at one end of the square transmission rod 81 facing the inspection box 11. A limiting block 83 is fixedly provided on the square transmission rod 81 outside the rectangular cover 13. A bidirectional threaded rod 85 is rotatably installed on the outer side wall of the rectangular cover 13 through a configuration seat 84, and the two ends of the bidirectional threaded rod 85 are respectively threaded through the two square transmission rods 81. An internal threaded hole 811 adapted to the bidirectional threaded rod 85 is opened on the square transmission rod 81, and a driving sleeve wheel 86 is fixedly sleeved in the middle of the bidirectional threaded rod 85.

[0057] After all the tests are completed, push the driving sleeve 86 to rotate to drive the bidirectional threaded rod 85 to rotate. In cooperation with the internal threaded hole 811 opened on the square transmission rod 81, the two square transmission rods 81 can be synchronously driven to slide away from the configuration seat 84, so that the rubber abutment rod 82 installed at the end of the square transmission rod 81 can abut against the inner side of the annular seat 25. When the rectangular cover 13 is subsequently pulled outward to open the detection box 11, the annular seat 25 can be brought out to facilitate the staff to take out the semiconductor devices one by one and also facilitate the subsequent placement of new semiconductor devices.

[0058] Reference Fig.18 As shown, on the other hand, the present application also discloses a semiconductor device performance detection process, the detection process comprising the following steps: S1, device placement: multiple semiconductor devices to be tested are placed in each position of the monitoring component 3 in turn, and the rectangular cover 13 is pushed to close the test box 11; specifically, four semiconductor devices can be placed on four placement seats 32 at one time and connected to each docking portion 321 respectively.

[0059] S2, multi-position snap-in: start several groups of snap-in mechanisms 4 in the test box 11 to operate, and perform various performance tests on semiconductor devices at different positions at the same time; the electromagnet block 48 is energized to drive each magnet side seat 42 to enter the corresponding rectangular slot 231 respectively, and in the process, it can drive the bottom side frame 45, the side frame 1 46 and the side frame 2 47 to snap-in at the corresponding placement seat 32 respectively; the bottom side frame 45 can perform high temperature test, the side frame 1 46 can perform wind cooling test, the water vapor high humidity test can be performed above the thermal energy plate 60, and the side frame 2 47 can perform humidity test.

[0060] S3, displacement detection: the servo motor 22 drives the cross back plate 23 to rotate, driving multiple semiconductor devices to synchronously shift positions for the next performance test; the electromagnet block 48 is turned off to release the suction force on the magnet side seat 42, and each magnet side seat 42 is reset under the action of the push spring 44. The servo motor 22 is started to run clockwise for 90 degrees, and the semiconductor devices after the high temperature test are transferred to the side frame 1 46, and the semiconductor devices originally at the side frame 1 46 are transferred to the water vapor high humidity environment, and the semiconductor devices in the water vapor high humidity environment are transferred to the humid environment of the side frame 2 47, and the semiconductor devices previously in the side frame 2 47 are transferred to the high temperature environment of the bottom side frame 45, so that the semiconductor devices can be tested alternately in different environments.

[0061] S4, performance evaluation: During the performance test, the monitoring component 3 monitors and records the operation data of each semiconductor device in real time, so that the staff can evaluate the overall performance and quality of the semiconductor device. Short-term alternating tests can detect the overall performance stability of semiconductor devices under different environments; while long-term cyclic alternating tests can accelerate the aging test of semiconductor devices.

[0062] The embodiments of this specific implementation method are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, any equivalent changes made based on the structure, shape, and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor device performance testing device, comprising a device support (1) and a testing box (11) mounted on the device support (1), wherein a rectangular cover plate (13) is slidably arranged on one side of the testing box (11) through a plurality of side round rods (12), and round rod holes (111) for inserting and installing the side round rods (12) are symmetrically opened on the testing box (11), characterized in that: The rectangular cover plate (13) and the detection box (11) are provided with a detection device (2); The detection device (2) comprises a servo motor (22) mounted on an equipment support (1) via a motor seat (21), and a rotating shaft of the servo motor (22) penetrates a detection box (11) and extends into the detection box (11), a circular shaft hole (112) for the rotating shaft of the servo motor (22) to penetrate is provided on the detection box (11), a cross back plate (23) connected to the end of the rotating shaft of the servo motor (22) is provided in the detection box (11), an annular seat (25) is slidably provided on the cross back plate (23) through a plurality of square rods (24), square holes (251) adapted to the square rods (24) are symmetrically provided on the annular seat (25), a monitoring component (3) is provided on the annular seat (25), and a plurality of groups of buckling mechanisms (4) are provided in the detection box (11).

2. A semiconductor device performance detection device according to claim 1, characterized in that: The monitoring assembly (3) comprises a monitoring element plate (31) mounted on a side of an annular seat (25) facing the cross back plate (23); a plurality of placement seats (32) connected to the monitoring element plate (31) are arranged on the outer ring surface of the annular seat (25); the placement seats (32) have docking portions (321) connected to semiconductor devices; and queue holes (252) are provided on both sides of the placement seats (32) on the annular seat (25).

3. A semiconductor device performance detection device according to claim 1, characterized in that: The locking mechanism (4) comprises a plurality of magnet side seats (42) slidably arranged on the inner wall of the detection box (11) through a side block (41); a plurality of side sliding grooves (113) for installing the side block (41) are provided on the inner wall of the detection box (11); an inner round rod (43) penetrating the side block (41) is provided in the side sliding groove (113); a through hole (411) adapted to the inner round rod (43) is provided on the side block (41); and a push spring (44) connected to the side block (41) is sleeved on the inner round rod (43).

4. A semiconductor device performance detection device according to claim 3, characterized in that: A plurality of the magnet side seats (42) are respectively connected to a bottom side frame (45), a side frame one (46) and a side frame two (47); the ends of the cross back plate (23) are each provided with a rectangular notch (231) adapted to the magnet side seat (42); and the cross back plate (23) is provided with an electromagnet block (48) at the rectangular notch (231).

5. A semiconductor device performance detection device according to claim 4, characterized in that: The bottom side frame (45) and the side frame one (46) are provided with a temperature testing unit (5), the temperature testing unit (5) comprising a U-shaped plate (51) mounted on the bottom side frame (45), the U-shaped plate (51) being provided with a heating tube (52), the side frame one (46) being provided with an L-shaped plate (53), two small fans (54) being symmetrically mounted on the L-shaped plate (53), and air outlets (114) being symmetrically opened at the bottom of the detection box (11).

6. A semiconductor device performance detection device according to claim 4, characterized in that: The detection device (2) further comprises a high humidity test unit (6) arranged in the rectangular cover plate (13) and the detection box (11), wherein the high humidity test unit (6) comprises a thermal energy plate (60) and an L-shaped heat insulation plate (61) installed on the side of the rectangular cover plate (13) facing the detection box (11), and a condensation assembly (7) is provided on the detection box (11) and the second side frame (47).

7. A semiconductor device performance detection device according to claim 6, characterized in that: The detection box (11) is provided with a water storage tank (62); two folding hoses (64) connected to the water storage tank (62) are installed on the outer wall of the rectangular cover plate (13) through an external pipe seat (63); two middle pipes (65) respectively connected to the two folding hoses (64) are provided through the rectangular cover plate (13); the middle pipes (65) are located above the thermal energy plate (60); and a circular pipe hole (131) for installing the two middle pipes (65) is provided through the rectangular cover plate (13).

8. A semiconductor device performance detection device according to claim 7, characterized in that: The end of the middle pipe (65) away from the folding hose (64) is connected to a control pipe (66), and a water outlet pipe (67) facing the thermal energy plate (60) is installed on the control pipe (66). An adjustment cap (68) is threadedly connected to one end of the control pipe (66), and an inner round ball (69) connected to the adjustment cap (68) is provided in the inner cavity of the control pipe (66).

9. A semiconductor device performance detection device according to claim 6, characterized in that: The condensation assembly (7) includes a condensation plate (71) installed on the top of the inner cavity of the detection box (11), a small air cooler (72) is fixed on the side wall of the detection box (11), an assembly port (115) for installing the small air cooler (72) and an exhaust port (116) for exhausting cold air are opened on the side wall of the detection box (11), a U-shaped sponge (73) and an arc-shaped guide plate (74) are installed on the side frame 2 (47), a vent hole (741) is opened through the arc-shaped guide plate (74), and the arc-shaped guide plate (74) has a guide groove (742) on the side facing the condensation plate (71).

10. A semiconductor device performance testing process, characterized in that: Using a semiconductor device performance detection device according to any one of claims 1 to 9, the operation steps are as follows: S1, device placement: placing a plurality of semiconductor devices to be tested in order at various positions of the monitoring component (3), and pushing the rectangular cover plate (13) to close the testing box (11); S2, multi-position buckling: starting a plurality of sets of buckling mechanisms (4) in the testing box (11) to operate, and simultaneously performing various performance tests on semiconductor devices at different positions; S3, shift detection: the servo motor (22) drives the cross back plate (23) to rotate, driving multiple semiconductor devices to synchronously shift positions for the next performance test; S4, performance evaluation: During the performance test, the monitoring component (3) monitors and records the operation data of each semiconductor device in real time, so that the staff can evaluate the overall performance and quality of the semiconductor device.

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