Waveguide converter, package for mounting electronic component, and waveguide conversion device

Abstract

The waveguide converter includes a first substrate, a signal conductor, a first ground conductor, a first frame, a second ground conductor, and a first cover. The first substrate has a first upper surface including a first region and a second region extending from the first region. The signal conductor has a conversion section located in the first region, and a line section connected to the conversion section and disposed so as to extend from at least the first region to the second region. The first ground conductor is disposed in a second region of the first upper surface so as to sandwich the line section in plan view. The first frame body is provided with a second upper surface and an inner side surface connected with the second upper surface. The first frame is disposed on the first upper surface and surrounds at least a portion of the first region and the second region in plan view. The second grounding conductor is located on the second upper surface. The first cover is disposed on the second upper surface and covers the first region in plan view.

Description

Technical Field

[0001] The present disclosure relates to a waveguide converter, an electronic component mounting package, and a waveguide converter device. Background Art

[0002] As wireless communication is required to be faster and larger in capacity, the frequency band used for wireless communication is becoming higher and higher, and therefore the frequency of the signals to be processed by wireless devices is also becoming higher and higher.

[0003] As a transmission medium that can efficiently transmit such high-frequency signals, a waveguide can be cited. However, since a waveguide cannot be directly connected to an integrated circuit mounted on a circuit substrate, a structure in which a microstrip line is installed between the integrated circuit and the waveguide is widely used. When such a structure is adopted, a converter is required for converting signals between the waveguide and the microstrip line.

[0004] As such a converter, the invention described in Patent Document 1 is known. The invention described in Patent Document 1 comprises a waveguide / planar circuit conversion substrate and a frame having a waveguide, wherein the waveguide / planar circuit conversion substrate comprises a ground layer and a dielectric substrate on which a signal line for propagating a high-frequency signal is formed, and a short cover is disposed on the upper surface of the waveguide / planar circuit conversion substrate (for example, see Patent Document 1). Figure 1 wait).

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2004-96206 Summary of the invention

[0008] A waveguide converter (1) according to one embodiment of the present disclosure comprises a first substrate, a signal conductor, a first ground conductor, a first frame, a second ground conductor and a first cover. The first substrate comprises a first upper surface including a first region and a second region extending from the first region. The signal conductor comprises a conversion portion located in the first region, and a line portion connected to the conversion portion and arranged to extend at least from the first region to the second region. The first ground conductor is arranged to sandwich the line portion in at least the second region of the first upper surface when viewed from above. The first frame comprises a second upper surface and an inner side surface connected to the second upper surface. The first frame is arranged on the first upper surface and surrounds at least a portion of the first region and the second region when viewed from above. In addition, the first frame is made of a non-metallic material. The second ground conductor is located on the second upper surface. The first cover is arranged on the second upper surface and covers the first region when viewed from above. The first cover is made of a metal material. The first frame also comprises a first end and a second end arranged to face each other with the second region sandwiched therebetween when viewed from above. The first ground conductor and the second ground conductor are electrically connected to the first cover.

[0009] (2) The waveguide converter of (1) above further includes a second frame body made of a non-metallic material. The second frame body is located on the second upper surface and is arranged to surround at least a portion of the first region on the outer side than the inner side surface when viewed from above. When the direction in which the line portion extends when viewed from above is set as the first direction and the direction intersecting the first direction is set as the second direction, the second frame body has a third end and a fourth end that are arranged to face each other in the second direction when viewed from above.

[0010] (3) In the waveguide converter of (2) above, a distance between the first end and the second end in the second direction is less than or equal to a distance between the third end and the fourth end in the second direction.

[0011] (4) In the waveguide converter of (1) to (3) above, the first cover has a first surface disposed opposite to the first region. When viewed in cross section intersecting the first upper surface, a distance from the conversion portion to the first surface is greater than 1 / 13.12 and less than 1 / 9.85 of a wavelength λ of a signal transmitted in the signal conductor.

[0012] (5) In the waveguide converter of (1) to (4) above, the first cover has a second surface arranged to overlap the second upper surface, and a first recessed portion having a first opening on the second surface. When viewed from above, the area of ​​the first opening is less than the area of ​​the first region.

[0013] (6) In the waveguide converter of (1) to (4) above, the first cover has a second surface arranged to overlap with the second upper surface, and a first recessed portion having a first opening on the second surface. The first recessed portion has a first surface.

[0014] (7) In the waveguide converter of (1) to (6) above, the first upper surface has a third region, which is connected to the second region and is arranged separately from the first region. The first frame also has a fifth end and a sixth end that are arranged opposite to each other with the third region sandwiched therebetween when viewed from above. The second region is located between the first region and the third region when viewed from above. When the direction in which the line portion extends is set as the first direction and the direction intersecting the first direction is set as the second direction when viewed from above, the distance between the first end and the second end in the second direction is less than the distance between the fifth end and the sixth end in the second direction.

[0015] (8) In the waveguide converter of (2) to (7) above, the line portion has a first portion. The first portion is disposed apart from the converter portion in a plan view. The dimension of the first portion in the second direction is the maximum dimension of the line portion in the second direction.

[0016] (9) In the waveguide converter of (8) above, a distance in the first direction from the conversion section to the first section is not less than 5 / 8 and not more than 7 / 8 of a wavelength λ of a signal propagating in the signal conductor in a plan view.

[0017] (10) In the waveguide converter of (8) above, in a plan view, a distance in the first direction from the conversion section to the first section is not less than 1 / 8 and not more than 3 / 8 of a wavelength λ of a signal propagating in the signal conductor.

[0018] (11) In the waveguide converter of (8) to (10) above, the second surface has a first side arranged to overlap with the second region in plan view, and at least a portion of the first portion is arranged to overlap with the first side in plan view.

[0019] (12) In the waveguide converters of (1) to (11) above, when the direction in which the line portion extends is set as a first direction and the direction intersecting the first direction is set as a second direction in a plan view, the conversion portion includes a second portion connected to the line portion. The line portion includes a third portion connected to the second portion. The dimension of the conversion portion in the second direction is larger than the dimension of the third portion in the second direction. The dimension of the second portion in the second direction decreases as it moves outward along the first direction.

[0020] (13) An electronic component mounting package according to one embodiment of the present disclosure comprises a second substrate, the waveguide converter of (1) to (12) above, and a third frame. The second substrate comprises a third upper surface, a third lower surface opposite to the third upper surface, and a through hole. The through hole penetrates the third lower surface from the third upper surface. The waveguide converter of (1) to (12) above is arranged on the third upper surface and overlaps with the through hole when viewed from above. The third frame is bonded to the third upper surface and is arranged so as to surround the waveguide converter.

[0021] (14) In the electronic component mounting package of (13) above, the second substrate further has a second recess including a second opening on the third upper surface. The second recess has a through hole. The waveguide converter of (1) to (12) above is located in the second recess. The first substrate has a second side and a third side connected to the second side via a first corner when viewed from above. The second opening has a fourth side and a fifth side connected to the fourth side via a second corner when viewed from above. The second side contacts at least a portion of the fourth side.

[0022] The third side contacts at least a portion of the fifth side.

[0023] (15) A waveguide conversion device according to an embodiment of the present disclosure comprises the electronic component mounting package described in (13) or (14), an electronic component, a second cover, and a waveguide. The electronic component is located on the third upper surface of the second substrate and is electrically connected to the waveguide converter of the electronic component mounting package. The second cover is located on the third frame and is configured to cover the interior of the electronic component mounting package. The waveguide is located on the third lower surface side of the second substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is an exploded perspective view of a waveguide converter according to one embodiment of the present disclosure.

[0025] Figure 2 This is a perspective view of a waveguide converter according to one embodiment of the present disclosure.

[0026] Figure 3 This is a perspective view of a waveguide converter according to an embodiment of the present disclosure as viewed from another angle.

[0027] Figure 4 yes Figure 2 The Z1-Z1 cross-sectional view of the waveguide converter is shown.

[0028] Figure 5 yes Figure 4 An enlarged view of the main part A is shown.

[0029] Figure 6 1 is a top view of a waveguide converter without a first cover according to an embodiment of the present disclosure.

[0030] Figure 7 yes Figure 6 An enlarged view of the main part B is shown.

[0031] Figure 8 1 is a top view of a first frame body according to an embodiment of the present disclosure.

[0032] Fig. 9 1 is a top view of a second frame body according to an embodiment of the present disclosure.

[0033] Fig.10 It is a perspective view of a first cover body according to one embodiment of the present disclosure.

[0034] Fig.11 It is an exploded perspective view of a waveguide conversion device according to one embodiment of the present disclosure.

[0035] Fig.12 It is a graph showing the reflection characteristics of the waveguide converters of Example 1, Example 2, and Example 3.

[0036] Fig.13It is a graph showing the transmission characteristics of the waveguide converters of Example 1, Example 2, and Example 3.

[0037] Fig.14 It is a graph showing the reflection characteristics of the waveguide converters of Example 1 and Example 4.

[0038] Fig.15 It is a graph showing the transmission characteristics of the waveguide converters of Example 1 and Example 4.

[0039] Fig.16 It is a graph showing the reflection characteristics of the waveguide converters of Example 1, Example 5 and Example 6. DETAILED DESCRIPTION

[0040] <Structure of waveguide converter>

[0041] Hereinafter, an exemplary embodiment of the present disclosure will be described with reference to the accompanying drawings. In addition, any direction of the waveguide converter can be set to the top or the bottom, but for convenience, an orthogonal coordinate system xyz is defined, and the positive side of the z direction is set to the top. In the present disclosure, the first direction refers to, for example, the x direction mentioned in the accompanying drawings. The second direction intersecting the first direction refers to, for example, the y direction mentioned in the accompanying drawings. In the present disclosure, the outside refers to, for example, a direction away from the first area 1a1 described later in the x direction or the y direction. In addition, in the present disclosure, the top view is a concept that includes plane perspective.

[0042] Reference Figures 1 to 10 A waveguide converter 101 according to an embodiment of the present disclosure will be described. The waveguide converter 101 includes a first substrate 1 , a signal conductor S1 , a first ground conductor G1 , a first frame body 2 , a second ground conductor G2 , and a first cover body 4 .

[0043] like Figure 1 and Figure 6 As shown, the first substrate 1 has a first upper surface 1a including a first region 1a1 and a second region 1a2 extending from the first region 1a1. The first substrate 1 is made of, for example, a non-metallic material. As the material of the first substrate 1, for example, a ceramic material such as an alumina sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, or a silicon nitride sintered body, or a non-metallic material such as a glass ceramic material can be used. In addition, the first substrate 1 can also use a printed substrate such as a copper-clad laminate.

[0044] The first substrate 1 may be a single-layer structure of a non-metallic material or a structure of a plurality of layers of non-metallic materials. The first substrate 1 is, for example, rectangular in plan view, with a size of 4 mm×4 mm to 50 mm×50 mm and a thickness of 0.05 mm to 1 mm.

[0045] Although not shown, one or more through holes may be provided in the first substrate 1. The via can be produced by providing a hole having the shape of a through hole in the first substrate 1 and filling the hole with a conductor paste containing high melting point metal powder such as tungsten or molybdenum.

[0046] Furthermore, if Figure 3 As shown, the first substrate 1 has a first lower surface 1b. In addition, a third grounding conductor G3 may be provided on the first lower surface 1b. The third grounding conductor G3 may also be an annular metal layer arranged in a manner to surround the first area 1a1 when viewed from above. The third grounding conductor G3 may also be electrically connected to the first grounding conductor G1 described later through the above-mentioned through hole or the like. Since the third grounding conductor G3 is located on the first lower surface 1b, the grounding potential of the signal conductor S1 can be enhanced, and it can have the function of a conductor wall that is electromagnetically connected to the waveguide 107 described later.

[0047] The first frame 2 has a second upper surface 2a and an inner side surface 2c connected to the second upper surface 2a. The first frame 2 is arranged on the first upper surface 1a, and surrounds at least a part of the first area 1a1 and the second area 1a2 in a plan view. The first frame 2 also has a first end 21 and a second end 22 arranged to face each other with the second area 1a2 sandwiched therebetween in a plan view. In addition, the first frame 2 is made of a non-metallic material. The material of the first frame 2 may be the same as or different from the material of the first substrate 1, and for example, the same material as the material of the first substrate 1 can be cited. When the materials of the first substrate 1 and the first frame 2 are ceramic materials or glass ceramic materials, raw sheets formed into the outer shapes of the first substrate 1 and the first frame 2 can be stacked for manufacturing, so the waveguide converter 101 can be easily manufactured. The first frame 2 is, for example, in a U-shape in a plan view, with a size of 4 mm×4 mm to 50 mm×50 mm and a thickness of 0.1 mm to 5 mm.

[0048] Since the first frame body 2 is located on the first upper surface 1 a of the first substrate 1 , the possibility of damage to the first substrate 1 can be reduced, and the thickness of the first substrate 1 can be reduced, thereby obtaining good high-frequency characteristics.

[0049] In addition, a through hole may be provided in the first frame body 2 similarly to the first substrate 1. The through hole makes it easy to electrically connect the first ground conductor G1, the second ground conductor G2 and the first cover body 4 described later. In addition, the through hole can be formed by the same method as the through hole provided in the first substrate 1 described above.

[0050] The signal conductor S1 has a conversion portion S11 located in the first area 1a1, and a line portion S12 connected to the conversion portion S11 and arranged to extend at least from the first area 1a1 to the second area 1a2. As the material of the signal conductor S1, for example, metal materials such as gold, silver, copper, nickel, tungsten, molybdenum and manganese can be cited. In addition, the signal conductor S1 can be formed by sintering a metal paste on the first upper surface 1a of the first substrate 1, or it can be formed using a thin film forming technique such as an evaporation method or a sputtering method. An insulating film such as a ceramic (such as an alumina coating) or a resin can also be located on a portion of the signal conductor S1. The insulating film can be provided on the signal conductor S1 by screen printing. In addition, the insulating film can also be located only on a portion of the conversion portion S11 or the line portion S12. With such a structure, the possibility of a short circuit between the signal conductor S1 and the first grounding conductor G1 described later can be reduced.

[0051] Although not shown, the signal conductor S1 can also be electrically connected to the electronic component 104 described later via a connecting member such as a wire mainly composed of a conductive metal material such as platinum. The signal conductor S1 is, for example, a transmission line suitable for transmitting high-frequency signals such as millimeter waves. The signal transmitted in the line portion S12 is electromagnetically coupled to the waveguide 107 described later in the conversion portion S11.

[0052] The first grounding conductor G1 is arranged to sandwich the line portion S12 when viewed from above, at least in the second area 1a2 of the first upper surface 1a. The material of the first grounding conductor G1 may be the same as or different from that of the signal conductor S1. For example, the same material as that of the signal conductor S1 may be mentioned. In addition, the first grounding conductor G1 may be formed using the same method as the signal conductor S1. In one embodiment, the signal conductor S1 and the first grounding conductor G1 are also located in the third area 1a3 described later, and the first grounding conductor G1 is also arranged to sandwich the line portion S12 in the third area 1a3 when viewed from above. Since the signal conductor S1 is arranged to be sandwiched by the first grounding conductor G1, the ground potential can be strengthened and the electric field coupling can be enhanced. Therefore, when the signal conductor S1 transmits a high-frequency signal, the possibility of resonance caused by the expansion of the electric field distribution beyond the expected range can be reduced.

[0053] Furthermore, the first ground conductor G1 need not necessarily be arranged across the line portion S12 in the third region 1a3 in a plan view. Alternatively, the first ground conductor G1 may be a pair of separate metal films provided on the first upper surface 1a so as to sandwich the signal conductor S1.

[0054] In addition, the first ground conductor G1 can be electrically connected to an electronic component 104 described later via a connection member such as a wire, similarly to the signal conductor S1.

[0055] The second ground conductor G2 is located on the second upper surface 2a. The material of the second ground conductor G2 may be the same as or different from that of the signal conductor S1. For example, the material may be the same as that of the signal conductor S1. The second ground conductor G2 may also be formed by the same method as that of the signal conductor S1. By providing the second ground conductor G2, the first cover body 4 described later can be easily joined to the first frame body 2.

[0056] In one embodiment, if Figure 1 As shown, the second grounding conductor G2 is continuously arranged from the second upper surface 2a to the inner side surface 2c of the first frame body 2. Although not shown, the second grounding conductor G2 can also be continuously located on the surface of the first frame body 2 opposite to the second upper surface 2a (the surface facing the first upper surface 1a). As a result, the first grounding conductor G1, the second grounding conductor G2 and the first cover body 4 can be easily electrically connected. In addition, since the grounding potential can be strengthened, the signal loss generated when the signal conductor S1 transmits a high-frequency signal can be reduced. In addition, in the case where the second grounding conductor G2 is continuously arranged from the second upper surface 2a to the inner side surface 2c, it can be regarded as a disguised, so-called back short-circuit block (in other words, conductor block) by being electrically connected to the first cover body 4 described later. In other words, the first frame body 2 and the first cover body 4 can be regarded as an integrated cover body.

[0057] like Figure 1 and Figure 2 As shown, it is arranged on the second upper surface 2a, and the first cover body 4 covers the first area 1a1 when viewed from above. In addition, the first cover body 4 is made of a metal material. The first cover body 4 is, for example, a quadrilateral when viewed from above, with a size of 1mm×1mm~50mm×50mm and a thickness of 0.2mm~20mm. The material of the first cover body 4 may include, for example, metal materials such as iron, copper, nickel, chromium, cobalt, molybdenum or tungsten, or alloys obtained by combining a plurality of these metal materials. By subjecting an ingot of such a metal material to metal processing methods such as rolling processing and punching processing, it is possible to produce a metal component constituting the first cover body 4. The first cover body 4 can efficiently inject the signal transmitted in the signal conductor S1 into the waveguide 107. In addition, the signal propagating in the waveguide 107 can be efficiently injected into the signal conductor S1.

[0058] The first cover body 4 can be bonded to the first frame body 2 and the second ground conductor G2 using a bonding material.

[0059] The first grounding conductor G1, the second grounding conductor G2, and the first cover body 4 are electrically connected. In one embodiment, the first grounding conductor G1, the second grounding conductor G2, and the first cover body 4 are electrically connected through a through hole provided in the first frame body 2 and the first grounding conductor G2 extended to the inner side surface 2c. Thus, the grounding potential can be strengthened. In addition, as long as the first grounding conductor G1, the second grounding conductor G2, and the first cover body 4 can be electrically connected, it is not limited to the above embodiment.

[0060] like Figure 1 to Figure 3 and Figure 6 As shown, the waveguide converter 101 may also have a second frame body 3 made of a non-metallic material. The second frame body 3 is arranged on the second upper surface 2a, and surrounds at least a portion of the first area 1a1 at a position closer to the outside than the inner side surface 2c when viewed from above. The second frame body 3 has a third end 33 and a fourth end 34 arranged to face each other in the y direction when viewed from above. By having the structure as described above, the first cover body 4 can be joined to the first frame body 3 while abutting against the second frame body 3, so the first cover body 4 can be joined to the first frame body 3 with high precision. That is, the second frame body 3 has the function of a guide for positioning when joining the first cover body 4.

[0061] The material of the second frame 3 may be the same as or different from that of the first frame 2. For example, the same material as that of the first frame 2 may be used. When the materials of the first substrate 1, the first frame 2, and the second frame 3 are ceramic materials or glass ceramic materials, the waveguide converter 101 can be manufactured by stacking green sheets formed into the outer shapes of the first substrate 1, the first frame 2, and the second frame 3. For example, the second frame 3 is U-shaped when viewed from above, with a size of 4 mm×4 mm to 50 mm×50 mm and a thickness of 0.1 mm to 5 mm. When the second frame 3 is mainly composed of ceramic materials or glass ceramic materials, since the second frame 3 is U-shaped, the possibility of warping of the second frame 3 during sintering can be reduced.

[0062] Furthermore, as described above, the second frame body 3 may not be in a U-shape, but may be in an L-shape, a U-shape separated in the middle, or the like, as long as it can function as a guide for positioning when joining the first cover body 4 .

[0063] As described above, the second frame body 3 is arranged on the second upper surface 2a, and surrounds at least a portion of the first area 1a1 at a position closer to the outside than the inner side surface 2c when viewed from above. More specifically, when viewed from above, the inner edge of the second frame body 3 is located closer to the outside than the inner edge of the first frame body 2. Moreover, in one embodiment, when viewed from above, the distances between the three sides of the inner edge of the second frame body 3 and the three sides of the inner edge of the corresponding first frame body 2 are constant on the corresponding sides.

[0064] In addition, in one embodiment, the outer edge of the second frame body 3 coincides with the outer edges of the first substrate 1 and the first frame body 2 when viewed from above, but the outer edge of the second frame body 3 does not necessarily have to coincide with the outer edges of the first substrate 1 and the first frame body 2. That is, the outer edge of the second frame body 3 may be larger or smaller than the outer edges of the first substrate 1 and the first frame body 2.

[0065] like Figure 7 As shown, further, when the distance in the x direction from the outer edge of the first frame body 2 to the first end 21 and / or the second end 22 is set to Lx21, and the size in the x direction of the first end 21 and / or the second end 22 is set to Lx22, Lx22>Lx21 may be satisfied. With this structure, the area for mounting the cover body 4 can be expanded. Therefore, the cover body 4 can be stably located on the first frame body 2.

[0066] Furthermore, if Figure 8 As shown, in the first frame, the portion of the first frame that surrounds the second region 1a2 and is located on the opposite side of the first region 1a1 may satisfy (Lx21+Lx22)>Lx23 when the dimension in the x direction is Lx23. This structure allows the second frame 3 to be stably located on the first frame 2.

[0067] like Figure 6 to Figure 9 As shown, the distance L12 between the first end 21 and the second end 22 of the first frame 2 in the y direction ( Figure 8 ), which may be the distance L34 between the third end 33 and the fourth end 34 of the second frame 3 in the y direction ( Fig. 9 ) or less. With such a structure, when the first cover body 4 is joined to the first frame body 2, the first cover body 4 can be embedded from the opening side of the second frame body 3 (the portion sandwiched by the third end portion 33 and the fourth end portion 34), thereby facilitating the manufacture of the waveguide converter 101.

[0068] like Fig.10 As shown in FIG. 1 , the first cover 4 may also have a first surface 411 disposed opposite to the first area 1a1. In this case, Figure 4 and Figure 5 As shown, in the cross-sectional view intersecting the first upper surface 1a ( Figure 4 and Figure 5is a cross-sectional view in the xz plane), the distance H from the conversion portion S11 to the first surface 411 is greater than 1 / 13.12 and less than 1 / 9.85 of the signal wavelength λ transmitted in the signal conductor S1. The waveguide converter 101 in one embodiment is a waveguide converter device 10 for processing signals with a signal frequency in the 65 GHz to 87 GHz band, and each part is set so that the operating frequency band of the waveguide converter 101 is 65 GHz to 87 GHz. With the above structure, the insertion loss and reflection loss in the 65 GHz to 87 GHz band can be reduced.

[0069] Fig.12 Graph showing the reflection characteristics of the waveguide converter 101 when the distance H from the converter S11 to the first surface 411 is changed. The horizontal axis represents the frequency (GHz) of the input signal, and the vertical axis represents the reflection characteristics (dB). In the graph showing the reflection characteristics, the smaller the value of the reflection characteristics (dB), the smaller the reflection of the signal (described later). Fig.14 and Fig.16 The same is true in Fig.12 The graph shows the reflection characteristics of the waveguide converter 101 with the following three different values ​​of the distance H. The distance H of Example 1 is 0.35 mm (equivalent to 1 / 13.12 of the wavelength λ of a frequency of 65 GHz or 1 / 9.85 of the wavelength λ of a frequency of 87 GHz), the distance H of Example 2 is 1.154 mm (equivalent to 1 / 4 of the wavelength λ of a frequency of 65 GHz), and the distance H of Example 3 is 0.862 mm (equivalent to 1 / 4 of the wavelength λ of a frequency of 87 GHz). In Examples 2 and 3, the distance H from the conversion portion S11 to the first surface 411 is set to a distance from the conversion portion S11 called a stub (1 / 4 of the wavelength λ of the signal frequency transmitted in the signal conductor S1). Fig.12 In the figure, the reflection characteristics in each embodiment are represented by the solid line for embodiment 1, the dashed line for embodiment 2, and the dotted line for embodiment 3.

[0070] When referring to Fig.12 It can be seen that in the operating frequency band (65 GHz to 87 GHz) of the waveguide 101, Example 1 can obtain good characteristics compared with Examples 2 and 3.

[0071] Fig.13 Graph showing the transmission characteristics of the waveguide converter 101 when the distance H from the conversion portion S11 to the first surface 411 is changed. The horizontal axis represents the frequency (GHz) of the input signal, and the vertical axis represents the transmission characteristics (dB). In the graph showing the transmission characteristics, the larger the value of the transmission characteristics (dB), the smaller the signal loss (described later). Fig.15 The same is true in Fig.13The curve graph shows the passing characteristics of the waveguide converter 101 with the following three different values ​​of the distance H. The distance H of Example 1 is 0.35 mm (equivalent to the wavelength λ of a frequency of 65 GHz being set to 1 / 13.12 or 1 / 9.85 of the wavelength λ of a frequency of 87 GHz), the distance H of Example 2 is 1.154 mm (equivalent to 1 / 4 of the wavelength λ of a frequency of 65 GHz), and the distance H of Example 3 is 0.862 mm (equivalent to 1 / 4 of the wavelength λ of a frequency of 87 GHz). In Examples 2 and 3, the distance H from the conversion portion S11 to the first surface 411 is set to a distance from the conversion portion S11 that is previously called a stub (1 / 4 of the wavelength λ of the signal frequency transmitted in the signal conductor S1). Fig.12 In the figure, the passing characteristics of each embodiment are represented by embodiment 1 with a dashed line, embodiment 2 with a dotted line, and embodiment 3 with a dashed line.

[0072] When referring to Fig.13 It can be seen that in the operating frequency band (65 GHz to 87 GHz) of the waveguide 101, Example 1 obtains good characteristics compared with Examples 2 and 3.

[0073] like Fig.10 As shown, the first cover body 4 may also have: a second surface 412 arranged to overlap with the second upper surface 2a; and a first recessed portion 41 having a first opening 41O on the second surface 412. The first recessed portion 41 has a first surface 411. Since the first cover body 4 has the first recessed portion 41, the height of the back side short circuit (the distance H from the conversion portion S11 to the first surface 411) of the short stub formed from the conversion portion S11 can be adjusted with high precision.

[0074] The area of ​​the first opening 410 may be less than the area of ​​the first region 1a1. In one embodiment, in a plan view, the area of ​​the first opening 410 may be less than the area of ​​the first region 1a1, and the first opening 410 may be located inside the first region 1a1 in a plan view. With the above-described structure, since the bonding area between the first cover 4 and the first frame 3 is increased, the bonding strength between the first cover 4 and the first frame 3 can be improved.

[0075] Here, when the area of ​​the first opening 410 is smaller than the first region 1a1, as shown in FIG. Figure 4 and Figure 5 As shown, the portion of the first cover 4 surrounding the first opening 41O may protrude in the x direction. Here, the protruding portion is, for example, a portion indicated by Lx42. With this structure, the first region 1a1 can be easily overlapped with the first opening 41O in a plan view.

[0076] like Figure 6As shown, the first upper surface 1a may have a third region 1a3, which is connected to the second region 1a2 and is configured separately from the first region 1a1. Figure 8 As shown, the first frame body 2 further includes a fifth end 25 and a sixth end 26 which are arranged facing each other with the third region 1a3 sandwiched therebetween in a plan view. The second region 1a2 is located between the first region 1a1 and the third region 1a3 in a plan view. The distance L12 between the first end 21 and the second end 22 in the y direction is less than the distance L56 between the fifth end 25 and the sixth end 26 in the y direction. In this case, in the third region 1a3, the first ground conductor G1 and the signal conductor S1 are connected to the electronic component 104 described later by a connecting member such as a wire. With the above-mentioned structure, the third region 1a3 is larger than the second region 1a2 in the y direction in a plan view, so that the electronic component 104, the first ground conductor G1 and the signal conductor S1 can be easily connected by a connecting member such as a wire.

[0077] like Figure 7 As shown, the line portion S12 may also include a first portion S12a. The dimension Ls1 of the first portion S12a in the y direction is the maximum dimension of the line portion S12 in the y direction. That is, the dimension Ls1 of the first portion S12a in the y direction is greater than the dimension Ls4 of the portion of the line portion S12 other than the first portion S12a in the y direction. With the above-described structure, a capacitance component can be added to the line portion S12, and impedance can be adjusted. Therefore, in the signal conductor S1, high-frequency characteristics are improved, and the frequency band to which the waveguide converter 101 can be applied can be expanded.

[0078] Furthermore, by arranging the line portion S12 and the first ground conductor G1 arranged across the line portion S12 so as to be close to each other in the y direction, it is possible to easily add a capacitance component to the line portion S12. Therefore, the same effects as those in the above case can be achieved.

[0079] In one embodiment, the line portion S12 is configured to extend to the third area 1a3 in a plan view. The first portion S12a is configured to extend from the second area 1a2 to the third area 1a3 in a plan view. In addition, the first portion S12a may be located only in the second area 1a2 or only in the third area 1a3. In addition, the line portion S12 may also have a plurality of first portions S12a.

[0080] In addition, in one embodiment, the dimension Ls1 of the first portion S12a in the y direction is smaller than the dimension Ls11 of the conversion portion S11 in the y direction, but can be changed according to the frequency of the signal transmitted by the signal conductor S1. That is, the dimension Ls1 of the first portion S12a in the y direction can be larger than the dimension Ls11 of the conversion portion S11 in the y direction, or can be the same.

[0081] Fig.14 Graph showing the reflection characteristics of the waveguide converter 101 with and without the first portion S12a of the line portion S12. In Example 1, the first portion S12a is provided in the line portion S12, and in Example 4, the first portion S12a is not provided in the line portion S12. Fig.14 In the figure, the reflection characteristics in each embodiment are shown in FIG. 1 with a solid line and in FIG. 4 with a dotted line.

[0082] When referring to Fig.14 When compared with Example 4, the frequency band in which the reflection characteristic is below -15dB can be widened.

[0083] Fig.15 Graph showing the transmission characteristics of the waveguide converter 101 with and without the first portion S12a of the line portion S12. In Example 1, the first portion S12a is provided in the line portion S12, and in Example 4, the first portion S12a is not provided in the line portion S12. Fig.15 In the figure, the passing characteristics in each embodiment are represented by the solid line for embodiment 1 and the dotted line for embodiment 4.

[0084] When referring to Fig.15 When compared with Example 4, Example 1 can widen the frequency band of the pass characteristic of -0.6 dB or more.

[0085] like Figure 7 As shown, when viewed from above, the distance Ls13 in the x direction from the conversion portion S11 to the first portion S12a can be greater than 5 / 8 and less than 7 / 8 of the wavelength λ of the signal transmitted in the signal conductor S1. In the case where the signal conductor S1 transmits a high-frequency signal, the distance in the x direction from the conversion portion S11 is around 3 / 4 of the wavelength λ of the transmitted signal, and the inductance component increases. Therefore, the impedance can be adjusted by the structure as described above. In this way, the high-frequency characteristics in the signal conductor S1 can be improved. Here, the distance Ls13 can be set to the distance from the center point of the conversion portion S11 in the x direction and the y direction to the center point of the first portion S12a in the x direction and the y direction.

[0086] Fig.16 Graph showing the reflection characteristics of the waveguide converter 101 when the distance Ls13 in the x direction from the line portion S12 to the first portion S12a is changed. The distance Ls13 of Example 1 is approximately 3 / 4 of the wavelength λ of the signal transmitted in the signal conductor S1, the distance Ls13 of Example 5 is approximately 1 / 2 of the wavelength λ of the signal, and the distance Ls13 of Example 6 is approximately 7 / 8 of the wavelength λ of the signal. Fig.16 In the figure, the reflection characteristics in each embodiment are represented by the solid line for embodiment 1, the dashed line for embodiment 5, and the dotted line for embodiment 6.

[0087] When referring to Fig.16 It can be seen that compared with Examples 5 and 6, Example 1 obtains good characteristics.

[0088] like Figure 7 As shown, in a plan view, the distance Ls13 in the x direction from the conversion portion S11 to the first portion S12a may be greater than 1 / 8 and less than 3 / 8 of the wavelength λ of the signal transmitted in the signal conductor S1. When the signal conductor S1 transmits a high-frequency signal, the distance in the x direction from the conversion portion S11 is near 1 / 4 of the wavelength λ of the transmitted signal, and the inductance component increases. Therefore, the impedance can be adjusted by the structure shown above. In this way, the high-frequency characteristics in the signal conductor S1 can be improved.

[0089] like Fig.10 As shown, the second surface 412 of the first cover body 4 may also have a first side 412a arranged to overlap with the second area 1a2 when viewed from above. In this case, at least a portion of the first portion S12a of the line portion S12 is arranged to overlap with the first side 412a when viewed from above. The first side 412a is a side that constitutes a portion of the outer periphery of the second surface 412.

[0090] like Figure 7 As shown, the conversion portion S11 may also have a second portion S11b connected to the line portion S12. In addition, the line portion S12 may also have a third portion S12b connected to the second portion S11b. The dimension Ls11 of the conversion portion S11 in the y direction is greater than the dimension Ls3 of the third portion S12b in the y direction. In addition, the dimension Ls2 of the second portion S11b in the y direction decreases as it moves outward along the x direction (in one embodiment, the negative direction of the x-axis). By having the structure as described above, the possibility of a sharp change in impedance from the conversion portion S11 to the line portion S12 can be reduced, and the mode conversion in the signal conductor S1 and the waveguide 107 can be alleviated. In this way, when the waveguide 107 is located on the lower side of the conversion portion S11, the possibility of a sharp deterioration of the reflection characteristics due to positional offset, etc. can be reduced.

[0091] <Method for manufacturing waveguide converter>

[0092] Here, a method for manufacturing the waveguide converter 101 according to an embodiment of the present disclosure is described. In addition, the present disclosure is not limited to the following embodiments, and for example, it can also be manufactured using a 3D printer. In addition, as described above, the first substrate 1 and the first frame body 2 do not necessarily have to be made of the same material as in the following manufacturing method.

[0093] (1) First, a plurality of green sheets are formed. Specifically, for example, an organic binder, a plasticizer or a solvent is added to a ceramic powder such as boron nitride, aluminum nitride, silicon nitride, silicon carbide or beryllium oxide and mixed to obtain a mixture. The obtained mixture is formed into a layer to produce a plurality of green sheets. Next, the plurality of green sheets are processed using a mold or the like to prepare a plurality of green sheets that are formed into the outer shapes of the first substrate 1 and the first frame 2 when viewed from above. In addition, in the case where the first substrate 1 and the first frame 2 have through holes, a hole that is the outer shape of the through hole is provided on the first substrate 1 and the first frame 2 using a mold or a laser or the like. In addition, in the case of forming a waveguide converter 101 having a second frame 3, a green sheet formed into the outer shape of the second frame 3 is also prepared.

[0094] (2) Prepare a high melting point metal powder such as tungsten or molybdenum, add an organic binder, a plasticizer or a solvent to the powder and mix them to prepare a metal paste. Then, print the metal paste in a predetermined pattern on a plurality of raw sheets formed into the outer shapes of the first substrate 1 and the first frame 2 to form a signal conductor S1, a first ground conductor G1, and a second ground conductor G2. In addition, in order to improve the bonding strength with the first substrate 1 and the first frame 2, the metal paste may also contain glass or ceramic. In addition, in the above-mentioned process (1), the metal paste is filled into the holes provided in the first substrate 1 and the first frame 2 to form a through hole.

[0095] (3) A plurality of green sheets are stacked in such a manner that the outer edges of the green sheets formed into the outer shapes of the first substrate 1 and the first frame 2 are aligned to form a green sheet stack. Alternatively, after the green sheet stack is formed, a metal paste may be printed into a predetermined pattern to form a signal conductor S1, a first ground conductor G1, a second ground conductor G2, and other wiring (for example, a third ground conductor G3).

[0096] (4) The green sheet stack is sintered to obtain a sintered body in which the first substrate 1 and the first frame body 2 are stacked.

[0097] (5) The first cover body 4 is formed by subjecting an ingot of a metal material constituting the first cover body 4 to a metal processing method such as a rolling method or a punching method.

[0098] (6) The first cover 4 is bonded to the sintered body produced in the above step (4) by using a bonding material, thereby obtaining the waveguide converter 101.

[0099] <Structure of electronic component mounting package>

[0100] Next, refer to Fig.11 An electronic component mounting package 100 according to an embodiment of the present disclosure will be described. Fig.11The figure is an exploded perspective view of a waveguide conversion device 10 including an electronic component mounting package 100 having a waveguide converter 101 according to an embodiment of the present disclosure. The electronic component mounting package 100 includes a second substrate 102 , the waveguide converter 101 , and a third housing 103 .

[0101] The second substrate 102 has a third upper surface 102a, a third lower surface 102b on the opposite side of the third upper surface 102a, and a through hole 102H. The second substrate 102 is, for example, a quadrilateral in a plan view, with a size of 10mm×10mm to 100mm×100mm and a thickness of 0.5mm to 20mm. As the material of the second substrate 102, for example, metal materials such as copper, iron, tungsten, molybdenum, nickel or cobalt, or alloys containing these metal materials can be cited. In this case, the second substrate 102 can be a laminated body obtained by laminating a metal plate or a plurality of metal plates. In addition, when the material of the second substrate 102 is the above-mentioned metal material, in order to reduce oxidative corrosion, a plating layer such as nickel or gold can also be formed on the surface of the second substrate 102 by electroplating or electroless plating. In addition, the material of the second substrate 102 may be an insulating material, for example, an alumina sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a ceramic material such as glass ceramics.

[0102] The through hole 102H extends from the third upper surface 102a to the third lower surface 102b. In addition, the waveguide converter 101 is located on the third upper surface 102a at a position overlapping with the through hole 102H when viewed from above. In a plan view, the through hole 102H is located at a position overlapping with the first region 1a1 and the conversion portion S11. In a plan view, the through hole 102H is located at a position overlapping with the waveguide 107 described later.

[0103] The third frame 103 is bonded to the third upper surface 102a and is arranged to surround the waveguide converter 101. The third frame 103 is, for example, a quadrilateral in a plan view, with a size of 10 mm×10 mm to 100 mm×100 mm and a thickness of 0.5 mm to 20 mm. The material of the third frame 103 may be the same as or different from the material of the second substrate 102, and for example, the same material as the material of the first frame 2 may be cited. The third frame 103 may also have a wiring portion for electrical connection with the electronic component 104 described later. The wiring portion may also be formed on a raw sheet that forms the outer shape of the third frame 103 using metal materials such as gold, silver, copper, nickel, tungsten, molybdenum and manganese. In addition, the wiring portion may also be formed by sintering a metal paste, or may be formed by a thin film forming technique such as a vapor deposition method or a sputtering method. An insulating film such as a ceramic (e.g., an alumina coating) or a resin may also be located on a portion of the wiring portion.

[0104] The third frame body 103 can be bonded to the second substrate 102 via a bonding material such as solder. The material of the solder is, for example, silver, copper, gold, aluminum, or magnesium, and may contain additives such as nickel, cadmium, or phosphorus.

[0105] The second substrate 102 may further include a second recess 102K including a second opening 102O on the third upper surface 102a. The second recess 102K includes the through hole 102H. In this case, the waveguide converter 10 is located in the second recess 102K. The first substrate 1 includes a second side 12 and a third side 13 connected to the second side 12 via a first corner 102K when viewed from above. The second opening 102O includes a fourth side 1024 and a fifth side 1025 connected to the fourth side 1024 via a second corner 1026 when viewed from above. The second side 12 is in contact with at least a portion of the fourth side 1024. The third side 13 is in contact with at least a portion of the fifth side 1025. With such a structure, when the waveguide converter 101 is mounted on the second substrate 102, the first substrate 1 of the waveguide converter 101 can be mounted in contact with the fourth side 1024 and the fifth side 1025. Therefore, the waveguide converter 101 can be mounted on the second substrate 102 with high positional accuracy. In one embodiment, the side where the signal conductor S1 is located is set as the second side 12. This can reduce the possibility of positional deviation in the direction of the connecting wire (x direction) when the electronic component 104 and the signal conductor S1 are electrically connected via a connecting member such as a wire, thereby reducing impedance fluctuations.

[0106] When the first substrate 1 is a polygon such as a rectangle, any corner can be set as the first corner 1K. By determining the first corner 1K, the second side 12 and the third side 13 can be uniquely determined. In addition, by determining the second side 12 and the third side 13, the fourth side 1024 and the fifth side 1025 can be uniquely determined.

[0107] In addition, as shown in one embodiment, the corners of the first substrate 1 (including the first corner 1K) can be rectangular and the corners are cut into arc shapes. With such a structure, the possibility of damage to the first substrate 1 when manufacturing the waveguide converter 101 or installing it on the second substrate 102 can be reduced. In addition, the first frame 2 and the second frame 3 can also be rectangular and the corners are cut into arc shapes when viewed from above. With such a structure, the above-mentioned effects can be obtained in the same way. In addition, the corners of the first substrate 1 (including the first corner 1K) are not limited to the above-mentioned embodiments, for example, they can also be rectangular with rounded corners.

[0108] <Structure of waveguide conversion device>

[0109] Next, a waveguide conversion device 10 according to an embodiment of the present disclosure will be described. Fig.11As shown, the waveguide conversion device 10 includes at least an electronic component mounting package 100 , an electronic component 104 , a second cover 106 , and a waveguide 107 .

[0110] The electronic component 104 is located on the third upper surface 102a of the second substrate 102, and is electrically connected to the waveguide converter 101 of the electronic component mounting package 100. The electronic component 104 may also be a component that performs processing such as converting an optical signal into an electrical signal or converting an electrical signal into an optical signal. In addition, although not shown, the electronic component 104 and the waveguide converter 101 are electrically connected by a connecting member such as a wire made of a conductive metal material. The electronic component 104 and the third frame 103 may also be electrically connected by a connecting member such as a wire. The electronic component 104 may be directly mounted on the second base 102, or may be mounted via a pedestal member such as a sub-base.

[0111] The second cover 106 is located on the third frame 103 and is located at a position covering the interior of the package 100 for mounting electronic components. The second cover 106 protects the electronic component 104 together with the second frame 103. The second cover 106 is, for example, a quadrilateral in a plan view, with a size of 10 mm×10 mm to 50 mm×50 mm and a thickness of 0.5 mm to 2 mm. Examples of the material of the second cover 106 include metal materials such as iron, copper, nickel, chromium, cobalt, molybdenum or tungsten, or alloys obtained by combining a plurality of these metal materials. By subjecting an ingot of such a metal material to metal processing methods such as rolling and punching, it is possible to produce a metal component constituting the second cover 106.

[0112] The second cover body 106 may be bonded to the third frame body 103 via a seal ring or the like, or may be bonded via a bonding material such as solder, brazing material, glass, or a resin adhesive.

[0113] The waveguide 107 is located on the third lower surface 102b side of the second substrate 102. As a material of the waveguide 107, a conductor such as metal can be cited. A printed circuit board (PCB: Printed Circuit Board) or the like is located between the second substrate 102 and the waveguide 107, and the second substrate 102 (electronic component mounting package 100) can also be joined to the waveguide 107 via the printed circuit board or the like.

[0114] The waveguide converter according to one embodiment has the above-described structure, so that the strength of the waveguide converter can be improved and the possibility of damage to the first substrate can be reduced.

[0115] In addition, since the thickness of the first substrate can be reduced in this manner, good high-frequency characteristics can be obtained.

[0116] In addition, various combinations of characteristic parts in one embodiment are not limited to the examples in the above-mentioned embodiment, and combinations of the respective embodiments are also possible.

[0117] Industrial Applicability

[0118] The present disclosure can be used as a waveguide converter, an electronic component mounting package, and a waveguide converter device.

[0119] Description of Reference Numerals

[0120] 1First substrate

[0121] 1a First upper surface

[0122] 1a1 First Area

[0123] 1a2 Second area

[0124] 1a3 Third Area

[0125] 1b First lower surface

[0126] 12 Second side

[0127] 13 The Third Side

[0128] 1K First Corner

[0129] G1 first ground conductor

[0130] G2 Second grounding conductor

[0131] G3 Third grounding conductor

[0132] S1 signal conductor

[0133] S11 conversion unit

[0134] S11b Part 2

[0135] S12 Line Department

[0136] S12a Part 1

[0137] S12b Part 3

[0138] 2First frame

[0139] 2a Second upper surface

[0140] 2c inner side

[0141] 21 First end

[0142] 22 Second end

[0143] 25 The fifth end

[0144] 26 The sixth end

[0145] 3 Second frame

[0146] 33 Third end

[0147] 34 Fourth End

[0148] 4First cover

[0149] 41 first recess

[0150] 41O First Opening

[0151] 411 First Side

[0152] 412 Second Side

[0153] 412a First Side

[0154] L12 Distance between the first end and the second end

[0155] L34 The distance between the third end and the fourth end

[0156] L56 Distance between the fifth end and the sixth end

[0157] LS1 first part size

[0158] LS2 second part size

[0159] LS3 Part 3 Dimensions

[0160] Dimensions other than the first section of the Ls4 line section

[0161] Dimensions of Ls11 conversion unit

[0162] Ls13 Distance from the conversion section to the first section

[0163] Distance between H conversion part and first surface

[0164] 10Waveguide conversion device

[0165] 100 Electronic component mounting package

[0166] 101 Waveguide Converter

[0167] 102 second substrate

[0168] 102a third upper surface

[0169] 102b third lower surface

[0170] 1024 Fourth Side

[0171] 1025 The Fifth Side

[0172] 1026 Second Corner

[0173] 102K second recess

[0174] 102O Second opening

[0175] 102H through hole

[0176] 103 Third frame

[0177] 104 Electronic components

[0178] 106 second cover

[0179] 107 waveguide

Claims

1. A waveguide converter, wherein: have: A first substrate having a first upper surface including a first region and a second region extending from the first region; a signal conductor having a conversion portion located in the first region, and a line portion connected to the conversion portion and arranged to extend at least from the first region to the second region; A first ground conductor is arranged at least in the second region of the first upper surface, sandwiching the line portion when viewed from above; A first frame body is disposed on the first upper surface, surrounds at least a portion of the first area and the second area in a plan view, has a second upper surface and an inner side surface connected to the second upper surface, and is made of a non-metallic material; a second grounding conductor, located on the second upper surface; as well as A first cover body, disposed on the second upper surface, covers the first area when viewed from above, and is made of a metal material; The first frame further includes a first end and a second end that are arranged to face each other with the second region sandwiched therebetween in a plan view. The first grounding conductor, the second grounding conductor, and the first cover are electrically connected.

2. The waveguide converter according to claim 1, wherein: In a plan view, when the direction in which the line portion extends is defined as a first direction and a direction intersecting the first direction is defined as a second direction, The waveguide converter further includes a second frame, which is located on the second upper surface, arranged outside the inner side surface in a plan view so as to surround at least a portion of the first region, and is made of a non-metallic material. The second frame body has a third end portion and a fourth end portion which are arranged to face each other in the second direction in a plan view.

3. The waveguide converter according to claim 2, wherein: A distance between the first end and the second end in the second direction is less than or equal to a distance between the third end and the fourth end in the second direction.

4. The waveguide converter according to any one of claims 1 to 3, wherein: The first cover has a first surface disposed opposite to the first region. In a cross-sectional view intersecting the first upper surface, a distance from the conversion portion to the first surface is not less than 1 / 13.12 and not more than 1 / 9.85 of a wavelength λ of a signal propagating in the signal conductor.

5. The waveguide converter according to any one of claims 1 to 4, wherein: The first cover body has: a second surface arranged to overlap with the second upper surface; and a first recessed portion having a first opening on the second surface; In a plan view, the area of ​​the first opening is smaller than the area of ​​the first region.

6. The waveguide converter according to any one of claims 1 to 4, wherein: The first cover body has: a second surface arranged to overlap with the second upper surface; and a first recessed portion having a first opening on the second surface; The first recess has the first surface.

7. The waveguide converter according to any one of claims 1 to 6, wherein: The first upper surface has a third area, the third area is connected to the second area and is arranged separately from the first area, The first frame further includes a fifth end and a sixth end which are arranged to face each other across the third region in a plan view. The second area is located between the first area and the third area in a plan view, In a plan view, when the direction in which the line portion extends is defined as a first direction and a direction intersecting the first direction is defined as a second direction, A distance between the first end and the second end in the second direction is less than or equal to a distance between the fifth end and the sixth end in the second direction.

8. The waveguide converter according to any one of claims 2, 3 or 7, wherein: The line portion has a first portion that is disposed apart from the conversion portion in a plan view. The dimension of the first portion in the second direction is the maximum dimension of the line portion in the second direction.

9. The waveguide converter according to claim 8, wherein: In a plan view, a distance from the conversion portion to the first portion in the first direction is not less than 5 / 8 and not more than 7 / 8 of a wavelength λ of a signal transmitted through the signal conductor.

10. The waveguide converter according to claim 8, wherein: In a plan view, a distance from the conversion portion to the first portion in the first direction is not less than 1 / 8 and not more than 3 / 8 of a wavelength λ of a signal transmitted through the signal conductor.

11. The waveguide converter according to any one of claims 8 to 10, wherein: The second surface has a first side arranged to overlap with the second region in a plan view, In a plan view, at least a portion of the first portion is arranged to overlap with the first side.

12. The waveguide converter according to any one of claims 1 to 11, wherein: In a plan view, when the direction in which the line portion extends is defined as a first direction and a direction intersecting the first direction is defined as a second direction, The conversion portion has a second portion connected to the line portion, The line portion has a third portion connected to the second portion, The dimension of the conversion portion in the second direction is greater than the dimension of the third portion in the second direction. A dimension of the second portion in the second direction decreases toward the outside along the first direction.

13. A package for mounting an electronic component, wherein: have: A second substrate having a third upper surface, a third lower surface opposite to the third upper surface, and a through hole penetrating from the third upper surface to the third lower surface; The waveguide converter according to any one of claims 1 to 12, arranged on the third upper surface so as to overlap with the through hole when viewed from above; as well as The third frame body is bonded to the third upper surface and is arranged to surround the waveguide converter.

14. The electronic component mounting package according to claim 13, wherein The second substrate further has a second recess including a second opening on the third upper surface, The second recess has the through hole, The waveguide converter is located in the second recess, The first substrate has a second side and a third side connected to the second side via a first corner portion when viewed from above. The second opening has a fourth side and a fifth side connected to the fourth side via a second corner portion when viewed from above. The second side contacts at least a portion of the fourth side, The third side contacts at least a portion of the fifth side.

15. A waveguide conversion device, wherein: have: The electronic component mounting package according to claim 13 or 14; an electronic component, located on the third upper surface of the second substrate and electrically connected to the waveguide converter of the electronic component mounting package; A second cover body is located on the third frame body and is configured to cover the interior of the electronic component mounting package; as well as A waveguide is located on the third lower surface side of the second substrate.

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