Radio frequency signal generator and radio frequency ablation equipment

Abstract

The invention provides a radio frequency signal generator and radio frequency ablation equipment, and the radio frequency signal generator comprises a signal source; the power driving assembly is connected with the signal source; the power output assembly is connected with the power driving assembly; the data detector is connected with the power output assembly; the master controller is connected with the data detector; the power output assembly comprises a temperature compensation circuit. The temperature compensation circuit is used for adjusting the voltage of a target element connected in the power output assembly. And the accuracy of the output radio frequency signal is improved.

Description

Technical Field

[0001] The present application relates to the technical field of medical equipment, and in particular to a radio frequency signal generator and a radio frequency ablation device. Background Art

[0002] In the medical field, radiofrequency ablation can be used to ablate various tissues in the body. Radiofrequency ablation is a process in which a radiofrequency signal is emitted by a radiofrequency signal generator and transmitted to a radiofrequency ablation catheter, so that the radiofrequency ablation catheter can generate an appropriate high temperature to achieve ablation of various tissues in the body. However, the accuracy of the signal of the current radiofrequency signal generator is insufficient, which affects the effect of radiofrequency ablation. Summary of the invention

[0003] The purpose of the present application is to provide a radio frequency signal generator and a radio frequency ablation device, which can improve the accuracy of the radio frequency signal of the radio frequency signal generator.

[0004] In a first aspect, the present invention provides a radio frequency signal generator, comprising: a signal source; a power driving component connected to the signal source; a power output component connected to the power driving component; a data detector connected to the power output component; and a master controller connected to the data detector; wherein the power output component comprises a temperature compensation circuit; and the temperature compensation circuit is used to adjust the voltage of a target element connected to the power output component.

[0005] In the embodiment of the present application, considering that the circuit is generally set to a constant voltage at the static operating point, but the target element may work at different temperatures due to the ambient temperature or operation, the static operating current of the target element at different temperatures may change with the temperature. If the target element works for a long time or in an environment with poor heat dissipation, the output power and output waveform of the target element may also fluctuate greatly. Therefore, by setting a temperature compensation circuit, the temperature of the target element can be compensated, thereby achieving voltage regulation, so that the waveform output by the target element can be more stable, and the operation can also be more stable. Furthermore, the energy output by the ablation tube that can be connected can also be more accurate, so as to achieve a better and more accurate ablation effect.

[0006] In an optional embodiment, the temperature compensation circuit includes: a temperature detector, a current detector, a voltage detector and a voltage controller; the temperature detector is used to collect temperature data of the target element; the current detector is used to collect current data of the target element; the voltage detector is used to collect voltage data of the target element; the voltage controller is electrically connected to the temperature detector, the current detector and the voltage detector, and the voltage controller is used to adjust the voltage of the target element based on the temperature data, the current data and the voltage data.

[0007] In the above embodiment, the temperature compensation circuit includes a temperature detector, a current detector, and a voltage detector. By combining the data obtained by detection of multiple detectors to compensate the target element, the compensation can be more targeted, and the adjustment of the voltage of the target element can also be more accurate.

[0008] In an optional embodiment, the target element is a MOS tube; the temperature data includes the temperature change of the MOS tube; the current data includes the output current of the MOS tube; the voltage data includes the base voltage of the MOS tube; the temperature detector is used to detect the temperature change of the MOS tube; the voltage detector is connected to the base of the MOS tube, and the voltage detector is used to collect the base voltage of the MOS tube; the current detector is connected to the output end of the MOS tube, and the current detector is used to collect the output current of the MOS tube.

[0009] In an optional embodiment, the temperature compensation circuit further includes: a resistance control element having one end connected to the voltage controller and the other end connected to the base of the MOS tube; the voltage controller is configured to adjust the resistance value of the resistance control element according to the temperature change of the MOS tube and the output current of the MOS tube to adjust the voltage on the base of the MOS tube, and the voltage controller is also configured to adjust the voltage on the gate of the MOS tube and the voltage from the gate of the MOS tube to the source by adjusting the voltage on the base of the MOS tube.

[0010] In an optional embodiment, the resistance control element includes a digitally controlled potentiometer (DCP).

[0011] In the above embodiment, by configuring a resistance control element, the voltage can be adjusted by controlling the resistance in the circuit where the target element is located. The voltage can be adjusted by combining the current data obtained by the current detector with the adjustment of the resistance, so that the voltage adjustment of the target element can be more precise.

[0012] In an optional embodiment, the power output component further includes: a first amplifying circuit connected to the target element; the first amplifying circuit includes: a first DC blocking capacitor and a second resistor connected in series.

[0013] In the above embodiment, by providing the first amplifier circuit, even if the input signal is relatively weak, the amplification processing of the first amplifier circuit can better meet the needs of subsequent temperature compensation related processing for the target element.

[0014] In an optional embodiment, the power output component also includes: a second amplifier circuit connected to the target element; the second amplifier circuit includes: a third resistor, a second transformer and a fourth resistor; the third resistor is connected to the primary side of the second transformer; the fourth resistor is connected to the output end of the second transformer.

[0015] In the above embodiment, by providing a second amplifying circuit, the output signal of the power output component can be made stronger, thereby facilitating the subsequent data detector to detect the output signal of the power output component more accurately.

[0016] In an optional implementation, the master controller includes: an oscillation filter circuit; wherein target circuit parameters of the oscillation filter circuit are determined by a genetic algorithm.

[0017] In an optional implementation, the circuit parameters of the oscillation filter circuit are determined in the following manner: calculating an initial total harmonic distortion (THD) value of the circuit in which the oscillation filter circuit is located; if it is determined that the initial total harmonic distortion value is greater than a target value, setting an iteration parameter; the iteration parameter includes an iteration number threshold; determining a target genetic operator in a genetic algorithm; calculating a current total harmonic distortion value according to the target genetic operator; if it is determined that the current total harmonic distortion value is less than the target value, determining that the circuit parameter corresponding to the current total harmonic distortion value is the target circuit parameter; if it is determined that the current total harmonic distortion value is not less than the target value, updating the target genetic operator, and calculating the current total harmonic distortion value based on the updated target genetic operator; if it is determined that the current total harmonic distortion value is not less than the target value, and the number of iterations is greater than the iteration number threshold, updating the iteration parameter, and iterating based on the updated iteration parameter.

[0018] In the above embodiment, by combining the genetic algorithm to adjust the parameters of the oscillation filter circuit, it is possible to quickly find suitable parameters and shorten the time required for parameter adjustment. Furthermore, in combination with the voltage adjustment of the target element based on temperature compensation in the power output component, when its output signal is more stable, the data obtained by the master controller can also be more stable. Based on more stable data, the ablation radio frequency output by its radio frequency signal generator can also be more stable and accurate.

[0019] In an optional implementation, the updating of the target genetic operator includes: updating the target genetic operator according to a difference between the current total harmonic distortion value and the target value.

[0020] In an optional embodiment, the genetic operators in the genetic algorithm include random operation, crossover operation, and mutation operation; the crossover operation may include single-point crossover operation, double-point crossover operation, and triple-point crossover operation; the mutation operation may include single-point mutation operation, double-point mutation operation, three-point mutation operation, and four-point mutation operation; the updating of the target genetic operator according to the difference between the current total harmonic distortion value and the target value includes: if the difference is within a first numerical interval, determining a single-point crossover operation and a single-point mutation operation as the target genetic operator; if the difference is within a second numerical interval, determining a double-point crossover operation and a double-point mutation operation as the target genetic operator; if the difference is within a third numerical interval, determining a random operation, a double-point crossover operation, and a double-point mutation operation as the target genetic operator; if the difference is within a fourth numerical interval, determining a random operation, a three-point crossover operation, and a double-point mutation operation as the target genetic operator; if the difference is within a fifth numerical interval, determining a random operation, a four-point crossover operation, and a three-point mutation operation as the target genetic operator.

[0021] In the above implementation, by selecting different genetic operators of the genetic algorithm based on the difference in difference, the iterative convergence speed can be improved, and the efficiency of determining the circuit parameters based on the genetic algorithm can be improved.

[0022] In an optional embodiment, the power driving component includes a plurality of groups of sub-power driving components; each group of the sub-power driving components is connected to the same signal source.

[0023] In an optional implementation, the sub-power driving component includes: an amplitude adjustment unit and a power amplification unit.

[0024] In the above implementation, by connecting multiple groups of sub-power drive components to the same signal source, the energy consistency of the multi-channel output can be better maintained when the RF signal generator realizes a multi-channel working mode. Furthermore, by realizing the same signal source, the number of components can be reduced, so that the cost of the RF signal generator is relatively low, and the debugging of the RF signal generator can also be simpler.

[0025] In an optional embodiment, the power drive assembly includes a plurality of groups of sub-power drive assemblies;

[0026] The signal source includes a crystal oscillator and a plurality of direct digital frequency synthesizers connected to the crystal oscillator; wherein the number of the direct digital frequency synthesizers is the same as the number of the sub-power driving components; and the sub-power driving components are connected to the direct digital frequency synthesizers one-to-one.

[0027] In the above implementation, by connecting multiple direct digital frequency synthesizers to the same crystal oscillator, the RF signal generator can be operated in a multi-channel mode. Since the signal source is based on the same crystal oscillator, the energy consistency of the multi-channel output can be better maintained.

[0028] In a second aspect, the present invention provides a radiofrequency ablation device, comprising a radiofrequency ablation catheter and the above-mentioned radiofrequency signal generator; wherein the radiofrequency ablation catheter is connected to the radiofrequency signal generator, and the radiofrequency ablation catheter is used to output radiofrequency energy based on a signal provided by the radiofrequency signal generator.

[0029] In the above embodiment, by setting a temperature compensation circuit, the temperature of the target element can be compensated, thereby achieving voltage regulation, making the waveform output by the target element more stable, and making its operation more stable. Furthermore, the energy output by the ablation tube that can be connected can also be more accurate, thereby achieving a better and more accurate ablation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0031] Figure 1 A block diagram of a radio frequency signal generator provided in an embodiment of the present application;

[0032] Figure 2A block diagram of a temperature compensation circuit for a radio frequency signal generator provided in an embodiment of the present application;

[0033] Figure 3 A schematic diagram of the structure of a power output component of a radio frequency signal generator provided in an embodiment of the present application;

[0034] Figure 4a A schematic diagram of a temperature detector circuit of a temperature compensation circuit provided in an embodiment of the present application;

[0035] Figure 4b A schematic diagram of a current detector circuit of a temperature compensation circuit provided in an embodiment of the present application;

[0036] Figure 4c A circuit diagram of a voltage detector of a temperature compensation circuit provided in an embodiment of the present application;

[0037] Figure 5a A circuit diagram of an oscillation filter circuit provided in an embodiment of the present application;

[0038] Figure 5b Another circuit diagram of the oscillation filter circuit provided in an embodiment of the present application;

[0039] Figure 6 A schematic diagram of a flow chart for determining circuit parameters of an oscillation filter circuit provided in an embodiment of the present application;

[0040] Figure 7a A schematic diagram of a matching circuit of a power drive component and a signal source provided in an embodiment of the present application;

[0041] Figure 7b Another schematic diagram of a matching circuit of a power driving component and a signal source provided in an embodiment of the present application;

[0042] Figure 8 Another block diagram of a radio frequency signal generator provided in an embodiment of the present application.

[0043] Icons: 110-signal source; 120-power drive component; 130-power output component; 131-temperature compensation circuit; 1311-temperature detector; 1312-current detector; 1313-voltage detector; 1314-voltage controller; 140-data detector; 150-master controller; 160-display; 161-key module; 162-display area; R1-first resistor; T1-first transformer; R2-second resistor; T2-second transformer; Q1-MOS tube; R3-third resistor; R4-fourth resistor; R5-fifth resistor; R6-sixth resistor; R7-seventh resistor; R8-eighth resistor; C1-first capacitor; C3-third capacitor; U1B-first operational amplifier; U2B-second operational amplifier; U4-temperature digital probe. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings in the embodiments of the present application.

[0045] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0046] RDN (Renal Denervation) is an interventional surgical technique designed to treat high blood pressure. This technique reduces the stimulation of the kidneys by the sympathetic nervous system by affecting the sympathetic nerve fibers around the renal artery, thereby lowering blood pressure. RDN is a technique that uses a catheter to place an ablation electrode into the renal artery, releasing radiofrequency energy, ultrasound energy, or heat energy to destroy the sympathetic nerve fibers.

[0047] The equipment used in RDN technology includes a mesh multi-electrode renal artery radiofrequency ablation catheter (ablation catheter for short) and a radiofrequency signal generator (ablation device for short). The radiofrequency ablation catheter and the radiofrequency signal generator work together to deliver radiofrequency energy to the inner wall of the renal artery, generating appropriate high temperatures to damage or partially damage the renal sympathetic nerves. The stability and accuracy of the signal emitted by the radiofrequency signal generator directly affect the effect of RDN technology. However, the stability of the signal of the current radiofrequency signal generator is still insufficient, which causes the radiofrequency energy output by the radiofrequency ablation catheter to be different from the expected value.

[0048] Based on the above research, the embodiments of the present application can provide a radio frequency signal generator and radio frequency ablation device, which can improve the stability and consistency of the signal of the radio frequency signal generator. The radio frequency signal generator and radio frequency ablation device of the present application are introduced below in combination with some embodiments.

[0049] like Figure 1 As shown, a radio frequency signal generator provided in an embodiment of the present application may include: a signal source 110 , a power driving component 120 , a power output component 130 , a data detector 140 and a general controller 150 .

[0050] The signal source 110 is connected to the power driving component 120 and outputs a signal to the power driving component 120 .

[0051] The power output component 130 can be connected to the power driving component 120 and output after receiving the signal transmitted by the power driving component 120.

[0052] The data detector 140 may be connected to the power output component 130, and may be used to detect the signal output by the power output component 130. Exemplarily, the data detector 140 may include a voltage detector, a current detector 1312, and a temperature detector 1311. The voltage detector may be used to detect the voltage value of the circuit where the power output component 130 is located, the current detector 1312 may be used to detect the current value of the circuit where the power output component 130 is located, and the temperature detector 1311 may be used to detect the temperature value of the circuit where the power output component 130 is located.

[0053] The data detector 140 may be connected to the master controller 150. The master controller 150 may obtain the data detected by the data detector 140. The master controller 150 may also be connected to the signal source 110.

[0054] In this embodiment, the power output component 130 may include a temperature compensation circuit 131 for adjusting the voltage of a target element connected to the power output component 130 .

[0055] As the ambient temperature of the circuit where the target component is located changes, the temperature of the target component may change, or as the circuit where the target component is located is used for a longer time, the temperature of each device in the circuit may also change. In this case, the target component may become unstable, which may also cause the output power and output waveform of the target component to fluctuate greatly.

[0056] The temperature compensation circuit 131 can adjust the voltage of the target element based on the temperature change of the target element, so that the voltage of the target element can be more stable under different temperatures.

[0057] Exemplarily, the voltage of the target element may be adjusted by adjusting the resistance of a circuit in which the target element is located.

[0058] The target element can be compensated for the above-mentioned temperature change through the temperature compensation circuit 131, so that the output power and output waveform of the target element can better meet expectations, and the target element can work more stably.

[0059] In one embodiment, if Figure 2 As shown, the temperature compensation circuit 131 includes: a temperature detector 1311 , a current detector 1312 , a voltage detector and a voltage controller 1314 .

[0060] The temperature detector 1311 can be used to collect temperature data of the target element. Exemplarily, the temperature detector 1311 can monitor the temperature change of the target element according to a set time rule.

[0061] The current detector 1312 can be used to collect current data of the target element. The current detector 1312 can also monitor the current of the circuit where the target element is located according to a set time rule.

[0062] The voltage detector can be used to collect voltage data of the target component. The voltage detector can also monitor the voltage of the circuit where the target component is located according to a set time rule.

[0063] The voltage controller 1314 may be electrically connected to the temperature detector 1311 , the current detector 1312 , and the voltage detector, and may obtain detection data obtained by the temperature detector 1311 , the current detector 1312 , and the voltage detector.

[0064] The voltage controller 1314 is used to adjust the voltage of the target element based on the temperature data, the current data and the voltage data, so that the voltage of the target element is relatively stable in different temperature environments.

[0065] Exemplarily, the voltage controller 1314 may be implemented as a microcontroller unit (MCU).

[0066] In the above-mentioned embodiment, the temperature compensation circuit 131 includes a temperature detector 1311, a current detector 1312, and a voltage detector, which realizes the monitoring of the temperature, current and voltage of the target element, and also realizes the monitoring of multiple types of information of the target element. In combination with the monitoring of multiple types of information of the target element, the voltage of the target element can be dynamically adjusted, and the adjustment of the voltage of the target element can also be made more accurate.

[0067] In one embodiment, the target component may be a MOS transistor Q1 .

[0068] The temperature data includes the temperature change of the MOS tube Q1; the current data includes the output current of the MOS tube Q1; and the voltage data includes the base voltage of the MOS tube Q1. The temperature detector 1311 can be used to detect the temperature change of the MOS tube Q1; the voltage detector connected to the base of the MOS tube Q1 can be used to collect the base voltage of the MOS tube Q1; and the current detector 1312 connected to the output end of the MOS tube Q1 can be used to collect the output current of the MOS tube Q1.

[0069] Alternatively, if Figure 3 and 4a As shown, the temperature detector 1311 may be a temperature digital probe U4. The temperature digital probe U4 is used to detect the temperature change of the MOS tube Q1. The use of the temperature digital probe U4 can achieve high detection accuracy.

[0070] Alternatively, if Figure 3 and4b As shown, the current detector 1312 can be a high-end current sampler, which can sample the output current of the MOS tube Q1. Using high-end current sampling can better eliminate ground interference, and send the sampled output current of the MOS tube Q1 to the connected micro control unit for processing. Figure 4b In the example shown, the high-end current sampler may include a second operational amplifier U2B and four resistors, namely a fifth resistor R5, a sixth resistor R6, a seventh resistor R7 and an eighth resistor R8. The seventh resistor R7 is connected in parallel with the eighth resistor R8 and connected to the non-inverting input terminal of the second operational amplifier U2B, and the other end of the eighth resistor R8 is grounded. One end of the fifth resistor R5 is connected to the inverting input terminal of the second operational amplifier U2B, the other end of the fifth resistor R5 is connected to the output terminal of the second operational amplifier U2B, and the sixth resistor R6 is connected to the inverting input terminal of the second operational amplifier U2B.

[0071] Optionally, the voltage detector may be a circuit that can use a high impedance to send the sampled voltage to a micro control unit connected thereto for processing. Figure 3 and 4c As shown, the voltage detector may be a base voltage sampler, which may be implemented by a first operational amplifier U1B.

[0072] In this embodiment, the voltage of the MOS tube Q1 can be adjusted by adjusting the resistance value in the circuit where the MOS tube Q1 is located.

[0073] In an optional embodiment, the temperature compensation circuit 131 further includes: a resistance control element having one end connected to the voltage controller 1314 and the other end connected to the base of the MOS tube Q1; the voltage controller 1314 adjusts the resistance value of the resistance control element according to the temperature change of the MOS tube Q1 and the output current of the MOS tube Q1 to adjust the voltage on the base of the MOS tube Q1, and adjusts the voltage on the gate of the MOS tube Q1 and the voltage from the gate to the source of the MOS tube Q1 by adjusting the voltage on the base of the MOS tube Q1.

[0074] Optionally, the resistance control element includes a digitally controlled potentiometer (DCP).

[0075] Below Figure 3The example shown is used to introduce the working principle of the temperature compensation circuit 131. The microcontroller unit can adjust the resistance of the digital control potentiometer by using the temperature rise of the MOS tube Q1 measured by the temperature digital probe U4 and the output current of the MOS tube Q1 sampled by the high-end current sampler, and adjust the voltage on the base of the MOS tube Q1. By also feeding back the voltage applied to the base of the MOS tube Q1, the voltage applied to the gate of the MOS tube Q1 can be further automatically adjusted to adjust the change of the voltage from the gate to the source (VGS) of the MOS tube Q1. Through the above adjustment method, the static operating point of the MOS tube Q1 can be kept stable, and the working waveform of the circuit where the MOS tube Q1 is located can be stable.

[0076] By configuring a resistance control element, the resistance control element uses a digital control potentiometer, which can realize multi-level real-time adjustment functions, which is convenient for the microcontroller to process. The voltage can be adjusted by controlling the resistance in the circuit where the target element is located. The multi-level adjustment achieved by combining the current data obtained by the current detector 1312 and the adjustment of the resistance makes the voltage adjustment of the target element more accurate.

[0077] In this embodiment, each data detector 140 can communicate with the micro control unit using a communication protocol, which can reduce interference between signals.

[0078] In order to make the signal in the circuit where the power output component 130 is located more stable and facilitate the subsequent signals to better meet the processing requirements, the power output component 130 may also include: a first amplification circuit connected to the target element.

[0079] like Figure 3 As shown, the first amplifying circuit includes: a first DC blocking capacitor and a second resistor R2 connected in series.

[0080] Take the target component as MOS tube Q1 as an example. Figure 3 As shown, the first amplifier circuit can be connected to the gate of the MOS tube Q1.

[0081] by Figure 3 Taking the example shown as an example, the working principle of the first amplifier circuit can be: a positive half-cycle sine wave can be input at the input end of the power output component 130, added to the primary side of the dummy load first resistor R1 and the first transformer T1, and a corresponding positive half-cycle sine wave is induced at the secondary side of the first transformer T1. The sine waveform is added to the gate of the MOS tube Q1 through the first capacitor C1 and the second resistor R2 to achieve power linear amplification.

[0082] Exemplarily, the first capacitor C1 may be a DC blocking capacitor.

[0083] Under the action of the first amplifier circuit, even if the input signal is relatively weak, the signal added to the gate of the MOS tube Q1 can be relatively stronger through the amplification processing of the first amplifier circuit, and can better meet the subsequent temperature compensation related processing requirements for the MOS tube Q1.

[0084] In order to make the signal output by the power output component 130 stronger, the power output component 130 may further include a second amplifying circuit connected to the target element.

[0085] like Figure 3 As shown, the second amplifying circuit includes a third resistor R3, a second transformer T2 and a fourth resistor R4; the third resistor R3 is connected to the primary side of the second transformer T2; and the fourth resistor R4 is connected to the output end of the second transformer T2.

[0086] The power of the driving signal applied to the gate of the MOS tube Q1 is amplified, and the VCC connected to the third capacitor C3 is discharged. The current passes through the MOS tube Q1 and the third current-limiting resistor R3 to the primary side of the second transformer T2, and then returns to the ground terminal of the third capacitor C3, forming a complete closed loop.

[0087] The second transformer T2 outputs a voltage waveform corresponding to the primary side through electromagnetic induction, which is added to the resistor R6 of the high-end current sampler to achieve amplification of a sinusoidal signal.

[0088] By providing the second amplifying circuit, the output signal of the power output component 130 can be made stronger, thereby facilitating the subsequent data detector 140 to detect the output signal of the power output component 130 more accurately.

[0089] The temperature compensation circuit 131 is provided in the power output component 130 to make the signal output by the power output component 130 more stable. However, if the signal output by the RF signal generator needs to be more stable and accurate, and the signal processed by the main controller 150 also needs to be stable, the effect of the RF signal output by the RF signal generator can be better improved. Under this requirement, the main controller 150 may include: an oscillation filter circuit.

[0090] like Figure 5a As shown, the oscillation circuit may include a group of series LC circuits and a group of parallel LC circuits.

[0091] Alternatively, if Figure 5b As shown, the inductor in the LC circuit can be composed of multiple coils connected in parallel, and the capacitor in the LC circuit can be composed of multiple capacitors connected in parallel. Figure 5b In the example shown, the inductance in the LC circuit may be composed of four coils connected in parallel, and the capacitance in the LC circuit may be composed of four capacitors connected in parallel.

[0092] Wherein, the target circuit parameters of the oscillation filter circuit are determined by a genetic algorithm.

[0093] like Figure 6 As shown, the circuit parameters of the oscillation filter circuit are determined by the following method:

[0094] Step 210, calculating the initial total harmonic distortion value of the circuit where the oscillation filter circuit is located.

[0095] The initial total harmonic distortion value (THD) is a parameter used to measure the ratio of the harmonic components in the output signal to the original signal.

[0096] Optionally, an ADC may be used to collect voltage and current in real time, and components of each harmonic may be obtained through Fourier transform (FFT), and an initial total harmonic distortion value may be obtained based on the ratio of other harmonic components to the total signal.

[0097] Step 220, determining whether the initial total harmonic distortion value is greater than the target value.

[0098] If the initial total harmonic distortion value is greater than the target value, step 220 is executed.

[0099] The target value may be a value set as needed, for example, the target value may be 5%, 7%, 10%, etc.

[0100] Step 230, setting iteration parameters.

[0101] The iteration parameter may be a parameter used in the iteration process involved in the genetic algorithm.

[0102] The iteration parameters may include an iteration number threshold, the number of variables, the number of chromosomes, initial circuit parameters, iteration termination conditions, and an initialization population.

[0103] The number of variables can be determined based on the number of parameters that need to be adjusted. If there are two groups of LC circuits in the oscillation filter circuit, there are four circuit parameters that need to be adjusted, and the number of variables can be determined to be 4.

[0104] The number of chromosomes may be selected based on actual needs. For example, the number of chromosomes may be set to a value less than 1000.

[0105] The initial circuit parameters may be initial parameters of each device in the oscillation filter circuit.

[0106] Usually L is an inductor, which plays the role of passing low frequencies and blocking high frequencies in the circuit. C is an inductor, which plays the role of passing high frequencies and blocking low frequencies in the circuit, but if it is connected in parallel to the circuit, the role is the opposite. After determining the rated load R of the oscillation filter circuit and the frequency f of the circuit, the initial L value and initial C value in the initial parameters of the oscillation filter circuit can be calculated according to the formula L=R / 2πf and C=1 / 2πfR.

[0107] The iteration termination condition may include a reference threshold. When the calculated total harmonic distortion value is less than the reference threshold, the iteration may be terminated. The reference threshold may be equal to the aforementioned target value.

[0108] Step 240, determining the target genetic operator in the genetic algorithm.

[0109] Genetic operators in genetic algorithms may include random operations, crossover operations, mutation operations, etc. Random operations may include but are not limited to compass selection operations; crossover operations may include but are not limited to single-point operations; mutation operations may include but are not limited to random mutation operations.

[0110] Optionally, the crossover operation may include a single-point crossover operation, a double-point crossover operation, a triple-point crossover operation, etc. The mutation operation may include a single-point mutation operation, a double-point mutation operation, a triple-point mutation operation, a quadruple-point mutation operation, etc.

[0111] Optionally, the target genetic operator may be determined based on the initial total harmonic distortion value. The target genetic operator may include one or more genetic operators in the genetic algorithm.

[0112] Exemplarily, the target genetic operator may be determined based on the difference between the initial total harmonic distortion value and the target value.

[0113] If the difference between the initial total harmonic distortion value and the target value is within the first numerical interval, a single-point crossover operation and a single-point mutation operation will be determined as the target genetic operator; if the difference between the initial total harmonic distortion value and the target value is within the second numerical interval, a double-point crossover operation and a double-point mutation operation will be determined as the target genetic operator; if the difference between the initial total harmonic distortion value and the target value is within the third numerical interval, a random operation, a double-point crossover operation, and a double-point mutation operation will be determined as the target genetic operator; if the difference between the initial total harmonic distortion value and the target value is within the fourth numerical interval, a random operation, a three-point crossover operation, and a two-point mutation operation will be determined as the target genetic operator; if the difference between the initial total harmonic distortion value and the target value is within the fifth numerical interval, a random operation, a four-point crossover operation, and a three-point mutation operation will be determined as the target genetic operator.

[0114] In this embodiment, the above-mentioned numerical value intervals may be mutually non-intersecting numerical value intervals.

[0115] In one example, if the difference between the initial total harmonic distortion value and the target value is within (5%, 15%)

[0116] Within the interval, a single-point crossover operation and a single-point mutation operation can be determined as the target genetic operator; if the difference between the initial total harmonic distortion value and the target value is within the interval of (15%, 30%], a double-point crossover operation and a double-point mutation operation can be determined as the target genetic operator; if the difference between the initial total harmonic distortion value and the target value is within the interval of (30%, 45%], a random operation, a double-point crossover operation and a double-point mutation operation can be determined as the target genetic operator; if the difference between the initial total harmonic distortion value and the target value is within the interval of (45%, 60%], a random operation, a three-point crossover operation and a double-point mutation operation can be determined as the target genetic operator; if the difference between the initial total harmonic distortion value and the target value is greater than 60%, a random operation, a four-point crossover operation and a three-point mutation operation can be determined as the target genetic operator.

[0117] Step 250: Calculate the current total harmonic distortion value according to the target genetic operator.

[0118] Step 260, determining whether the current total harmonic distortion value is less than the target value.

[0119] If the current total harmonic distortion value is less than the target value, the circuit parameters corresponding to the current total harmonic distortion value are determined as the target circuit parameters.

[0120] Step 270, determining whether the number of iterations is greater than an iteration number threshold.

[0121] If the current total harmonic distortion value is not less than the target value, and the number of iterations is not greater than the iteration number threshold, re-execute step 240 and step 250. Update the target genetic operator, and calculate the current total harmonic distortion value based on the updated target genetic operator. Compare the current total harmonic distortion value obtained by recalculation with the target value to determine the subsequent execution process. If the current total harmonic distortion value is less than the target value, determine that the circuit parameters corresponding to the current total harmonic distortion value are the target circuit parameters. If the current total harmonic distortion value is not less than the target value, then step 240 and step 250 can be repeated. If the current total harmonic distortion value is not less than the target value, and the number of iterations is greater than the iteration number threshold, re-execute step 220.

[0122] Exemplarily, the target genetic operator may be updated based on the difference between the current total harmonic distortion value and the target value.

[0123] If the difference between the current total harmonic distortion value and the target value is within the first numerical interval, a single-point crossover operation and a single-point mutation operation will be determined as the target genetic operator; if the difference between the current total harmonic distortion value and the target value is within the second numerical interval, a double-point crossover operation and a double-point mutation operation will be determined as the target genetic operator; if the difference between the current total harmonic distortion value and the target value is within the third numerical interval, a random operation, a double-point crossover operation, and a double-point mutation operation will be determined as the target genetic operator; if the difference between the current total harmonic distortion value and the target value is within the fourth numerical interval, a random operation, a three-point crossover operation, and a two-point mutation operation will be determined as the target genetic operator; if the difference between the current total harmonic distortion value and the target value is within the fifth numerical interval, a random operation, a four-point crossover operation, and a three-point mutation operation will be determined as the target genetic operator.

[0124] If the current total harmonic distortion value is not less than the target value, and the number of iterations is greater than the iteration number threshold, step 220 is re-executed to update the iteration parameters, and iteration is performed based on the updated iteration parameters.

[0125] By combining the genetic algorithm to adjust the parameters of the oscillation filter circuit, it is possible to quickly find suitable parameters and shorten the time required for parameter adjustment. Furthermore, in combination with the voltage adjustment of the target element based on temperature compensation in the power output component 130, when its output signal is more stable, the data obtained by the master controller 150 can also be more stable. Based on more stable data, the ablation radio frequency output by its radio frequency signal generator can also be more stable and accurate.

[0126] The radio frequency signal generator provided in the embodiment of the present application can be used in the field of radio frequency ablation. Considering that a multi-channel working mode is usually adopted, and the signal source 110 and the power amplifier circuit of each channel are independent, even if each channel uses the same type of signal source 110, the phase of the crystal oscillator is not fixed after power-on, the frequency is slightly different, and the output signal is also different, which causes output differences. In this way, there may be a problem that the frequency and phase of the signal source 110 of each channel are not uniform.

[0127] In one embodiment, if Figure 7a As shown, the power driving component 120 includes a plurality of sub-power driving components; each group of sub-power driving components is connected to the same signal source 110 .

[0128] Exemplarily, the sub-power driving component may include: an amplitude adjustment unit and a power amplification unit.

[0129] Each set of amplitude adjustment units and power amplification units forms a channel with the signal source 110 .

[0130] In one example, the power driving component 120 may include six sub-power driving components, thus forming six independent channels.

[0131] In the above example, since the six channels all use the same signal source 110 , the consistency of each communication can be better maintained.

[0132] Optionally, the signal source 110 may include a crystal oscillator and a digital frequency synthesizer.

[0133] Optionally, the amplitude adjustment unit may include a digital potentiometer, through which the amplitude of the signal output by the signal source 110 is adjusted.

[0134] By connecting multiple groups of sub-power driving components to the same signal source 110, the energy consistency of the multi-channel output can be better maintained when the RF signal generator realizes a multi-channel working mode. Furthermore, by realizing the same signal source 110, the number of components can be reduced, so that the cost of the RF signal generator is relatively low, and the debugging of the RF signal generator can also be simpler.

[0135] In another embodiment, if Figure 7b As shown, the power drive assembly 120 includes a plurality of sub-power drive assemblies.

[0136] The signal source 110 includes a crystal oscillator and a plurality of direct digital frequency synthesizers connected to the crystal oscillator.

[0137] The number of direct digital frequency synthesizers is the same as the number of sub-power driving components; and the sub-power driving components are connected to the direct digital frequency synthesizers in a one-to-one manner.

[0138] exist Figure 7b In the example shown, the power driving component 120 includes six groups of sub-power driving components, and the signal source 110 includes six direct digital frequency synthesizers.

[0139] Six direct digital frequency synthesizers are connected to the same crystal.

[0140] By connecting multiple direct digital frequency synthesizers to the same crystal oscillator, the RF signal generator can be implemented in a multi-channel working mode. Since the signal source is based on the same crystal oscillator, the energy consistency of the multi-channel output can be better maintained.

[0141] Based on different actual needs, the RF signal generator may also include some other modules. For example, in order to better present the effect and real-time status of the RF signal generator. Figure 8 As shown, the RF signal generator may further include a display 160 .

[0142] The display 160 may have a button module 161 , a display area 162 , and the like.

[0143] An embodiment of the present application provides a radiofrequency ablation device, which includes a radiofrequency ablation catheter and a radiofrequency signal generator.

[0144] The radio frequency ablation catheter is connected to a radio frequency signal generator, and the radio frequency ablation catheter is used to output radio frequency energy based on a signal provided by the radio frequency signal generator.

[0145] The RF signal generator involved in the embodiment of the present application is similar to the RF signal generator described in the previous embodiment. For other details of the RF signal generator of this embodiment, please refer to the description in the previous embodiment, which will not be repeated here.

[0146] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0147] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A radio frequency signal generator, characterized in that: include: Signal source; A power driving component connected to the signal source; A power output component connected to the power drive component; a data detector connected to the power output assembly; and A master controller connected to the data detector; Wherein, the power output component includes a temperature compensation circuit; the temperature compensation circuit is used to adjust the voltage of the target element connected to the power output component.

2. The radio frequency signal generator according to claim 1, characterized in that: The temperature compensation circuit includes: a temperature detector, a current detector, a voltage detector and a voltage controller; The temperature detector is used to collect temperature data of the target element; The current detector is used to collect current data of the target element; The voltage detector is used to collect voltage data of the target element; The voltage controller is electrically connected to the temperature detector, the current detector and the voltage detector, and is used to adjust the voltage of the target element based on the temperature data, the current data and the voltage data.

3. The radio frequency signal generator according to claim 2, characterized in that: The target element is a MOS tube; the temperature data includes the temperature change of the MOS tube; the current data includes the output current of the MOS tube; the voltage data includes the base voltage of the MOS tube; The temperature detector is used to detect the temperature change of the MOS tube; The voltage detector is connected to the base of the MOS tube, and the voltage detector is used to collect the voltage of the base of the MOS tube; The current detector is connected to the output end of the MOS tube, and the current detector is used to collect the output current of the MOS tube.

4. The radio frequency signal generator according to claim 3, characterized in that: The temperature compensation circuit further includes: a resistance control element having one end connected to the voltage controller and the other end connected to the base of the MOS tube; The voltage controller is configured to adjust the resistance value of the resistance control element according to the temperature change of the MOS tube and the output current of the MOS tube, so as to adjust the voltage on the base of the MOS tube; and The voltage controller is configured to adjust the voltage on the gate of the MOS tube and the voltage from the gate of the MOS tube to the source by adjusting the voltage on the base of the MOS tube.

5. The radio frequency signal generator according to claim 1, characterized in that: The power output assembly further includes: a first amplifying circuit connected to the target element; The first amplifier circuit includes: a first DC blocking capacitor and a second resistor connected in series.

6. The radio frequency signal generator according to claim 1, characterized in that: The power output assembly further includes: a second amplifying circuit connected to the target element; The second amplifying circuit comprises: a third resistor, a second transformer and a fourth resistor; The third resistor is connected to the primary side of the second transformer; and the fourth resistor is connected to the output end of the second transformer.

7. The radio frequency signal generator according to any one of claims 1 to 6, characterized in that: The overall controller comprises: an oscillation filter circuit; wherein the target circuit parameters of the oscillation filter circuit are determined by a genetic algorithm.

8. The radio frequency signal generator according to claim 7, characterized in that: in, The circuit parameters of the oscillation filter circuit are determined in the following manner: Calculating an initial total harmonic distortion value of the circuit in which the oscillation filter circuit is located; If it is determined that the initial total harmonic distortion value is greater than the target value, an iteration parameter is set; wherein the iteration parameter includes an iteration number threshold; Determine a target genetic operator in a genetic algorithm; wherein the target genetic operator includes one or more genetic operators; Calculating a current total harmonic distortion value according to the target genetic operator; If it is determined that the current total harmonic distortion value is less than the target value, then determining the circuit parameter corresponding to the current total harmonic distortion value as the target circuit parameter; If it is determined that the current total harmonic distortion value is not less than the target value, the target genetic operator is updated, and the current total harmonic distortion value is calculated based on the updated target genetic operator; If it is determined that the current total harmonic distortion value is not less than the target value, and the number of iterations is greater than the iteration number threshold, the iteration parameters are updated, and iteration is performed based on the updated iteration parameters.

9. The radio frequency signal generator according to claim 8, characterized in that: The updating of the target genetic operator comprises: The target genetic operator is updated according to the difference between the current total harmonic distortion value and the target value.

10. The radio frequency signal generator according to claim 9, characterized in that: The genetic operators in the genetic algorithm include random operation, crossover operation, and mutation operation; the crossover operation can include single-point crossover operation, double-point crossover operation, and triple-point crossover operation; the mutation operation includes single-point mutation operation, double-point mutation operation, triple-point mutation operation, and quadruple-point mutation operation; The updating of the target genetic operator according to the difference between the current total harmonic distortion value and the target value comprises: If the difference is within the first numerical interval, a single-point crossover operation and a single-point mutation operation are determined as target genetic operators; If the difference is within the second numerical interval, a two-point crossover operation and a two-point mutation operation are determined as target genetic operators; If the difference is within the third numerical range, a random operation, a two-point crossover operation, and a two-point mutation operation are determined as target genetic operators; If the difference is within a fourth numerical interval, a random operation, a three-point crossover operation, and a two-point mutation operation are determined as target genetic operators; If the difference is within the fifth numerical interval, the random operation, the four-point crossover operation, and the three-point mutation operation are determined as the target genetic operators.

11. The radio frequency signal generator according to any one of claims 1 to 6, characterized in that: The power drive assembly includes a plurality of groups of sub-power drive assemblies; Each group of the sub-power driving components is connected to the same signal source.

12. The radio frequency signal generator according to claim 11, characterized in that: The sub-power driving component includes: an amplitude adjustment unit and a power amplification unit.

13. The radio frequency signal generator according to any one of claims 1 to 6, characterized in that: The power drive assembly includes a plurality of groups of sub-power drive assemblies; The signal source includes a crystal oscillator and a plurality of direct digital frequency synthesizers connected to the crystal oscillator; wherein the number of the direct digital frequency synthesizers is the same as the number of the sub-power driving components; The sub-power driving component is connected to the direct digital frequency synthesizer in a one-to-one manner.

14. A radiofrequency ablation device, characterized in that: Comprising a radiofrequency ablation catheter and a radiofrequency signal generator according to any one of claims 1 to 13; The radio frequency ablation catheter is connected to the radio frequency signal generator, and the radio frequency ablation catheter is used to output radio frequency energy based on the signal provided by the radio frequency signal generator.

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