A etching tool and etching method capable of placing a chip upright or inverted

Abstract

The invention discloses an etching tool and an etching method for chips that can be placed upright and inverted, and relates to the field of chip technology. In order to solve the problem that the existing chip etching tool cannot switch the upright and inverted states of the chip when in use, the etching tool comprises a first carrier, a mounting groove for placing the chip is provided in the middle of the first carrier, a second carrier is detachably connected to the first carrier through a mortise and tenon structure, the second carrier is provided with a slot hole corresponding to the mounting groove, the size of the slot hole is smaller than the size of the chip, a plurality of through holes are provided on the first carrier and the second carrier, a hand-held rod is detachably provided on the first carrier and the second carrier, and the hand-held rod is movably connected to the first carrier and the second carrier, and a clamping groove clamped with the end of the hand-held rod is provided on the first carrier and the second carrier.

Description

Technical Field

[0001] The present invention relates to the field of chip technology, and more specifically, to an etching tool and an etching method for chips that can be placed upright or inverted. Background Art

[0002] Mercury cadmium telluride materials are soft and brittle, and are easily damaged or even broken during the preparation of large-size chips, reducing the yield rate. The material needs to go through multiple processes such as photolithography, coating, cleaning, and hole opening to make the required chips. Among them, cleaning and hole opening are very critical process steps, both of which involve corrosion treatment of the material film layer.

[0003] Mercury cadmium telluride is a relatively sensitive optoelectronic material with a very low damage threshold. During dry etching, it is easy to cause plasma-induced damage on the surface of the mercury cadmium telluride etching area. The wet etching process has a natural advantage in the preparation of contact holes without damage. Compared with the dry etching process, it has the characteristics of simple process and low cost. It is an indispensable step in the preparation of mercury cadmium telluride chips. The wet process of chips is generally divided into chip surface treatment and contact hole opening. The corrosion process and surface wetting before corrosion are very important for the corrosion process. If the chip surface wetting effect is not good or the etching solution is not thoroughly rinsed after corrosion, it will have an adverse effect on the surface of the chip.

[0004] Mercury cadmium telluride chips are square pieces. In the wet etching process, tweezers are usually not used for direct clamping. Direct clamping leads to a high risk of chip falling off. Conventional upright wet etching technology usually uses an etching basket tool with a hand-held rod. The operator places the chip in a basket made of polytetrafluoroethylene material, with the surface to be processed facing up and away from the surface to be processed. The basket is placed in the etching liquid with the hand-held rod. After entering the etching liquid, the exchange of the surface etching liquid is improved by rotation, up and down oscillation, ultrasound, etc., to promote the reaction between the surface and the etching liquid; after the etching is completed, it is rinsed with pure water and organic solvents multiple times, and the impact force of the liquid flow is used to remove the etching liquid and foreign matter on the surface of the chip, so as to achieve the purpose of completely removing the etching liquid. The existing inverted etching tool needs to embed the chip in it for inverted etching of the chip. However, whether it is a forward etching tool or an inverted etching tool, only one form can be maintained to process the chip surface during the wet process.

[0005] Therefore, how to solve the problem that the existing chip etching tooling cannot switch the chip upright and inverted states when in use is a problem that currently needs to be solved urgently by those skilled in the art. Summary of the invention

[0006] In view of this, the purpose of the present invention is to provide an etching tool that can upright and invert chips, realize the change of chip shape during the etching process, so that this tool can meet the requirements of forward etching chip tooling and also meet the requirements of inverted etching chip tooling, realizing two etching methods.

[0007] Another object of the present invention is to provide a chip etching method including the above-mentioned etching tooling that can place the chip upright and inverted, thereby ensuring sufficient wetting and flushing of the chip surface.

[0008] In order to achieve the above object, the present invention provides the following technical solutions:

[0009] An etching tool capable of placing a chip upright or inverted, comprising:

[0010] A first carrier, wherein a mounting groove for placing a chip is provided in the middle of the first carrier;

[0011] A second carrier is detachably connected to the first carrier through a mortise and tenon structure, the second carrier is provided with a slot hole corresponding to the mounting slot, the size of the slot hole is smaller than the size of the chip, and a plurality of through holes are provided on the first carrier and the second carrier;

[0012] The hand-held rod is detachably arranged on the first carrier and the second carrier, and the hand-held rod is movably connected to the first carrier and the second carrier. The first carrier and the second carrier are both provided with a clamping groove clamped with the end of the hand-held rod.

[0013] Preferably, the hand-held rod comprises a main body and detachable clamping bodies arranged at two ends of the main body, the main body and the clamping body are threadedly connected, and the clamping body is clamped with the clamping groove.

[0014] Preferably, the main body is a cylinder, the clamping body is a stepped shaft, both ends of the main body are provided with external threads, the clamping body is provided with internal thread grooves matching with the external threads, or both ends of the main body are provided with internal thread grooves, the clamping body is provided with external threads matching with the internal thread grooves.

[0015] Preferably, the main body is a cylinder, the clamping body is a ring with a diameter larger than the main body, both ends of the main body are provided with external threads, and the clamping body is provided with internal threaded holes matching with the external threads.

[0016] Preferably, the mortise and tenon structure includes a mortise groove provided on the first carrier and the second carrier, and also includes a tenon engaged with the mortise groove.

[0017] Preferably, the mounting groove is a rectangular groove, and the four corners of the mounting groove are each provided with a circular groove connected to the mounting groove.

[0018] Preferably, it also includes an ultrasonic tank for cleaning the chip, and a beaker for placing the corrosion tool is provided in the ultrasonic tank.

[0019] Preferably, the chip is a mercury cadmium telluride chip.

[0020] A chip etching method is applied to the above-mentioned etching tool for upright and inverted chips, and the etching method comprises:

[0021] Rinse the chips in the corrosion tooling with pure water;

[0022] Place the rinsed chip upright or upside down in an ultrasonic bath to immerse it;

[0023] Rinse the soaked chip twice with pure water;

[0024] The chip after secondary washing is etched upside down;

[0025] The inverted etched chip is rinsed upside down in an ultrasonic tank;

[0026] Place the inverted rinsed chip upright and rinse with pure water;

[0027] The rinsed chip was blown dry with nitrogen and taken out.

[0028] Preferably, before the chips in the etching tool are rinsed with pure water, the etching tool is assembled, and the assembling of the etching tool includes:

[0029] Placing the chip in the mounting groove of the first carrier of the etching tool;

[0030] Overlap the second carrier of the corrosion tool with the first carrier, and insert the tenon into the tenon groove to connect the first carrier and the second carrier;

[0031] The clamping body at one end of the main body of the hand-held rod is removed, the main body is inserted into the first carrier and the second carrier, and then the clamping body is installed on the main body.

[0032] The etching tool for upright and inverted chips provided by the present invention comprises a first carrier, a second carrier and a hand-held rod. Specifically, a mounting groove for placing the chip is provided in the middle of the first carrier. When the tool is used to corrode the chip, the chip is first placed in the mounting groove of the first carrier. The second carrier is detachably connected to the first carrier through a mortise and tenon structure. The second carrier is provided with a slot hole corresponding to the mounting groove. After the chip is placed in the mounting groove, the second carrier is connected to the first carrier through the mortise and tenon structure. The size of the slot hole of the second carrier is smaller than the size of the chip, so as to realize the clamping and fixing of the chip and prevent the chip from falling from the tool during the etching process. Multiple through holes are provided on the first carrier and the second carrier, so that during the chip etching process, the etching liquid can easily reach the chip surface and quickly exchange the etching liquid, and the solution is guided to facilitate the etching and cleaning of the chip.

[0033] The hand-held rod is detachably arranged on the first carrier and the second carrier, and the hand-held rod is movably connected to the first carrier and the second carrier. The first carrier and the second carrier are both provided with a clamping groove clamped with the end of the hand-held rod. The first carrier and the second carrier connected by the mortise and tenon structure can slide on the hand-held rod, and the two ends of the hand-held rod will be clamped with the corresponding clamping grooves on the first carrier and the second carrier to prevent the first carrier and the second carrier from slipping off the hand-held rod after connection. Through the clamping of the two ends of the hand-held rod, the surface to be processed of the chip can be facing up, and the surface to be processed of the chip can also be facing down, so as to realize inverted corrosion of the chip and upright corrosion and flushing of the chip.

[0034] The etching tooling for upright and inverted chips set up in the above manner realizes the connection between the first carrier and the second carrier through the mortise and tenon structure. Compared with the existing screw connection, it is simple to operate and there is no risk of loosening or falling during use. Through the cooperation of the first carrier, the second carrier and the hand-held rod, the chip can be freely switched between the upright and inverted states during the etching process to realize the forward corrosion and inverted corrosion of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0036] Figure 1 A schematic diagram of the structure of the etching tooling capable of placing a chip upright and inverted provided by the present invention;

[0037] Figure 2 This is a schematic diagram of the inverted structure of the etching tooling provided by the present invention that can place chips upright and inverted;

[0038] Figure 3 A top view of a first carrier provided by the present invention;

[0039] Figure 4 A cross-sectional view of a first carrier provided by the present invention;

[0040] Figure 5 A side view of a first carrier provided by the present invention;

[0041] Figure 6 A top view of a second carrier provided by the present invention;

[0042] Figure 7 A cross-sectional view of a second carrier provided by the present invention;

[0043] Figure 8 A side view of a second carrier provided by the present invention;

[0044] Fig. 9 This is a schematic diagram of the structure of the handheld rod provided by the present invention;

[0045] Fig.10 A schematic diagram of the structure of the tenon provided by the present invention;

[0046] Fig.11 This is a step diagram of the chip etching method provided by the present invention.

[0047] Reference numerals:

[0048] 01-Chip;

[0049] 1-first carrier, 11-installation slot, 12-groove;

[0050] 2-second carrier, 21-slot;

[0051] 3-mortise and tenon structure, 31-mortise groove, 32-tenon;

[0052] 4-Through hole;

[0053] 5-hand-held rod, 51-body, 52-clip body;

[0054] 6-Card slot. DETAILED DESCRIPTION

[0055] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0056] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0057] It should be noted that the directional words such as "upper" and "lower" mentioned below are defined based on the drawings in the specification.

[0058] The core of the present invention is to provide an etching tool that can be used to place a chip upright and inverted, and to change the shape of the chip 01 during the etching process, so that the tool can meet the requirements of the tool for forward etching the chip 01, and can also meet the requirements of the tool for inverted etching the chip 01, and realize two etching methods. Another core of the present invention is to provide a chip etching method including the etching tool that can be used to place a chip upright and inverted, which ensures sufficient infiltration and flushing effects on the surface of the chip 01.

[0059] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 5 , Figure 6 and Figure 7 A etching tool for placing a chip upright or inverted includes a first carrier 1, a second carrier 2, a mortise and tenon structure 3, a through hole 4 and a hand-held rod 5.

[0060] Specifically, a mounting groove 11 for placing the chip 01 is provided in the middle of the first carrier 1. When the tooling is used to corrode the chip 01, the chip 01 is first placed in the mounting groove 11 of the first carrier 1. The second carrier 2 is detachably connected to the first carrier 1 through a mortise and tenon structure 3. The second carrier 2 is provided with a slot hole 21 corresponding to the mounting groove 11. After the chip 01 is placed in the mounting groove 11, the second carrier 2 is connected to the first carrier 1 through the mortise and tenon structure 3. The size of the slot hole 21 of the second carrier 2 is smaller than the size of the chip 01, so as to realize the clamping and fixing of the chip 01 and prevent the chip 01 from falling from the tooling during the corrosion process. A plurality of through holes 4 are provided on the first carrier 1 and the second carrier 2, so that during the corrosion process of the chip 01, the corrosive liquid can easily reach the surface of the chip 01 and quickly exchange the corrosive liquid, and guide the solution to facilitate the corrosion and cleaning of the chip 01.

[0061] The hand-held rod 5 is detachably arranged on the first carrier 1 and the second carrier 2, and the hand-held rod 5 is movably connected to the first carrier 1 and the second carrier 2. The first carrier 1 and the second carrier 2 are both provided with a clamping groove 6 that is clamped with the end of the hand-held rod 5. The first carrier 1 and the second carrier 2 connected by the mortise and tenon structure 3 can slide on the hand-held rod 5, and the two ends of the hand-held rod 5 will be clamped with the corresponding clamping grooves 6 on the first carrier 1 and the second carrier 2 to prevent the first carrier 1 and the second carrier 2 from slipping off the hand-held rod 5 after the connection. Through the clamping of the two ends of the hand-held rod 5, the surface to be processed of the chip 01 can be facing up, or the surface to be processed of the chip 01 can be facing down, so as to realize inverted corrosion of the chip 01 and upright corrosion and flushing of the chip 01.

[0062] Among them, the slot 21 is a square groove 12 that runs through the second carrier 2, which is used to fix the chip 01 so that the chip 01 does not fall during inverted etching. The size of the slot 21 is slightly smaller than the size of the chip 01. If the size of the chip 01 is 25×30mm, the size of the slot 21 is designed to be 24.5×29.5mm. In practical applications, the size of the slot 21 can be determined according to actual conditions, and there is no restriction on this, as long as the above-mentioned technical effect can be achieved. The through hole 4 is a smaller circular through hole 4, so that during the etching process, the etching liquid can easily reach the surface of the chip 01 and quickly exchange the etching liquid, and guide the solution to facilitate the etching and cleaning of the chip 01.

[0063] The etching tooling for chips that can be placed upright and inverted is arranged in the above manner, and the connection between the first carrier 1 and the second carrier 2 is achieved through the mortise and tenon structure 3. Compared with the existing screw connection, it is simple to operate and there is no risk of loosening or falling during use. Through the cooperation of the first carrier 1, the second carrier 2 and the hand-held rod 5, the chip 01 can be freely switched between the upright and inverted states during the etching process, so as to achieve forward etching and inverted etching of the chip 01.

[0064] Please refer to Fig. 9 The hand-held rod 5 includes a main body 51 and detachable clamping bodies 52 disposed at both ends of the main body 51 . The main body 51 is threadedly connected to the clamping body 52 , and the clamping body 52 is clamped to the clamping groove 6 .

[0065] It should be noted that when using the tool, first unscrew the clamping body 52 at one end of the body 51, pass the body 51 through the clamping groove 6, and then screw the unscrewed clamping body 52 onto the body 51 to achieve the installation of the hand-held rod 5. In this embodiment, the body 51 and the clamping body 52 are connected by threads, but in actual applications, there is no limitation on the connection method between the body 51 and the clamping body 52, as long as the above technical effects can be achieved.

[0066] The snap-in groove 6 includes two concentric circular holes, one of which is slightly smaller in size. The smaller circular hole runs through the entire carrier. The first carrier 1 and the second carrier 2 are designed with the same snap-in groove 6 structure, which can realize inverted etching of chip 01, as well as upright etching and flushing of chip 01.

[0067] In the above case, the main body 51 is a cylinder, the clamping body 52 is a stepped shaft, both ends of the main body 51 are provided with external threads, and the clamping body 52 is provided with internal thread grooves matching with the external threads, or, both ends of the main body 51 are provided with internal thread grooves, and the clamping body 52 is provided with external threads matching with the internal thread grooves.

[0068] It can be understood that in one setting of the hand-held rod 5, the main body 51 is set as a cylinder, and the clamping body 52 is set as a stepped shaft. By setting an internal thread groove on the main body 51 or the clamping body 52, the threaded connection between the main body 51 and the clamping body 52 is achieved.

[0069] Furthermore, the main body 51 is a cylinder, the clamping body 52 is a ring with a diameter larger than that of the main body 51 , both ends of the main body 51 are provided with external threads, and the clamping body 52 is provided with internal thread holes matching with the external threads.

[0070] It should be noted that in another setting of the hand-held rod 5, the main body 51 is set as a cylinder, the clamping body 52 is set as a ring with a diameter larger than the main body 51, the clamping body 52 is provided with an internal threaded hole, and the main body 51 and the clamping body 52 are connected by threads.

[0071] External threads are provided at both ends of the body 51, which can be used as a lifting rod for the flower basket after being combined with the internal threaded holes of the clamping body 52. ​​The traditional lifting rod for the flower basket is connected by threads. Once worn, the first carrier 1, the second carrier 2, and the hand-held rod 5 will be worn at the same time, which is impossible to maintain and has a high replacement cost. However, when the clamping body 52 of this setting is worn and cannot be used, it is only necessary to process the clamping body 52. ​​If the external thread on the body 51 is worn and cannot be used, it is only necessary to let the clamping body 52 use the unworn part of the body 51. If the external thread on one side of the body 51 is worn and seriously affects its use, only the other side can be used to convert it into a lifting rod for a single-function flower basket. The probability of replacement of the external thread due to wear is low, the maintenance cost is low, and the use cost is low.

[0072] This setting is simple to assemble and is not easy to wear. It can also change its shape during the corrosion process, so that this tooling can meet the requirements of both forward corrosion tooling and inverted tooling. It can also change its shape during use to achieve two corrosion methods.

[0073] Please refer to Figure 1-Figure 4 , Figure 6 , Figure 8 and Fig.10 The mortise and tenon structure 3 includes a mortise groove 31 provided on the first carrier 1 and the second carrier 2 , and also includes a tenon 32 engaged with the mortise groove 31 .

[0074] It can be understood that the connection between the first carrier 1 and the second carrier 2 is achieved through the cooperation between the tenon 32 and the tenon groove 31 on the two carriers. The tenon groove 31 is obtained by the trapezoidal column groove 12 penetrating the end faces of the first carrier 1 and the second carrier 2, and is symmetrically designed as shown in the figure. When used in combination with the tenon 32, the connection between the first carrier 1 and the second carrier 2 can be achieved. When the tenon grooves 31 of the first carrier 1 and the second carrier 2 are overlapped, the tenon 32 is inserted into the tenon groove 31 to obtain a combination that can be assembled and fixed without screws, which is simple to operate and not prone to wear.

[0075] This assembly method is simple, and the two carriers are not likely to slide during installation, thereby damaging the chip 01. In the conventional threaded structure, whether it is designed with three or more screws, when fixing one screw, the first carrier 1 or the second carrier 2 may be misaligned, thereby wearing the chip 01.

[0076] Please refer to Figure 3 The mounting groove 11 is a rectangular groove, and the four corners of the mounting groove 11 are each provided with a circular groove 12 connected to the mounting groove 11 .

[0077] It should be noted that the depth of the mounting groove 11 is close to the thickness of the chip 01, and the size is slightly larger than the chip 01 to be corroded. If the size of the chip 01 is 25×30 mm, the size of the mounting groove 11 is 25.2×30.2 mm. In practical applications, the size of the mounting groove 11 can be determined according to actual conditions, and there is no limitation on this, as long as the above-mentioned technical effect can be achieved. Four circular grooves 12 are designed at the four corners of the mounting groove 11 for placing and removing the chip 01.

[0078] In the above embodiment, an ultrasonic tank for cleaning the chip 01 is also included, and a beaker for placing the etching tool is provided in the ultrasonic tank.

[0079] It is understandable that when the chip 01 needs to be cleaned, the tooling with the chip 01 is placed into a beaker in an ultrasonic tank. The beaker contains pure water for cleaning the chip 01, and the chip 01 is ultrasonically cleaned by ultrasonic waves.

[0080] As a preferred implementation, the chip 01 is a mercury cadmium telluride chip 01 .

[0081] It should be noted that the chip 01 of the present application is a mercury cadmium telluride chip 01, and the tooling of the present application can be used for etching chips 01 made of other materials.

[0082] Please refer to Fig.11 A chip etching method is applied to the above-mentioned etching tool for upright and inverted chips, and the etching method includes:

[0083] Step S1, washing the chip 01 in the etching tool with pure water;

[0084] Step S2, placing the washed chip 01 upright or upside down in an ultrasonic bath for immersion;

[0085] Step S3, washing the soaked chip 01 with pure water for a second time;

[0086] Step S4, inverting and etching the chip 01 after the second rinse;

[0087] Step S5, washing the inverted etched chip 01 in an inverted ultrasonic bath;

[0088] Step S6, placing the inverted rinsed chip 01 upright and rinsing it with pure water;

[0089] Step S7, blow dry the rinsed chip 01 with nitrogen and take it out.

[0090] It is understandable that before the above etching method is performed on the chip 01, the contact hole is firstly photolithographically processed, and then the chip 01 is placed in the etching tool, and then the etching is started, which specifically includes: the first step is to wet the surface of the chip 01: firstly, Figure 1 The surface to be treated is rinsed with pure water for 5-10 minutes to wet the surface; the second step is to fully wet the chip 01: Figure 1 Form or Figure 2 The morphology is immersed in the ultrasonic tank for 5-10 minutes, during which the etching tool is oscillated up and down at regular intervals; with the help of the "cavitation" effect of ultrasound, the etching tool with chip 01 rinsed with pure water is immersed in a beaker with pure water in the ultrasonic tank, and tiny bubbles are formed in the contact holes and quickly burst to ensure that each contact hole can be fully infiltrated to prepare for subsequent corrosion. This step can be immersed in the ultrasonic tank upright or inverted with the help of the tool; the third step is to completely infiltrate chip 01: after the chip 01 is immersed in the ultrasonic tank, the tool with chip 01 is placed in the ultrasonic tank. Figure 1 The morphology is rinsed with pure water again for 5-10 minutes. Although the "cavitation" effect makes the contact hole fully infiltrated, it is inevitable that a certain amount of bubbles will be attached to the side walls of the contact holes, thereby preventing the contact between the etching liquid and the side walls of the contact holes during the etching process, resulting in inconsistent contact hole openings. Therefore, after ultrasonic infiltration of chip 01, it is necessary to add a step of pure water flow to infiltrate the surface of the contact holes to destroy the generation of bubbles in the holes; the fourth step is to corrode chip 01: After the infiltration of chip 01 is completed, Figure 2The fifth step is to rinse the chip 01 after etching: after the etching of chip 01, rinse it 5-10 times in a pure water beaker in an ultrasonic tank in form 2, which is more conducive to the extraction and rinsing of the etching liquid and ensure that there is no residue of the etching liquid in the contact hole; the sixth step is to put the chip 01 after the inverted rinsing upright and rinse it with pure water for 30s-2min; the seventh step is to blow dry the chip 01 after rinsing with nitrogen and take out the chip 01.

[0091] In the above embodiment, before the chip 01 in the etching tool is rinsed with pure water, the etching tool is assembled, and the assembling of the etching tool includes:

[0092] Place the chip 01 in the mounting groove 11 of the first carrier 1 of the etching tool;

[0093] Overlap the second carrier 2 of the etching tool with the first carrier 1, and insert the tenon 32 into the tenon groove 31 to connect the first carrier 1 and the second carrier 2;

[0094] The clamping body 52 at one end of the main body 51 of the hand-held rod 5 is removed, and after the main body 51 is inserted into the first carrier 1 and the second carrier 2 , the clamping body 52 is installed on the main body 51 .

[0095] It should be noted that the assembly method of the corrosion tooling of the present invention is: place the chip 01 in the installation groove 11 of the first carrier 1, then overlap the upper surface of the second carrier 2 with the upper surface of the first carrier 1, and insert the two tenons 32 into the tenon grooves 31 of the first carrier 1 and the second carrier 2 to make the first carrier 1 and the second carrier 2 become a combination, and then rotate and remove the clamping body 52 at one end of the hand-held rod 5, and insert the main body 51 of the clamping body 52 on the removed side from the clamping groove 6 of the first carrier 1 and the second carrier 2, and then rotate the removed clamping body 52 to complete the assembly of the tooling.

[0096] In summary, the present invention provides an etching tool for upright and inverted chips. When a chip 01 of extremely small size is used, the up and down shaking of the traditional etching tool and the buoyancy of the etching liquid may cause the liquid to float and cause it to fall or be lost during the etching process. The device can design tooling of different sizes according to the size of the chip 01, and fix the chip 01 by combining the first carrier 1 and the second carrier 2. Whether it is forward etching or inverted etching, the chip 01 will not turn over or fall due to the size or buoyancy of the water flow. Even if the operator causes the tooling to fall due to improper operation, because the chip 01 is fixed in the tooling, the tooling itself bears part of the impact force, and can also protect the chip 01 from being broken to a certain extent.

[0097] The device can realize forward corrosion or inverted corrosion by changing the device shape, and can also take both methods into consideration during use, and has various forms of use. The front and back sides of the tooling can be switched at any time, so that the front-up flushing and the front-down corrosion can be quickly combined, effectively eliminating the unevenness caused by ultrasonic bubbles to the corrosion through hole 4, and realizing rapid flushing and drying after corrosion, ensuring the cleanliness of the chip 01 surface and avoiding secondary micro-corrosion of the chip 01 during the residual corrosion liquid process, and the operation method is simple, and the operation process will not cause the loss of the chip 01.

[0098] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.

[0099] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0100] The above is a detailed introduction to the etching tool and etching method for upright and inverted chips provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. An etching tool that can place chips upright and inverted, characterized in that: include: A first carrier (1), wherein a mounting groove (11) for placing a chip (01) is provided in the middle of the first carrier (1); A second carrier (2) is detachably connected to the first carrier (1) via a mortise and tenon structure (3); the second carrier (2) is provided with a slot hole (21) corresponding to the mounting slot (11); the size of the slot hole (21) is smaller than the size of the chip (01); and a plurality of through holes (4) are provided on both the first carrier (1) and the second carrier (2); a hand-held rod (5) detachably provided on the first carrier (1) and the second carrier (2), and the hand-held rod (5) is movably connected to the first carrier (1) and the second carrier (2), and the first carrier (1) and the second carrier (2) are both provided with a clamping groove (6) for clamping with the end of the hand-held rod (5); The hand-held rod (5) comprises a main body (51) and detachable clamping bodies (52) provided at two ends of the main body (51); the main body (51) and the clamping bodies (52) are threadedly connected, and the clamping bodies (52) are clamped with the clamping grooves (6); The main body (51) is a cylindrical body, the clamping body (52) is a stepped shaft, both ends of the main body (51) are provided with external threads, the clamping body (52) is provided with internal thread grooves matching with the external threads, or both ends of the main body (51) are provided with the internal thread grooves, the clamping body (52) is provided with the external threads matching with the internal thread grooves.

2. The etching tool for upright and inverted chips according to claim 1, characterized in that: The main body (51) is a cylinder, the clamping body (52) is a ring with a diameter larger than that of the main body (51), both ends of the main body (51) are provided with the external threads, and the clamping body (52) is provided with the internal thread hole that matches the external threads.

3. The etching tool for upright and inverted chips according to claim 2, characterized in that: The mortise and tenon structure (3) comprises a mortise groove (31) provided on the first carrier (1) and the second carrier (2), and also comprises a tenon (32) engaged with the mortise groove (31).

4. The etching tool for upright and inverted chips according to claim 3, characterized in that: The installation groove (11) is a rectangular groove, and four corners of the installation groove (11) are each provided with a circular groove (12) that is in communication with the installation groove (11).

5. The etching tool for upright and inverted chips according to claim 4, characterized in that: It also includes an ultrasonic tank for cleaning the chip (01), wherein a beaker for placing the etching tool is provided in the ultrasonic tank.

6. The etching tool for upright and inverted chips according to claim 5, characterized in that: The chip (01) is a mercury cadmium telluride chip.

7. A chip etching method, characterized in that: The etching tool for the upright and invertible chip according to claim 6, wherein the etching method comprises: The chip (01) in the etching tool is rinsed with pure water; The washed chip (01) is placed upright or upside down in an ultrasonic bath for immersion; Rinse the soaked chip (01) twice with pure water; Inverting and etching the chip (01) after the second rinse; The chip (01) after inverted etching is inverted and rinsed in the ultrasonic tank; After being rinsed upside down, the chip (01) is placed upright and rinsed with pure water; The rinsed chip (01) is blown dry with nitrogen and taken out.

8. The chip etching method according to claim 7, characterized in that: Before the chip (01) in the etching tool is rinsed with pure water, the etching tool is assembled, and the assembling of the etching tool comprises: Placing the chip (01) in a mounting groove (11) of a first carrier (1) of the etching tool; Overlapping the second carrier (2) of the etching tool with the first carrier (1), and inserting the tenon (32) into the tenon groove (31) to connect the first carrier (1) and the second carrier (2); The clamping body (52) at one end of the main body (51) of the hand-held rod (5) is removed, and after the main body (51) is inserted into the first carrier (1) and the second carrier (2), the clamping body (52) is installed on the main body (51).

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