A semiconductor lead frame cutting device

Abstract

The present invention provides a semiconductor lead frame cutting device, including a support assembly, which includes a support platform, a first driving rod, a top plate and a flip plate; a feeding conveyor belt; a cutting assembly, which is installed at one end of the bottom surface of the flip plate, and the cutting assembly is used to cut the semiconductor frame to obtain a semiconductor body; a press assembly, which is installed at the other end of the bottom surface of the flip plate, and the press assembly includes a third driving rod, a hanging frame, a flip frame, a bending press plate and a detection component; a feeding conveyor belt, which is placed on the side of the support platform, and the surface of the feeding conveyor belt is provided with a conveying mold for placing the semiconductor body; a recycling assembly, which is installed on the inner side of the surface of the support platform, and the recycling assembly is used to separate and recycle resin and metal parts; a first positioning assembly; and a second positioning assembly. After the cutting of the ribs is completed, the present invention can discharge the unqualified semiconductors together with the lead frame.

Description

Technical Field

[0001] The invention relates to the technical field of lead frame rib cutting equipment, and in particular to a semiconductor lead frame rib cutting device. Background Art

[0002] Semiconductors are the cornerstone of modern electronic technology and are widely used in various electronic devices, such as computers, mobile phones, sensors, and power management devices. Semiconductor materials have unique electrical properties and can exhibit the characteristics of conductors and insulators under different conditions;

[0003] After the semiconductor is sealed, it needs to be cut and formed. The cutter will separate the sealed semiconductor from the lead frame, and then press the outer conductor of the semiconductor into a pin. The current cutting equipment has the following shortcomings when working:

[0004] 1. After the rib cutting is completed, the cut lead frame must pass through the turnover track before it can reach the recycling equipment, and the lead frame recycling route is long;

[0005] 2. After the rib cutting is completed, some pins may not meet the appearance standards. Currently, semiconductors lack a testing process before cutting. Unqualified semiconductors are output together with other qualified semiconductors, and a separate testing process is set up to remove unqualified semiconductors. Unqualified semiconductors are then transported to recycling equipment via tracks, making the recycling route for unqualified semiconductors too long. Summary of the invention

[0006] In view of the deficiencies in the prior art, the present invention provides a semiconductor lead frame rib cutting device, which solves the problems mentioned in the background technology.

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] A semiconductor lead frame rib cutting device includes a support assembly, which includes a support platform, a first driving rod, a top plate and a flip plate. The first driving rod is vertically installed on one side of the surface of the support platform, and the top plate is vertically arranged on the top of the first driving rod. The top plate is placed above the support platform in parallel, and the bottom surface of the top plate is rotatably installed with the flip plate;

[0009] A feeding conveyor belt is placed outside the support platform, and is used to convey the semiconductor frame to the processing position of the support platform; the semiconductor frame includes a lead frame, and a plurality of reinforcing bars are equidistantly arranged inside the lead frame, and a semiconductor body is arranged between adjacent reinforcing bars, and both sides of the semiconductor body are connected to the lead frame through straight main ribs, and the top and bottom surfaces of the reinforcing bars are both attached with resin gate materials, and the resin gate materials are connected to the semiconductor body as a whole;

[0010] A rib cutting assembly is installed at one end of the bottom surface of the flip plate, and is used to perform rib cutting on the semiconductor frame to obtain a semiconductor body;

[0011] The profiling component is installed at the other end of the bottom surface of the flip plate. The profiling component includes a third driving rod, a hanging frame, a flip frame, a bending pressure plate and a detection component. The third driving rod is vertically arranged on the bottom surface of the flip plate. The bottom end of the third driving rod is connected to the hanging frame. The flip frame is rotatably installed inside the hanging frame. The flip frame is a rectangular parallelepiped structure. The bottom surface of the flip frame is installed with a bending pressure plate and the side surface is installed with a detection component. The bending pressure plate is used to press out pins on both sides of the semiconductor body. The detection component is used to detect the flatness and gap of the pins.

[0012] A material unloading conveyor belt is placed on the side of the support platform, and a conveying mold for placing the semiconductor body is provided on the surface of the material unloading conveyor belt;

[0013] A recovery component is installed on the inner side of the surface of the support table, and the recovery component is used to separate and recover the resin and the metal parts;

[0014] A first positioning assembly is installed on the inner side of the processing position of the support table, and the first positioning assembly is placed on the outer side of the recovery assembly;

[0015] The second positioning component is installed on the outside of the supporting processing position; when the rib cutting device is cutting the ribs, the first positioning component is placed above the second positioning component to jointly constrain the semiconductor frame; when the rib cutting device is unloading, the first positioning component flips the cut lead frame and unqualified semiconductor body into the recycling component, and the second positioning component flips the semiconductor body into the unloading conveyor belt.

[0016] Furthermore, the rib cutting assembly includes a second driving rod, which is vertically arranged on the bottom surface of the flip plate, and a fixed plate is vertically arranged on the bottom end of the second driving rod. An external cutting knife is vertically arranged on the bottom surface of the fixed plate close to one end of the loading conveyor belt, and a plurality of rectangular cutting frames are arranged on the bottom surface of the fixed plate; the external cutting knife is used to cut the semiconductor frame, and the rectangular cutting frame is used to cut off the main ribs and the resin gate material to separate the semiconductor body from the lead frame.

[0017] Furthermore, the detection component includes a slide plate and a detection probe. The slide plate is slidably installed on the side wall of the flip frame. The outer wall of the slide plate is provided with multiple pairs of detection probes. The detection probes are used to elastically detect the pins located on one side. The detection probes determine the flatness of the pins according to the amount of expansion and contraction when they contact the pins, and the detection probes determine the pin distribution gap according to the interval time when they contact adjacent pins.

[0018] Furthermore, the first positioning assembly includes a first support seat, which is arranged on the surface of the support platform, the top of the first support seat is rotatably connected to the first flip axis, the side of the first flip axis is vertically provided with a first movable rod, the outer end of the first movable rod is provided with an inner fixing block, the two ends of the inner fixing block are connected to the outer fixing block through side connecting strips, a rectangular groove is left between the inner fixing block and the outer fixing block, an outer storage seat is provided on the outer side of the outer fixing block, a second storage groove is opened on the inner wall of the outer storage seat, and an outer hook plate is rotatably installed inside the second storage groove; when cutting materials, the outer hook plate rotates outward to hook the lead frame to prevent the lead frame from detaching prematurely.

[0019] Furthermore, a movable side baffle assembly is installed on the surface of the inner fixed block, and the movable side baffle assembly includes a side guide plate, a guide film and a winding wheel. A first storage groove is opened on the surface of the inner fixed block, a baffle is rotatably installed inside the first storage groove and a torsion spring is installed at the rotating connection, a winding wheel is installed inside the first flip shaft, the outer wall of the winding wheel is wrapped with a guide film, and the outer end of the guide film is connected to the top of the side guide plate; when cutting the ribs, the side guide plate and the external storage seat constrain the input semiconductor frame from both sides; when unloading, the winding wheel rolls up the guide film, so that the side guide plate is stored in the first storage groove, and the lead frame can slide out along the guide film.

[0020] Furthermore, the second positioning assembly includes a main support seat, the top of the main support seat is flushly embedded in the rectangular groove, the bottom of the support plate extends downwardly out of the rectangular groove, the outer side wall of the support plate is vertically provided with a second movable rod, the outer side of the second movable rod is connected to the second flip axis, the second flip axis is arranged in the second support seat, and the second support seat is connected to the main support seat through the support plate; a main material trough is opened in the middle of the surface of the main support seat, the main material trough is aligned with the feeding conveyor belt, the semiconductor body is embedded in the main material trough, side grooves are symmetrically opened on both sides of the surface of the main support seat, and a plurality of groups of negative pressure holes are opened on the surface of the main support seat; the joint between the main support seat and the inner fixing block and the outer fixing block is the cutting point of the main rib, and the side groove is the area where the bending pressure plate presses the pin; the negative pressure hole is used to attract and position the semiconductor body.

[0021] Furthermore, a third storage slot is spaced apart inside the main support seat, a middle support assembly is installed inside the third storage slot, the middle support assembly includes a top block and a side guide rail, the side wall of the top block is provided with a side guide bar, the side guide bar is slidably installed in the side guide rail, the side guide rail is vertically arranged in the third storage slot, and a driving wheel for driving the top block to rise and fall is installed on the top end of the inner part of the side guide rail; when the semiconductor frame is input, the top block is received in the third storage slot to make the main material slot in a flat state; when cutting the ribs, the top block extends outward to support and lift the reinforcing strip.

[0022] Furthermore, outriggers are vertically provided on both sides of the top block, vertical rods are vertically provided on the top surfaces of the outer ends of the outriggers, matching rods are provided on the top ends of the vertical rods, and the length of the matching rods is the same as the length of the top block. The matching rods are relatively arranged on the bottom surface of the connection between the semiconductor body and the resin pouring material; the matching rods are used to support the rectangular cutting frame from the bottom when the rectangular cutting frame cuts off the resin pouring material.

[0023] Furthermore, an internal heating rod is installed inside the matching rod; when the detection probe detects that a certain semiconductor body is unqualified, the internal heating rods on both sides of the unqualified semiconductor body work to make the unqualified semiconductor body hot-melt connected with the resin casting material, and when the first positioning component turns the lead frame outward, the unqualified semiconductor body follows the outward turning.

[0024] Furthermore, the recycling component includes an upper box body, which is arranged on the surface of the support platform, and a mesh plate is installed inside the upper box body, a discharge port is opened at one end of the mesh plate, a metal parts recovery box is provided at a position opposite to the discharge port on the bottom surface of the upper box body, a heating plate is provided on the inner wall of the upper box body, a separation area is formed at a position opposite to the mesh plate and the heating plate, and a water tank is installed at a position opposite to the separation area on the bottom surface of the upper box body; a push plate is installed at the other end of the interior of the upper box body, and the push plate is slidably placed in the upper box body; the heating plate is used to heat the material in the separation area to make the resin material melt and drip into the water tank; the push plate is used to push the separated material to the metal parts recovery box.

[0025] The present invention provides a semiconductor lead frame rib cutting device. Compared with the prior art, it has the following beneficial effects:

[0026] 1. The cutting component can cut the input semiconductor frame into lengths, and then punch out each semiconductor body to separate the semiconductor body from the lead frame;

[0027] 2. The setting of the press component can achieve the following effects: it can press down the conductor of the semiconductor body so that the conductor is pressed into a bent pin, thus completing the molding of the semiconductor body; the flip frame can be rotated in the hanging frame so that the bending pressure plate and the detection component can switch between working; the detection component can translate and detect each pin of the semiconductor body, thereby detecting the flatness and distribution gap of the pin, and judging whether the shape of the semiconductor is regular. At the same time, the detection action is completed before the waste material is discharged, so that the unqualified semiconductor body can be connected to the lead frame so that they can be discharged together, thus realizing the automatic stripping of the pins with unqualified shapes;

[0028] 3. The first positioning component can constrain and guide the lead frame outside the semiconductor frame to ensure the stability of the cutting ribs. At the same time, it can be flipped to one side to drive the cut lead frame to rotate outward to achieve fast and automatic unloading;

[0029] 4. The second positioning component can constrain and guide the semiconductor body to ensure the stability of the cutting ribs, so that the semiconductor body can be accurately separated from the lead frame and the reinforcing ribs. At the same time, the second positioning component can rotate to one side of the unloading conveyor belt, so that the semiconductor body is automatically transferred to the unloading conveyor belt;

[0030] 5. Set up a recycling component to recycle the cut lead frame. At the same time, there is resin gate material remaining on the reinforcing ribs of the lead frame, and there is resin on the unqualified semiconductor, which is not convenient for metal recycling and reuse. The recycling component can heat the resin to melt and separate the resin from the metal parts, which is convenient for the subsequent recycling and classification of the resin and metal parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 The schematic diagram of the structure of the semiconductor lead frame cutting device of the present invention is shown;

[0033] Figure 2 A schematic diagram of the structure of the tendon cutting assembly of the present invention is shown;

[0034] Figure 3 A schematic diagram of the structure of one side of the profiled assembly of the present invention is shown;

[0035] Figure 4 A schematic diagram of the structure of the other side of the profiled assembly of the present invention is shown;

[0036] Figure 5 A schematic diagram of the semiconductor frame structure of the present invention is shown;

[0037] Figure 6 A schematic diagram of the semiconductor body structure of the present invention is shown;

[0038] Figure 7 A schematic diagram of the structure of the semiconductor frame in a cut state of the present invention is shown;

[0039] Figure 8 A schematic diagram of the connection structure between the first positioning assembly and the second positioning assembly of the present invention is shown;

[0040] Fig. 9 A schematic diagram of the distribution structure of the middle support assembly of the present invention in the main material trough is shown;

[0041] Fig.10 A schematic diagram of the structure of the middle support assembly of the present invention is shown;

[0042] Fig.11 A schematic diagram of the structure of the inner heating rod of the present invention is shown;

[0043] Fig.12 A schematic diagram of the side guide structure of the present invention is shown;

[0044] Fig.13 A schematic diagram of the structure of the recycling assembly of the present invention is shown;

[0045] As shown in the figure: 1. Support assembly, 11. Support table, 12. First drive rod, 13. Top plate, 14. Flip plate, 2. Rib cutting assembly, 21. Second drive rod, 22. Fixed plate, 23. Rectangular cutting frame, 24. External cutting knife, 3. Pressing assembly, 31. Third drive rod, 32. Hanging frame, 33. Flip frame, 34. Bending pressure plate, 35. Slide plate, 36. Detection probe, 4. First positioning assembly, 41. First support seat, 42. First flip axis, 43. First movable rod, 44. Internal fixed block, 441. First storage slot, 45. Side connecting strip, 46. External fixed block, 461. External storage seat, 4611. Second storage slot, 47. External hook plate, 48. Movable side stop assembly, 481. Side guide plate, 482. Guide film, 483. Winding wheel, 5. Second positioning assembly, 51. Support plate , 52, second support seat, 521, second turning axis, 53, second movable rod, 54, main support seat, 541, main material trough, 542, side groove, 543, third storage trough, 544, negative pressure hole, 6, recovery component, 61, upper box, 62, push plate, 63, heating plate, 64, mesh plate, 641, unloading port, 65, water tank, 66, metal parts recovery box, 7, unloading conveyor belt, 7 1. Conveying mold, 8. Middle supporting assembly, 81. Top block, 811. Side guide bar, 82. Side guide rail, 821. Driving wheel, 83. Outer rod, 84. Vertical rod, 84. Matching rod, 841. Internal heating rod, 9. Semiconductor frame, 91. Lead frame, 911. Reinforcement bar, 92. Main rib, 93. Semiconductor body, 931. Pin, 94. Resin gate material, 9a. Loading conveyor belt. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] In order to solve the technical problems in the background technology, a semiconductor lead frame cutting device is provided as follows:

[0048] Combination Figure 1-Figure 13 As shown, a semiconductor lead frame cutting device provided by the present invention includes a support assembly 1, which includes a support platform 11, a first driving rod 12, a top plate 13 and a flip plate 14. The first driving rod 12 is vertically installed on one side of the surface of the support platform 11, and the top plate 13 is vertically provided on the top of the first driving rod 12. The top plate 13 is placed parallel to the top of the support platform 11, and the bottom surface of the top plate 13 is rotatably installed with the flip plate 14;

[0049] A feeding conveyor belt 9a is placed outside the support platform 11, and is used to convey the semiconductor frame 9 to the processing position of the support platform 11; the semiconductor frame 9 includes a lead frame 91, and a plurality of reinforcing bars 911 are equidistantly arranged inside the lead frame 91, and a semiconductor body 93 is arranged between adjacent reinforcing bars 911, and both sides of the semiconductor body 93 are connected to the lead frame 91 through straight main ribs 92, and the top and bottom surfaces of the reinforcing bars 911 are both attached with resin gate materials 94, and the resin gate materials 94 are connected to the semiconductor body 93 as a whole;

[0050] A rib cutting assembly 2, which is mounted on one end of the bottom surface of the flip plate 14, and is used to perform rib cutting on the semiconductor frame 9 to obtain a semiconductor body 93;

[0051] The profiling assembly 3 is installed at the other end of the bottom surface of the flip plate 14. The profiling assembly 3 includes a third driving rod 31, a hanging frame 32, a flip frame 33, a bending pressure plate 34 and a detection component. The third driving rod 31 is vertically arranged on the bottom surface of the flip plate 14. The bottom end of the third driving rod 31 is connected to the hanging frame 32. The flip frame 33 is rotatably installed inside the hanging frame 32. The flip frame 33 is a rectangular parallelepiped structure. The bottom surface of the flip frame 33 is installed with a bending pressure plate 34 and the side surface is installed with a detection component. The bending pressure plate 34 is used to press out the pins 931 on both sides of the semiconductor body 93. The detection component is used to detect the flatness and gap of the pins 931.

[0052] A material unloading conveyor belt 7 is placed on the side of the support platform 11, and a conveying mold 71 for placing the semiconductor body 93 is provided on the surface of the material unloading conveyor belt 7;

[0053] A recovery component 6, which is installed on the inner side of the surface of the support platform 11, and the recovery component 6 is used to separate and recover the resin and the metal parts;

[0054] A first positioning assembly 4, which is installed on the inner side of the processing position of the support table 11, and the first positioning assembly 4 is placed on the outer side of the recovery assembly 6;

[0055] The second positioning component 5 is installed on the outside of the supporting processing position; when the rib cutting device is cutting the ribs, the first positioning component 4 is placed above the second positioning component 5 to jointly constrain the semiconductor frame 9; when the rib cutting device is unloading, the first positioning component 4 flips the cut lead frame 91 and the unqualified semiconductor body 93 and pours them into the recovery component 6, and the second positioning component 5 flips the semiconductor body 93 into the unloading conveyor belt 7.

[0056] In the above scheme:

[0057] 1. The cutting component can cut the input semiconductor frame into lengths, and then punch out each semiconductor body to separate the semiconductor body from the lead frame;

[0058] 2. The profiled component setting can achieve the following effects:

[0059] 2.1. It can press down the conductor of the semiconductor body so that the conductor is pressed into a bent pin, thus completing the molding of the semiconductor body;

[0060] 2.2. The flip frame can be rotated in the hanging frame so that the bending plate and the detection component can switch to work;

[0061] 2.3. The detection component can move horizontally to detect each pin of the semiconductor body, so as to detect the flatness and distribution gap of the pins and judge whether the shape of the semiconductor is regular. At the same time, the detection action is completed before the waste is discharged, so that the unqualified semiconductor body can be connected with the lead frame so that they can be discharged together, and the pins with unqualified shapes can be automatically stripped;

[0062] 3. The first positioning component can constrain and guide the lead frame outside the semiconductor frame to ensure the stability of the cutting ribs. At the same time, it can be flipped to one side to drive the cut lead frame to rotate outward to achieve fast and automatic unloading;

[0063] 4. The second positioning component can constrain and guide the semiconductor body to ensure the stability of the cutting ribs, so that the semiconductor body can be accurately separated from the lead frame and the reinforcing ribs. At the same time, the second positioning component can rotate to one side of the unloading conveyor belt, so that the semiconductor body is automatically transferred to the unloading conveyor belt;

[0064] 5. Set up a recycling component to recycle the cut lead frame. At the same time, there is resin gate material remaining on the reinforcing ribs of the lead frame, and there is resin on the unqualified semiconductor, which is not convenient for metal recycling and reuse. The recycling component can heat the resin to melt, so that the resin and metal parts are separated, which is convenient for the subsequent recycling and classification of the resin and metal parts;

[0065] 6. The first driving rod can drive the top plate to move up and down, thereby changing the positions of the rib cutting assembly and the press forming assembly. The flip plate can rotate horizontally at the bottom of the top plate to complete the switching of the rib cutting assembly and the press forming assembly.

[0066] In this embodiment, the rib cutting assembly 2 includes a second driving rod 21, which is vertically arranged on the bottom surface of the flip plate 14, and a fixing plate 22 is vertically arranged on the bottom end of the second driving rod 21. An external cutting knife 24 is vertically arranged on the bottom surface of the fixing plate 22 close to one end of the loading conveyor belt 9a, and a plurality of rectangular cutting frames 23 are arranged on the bottom surface of the fixing plate 22; the external cutting knife 24 is used to cut the semiconductor frame 9, and the rectangular cutting frame 23 is used to cut off the main rib 92 and the resin gate material 94, so as to separate the semiconductor body 93 from the lead frame 91.

[0067] In the above scheme: when the semiconductor frame is input with a suitable length, the second driving rod drives the fixing plate to descend, the outer cutting knife cuts off the semiconductor frame, and the rectangular cutting frame cuts off each main rib; the first positioning assembly and the second positioning assembly can support the semiconductor frame from the bottom to ensure cutting accuracy.

[0068] In this embodiment, the detection component includes a slide plate 35 and a detection probe 36. The slide plate 35 is slidably installed on the side wall of the flip frame 33. The outer wall of the slide plate 35 is provided with multiple pairs of detection probes 36. The detection probes 36 are used to elastically detect the pins 931 located on one side; the detection probes 36 determine the flatness of the pins 931 according to the amount of expansion and contraction when they contact the pins 931, and the detection probes 36 determine the distribution gap of the pins 931 according to the interval time when they contact adjacent pins 931.

[0069] In the above scheme: when performing pin detection, the third drive rod hanging frame descends, so that each detection probe is extended into the main material trough, and two groups of detection probes are extended into both sides of each semiconductor body. Then the slide moves along the side of the flip frame to drive the detection probe to move. The detection probe contacts the pins on both sides one by one, and the flatness of the pin is determined according to the extension and contraction amount of the detection probe, and the distribution gap of the pin can be determined according to the adjacent action time; the detection probe can also add a power-on detection function to detect the electrical properties of the semiconductor.

[0070] In this embodiment, the first positioning assembly 4 includes a first support seat 41, which is arranged on the surface of the support platform 11, and the top of the first support seat 41 is rotatably connected to the first flip axis 42, and the side of the first flip axis 42 is vertically provided with a first movable rod 43, and the outer end of the first movable rod 43 is provided with an inner fixing block, and the two ends of the inner fixing block 44 are connected to the outer fixing block 46 through the side connecting strip 45, and a rectangular groove is left between the inner fixing block 44 and the outer fixing block 46, and an outer storage seat 461 is provided on the outer side of the outer fixing block 46, and a second storage groove 4611 is opened on the inner wall of the outer storage seat 461, and an outer hook plate 47 is rotatably installed inside the second storage groove 4611; when unloading, the outer hook plate 47 rotates outward to hook the lead frame 91 to prevent the lead frame 91 from detaching prematurely.

[0071] In the above scheme:

[0072] 1. The first movable rod can adjust the position of the internal fixing block, thereby changing the position of the rectangular groove;

[0073] 2. The external storage seat can constrain the lead frame from the outside, allowing the semiconductor frame to enter accurately;

[0074] 3. When not in use, the outer hook plate can be rotated inwardly and stored in the second storage slot. When unloading, the outer hook plate rotates downward to hook the lead frame to prevent the lead frame from sliding off prematurely.

[0075] In this embodiment, a movable side baffle assembly 48 is installed on the surface of the inner fixed block 44, and the movable side baffle assembly 48 includes a side guide plate 481, a guide film 482 and a winding wheel 483. A first storage groove 441 is opened on the surface of the inner fixed block 44, and a baffle is rotatably installed inside the first storage groove 441 and a torsion spring is installed at the rotation connection. A winding wheel 483 is installed inside the first flip shaft 42, and the outer wall of the winding wheel 483 is wrapped with a guide film 482, and the outer end of the guide film 482 is connected to the top of the side guide plate 481; when cutting the ribs, the side guide plate 481 and the outer storage seat 461 constrain the input semiconductor frame 9 from both sides; when unloading, the winding wheel 483 rolls up the guide film 482, so that the side guide plate 481 is stored in the first storage groove 441, and the lead frame 91 can slide out along the guide film 482.

[0076] In the above scheme:

[0077] 1. When feeding and cutting, the side guide plates are in a vertical state, and the side guide plates constrain and guide the other side of the lead frame;

[0078] 2. When unloading, the winding wheel pulls the winding guide film, so that the side guide plate rotates and is stored in the first storage groove and compresses the torsion spring. In this way, the entire internal fixing block is flat and the lead frame can be discharged smoothly without obstruction. At the same time, the guide film can be used as a discharge guide structure for the lead frame, so that the lead frame can be discharged smoothly.

[0079] In this embodiment, the second positioning assembly 5 includes a main support seat 54, the top of the main support seat 54 is flushly embedded in the rectangular groove, the bottom of the support plate 51 extends downward out of the rectangular groove, and the outer wall of the support plate 51 is vertically provided with a second movable rod 53, the outer side of the second movable rod 53 is connected to the second flip shaft 521, and the second flip shaft 521 is arranged in the second support seat 52, and the second support seat 52 is connected to the main support seat 54 through the support plate 51; the main material groove 54 is opened in the middle of the surface of the main support seat 54 1. The main material trough 541 is aligned with the feeding conveyor belt 9a, and the semiconductor body 93 is embedded in the main material trough 541. Side grooves 542 are symmetrically opened on both sides of the surface of the main bracket 54, and multiple groups of negative pressure holes 544 are opened on the surface of the main bracket 54; the joint between the main bracket 54 and the inner fixing block 44 and the outer fixing block 46 is the cutting point of the main rib 92, and the side groove 542 is the area where the bending pressure plate 34 presses the pin 931; the negative pressure hole 544 is used to attract and position the semiconductor body 93.

[0080] In the above scheme:

[0081] 1. The manufactured semiconductor body is directly fed into the main material trough, and each main rib is moved to the corresponding side groove;

[0082] 2. During unloading, after the first positioning component is turned outward, the second flip axis drives the main support to flip outward, and the negative pressure hole absorbs and positions the semiconductor body. When the semiconductor body is upside down in the conveying mold of the unloading conveyor belt, the negative pressure hole disconnects the negative pressure.

[0083] In this embodiment, a third storage slot 543 is spaced apart inside the main support seat 54, and a middle support assembly 1 is installed inside the third storage slot 543. The middle support assembly 1 includes a top block 81 and a side guide rail 82. The side wall of the top block 81 is provided with a side guide bar 811, and the side guide bar 811 is slidably installed in the side guide rail 82. The side guide rail 82 is vertically arranged in the third storage slot 543, and a driving wheel 821 for driving the top block 81 to rise and fall is installed at the top end of the inner part of the side guide rail 82; when the semiconductor frame 9 is input, the top block 81 is received in the third storage slot 543, so that the main material slot 541 is in a flat state; when cutting the ribs, the top block 81 extends outward to support and lift the reinforcing bar 911.

[0084] In the above scheme:

[0085] 1. The setting of the top block can support the semiconductor body from the top when cutting the rib, so that the rib cutting is more accurate;

[0086] 2. During loading, in order to ensure continuous entry of the semiconductor body, each driving wheel drives the top block to descend and be stored in the third storage tank.

[0087] In this embodiment, outrigger rods 83 are vertically provided on both sides of the top block 81, and vertical rods 84 are vertically provided on the top surface of the outer ends of the outrigger rods 83. A matching rod 84 is provided on the top of the vertical rod 84. The length of the matching rod 84 is the same as that of the top block 81. The matching rod 84 is relatively arranged on the bottom surface of the connection between the semiconductor body 93 and the resin pouring material 94; the matching rod 84 is used to support the rectangular cutting frame 23 from the bottom when the rectangular cutting frame 23 cuts off the resin pouring material 94.

[0088] In the above scheme: the matching rod can support the cutting operation of the resin gate material, so that the cut surface here is smoother.

[0089] In this embodiment, an internal heating rod 841 is installed inside the matching rod 84; when the detection probe 36 detects that a certain semiconductor body 93 is unqualified, the internal heating rods 841 on both sides of the unqualified semiconductor body 93 work to make the unqualified semiconductor body 93 hot-melt connected with the resin pouring material 94, and when the first positioning component 4 turns the lead frame 91 outward, the unqualified semiconductor body 93 follows the outward turning.

[0090] In the above scheme: when the inner heating rod is heated, the matching rod is also heated. In this way, the matching rod can heat-melt the resin gate material and the semiconductor body that were cut off before. In this way, when the lead frame is flipped outward, the reinforcing ribs of the lead frame can drive the unqualified semiconductor body to follow the outward rotation, thereby realizing automatic separation and unloading.

[0091] In this embodiment, the recycling component 6 includes an upper box body 61, which is arranged on the surface of the support platform 11. A mesh plate 64 is installed inside the upper box body 61, and a discharge port 641 is opened at one end of the mesh plate 64. A metal part recovery box 66 is provided at a position relative to the bottom surface of the upper box body 61 and the discharge port 641. A heating plate 63 is provided on the inner wall of the upper box body 61. The position relative to the mesh plate 64 and the heating plate 63 is a separation area. A water tank 65 is installed at a position relative to the bottom surface of the upper box body 61 and the separation area; a push plate 62 is installed at the other end of the upper box body 61, and the push plate 62 is slidably placed in the upper box body 61; the heating plate 63 is used to heat the material in the separation area, so that the resin material melts and drips into the water tank 65; the push plate 62 is used to push the separated material to the metal part recovery box 66.

[0092] In the above scheme: the setting of the recycling component can utilize the characteristic that the melting point of the resin is lower than that of the metal parts, so that the resin melts and separates, and the metal parts and resin materials are classified and recycled, which is convenient for subsequent classification and reuse.

[0093] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0094] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor lead frame cutting device, characterized in that: include: The support assembly includes a support platform, a first driving rod, a top plate and a flip plate. The first driving rod is vertically installed on one side of the surface of the support platform, the top of the first driving rod is vertically provided with a top plate, the top plate is placed parallel to the top of the support platform, and the bottom of the top plate is rotatably installed with a flip plate; A feeding conveyor belt is placed outside the support platform, and is used to convey the semiconductor frame to the processing position of the support platform; the semiconductor frame includes a lead frame, and a plurality of reinforcing bars are equidistantly arranged inside the lead frame, and a semiconductor body is arranged between adjacent reinforcing bars, and both sides of the semiconductor body are connected to the lead frame through straight main ribs, and the top and bottom surfaces of the reinforcing bars are both attached with resin gate materials, and the resin gate materials are connected to the semiconductor body as a whole; A rib cutting assembly is installed at one end of the bottom surface of the flip plate, and is used to perform rib cutting on the semiconductor frame to obtain a semiconductor body; The profiling component is installed at the other end of the bottom surface of the flip plate. The profiling component includes a third driving rod, a hanging frame, a flip frame, a bending pressure plate and a detection component. The third driving rod is vertically arranged on the bottom surface of the flip plate. The bottom end of the third driving rod is connected to the hanging frame. The flip frame is rotatably installed inside the hanging frame. The flip frame is a rectangular parallelepiped structure. The bottom surface of the flip frame is installed with a bending pressure plate and the side surface is installed with a detection component. The bending pressure plate is used to press out pins on both sides of the semiconductor body. The detection component is used to detect the flatness and gap of the pins. A material unloading conveyor belt is placed on the side of the support platform, and a conveying mold for placing the semiconductor body is provided on the surface of the material unloading conveyor belt; A recovery component is installed on the inner side of the surface of the support table, and the recovery component is used to separate and recover the resin and the metal parts; A first positioning assembly is installed on the inner side of the processing position of the support table, and the first positioning assembly is placed on the outer side of the recovery assembly; The second positioning component is installed on the outside of the support processing position; when the rib cutting device is cutting the ribs, the first positioning component is placed above the second positioning component to jointly constrain the semiconductor frame; when the rib cutting device is unloading, the first positioning component flips the cut lead frame and unqualified semiconductor body into the recycling component, and the second positioning component flips the semiconductor body into the unloading conveyor belt; The first positioning assembly comprises a first support seat, the first support seat is arranged on the surface of the support platform, the top of the first support seat is rotatably connected to the first flip axis, the side of the first flip axis is vertically provided with a first movable rod, the outer end of the first movable rod is provided with an inner fixing block, the two ends of the inner fixing block are connected to the outer fixing block through side connecting strips, a rectangular groove is left between the inner fixing block and the outer fixing block, an outer storage seat is arranged on the outer side of the outer fixing block, a second storage groove is opened on the inner wall of the outer storage seat, and an outer hook plate is rotatably installed inside the second storage groove; when cutting, the outer hook plate rotates outward to hook the lead frame to prevent the lead frame from falling off prematurely; The second positioning component includes a main bracket, the top of the main bracket is flushly embedded in the rectangular groove, the bottom of the bracket extends downwardly outward from the rectangular groove, the outer side wall of the bracket is vertically provided with a second movable rod, the outer side of the second movable rod is connected to the second flip axis, the second flip axis is arranged in the second support seat, and the second support seat is connected to the main bracket through the bracket; a main material trough is opened in the middle of the surface of the main bracket, the main material trough is aligned with the feeding conveyor belt, the semiconductor body is embedded in the main material trough, side grooves are symmetrically opened on both sides of the surface of the main bracket, and multiple groups of negative pressure holes are opened on the surface of the main bracket; the joint between the main bracket and the inner fixing block and the outer fixing block is the cutting point of the main rib, and the side groove is the area where the bending pressure plate presses the pins; the negative pressure holes are used to attract and position the semiconductor body.

2. A semiconductor lead frame cutting device according to claim 1, characterized in that: The rib cutting assembly includes a second driving rod, which is vertically arranged on the bottom surface of the flip plate, and a fixed plate is vertically arranged on the bottom end of the second driving rod. An external cutting knife is vertically arranged on the bottom surface of the fixed plate close to one end of the feeding conveyor belt, and a plurality of rectangular cutting frames are arranged on the bottom surface of the fixed plate; the external cutting knife is used to cut the semiconductor frame, and the rectangular cutting frame is used to cut off the main ribs and the resin gate material to separate the semiconductor body from the lead frame.

3. A semiconductor lead frame cutting device according to claim 2, characterized in that: The detection component includes a slide plate and a detection probe. The slide plate is slidably mounted on the side wall of the flip frame. The outer wall of the slide plate is provided with multiple pairs of detection probes. The detection probes are used to elastically detect the pins located on one side. The detection probe determines the flatness of the pin according to the amount of expansion and contraction when it contacts the pin, and the detection probe determines the pin distribution gap according to the interval time when it contacts adjacent pins.

4. A semiconductor lead frame cutting device according to claim 1, characterized in that: A third storage slot is spaced apart inside the main bracket, a middle support assembly is installed inside the third storage slot, the middle support assembly includes a top block and a side guide rail, the side wall of the top block is provided with a side guide bar, the side guide bar is slidably installed in the side guide rail, the side guide rail is vertically arranged in the third storage slot, and a driving wheel for driving the top block to rise and fall is installed on the top end of the inner side guide rail; when the semiconductor frame is input, the top block is received in the third storage slot to make the main material slot in a flat state; when cutting the ribs, the top block extends outward to support and lift the reinforcing strip.

5. A semiconductor lead frame cutting device according to claim 4, characterized in that: Outriggers are vertically provided on both sides of the top block, vertical rods are vertically provided on the top surfaces of the outer ends of the outriggers, matching rods are provided on the top ends of the vertical rods, and the length of the matching rods is the same as that of the top block. The matching rods are relatively arranged on the bottom surface of the connection between the semiconductor body and the resin pouring material; the matching rods are used to support the rectangular cutting frame from the bottom when the rectangular cutting frame cuts off the resin pouring material.

6. A semiconductor lead frame cutting device according to claim 5, characterized in that: An internal heating rod is installed inside the matching rod; when the detection probe detects that a certain semiconductor body is unqualified, the internal heating rods on both sides of the unqualified semiconductor body work to make the unqualified semiconductor body hot-melt connected with the resin gate material, and when the first positioning component turns the lead frame outward, the unqualified semiconductor body follows the outward turning.

7. A semiconductor lead frame cutting device according to claim 6, characterized in that: The recycling component includes an upper box body, which is arranged on the surface of the support platform, a mesh plate is installed inside the upper box body, a discharge port is opened at one end of the mesh plate, a metal parts recovery box is arranged at a position opposite to the discharge port on the bottom surface of the upper box body, a heating plate is arranged on the inner wall of the upper box body, a separation zone is arranged at a position opposite to the mesh plate and the heating plate, a water tank is arranged at a position opposite to the separation zone on the bottom surface of the upper box body; a push plate is installed at the other end of the interior of the upper box body, and the push plate is slidably placed in the upper box body; the heating plate is used to heat the material in the separation zone to make the resin material melt and drip into the water tank; the push plate is used to push the separated material to the metal parts recovery box.

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