Satellite pyrotechnic thermal buffer structure

Abstract

This invention provides a satellite pyrotechnic thermal conduction buffer structure, including mounting screws, mounting feet, an upper thermal conduction buffer pad, a middle thermal conduction buffer pad, and a lower thermal conduction buffer pad. The middle and upper thermal conduction buffer pads are sequentially arranged from bottom to top on the top of the pyrotechnic unlocking and separation device, and the lower thermal conduction buffer pad is disposed between the bottom of the pyrotechnic unlocking and separation device and the satellite. The satellite is disposed on top of the mounting feet. The mounting screws are used to sequentially fix the upper thermal conduction buffer pad, the middle thermal conduction pad, the pyrotechnic unlocking and separation device, the lower thermal conduction buffer pad, and the satellite to the mounting feet and provide preload. The thermal conduction buffer structure of this invention adopts a three-layer thermal conduction pad structure, and the superposition of multiple layers of materials better dissipates the heat generated during the explosion of the pyrotechnic, effectively reducing the thermal shock of the pyrotechnic explosion to the satellite structure and equipment.

Description

Technical Field

[0001] This invention relates to the field of satellite unlocking and separation technology, specifically to a heat-conducting buffer structure for satellite pyrotechnics, and more particularly to a heat-conducting buffer structure for a satellite pyrotechnics unlocking and separation device. Background Technology

[0002] Satellite unlocking and separation technology refers to the techniques used during satellite launch, operation, or reentry to unlock and separate various components of a satellite. This includes unlocking and deploying components such as solar panels, antennas, and payloads, or separating the upper stage and reentry capsule. Satellite unlocking and separation technology typically uses pyrotechnics as a power source, utilizing the explosive energy of the pyrotechnics to drive the unlocking and separation mechanism, thereby achieving satellite unlocking and separation.

[0003] However, the explosion of pyrotechnics generates high-temperature, high-pressure gases and debris, causing thermal and mechanical shocks to the satellite's structure and equipment, affecting its performance and reliability. To mitigate the adverse effects of pyrotechnic explosions, a heat-conducting buffer structure is typically installed at the installation location of the pyrotechnic unlocking and separation device. This structure dissipates the heat generated by the explosion and cushions the impact force, protecting the satellite's structure and equipment.

[0004] Existing thermally conductive buffer structures typically employ single- or double-layer thermally conductive pads, such as metal pads, graphite pads, and ceramic pads, to isolate pyrotechnic unlocking and separation devices and satellite mounting feet. The disadvantages of this type of thermally conductive buffer structure are that the choice of material for the thermally conductive pad is limited, the thickness and hardness of the thermally conductive pad are difficult to balance, the contact area of ​​the thermally conductive pad is small, and the heat dissipation and buffering effects of the thermally conductive pad are not ideal. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the purpose of this invention is to provide a thermally conductive buffer structure for satellite pyrotechnics.

[0006] The satellite pyrotechnic thermal conduction buffer structure provided by the present invention includes mounting screws, mounting feet, an upper thermal conduction buffer pad, a middle thermal conduction buffer pad, and a lower thermal conduction buffer pad;

[0007] The middle and upper buffer heat-conducting pads are arranged sequentially from bottom to top on the top of the pyrotechnic unlocking and separation device, and the lower buffer heat-conducting pad is arranged between the bottom of the pyrotechnic unlocking and separation device and the satellite.

[0008] The satellite is positioned on top of the mounting foot, and the mounting screws are used to sequentially fix the upper buffer thermal pad, the middle buffer thermal pad, the pyrotechnic unlocking and separation device, the lower buffer thermal pad, and the satellite onto the mounting foot and provide preload.

[0009] Preferably, the upper, middle, and lower thermal pads are made of different materials.

[0010] Preferably, the thermal conductivity of the upper buffer thermal pad material is above 100 W / mK, and the coefficient of thermal expansion of the upper buffer thermal pad material is not higher than 23.1 × 10⁻⁶. -6 / ℃.

[0011] Preferably, the thermal conductivity of the intermediate buffer thermal pad material is less than 100 W / mK, but the specific heat capacity of the intermediate buffer thermal pad material is not greater than 2 × 10⁻⁶ W / mK. 3 J / (kg·℃).

[0012] Preferably, the elastic modulus of the lower buffer thermal pad material is in the range of no more than 1 GPa, and the Poisson's ratio of the lower buffer thermal pad material is in the range of 0-0.5.

[0013] Preferably, the upper buffer thermal pad is made of aluminum alloy.

[0014] Preferably, the material of the intermediate buffer thermal pad is silicone.

[0015] Preferably, the lower buffer thermal pad is made of rubber.

[0016] Preferably, the ends of the upper, middle, and lower thermal pads are interfaces for mating with mounting screws or adjacent thermal pads, and the interfaces are round holes, square holes, or elliptical holes.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The thermally conductive buffer structure in this invention adopts a three-layer thermally conductive pad structure, which uses multiple layers of materials to better dissipate the heat generated during the explosion of pyrotechnics, effectively reducing the thermal shock of pyrotechnic explosions to satellite structures and equipment.

[0019] 2. The thermally conductive buffering method in this invention increases the contact surface of the buffer by using a three-layer contact method of the thermally conductive pad. When subjected to impact, the multi-layer structure can effectively disperse the impact force and effectively reduce the mechanical impact of pyrotechnic explosions on satellite structures and equipment.

[0020] 3. The thermal conduction buffering method in this invention uses mounting screws to fix the thermal conduction pads, which is simple in structure and easy to install. At the same time, the number and position of the thermal conduction pads can be flexibly adjusted according to the different specifications of pyrotechnic products and the different needs of satellites, thereby improving the adaptability and reliability of the thermal conduction buffering structure. Attached Figure Description

[0021] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0022] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 This is a cross-sectional structural diagram of the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of the present invention from a top-down perspective.

[0025] The diagram shows:

[0026] Explosive unlocking and separation device 1, upper buffer heat-conducting pad 5

[0027] Satellite 2, Buffer Thermal Pad 6

[0028] Mounting foot 3, lower cushioning thermal pad 7

[0029] Mounting screw 4 Detailed Implementation

[0030] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0031] This invention discloses a thermally conductive buffer structure for satellite pyrotechnics, which adopts a three-layer thermally conductive pad structure. By stacking multiple layers of materials, the heat generated during the explosion of the pyrotechnics is better dissipated, effectively reducing the thermal shock of the pyrotechnic explosion to the satellite structure and equipment.

[0032] The satellite pyrotechnic thermal conduction buffer structure provided by the present invention includes mounting screws 4, mounting feet 3, upper buffer thermal conduction pads 5, middle buffer thermal conduction pads 6, and lower buffer thermal conduction pads 7; the middle buffer thermal conduction pads 6 and 5 are arranged sequentially from bottom to top on the top of the pyrotechnic unlocking and separation device 1, and the lower buffer thermal conduction pads 7 are arranged between the bottom of the pyrotechnic unlocking and separation device 1 and the satellite 2; the satellite 2 is arranged on the top of the mounting feet 3, and the mounting screws 4 are used to sequentially fix the upper buffer thermal conduction pads 5, 6, 1, 7, and 2 onto the mounting feet 3 and provide preload force.

[0033] The upper buffer thermal pad 5, the middle buffer thermal pad 6, and the lower buffer thermal pad 7 are made of different materials. The thermal conductivity of the upper buffer thermal pad 5 is above 100 W / mK, and the coefficient of thermal expansion of the upper buffer thermal pad 5 is not higher than 23.1 × 10⁻⁶. -6 / ℃.

[0034] The intermediate buffer thermal pad 6 is mainly used to absorb the heat transferred by the upper thermal pad. Its material can have a lower thermal conductivity than the upper buffer pad, i.e., less than 100 W / mK. The specific heat capacity of the intermediate buffer thermal pad 6 material is no greater than 2 × 10⁻⁶. 3 J / (kg·℃). The lower buffer thermal pad 7 mainly serves a buffering function and should be made of a material with low stiffness. The elastic modulus of the material should not exceed 1 GPa, and the Poisson's ratio of the material of the lower buffer thermal pad 7 should be 0-0.5.

[0035] Preferably, the upper thermal pad 5 is made of aluminum alloy. The middle thermal pad 6 is made of silicone. The lower thermal pad 7 is made of rubber.

[0036] like Figure 3 As shown, the ends of the upper buffer thermal pad 5, the middle buffer thermal pad 6, and the lower buffer thermal pad 7 are interfaces for mating with mounting screws or adjacent thermal buffer pads. The interfaces are round holes, square holes, or elliptical holes.

[0037] Example 1

[0038] This embodiment discloses a heat-conducting buffer structure for satellite pyrotechnics, such as Figure 1 As shown in the figure, 1 is the pyrotechnic unlocking and separation device, 2 is the satellite, 3 is the mounting foot, 4 is the mounting screw, 5 is the upper buffer thermal pad, 6 is the middle buffer thermal pad, and 7 is the lower buffer thermal pad.

[0039] The specific installation steps are as follows:

[0040] Step 1. Connect the pyrotechnic unlocking and separation device 1 to the mounting feet 3 of the satellite 2, fix it with mounting screws 4 and provide pre-tightening force so that the pyrotechnic unlocking and separation device 1 and the satellite 2 fit tightly together to form a heat-conducting buffer structure;

[0041] Step 2. Place the upper buffer thermal pad 5, the middle buffer thermal pad 6, and the lower buffer thermal pad 7 above and below the mounting foot 3 respectively, so that they mate with the mounting screw 4 or the adjacent thermal buffer pad to form an interface. The shape of the interface can be different shapes such as round hole, square hole, and oval hole to adapt to different installation methods.

[0042] Step 3. The upper buffer thermal pad 5, the middle buffer thermal pad 6, and the lower buffer thermal pad 7 are made of different materials to achieve different heat conduction and buffering effects. For example, the upper buffer thermal pad 5 can be made of aluminum alloy, the middle buffer thermal pad 6 can be made of silicone, and the lower buffer thermal pad 7 can be made of rubber.

[0043] Step 4. When the pyrotechnic unlocking and separation device 1 receives the separation signal, it triggers the pyrotechnic explosion, generating high-temperature and high-pressure gas and debris, which threatens the structure and function of satellite 2.

[0044] Among them, the material of the upper buffer heat-conducting pad 5 has a high thermal conductivity and a low coefficient of thermal expansion, which can quickly conduct away the heat generated by the explosion of the pyrotechnics, while preventing structural deformation caused by thermal expansion; the material of the middle buffer heat-conducting pad 6 has a high specific heat capacity and a low thermal conductivity, which can absorb and store the heat generated by the explosion of the pyrotechnics, while slowing down the heat conduction speed and reducing the temperature impact on satellite 2; the material of the lower buffer heat-conducting pad 7 has a low elastic modulus and a high Poisson's ratio, which can withstand and disperse the impact force generated by the explosion of the pyrotechnics, while preventing structural damage caused by the impact.

[0045] The above-mentioned heat conduction buffering method can effectively protect the structure and function of satellite 2 from the influence of pyrotechnic unlocking and separation device 1, and achieve the safe separation of satellite 2.

[0046] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0047] Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. A thermally conductive buffer structure for satellite pyrotechnics, characterized in that, Includes mounting screws (4), mounting feet (3), upper buffer thermal pad (5), middle buffer thermal pad (6), and lower buffer thermal pad (7); The middle buffer heat-conducting pad (6) and the upper buffer heat-conducting pad (5) are arranged from bottom to top on the top of the pyrotechnic unlocking and separation device (1), and the lower buffer heat-conducting pad (7) is arranged between the bottom of the pyrotechnic unlocking and separation device (1) and the satellite (2). The satellite (2) is set on the top of the mounting foot (3), and the mounting screw (4) is used to fix the upper buffer heat-conducting pad (5), the middle buffer heat-conducting pad (6), the pyrotechnic unlocking and separation device (1), the lower buffer heat-conducting pad (7) and the satellite (2) on the mounting foot (3) in sequence and provide pre-tightening force; The upper buffer thermal pad (5), the middle buffer thermal pad (6), and the lower buffer thermal pad (7) are made of different materials; The thermal conductivity of the upper buffer heat-conducting pad (5) is above 100 W / mK, and the coefficient of thermal expansion of the upper buffer heat-conducting pad (5) is not higher than 23.1 × 10⁻⁶. -6 / ℃; The thermal conductivity of the intermediate buffer thermal pad (6) material is less than 100 W / mK, and the specific heat capacity of the intermediate buffer thermal pad (6) material is no greater than 2 × 10⁻⁶ W / mK. 3 J / (kg·℃); The elastic modulus of the material of the lower buffer heat-conducting pad (7) is in the range of no more than 1 GPa, and the Poisson's ratio of the material of the lower buffer heat-conducting pad (7) is in the range of 0-0.

5.

2. The satellite pyrotechnic thermal buffer structure according to claim 1, characterized in that, The upper buffer heat-conducting pad (5) is made of aluminum alloy.

3. The satellite pyrotechnic thermal buffer structure according to claim 1, characterized in that, The material of the intermediate buffer thermal pad (6) is silicone.

4. The satellite pyrotechnic thermal buffer structure according to claim 1, characterized in that, The material of the lower buffer thermal pad (7) is rubber.

5. The satellite pyrotechnic thermal buffer structure according to claim 1, characterized in that, The ends of the upper buffer thermal pad (5), the middle buffer thermal pad (6) and the lower buffer thermal pad (7) are interfaces for mating with mounting screws or adjacent thermal buffer pads, and the interfaces are round holes, square holes or elliptical holes.

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