Display panel, manufacturing method and display device

Abstract

The present disclosure relates to a display panel and a manufacturing method thereof, and a display device, and belongs to the technical field of display technology, and comprises a substrate, a metal pad, an insulating layer and a connecting wire, the connecting wire is at least partially located on the side surface of the substrate, and is connected with the first metal pad and the second metal pad, the side of the insulating layer away from the substrate comprises a micro cavity, and the micro cavity is in a structure of being narrow at the top and wide at the bottom along the direction from the substrate to the insulating layer, thus, by arranging the micro cavity in the structure of being narrow at the top and wide at the bottom on the surface of the insulating layer away from the metal pad, when the side surface of the substrate and at least part of the first surface and the second surface are coated, the connecting wire located on both sides of the micro cavity is naturally broken due to the existence of the micro cavity, the risk of the connecting wire on the side surface falling off caused by tearing off the protective film is reduced, and the preparation yield is improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular to a display panel, a manufacturing method and a display device. BACKGROUND

[0002] The seamless splicing technology refers to splicing multiple display panels to form a large display device. A driving circuit is arranged on a bonding area of the display panel. A protective film is attached to the front and back surfaces of the display panel to prevent the pixel area from being contaminated. A metal material is deposited on the side surface of the display panel by using a physical vapor deposition technology. After the film coating is completed, the protective film is removed. The metal layer deposited on the side surface is patterned or formed into a side metal trace by laser. The front and back surface lines of the display panel are connected by the side metal trace to realize the connection between the display panel and the driving circuit.

[0003] However, the metal deposited on the protective film and the metal deposited on the side surface of the display panel are formed by integral film coating. When the protective film is removed, the metal deposited on the side surface is easily torn off together with the substrate due to the weak adhesion between the metal and the substrate, which results in the failure of manufacturing the side metal trace. SUMMARY

[0004] To solve the above technical problems, the present disclosure provides a display panel, a manufacturing method and a display device, which are used to increase the adhesion between the side film coating and the substrate and reduce the risk of the side metal film coating falling off caused by removing the protective film.

[0005] In a first aspect, the present disclosure provides a display panel, comprising:

[0006] a substrate comprising a first surface and a second surface arranged oppositely, and a side surface, wherein the first surface and the second surface are both provided with a metal pad;

[0007] the metal pad comprises a first metal pad and a second metal pad, wherein the first metal pad is located on the first surface, and the second metal pad is located on the second surface;

[0008] a first insulating layer, wherein the first insulating layer is at least partially arranged on a side of the first metal pad away from the first surface, and at least part of the first metal pad is exposed to the first insulating layer, and the first insulating layer comprises a micro cavity located on a side surface of the first insulating layer away from the first metal pad;

[0009] and / or,

[0010] a second insulating layer disposed at least partially on a side of the second metal pad facing away from the second surface, at least part of the second metal pad being exposed from the second insulating layer, the second insulating layer comprising a micro cavity on a surface of the second insulating layer facing away from the second metal pad;

[0011] a connecting wire disposed at least partially on the side surface and connecting the first metal pad and the second metal pad;

[0012] the connecting wire on both sides of the micro cavity is at least partially disconnected.

[0013] In a second aspect, the present disclosure provides a display device comprising the display panel of the first aspect.

[0014] In a third aspect, the present disclosure provides a manufacturing method of a display panel, for manufacturing the display panel of the first aspect, the method comprising:

[0015] providing a substrate;

[0016] manufacturing metal pads on a first surface and a second surface of the substrate;

[0017] disposing an insulating layer on a side of the metal pad facing away from the substrate, at least part of the metal pad being exposed from the insulating layer;

[0018] disposing a protective layer on a side of the insulating layer facing away from the metal pad, at least part of the insulating layer being exposed from the protective layer;

[0019] etching the insulating layer exposed from the protective layer to form a micro cavity;

[0020] plating a metal layer on a side surface, the first surface and the second surface of the substrate, the metal layer covering the metal pad exposed from the insulating layer, and electrically connecting the metal pads on the first surface and the second surface;

[0021] tearing off the protective layer.

[0022] The technical solution provided by the embodiments of the present disclosure has the following advantages compared with the prior art: by disposing the micro cavity on the surface of the insulating layer facing away from the metal pad, the connecting wire on both sides of the micro cavity is naturally disconnected, the disconnection of the connecting wire is naturally formed due to the existence of the micro cavity during plating, the adhesion between the connecting wire and the metal pad and the substrate is increased, the risk of the side connecting wire falling off due to tearing off the protective film is reduced, and the preparation yield is improved. BRIEF DESCRIPTION OF DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and serve to explain the principles of the present disclosure, together with the description.

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the accompanying drawings required by the embodiments or prior art description will be briefly introduced as follows. Obviously, the drawings can also provide other drawings for those skilled in the art based on these drawings without any creative effort.

[0025] Figure 1 Fig. 1 shows a plan view of a display panel provided by an embodiment of the present disclosure;

[0026] Figure 2 Fig. 2 shows an A-A' cross-sectional view of the display panel in Fig. 1; Figure 1

[0027] Figure 3 Fig. 3 shows another A-A' cross-sectional view of the display panel in Fig. 1; Figure 1

[0028] Figure 4 Fig. 4 shows yet another A-A' cross-sectional view of the display panel in Fig. 1; Figure 1

[0029] Figure 5 Fig. 5 shows an A-A' cross-sectional view of the display panel in Fig. 1; Figure 1

[0030] Figure 6 Fig. 6 shows a B-B' cross-sectional view of the display panel in Fig. 1; Figure 1

[0031] Figure 7 Fig. 7 shows a schematic diagram of a micro-cavity structure provided by an embodiment of the present disclosure;

[0032] Figure 8 Fig. 8 shows an A-A' cross-sectional view of the display panel in Fig. 7; Figure 1

[0033] Fig. 9 shows a schematic diagram of the relative width of a metal wire and a micro-cavity provided by an embodiment of the present disclosure; Figure 9

[0034] Fig. 10 shows a schematic diagram of the relative relationship between the depth of a micro-cavity and the thickness of a connecting wire provided by an embodiment of the present disclosure; Figure 10

[0035] Fig. 11 shows a schematic diagram of a display device provided by an embodiment of the present disclosure; Figure 11

[0036] Fig. 12 shows a flowchart of the manufacturing process of a display panel provided by an embodiment of the present disclosure; Figure 12

[0037] Figure 13 ​​​​​​The diagram shown is a structural schematic of a display panel with a protective layer provided in an embodiment of this disclosure. Detailed Implementation

[0038] To better understand the above-mentioned objectives, features, and advantages of this disclosure, the solutions disclosed herein will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0039] Numerous specific details are set forth in the following description in order to provide a full understanding of this disclosure, but this disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some, and not all, of the embodiments of this disclosure.

[0040] Figure 1 The image shown is a plan view of a display panel provided in an embodiment of this disclosure. Figure 2 As shown Figure 1 A cross-sectional view of the display panel along line A-A'. Figure 3 As shown Figure 1 Another A-A' section view of the central display panel. Figure 4 As shown Figure 1 Please refer to another A-A' section view of the central display panel. Figures 1 to 4 This disclosure provides a display panel 100, including a display area AA and a bonding area BA. The bonding area BA includes a plurality of spaced metal pads 20. The bonding area BA also includes a substrate 10. The substrate 10 includes a first surface 11 and a second surface 12 disposed opposite to each other, and a side surface 13. The first surface 11 and the second surface 12 are both provided with metal pads 20. The metal pads 20 include a first metal pad 21 and a second metal pad 22. The first metal pad 21 is located on the first surface 11, and the second metal pad 22 is located on the second surface 12.

[0041] A first insulating layer 31 is at least partially disposed on the side of the first metal pad 21 opposite to the first surface 11, and at least a portion of the first metal pad 21 is exposed on the first insulating layer 31. The first insulating layer 31 includes a microcavity 00 located on the surface of the first insulating layer 31 opposite to the first metal pad 21. And / or, a second insulating layer 32 is at least partially disposed on the side of the second metal pad 22 opposite to the second surface 12, and at least a portion of the second metal pad 22 is exposed on the second insulating layer 32. The second insulating layer 32 includes a microcavity 00 located on the surface of the second insulating layer 32 opposite to the second metal pad 22.

[0042] The connecting trace 40 is at least partially located on the side 13 and connects the first metal pad 21 and the second metal pad 22; the connecting traces 40 on both sides of the microcavity 00 are at least partially disconnected.

[0043] Specifically, the display panel 100 comprises a substrate 10, the substrate 10 comprises a first surface 11, a second surface 12 and a side surface 13, the first surface 11 and the second surface 12 are oppositely arranged, and the side surface 13 is used to connect the first surface 11 and the second surface 12. It should be noted that the side surface 13 can be a completely vertical surface, or can not be a completely vertical surface. In the figure, only one case where the side surface 13 is a completely vertical surface is shown. It can be understood that the side surface 13 can also be a bevel surface extending from one side of the first surface 11, or a bevel surface extending from one side of the second surface 12, or a side surface connecting the bevel surface extending from the first surface 11 and the bevel surface extending from the second surface 12.

[0044] The first surface 11 of the substrate 10 in the display panel 100 is provided with a first metal pad 21, and the second surface 12 of the substrate 10 in the display panel 100 is provided with a second metal pad 22. The projections of the first metal pad 21 and the second metal pad 22 on the plane of the substrate 10 can overlap or can not overlap, and the present disclosure does not make specific limitations thereon.

[0045] Please refer to Figures 1 to 4 The display panel 100 further comprises a first insulating layer 31, the first insulating layer 31 is at least partially located on a side of the first metal pad 21 away from the first surface 11 of the substrate 10, and the first metal pad 21 is at least partially exposed from the first insulating layer 31. The display panel 100 can further comprise a second insulating layer 32, the second insulating layer 32 is at least partially located on a side of the second metal pad 22 away from the first surface 11 of the substrate 10, and the second metal pad 22 is at least partially exposed from the second insulating layer 32.

[0046] Please refer to Figure 2 In an optional embodiment provided by the present disclosure, the display panel 100 comprises a first insulating layer 31, the first insulating layer 31 comprises a micro cavity 00, and the micro cavity 00 is located on a side surface of the first insulating layer 31 away from the first metal pad 21. In the embodiment, the display panel 100 does not comprise a second insulating layer 32. Please refer to Figure 3 In another optional embodiment provided by the present disclosure, the display panel 100 comprises a first insulating layer 31, the first insulating layer 31 comprises a micro cavity 00, and the micro cavity 00 is located on a side surface of the first insulating layer 31 away from the first metal pad 21. The display panel 100 further comprises a second insulating layer 32, the second insulating layer 32 comprises a micro cavity 00, and the micro cavity 00 is located on a side surface of the second insulating layer 32 away from the second metal pad 22. Please refer to Figure 4In another alternative embodiment provided in this disclosure, the display panel 100 does not include the first insulating layer 31, and the display panel 100 includes a second insulating layer 32, the second insulating layer 32 including a microcavity 00, the microcavity 00 being located on the side surface of the second insulating layer 32 facing away from the second metal pad 22.

[0047] The display panel 100 also includes a connection trace 40, which is at least partially located on the side 13. The two ends of the connection trace 40 are respectively connected to the first metal pad 21 and the second metal pad 22. Further, one end of the connection trace 40 is connected to the portion of the first metal pad 21 exposed in the first insulating layer 31, and the other end of the connection trace 40 is connected to the portion of the second metal pad 22 exposed in the second insulating layer 32. The connection traces 40 on both sides of the microcavity 00 are at least partially disconnected along a direction parallel to the plane of the substrate 10.

[0048] Thus, by setting a microcavity 00 on the surface of the insulating layer 30 away from the metal pad 20, the connecting lines 40 on both sides of the microcavity 00 are at least partially disconnected. The connecting lines 40 can be connected to the metal pad 20 by film coating, while the connecting lines 40 on both sides of the microcavity 00 are naturally disconnected, reducing the lifting or falling off of the connecting lines 40 due to film tearing, and improving the preparation yield.

[0049] Figure 5 As shown Figure 1 A cross-sectional view of the display panel along line A-A'. Figure 6 As shown Figure 1 A B-B' cross-sectional view of a display panel. Figure 7 The diagram shown is a schematic representation of a microcavity structure provided in an embodiment of this disclosure. Figure 8 As shown Figure 1 A cross-sectional view of the display panel along line A-A', please refer to... Figures 1 to 8 In one optional embodiment of this disclosure, the microcavity 00 has a narrow top and wide bottom structure along the direction from the substrate 10 to the insulating layer 30.

[0050] Specifically, the microcavity 00 is located on the surface of the insulating layer 30 facing away from the substrate 10. Along the direction from the substrate 10 to the insulating layer 30, the microcavity 00 has a structure that is narrower at the top and wider at the bottom. Here, "top" refers to the portion of the microcavity 00 relatively far from the substrate 10, and "bottom" refers to the portion of the microcavity 00 relatively close to the substrate 10. Please refer to [reference needed]. Figure 7 When the microcavity 00 includes a first sub-part 001 and a second sub-part 002, the first sub-part 001 of the microcavity 00 is relatively far from the substrate 10, and the second sub-part 002 of the microcavity 00 is relatively close to the substrate 10. The first sub-part 001 of the microcavity 00, which is relatively far from the substrate 10, is narrower than the second sub-part 002 of the microcavity 00, which is relatively close to the substrate 10. Please refer to... Figure 8When the insulating layer 30 only includes one film layer 301, the micro cavity 00 is only composed of one part, and the cross section of the micro cavity 00 in the direction perpendicular to the plane where the substrate 10 is located is a trapezoid. The short horizontal side of the trapezoid is relatively far away from the substrate 10, the long horizontal side of the trapezoid is relatively close to the substrate 10, and the trapezoidal micro cavity 00 has a structure of being narrow at the top and wide at the bottom. In this way, by arranging the micro cavity 00 to have a structure of being narrow at the top and wide at the bottom, the connecting wires 40 on the left and right sides of the micro cavity 00 can be naturally disconnected based on the special structure of the micro cavity 00 when the connecting wires 40 are formed by film plating, thereby reducing the risk of the connecting wires 40 and the metal pads 20 being connected to be buckled or detached due to the subsequent film tearing process, and causing poor connection.

[0051] Please refer to Figures 1 to 8 In an optional embodiment of the present disclosure, the micro cavity 00 does not penetrate the insulating layer 30.

[0052] Specifically, the micro cavity 00 is located on the surface of the insulating layer 30 away from the substrate 10, and the micro cavity 00 does not penetrate the insulating layer 30 in the direction perpendicular to the plane where the substrate 10 is located, that is, the minimum distance between the micro cavity 00 located on the side of the insulating layer 30 away from the substrate 10 and the metal pad 20 is greater than 0. When the connecting wires 40 are formed by film plating, there is part of the insulating layer 30 between the film plating material falling to the bottom of the micro cavity 00 and the metal pad 20, which can insulate the film plating material located in the micro cavity 00 from the metal pad 20. In this way, the micro cavity 00 does not penetrate the insulating layer 30, which can reduce the risk of short circuit caused by the film plating material falling to the bottom of the micro cavity 00 and being connected to the metal pad 20 when the connecting wires 40 are formed by film plating, thereby improving the safety of the display panel 100.

[0053] Please refer to Figures 1 to 6 In an optional embodiment of the present disclosure, the first surface 11 is provided with a plurality of first metal pads 21 arranged at intervals, and the first insulating layer 31 includes a first micro cavity 01 and a second micro cavity 02. The projection of the first micro cavity 01 on the substrate 10 at least partially overlaps the projection of the first metal pad 21 on the substrate 10 in the direction perpendicular to the plane where the substrate 10 is located, and the projection of the second micro cavity 02 on the substrate 10 does not overlap the projection of the first metal pad 21 on the substrate 10.

[0054] Specifically, in an optional embodiment provided by the present disclosure, the substrate 10 includes a first surface 11. The first surface 11 is provided with a plurality of first metal pads 21 arranged at intervals in the direction parallel to the plane where the substrate 10 is located. The first insulating layer 31 is located on the side of the first metal pad 21 away from the substrate 10 in the direction perpendicular to the plane where the substrate 10 is located. Please refer to Figure 5 The first insulating layer 31 includes a first micro cavity 01, and the projection of the first micro cavity 01 on the substrate 10 at least partially overlaps the projection of the first metal pad 21 on the substrate 10. Please refer toFigure 6 The first insulating layer 31 includes the second microcavity 02, and a projection of the second microcavity 02 on the substrate 10 does not overlap a projection of the first metal pad 21 on the substrate 10, that is, along a direction perpendicular to a plane in which the substrate 10 is located, a side surface of the first insulating layer 31 away from the first metal pad 21 includes the first microcavity 01 and the second microcavity 02, and along a direction in which the substrate 10 is directed to the first insulating layer 31, the first microcavity 01 is located above the first metal pad 21, and the second microcavity 02 is not located above the first metal pad 21; along a direction parallel to the plane in which the substrate 10 is located, the second microcavity 02 is located between two adjacent first metal pads 21. In this way, by arranging the second microcavity 02 on the first insulating layer 31 between two adjacent first metal pads 21 in the direction parallel to the plane in which the substrate 10 is located, there is no first metal pad 21 below the second microcavity 02 in the direction in which the first insulating layer 31 is directed to the plane in which the substrate 10 is located, so that the water-oxygen isolation effect of the substrate 10 can be improved, and the short-circuit probability of the display panel 100 can be reduced.

[0055] Please refer to Figures 1 to 8 In an optional embodiment of the present disclosure, the size of the first microcavity 01 is smaller than the size of the second microcavity 02.

[0056] Specifically, the side of the first insulating layer 31 away from the substrate 10 includes the first microcavity 01 and the second microcavity 02, along a direction perpendicular to a plane in which the substrate 10 is located, the first microcavity 01 at least partially overlaps the first metal pad 21, and along a direction parallel to the plane in which the substrate 10 is located, the second microcavity 02 is located between two adjacent first metal pads 21. In an optional embodiment provided in the present disclosure, along the direction perpendicular to the plane in which the substrate 10 is located, one first metal pad 21 corresponds to a plurality of first microcavities 01, and along the direction parallel to the plane in which the substrate 10 is located, between two adjacent first metal pads 21, there corresponds a plurality of second microcavities 02, the projection of the first microcavity 01 on the plane in which the substrate 10 is located is smaller than the projection of the second microcavity 02 on the plane in which the substrate 10 is located, and the number of the first microcavities 01 is smaller than the number of the second microcavities 02. In this way, by arranging the first microcavity 01 and the second microcavity 02 on the first insulating layer 31, the specific structure of the first microcavity 01 and the second microcavity 02 naturally disconnects the connecting wires 40 on both sides of the microcavity 00, and by designing the size of the first microcavity 01 to be smaller than the size of the second microcavity 02, the connecting wires 40 corresponding to the first metal pad 21 can be more thoroughly disconnected during film plating, and the probability of edge lifting or falling off of the connecting wires 40 caused by film tearing can be reduced.

[0057] Please refer to Figures 1 to 8 In an optional embodiment of the present disclosure, the first microcavity 01 and the second microcavity 02 are in communication.

[0058] Specifically, in the direction parallel to the plane where the substrate 10 is located, the plurality of first microcavities 01 corresponding to the same metal pad 20 are in communication with each other, the plurality of second microcavities 02 corresponding to the adjacent two first metal pads 21 are in communication with each other, the first microcavity 01 is in communication with the second microcavity 02, and the connection wire 40 on both sides of the microcavity 00 is at least partially disconnected. Please refer to Figure 1 The first microcavity 01 is in communication with the second microcavity 02, a continuous and orderly microcavity 00 channel can be formed on the insulating layer 30, and the connection wire 40 on both sides of the microcavity 00 is naturally disconnected during film plating. In this way, the first microcavity 01 is in communication with the second microcavity 02, which can form a natural transition between the first microcavity 01 and the second microcavity 02, and the connection wire 40 on both sides of the microcavity 00 is disconnected in an orderly manner, facilitating the smooth tearing of the film.

[0059] Please refer to Figures 7 to 8 In an optional embodiment of the present disclosure, the insulating layer 30 includes a first film layer 301 and a second film layer 302, the first film layer 301 is located on the side of the second film layer 302 away from the substrate 10, and the etching rate of the material of the first film layer 301 is less than that of the second film layer 302.

[0060] Specifically, in an optional embodiment provided by the present disclosure, when the first insulating layer 31 has a microcavity 00, the first insulating layer 31 includes a first film layer 301 and a second film layer 302, the first film layer 301 is located on the side of the second film layer 302 away from the substrate 10, in the direction perpendicular to the plane where the substrate 10 is located, the microcavity 00 is located in the first film layer 301 and part of the second film layer 302, and the etching rate of the material of the first film layer 301 is less than that of the second film layer 302; in another optional embodiment provided by the present disclosure, when the second insulating layer 32 has a microcavity 00, the second insulating layer 32 includes a first film layer 301 and a second film layer 302, the first film layer 301 is located on the side of the second film layer 302 away from the substrate 10, in the direction perpendicular to the plane where the substrate 10 is located, the microcavity 00 is located in the first film layer 301 and part of the second film layer 302, and the etching rate of the material of the first film layer 301 is less than that of the second film layer 302; in this way, when the microcavity 00 is etched in the insulating layer 30, because the etching rate of the material of the first film layer 301 is less than that of the second film layer 302, the microcavity 00 naturally forms a structure of being narrow at the top and wide at the bottom in the direction perpendicular to the plane where the substrate 10 is located, which facilitates the natural disconnection of the connection wire 40 on both sides of the microcavity 00 during film plating and reduces the occurrence of adverse conditions such as edge lifting of the connection wire 40 caused by film tearing.

[0061] Please refer to Figure 7In an optional embodiment provided in the present disclosure, the micro cavity 00 includes a first sub-part 001 and a second sub-part 002, the first sub-part 001 is located in the first film layer 301, the second sub-part 002 is located in the second film layer 302, the first sub-part 001 and the second sub-part 002 are through, the inner diameter R1 of the first sub-part 001 is smaller than the inner diameter R2 of the second sub-part 002.

[0062] Specifically, in an optional embodiment provided in the present disclosure, referring to Figure 5 and Figure 7 , the first insulating layer 31 includes a first micro cavity 01 and a second micro cavity 02, the projection of the first micro cavity 01 on the plane where the substrate 10 is located at least partially overlaps with the projection of the first metal pad 21 on the plane where the substrate 10 is located, the first micro cavity 01 includes a first sub-part 001, along the direction perpendicular to the plane where the substrate 10 is located, the first sub-part 001 is located in the first film layer 301 relatively far away from the first metal pad 21, the first micro cavity 01 includes a second sub-part 002, the second sub-part 002 is located in the second film layer 302 relatively close to the first metal pad 21, the first sub-part 001 and the second sub-part 002 are through, the inner diameter R1 of the first sub-part 001 is smaller than the inner diameter R2 of the second sub-part 002, that is, along the direction where the substrate 10 points to the first insulating layer 31, the first micro cavity 01 is in an upper-narrow-lower-wide structure; please refer to Figures 6 to 7 , the projection of the second micro cavity 02 on the plane where the substrate 10 is located does not overlap with the projection of the first metal pad 21 on the plane where the substrate 10 is located, the second micro cavity 02 includes a first sub-part 001, along the direction perpendicular to the plane where the substrate 10 is located, the first sub-part 001 is located in the first film layer 301 relatively far away from the substrate 10, the second micro cavity 02 includes a second sub-part 002, the second sub-part 002 is located in the second film layer 302 relatively close to the substrate 10, the first sub-part 001 and the second sub-part 002 are through, the inner diameter R1 of the first sub-part 001 is smaller than the inner diameter R2 of the second sub-part 002, that is, along the direction where the substrate 10 points to the first insulating layer 31, the second micro cavity 02 is in an upper-narrow-lower-wide structure; in this way, by setting the micro cavities 00 to be through each other but located in the sub-parts of different film layers, the micro cavities 00 can naturally form an upper-narrow-lower-wide structure based on the material characteristics of the film layers and the difference in etching rate when etching the insulating layer 30, which is beneficial for the connection wires 40 on both sides of the micro cavities 00 to be naturally disconnected when film plating.

[0063] It should be noted that only the case where the first sub-part 001 and the second sub-part 002 of the micro cavity 00 are rectangular is shown in the figure, it can be understood that the first sub-part 001 and the second sub-part 002 can also be in an upper-narrow-lower-wide structure such as isosceles trapezoid or non-isosceles trapezoid, which will not be listed one by one here, and can be set according to actual process needs.

[0064] It should be noted that only the first microcavity 01 and the second microcavity 02 of the first insulating layer 31 are shown in the figure, and it can be understood that when the display panel 100 includes the second insulating layer 32, the second insulating layer 32 includes the microcavity 00, the first microcavity 01 and the second microcavity 02 exist in the second insulating layer 32, the first microcavity 01 in the second insulating layer 32 includes the first sub-portion 001 and the second sub-portion 002, the first sub-portion 001 and the second sub-portion 002 are through, the inner diameter of the first sub-portion 001 is smaller than that of the second sub-portion 002, that is, in the direction of the substrate 10 pointing to the second insulating layer 32, the first microcavity 01 has a structure of being narrow at the top and wide at the bottom; the first sub-portion 001 of the first microcavity 01 is located in the first film layer 301 relatively far away from the substrate 10, and the second sub-portion 002 of the first microcavity 01 is located in the second film layer 302 relatively close to the substrate 10; the second microcavity 02 in the second insulating layer 32 includes the first sub-portion 001 and the second sub-portion 002, the first sub-portion 001 of the second microcavity 02 is located in the first film layer 301 relatively far away from the substrate 10, and the second sub-portion 002 of the second microcavity 02 is located in the second film layer 302 relatively close to the substrate 10, the first sub-portion 001 and the second sub-portion 002 are through, the inner diameter R1 of the first sub-portion 001 is smaller than the inner diameter R2 of the second sub-portion 002, that is, in the direction of the substrate 10 pointing to the second insulating layer 32, the second microcavity 02 has a structure of being narrow at the top and wide at the bottom.

[0065] Please refer to Figure 8 In an optional embodiment of the present disclosure, the microcavity 00 has a trapezoidal cross section in the direction perpendicular to the plane in which the substrate 10 is located.

[0066] Specifically, in an optional embodiment provided by the present disclosure, the insulating layer 30 only includes the first film layer 301, the microcavity 00 is located on the surface of the first film layer 301 away from the substrate 10 and does not penetrate through the first film layer 301, and in the direction perpendicular to the plane in which the substrate 10 is located, the cross section of the microcavity 00 is trapezoidal. When the film is formed to connect the wire 40, the trapezoidal microcavity 00 can naturally disconnect the film material falling into the bottom of the microcavity 00 from the connecting wire 40 on both sides of the microcavity 00, facilitating the subsequent film tearing process. In this way, when the insulating layer 30 only includes the first film layer 301, by setting the microcavity 00 to have a structure of being narrow at the top and wide at the bottom, the connecting wire 40 on both sides of the microcavity 00 can be naturally disconnected without the need to increase the process during the film plating process, and the film material falling into the bottom of the microcavity 00 does not form adhesion, reducing the occurrence of adverse conditions such as edge lifting or falling off of the connecting wire 40 during film tearing.

[0067] Figure 9 The figure shows a relative width diagram of the metal wire and the microcavity provided by an embodiment of the present disclosure. Please refer to Figures 1 to 9In an optional embodiment of the present disclosure, the display panel 100 provided by the present disclosure has a metal wire 41 in the micro-cavity 00, the maximum width H1 of the metal wire 41 is less than the maximum width R2 of the micro-cavity 00, and the metal wire 41 is formed in the same process as the connection wire 40. It should be noted that the maximum width R2 of the micro-cavity 00 is the maximum inner diameter R2 of the micro-cavity 00.

[0068] Specifically, in an optional embodiment provided by the present disclosure, after the surface of the insulating layer 30 away from the substrate 10 is etched to form the micro-cavity 00, the first surface 11, the second surface 12 and the side surface 13 of the substrate 10 are coated, and after the coating is completed, the coating material deposited on the side surface 13, at least part of the first surface 11 and at least part of the second surface 12 forms the connection wire 40, the connection wire 40 is used to connect the metal pads 20 on the first surface 11 and the second surface 12, and the coating material deposited inside the micro-cavity 00 forms the metal wire 41. The upper narrow and lower wide structure of the micro-cavity 00 makes the maximum width H1 of the metal wire 41 deposited inside the micro-cavity 00 less than the maximum inner diameter R2 of the micro-cavity 00. In this way, by forming the connection wire 40 on the surface of the substrate 10 and the metal wire 41 inside the micro-cavity 00 in the coating process, due to the upper narrow and lower wide structure of the micro-cavity 00, the maximum width H1 of the metal wire 41 is less than the maximum width R2 of the micro-cavity 00, and the metal wire 41 will not be lifted when the film is torn off later. It is beneficial to deposit the metal wire 41 inside the micro-cavity 00 to form a continuous metal wire, which is convenient for communication with the anti-static circuit of the display panel 100, and improves the safety of the display panel 100.

[0069] Please refer to Figures 1 to 9 In an optional embodiment of the present disclosure, the display panel 100 includes an anti-static circuit, and the metal wire 41 is in communication with the anti-static circuit.

[0070] Specifically, in an optional embodiment provided by the present disclosure, the display panel 100 includes an anti-static circuit, the anti-static circuit is located outside the display area, and in the direction perpendicular to the plane where the substrate 10 is located, a plurality of first micro-cavities 01 corresponding to the same metal pad 20 in the same insulating layer 30 are in communication with each other, and a plurality of second micro-cavities 02 corresponding to adjacent two metal pads 20 are in communication with each other, and the first micro-cavity 01 and the second micro-cavity 02 are in communication, please refer to Figure 1The continuous microcavities 00 are communicated, and when the film coating forms the connecting wire 40, at least part of the film coating material is deposited on the bottom of the microcavities 00 to form a continuous metal wire 41. The continuous metal wire 41 in the plurality of microcavities 00 is communicated with the anti-static circuit in the display panel 100, preventing the connecting wire 40 from being damaged by static electricity in subsequent processes, improving the anti-static effect of the display panel 100, and ensuring product reliability. In this way, by communicating the metal wire 41 in the plurality of communicated microcavities 00 with the anti-static circuit of the display panel 100, the anti-static effect of the display panel 100 can be improved, and the safety and stability of the display panel 100 can be improved.

[0071] Please refer to Figure 5 and Figure 6 In another optional embodiment provided by the present disclosure, in the direction parallel to the plane where the substrate 10 is located, the same insulating layer 30 includes a plurality of microcavities 00, the plurality of microcavities 00 are communicated with each other, the film coating process forms the connecting wire 40 on the surface of the first insulating layer 31 of the first surface 11, the side surface 13, and the surface of the second insulating layer 32 of the second surface 12. After the metal wire 41 is formed in the microcavity 00, in combination with the subsequent packaging process, the light-shielding layer 50 is filled above the metal wire 41 of the microcavity 00. The light-shielding layer 50 can reduce the reflectivity of the display panel 100 and prevent overflow of glue to the display area caused by the printing or pad printing process.

[0072] Figure 10 The relative relationship between the depth of the microcavity and the thickness of the connecting wire provided by the embodiment of the present disclosure is shown in the schematic diagram. Please refer to Figures 1 to 10 The present disclosure provides a display panel 100, the depth h1 of the microcavity 00 is greater than the thickness L1 of the connecting wire 40, and the minimum inner diameter R1 of the microcavity 00 is greater than or equal to 1.2 times the thickness L1 of the connecting wire 40.

[0073] Specifically, in the direction perpendicular to the plane where the substrate 10 is located, the maximum depth h1 of the micro-cavity 00 is greater than the thickness L1 of the connection trace 40, the width H1 of the metal line 41 deposited inside the micro-cavity 00 by the plating process is less than the minimum inner diameter R1 of the micro-cavity 00, when the plating film is a thin film, the minimum inner diameter R1 of the micro-cavity 00 is 1.2 times or more of the thickness of the plating film, in an optional embodiment provided by the present disclosure, the minimum inner diameter R1 of the micro-cavity 00 is 1.2 times of the thickness L1 of the connection trace 40; in another optional embodiment provided by the present disclosure, the minimum inner diameter R1 of the micro-cavity 00 is 1.5 times of the thickness L1 of the connection trace 40; hereinafter, specific embodiments are not listed one by one, and the minimum inner diameter R1 of the micro-cavity 00 can be set according to the process requirement, as long as the minimum inner diameter R1 of the micro-cavity 00 is 1.2 times or more of the thickness L1 of the connection trace 40; in this way, the height difference between the metal line 41 inside the micro-cavity 00 and the connection trace 40 on both sides of the micro-cavity 00 is greater than the thickness L1 of the connection trace 40 itself, which can realize the natural disconnection of the connection trace 40 on both sides of the micro-cavity 00 and the metal line 41 inside the micro-cavity 00 in the plating process, and reduce the metal debris back-sticking in the film tearing process, thereby causing subsequent process defects.

[0074] Figure 11 A display device provided by an embodiment of the present disclosure is shown in a schematic diagram, Figures 1 to 11 The present disclosure provides a display device 200, which comprises the display panel 100 provided by any of the above embodiments.

[0075] The display device 200 provided by the embodiment of the present disclosure can be a touch display screen, a mobile phone, a tablet computer, a notebook computer, an electronic paper or a television, or any other electronic device with a display function, and can also be a spliced display device. The display device 200 provided by the embodiment of the present disclosure has the beneficial effects of the display panel 100 provided by the embodiment of the present disclosure, and specific descriptions can be referred to the specific descriptions of the display panel 100 in the above embodiments, which will not be repeated here.

[0076] It can be understood that, Figure 11 Only a circular rectangular structure is taken as an example to show one shape of the display device 200, and in some other embodiments of the present disclosure, the display device 200 can also be in a circular, elliptical or any other feasible shape, which is not specifically limited in the present disclosure.

[0077] Figure 12 A manufacturing flowchart of a display panel provided by an embodiment of the present disclosure is shown, Figure 13 A structure schematic diagram of a display panel provided by an embodiment of the present disclosure when a protective layer exists is shown, please combine Figures 1 to 13 The present disclosure provides a manufacturing method of a display panel 100, which is used to manufacture the display panel 100 as described above, and the method comprises:

[0078] S1: providing a substrate 10;

[0079] S2: forming metal pads 20 on the first face 11 and the second face 12 of the substrate 10;

[0080] S3: disposing an insulating layer 30 on the side of the metal pads 20 away from the substrate 10, at least part of the metal pads 20 being exposed to the insulating layer 30;

[0081] S4: disposing a protective layer 60 on the side of the insulating layer 30 away from the metal pads 20, at least part of the insulating layer 30 being exposed to the protective layer 60;

[0082] S5: etching the insulating layer 30 exposed to the protective layer 60 to form microcavities 00;

[0083] S6: plating a metal layer on the side face 13, the first face 11 and the second face 12 of the substrate 10, the metal layer covering the metal pads 20 exposed to the insulating layer 30, and electrically connecting the metal pads 20 on the first face 11 and the second face 12;

[0084] S7: tearing off the protective layer 60.

[0085] Specifically, step S1: providing a substrate 10; step S2: making a plurality of first metal pads 21 arranged at intervals on a first surface 11 of the substrate 10 and a plurality of second metal pads 22 arranged at intervals on a second surface 12 of the substrate 10 in a direction parallel to the plane on which the substrate 10 lies; step S3: providing a first insulating layer 31 on the side of the plurality of first metal pads 21 away from the substrate 10, at least part of the first metal pads 21 being exposed to the first insulating layer 31, and / or providing a second insulating layer 32 on the side of the plurality of second metal pads 22 away from the substrate 10, at least part of the second metal pads 22 being exposed to the second insulating layer 32; step S4: providing a protective layer 60 on the side of the first insulating layer 31 away from the first metal pads 21, at least part of the first insulating layer 31 being exposed to the protective layer 60, and / or providing a protective layer 60 on the side of the second insulating layer 32 away from the second metal pads 22, at least part of the second insulating layer 32 being exposed to the protective layer 60, the material of the protective layer 60 being an organic film such as a polyimide film; step S5: etching the first insulating layer 31 exposed to the protective layer 60 to form microcavities 00, and etching the second insulating layer 32 exposed to the protective layer 60 to form microcavities 00 (if any); step S6: coating the side surface 13 of the substrate 10, the first insulating layer 31 on the first surface 11, and the second insulating layer 32 on the second surface 12 with a metal layer, the metal layer covering at least part of the first metal pads 21 exposed to the first insulating layer 31, the metal layer covering at least part of the second metal pads 22 exposed to the second insulating layer 32, and the first metal pads 21 on the first surface 11 being electrically connected to the second metal pads 22 on the second surface 12 through the metal layer formed by coating; and step S7: after the coating is completed, the protective layer 60 is removed, thereby obtaining the display panel 100 provided by the embodiment of the present disclosure.

[0086] It should be noted that the material of the insulating layer 30 includes one or more of organic materials and inorganic materials, the first insulating layer 31 and the second insulating layer 32 can only include the first film layer 301, and the first film layer 301 includes one or more of organic materials and inorganic materials; the insulating layer 30 can also include the first film layer 301 and the second film layer 302, the first film layer 301 is an organic material, the second film layer 302 is an inorganic material, or the first film layer 301 is an inorganic material, the second film layer 302 is an organic material, or the first film layer 301 and the second film layer 302 are respectively organic materials of different compositions, or the first film layer 301 and the second film layer 302 are respectively inorganic materials of different compositions; for example, the material of the first film layer 301 is resin, and the material of the second film layer 302 is silicon nitride; or the material of the first film layer 301 is silicon nitride, and the material of the second film layer 302 is resin; or the material of the first film layer 301 is silicon oxide, and the material of the second film layer 302 is silicon nitride; and so on, which are not listed one by one here, as long as when the insulating layer 30 includes a plurality of film layers, the materials of the plurality of film layers are different in composition.

[0087] Please refer to Figures 1 to 13 , the present disclosure provides a manufacturing method of a display panel 100, and the protective layer 60 is torn off in step S7. Specifically, after the metal layer is patterned to form the connection trace 40, the protective layer 60 is torn off, and a stripping solution is used to remove the dry photoresist film. Alternatively, the protective layer 60 is first torn off, and then the metal layer is laser engraved to form the connection trace 40. The structure of the display panel after the protective film is torn off is shown in Figures 1 to 10 .

[0088] Specifically, in an optional embodiment provided by the present disclosure, after the metal layer is formed on the side surface 13 of the substrate 10, the first insulating layer 31 of the first surface 11, and the second insulating layer 32 of the second surface 12, the metal layer can be first patterned to form the connection trace 40, and then the protective layer 60 is torn off. The torn-off protective layer 60 can be torn off together with the metal layer plated above the protective layer 60, and only the part of the connection trace 40 extending along the side edge to the first metal pad 21 and the second metal pad 22 is retained. Then, a stripping solution is used to remove the dry photoresist film in the patterning process, and the display panel 100 provided by the embodiment of the present disclosure is obtained. In another optional embodiment provided by the present disclosure, after the metal layer is formed on the side surface 13 of the substrate 10, the first insulating layer 31 of the first surface 11, and the second insulating layer 32 of the second surface 12, the protective layer 60 is first torn off, and the torn-off protective layer 60 is torn off together with the metal layer plated above the protective layer 60. Then, the remaining metal layer is laser engraved to form the connection trace 40, and the connection trace 40 connects the first metal pad 21 and the second metal pad 22, so that the display panel 100 provided by the embodiment of the present disclosure is obtained. In this way, according to the actual process needs, the corresponding protective layer 60 tearing process can be provided, and multiple feasible solutions for the patterning of the metal layer and the tearing of the protective layer 60 are provided.

[0089] Please continue to refer to Figures 1 to 13 , the present disclosure provides a manufacturing method of a display panel 100, and when the insulating layer 30 includes the first film layer 301 and the second film layer 302, different etching rates are used to form the microcavity 00 with a narrow upper part and a wide lower part. Alternatively, when the insulating layer 30 includes only one film layer, a negative photoresist process is used to etch the microcavity 00 into a structure with a trapezoidal cross section.

[0090] Specifically, in an optional embodiment provided in the present disclosure, when the insulating layer 30 comprises the first film layer 301 and the second film layer 302, the material of the first film layer 301 and the material of the second film layer 302 comprise one or more of organic material and inorganic material, and the material of the first film layer 301 is different from the material of the second film layer 302. Without adding a mask, a self-alignment process is adopted to form the microcavity 00 with a narrow upper part and a wide lower part by using different etching rates for the first film layer 301 and the second film layer 302 of the insulating layer 30. The inner diameter R1 of the first subpart 001 of the same microcavity 00 is smaller than the inner diameter R2 of the second subpart 002, and the first subpart 001 and the second subpart 002 of the microcavity 00 are not misaligned at the opening. In another optional embodiment provided in the present disclosure, when the insulating layer 30 only comprises the first film layer 301, the material of the first film layer 301 comprises one or more of organic material and inorganic material. For example, when the material of the first film layer 301 is resin, a half-tone mask process can be used to form the microcavity 00 with a trapezoidal structure in the resin film layer, and the left and right oblique edges of the trapezoidal structure of the microcavity 00 are not strictly symmetrical (related to the evaporation angle). In this way, when the insulating layer 30 comprises multiple film layers, the etching rate of different film layers can be controlled to achieve the structure of the microcavity 00 with a narrow upper part and a wide lower part. When the insulating layer 30 only comprises one film layer, the process can be controlled to achieve the structure of the microcavity 00 with a narrow upper part and a wide lower part, and the process risk is low, thereby reducing the production cost.

[0091] It should be noted that when etching the insulating layer 30, the etching depth of the film layer close to the substrate 10 should be controlled to prevent the metal line 41 from being short-circuited with the metal pad 20 due to etching through.

[0092] In summary, the display panel and manufacturing method, and the display device provided by the present disclosure have the following advantages. The micro cavity is arranged on the side surface of the insulating layer away from the metal pad. Based on the upper-narrow lower-wide structure of the micro cavity, the connection wires on both sides of the micro cavity are naturally disconnected, reducing the edge lifting of the connection wires caused by film tearing. The micro cavity does not penetrate the insulating layer, reducing the risk of short circuit caused by the falling of the plating film material to the bottom of the micro cavity and the connection with the metal pad, and improving the safety of the display panel. The size of the first micro cavity is designed to be smaller than the size of the second micro cavity, so that the corresponding connection wires of the first metal pad are more completely disconnected in the direction perpendicular to the plane where the substrate is located, and the probability of edge lifting of the connection wires caused by film tearing is smaller. The first micro cavity and the second micro cavity are in communication, so that the first micro cavity and the second micro cavity form a natural transition, and the connection wires on both sides of the micro cavity are neatly disconnected, facilitating the smooth film tearing process. The etching rate of the first film layer material is smaller than the etching rate of the second film layer material, so that the micro cavity naturally forms an upper-narrow lower-wide structure in the direction perpendicular to the plane where the substrate is located, and the connection wires on both sides of the micro cavity are naturally disconnected during plating. When the insulating layer includes multiple film layers, by arranging the micro cavities to be mutually penetrated but located in different film layers, the micro cavities naturally form an upper-narrow lower-wide structure due to the difference in film layer material properties and etching rate during etching of the insulating layer. When the insulating layer includes only the first film layer, the micro cavity is arranged in a trapezoidal upper-narrow lower-wide structure, so that the connection wires on both sides of the micro cavity are naturally disconnected during plating to form the connection wires, and the plating film material falling to the bottom of the micro cavity does not form adhesion, reducing the adhesion of metal debris during the film tearing process, which causes subsequent process defects. The maximum width of the metal line is smaller than the maximum width of the micro cavity, so that the metal line will not be lifted during subsequent film tearing, facilitating the deposition of the metal line inside the micro cavity. By connecting the metal lines in the multiple interconnected micro cavities with the anti-static circuit of the display panel, the anti-static effect of the display panel can be improved. According to the actual process needs, corresponding film removal protection processes are provided, providing multiple feasible solutions for patterning of the metal layer and removal of the protective layer. When the insulating layer includes multiple film layers, the etching rate of different film layers is controlled to achieve the upper-narrow lower-wide structure of the micro cavity. When the insulating layer includes only one film layer, the process is controlled to achieve the upper-narrow lower-wide structure of the micro cavity, which has low process risk and reduces production costs.

[0093] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0094] The above description is merely a specific embodiment of this disclosure, enabling those skilled in the art to understand or implement it. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display panel, characterized by, The display panel comprises: a substrate comprising a first surface and a second surface arranged oppositely, and a side surface, the first surface and the second surface are provided with metal pads; the metal pads comprise first metal pads and second metal pads, the first metal pads are located on the first surface, and the second metal pads are located on the second surface; a first insulating layer is arranged at least partially on a side of the first metal pads away from the first surface, at least part of the first metal pads is exposed to the first insulating layer, the first insulating layer comprises micro cavities, and the micro cavities are located on a side surface of the first insulating layer away from the first metal pads; and / or, a second insulating layer is arranged at least partially on a side of the second metal pads away from the second surface, at least part of the second metal pads is exposed to the second insulating layer, the second insulating layer comprises micro cavities, and the micro cavities are located on a side surface of the second insulating layer away from the second metal pads; a connecting wire is located at least partially on the side surface and connects the first metal pads and the second metal pads; the connecting wire on both sides of the micro cavities is at least partially naturally disconnected; the first surface is provided with a plurality of first metal pads, and the plurality of first metal pads are arranged at intervals; the first insulating layer comprises first micro cavities and second micro cavities, in a direction perpendicular to a plane in which the substrate is located, the first micro cavities at least partially overlap projections of the first metal pads on the substrate, and a plurality of second micro cavities are arranged between adjacent two first metal pads, and the second micro cavities do not overlap the projections of the first metal pads on the substrate.

2. The display panel of claim 1, wherein, In a direction of the substrate pointing to the insulating layer, the micro cavities have a structure of being narrow at the top and wide at the bottom.

3. The display panel of claim 1, wherein, The micro cavities do not penetrate the insulating layer.

4. The display panel of claim 1, wherein, The size of the first micro cavities is smaller than the size of the second micro cavities.

5. The display panel of claim 1, wherein, The first micro cavities are in communication with the second micro cavities.

6. The display panel of claim 1, wherein, The insulating layer comprises a first film layer and a second film layer, the first film layer is located on a side of the second film layer away from the metal pads, and the etching rate of the material of the first film layer is smaller than the etching rate of the material of the second film layer.

7. The display panel of claim 6, wherein, The micro cavities comprise a first sub-part and a second sub-part, the first sub-part is located on the first film layer, the second sub-part is located on the second film layer, the first sub-part and the second sub-part are through, and the inner diameter of the first sub-part is smaller than the inner diameter of the second sub-part.

8. The display panel of claim 1, wherein, The micro cavities have a trapezoidal cross section in a direction perpendicular to a plane in which the substrate is located.

9. The display panel of claim 1, wherein, A metal wire exists in the micro cavities, and the maximum width of the metal wire is smaller than the maximum width of the micro cavities; The metal wire and the connecting wire are formed in the same process.

10. The display panel of claim 9, wherein, The display panel comprises an anti-static circuit, and the metal wire is in communication with the anti-static circuit.

11. The display panel of claim 1, wherein, The depth of the micro cavities is greater than the thickness of the connecting wire. The minimum inner diameter of the micro cavities is greater than or equal to 1.2 times the thickness of the connecting wire.

12. A display device, characterized by comprising: The display panel comprises the display panel according to any one of claims 1-11.

13. A manufacturing method of a display panel, comprising: A method for manufacturing the display panel according to any one of claims 1-11, the method comprises: providing a substrate; Manufacturing a metal pad on the first and second surfaces of a substrate; Setting an insulating layer on the side of the metal pad away from the substrate, at least part of the metal pad is exposed to the insulating layer; Setting a protective layer on the side of the insulating layer away from the metal pad, at least part of the insulating layer is exposed to the protective layer; Etching the insulating layer exposed to the protective layer to form a micro-cavity; Plating a metal layer on the side surface, the first surface and the second surface of the substrate, the metal layer covers the metal pad exposed to the insulating layer, and the metal pads on the first surface and the second surface are electrically connected; Tearing off the protective layer.

14. The manufacturing method of the display panel according to claim 13, wherein the tearing off the protective layer is specifically: After the metal layer is patterned to form a connection wire, the protective layer is torn off, and a stripping liquid is used to remove the dry photoresist film; or, the protective layer is torn off first, and then the metal layer is laser engraved to form a connection wire. When the insulating layer includes a first film layer and a second film layer, different etching rates are used to etch the first film layer and the second film layer of the insulating layer to form a micro-cavity with a narrow upper part and a wide lower part; 15. The manufacturing method of a display panel according to claim 13, wherein, Or, when the insulating layer includes only one film layer, a negative photoresist process is used to etch the micro-cavity into a trapezoidal structure in cross section. ​

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