An auxiliary temperature and humidity control device and a control method thereof

Abstract

The application provides an auxiliary temperature and humidity control device and a control method thereof. The device comprises a vapor compression heat pump system, a box, a semiconductor component, a humidifier device and a control element. The outlet of the compressor of the vapor compression heat pump system is connected to the inlet of a four-way reversing valve, the outlet of the four-way reversing valve is connected to the inlet of a second heat exchanger, the outlet of the second heat exchanger is connected to the inlet of a second electromagnetic valve, the outlet of the second electromagnetic valve is connected to the inlet of a first heat exchanger, and the outlet of the first heat exchanger is connected to the inlet of the compressor. The heat radiator at the hot end of the semiconductor component and the heat radiator at the cold end of the semiconductor component heat or cool the air in the box. The humidifier device comprises a water collecting tank, a water tank, a first electromagnetic valve and a humidifying nozzle. The water collecting tank collects the condensed water formed by the dehumidification of the cold end of the semiconductor component, the water tank is connected to the water collecting tank and is arranged directly below the semiconductor component, and the first electromagnetic valve is connected to the water tank and the humidifying nozzle. The application can precisely control the temperature and humidity in the cabinet, widen the working temperature range and optimize the storage effect of the box.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of constant temperature and humidity control, and particularly relates to an auxiliary temperature and humidity control device and a control method thereof. BACKGROUND

[0002] In recent years, with the continuous improvement of people's living standards, the constant temperature and humidity cabinet industry has developed rapidly to meet the diversified needs of customers to store goods. The traditional vapor compression refrigeration system is widely used in this industry due to its simple structure and high reliability. However, the existing cabinet based on the vapor compression refrigeration system has certain limitations in precise control of temperature range and humidity range. The start-stop of the compressor, changes in environmental factors, fluctuations in load and other factors can cause large changes in temperature and humidity inside the cabinet, which is not good for the storage of some goods that are sensitive to temperature and humidity changes.

[0003] The current constant temperature and humidity cabinet technology that is widely used is to use electric heating technology to balance the additional cooling generated by the refrigeration system, and combine steam humidification and dry dehumidification methods to achieve a constant temperature and humidity environment in the cabinet. This mode has the risk of overheating, a single working temperature zone, and needs to use additional steam to compensate for the air drying problem caused by electric heating. The system is relatively complex and has high energy consumption. SUMMARY

[0004] In view of the problems existing in the prior art, the purpose of the present application is to provide an auxiliary temperature and humidity control device and a control method thereof, which can widen the working temperature zone and precisely control the temperature and humidity in the cabinet.

[0005] In order to achieve the above purpose, the present application adopts the following technical solutions:

[0006] An auxiliary temperature and humidity control device, comprising a vapor compression heat pump system, a cabinet, a semiconductor assembly, a humidifier device and a control element;

[0007] The vapor compression heat pump system comprises a first heat exchanger 110, a compressor 120, a four-way reversing valve 121, a second electromagnetic valve 122 and a second heat exchanger 123. The outlet of the compressor 120 is connected to the inlet of the four-way reversing valve 121, the outlet of the four-way reversing valve 121 is connected to the inlet of the second heat exchanger 123, the outlet of the second heat exchanger 123 is connected to the inlet of the second electromagnetic valve 122, the outlet of the second electromagnetic valve 122 is connected to the inlet of the first heat exchanger 110, and the outlet of the first heat exchanger 110 is connected to the inlet of the compressor 120 through the four-way reversing valve 121;

[0008] The box body comprises a containing chamber 102, an air duct assembly and a detection device; the air duct assembly is composed of a first air duct 103, a second air duct 105, a third air duct 118, an in-box fan 101, a heat dissipation fan 117, a first wind baffle 104, a second wind baffle 111, a third wind baffle 112 and a fourth wind baffle 116; the first air duct 103 is located above the containing chamber 102, the second air duct 105 is located on the right side of the containing chamber 102, the third air duct 118 is located on the right side of the second air duct 105, and the second air duct 105 and the third air duct 118 are located below the first air duct 103; the in-box fan 101 is installed in the containing chamber 102 and the first air duct 103, and the heat dissipation fan 117 is installed below the third air duct 118; the first wind baffle 104 is located between the first air duct 103 and the second air duct 105, the second wind baffle 111 is located between the first air duct 103 and the third air duct 118, the third wind baffle 112 is located at the air inlet end of the third air duct 118, and the fourth wind baffle 116 is located at the air outlet end of the third air duct 118; the detection device comprises a temperature sensor 124 and a humidity sensor 125 arranged in the containing chamber 102.

[0009] The semiconductor assembly comprises a semiconductor refrigeration chip 106, a hot-end heat sink 107 and a cold-end heat sink 113; the semiconductor 106 is arranged at the junction of the second air duct 105 and the third air duct 118, and the hot-end heat sink 107 and the cold-end heat sink 113 are respectively located at the hot end and the cold end of the semiconductor refrigeration chip 106.

[0010] The humidifier device comprises a water collecting tank 114, a water tank 115, a humidifying nozzle 109 and a first electromagnetic valve 108; the water collecting tank 114 is connected to the upper part of the water tank 115 and is arranged directly below the semiconductor assembly to collect the condensed water formed by the dehumidification of the cold end of the semiconductor, and the first electromagnetic valve 108 is connected to the water tank 115 and the humidifying nozzle 109 on both sides to increase the humidity of the air.

[0011] The air duct assembly, the semiconductor refrigeration chip 106, the first electromagnetic valve 108, the compressor 120, the four-way reversing valve 121, the second electromagnetic valve 122, the temperature sensor 124 and the humidity sensor 125 are connected to a control element; the control element feeds back signals through the temperature sensor 124 and the humidity sensor 125 to control the switching of the air duct assembly, the current size and direction entering the semiconductor refrigeration chip 106, the opening degree of the first electromagnetic valve 108, the start-stop and rotating speed of the compressor 120, the direction of the four-way reversing valve 121 and the opening degree of the second electromagnetic valve 122.

[0012] Preferably, the first heat exchanger 110 is arranged in the box body to absorb and release heat from the air in the box body, and the second heat exchanger 123 is arranged outside the box body to release and absorb heat from the air outside the box body.

[0013] The vapor compression heat pump system, in the refrigeration mode, the refrigerant flows out from the outlet of the compressor 120, flows to the second heat exchanger 123 through the four-way reversing valve 121, releases heat to the outdoor air, enters the first heat exchanger 110 after throttling by the second electromagnetic valve 122, absorbs the heat of the air in the box, and reduces the temperature; the evaporated refrigerant returns to the four-way reversing valve 121 in a gaseous state, flows to the compressor 120, and completes the cycle; in the heating mode, the refrigerant flow direction is changed by the four-way reversing valve 121, the refrigerant flows out from the outlet of the compressor 120, flows to the first heat exchanger 110 through the four-way reversing valve 121, releases heat to the air in the box, enters the second heat exchanger 123 after throttling by the second electromagnetic valve 122, absorbs the heat of the air outside the box, and the evaporated refrigerant returns to the four-way reversing valve 121 in a gaseous state, flows to the compressor 120, and completes the cycle.

[0014] Preferably, the semiconductor refrigeration chip 106 is a single-stage semiconductor refrigeration chip, a double-stage semiconductor refrigeration chip or a multi-stage semiconductor refrigeration chip.

[0015] Preferably, the hot end heat sink 107 includes flexible heat-conductive material, heat-conductive pipes and metal fins; the heat-conductive pipes are connected to the hot end of the semiconductor refrigeration chip 106 through flexible heat-conductive material, and the metal fins are arranged on the outside of the heat-conductive pipes; the cold end heat sink 113 includes flexible heat-conductive material, heat-conductive pipes and metal fins; the heat-conductive pipes are connected to the cold end of the semiconductor refrigeration chip 106 through flexible heat-conductive material, and the metal fins are arranged on the outside of the heat-conductive pipes; the switching of the cold and hot ends is realized by changing the direction of the current flowing into the semiconductor refrigeration chip 106.

[0016] Preferably, the flexible heat-conductive material is made of any one of heat-conductive film, heat-conductive silica gel, graphite sheet and heat-conductive sheet, has good heat-conductive performance, can effectively transfer heat to the heat-conductive metal block for heat dissipation, improve the overall heat dissipation performance of the heat sink, and can easily fit components of various shapes, improve the thermal contact area and enhance the heat exchange effect.

[0017] Preferably, the hole plate material above the containing chamber 102 is made of large-pore foam metal, and the chamber wall material is made of nano-pore foam metal, which can significantly reduce the overall weight of the containing chamber 102, and the material has a large specific surface area and good heat-conductive performance, and has strong heat exchange capacity; the phase change material 119 is adsorbed on the surface of the hole plate and the chamber wall to realize the energy storage effect.

[0018] The control method of the auxiliary temperature and humidity control device measures the temperature value T1 in the box by the temperature sensor 124, measures the humidity value H1 in the box by the humidity sensor 125, and sets the rated set temperature T s When the rated set temperature in the box is T s1When the rated set temperature in the cabinet in the heating mode is T s2 , the rated set humidity in the cabinet is H s； When T s -1≤T1≤T s +1, 0.95H s ≤H1≤1.05H s , the compressor 120 is powered off, the semiconductor refrigeration chip 106 works by default current, and the humidifier device works by default;

[0019] In the cabinet cooling mode, the first air baffle 104 is opened, the second air baffle 111 is closed, the third air baffle 112 is opened, the fourth air baffle 116 is opened, the cabinet fan 101 is opened, and the heat dissipation fan 117 is opened. When T s1 -3≤T1<T s1 -1, the current flowing into the semiconductor refrigeration chip 106 is continuously increased until the rated current is reached, and the hot-end heat sink 107 heats the air in the cabinet; on the one hand, the heated air is sent into the containing chamber 102 through the orifice plate by the guiding effect of the cabinet fan 101, and on the other hand, the cold-end heat sink 113 is cooled by the air outside the cabinet by the heat dissipation fan 117; when T s1 -5≤T1<T s1 -3, the compressor 120 gradually reduces the speed and the opening degree of the second electromagnetic valve 122, and the semiconductor refrigeration chip 106 works at the rated current; when T1<T s1 -5, the speed of the compressor 120 and the opening degree of the second electromagnetic valve 122 are adjusted to the minimum, the semiconductor refrigeration chip 106 works at the rated current, the second air baffle 111 is opened, and the outdoor air with high temperature is introduced into the cabinet to heat the air in the cabinet; in the cabinet cooling mode, the first air baffle 104 is opened, the second air baffle 111 is closed, the third air baffle 112 is opened, the fourth air baffle 116 is opened, the cabinet fan 101 is opened, and the heat dissipation fan 117 is opened. When T s1 +1<T1≤T s1 +3, the direction of the rated current flowing into the semiconductor refrigeration chip 106 is changed, the current is continuously increased until the rated current is reached, and the cold-end heat sink 113 cools the air in the cabinet; on the one hand, the cooled air is sent into the containing chamber 102 through the orifice plate by the guiding effect of the cabinet fan 101, and on the other hand, the hot-end heat sink 107 is cooled by the air outside the cabinet by the heat dissipation fan 117; when T s1 +3<T1≤T s1 +5, the compressor 120 gradually increases the speed and the opening degree of the second electromagnetic valve 122, and the semiconductor refrigeration chip 106 works at the rated current; when T s1+5 < T1, the compressor 120 speed and the second electromagnetic valve 122 opening are adjusted to the maximum, the semiconductor refrigeration chip 106 works at the rated current; in terms of humidity control, the humidity value H1 in the box is measured by the humidity sensor 125, the second air baffle 111 is closed; in the refrigeration and humidification mode in the box, when 0.90H s ≤ H1 < 0.95H s , the current of the semiconductor refrigeration chip 106 is continuously reduced until the minimum working current, the water stored in the water tank 115 is humidified to the air in the box through the humidification nozzle 109; when 0.85H s ≤ H1 < 0.90H s , the opening of the first electromagnetic valve 108 is continuously increased, and the semiconductor refrigeration chip 106 is at the minimum working current; when H1 < 0.85H s , the opening of the first electromagnetic valve 108 is at the maximum, and the semiconductor refrigeration chip 106 is at the minimum working current; in the refrigeration and dehumidification mode in the box, when 1.05H s < H1 ≤ 1.10H s , the current of the semiconductor refrigeration chip 106 is continuously increased until the rated current, and the dehumidification capacity is increased; when 1.10H s < H1 ≤ 1.15H s , the opening of the first electromagnetic valve 108 is continuously reduced, and the semiconductor refrigeration chip 106 works at the rated current; when 1.15H s < H1, the opening of the first electromagnetic valve 108 is at the minimum, and the semiconductor refrigeration chip 106 works at the rated current;

[0020] In the heating mode in the box, the first air baffle 104 is opened, the second air baffle 111 is closed, the third air baffle 112 is opened, the fourth air baffle 116 is opened, the box fan 101 is opened, and the heat dissipation fan 117 is opened; when T s2 -3 < T1 ≤ T s2 -1, the current flowing into the semiconductor refrigeration chip 106 is continuously increased until the rated current, and the hot end heat sink 107 heats the air in the box; on the one hand, the heated air is sent into the containing chamber 102 through the orifice plate by the guiding effect of the box fan 101, and on the other hand, the cold end heat sink 113 is cooled by the air outside the box through the heat dissipation fan 117; when T s2 -5 < T1 ≤ T s2 -3, the compressor 120 gradually increases the speed and the opening of the second electromagnetic valve 122, and the semiconductor refrigeration chip 106 works at the rated current; when T1 < T s2-5, the compressor 120 speed and the second electromagnetic valve 122 opening degree to the maximum, the semiconductor refrigeration chip 106 at rated current work; in the case of the box in heating mode cooling, open the first baffle 104, close the second baffle 111, open the third baffle 112, open the fourth baffle 116, open the box fan 101, open the heat dissipation fan 117, when T s2 +1≤T1≤T s2 +3, change the direction of the semiconductor refrigeration chip 106 rated current, constantly increase, until the rated current, cold end heat sink 113 on the air in the box cooling. On the one hand through the box fan 101 guide flow effect will be cooled air into the cavity 102 through the orifice plate, on the other hand through the heat dissipation fan 117 using the air outside the box heat dissipation heat sink 107; when T s2 +3≤T1≤T s2 +5, the compressor 120 gradually reduce the speed and reduce the second electromagnetic valve 122 opening degree, the semiconductor refrigeration chip 106 at rated current work; when T1 s1 +5, the compressor 120 speed and the second electromagnetic valve 122 opening degree to the minimum, the semiconductor refrigeration chip 106 at rated current work, open the second baffle 111, the temperature of the box outside air into the box, so as to cool the air in the box; in terms of humidity control, through the humidity sensor 125 measure the humidity value H1 in the box, open the second baffle 111, close the third baffle 112 and the fourth baffle 116. In the case of the box in heating and humidification mode, when 0.90H s ≤H1≤0.95H s , the semiconductor refrigeration chip 106 current constantly decrease, until the minimum working current, the water tank 115 stored water through the humidification nozzle 109 on the air in the box humidification; when 0.85H s ≤H1≤0.90H s , the first electromagnetic valve 108 opening degree constantly increase, the semiconductor refrigeration chip 106 at minimum working current; when H1 s , the first electromagnetic valve 108 opening degree at the maximum, the semiconductor refrigeration chip 106 at minimum working current; in the case of the box in heating and dehumidification mode, when 1.05H s ≤H1≤1.10H s , the semiconductor refrigeration chip 106 current constantly increase, until the rated current, increase the dehumidification capacity; when 1.10H s ≤H1≤1.15H s , the first electromagnetic valve 108 opening degree constantly decrease, the semiconductor refrigeration chip 106 at rated current work; when 1.15H s , the first electromagnetic valve 108 opening degree at the minimum, the semiconductor refrigeration chip 106 at rated current work.

[0021] The initial opening degree of the first electromagnetic valve 108 and the second electromagnetic valve (122) is 1 / 4 of the full opening degree of the valve, facilitating subsequent adjustment.

[0022] The compressor (120) is a variable frequency compressor, which controls the temperature of the refrigerant pipeline by automatically adjusting the rotating speed, thereby matching various requirements.

[0023] The steam compression heat pump system and the semiconductor refrigeration system are coupled, and a humidifier device is added, so that the temperature and humidity of the air in the containing chamber are controlled, the problem of low precision of the steam compression heat pump system in controlling the temperature and humidity in the box is solved, and the storage effect of the box is optimized.

[0024] Compared with the prior art, the auxiliary temperature and humidity control device and the control method thereof can compare the values output by the temperature sensor and the humidity sensor with the set value range, and realize the adjustment of the temperature and the humidity. In terms of temperature control, when the temperature in the box is low, the hot end of the semiconductor assembly is used to heat the air in the box; when the temperature in the box is high, the direction of the current flowing into the semiconductor assembly is changed, and the cold end of the semiconductor assembly is used to cool the air in the box; when the temperature in the box is too low or too high, the compressor is started and stopped, the rotating speed and the opening degree of the second electromagnetic valve are controlled to match the excess heat or cold. In terms of humidity control, when the humidity in the box is low, the humidifier device humidifies the air in the box by using the humidification nozzle; when the humidity in the box is high, the semiconductor assembly is used to cool the air to reduce the humidity; when the humidity in the box is too low or too high, the first electromagnetic valve is controlled to adjust the humidification amount of the humidification nozzle. When the temperature in the box is in the rated set temperature range and the humidity in the box is in the rated set humidity range, the compressor is powered off, the semiconductor assembly works by default, and the humidifier device works by default. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is a structural schematic view of the auxiliary temperature and humidity control device of the embodiment of the present application;

[0026] Figure 2 It is a feedback control schematic view of the control element of the embodiment of the present application;

[0027] Figure 3 It is a control logic diagram of the auxiliary temperature and humidity control device of the embodiment of the present application in the refrigeration mode in the box;

[0028] Figure 4 The control logic diagram of the auxiliary temperature and humidity control device in the heat supply mode in the box body according to the embodiment of the present application;

[0029] In the drawings: 101 - fan in the box body; 102 - containing chamber; 103 - first air duct; 104 - first air baffle; 105 - second air duct; 106 - semiconductor assembly; 107 - hot end heat sink; 108 - first electromagnetic valve; 109 - humidification nozzle; 110 - first heat exchanger; 111 - second air baffle; 112 - third air baffle; 113 - cold end heat sink; 114 - water collecting tank; 115 - water tank; 116 - fourth air baffle; 117 - heat dissipation fan; 118 - third air duct; 119 - phase change material; 120 - compressor; 121 - four-way reversing valve; 122 - second electromagnetic valve; 123 - second heat exchanger; 124 - temperature sensor; 125 - humidity sensor. DETAILED DESCRIPTION

[0030] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the related drawings will be further described in detail below.

[0031] The embodiment of the present application proposes an auxiliary temperature and humidity control device and a control method thereof, which uses a four-way reversing valve to flexibly switch a vapor compression heat pump system to perform refrigeration or heat supply to air in a box body, improves the functionality of the system, and meets various requirements; a semiconductor assembly is arranged at the center of the adjacent wall surface between the second air duct and the third air duct, the cold and hot ends are switched by changing the current direction of the power supply, the temperature of the air in the box body is actively adjusted, and accurate temperature control is realized; a humidifier device is arranged directly below the heat sink of the semiconductor assembly, the water collecting tank and the water tank collect the condensed water of the cold end heat sink, when the humidity of the air in the box body is low, the humidity of the air in the box body is improved through the humidification nozzle, and the humidification function of the device is realized. The traditional vapor compression heat pump system is coupled with the semiconductor refrigeration technology, and the humidifier device is assisted and matched, so that accurate temperature and humidity control can be realized, and the storage effect of the box body is optimized.

[0032] Please refer to Figure 1The application embodiment auxiliary temperature and humidity control device includes a box fan 101 containing chamber 102, a first air duct 103, a first wind blocking piece 104, a second air duct 105, a semiconductor assembly 106, a hot end heat sink 107, a first electromagnetic valve 108, a humidification nozzle 109, a first heat exchanger 110, a second wind blocking piece 111, a third wind blocking piece 112, a cold end heat sink 113, a water collecting tank 114, a water tank 115, a fourth wind blocking piece 116, a heat dissipation fan 117, a third air duct 118, a phase change material 119, a compressor 120, a four-way reversing valve 121, a second electromagnetic valve 122, a second heat exchanger 123, a temperature sensor 124, and a humidity sensor 125. The compressor 120 outlet is connected to the four-way reversing valve 121 inlet, the four-way reversing valve 121 outlet is connected to the second heat exchanger 123 inlet, the second heat exchanger 123 outlet is connected to the second electromagnetic valve 122 inlet, the second electromagnetic valve 122 outlet is connected to the first heat exchanger 110 inlet, and the first heat exchanger 110 outlet is connected to the compressor 120 inlet through the four-way reversing valve 121. In the refrigeration mode, the refrigerant flows out from the compressor 120 outlet, flows to the second heat exchanger 123 through the four-way reversing valve 121, releases heat to the outdoor air, enters the first heat exchanger 110 after throttling through the second electromagnetic valve 122, absorbs the heat of the air in the box, and reduces the temperature. The evaporated refrigerant returns to the four-way reversing valve 121 in a gaseous state, flows to the compressor 120, and completes the cycle. In the heating mode, the four-way reversing valve 121 changes the flow direction of the refrigerant, the refrigerant flows out from the compressor 120 outlet, flows to the first heat exchanger 110 through the four-way reversing valve 121, releases heat to the air in the box, enters the second heat exchanger 123 after throttling through the second electromagnetic valve 122, absorbs the heat of the air outside the box, the evaporated refrigerant returns to the four-way reversing valve 121 in a gaseous state, flows to the compressor 120, and completes the cycle.The semiconductor assembly is arranged at the center of the wall adjacent to the second air duct 105 and the third air duct 118, and is connected with the hot end heat sink 107 and the cold end heat sink 113 by using flexible heat-conducting materials; the water collecting tank 114 is connected with the upper part of the water tank 115 and is arranged directly below the semiconductor assembly to collect the condensed water formed by the dehumidification of the cold end of the semiconductor; the two sides of the first electromagnetic valve 108 are connected with the water tank 115 and the humidifying nozzle 109 respectively to increase the humidity of the air; the hole plate on the upper part of the containing chamber 102 and the surface of the chamber wall are closely attached to the phase change material 119; the first air duct is located above the containing chamber 102, the second air duct 105 is located on the right side of the containing chamber 102, and the third air duct 118 is located on the right side of the second air duct 105; the box fan 101 is installed in the containing chamber 102 and the first air duct 103, and the heat dissipation fan 117 is installed below the third air duct 118; the first wind blocking piece 104 is located between the first air duct 103 and the second air duct 105, the second wind blocking piece 111 is located between the first air duct 103 and the third air duct 118, the third wind blocking piece 112 is located at the air inlet end of the third air duct 118, and the fourth wind blocking piece 116 is located at the air outlet end of the third air duct 118.

[0033] The semiconductor refrigeration chip 106 of the embodiment of the present application is a multi-stage semiconductor refrigeration chip, which increases the temperature control interval to match various working conditions. The heat-conducting pipes with metal fins are connected with the hot end and the cold end of the semiconductor refrigeration chip 106 through flexible heat-conducting materials; and the switching of the cold end and the hot end is realized by changing the current direction flowing into the semiconductor refrigeration chip 106.

[0034] The flexible heat-conducting material used in the embodiment of the present application can be any one of a heat-conducting film, heat-conducting silica gel, a graphite sheet and a heat-conducting sheet. Since the flexible heat-conducting material has good heat-conducting performance, it can effectively transfer heat to the heat-conducting metal block for heat dissipation, improve the overall heat dissipation performance of the heat sink, and easily attach to components of various shapes to improve the heat contact area and enhance the heat exchange effect.

[0035] The material of the hole plate on the upper part of the containing chamber 102 in the embodiment of the present application is a large-pore foam metal, and the material of the chamber wall is a nano-pore foam metal, which can significantly reduce the overall weight of the containing chamber 102, and the material has a large specific surface area and good heat-conducting performance, and has strong heat exchange capacity.

[0036] The phase change material 119 in the embodiment of the present application is a solid-liquid phase change material of hydrated salt, which has the advantages of high phase change latent heat and simple preparation, and can adjust the air temperature in the box by absorbing or releasing heat to improve the stability of the system. The phase change material is encapsulated into a microcapsule and adsorbed in porous particles to prepare a composite phase change material, which effectively solves the problems of migration and leakage of the liquid phase change material and is conducive to recycling.

[0037] Please refer toFigure 2 The air duct assembly, the semiconductor refrigeration chip 106, the first electromagnetic valve 108, the compressor 120, the four-way reversing valve 121, the second electromagnetic valve 122, and the temperature sensor 124 and the humidity sensor 125 in the embodiment of the present application are connected with the control element; the control element feeds back signals through the temperature sensor 124 and the humidity sensor 125 to control the switch of the air duct assembly, the current size and direction entering the semiconductor refrigeration chip 106, the opening degree of the first electromagnetic valve 108, the start-stop and rotating speed of the compressor 120, the direction of the four-way reversing valve 121, and the opening degree of the second electromagnetic valve 122.

[0038] Please refer to Figure 3 and Figure 4 The auxiliary temperature and humidity control device and the control method thereof in the embodiment of the present application specifically include:

[0039] Set corresponding working condition parameters, T s represents the rated set temperature in the cabinet, T s1 represents the rated set temperature in the cabinet in the refrigeration mode, T s2 represents the rated set temperature in the cabinet in the heating mode, H s represents the rated set humidity in the cabinet. The temperature value T1 in the cabinet is measured by the temperature sensor 124, and the humidity value H1 in the cabinet is measured by the humidity sensor 125.

[0040] The air in the cabinet is cooled or heated by changing the direction of the four-way reversing valve 121 in the vapor compression heat pump system. When in the cabinet refrigeration mode, the first heat exchanger 110 in the system absorbs heat to cool the air in the cabinet. When in the cabinet heating mode, the first heat exchanger 110 in the system releases heat to heat the air in the cabinet.

[0041] When T s -1≤T1≤T s +1, 0.95H s ≤H1≤1.05H s , at this time, the temperature of the air in the cabinet is within the range of ±1℃ of the rated set temperature, the humidity of the air in the cabinet is within the range of 5% of the rated set humidity, the compressor 120 is powered off, and the temperature and humidity environment in the cabinet is maintained by the semiconductor refrigeration chip 106 and the humidifier device.

[0042] In the cabinet refrigeration mode heating case, the first air baffle 104 is opened, the second air baffle 111 is closed, the third air baffle 112 is opened, the fourth air baffle 116 is opened, the cabinet fan 101 is opened, and the heat dissipation fan 117 is opened, when T s1 -3≤T1<T s1-1, the temperature in the box is slightly lower than the rated set temperature in the box, the current flowing into the semiconductor refrigeration chip 106 is continuously increased until the rated current is reached, and the hot end heat sink 107 heats the air in the box; on the one hand, the heated air is sent into the containing chamber 102 through the orifice plate by the guiding effect of the box fan 101, and on the other hand, the cold end heat sink 113 is cooled by the air outside the box by the cooling fan 117;

[0043] When T s1 -5 < T1 < T s1 -3, the temperature in the box is obviously lower than the rated set temperature interval in the box, the compressor 120 gradually reduces the speed and reduces the opening of the second electromagnetic valve 122, and the semiconductor refrigeration chip 106 works under the rated current;

[0044] When T1 < T s1 -5, the temperature in the box is far lower than the rated set temperature interval in the box, the speed of the compressor 120 and the opening of the second electromagnetic valve 122 are adjusted to the minimum, the semiconductor refrigeration chip 106 works under the rated current, the second air baffle 111 is opened, and the outdoor air with high temperature is introduced into the box to heat the air in the box;

[0045] In the cooling case of the refrigeration mode in the box, the first air baffle 104 is opened, the second air baffle 111 is closed, the third air baffle 112 is opened, the fourth air baffle 116 is opened, the box fan 101 is opened, and the cooling fan 117 is opened, when T s1 +1 < T1 < T s1 +3, the temperature in the box is slightly higher than the rated set temperature interval in the box, the direction of the rated current flowing into the semiconductor refrigeration chip 106 is changed, the current is continuously increased until the rated current is reached, and the cold end heat sink 113 cools the air in the box; on the one hand, the cooled air is sent into the containing chamber 102 through the orifice plate by the guiding effect of the box fan 101, and on the other hand, the hot end heat sink 107 is cooled by the air outside the box by the cooling fan 117;

[0046] When T s1 +3 < T1 < T s1 +5, the temperature in the box is obviously higher than the rated set temperature interval in the box, the speed of the compressor 120 and the opening of the second electromagnetic valve 122 are gradually increased, and the semiconductor refrigeration chip 106 works under the rated current;

[0047] When T s1 +5 < T1, the temperature in the box is far higher than the rated set temperature interval in the box, the speed of the compressor 120 and the opening of the second electromagnetic valve 122 are adjusted to the maximum, and the semiconductor refrigeration chip 106 works under the rated current;

[0048] In terms of humidity control, the humidity value H1 in the box is measured by the humidity sensor 125, and the second air baffle 111 is closed. In the refrigeration and humidification mode in the box, when 0.90H s ≤H1<0.95H s , the humidity in the box is low, the current of the semiconductor refrigeration chip 106 is continuously reduced until the minimum working current, the water stored in the water tank 115 is humidified to the air in the box through the humidification nozzle 109, and the opening degree of the first electromagnetic valve 108 is adjusted to control the humidification amount;

[0049] When 0.85H s ≤H1<0.90H s , the humidity in the box is significantly lower than the rated value, the opening degree of the first electromagnetic valve 108 is continuously increased, and the semiconductor refrigeration chip 106 is at the minimum working current;

[0050] When H1<0.85H s , the humidity in the box is far lower than the rated value, the opening degree of the first electromagnetic valve 108 is at the maximum, and the semiconductor refrigeration chip 106 is at the minimum working current.

[0051] In the refrigeration and dehumidification mode in the box, when 1.05H s <H1≤1.10H s , the humidity in the box is high, the current of the semiconductor refrigeration chip 106 is continuously increased until the rated current, and the dehumidification capacity is increased;

[0052] When 1.10H s <H1≤1.15H s , the humidity in the box is significantly higher than the rated value, the opening degree of the first electromagnetic valve 108 is continuously reduced, and the semiconductor refrigeration chip 106 works at the rated current;

[0053] When 1.15H s <H1, the humidity in the box is far higher than the rated value, the opening degree of the first electromagnetic valve 108 is at the minimum, and the semiconductor refrigeration chip 106 works at the rated current.

[0054] In the heating mode in the box, the first air baffle 104 is opened, the second air baffle 111 is closed, the third air baffle 112 is opened, the fourth air baffle 116 is opened, the box fan 101 is opened, and the heat dissipation fan 117 is opened. When T s2 -3<T1≤T s2-1, the temperature in the box is slightly lower than the rated set temperature interval, the first baffle 104 is opened, the second baffle 111 is closed, the third baffle 112 is opened, the box fan 101 is opened, and the heat dissipation fan 117 is opened, and the box is heated. The current flowing through the semiconductor refrigeration chip 106 is continuously increased until the rated current is reached, and the hot end heat sink 107 heats the air in the box; on the one hand, the heated air is sent into the containing chamber 102 through the orifice plate by the guiding effect of the box fan 101, and on the other hand, the cold end heat sink 113 is cooled by the outdoor air through the heat dissipation fan 117;

[0055] When T s2 -5≤T1<T s2 -3, the temperature in the box is significantly lower than the rated set temperature interval, the compressor 120 gradually increases the speed and the opening of the second electromagnetic valve 122, and the semiconductor refrigeration chip 106 works at the rated current;

[0056] When T1<T s2 -5, the temperature in the box is far lower than the rated set temperature interval, the compressor 120 and the second electromagnetic valve 122 are adjusted to the maximum, and the semiconductor refrigeration chip 106 works at the rated current;

[0057] In the cooling case of the heating mode in the box, the first baffle 104 is opened, the second baffle 111 is closed, the third baffle 112 is opened, the fourth baffle 116 is opened, the box fan 101 is opened, and the heat dissipation fan 117 is opened, when T s2 +1<T1≤T s2 +3, the temperature in the box is slightly higher than the rated set temperature interval. The direction of the rated current flowing through the semiconductor refrigeration chip 106 is changed and continuously increased until the rated current is reached, and the cold end heat sink 113 cools the air in the box. On the one hand, the cooled air is sent into the containing chamber 102 through the orifice plate by the guiding effect of the box fan 101, and on the other hand, the hot end heat sink 107 is cooled by the outdoor air through the heat dissipation fan 117;

[0058] When T s1 +3<T1≤T s1 +5, the temperature in the box is significantly higher than the rated set temperature interval, the compressor 120 gradually reduces the speed and the opening of the second electromagnetic valve 122, and the semiconductor refrigeration chip 106 works at the rated current;

[0059] When T s1When T1> +5, the temperature in the box is much higher than the rated temperature range, the compressor 120 and the second electromagnetic valve 122 are adjusted to the minimum, the semiconductor refrigeration chip 106 works at the rated current, the second air baffle 111 is opened, and the outdoor air with lower temperature is introduced into the box to cool the air in the box.

[0060] In terms of humidity control, the humidity value H1 in the box is measured by the humidity sensor 125, the second air baffle 111 is opened, the third air baffle 112 and the fourth air baffle 116 are closed, the box fan 101 is opened, and the heat dissipation fan 117 is opened. In the heating and humidifying mode in the box, when 0.90H s ≤H1<0.95H s , the humidity in the box is low, the current of the semiconductor refrigeration chip 106 is continuously reduced until the minimum working current, the water stored in the water tank 115 is humidified to the air in the box through the humidifying nozzle 109, and the opening degree of the first electromagnetic valve 108 is adjusted to control the humidification amount;

[0061] When 0.85H s ≤H1<0.90H s , the humidity in the box is obviously lower than the rated value, the opening degree of the first electromagnetic valve 108 is continuously increased, and the semiconductor refrigeration chip 106 is at the minimum working current;

[0062] When H1<0.85H s , the humidity in the box is much lower than the rated value, the opening degree of the first electromagnetic valve 108 is at the maximum, and the semiconductor refrigeration chip 106 is at the minimum working current.

[0063] In the heating and dehumidifying mode in the box, when 1.05H s <H1≤1.10H s , the humidity in the box is high, the current of the semiconductor refrigeration chip 106 is continuously increased until the rated current, and the dehumidification capacity is increased;

[0064] When 1.10H s <H1≤1.15H s , the humidity in the box is obviously higher than the rated value, the opening degree of the first electromagnetic valve 108 is continuously reduced, and the semiconductor refrigeration chip 106 works at the rated current;

[0065] When 1.15H s <H1, the humidity in the box is much higher than the rated value, the opening degree of the first electromagnetic valve 108 is at the minimum, and the semiconductor refrigeration chip 106 works at the rated current.

[0066] In the aspect of constant temperature and humidity, in the refrigeration mode in the box, the first wind baffle 104 is opened, the second wind baffle 111 is closed, the third wind baffle 112 is opened, the fourth wind baffle 116 is opened, the in-box fan 101 is opened, the heat dissipation fan 117 is opened, the semiconductor component 106 is current reversed, the current is adjusted to the default current, the first electromagnetic valve 108 is adjusted to the initial opening, the humidification nozzle 109 is used for stable humidification in the box, the cold end radiator 113 is used for cooling and dehumidifying the air in the box, the heat penetration from the outside to the box is consumed, and the constant temperature and humidity in the box is maintained; in the heating mode in the box, the first wind baffle 104 is opened, the second wind baffle 111 is opened, the third wind baffle 112 is closed, the fourth wind baffle 116 is closed, the in-box fan 101 is opened, the heat dissipation fan 117 is opened, the semiconductor refrigeration chip 106 is adjusted to the default current, the first electromagnetic valve 108 is adjusted to the initial opening, the humidification nozzle 109 is used for stable humidification in the box, and the cold end radiator 113 is used for cooling and dehumidifying the air in the box, the heat penetration from the outside to the box is consumed, and the constant temperature and humidity in the box is maintained.

[0067] The above merely describes the preferred embodiments of the present application and is not intended to limit the technical solutions of the present application. Those skilled in the art should understand that without departing from the spirit and principle of the present application, the technical solutions can be simply modified and replaced, and these modifications and replacements also belong to the protection scope of the claims.

Claims

1. An auxiliary temperature and humidity control device, characterized by: The application relates to a vapor compression heat pump system, a box body, a semiconductor assembly, a humidifier device and a control element. The vapor compression heat pump system comprises a first heat exchanger (110), a compressor (120), a four-way reversing valve (121), a second electromagnetic valve (122) and a second heat exchanger (123); the compressor (120) is connected with the inlet of the four-way reversing valve (121), the outlet of the four-way reversing valve (121) is connected with the inlet of the second heat exchanger (123), the outlet of the second heat exchanger (123) is connected with the inlet of the second electromagnetic valve (122), the outlet of the second electromagnetic valve (122) is connected with the inlet of the first heat exchanger (110), and the outlet of the first heat exchanger (110) is connected with the inlet of the compressor (120) through the four-way reversing valve (121); The box body comprises a containing chamber (102), an air duct assembly and a detection device; the air duct assembly is composed of a first air duct (103), a second air duct (105), a third air duct (118), an in-box fan (101), a heat dissipation fan (117), a first air baffle (104), a second air baffle (111), a third air baffle (112) and a fourth air baffle (116); the first air duct (103) is located above the containing chamber (102), the second air duct (105) is located on the right side of the containing chamber (102), the third air duct (118) is located on the right side of the second air duct (105), and the second air duct (105) and the third air duct (118) are located below the first air duct (103); the in-box fan (101) is installed in the containing chamber (102) and the first air duct (103), and the heat dissipation fan (117) is installed below the third air duct (118); the first air baffle (104) is located between the first air duct (103) and the second air duct (105), the second air baffle (111) is located between the first air duct (103) and the third air duct (118), the third air baffle (112) is located at the air inlet end of the third air duct (118), and the fourth air baffle (116) is located at the air outlet end of the third air duct (118); the detection device comprises a temperature sensor (124) and a humidity sensor (125) arranged in the containing chamber (102); The semiconductor assembly comprises a semiconductor refrigeration chip (106), a hot end heat dissipator (107) and a cold end heat dissipator (113); the semiconductor refrigeration chip (106) is arranged at the joint of the second air duct (105) and the third air duct (118), the hot end heat dissipator (107) and the cold end heat dissipator (113) are respectively located at the hot end and the cold end of the semiconductor refrigeration chip (106); The humidifier device comprises a water collecting groove (114), a water tank (115), a humidifying nozzle (109) and a first electromagnetic valve (108); the water collecting groove (114) is connected with the upper portion of the water tank (115) and is arranged directly below the semiconductor assembly to collect condensed water generated by the semiconductor cold end dehumidification; the first electromagnetic valve (108) is connected with the water tank (115) and the humidifying nozzle (109) on the two sides respectively, so that the humidity of air is increased. The air duct assembly, the semiconductor refrigeration chip (106), the first electromagnetic valve (108), the compressor (120), the four-way reversing valve (121), the second electromagnetic valve (122), the temperature sensor (124) and the humidity sensor (125) are connected with the control element; the control element feeds back signals from the temperature sensor (124) and the humidity sensor (125) to control the switch of the air duct assembly, the current size and direction entering the semiconductor refrigeration chip (106), the opening of the first electromagnetic valve (108), the start-stop and rotating speed of the compressor (120), the direction of the four-way reversing valve (121) and the opening of the second electromagnetic valve (122).

2. The device according to claim 1, wherein: The first heat exchanger (110) is arranged in the box body and is used for absorbing and releasing heat of air in the box body; and the second heat exchanger (123) is arranged outside the box body and is used for absorbing and releasing heat of air outside the box body.

3. The device according to claim 1, wherein: In the refrigeration mode, the refrigerant flows out from the outlet of the compressor (120), flows to the second heat exchanger (123) through the four-way reversing valve (121), releases heat to outdoor air, enters the first heat exchanger (110) after throttling by the second electromagnetic valve (122), absorbs heat of air in the box body and reduces the temperature; the evaporated refrigerant returns to the four-way reversing valve (121) in a gaseous state, flows to the compressor (120) and completes the cycle; in the heating mode, the flow direction of the refrigerant is changed by the four-way reversing valve (121), the refrigerant flows out from the outlet of the compressor (120), flows to the first heat exchanger (110) through the four-way reversing valve (121), releases heat to air in the box body, enters the second heat exchanger (123) after throttling by the second electromagnetic valve (122), absorbs heat of air outside the box body, the evaporated refrigerant returns to the four-way reversing valve (121) in a gaseous state, flows to the compressor (120) and completes the cycle.

4. The device according to claim 1, wherein: The semiconductor refrigeration chip (106) is a single-stage semiconductor refrigeration chip or a multi-stage semiconductor refrigeration chip.

5. The device according to claim 1, wherein: The heat sink (107) comprises a flexible heat-conducting material, a heat-conducting pipe and metal fins; the heat-conducting pipe is connected to the hot end of the semiconductor refrigeration chip (106) through the flexible heat-conducting material, and the metal fins are arranged outside the heat-conducting pipe; the cold end heat sink (113) comprises a flexible heat-conducting material, a heat-conducting pipe and metal fins; the heat-conducting pipe is connected to the cold end of the semiconductor refrigeration chip (106) through the flexible heat-conducting material, and the metal fins are arranged outside the heat-conducting pipe; the switching of the cold end and the hot end is realized by changing the current direction flowing into the semiconductor refrigeration chip (106).

6. The device according to claim 5, wherein: The flexible heat-conducting material adopts a heat-conducting film or a heat-conducting sheet.

7. The device according to claim 1, wherein: The hole plate material above the accommodation chamber (102) adopts a large-pore foam metal, and the chamber wall material adopts a nano-pore foam metal; the phase change material (119) is adsorbed on the surfaces of the hole plate and the chamber wall to realize the energy storage effect.

8. The control method of the auxiliary temperature and humidity control device according to any one of claims 1 to 7, characterized in that: The temperature value T1 in the box is measured by the temperature sensor (124), and the humidity value H1 in the box is measured by the humidity sensor (125). The rated set temperature in the box is T s When the rated set temperature in the box is T s1 in the refrigeration mode, the rated set temperature in the box is T s2 in the heating mode, the rated set humidity in the box is H s； When T s -1≤T1≤T s +1, 0.95H s ≤H1≤1.05H s , the compressor (120) is powered off, the semiconductor refrigeration chip (106) is in default current work, and the humidifier device is in default work. In the case of heating in the box in the cooling mode, the first baffle (104) is opened, the second baffle (111) is closed, the third baffle (112) is opened, the fourth baffle (116) is opened, the box fan (101) is opened, and the heat dissipation fan (117) is opened. When T s1 -3≤T1<T s1 -1, the current flowing into the semiconductor refrigeration chip (106) is continuously increased until the rated current is reached, and the hot end heat sink (107) heats the air in the box; on the one hand, the heated air is sent into the containing chamber (102) through the orifice plate by the flow guiding effect of the box fan (101), and on the other hand, the cold end heat sink (113) is cooled by the air outside the box by the heat dissipation fan (117); when T s1 -5≤T1<T s1 -3, the compressor (120) gradually reduces the speed and reduces the opening of the second electromagnetic valve (122), and the semiconductor refrigeration chip (106) works at the rated current; when T1<T s1 -5, the speed of the compressor (120) and the opening of the second electromagnetic valve (122) are adjusted to the minimum, the semiconductor refrigeration chip (106) works at the rated current, the second baffle (111) is opened, and the outdoor air with high temperature is introduced into the box to heat the air in the box; in the case of cooling in the cooling mode in the box, the first baffle (104) is opened, the second baffle (111) is closed, the third baffle (112) is opened, the fourth baffle (116) is opened, the box fan (101) is opened, and the heat dissipation fan (117) is opened. When T s1 +1<T1≤T s1 +3, the direction of the rated current flowing into the semiconductor refrigeration chip (106) is changed, the current is continuously increased until the rated current is reached, and the cold end heat sink (113) cools the air in the box; on the one hand, the cooled air is sent into the containing chamber (102) through the orifice plate by the flow guiding effect of the box fan (101), and on the other hand, the hot end heat sink (107) is cooled by the air outside the box by the heat dissipation fan (117); when T s1 +3<T1≤T s1 +5, the speed of the compressor (120) is gradually increased and the opening of the second electromagnetic valve (122) is increased, and the semiconductor refrigeration chip (106) works at the rated current; when T s1 +5<T1, the speed of the compressor (120) and the opening of the second electromagnetic valve (122) are adjusted to the maximum, and the semiconductor refrigeration chip (106) works at the rated current; in terms of humidity control, the humidity value H1 in the box is measured by the humidity sensor (125), and the second baffle (111) is closed; in the case of cooling and humidification in the box, when 0.90H s ≤H1<0.95H s When 0.85H s ≤H1<0.90H s When H1 is less than 0.85H, the opening of the first solenoid valve (108) increases continuously, and the semiconductor refrigeration chip (106) is at the minimum operating current; s When the first solenoid valve (108) is opened to the maximum, the semiconductor refrigeration chip (106) is at the minimum operating current; in the refrigeration and dehumidification mode in the box, when 1.05H s s When 1.10H s s When the opening of the first solenoid valve (108) decreases continuously, the semiconductor refrigeration chip (106) operates at the rated current; when 1.15H s When the temperature is less than H1, the opening of the first solenoid valve (108) is at its minimum, and the semiconductor refrigeration chip (106) operates at the rated current;​​ In the case of heating in the box, open the first baffle (104), close the second baffle (111), open the third baffle (112), open the fourth baffle (116), open the box fan (101), open the cooling fan (117), when T s2 -3 s2 -1, the current flowing into the semiconductor refrigeration chip (106) is continuously increased until the rated current is reached, and the hot end heat sink (107) heats the air in the box; on the one hand, the heated air is sent into the containing chamber (102) through the orifice plate by the flow guiding effect of the box fan (101), and on the other hand, the cold end heat sink (113) is cooled by the air outside the box by the cooling fan (117); when T s2 -5 s2 -3, the compressor (120) gradually increases the speed and the opening of the second electromagnetic valve (122), and the semiconductor refrigeration chip (106) works at the rated current; when T1 s2 -5, the speed of the compressor (120) and the opening of the second electromagnetic valve (122) are adjusted to the maximum, and the semiconductor refrigeration chip (106) works at the rated current; in the case of cooling in the box, open the first baffle (104), close the second baffle (111), open the third baffle (112), open the fourth baffle (116), open the box fan (101), open the cooling fan (117), when T s2 +1 s2 +3, change the direction of the rated current flowing into the semiconductor refrigeration chip (106) and continuously increase it until the rated current is reached, and the cold end heat sink (113) cools the air in the box; on the one hand, the cooled air is sent into the containing chamber (102) through the orifice plate by the flow guiding effect of the box fan (101), and on the other hand, the hot end heat sink (107) is cooled by the air outside the box by the cooling fan (117); when T s2 +3 s2 +5, the compressor (120) gradually reduces the speed and the opening of the second electromagnetic valve (122), and the semiconductor refrigeration chip (106) works at the rated current; when T1 s1 +5, the speed of the compressor (120) and the opening of the second electromagnetic valve (122) are adjusted to the minimum, and the semiconductor refrigeration chip (106) works at the rated current, open the second baffle (111), and introduce the air outside the box with low temperature into the box to cool the air in the box; in terms of humidity control, measure the humidity value H1 in the box by the humidity sensor (125), open the second baffle (111), and close the third baffle (112) and the fourth baffle (116); in the case of heating and humidification in the box, when 0.90H s ≤H1 s When H1≥0.90H, the current of the semiconductor refrigeration chip (106) is continuously reduced until the minimum working current, and the water stored in the water tank (115) is used to humidify the air in the cabinet through the humidifying nozzle (109); when 0.85H s ≤H1<0.90H s , the first electromagnetic valve (108) opening is continuously increased, and the semiconductor refrigeration chip (106) is at the minimum working current; when H1<0.85H s , the first electromagnetic valve (108) opening is at the maximum, and the semiconductor refrigeration chip (106) is at the minimum working current; in the heat supply and dehumidification mode in the cabinet, when 1.05H s <H1≤1.10H s , the current of the semiconductor refrigeration chip (106) is continuously increased until the rated current, and the dehumidification capacity is increased; when 1.10H s <H1≤1.15H s , the first electromagnetic valve (108) opening is continuously reduced, and the semiconductor refrigeration chip (106) works at the rated current; when 1.15H s <H1, the first electromagnetic valve (108) opening is at the minimum, and the semiconductor refrigeration chip (106) works at the rated current.

9. The control method of the auxiliary temperature and humidity control device according to claim 8, wherein: The initial opening of the first electromagnetic valve (108) and the second electromagnetic valve (122) is 1 / 4 of the full opening of the valve, which is convenient for subsequent adjustment.

10. The control method of the auxiliary temperature and humidity control device according to claim 8, wherein: The compressor (120) is a variable frequency compressor, which controls the refrigerant pipeline temperature by automatically adjusting the rotating speed, thereby matching various requirements.

Images