Optical module

Abstract

The optical module (200) comprises a circuit connecting plate (300a) and an optical receiving component (500), the optical receiving component (500) comprises a tube shell, a notch (301a) is formed in the end of the circuit connecting plate (300a), and the surface of the notch (301a) comprises a first side wall (301a1), a second side wall (301a2) and a connecting face (301a3) arranged between the first side wall (301a1) and the second side wall (301a2). An avoiding hole (515) is formed in one end of the tube shell, a first step (511), a second step (512), a third step (513) and a fourth step (514) which are sequentially increased in height are formed on the bottom surface of the tube shell, and different optical elements are arranged through the steps with different heights. The avoiding hole (515) is used for enabling the circuit connecting plate (300a) to extend into the tube shell until the notch (301a) comprises the periphery of the second step (512); the first step (511) is used for supporting the circuit connection board (300a); the second step (512) is used for supporting the optical receiving chip (550) and the TIA (560). The surface of the notch (301a) is composed of a first side wall (301a1), a second side wall (301a2) and a connecting face (301a3) arranged between the first side wall (301a1) and the second side wall (301a2), the notch (301a) in the form can increase the arrangement direction and area of a bonding pad, routing of a light receiving chip (550) and a TIA (560) is facilitated, and the routing length is shortened.

Description

optical modules

[0001] This application claims the priority of application number 202310739097.7 filed with the China Patent Office on June 20, 2023; the priority of application number 202310735732.4 filed with the China Patent Office on June 20, 2023; and the priority of application number 202320675502.9 filed with the China Patent Office on March 30, 2023; all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, advances in optical communication technology are becoming increasingly important. As a key component in optical communication equipment, optical modules enable photoelectric signal conversion. As optical communication technology evolves, the data transmission rate of these modules continues to increase.

[0004] Summary of the Invention

[0005] An embodiment of the present disclosure provides an optical module, including:

[0006] A circuit connection board having a notch formed at an end thereof, wherein a surface of the notch includes a first side wall, a second side wall, and a connection surface provided between the first side wall and the second side wall;

[0007] a light receiving component, electrically connected to the circuit connection board;

[0008] The light receiving component includes:

[0009] A first tube shell is provided with an escape hole at one end, and a bottom surface of the first tube shell is formed with a first step, a second step, a third step, and a fourth step with increasing heights, respectively, for accommodating different optical elements, wherein the escape hole is configured to allow the circuit connection board to extend into the interior of the first tube shell until the notch wraps around the outer periphery of the second step; and the first step is configured to support the circuit connection board;

[0010] Light receiving chips are arranged in an array on the second step surface, and the light receiving chips are electrically connected to the first side wall or the surface of the second side wall;

[0011] A TIA is provided on the second step surface, provided between the connection surface and the light receiving chip, the TIA being electrically connected to the light receiving chip and the surface of the connection surface;

[0012] The light emitting component includes a second tube shell, wherein an end surface of the second tube shell is formed with a through hole;

[0013] an adapter assembly connected to the through hole;

[0014] The adapter assembly comprises:

[0015] Fiber optic adapter, with a fiber optic ferrule inside;

[0016] an optical isolator, disposed inside the optical fiber adapter and connected to the end face of the optical fiber ferrule, wherein the size of the optical isolator is smaller than the inner diameter of the optical fiber adapter;

[0017] The non-cylindrical lens is connected to the end face of the optical fiber adapter, and a gap is formed between the non-cylindrical lens and the optical isolator. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0019] FIG1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0020] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0021] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0022] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0023] FIG5 is a structural diagram of a first light receiving component provided according to some embodiments of the present disclosure;

[0024] FIG6 is a structural diagram 1 of a tube shell provided according to some embodiments of the present disclosure;

[0025] FIG7 is a second structural diagram of a tube shell provided according to some embodiments of the present disclosure;

[0026] FIG8 is a cross-sectional schematic diagram of a tube shell provided according to some embodiments of the present disclosure;

[0027] FIG9 is a cross-sectional structural diagram 1 of a first light receiving component provided according to some embodiments of the present disclosure;

[0028] FIG10 is a second cross-sectional structural diagram of a first light receiving component provided according to some embodiments of the present disclosure;

[0029] FIG11 is a third cross-sectional structural diagram of a first light receiving component provided according to some embodiments of the present disclosure;

[0030] FIG12 is a fourth cross-sectional structural diagram of a first light receiving component provided according to some embodiments of the present disclosure;

[0031] FIG13 is a fifth cross-sectional structural diagram of a first light receiving component provided according to some embodiments of the present disclosure;

[0032] FIG14 is a sixth cross-sectional structural diagram of a first light receiving component provided according to some embodiments of the present disclosure;

[0033] FIG15 is a structural diagram of a second light receiving component provided according to some embodiments of the present disclosure;

[0034] FIG16 is a cross-sectional view of a second light receiving component provided according to some embodiments of the present disclosure;

[0035] FIG17 is an exploded cross-sectional view of a second light receiving component according to some embodiments of the present disclosure;

[0036] FIG18 is a first cross-sectional diagram of another tube shell provided according to some embodiments of the present disclosure;

[0037] FIG19 is a second cross-sectional schematic diagram of another tube shell provided according to some embodiments of the present disclosure;

[0038] FIG20 is a first cross-sectional view of a third light receiving component provided according to some embodiments of the present disclosure;

[0039] FIG21 is a cross-sectional exploded view of a third light receiving component provided according to some embodiments of the present disclosure;

[0040] FIG22 is a second cross-sectional view of a third light receiving component provided according to some embodiments of the present disclosure;

[0041] FIG23 is a third cross-sectional view of a third light receiving component provided according to some embodiments of the present disclosure;

[0042] FIG24 is a diagram showing the internal structure of an optical module according to some embodiments of the present disclosure;

[0043] FIG25 is a schematic structural diagram of a circuit board according to some embodiments of the present disclosure;

[0044] FIG26 is a schematic structural diagram of a light emitting component according to some embodiments of the present disclosure;

[0045] FIG27 is a schematic diagram of an assembly of a fiber optic adapter and a light emitting component according to some embodiments of the present disclosure;

[0046] FIG28 is an exploded view of an assembly of a fiber optic adapter and a light emitting component according to some embodiments of the present disclosure;

[0047] FIG29 is a schematic diagram of an assembly of a fiber optic adapter and a Fresnel lens according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0048] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0049] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0050] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0051] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0052] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0053] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0054] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0055] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0056] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0057] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0058] Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0059] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0060] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0061] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0062] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0063] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0064] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, FIG2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG2, the host computer 100 also includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins that increase the heat dissipation area.

[0065] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0066] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes either the light emitting component 400 or the light receiving component 500.

[0067] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0068] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0069] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0070] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and the opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located on the side of the optical module 200. The opening 204 is an electrical port, from which the gold finger 301 of the circuit board 300 extends and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, which is configured to connect to the external optical fiber 101, so that the optical fiber 101 connects the optical emitting component 400 and the optical receiving component 500 in the optical module 200.

[0071] The combined assembly of the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, and the like within the housing. The upper housing 201 and the lower housing 202 provide encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300, the light emitting component 400, and the light receiving component 500, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0072] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0073] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0074] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0075] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0076] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0077] The circuit board 300 also includes a gold finger 301 formed on its end surface, and the gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0078] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301 .

[0079] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0080] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0081] FIG5 is a structural diagram of a first optical receiving component provided according to some embodiments of the present disclosure. As shown in FIG5 , in some embodiments, the optical receiving component 500 includes a first tube shell 510a, an optical demultiplexing assembly 520, a lens, a reflector, an optical receiving chip, and a TIA 560. The optical demultiplexing assembly 520, the lens, the reflector, and the TIA 560 are respectively arranged inside the first tube shell 510a. The lens is located in the light-emitting direction of the optical demultiplexing assembly 520 to receive the various optical signals generated by the optical demultiplexing assembly 520; the reflector is located in the light-emitting direction of the lens to receive the various optical signals transmitted from the lens; and the optical receiving chip is located in the light-emitting direction of the reflector to receive the optical signals reflected by the reflector.

[0082] The optical demultiplexing assembly 520 is used to receive the optical signal transmitted from the optical module to the first tube shell 510a and decompose the optical signal into multiple optical signals of different wavelengths. Exemplarily, the lens is a converging lens, which is used to convert each optical signal from diverging light to converging light. The reflector is used to reflect the optical signal transmitted by the lens, changing the transmission direction of the optical signal, turning the optical signal downward, and then reflecting the optical signal to the optical receiving chip. The optical receiving chip converts the optical signal into a current signal. The TIA 560 is used to convert the current signal into a voltage signal and amplify it. Exemplarily, the optical receiving chips are arranged in an array so that each optical receiving chip can receive the optical signals generated by the optical demultiplexing assembly 520.

[0083] One end of the optical receiving component 500 is connected to the optical fiber adapter, and the other end is electrically connected to the circuit connection board 300a. One end of the circuit connection board 300a extends into the interior of the first tube shell 510a. In some embodiments, the circuit connection board 300a can be the circuit board 300 of the optical module. In this case, one end of the circuit connection board 300a extends into the interior of the first tube shell 510a, and the other end is electrically connected to the host computer through an electrical port. In some embodiments, the circuit connection board 300a can be a sub-circuit board. For example, the sub-circuit board is a printed circuit board or a ceramic connection board. One end of the sub-circuit board extends into the interior of the first tube shell 510a, and the other end is electrically connected to the circuit board 300 of the optical module through a flexible circuit board. In some embodiments, the circuit connection board 300a can be a flexible circuit board. One end of the flexible circuit board extends into the interior of the first tube shell 510a, and the other end is electrically connected to the circuit board 300 of the optical module.

[0084] Figure 6 is a structural diagram of a first housing according to some embodiments of the present disclosure. As shown in Figure 6, in some embodiments, a clearance hole 515 is provided at one end of the first housing 510a. This clearance hole 515 allows the circuit board 300a to extend into the interior of the first housing 510a, thereby electrically connecting the circuit board 300a to the TIA 560. The optical receiver chip 550 is electrically connected to the TIA 560. The optical receiver chip 550 converts the received optical signal into a photocurrent signal. The TIA 560 converts the photocurrent signal into a voltage signal, amplifies the voltage signal, and then transmits the voltage signal through the circuit board 300a.

[0085] Figure 7 is a second structural diagram of a first tube shell provided according to some embodiments of the present disclosure. As shown in Figure 7, in some embodiments, a boss 516 is provided at the other end of the first tube shell 510a. The boss 516 has an optical window disposed therein, and an optical connection with the optical fiber adapter is achieved through the boss 516.

[0086] Figure 8 is a schematic cross-sectional view of a first tube housing according to some embodiments of the present disclosure. As shown in Figure 8, in some embodiments, the bottom surface of the first tube housing 510a is formed with stepped surfaces of varying heights, including a first step 511, a second step 512, a third step 513, and a fourth step 514. For example, the heights of the first step 511, the second step 512, the third step 513, and the fourth step 514 increase in sequence. In some embodiments, a gap is provided between the fourth step 514 and the end face of the first tube housing 510a where the light window is located to avoid the light window. However, no gap is required as long as the light window is avoided.

[0087] Figure 9 is a cross-sectional structural diagram (I) of a first type of light receiving component provided according to some embodiments of the present disclosure; Figure 10 is a cross-sectional structural diagram (II) of a first type of light receiving component provided according to some embodiments of the present disclosure. As shown in Figures 9 and 10, a notch 301a is provided at the end of the circuit connection board 300a near the first tube shell 510a. Exemplarily, the notch 301a is a U-shaped notch.

[0088] Circuit connection board 300a extends through avoidance hole 515 into first tube housing 510a until notch 301a wraps around the periphery of second step 512. First step 511 supports circuit connection board 300a, thereby securing circuit connection board 300a. Exemplarily, notch 301a wraps around the periphery of second step 512: notch 301a surrounds the periphery of the remaining three surfaces of second step 512, excluding the interface between the notch 301a and third step 513.

[0089] The surface of the second step 512 is provided with a light receiving chip 550 and a TIA 560. For example, there is a certain distance between the light receiving chip 550 and the TIA 560 to avoid problems such as light path contamination caused by glue overflowing during the pasting and fixing.

[0090] A lens is provided on the surface of the third step 513. The reflector includes a light incident surface, an inclined surface, and a light emitting surface. The light incident surface faces the lens, the inclined surface is used to reflect the light signal transmitted by the lens, and the light emitting surface faces the second step 512. In some embodiments, the lens and the reflector can be connected together or separately depending on different scenarios. In the present disclosure, the lens is fixed to the surface of the third step 513. Compared with some embodiments in which the lens is arranged between the reflector and the light receiving chip, the lens is more stable.

[0091] The lens is disposed on the surface of the third step 513 , the reflector is not disposed on the surface of any step, and the reflector is disposed above the second step.

[0092] The lens and the reflector are arranged opposite to each other so that the light signal transmitted from the lens is incident on the reflector. The focal length of the lens should be sufficient to ensure that the light signal transmitted from the lens is reflected by the reflector and then focused on the surface of the light receiving chip, thereby reducing the size of the light spot so that the light signal falls within the light receiving range of the light receiving chip.

[0093] The surface of the fourth step 514 is provided with an optical demultiplexing assembly 520 . The fourth step 514 is provided at a preset height so that the optical axis of the optical demultiplexing assembly 520 and the optical port of the optical module are coaxial, thereby increasing optical coupling efficiency.

[0094] When the optical demultiplexing component 520 is selected to be of standard specifications, its height is less than the height of the lens. Therefore, the optical demultiplexing component 520 is arranged on the surface of the relatively higher fourth step 514, and the lens is arranged on the surface of the relatively lower third step 513, so that the optical axis of the optical demultiplexing component 520 and the optical axis of the lens are on the same straight line. By arranging the optical demultiplexing component 520 on a separate step surface, it is more conducive to selecting standard specifications and facilitating production.

[0095] In some embodiments, the bottom surface of the first tube shell 510a is respectively formed with step surfaces of different heights. These step surfaces are integrally formed with the main structure of the first tube shell 510a, which can increase the reliability of each step. Compared with some embodiments in which a ceramic substrate is pasted and then the ceramic substrate serves as these step surfaces, the present disclosure forms each step inside the first tube shell 510a, avoids patching, thereby increasing the reliability of each step, increasing the optical reliability of each optical element, and thus improving the optical coupling accuracy.

[0096] In some embodiments, the circuit connection board 300a, TIA560 and the optical receiving chip 550 are arranged in sequence, and the TIA560 and the optical receiving chip 550 are electrically connected to the circuit connection board 300a respectively. Since the TIA560 is provided between the optical receiving chip 550 and the circuit connection board 300a, the bonding length between the optical receiving chip 550 and the circuit connection board 300a is relatively long, which is not conducive to the transmission of high-frequency signals. Moreover, since the optical receiving chip 550 is arranged in the form of an array, that is, it includes multiple optical receiving chips, the difficulty of bonding between the optical receiving chip and the circuit connection board 300a is further increased.

[0097] Exemplarily, a notch 301a is provided at the end of the circuit connection board 300a, and the notch 301a includes a first side wall 301a1, a second side wall 301a2 and a connecting surface 301a3 connecting the first side wall 301a1 and the second side wall 301a2. The first side wall 301a1 and the second side wall 301a2 of the notch 301a can increase the pad setting area and orientation, especially when the optical receiving chip is arranged in the form of an array and a TIA is provided between the optical receiving chip and the connecting surface. Exemplarily, each optical receiving chip in the optical receiving chip array can be selected to be wire-bonded with the pad on the surface of the first side wall or the second side wall nearby to realize the electrical connection between the optical receiving chip and the circuit connection board, which is conducive to the distribution of the bonding wires of the optical receiving chip array.

[0098] Exemplarily, the surfaces of the first side wall 301a1 and the second side wall 301a2 are provided with solder pads electrically connected to the optical receiving chip 550, which increases the pad setting orientation and is beneficial to shortening the wire bonding length. For example, when the optical receiving chip array includes eight optical receiving chips, the surface of the first side wall 301a1 is provided with 4 solder pads to achieve electrical connection with the 4 optical receiving chips, and the surface of the second side wall 301a2 is provided with 4 solder pads to achieve electrical connection with the other 4 optical receiving chips. Therefore, when the solder pads electrically connected to the optical receiving chip 550 are provided on the surfaces of the first side wall 301a1 and the second side wall 301a2, it is beneficial to the layout of the wire bonding, shortens the wire bonding length, and is beneficial to high-frequency signal transmission.

[0099] For example, the surface of the connection surface 301a3 is provided with a solder pad electrically connected to the TIA560, thereby realizing wiring between the optical receiving chip 550 and the circuit connection board 300a. Since the TIA560 is arranged adjacent to the connection surface 301a3, the wiring length between the circuit connection board 300a and the TIA560 can be shortened at this time, which is conducive to high-frequency signal transmission.

[0100] In some embodiments, the lens includes a first lens 530a; the reflector includes a first reflector 540a. The first lens 530a is a converging lens. The light incident surface of the first lens 530a is a curved surface, and the light emitting surface is a flat surface.

[0101] The light beams emitted by the optical demultiplexing component 520 are respectively converged by the first lens 530a and coupled to the first reflector 540a. Then, after being reflected by the first reflector 540a, the light path turns downward to the surface of the light receiving chip 550. The focal length of the first lens 530a satisfies that the light spot formed by the optical signal falls on the surface of the light receiving chip 550.

[0102] The first reflector 540a includes a light incident surface, a first inclined surface 540a1 and a light emitting surface, wherein the light incident surface faces the first lens 530a, the first inclined surface 540a1 has a preset inclination angle so that the light signal incident thereon is totally reflected to the surface of the light receiving chip 550, and the light emitting surface faces the surface of the light receiving chip 550.

[0103] In some embodiments, the first lens 530a is disposed on the surface of the third step 513, and the first reflector 540a is not disposed on the surface of any step. In order to fix the first reflector 540a, the first reflector 540a can be supported by the first lens 530a. Exemplarily, the first lens 530a and the first reflector 540a are pasted together. Exemplarily, the light-emitting surface of the first lens 530a and the light-incident surface of the first reflector 540a are pasted together by optical glue. At this time, the first reflector 540a is suspended relative to the step surface.

[0104] Because the light-emitting surface of the first lens 530a is flat, a larger contact surface is ensured between the light-emitting surface of the first lens 530a and the light-entering surface of the first reflector 540a, thereby ensuring the stability of the affixation of the first reflector 540a. When affixing the first lens 530a and the first reflector 540a together, the first lens 530a only needs to be fixed to the surface of the third step 513 using a high-precision chip mounter, eliminating the need to use a high-precision chip mounter to fix the first reflector 540a, thereby simplifying the chip mounting process. The light-emitting surface of the first lens 530a and the light-entering surface of the first reflector 540a do not need to be fixed using a high-precision chip mounter, and can be manually applied with optical glue and affixed. Therefore, when affixing the first lens 530a and the first reflector 540a together, the chip mounting process can be simplified, thereby improving efficiency.

[0105] In some embodiments, when the circuit connection board 300a is a circuit board, a printed circuit board, or a flexible circuit board of an optical module, the pads on the surface of the TIA560 and the pads on the surface of the circuit connection board 300a can be directly connected by bonding; when the circuit connection board 300a is a ceramic connection board, bonding capacitors are set on the surface of the ceramic connection board, and then the pads on the surface of the TIA560 are electrically connected to the bonding capacitors, and then the bonding capacitors are connected to the pads on the surface of the ceramic connection board by bonding.

[0106] Figure 11 is a third cross-sectional structural diagram of a first optical receiving component provided according to some embodiments of the present disclosure. As shown in Figure 11, a first step 511, a second step 512, a third step 513, and a fourth step 514 are formed on the bottom surface of the first tube shell 510a. The first step 511 is used to support the circuit connection board 300a; the surface of the second step 512 is provided with a TIA 560 and an optical receiving chip 550; the surface of the third step 513 is provided with a first lens 530a, and the light-emitting surface of the first reflector 540a faces the optical receiving chip 550 on the surface of the second step 512; and the surface of the fourth step 514 is provided with an optical demultiplexing assembly 520.

[0107] In the disclosed embodiment, the optical path of the optical element is ensured by properly setting the height of each step, thereby ensuring its normal operation. For example, the height of the second step 512 is a predetermined height. The predetermined height is required to make the surface of the TIA 560 flush with the surface of the circuit board 300a, thereby shortening the bonding distance between the TIA 560 and the circuit board 300a.

[0108] Exemplarily, the third step 513 is located at a predetermined height, which must satisfy the working distance of the first lens 530a while also ensuring that the optical axis of the first lens 530a is aligned with the optical axis of the optical demultiplexing assembly 520. Exemplarily, the first lens 530a has a predetermined working distance. If the third step 513 is located too low, while the optical axes of the first lens 530a and the first reflector 540a must remain aligned with the optical axis of the optical demultiplexing assembly 520, and the height of the first reflector 540a remains fixed, the distance between the first reflector 540a and the optical receiving chip 550 will be relatively large, potentially exceeding the working distance of the first lens 530a. Consequently, the magnification of the first lens 530a cannot be guaranteed, and the first lens 530a cannot function properly. If the height of the third step 513 is too low, and the optical axes of the first lens 530a and the first reflector 540a need to be aligned with the optical axis of the optical demultiplexing assembly 520, the distance between the first reflector 540a and the optical receiving chip 550 will be relatively small, thereby interfering with operations such as bonding of the optical receiving chip 550. Therefore, the height of the third step 513 is predetermined, and the predetermined height must meet the working distance of the first lens 530a while also ensuring that the optical axis of the first lens 530a is aligned with the optical axis of the optical demultiplexing assembly 520.

[0109] Exemplarily, the fourth step 514 has a preset height, which needs to ensure that the optical axis of the optical demultiplexing component 520 on the surface and the optical port of the optical module are on the same axis, thereby ensuring the optical coupling power.

[0110] FIG12 is a fourth cross-sectional structural diagram of a first light receiving component according to some embodiments of the present disclosure. As shown in FIG12 , in some embodiments, when the first lens 530a and the first reflector 540a are attached together, the bottom surface of the first lens 530a and the bottom surface of the first reflector 540a are on the same surface. In this case, the optical axes of the first lens 530a and the first reflector 540a are on the same straight line.

[0111] The optical receiving chip 550 and the TIA 560 are both disposed on the surface of the second step 512 ; the first lens 530 a is disposed on the surface of the third step 513 ; and the optical demultiplexing element 520 is disposed on the surface of the fourth step 514 .

[0112] In some embodiments, the third step 513 and the fourth step 514 can be arranged in a plane. In this case, the dimensions of the optical demultiplexing component 520 and the first lens 530a should satisfy that the optical axis of the optical demultiplexing component 520 and the optical axis of the first lens 530a are on the same axis.

[0113] FIG13 is a fifth cross-sectional structural diagram of the first light receiving component provided according to some embodiments of the present disclosure. As shown in FIG13 , in some embodiments, when the first lens 530a and the first reflector 540a are pasted together, the bottom surface of the first lens 530a is located on the surface of the third step 513, and then the bottom surface of the first reflector 540a is not on the same surface as the bottom surface of the first lens 530a, but is closer to the light receiving chip 550 relative to the bottom surface of the first lens 530a. In this way, the bottom surface of the first lens 530a and the bottom surface of the first reflector 540a are relatively staggered. This is because when the first lens 530a is pasted, excess glue may overflow to the bottom surface of the first reflector 540a, thereby reducing the transmittance of the bottom surface of the first reflector 540a. When the bottom surface of the first lens 530a and the bottom surface of the first reflector 540a are relatively staggered, the step surface formed by the staggered state can block the glue, thereby preventing the glue from overflowing to the bottom surface of the first reflector 540a, thereby ensuring the transmittance of the bottom surface of the first reflector 540a.

[0114] In some embodiments, when the first lens 530a and the first reflector 540a are attached together, the bottom surface of the first lens 530a is located on the surface of the third step 513. The bottom surface of the first reflector 540a is not co-located with the bottom surface of the first lens 530a, but is instead located upwards and away from the light receiving chip 550 relative to the bottom surface of the first lens 530a. When the first reflector 540a is further upwards and away from the light receiving chip 550, the gap between the first reflector 540a and the light receiving chip 550 can be increased, leaving sufficient space for bonding wires on the surface of the light receiving chip 550 and attaching capacitors near the light receiving chip 550.

[0115] FIG14 is a sixth cross-sectional structural diagram of the first light receiving component according to some embodiments of the present disclosure. As shown in FIG14 , the TIA 560 is disposed on the surface of the second step 512 and in the notch 301a of the circuit connection board 300a, and the notch 301a encloses the TIA 560.

[0116] The light exiting surface of the first lens 530a and the light incident surface of the first reflector 540a are adhered together by optical adhesive, which simplifies the patch process. At the same time, the working distance of the first lens 530a is shorter, which reduces the working distance pressure of the first lens 530a.

[0117] In some embodiments, when the working distance of the first lens 530a is determined, in some scenarios, for example, when the first lens 530a and the first reflector 540a are set separately, if the first lens 530a and the first reflector 540a are directly set separately, then in order to ensure that the working distance of the first lens 530a remains unchanged, the first reflector 540a needs to be moved downward close to the optical receiving chip 550. Since the optical axes of the first lens 530a and the first reflector 540a are on the same straight line, the first lens 530a should also be set downward at this time, which will cause the optical axis of the first lens 530a and the optical axis of the optical demultiplexing component 520 to be not on the same axis, affecting the optical coupling efficiency. Therefore, when the working distance of the first lens 530a is determined, it is not appropriate to set the first lens 530a and the first reflector 540a separately.

[0118] In some embodiments, when the working distance of the first lens 530a is determined, in some scenarios, for example, when the first lens 530a and the first reflector 540a are set separately, if the first lens 530a and the first reflector 540a are directly set separately, then in order to ensure that the working distance of the first lens 530a remains unchanged, the height of the surface of the second step 512 can be increased to shorten the chip between the first reflector 540a and the light receiving chip 550. At this time, the thickness of the circuit connection board 300a needs to be reduced to ensure that the surface of the TIA560 on the surface of the second step 512 is on the same surface as the circuit connection board 300a.

[0119] In some embodiments, in some scenarios, for example, when the first lens 530a and the first reflector 540a are separately arranged, if the first lens 530a and the first reflector 540a are directly separately arranged, in order to ensure that the thickness of the circuit connection board 300a remains unchanged, and the surface where the TIA560 on the surface of the second step 512 is located is on the same surface as the circuit connection board 300a, the working distance of the first lens 530a should be adjusted. For example, the working distance of the first lens 530a is increased.

[0120] Figure 15 is a structural diagram of a second optical receiving component according to some embodiments of the present disclosure. As shown in Figure 15 , as described above, in some embodiments, the circuit connection board 300a may be a flexible printed circuit board, one end of which extends into the interior of the first tube shell 510a and the other end of which is electrically connected to the circuit board 300 of the optical module.

[0121] Exemplarily, circuit connection board 300a is in the form of a flexible printed circuit board 300b. Because flexible printed circuit board 300b is somewhat flexible, it is supported by reinforcing plate 300c. Flexible printed circuit board 300b and reinforcing plate 300c pass through avoidance hole 515 and extend into first tube shell 510a.

[0122] In some embodiments, the flexible circuit board 300b and the reinforcement plate 300c are stacked, and each of the flexible circuit board 300b and the reinforcement plate 300c is provided with a notch. The form of the notch is similar to the notch of the aforementioned circuit connection plate 300a. The notches of the flexible circuit board 300b and the reinforcement plate 300c also surround the second step 512.

[0123] Figure 16 is a cross-sectional view of a second light receiving component according to some embodiments of the present disclosure; Figure 17 is an exploded cross-sectional view of a second light receiving component according to some embodiments of the present disclosure. As shown in Figures 16 and 17, the notches in the flexible printed circuit board 300b and the reinforcing plate 300c also surround the second step 512. The reinforcing plate 300c supports the flexible printed circuit board 300b. The surface of the first step 511 is used to support the reinforcing plate 300c and the flexible printed circuit board 300b.

[0124] An optical demultiplexing assembly 520 is provided on the surface of the fourth step 514; a first lens 530a is provided on the surface of the third step 513, and the first lens 530a is connected to the first reflector 540a. The first reflector 540a is used to reflect the optical signal transmitted by the first lens 530a and turn the optical signal downward to the surface of the optical receiving chip 550.

[0125] A light receiving chip 550 and a TIA 560 are provided on the surface of the second step 512. The light receiving chip 550 and the TIA 560 are electrically connected. The light receiving chip 550 converts the optical signal into a current signal, and the TIA 560 converts the current signal into a voltage signal and amplifies the voltage signal.

[0126] Figure 18 is a cross-sectional view of another first tube shell provided according to some embodiments of the present disclosure. As shown in Figure 18, in some embodiments, another first tube shell 510b different from the above-mentioned first tube shell 510a is provided.

[0127] The first housing 510b has a relief hole 515 at one end and a boss 516 at the other end. The relief hole 515 in the first housing 510b serves the same function as the relief hole 515 in the first housing 510a: it allows the circuit connection board 300a to extend therethrough. The boss 516 in the first housing 510b also serves the same function as the boss 516 in the first housing 510a: it is used for coupling with the optical fiber adapter.

[0128] The inner bottom surface of the first tube housing 510b is formed with a first step 511, a second step 512, a third step 513, and a fourth step 514, each with increasing height. By providing corresponding optical elements on the stepped surfaces at different heights, the optical axis can be properly positioned and the optical path can be properly designed.

[0129] FIG19 is a second cross-sectional schematic diagram of another first tube shell provided according to some embodiments of the present disclosure. As shown in FIG19 , in some embodiments, a first support protrusion 517 and a second support protrusion 518 are formed at both ends of the interface between the second step 512 and the third step 513, respectively. The first support protrusion 517 and the second support protrusion 518 are both designed as slots, which are snap-fitted onto the surface of the second step 512 and then connected to the interface between the second step 512 and the third step 513 from the side, thereby achieving a fixed connection between the first support protrusion 517 and the second support protrusion 518. For example, a first snap-fitting groove is formed on the surface of the first support protrusion 517, and a second snap-fitting groove is formed on the surface of the second support protrusion 518. The first snap-fitting groove and the second snap-fitting groove are respectively snap-fitted onto either side of the interface between the second step 512 and the third step 513.

[0130] Exemplarily, the top surfaces of the first supporting protrusion 517 and the second supporting protrusion 518 are higher than the surface of the third step 513 , and thus the heights of the first supporting protrusion 517 and the second supporting protrusion 518 are higher than the height of the third step 513 .

[0131] Since the first supporting protrusion 517 and the second supporting protrusion 518 are separated and spaced apart at both ends, an optical element can be disposed on the top surface thereof, and an optical element can also be disposed below the optical element.

[0132] Figure 20 is a cross-sectional view of a third optical receiving component provided according to some embodiments of the present disclosure. As shown in Figure 20 , each step surface within the first tube shell 510b is provided with a corresponding optical element. In some embodiments, the surface of the fourth step 514 is provided with an optical demultiplexing assembly 520. The surface of the third step 513 is provided with a lens, which is a converging lens. A reflector is provided on the other side of the lens to reflect the optical signal transmitted by the lens. The surface of the second step 512 is provided with an optical receiving chip 550 and a transient electrical isolation (TIA) 560, respectively. The optical receiving chip 550 and the TIA 560 are electrically connected, exemplarily achieved by wire bonding. The reflector reflects the optical signal to the surface of the optical receiving chip 550, which converts the optical signal into a current signal. The TIA 560 converts the current signal into a voltage signal and amplifies the voltage signal. The TIA 560 is electrically connected to the circuit board 300a. Exemplarily, the pads on the surface of the TIA 560 are electrically connected to the pads on the surface of the circuit board 300a.

[0133] In some embodiments, the lens includes a second lens 530b, the reflector includes a second reflector 540b, the surface of the second reflector 540b has a second inclined surface 540b1, and the second inclined surface 540b1 has a preset inclination angle so that the light signal incident on the surface of the second reflector 540b is totally reflected to the surface of the light receiving chip 550.

[0134] The light incident surface of the second lens 530b faces the optical demultiplexing assembly 520 , and the light emitting surface faces the second reflector 540b ; the light incident surface of the second reflector 540b faces the second lens 530b , and the light emitting surface faces the light receiving chip 550 on the surface of the second step 512 .

[0135] In some embodiments, the second lens 530b is disposed on the surface of the third step 513, and the second reflector 540b is not disposed on the surface of any step. In order to fix the second reflector 540b, the first supporting protrusion 517 and the second supporting protrusion 518 can be used to support and fix the second reflector 540b. Exemplarily, the second lens 530b and the second reflector 540b are disposed separately, that is, there is a certain distance between the second lens 530b and the second reflector 540b, and the two ends of the second reflector 540b are respectively straddling the surfaces of the first supporting protrusion 517 and the second supporting protrusion 518, which support the second reflector 540b. Then, the light receiving chip 550 is disposed below the second reflector 540b. By setting the first supporting protrusion 517 and the second supporting protrusion 518 apart from each other, a second reflector 540b is set on the top surface thereof, and a light receiving chip 550 is set therebelow, so that the second reflector 540b and the light receiving chip 550 are set up and down, thereby transmitting the light signal reflected by the second reflector 540b to the surface of the light receiving chip 550.

[0136] Figure 21 is an exploded cross-sectional view of a third type of light receiving component according to some embodiments of the present disclosure. As shown in Figure 21 , a notch is also provided at the end of the circuit connection board 300a. The notch extends through the avoidance hole 515 into the first tube shell 510b until the notch surrounds the outer periphery of the second step 512.

[0137] Figure 22 is a second cross-sectional view of a third optical receiving component provided according to some embodiments of the present disclosure; Figure 23 is a third cross-sectional view of a third optical receiving component provided according to some embodiments of the present disclosure. As shown in Figures 22 and 23, an optical demultiplexing assembly 520 is provided on the surface of the fourth step 514, a second lens 530b is provided on the surface of the third step 513, and a second reflector 540b is provided above the second step 512. The second reflector 540b is arranged opposite to the optical receiving chip 550, and the optical signal transmitted by the second lens 530b is reflected by the second reflector 540b to the surface of the optical receiving chip 550. The optical receiving chip 550 and the TIA 560 are both arranged on the surface of the second step 512.

[0138] In some embodiments, the second lens 530b and the second reflector 540b are separated, which is easier to couple than setting them in contact. When the two are set in contact, joint coupling is required, and the efficiency of joint coupling is low. Therefore, the two can be set separately and then coupled separately. For example, the second reflector 540b is coupled first, and then the second lens 530b is coupled. At the same time, in order to facilitate the coupling of the second lens 530b, the interval between the second lens 530b and the second reflector 540b is large, thereby leaving enough space for the coupling of the second lens 530b.

[0139] In some embodiments, the light receiving chip 550 and the TIA 560 are wire bonded. To avoid interfering with the bonding, the distance between the second reflector 540 b and the light receiving chip 550 can be set larger to facilitate the bonding operation.

[0140] In order to increase the distance between the second reflector 540b and the light receiving chip 550, since the height of the second step 512 where the light receiving chip 550 is located should ensure that the surface of the TIA560 is flush with the surface of the circuit connection board 300a, the height of the second step 512 should remain unchanged, and the height of the light receiving chip 550 will remain unchanged. Therefore, at this time, the second reflector 540b can be adjusted to increase the distance between the second reflector 540b and the light receiving chip 550.

[0141] Since the optical axis height of the second reflector 540b should remain unchanged, the position of the second bevel 540b1 should remain unchanged. The distance between the second reflector 540b and the light receiving chip 550 can be increased by reducing the size of the second reflector 540b along the height direction of the first tube shell 510b, that is, reducing the height of the second reflector 540b in the up and down directions while ensuring the position of the second bevel 540b1, thereby facilitating operations such as wire bonding.

[0142] Accordingly, the dimension of the reflector in the corresponding example of FIG9 along the height direction of the first tube shell 510a is greater than the dimension of the reflector in the corresponding example of FIG22 along the height direction of the first tube shell 510a, that is, the dimension of the first reflector 540a along the height direction of the first tube shell 510a is greater than the dimension of the second reflector 540b along the height direction of the first tube shell 510a, that is, the dimension of the second reflector 540b in the vertical direction is smaller than the dimension of the first reflector 540a in the vertical direction. It can be understood that the "vertical direction" refers to the direction from the second reflector 540b to the light receiving chip 550. At this time, the distance from the first reflector 540a to the corresponding light receiving chip 550 is smaller than the distance from the second reflector 540b to the corresponding light receiving chip 550.

[0143] For example, the first reflector 540a has a vertical cross-section that is a trapezoid plus a rectangle, while the second reflector 540b has a vertical cross-section that is a trapezoid. Consequently, the second reflector 540b is smaller in the vertical dimension than the first reflector 540a. When the first reflector 540a has a vertical cross-section that is a trapezoid plus a rectangle, a rectangular shape is provided below the first inclined surface 540a1 to avoid forming a sharp corner on the first inclined surface 540a1, which can easily lead to chipping. When the second reflector 540b has a vertical cross-section that is a trapezoid, the distance between the second reflector 540b and the light receiving chip 550 can be increased, facilitating operations such as wire bonding on the light receiving chip 550.

[0144] In some embodiments, when the position of the optical port remains unchanged, the height of the optical axis of the optical demultiplexing component 520 should also remain unchanged, and thus the height of the optical axis of the second reflector 540b should remain unchanged. Then, the height of the top surface of the second reflector 540b is the same as the height of the top surface of the first reflector 540a. Therefore, the first support protrusion 517 and the second support protrusion 518 have preset heights so that the height of the top surface of the second reflector 540b is the same as the height of the top surface of the first reflector 540a.

[0145] When the dimension of the first reflector 540a along the height direction of the first tube shell 510a is larger than the dimension of the second reflector 540b along the height direction of the first tube shell 510a, that is, the dimension of the second reflector 540b in the vertical direction is smaller than the dimension of the first reflector 540a in the vertical direction, the optical path from the second lens 530b to the corresponding optical receiving chip 550 is shorter than the optical path from the first lens 530a to the corresponding optical receiving chip 550, and the distance the optical signal is transmitted through the second reflector 540b is shorter than the distance the optical signal is transmitted through the first reflector 540a. When the reflector is the second reflector 540b, the distance the optical signal is transmitted through in the air is longer than the distance when the reflector is the first reflector 540a. Since the refractive index of air is small, the optical path from the second lens 530b to the corresponding optical receiving chip 550 is shorter than the optical path from the first lens 530a to the corresponding optical receiving chip 550. At this time, the working distance of the second lens 530b is shorter than the working distance of the first lens 530a.

[0146] In order to ensure the coupling effect, the gap between the second lens 530b and the second reflector 540b is large. For example, the gap is greater than the size difference. The size difference refers to the difference between the size of the second reflector 540b along the height direction of the first tube shell 510b and the size of the first reflector 540a along the height direction of the first tube shell 510a. At this time, although the size of the second reflector 540b in the up and down direction is smaller than the size of the first reflector 540a in the up and down direction, the gap between the second lens 530b and the second reflector 540b is large. Therefore, the working distance of the second lens 530b may be greater than the working distance of the first lens 530a.

[0147] In this embodiment, the lens is fixed to the surface of the third step to increase its stability. Simultaneously, the reflector is positioned above the second step, and the light receiving chip is positioned on the surface of the second step, fully utilizing the vertical space of the first tube housing. In this embodiment, the focal length of the lens allows the light signal emitted from the lens to be reflected by the reflector and then focused on the surface of the light receiving chip, thereby reducing the size of the light spot and ensuring that the light signal falls within the light receiving range of the light receiving chip.

[0148] In the disclosed embodiments, by positioning each optoelectronic element on different steps within the first tube housing, the steps of varying heights align the optical axes of the optical elements, eliminating the need for a ceramic support plate used in some embodiments and thus reducing production costs. Step surfaces of varying heights are integrally formed within the first tube housing, eliminating the need for patch-mounted mounting of the ceramic support plate, thereby improving product reliability and optical coupling accuracy. Furthermore, by rationally setting the heights of the steps, the disclosed embodiments ensure the optical axis height of the optical element, thereby ensuring its proper operation.

[0149] Figure 24 shows a schematic diagram of the arrangement of a light-receiving component and a light-emitting component on a circuit board within an optical module according to some embodiments of the present disclosure. As shown in Figure 24 , in some embodiments of the present disclosure, light-emitting component 400 and light-receiving component 500 utilize micro-optical packaging. Light-emitting component 400 converts received electrical signals into optical signals, and light-receiving component 500 converts received optical signals into electrical signals, thereby achieving the optical-to-electrical conversion function of the optical module.

[0150] As shown in Figure 4, the light emitting component 400 and the light receiving component 500 can be stacked. As another embodiment, the light emitting component 400 is located at the edge of the PCB circuit board 105, and the light emitting component 400 and the light receiving component 500 are staggered on the surface of the PCB circuit board 105, which is conducive to achieving a better electromagnetic shielding effect.

[0151] The light emitting component 400 includes a cover plate 401 , and the light receiving component 500 includes a cover plate 501 .

[0152] FIG25 is a schematic diagram of the structure of a circuit board provided according to some embodiments of the present disclosure. As shown in FIG25 , a first notch 301 and a second notch 302 are formed on the surface of the circuit board 300. The first notch 301 is used to set the light emitting component 400. The first notch 301 can be set in the middle of the PCB circuit board 105 or at the edge of the PCB circuit board 105. The light emitting component 400 is set in the notch in an embedded manner, which facilitates the circuit board 300 to extend into the light emitting component 400 and also facilitates the fixing of the light emitting component and the circuit board 300 together. The second notch 302 is used to set the light receiving component 500. In another common packaging method, the light receiving component is physically separated from the circuit board and electrically connected through a flexible circuit board.

[0153] Figure 26 is a schematic diagram of the structure of an optical transmission component provided according to some embodiments of the present disclosure. As shown in Figure 26, the optical transmission component 400 includes a second tube shell 402, which is internally provided with a laser array 403, a lens array 404, and an optical multiplexing assembly 405. A cover plate 401 covers the surface of the second tube shell 402. Taking the example of laser array 403 including four lasers, the lens array 404 correspondingly includes four collimating lenses. The lasers emit optical signals, which, after coupling through the collimating lenses, enter the optical multiplexing assembly 405. The optical multiplexing assembly 405 combines the four optical signals into a single optical signal, which is then transmitted to the outside via optical fiber.

[0154] Figure 27 of some embodiments of the present disclosure is a schematic diagram illustrating the assembly of a fiber optic adapter and a light emitting component according to some embodiments of the present disclosure, and Figure 28 is an exploded view illustrating the assembly of a fiber optic adapter and a light emitting component according to some embodiments of the present disclosure. As shown in Figures 27 and 28 , a through hole 4021 is defined at one end of the second tube shell 402. An adapter assembly is disposed within the through hole 4021, comprising a fiber optic adapter 700, an optical isolator 700a, and a non-cylindrical lens 700b. The optical isolator 700a is smaller than the inner diameter of the fiber optic adapter 700; that is, the lengthwise diameter of the optical isolator 700a is smaller than the inner diameter of the fiber optic adapter 700, thereby enabling the optical isolator 700a to be positioned within the fiber optic adapter 700.

[0155] The fiber optic adapter 700 includes a housing 701, within which a fiber optic ferrule 702 is disposed. A limit ring 703 is formed on the outer surface of the housing 701. In some embodiments, the end surface of the fiber optic ferrule 702 facing the optical emitting component 400 is inclined to prevent the optical transmission signal from returning to the interior of the optical emitting component 400 along its original path.

[0156] One end of the housing 701 is disposed inside the second tube shell 402 , and the other end is disposed outside the second tube shell 402 . The non-cylindrical lens 700 b is connected to the end of the housing 701 disposed inside the second tube shell 402 .

[0157] In some embodiments of the present disclosure, a portion of the optical signal emitted by the optical emitting component 400 may return to the optical emitting component 400 along the original path, thereby affecting the optical signal quality of the optical emitting component 400. Therefore, an optical isolator 700a is provided inside the second tube shell. The optical isolator 700a allows the optical signal emitted by the optical emitting component 400 to pass in one direction, and does not allow the emitted optical signal to return to the interior of the optical emitting component 400 along the original path.

[0158] In some embodiments of the present disclosure, the optical isolator 700a is positioned near the end face of the optical fiber ferrule within the optical fiber adapter 700. When the optical isolator is positioned near the end face of the optical fiber ferrule, the light beam is focused on the optical fiber ferrule, resulting in a narrower light spot. This reduces the beam aperture, allowing the size of the optical isolator to be smaller, thereby reducing the cost of the optical isolator. If the optical isolator is not positioned within the optical fiber adapter 700 but within the second tube shell 402, light blocking issues may occur, causing the light beam to deflect outside the isolator, thereby reducing the light transmission power. In this case, the size of the optical isolator is relatively large, increasing the cost of the optical isolator. Therefore, the present disclosure connects the optical isolator 700a to the end face of the optical fiber ferrule, thereby reducing the size of the optical isolator 700a and reducing the cost of the optical isolator.

[0159] In some embodiments, when the optical isolator 700a is disposed within the fiber optic adapter 700, the dimensions of the optical isolator 700a are a first dimension. In some embodiments, when the optical isolator 700a is disposed outside the fiber optic adapter 700, that is, within the second housing 402, the dimensions of the optical isolator 700a are a second dimension. A collimating lens is disposed within the second housing 402. The collimating lens collimates the light beam emitted by the light emitting component to generate a collimated light beam, which is then converged by a converging lens to generate a converged light beam. When the optical isolator 700a is disposed within the second housing 402, the optical isolator 700a is located between the collimating lens and the converging lens. Due to the larger diameter of the collimated light beam, the second dimension is greater than the first dimension. For example, the first dimension is smaller than the inner diameter of the fiber optic adapter 700, and the second dimension is greater than the inner diameter of the fiber optic adapter 700.

[0160] In some embodiments, when the optical isolator 700a is disposed within the fiber optic adapter 700, the back working distance of the converging lens should be greater than the optical path length of the optical isolator 700a. The back working distance of the converging lens refers to the distance between the back surface of the converging lens and the focal point of the converging light beam emitted by the converging lens. The "back surface of the converging lens" refers to the surface from which the converging light beam is emitted. The optical path length of the optical isolator 700a refers to the thickness of the optical isolator 700a along the length of the fiber optic adapter 700.

[0161] The converging lens can be a cylindrical lens or a non-cylindrical lens. Cylindrical lenses include spherical lenses (conventional lenses, C-lens), which are cylindrical optical lenses with spherical end faces that focus light beams by relying on the curvature of their spherical surfaces. Non-cylindrical lenses 700b include Fresnel lenses, also known as threaded lenses. Fresnel lenses are mostly made of thin sheets of polyolefin material injection-molded, but some are made of glass. One side of the lens surface is smooth, and the other side is engraved with concentric circles from small to large. From a cross-section of the Fresnel lens, its surface is composed of a series of sawtooth-shaped grooves, with an elliptical arc at the center. Each groove has a different angle with the adjacent grooves, but all concentrate the light to form a central focus, which is also the focus of the lens. Each groove can be regarded as an independent small lens that adjusts the data light into a concentrated light.

[0162] The non-cylindrical lens 700b, such as a Fresnel lens, includes a functional surface and a non-functional surface. The functional surface is a surface with concentric circles from small to large; the non-functional surface is a smooth surface. The non-functional surface is connected to the end surface of the housing 701 near the interior of the light emitting component 400.

[0163] The back working distance of a non-cylindrical lens is greater than that of a cylindrical lens and is also greater than the optical path length of the optical isolator 700a. For example, the optical path length of the optical isolator 700a is approximately 1 mm, while the back working distance of a cylindrical lens, such as a C-lens, is approximately 0.4 mm. Therefore, the back working distance of a cylindrical lens is not compatible with the optical path length of the optical isolator 700a. Therefore, when the optical isolator is positioned within a fiber optic adapter, a cylindrical lens cannot be used as the converging lens. However, the back working distance of a non-cylindrical lens, such as a Fresnel lens, is approximately 1.35 mm. Therefore, the back working distance of a non-cylindrical lens is compatible with the optical path length of the optical isolator 700a and is greater than the optical path length of the optical isolator 700a.

[0164] Therefore, in some embodiments of the present disclosure, the converging lens is a non-cylindrical lens 700 b .

[0165] Figure 29 illustrates an assembly diagram of a fiber optic adapter and a Fresnel lens, according to some embodiments of the present disclosure. As shown in Figure 29, a non-cylindrical lens 700b is connected to the end face of the housing 701. For example, the non-cylindrical lens 700b is connected to the end face of the housing 701 near the light emitting component 400. The non-cylindrical lens 700b converges the light beam emitted by the light emitting component to form a converged beam.

[0166] In some embodiments of the present disclosure, due to the small size of the optical isolator 700a, a gap is provided between the non-cylindrical lens 700b and the optical isolator 700a to allow the converged light beam emitted by the non-cylindrical lens 700b to enter the interior of the optical isolator 700a. After the converged light beam emitted from the non-cylindrical lens 700b transmits through the air in the gap, the diameter of the converged light beam is reduced, so that the diameter of the converged light beam after passing through the gap is less than or equal to the effective optical aperture of the optical isolator 700a. Consequently, after the converged light beam is emitted from the non-cylindrical lens 700b, it enters the optical isolator 700a, thereby increasing the light transmission power. The effective optical aperture of the optical isolator 700a is the effective optical diameter, which is the diameter of the light beam that the optical isolator allows to pass through.

[0167] The length of the gap between the non-cylindrical lens 700b and the optical isolator 700a must satisfy the following requirement: the beam diameter of the convergent light beam emitted by the non-cylindrical lens 700b after passing through the gap is not larger than the effective aperture of the optical isolator 700a.

[0168] The axial length of the non-cylindrical lens 700b is smaller than that of the cylindrical lens, where "axial length" refers to the length along the length direction of the optical fiber adapter 700; therefore, the non-cylindrical lens 700b, like the Fresnel lens, is thinner and can be well coupled to the end face of the optical fiber adapter, reducing the coupling difficulty; and the coupling connection between the two is an optical coupling connection, not a mechanical coupling connection, which can increase the coupling accuracy between the two.

[0169] In some embodiments, multiple lenses are disposed inside the second tube shell 402 . When the converging lens is fixed by a passive patch, the tolerance of the passive patch is large, thereby reducing the coupling efficiency of the converging lens.

[0170] In some embodiments, a mounting hole is provided inside the fiber optic adapter 700, a cylindrical lens is disposed in the mounting hole, and then the cylindrical lens is coupled to the fiber optic adapter 700. When the C-lens lens is disposed inside the fiber optic adapter 700, due to its cylindrical shape, a portion of the C-lens lens protrudes relative to the fiber optic adapter 700, thereby occupying a large space in the second tube shell and easily interfering with other structures inside the second tube shell, thereby reducing coupling efficiency. Moreover, during coupling, the end face of the C-lens lens is likely to collide with the inner wall of the second tube shell, causing damage to the C-lens lens. At the same time, due to the tolerance of the C-lens lens and the tolerance of the fiber optic adapter 700, the C-lens lens has a certain degree of deflection relative to the fiber optic adapter 700, thereby reducing coupling efficiency.

[0171] In some embodiments of the present disclosure, by coupling a non-cylindrical lens 700b such as a Fresnel lens with a fiber optic adapter 700, the patch tolerance of the lens is reduced, the patch accuracy is improved, and the coupling efficiency of the non-cylindrical lens 700b is improved.

[0172] In some embodiments of the present disclosure, a non-cylindrical lens 700 b such as a Fresnel lens may be pre-coupled with the fiber adapter 700 to improve patch accuracy and thereby improve coupling efficiency of the non-cylindrical lens 700 b.

[0173] In some embodiments of the present disclosure, the inner diameter of the end surface of the through hole 4021 close to the light emitting component 400 is smaller than the inner diameter of the end surface away from the light emitting component 400, and a placement end surface 4022 is formed on the end surface close to the light emitting component 400, and the non-cylindrical lens 700b is connected to the placement end surface 4022. That is, the non-cylindrical lens 700b is disposed at the placement end surface 4022, and the non-cylindrical lens 700b and the placement end surface 4022 are abutted together; illustratively, the non-cylindrical lens 700b is disposed at the placement end surface 4022 away from the inner wall of the second tube shell 402, thereby realizing the connection between the non-cylindrical lens 700b and the second tube shell 402.

[0174] In some embodiments of the present disclosure, the non-cylindrical lens 700b is connected to the outer shell 701 of the optical fiber adapter 700. For example, the non-cylindrical lens 700b is connected to the end face of the outer shell 701 close to the interior of the second tube shell 402; the inner diameter of the non-cylindrical lens 700b is equal to the inner diameter of the end face of the outer shell 701 close to the interior of the second tube shell 402; in some embodiments, the non-cylindrical lens 700b and the end face of the outer shell 701 close to the interior of the second tube shell 402 are connected together by glue, thereby realizing the connection between the non-cylindrical lens 700b and the optical fiber adapter 700.

[0175] In some embodiments of the present disclosure, a limiting ring 703 is formed on the outer surface of the outer shell 701 of the optical fiber adapter 700; the limiting ring 703 is connected to the end face of the through hole 4021 away from the light emitting component 400. For example, the limiting ring 703 is bonded to the end face of the through hole 4021 away from the light emitting component 400, thereby realizing the connection between the optical fiber adapter 700 and the second tube shell 402.

[0176] In some embodiments of the present disclosure, the inner diameter of the end face of the through hole 4021 close to the light emitting component 400 is smaller than the inner diameter of the end face away from the light emitting component 400, the non-cylindrical lens 700b is connected to the end face of the through hole 4021 close to the light emitting component 400, and the limit ring 703 is connected to the end face of the through hole 4021 away from the light emitting component 400.

[0177] The optical module provided in the embodiment of the present disclosure includes a circuit board, a light emitting component and an adapter assembly; the light emitting component includes a second tube shell, the end of the second tube shell has a through hole, and the adapter assembly is connected to the through hole; the adapter assembly includes a fiber optic adapter, an optical isolator and a non-cylindrical lens; wherein, a fiber optic core is provided inside the fiber optic adapter; the optical isolator is arranged inside the fiber optic adapter and connected to the end face of the fiber optic core, and the size of the optical isolator is smaller than the inner diameter of the fiber optic adapter; the non-cylindrical lens is connected to the end face of the fiber optic adapter, and a gap is provided between the non-cylindrical lens and the optical isolator; the back working distance of the non-cylindrical lens is greater than the optical path length of the optical isolator, so that the optical isolator can be arranged inside the fiber optic adapter and connected to the end face of the fiber optic core; the non-cylindrical lens converges the light beam emitted by the light emitting component and generates a converged light beam, and the beam diameter of the converged light beam after passing through the gap is not greater than the effective light aperture of the optical isolator.

[0178] In the embodiment of the present disclosure, since the optical isolator is arranged inside the optical fiber adapter, a non-cylindrical lens is selected, and the rear working distance of the non-cylindrical lens is greater than the optical path length of the optical isolator; since the optical isolator is relatively small, the embodiment of the present disclosure provides a gap between the non-cylindrical lens and the optical isolator. In this way, after the non-cylindrical lens converges the light beam emitted by the light emitting component into a converged light beam, the aperture of the converged light beam passing through the gap is no greater than the effective light aperture of the optical isolator, and then the converged light beam exiting the non-cylindrical lens enters the optical isolator.

[0179] The disclosed embodiment couples a non-cylindrical lens with a fiber optic adapter, thereby reducing the tolerance of the lens patch and improving the lens coupling accuracy. At the same time, due to the small size of the non-cylindrical lens, it can be well coupled with the fiber optic adapter, reducing the difficulty of assembly and minimizing the space occupied by the second tube shell, thereby saving the space of the second tube shell.

Claims

1. An optical module, include: A circuit connection board, wherein a notch is formed at the end thereof, wherein the notch surface comprises a first side wall, a second side wall and a connection surface disposed between the first side wall and the second side wall; A light receiving component and / or a light emitting component; The light receiving component is electrically connected to the circuit connection board; The light receiving component comprises: A first tube shell, one end of which is provided with an avoidance hole, and a first step, a second step, a third step and a fourth step with increasing heights in sequence are formed on the bottom surface of the first tube shell respectively, so as to arrange different optical elements, wherein the avoidance hole is configured to allow the circuit connection board to extend into the first tube shell until the notch wraps around the outer periphery of the second step; and the first step is configured to support the circuit connection board; Light receiving chips are arranged on the second step surface in the form of an array, and the light receiving chips are electrically connected to the first side wall or to the surface of the second side wall; A TIA is disposed on the second step surface, disposed between the connection surface and the light receiving chip, the TIA is electrically connected to the light receiving chip, and the TIA is electrically connected to the surface of the connection surface; The light emitting component comprises a second tube shell, and a through hole is formed on the end surface of the second tube shell; an adapter assembly connected to the through hole; The adapter assembly comprises: Optical fiber adapter, with an optical fiber ferrule inside; An optical isolator is disposed inside the optical fiber adapter and connected to the end face of the optical fiber ferrule, wherein the size of the optical isolator is smaller than the inner diameter of the optical fiber adapter; The non-cylindrical lens is connected to the end face of the optical fiber adapter, and a gap is provided between the non-cylindrical lens and the optical isolator.

2. The optical module according to claim 1, in, The light receiving component also includes: An optical demultiplexing component is disposed on the surface of the fourth step, and the optical demultiplexing component is configured to decompose the optical signal transmitted to the first tube shell into multiple optical signals; A lens is disposed on the surface of the third step, and the lens is configured to converge multiple light signals respectively; a reflector, arranged in the light emitting direction of the lens, the reflector is located above the second step, the reflector comprises a light incident surface, an inclined surface, and a light emitting surface, the light incident surface faces the lens, the inclined surface is configured to reflect the light signal transmitted from the lens, and the light emitting surface faces the second step; The light receiving chip faces the reflector, and a preset distance is formed between the surface of the light receiving chip and the light emitting surface of the reflector to meet the working distance of the lens; the light receiving chips are arranged in an array to receive each light signal reflected by the reflector and convert the light signal into an electrical signal; wherein the focal length of the lens is such that the light signal transmitted from the lens is reflected by the reflector and then focused on the surface of the light receiving chip; The TIA has a surface flush with the surface of the circuit connection board; The second step has a preset height so that the TIA surface is flush with the circuit connection board surface; the third step has a preset height to meet the working distance of the lens and make the optical axis of the lens and the optical axis of the optical demultiplexing component on the same axis; the fourth step has a preset height so that the optical axis of the optical demultiplexing component and the optical port of the optical module are on the same axis.

3. The optical module according to claim 2, in, The lens includes a first lens, the reflector includes a first reflector, and a first inclined surface is formed on a surface of the first reflector; The light emitting surface of the first lens is connected to the light incident surface of the first reflector by optical glue.

4. The optical module according to claim 3, in, The bottom surface of the first lens and the bottom surface of the reflector are on the same surface; Or, the bottom surface of the first lens is lower than the bottom surface of the reflector to prevent glue from overflowing to the bottom surface of the reflector when the first lens is attached; Alternatively, the bottom surface of the first lens is higher than the bottom surface of the reflector, so as to increase the distance between the reflector and the light receiving chip.

5. The optical module according to claim 3, in, The light incident surface of the first lens is a curved surface, and the light emitting surface is a flat surface.

6. The optical module according to claim 2, in, The lens includes a second lens, the reflector includes a second reflector, a second inclined surface is formed on the surface of the second reflector; the second lens is separately arranged from the second reflector; A first supporting protrusion and a second supporting protrusion are respectively formed at the interface between the second step and the third step, and the first supporting protrusion and the second supporting protrusion are used to support the second reflector; The first supporting protrusion and the second supporting protrusion have preset heights respectively, so that the central axis of the second inclined surface and the optical axis of the second lens are on the same axis.

7. The optical module according to claim 6, in, A first clamping groove is formed on the surface of the first supporting protrusion, and a second clamping groove is formed on the surface of the second supporting protrusion; The first clamping groove and the second clamping groove are respectively clamped on both sides of the interface between the second step and the third step.

8. The optical module according to claim 6, in, The dimension of a first reflector among the reflectors along the height direction of the first tube shell is greater than the dimension of a second reflector among the reflectors along the height direction of the first tube shell; The distance from the first reflector to the corresponding light receiving chip is smaller than the distance from the second reflector to the corresponding light receiving chip.

9. The optical module according to claim 6, in, Surfaces of the first supporting protrusion and the second supporting protrusion are higher than a surface of the third step.

10. The optical module according to claim 1, in, The light receiving chip is electrically connected to a pad on the surface of the first side wall or the second side wall; The TIA is electrically connected to the pads on the surface of the connection surface.

11. The optical module according to claim 1, in, The circuit connection board is the circuit board of the optical module; or, the circuit connection board is a flexible circuit board, one end of the flexible circuit board extends into the first tube shell, and the other end is electrically connected to the circuit board of the optical module; or, the circuit connection board is a printed circuit board, one end of the printed circuit board extends into the first tube shell, and the other end is electrically connected to the circuit board of the optical module; or, the circuit connection board is a ceramic connection board, one end of the ceramic connection board extends into the first tube shell, and the other end is electrically connected to the circuit board of the optical module through a flexible circuit board.

12. The optical module according to claim 1, in, The optical module also includes a circuit board; the light emitting component is electrically connected to the circuit board, and a laser array, a lens array and an optical multiplexing component are respectively arranged inside the light emitting component; The rear working distance of the non-cylindrical lens is greater than the optical path length of the optical isolator, so that the optical isolator is arranged inside the optical fiber adapter and connected to the end face of the optical fiber ferrule; The non-cylindrical lens is used to converge the light beam emitted by the light emitting component and generate a converged light beam, and the beam diameter of the converged light beam after passing through the gap is less than or equal to the effective light aperture of the optical isolator.

13. The optical module according to claim 12, in, The optical fiber adapter comprises a housing; One end of the housing is disposed inside the second tube shell, and the other end is disposed outside the second tube shell; The non-cylindrical lens is connected to one end of the outer shell disposed inside the second tube shell.

14. The optical module according to claim 13, in, The non-cylindrical lens includes a functional surface and a non-functional surface; The functional surface is formed with concentric circles, and the non-functional surface is a smooth surface; The non-functional surface is connected to one end of the outer shell disposed inside the second tube shell.

15. The optical module according to claim 14, in, The rear working distance of the non-cylindrical lens is the axial distance between the non-functional surface and the beam focus formed by the convergent light beam after passing through the gap; The optical path length of the optical isolator is the thickness of the optical isolator along the length direction of the optical fiber adapter.

16. The optical module according to claim 1, in, The back working distance of the non-cylindrical lens is greater than the back working distance of the cylindrical lens; The axial length of the non-cylindrical lens is smaller than the axial length of the cylindrical lens.

17. The optical module according to claim 1, in, An inner diameter of the through hole close to the interior of the light emitting component is smaller than an inner diameter of the through hole far from the interior of the light emitting component.

18. The optical module according to claim 12, in, The length of the gap satisfies that the beam diameter of the convergent light beam after passing through the gap is less than or equal to the effective light aperture of the optical isolator.

19. The optical module according to claim 1, in, The non-cylindrical lens is configured as a Fresnel lens.

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