A structure and method for controlling patch coating weight

Abstract

The application discloses a structure and method for controlling the coating weight of a patch, and belongs to the technical field of patch processing. The structure comprises a rack, a coating roller arranged on the rack, a coating assembly arranged in front of the coating roller, the coating assembly being movably connected to the rack and a coating gap being formed between the coating assembly and the coating roller, and a base material of the patch passing through the coating gap; a thickness gauge is arranged behind the coating roller, and the thickness gauge reciprocally moves to detect the thickness of the patch after coating; an adjusting mechanism is further arranged on the rack, the adjusting mechanism comprising an eccentric wheel and a distance meter, the eccentric wheel being rotatably arranged on the rack and being in contact with the coating assembly, and the distance meter being used for measuring the distance between the coating mold and the coating roller. The structure and method can adjust the coating gap according to the coating thickness of the patch, so as to ensure the stability of the coating weight in the production process of the patch; and the repeated positioning precision is high, and the coating gap can be quickly restored to a suitable gap after the coating gap changes, so that the consistency of the coating thickness of the patch is good.

Description

A structure and method for controlling the basis weight of adhesive patch application Technical Field

[0001] This invention relates to the field of patch processing technology, and in particular to a structure and method for controlling the weight of adhesive applied to patches. Background Technology

[0002] Adhesive patches are typically produced using specialized laminating machines that bond two or more substrates (such as film, paper, nonwoven fabric, and spunlace fabric) through processes including adhesive application, lamination, slitting, and cutting. As adhesive patch production becomes increasingly standardized and parameterized, processing requirements are also rising. Basis weight is a crucial indicator of patch quality, and adhesive thickness is a key parameter for determining basis weight. Common laminating machines cannot measure patch weight directly; instead, quality is typically determined during production through frequent and quantitative sampling, relying on the experience of the processing personnel. When a product is deemed substandard, the processing personnel adjust the adhesive application gap to alter the adhesive layer thickness. For example, if the basis weight is too high, the application gap is narrowed to reduce the adhesive layer thickness and lower the basis weight; conversely, the application gap is widened. Furthermore, substandard patches that have already been produced must be destroyed, resulting in waste.

[0003] Typically, the glue application gap is fine-tuned using a handwheel and lead screw. After adjustment, a certain number of patches need to be produced to ensure stable patch thickness; patches with unstable thicknesses are discarded as defective products. Furthermore, the patch adhesive is generally made from processed herbs, potentially containing dissolved medicinal components and foreign matter. This foreign matter can clog the glue application nozzle or scratch the substrate or adhesive layer on the application roller during production. In such cases, the glue application gap needs to be increased to remove the foreign matter before adjusting it to the appropriate range. However, the repeatability and precision of the lead screw adjustment method are difficult to guarantee, resulting in poor consistency in glue thickness. Multiple adjustments to the gap are required based on variations in the adhesive layer thickness to achieve the desired range, undoubtedly increasing the number of defective products and wasting costs. Summary of the Invention

[0004] The purpose of this invention is to provide a structure for controlling the adhesive weight of patches. This structure can adjust the adhesive gap in a timely manner according to the adhesive thickness of the patch to ensure the stability of the weight during patch production. Furthermore, it has high repeatability and positioning accuracy, and can quickly restore the appropriate gap after the adhesive gap changes, resulting in good consistency of the adhesive layer thickness of the patch.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A structure for controlling the weight of adhesive applied to a patch includes a frame, a coating roller mounted on the frame, a coating assembly positioned in front of the coating roller, the coating assembly being movably connected to the frame and forming a coating gap between the coating assembly and the coating roller, through which the patch substrate passes; a thickness gauge positioned behind the coating roller, the thickness gauge reciprocating along the length of the coating roller to detect the thickness of the coated patch substrate; and an adjustment mechanism mounted on the frame, the adjustment mechanism including an eccentric wheel and a distance measuring instrument, the eccentric wheel being rotatably mounted on the frame and in contact with the coating assembly, and the probe of the distance measuring instrument being in contact with the coating assembly to measure the distance between the coating mold and the coating roller.

[0007] Here, the width of the adhesive application gap is adjusted by rotating the eccentric wheel, ensuring a continuous and stable change in the gap width. This, combined with distance monitoring using a rangefinder, further enhances adjustment accuracy. The eccentric wheel and the adhesive application assembly are connected but operate independently. Even if the position of the adhesive application assembly changes, it does not affect the state of the eccentric wheel. Therefore, when the adhesive application assembly moves and the gap widens, it is pulled back to its initial position in contact with the eccentric wheel, achieving the initial positioning accuracy of the adhesive application gap. This eliminates the need for readjustment, improving the speed and accuracy of repeated positioning. Consequently, it ensures good consistency in the adhesive layer thickness, avoiding the problem of many defective products arising from readjusting the adhesive application gap width.

[0008] By using a thickness gauge to monitor the thickness of the adhesive patch in real time, the adhesive gap and dispensing amount can be adjusted in a timely manner according to the changes in thickness, so as to accurately control and adjust the weight of the patch and avoid producing defective products, which would lead to increased costs.

[0009] Preferably, the adhesive application assembly includes a mounting plate and an adhesive application mold. The adhesive application mold is fixed on the mounting plate, and both ends of the mounting plate are connected to the frame via cylinders. An adhesive application gap is formed between the adhesive application mold and the adhesive application roller. The sidewall of the eccentric wheel is in contact with the sidewall of the mounting plate.

[0010] Using a cylinder, the glue application assembly can be quickly and stably pushed out to provide sufficient space for removing foreign objects. The side wall of the eccentric wheel is in contact with the side wall of the mounting plate. By rotating the eccentric wheel, the distance between the glue application mold and the glue application roller can be changed.

[0011] Preferably, the rangefinder is a micrometer, with the micrometer's probe resting against the side wall of the mounting plate; the eccentric wheel is connected to a servo motor.

[0012] Preferably, the thickness gauge is an X-ray thickness gauge, including an X-ray emitter and an X-ray receiver. The X-ray emitter and the X-ray receiver are aligned on the frame and move back and forth via a synchronous belt. The adhesive-coated substrate passes between the X-ray emitter and the X-ray receiver.

[0013] Preferably, the mounting plate has a sliding groove on its bottom side, the frame has a slide rail that cooperates with the sliding groove, and the frame has two sets of adjustment mechanisms, which are arranged on both sides of the mounting plate.

[0014] Preferably, it also includes a control system and a display screen, and the thickness gauge, rangefinder, servo motor and cylinder are electrically connected to the control system; the control system is also electrically connected to the pumping device of the coating mold.

[0015] Preferably, the thickness gauge is further equipped with a control screen, which sets the thickness gauge and can display the thickness change of the adhesive substrate after the adhesive is applied.

[0016] Preferably, the coating roller is rotatably mounted on the frame, and a guide roller is provided between the coating roller and the thickness gauge, the guide roller guiding the substrate of the adhesive to pass parallel to the thickness gauge.

[0017] The purpose of this invention is to provide a method for controlling the weight of adhesive patch coating. This method, by using the structure in the above technical solution, can detect and adjust the weight of the patch in real time, thereby avoiding the generation of defective products and reducing costs.

[0018] To achieve the above objectives, the present invention adopts the following technical solution:

[0019] S0: Input the weight of the patch and the standard thickness of the patch corresponding to the weight as parameters in the control system, and adjust the adhesive coating structure to the initial state;

[0020] S1: The adhesive gap between the adhesive roller and the adhesive die is adjusted to a suitable width by the adjustment mechanism as described in claim 1, so that the substrate of the patch passes through the adhesive gap, the adhesive die applies the adhesive to the substrate of the patch, and the adhesive roller rotates to follow the substrate of the patch forward.

[0021] S2: The substrate of the adhesive after coating passes parallel through the thickness gauge. The thickness gauge reciprocates along the length of the coating roller, continuously and linearly monitoring the coating thickness of the substrate and feeding it back to the control unit.

[0022] S3: The control system controls the adjustment mechanism to operate based on the data fed back by the thickness gauge; when the adhesive thickness of the substrate of the patch is greater than the standard thickness of the patch, the adjustment mechanism operates to reduce the adhesive gap; when the adhesive thickness of the substrate of the patch is less than the standard thickness of the patch, the adjustment mechanism operates to increase the adhesive gap.

[0023] S4: The control system can also be connected to the pumping device of the coating mold to control the amount of glue dispensed from the coating mold.

[0024] Compared with existing technologies, the above technical solution has the following advantages: it can adjust the glue application gap with higher precision and achieve rapid repeat positioning while ensuring repeat positioning accuracy; it can adjust the glue application thickness and amount in a timely manner according to the change of the adhesive thickness, so as to achieve precise control of the adhesive weight and avoid producing defective products. Attached Figure Description

[0025] Figure 1 is a three-dimensional structural schematic diagram of the present invention;

[0026] Figure 2 is a top view of the present invention;

[0027] Figure 3 is a structural schematic diagram of the second angle of the present invention (without the coating roller, coating assembly and thickness gauge);

[0028] Figure 4 is a partial enlarged structural diagram of part A in Figure 3;

[0029] Figure 5 is a three-dimensional structural diagram of the present invention from a third angle;

[0030] Figure 6 is a side view of the cut-out structure of the present invention.

[0031] In the diagram: 1. Frame; 11. Guide rail; 2. Glue roller; 21. Drive mechanism; 3. Glue mold; 31. Mounting plate; 32. Cylinder; 34. Slide groove; 35. Glue outlet; 36. Glue inlet; 4. Glue gap; 5. Thickness gauge; 51. X-ray emitter; 52. X-ray receiver; 6. Adjustment mechanism; 61. Eccentric wheel; 62. Rangefinder; 63. Probe; 64. Servo motor; 7. Guide roller; 8. Substrate. Detailed Implementation

[0032] The present invention will be further described below with reference to the accompanying drawings:

[0033] As shown in Figures 1 to 6, a structure for controlling the weight of adhesive applied to a patch includes a frame 1. An adhesive roller 2 is mounted on the frame 1 and is rotatably mounted on the frame 1 via a drive mechanism 21. An adhesive application assembly is located in front of the adhesive roller 2, movably connected to the frame 1, forming an adhesive application gap 4 between the assembly and the roller. The assembly has an adhesive outlet, through which the patch substrate 8 passes. The roller 2 rotates, driving and following the substrate, and the adhesive from the outlet is applied to the substrate. A thickness gauge 5 is located behind the roller 2, reciprocating along the length of the roller 2 to measure the thickness of the applied patch substrate. An adjustment mechanism 6 is also provided on the frame 1. The adjustment mechanism 6 includes an eccentric wheel 61 and a rangefinder 62. The eccentric wheel 61 is rotatably mounted on the frame 1 and is in contact with the glue application assembly to adjust the size of the glue application gap 4. The probe of the rangefinder is in contact with the glue application assembly to measure the distance between the glue application mold and the glue application roller. The rangefinder 62 is preferably a micrometer. The eccentric wheel 61 rotates and pushes the side wall of the glue application assembly away from the glue application roller 2, thereby adjusting the glue application gap 4. The probe 63 of the micrometer rests against the side wall of the glue application assembly. The probe 63 extends or shortens as the glue application gap 4 changes, thereby achieving a more accurate measurement of the distance of the glue application gap 4. Here, the size of the glue application gap 4 is adjusted by rotating the eccentric wheel 61, making the change of the glue application gap 4 continuous and stable. Combined with the distance monitoring by the rangefinder 62, the adjustment accuracy is further improved.

[0034] In a preferred embodiment, the adhesive application assembly includes a mounting plate 31 and an adhesive application mold 3. The adhesive application mold 3 is fixed to the mounting plate 31, and both ends of the mounting plate 31 are movably connected to the frame 1 via cylinders 32. An adhesive application gap 4 is formed between the adhesive application mold 3 and the adhesive application roller 2. An adhesive outlet 35 is provided on the side of the adhesive application mold 3 near the adhesive application roller 2, and an adhesive inlet 36 is also provided on the adhesive application mold 3. The adhesive application mold 3 is connected to a pumping device for adhesive through the adhesive inlet 36. The substrate of the adhesive passes through the adhesive application gap 4 and is applied to the surface of the adhesive application roller 2. The adhesive flows out from the adhesive outlet 36 of the adhesive application mold 3 and is applied to the surface of the adhesive substrate to form an adhesive layer. Furthermore, a groove 34 is provided on the bottom side of the mounting plate 31, and a guide rail 11 that cooperates with the groove 34 is provided on the frame 1 to enhance the stability of the mounting plate 31 during movement.

[0035] Furthermore, the sidewall of the eccentric wheel 61 is in contact with the sidewall of the mounting plate 31, and the eccentric wheel 61 is connected to a servo motor 64 through a reducer. The servo motor 64 drives the eccentric wheel 61 to rotate, and the eccentric wheel 61 pushes the sidewall of the mounting plate 31 to move. The glue-applying mold 3 moves away from the glue-applying roller 2 along with the mounting plate 31, thereby adjusting the glue-applying gap 4. The probe 63 of the micrometer rests against the sidewall of the mounting plate 31 and will extend or shorten with the change of the glue-applying gap 4, thereby achieving a more accurate measurement of the distance of the glue-applying gap 4.

[0036] When there are foreign objects at the glue-applying mold 3 or glue-applying nozzle 3, the cylinder 32 connected to the mounting plate 31 is activated to quickly push the glue-applying assembly away from the glue-applying roller 2, providing sufficient space to remove the foreign objects. Then, the push rod of the cylinder 32 retracts, pulling the glue-applying mold 3 back through the mounting plate 31 to maintain contact with the eccentric wheel 61. At this time, the probe 63 of the rangefinder 62 rests against the mounting plate 31 to measure the width of the glue-applying gap. Based on the detection data from the rangefinder 62, the eccentric wheel 61 rotates to fine-tune the glue-applying gap 4 to achieve a suitable distance, thus achieving rapid and accurate positioning of the glue-applying gap 4 again. This eliminates the need for multiple manual adjustments, avoiding the production of defective products and reducing costs. During the process of the eccentric wheel 61 rotating to adjust the glue-applying gap, the cylinder 32 drives the mounting plate 31 to maintain contact with the eccentric wheel 61 at all times.

[0037] In a preferred embodiment, the frame 1 is provided with two sets of adjustment mechanisms 6, which are located on both sides of the mounting plate 31. The two sets of adjustment mechanisms 6 can operate independently to adjust the mounting plate 31, thereby further ensuring the flexibility and accuracy of adjusting the glue application gap 4.

[0038] In a preferred embodiment, the thickness gauge 5 is an X-ray thickness gauge, including an X-ray emitter 51 and an X-ray receiver 52. The X-ray emitter 51 and the X-ray receiver 52 are centered on the frame 1 and move back and forth via a synchronous belt. The adhesive-coated substrate passes parallel between the X-ray emitter 51 and the X-ray receiver 52, resulting in a simple overall structure. Furthermore, the thickness gauge 5 is also equipped with a control screen (not shown in the attached figure). The control screen sets the parameters of the thickness gauge 5 and can linearly display the thickness of the adhesive detected by the thickness gauge 5, providing a more intuitive understanding of the thickness change of the adhesive after coating.

[0039] In a preferred embodiment, a guide roller 7 is provided between the coating roller 2 and the thickness gauge 5. The guide roller 7 guides the substrate of the adhesive to pass stably through the thickness gauge 5, making the data measured by the thickness gauge 5 more accurate and reliable.

[0040] In one embodiment, the system also includes a control system and a display screen (not shown in the figures). The thickness gauge 5, the rangefinder 62, the servo motor 64, and the cylinder 32 are electrically connected to the control system. The thickness gauge 5 feeds back the actual thickness of the adhesive substrate to the control system. The control system compares the value fed back by the thickness gauge 5 with the target value, and sends a signal to the servo motor 64 to drive the eccentric wheel 61 to rotate, fine-tuning the adhesive application gap 4 to ensure that the thickness of the adhesive is within a suitable range, thereby ensuring that the weight of the adhesive meets the standard. At the same time, the control system controls the servo motor 64 to operate or stop based on the change in the distance of the adhesive application gap 4 measured by the rangefinder 62. The display screen is used to input control commands for the device used for adhesive application and to set parameters for the device.

[0041] In one embodiment, the control system is also electrically connected to the pumping device of the adhesive coating mold 3. The control system controls the rotation speed of the pumping device by using the detection data of the adhesive thickness by the thickness gauge 5, thereby increasing or decreasing the amount of adhesive dispensed from the adhesive coating mold 3, and more comprehensively controlling the weight of the adhesive.

[0042] In use, the device is adjusted to its initial position, and the rangefinder 62 records the zero point. Then, the device is started. The servo motor 64 drives the eccentric wheel 61 to rotate and push the adhesive coating mold 3 away from the adhesive coating roller 2, forming an adhesive coating gap 4. The probe 63 of the rangefinder 62 extends as the adhesive coating gap 4 increases. When the value measured by the probe 63 reaches the set distance, the eccentric wheel 61 stops rotating. At this point, adhesive application can begin on the substrate of the adhesive. If a foreign object is found in the adhesive coating mold 3, the cylinder 32... The pusher plate 31 quickly moves away from the glue application roller 2, providing sufficient space to remove foreign objects. Then, the pusher rod of the cylinder 32 retracts, pulling the glue application mold 3 back so that the side wall of the mounting plate 31 contacts the side of the eccentric wheel 61. The probe 63 of the rangefinder 62 rests against the mounting plate 31 to detect the glue application gap 4. Based on the detection data from the rangefinder 62, the control system causes the eccentric wheel 61 to rotate, fine-tuning the glue application gap 4 to achieve a suitable distance, thus achieving rapid and accurate positioning of the glue application gap 4. The adhesive passes through the glue application gap 4 to complete the glue application. Then, following the rotation of the glue application roller 2, it moves backward through the thickness gauge 5. The thickness gauge 5 reciprocates in the width direction of the substrate to detect the thickness of the glued substrate and displays the results on the control screen while simultaneously feeding them back to the control system. The control system compares the detected thickness changes with the standard value. When the adhesive thickness deviates from the standard value... The control system will control the rotation of the eccentric wheel to adjust the width of the adhesive application gap 4. If necessary, it will also adjust the pumping device of the adhesive application mold 3 to increase or decrease the amount of adhesive dispensed from the adhesive application mold 3, thereby achieving precise control of the adhesive weight.

[0043] This application also provides a method for controlling the weight of adhesive coating on patches, characterized by comprising the following steps:

[0044] S0: Input the weight of the patch and the standard thickness of the patch corresponding to the weight as parameters in the control system, and adjust the adhesive coating structure to the initial state;

[0045] S1: The adhesive gap between the adhesive roller and the adhesive die is adjusted to a suitable width by the adjustment mechanism as described in claim 1, so that the substrate of the patch passes through the adhesive gap, the adhesive die applies the adhesive to the substrate of the patch, and the adhesive roller rotates to follow the substrate of the patch forward.

[0046] S2: The substrate of the adhesive after coating passes parallel through the thickness gauge. The thickness gauge reciprocates along the length of the coating roller, continuously and linearly monitoring the coating thickness of the substrate and feeding it back to the control unit.

[0047] S3: The control system controls the adjustment mechanism to operate based on the data fed back by the thickness gauge; when the adhesive thickness of the substrate of the patch is greater than the standard thickness of the patch, the adjustment mechanism operates to reduce the adhesive gap; when the adhesive thickness of the substrate of the patch is less than the standard thickness of the patch, the adjustment mechanism operates to increase the adhesive gap.

[0048] S4: The control system can also be connected to the pumping device of the coating mold to control the amount of glue dispensed from the coating mold.

[0049] This embodiment is merely an illustration of the concept and implementation of the present invention and is not intended to limit it. Under the concept of the present invention, technical solutions without substantial changes are still within the scope of protection.

Claims

1. A method for controlling the weight of adhesive applied to patches, characterized in that, The adhesive weight of the patch is controlled using a structure that includes a frame with an adhesive roller mounted on it. An adhesive application assembly is positioned in front of the roller, movably connected to the frame and forming an adhesive gap between the assembly and the roller through which the patch substrate passes. A thickness gauge is positioned behind the roller, reciprocating along its length to measure the thickness of the coated substrate. The thickness gauge also has a control panel for setting the gauge and displaying changes in substrate thickness. Two adjustment mechanisms are mounted on the frame, each including an eccentric wheel and a distance measuring device. The eccentric wheel is rotatably mounted on the frame and contacts the adhesive application assembly. Its rotation pushes the sidewall of the assembly away from the roller, adjusting the adhesive gap. The probe is in contact with the coating assembly, and the probe extends or shortens with the change of the coating gap to measure the distance between the coating mold and the coating roller; it also includes a control system and a display screen, and the thickness gauge, distance gauge, servo motor and cylinder are electrically connected to the control system; the control system is also electrically connected to the pumping device of the coating mold to adjust the glue output of the coating mold; the coating assembly includes a mounting plate and a coating mold, the coating mold is fixed on the mounting plate, the two ends of the mounting plate are connected to the frame by cylinders, and a coating gap is formed between the coating mold and the coating roller; the side wall of the eccentric wheel is in contact with the side wall of the mounting plate; the bottom side of the mounting plate is provided with a sliding groove, the frame is provided with a slide rail that cooperates with the sliding groove, and two sets of the adjustment mechanisms are arranged on both sides of the mounting plate; the control method specifically includes the following steps: S0: The control system inputs the patch weight and the corresponding standard patch thickness as parameters, and adjusts the adhesive application structure to the initial state; S1: The adjustment mechanism adjusts the adhesive gap between the adhesive roller and the adhesive die to a suitable width, allowing the patch substrate to pass through the adhesive gap. The adhesive die applies the adhesive to the patch substrate, and the adhesive roller rotates to follow the patch substrate forward; S11: When a foreign object blocks the adhesive outlet of the adhesive die, the cylinder pushes the mounting plate away from the adhesive roller quickly, providing sufficient space in the adhesive gap to remove the foreign object; S12: The cylinder push rod retracts, pulling the adhesive die... S121: The side wall of the mounting plate contacts and connects with the side of the eccentric wheel; S121: The probe of the rangefinder abuts against the mounting plate to detect the glue application gap. When the glue application gap is not suitable, the control system causes the eccentric wheel to rotate according to the detection data of the rangefinder to fine-tune the glue application gap to achieve a suitable distance, thereby realizing the rapid positioning of the glue application gap again; S2: The substrate of the adhesive after application passes parallel through the thickness gauge. The thickness gauge reciprocates along the length direction of the glue application roller, continuously and linearly monitoring the glue application thickness of the substrate and feeding it back to the control unit; S3: The control system controls the adjustment mechanism to operate according to the data fed back by the thickness gauge.When the adhesive coating thickness of the adhesive substrate is greater than the standard adhesive thickness, the control system controls the eccentric wheel to rotate and adjust the adhesive coating gap to be smaller; when the adhesive coating thickness of the adhesive substrate is less than the standard adhesive thickness, the control system controls the eccentric wheel to rotate and adjust the adhesive coating gap to be larger; S4: The control system can also be electrically connected to the pumping device of the adhesive coating mold to control the amount of adhesive dispensed from the adhesive coating mold.

2. The method for controlling the weight of adhesive coating as described in claim 1, characterized in that, The rangefinder is a micrometer, and the probe of the micrometer rests against the side wall of the mounting plate; the eccentric wheel is connected to a servo motor.

3. The method for controlling the weight of adhesive coating for patches as described in claim 2, characterized in that, The thickness gauge is an X-ray thickness gauge, which includes an X-ray emitter and an X-ray receiver. The X-ray emitter and the X-ray receiver are aligned on the frame and move back and forth via a synchronous belt. The adhesive-coated substrate passes between the X-ray emitter and the X-ray receiver.

4. The method for controlling the weight of adhesive coating as described in claim 1, characterized in that, The coating roller is rotatably mounted on the frame, and a guide roller is provided between the coating roller and the thickness gauge. The guide roller guides the substrate of the adhesive to pass parallel to the thickness gauge.

Images