Cooling device and process equipment, substrate manufacturing method

Abstract

The present disclosure provides a cooling device, a process equipment and a substrate manufacturing method. The cooling device is used for cooling gas discharged from the process equipment. The cooling device comprises a pre-cooling unit and a secondary cooling unit arranged in sequence along a gas discharge direction on an exhaust pipeline of the process equipment. The pre-cooling unit has an air inlet end and an air outlet end. The pre-cooling unit comprises at least one cooling group arranged between the air inlet end and the air outlet end. The pre-cooling unit is configured to cool the gas to a first temperature. The first temperature is greater than a desublimation point at which the gas is solidified. The secondary cooling unit comprises at least one cooling pipe with an inner diameter greater than or equal to a threshold value and a cooling assembly arranged on an outer wall of the cooling pipe. The cooling pipe is connected to the air outlet end. The secondary cooling unit is configured to cool the gas to a second temperature. The second temperature is less than the first temperature. The cooling device, the process equipment and the substrate manufacturing method provided by the present disclosure can realize two-step cooling of process gas and reduce exhaust pipe blockage and other phenomena.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a cooling device and process equipment, and a substrate manufacturing method. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are active-matrix display devices with advantages such as self-illumination, wide viewing angle, high contrast, low power consumption, and extremely fast response speed. With the continuous development of display technology, OLED technology is increasingly being used in flexible display devices. As technology continues to advance, higher demands are being placed on display devices. However, in related technologies, OLED display substrates suffer from defects such as dark spots in the image. Summary of the Invention

[0003] To address at least one of the problems in the prior art described above, this disclosure provides a cooling device and process equipment, as well as a substrate manufacturing method.

[0004] The technical solutions provided in this disclosure are as follows:

[0005] In a first aspect, embodiments of this disclosure provide a cooling device for cooling gases emitted from process equipment; the cooling device includes a pre-cooling unit and a secondary cooling unit sequentially arranged along the gas emission direction on the exhaust pipe of the process equipment; wherein...

[0006] The precooling unit has an inlet end and an outlet end, and the precooling unit includes at least one cooling group disposed between the inlet end and the outlet end. The precooling unit is configured to cool the gas to a first temperature, the first temperature being greater than the sublimation point at which the gas solidifies.

[0007] The secondary cooling unit includes at least one cooling pipe with an inner diameter greater than or equal to a threshold and a cooling assembly disposed on the outer wall of the cooling pipe. The cooling pipe is connected to the exhaust end. The secondary cooling unit is configured to cool the gas to a second temperature, which is lower than the first temperature.

[0008] For example, the precooling unit includes at least two cooling groups arranged in series or in parallel, and the precooling unit further includes a cooling medium distribution pipeline connected to the cooling groups, and the cooling medium distribution pipeline is configured to independently provide cooling medium to each cooling group.

[0009] For example, the cooling medium distribution pipeline includes at least two cooling medium branch pipelines and a control switch. Each cooling medium branch pipeline is correspondingly connected to at least one of the cooling groups, and the control switch is used to control the on / off state of each cooling medium branch pipeline.

[0010] For example, the cooling group includes cooling coil groups, and each cooling coil group includes a plurality of cooling coils arranged at intervals.

[0011] For example, the cooling assembly includes a cooling coil wound around the cooling pipe.

[0012] Secondly, embodiments of this disclosure provide a process apparatus, which includes:

[0013] A process chamber, wherein an exhaust pipe is connected to the process chamber; and

[0014] The cooling device described above is disposed on the exhaust pipe.

[0015] Secondly, embodiments of this disclosure provide a substrate manufacturing method, which uses the process equipment described above to form a first film layer on the substrate, wherein during the formation of the first film layer, the gas discharged from the process chamber is cooled by the cooling device.

[0016] For example, cooling the gas discharged from the process chamber via the cooling device specifically includes:

[0017] The gas discharged from the process chamber is pre-cooled by the pre-cooling unit to cool the gas to a first temperature that keeps the gas in a gaseous state.

[0018] The gas, after being cooled by the pre-cooling unit, is further cooled by the secondary cooling unit to a second temperature at which at least a portion of the gas solidifies.

[0019] For example, the first temperature is greater than or equal to 125°C; the second temperature is less than 125°C.

[0020] For example, the pre-cooling treatment of the gas discharged from the process chamber through the pre-cooling unit to cool the gas to a first temperature that keeps the gas in a gaseous state specifically includes:

[0021] Cooling medium is supplied to a target number of cooling groups through the cooling medium distribution pipeline to individually control the operation of the target number of cooling groups so that the gas reaches the first temperature after being cooled by the pre-cooling unit.

[0022] The beneficial effects of the embodiments disclosed herein are as follows:

[0023] In the above solution, by setting up a pre-cooling unit and a secondary cooling unit in the cooling device, the pre-cooling unit can cool the gas emitted from the process equipment to a first temperature above the condensation point where the gas solidifies. This avoids a sudden drop in gas temperature, which could generate a large amount of solid powder and other impurities, causing them to accumulate and block the pre-cooling unit, leading to abnormal exhaust. The secondary cooling unit can further cool the gas after it has been cooled by the pre-cooling unit, causing some of the gas to solidify. Furthermore, the secondary cooling unit uses a cooling pipe with a relatively large inner diameter, so even if the gas solidifies in this cooling pipe, blockage is less likely to occur. When this cooling device is applied to the manufacture of the first film layer on a substrate, it can reduce the blockage of exhaust pipes caused by abnormal exhaust, and prevent some of the gas from remaining on the surface of the first film layer due to the inability of the gas to exit the process chamber in a timely manner. This improves the display defects caused by foreign object protrusions on the surface of the first film layer. Attached Figure Description

[0024] Figure 1 This is a schematic diagram showing the structure of the cooling device and process equipment provided in some embodiments of this disclosure. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0026] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0027] The features such as "parallel," "perpendicular," and "identical" used in the embodiments of this disclosure include features in the strict sense of "parallel," "perpendicular," and "identical," as well as cases where "approximately parallel," "approximately perpendicular," and "approximately identical" include certain tolerances. Taking into account the measurement and the tolerances associated with the measurement of a specific quantity (e.g., limitations of the measurement system), they represent the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of said value.

[0028] Furthermore, throughout this document, unless otherwise defined, the terms “substantially,” “essentially,” “approximately,” and “about” are used to describe and explain small variations. When used with an event or situation, these terms can cover situations where the event or situation occurs precisely or approximately. For example, when used with a numerical value, these terms can include a range of variation of the value less than or equal to 10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term “substantially coplanar” can refer to two surfaces arranged along the same plane within a micrometer range, such as within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm.

[0029] It should be understood that, in the exemplary embodiments of this disclosure, when a layer or element is referred to as being on another layer or substrate, it may mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate. "A and B are set in the same layer" means that after A and B are formed using the same film deposition process to form a film layer for forming a specific pattern, the layer structure is formed in one patterning process using the same photomask.

[0030] The cooling apparatus, process equipment, and substrate manufacturing method provided in the embodiments of this disclosure will be described in detail below, and the related technologies will be explained as follows:

[0031] With the continuous advancement of technology, higher demands are being placed on display devices. However, in related technologies, OLED display substrates suffer from defects such as dark spots in the image.

[0032] The inventors of this application have discovered through research that one of the reasons for the above-mentioned problems is:

[0033] In related technologies, the mainstream process flow for OLED display substrates is to first fabricate a driving backplane, and then fabricate anode, organic light-emitting layer, and cathode films on the driving backplane. The basic structure of the anode film is a stacked structure formed by a first transparent conductive layer, a metal layer, and a second transparent conductive layer. The role of the anode is to provide holes for the organic light-emitting layer. The organic light-emitting layer is deposited onto the anode surface, and the surface smoothness of the anode is a key factor affecting OLED dark spots.

[0034] In recent years, due to continuous technological advancements, people have placed higher demands on display devices, especially regarding the management of dark spots and other factors affecting display performance. Currently, the mainstream process technology for mobile phone screens is OLED, whose basic structure consists of an LTPS or LTPO backplane driving circuit + anode + organic light-emitting material + cathode. The basic structure of the anode film layer is ITO + Ag + ITO, and its function is to provide holes for the light-emitting layer. The OLED light-emitting film layer is deposited on the anode surface, and the flatness of the anode surface is a key factor affecting OLED dark spots.

[0035] To improve the flatness of the anode, an organic planarization layer is fabricated on the surface of the drive circuitry on the drive backplane, and then a physical anode coating is applied to the organic planarization layer. Typically, the organic planarization layer is prepared using a coating, exposure, development, and curing process. Among these processes, the curing process, due to the influence of airflow and volatile organic compounds, becomes the key process affecting the flatness of the anode.

[0036] During the curing process, the temperature of the gas discharged from the equipment can reach over 250°C. Due to safety and environmental protection requirements, the factory exhaust temperature must be below 30°C. Therefore, a cooling device is usually required at the end of the equipment's exhaust port. After passing through the cooling device, the high-temperature gas is rapidly reduced from a high temperature to below 30°C before being discharged into the factory's exhaust pipeline.

[0037] Organic planarization layer materials contain additives and exist in the form of polymer cross-links to achieve precise pixel control. However, organic planarization layer materials have poor high-temperature stability and a low vaporization temperature. They vaporize under high-temperature process conditions of 250°C and are discharged as gas with the organic exhaust gas. Below 125°C, they solidify rapidly. When the organic additives are rapidly cooled into solid powder after passing through the cooling device, long-term use can lead to blockage of the exhaust cooling device. When the exhaust cooling device is blocked, it will cause abnormal exhaust in the process chamber. Organic volatiles cannot be discharged in time and will remain on the surface of the organic film of the planarization layer as organic residues, causing local small particle-like protrusions in the organic film, affecting the flatness of the anode film layer. The protrusions can cause short circuits between the anode and cathode, resulting in abnormal light emission of sub-pixels and the occurrence of dark spots.

[0038] Therefore, in order to solve the above problems, this disclosure provides a cooling device and process equipment, as well as a substrate manufacturing method.

[0039] like Figure 1 As shown in the embodiments of this disclosure, the cooling device is used to cool the gas emitted from process equipment.

[0040] The cooling device includes a pre-cooling unit 100 and a secondary cooling unit 200, which are sequentially arranged along the gas emission direction on the exhaust pipe 300 of the process equipment. Thus, the high-temperature gas emitted by the process equipment can be cooled sequentially by the pre-cooling unit 100 and the secondary cooling unit 200, meaning the cooling process of the high-temperature gas can be divided into two steps.

[0041] like Figure 1 As shown, the precooling unit 100 has an inlet end A and an outlet end B. The precooling unit 100 includes at least one cooling assembly 110 disposed between the inlet end A and the outlet end B. The precooling unit 100 is configured to cool the gas to a first temperature, which is greater than the sublimation point at which the gas solidifies.

[0042] The secondary cooling unit 200 includes at least one cooling pipe 210 with an inner diameter greater than or equal to a threshold and a cooling assembly 220 disposed on the outer wall of the cooling pipe 210. The cooling pipe 210 is connected to the exhaust end B. The secondary cooling unit 200 is configured to cool the gas to a second temperature, which is lower than the first temperature.

[0043] In the above scheme, by setting the pre-cooling unit 100 and the secondary cooling unit 200 in the cooling device, the cooling process of high-temperature gas can be divided into two steps. First, the pre-cooling unit 100 can cool the gas discharged from the process equipment to a first temperature above the condensation point where the gas solidifies, which can avoid a sudden drop in gas temperature and the generation of a large amount of solid powder and other impurities, which would cause accumulation and blockage in the pre-cooling unit 100 and lead to abnormal exhaust. Then, the secondary cooling unit 200 can further cool the gas after it has been cooled by the pre-cooling unit 100, so that part of the gas solidifies. The secondary cooling unit 200 uses a cooling pipe 210 with a relatively large inner diameter, so even if the gas solidifies in the cooling pipe 210, it is not easy to cause blockage.

[0044] When this cooling device is applied to the manufacturing of the first film layer on the display substrate, it can reduce the blockage of the exhaust pipe 300 caused by abnormal exhaust, and avoid the fact that some gas in the gas cannot be discharged from the process chamber in time and is left on the surface of the first film layer, thereby improving the display defects caused by foreign object protrusions on the surface of the first film layer.

[0045] As mentioned above, for the organic film layer curing process on the display substrate, the volatile organic compounds in the high-temperature gas exiting the curing equipment will solidify into powder below 125°C. Therefore, in some embodiments, when the cooling device is applied to the organic film layer curing process on the substrate, the first temperature can be higher than the sublimation point where the gas solidifies. For example, the first temperature can be greater than or equal to 125°C. Generally, the emitted gas needs to be cooled to below 30°C before being discharged into the factory exhaust pipe 30. Therefore, for example, the second temperature can be less than 125°C, and further, the second temperature can be less than or equal to 30°C.

[0046] It should be understood that the cooling device is not limited to the curing equipment for films such as organic planarization layers on display substrates, but can also be applied to gas emission scenarios of other process equipment. Depending on the temperature and composition of the gas emitted by the process equipment, the first temperature and the second temperature can also be other temperature thresholds.

[0047] Furthermore, it should be understood that the cooling device can also be used in the organic planarization layer curing process on the display substrate, but is not limited thereto, and can also be used in other film layer curing processes on the display substrate.

[0048] Furthermore, in some embodiments of this disclosure, the precooling unit 100 may include at least two cooling groups 110, which may be connected in series or in parallel, and the operation of each cooling group 110 can be individually controlled. Different numbers of cooling groups 110 operating result in different cooling effects on the gas. Therefore, by controlling the number of operating cooling groups 110, multi-level control of the precooling unit 100 can be achieved.

[0049] For example, such as Figure 1As shown, the pre-cooling unit 100 includes three cooling groups 110, namely a first-stage cooling group, a second-stage cooling group, and a third-stage cooling group. When one cooling group 110 is working, for example, when the first-stage cooling group is working, the gas can be cooled to a third temperature; when two cooling groups 110 are working, for example, when the first-stage and second-stage cooling groups are working, the gas can be cooled to a fourth temperature; when all three cooling groups 110 are working, for example, when the first-stage, second-stage, and third-stage cooling groups are all working, the gas can be cooled to the first temperature. For example, the third temperature is greater than the fourth temperature, and the fourth temperature is greater than the first temperature. In this way, the cooling device can be adapted to more application scenarios, and an appropriate number of cooling groups 110 can be selected to work according to the temperature and composition of the exhaust gas. When a higher temperature is required after the gas is cooled by the pre-cooling unit 100, some cooling groups 110 can be set to not work; when a lower temperature is required after the gas is cooled by the pre-cooling unit 100, more or all cooling groups 110 can be activated.

[0050] In some embodiments, the cooling group 110 may include cooling coil groups, each of which includes a plurality of spaced-apart cooling coils 111. Since the spacing between cooling coils 111 is generally small, blockage can easily occur if volatile organic compounds solidify there. However, in this embodiment, even with a small spacing between the cooling coils 111, the gas remains in a gaseous state and will not solidify to form a white powder, thus reducing the risk of blockage in the pre-cooling unit 100. It should be understood that the specific construction of the cooling group 110 is not limited to this.

[0051] To achieve individual controllability of each of the aforementioned cooling groups 110, in some embodiments, such as Figure 1 As shown, the precooling unit 100 may further include a cooling medium distribution pipe 120, which is connected to the cooling group 110 and configured to independently supply cooling medium to each of the cooling groups 110. In other words, multi-level control of the precooling unit 100 is achieved by controlling whether the cooling medium distribution pipe 120 supplies cooling medium to each of the cooling groups 110.

[0052] In some exemplary embodiments, the cooling medium distribution pipeline 120 includes at least two cooling medium branch pipelines 121 and a control switch 122. Each cooling medium branch pipeline 121 is correspondingly connected to at least one of the cooling groups 110, and the control switch 122 is used to control the on / off state of each cooling medium branch pipeline 121. In this way, by controlling the on / off state of each cooling medium branch pipeline 121 through the control switch 122, multi-level control of the pre-cooling unit 100 can be realized.

[0053] It should be noted that the above is only an exemplary description of how each of the cooling groups 110 can be individually controlled, and in actual applications, it is not limited to this.

[0054] Furthermore, in some embodiments, in the secondary cooling unit 200, the inner diameter of the cooling pipe 210 is greater than or equal to a threshold value. In other words, the inner diameter of the cooling pipe 210 is relatively large; for example, the threshold value may be 80 Å, and the inner diameter of the cooling pipe 210 is greater than 80 Å. A cooling assembly 220 may be provided on the outer wall of the cooling pipe 210; for example, the cooling assembly 220 may include a cooling coil 111 wound around the cooling pipe 210.

[0055] However, the cooling assembly 220 is not limited to this. For example, the cooling assembly 220 may also include a cooling sleeve located around the cooling pipe 210, with a cooling medium channel formed between the cooling sleeve and the outer wall of the cooling pipe 210. The cooling medium channel is provided with a medium inlet and a medium outlet, and cooling is achieved by heat exchange between the cooling medium and the gas inside the cooling pipe 210.

[0056] In some embodiments, such as Figure 1 As shown, the secondary cooling unit 200 can have multiple cooling pipes 210 connected in parallel, with each cooling pipe 210 having a corresponding cooling coil 111 on its outer wall. Increasing the number of parallel cooling pipes 210 improves gas cooling efficiency, ensures effective gas cooling, and prevents the pipes from being blocked by white powder from volatile organic compounds. The number of cooling pipes 210 is not limited.

[0057] By providing the secondary cooling unit 200 at the rear of the pre-cooling unit 100, the volatile organic compounds can be solidified within the secondary cooling unit 200. The secondary cooling unit 200 employs a cooling pipe 210 with a relatively large inner diameter, and a cooling coil 111 is coiled around the outer wall of the cooling pipe 210, thereby achieving a good cooling effect.

[0058] Therefore, the cooling device provided in this embodiment can effectively avoid pipeline blockage caused by the condensation of gases containing volatile organic compounds into solid powder accumulation through a two-step cooling method. Furthermore, by dividing the gas cooling process into two steps, the gas is still in a gaseous state during the pre-cooling stage and will only be converted into a solid state during the secondary cooling stage. This can effectively control the airflow in the process and fundamentally prevent the residue of impurities on organic film layers such as organic planarization layers on the substrate. It can also ensure the flatness of the anode and thus improve display defects such as dark spots on the OLED display substrate.

[0059] In addition, such as Figure 1 As shown, this disclosure also provides a process device, which includes a process chamber 10 and a cooling device 20 provided in this disclosure embodiment. The process chamber is connected to an exhaust pipe 300, and the cooling device is disposed on the exhaust pipe 300.

[0060] The process equipment provided in this disclosure includes a cooling device provided in this disclosure. Since the principle by which this process equipment solves the problem is similar to that of the cooling device described above, the embodiments of the process equipment provided in this disclosure can be found in the embodiments of the cooling device described above, and will not be repeated here.

[0061] Furthermore, this disclosure also provides a substrate manufacturing method, which uses the process equipment provided in this disclosure to form a first film layer on the substrate. The first film layer includes, but is not limited to, an organic planarization layer.

[0062] The substrate manufacturing method includes the following steps:

[0063] Step S01: A first film layer is formed on the substrate using the process equipment provided in this embodiment of the present disclosure, wherein, during the formation of the first film layer, the gas discharged from the process chamber is cooled by the cooling device.

[0064] For example, cooling the gas discharged from the process chamber via the cooling device specifically includes:

[0065] The gas discharged from the process chamber is pre-cooled by the pre-cooling unit 100 so that the gas is cooled to a first temperature that keeps the gas in a gaseous state.

[0066] The secondary cooling unit 200 performs secondary cooling on the gas after it has been cooled by the pre-cooling unit 100, so that the gas is cooled to a second temperature at which at least part of the gas solidifies into a solid state.

[0067] As mentioned above, for the organic film layer curing process on the display substrate, the volatile organic compounds in the high-temperature gas exiting the curing equipment will solidify into powder below 125°C. Therefore, in some embodiments, when the cooling device is applied to the organic film layer curing process on the substrate, the first temperature can be higher than the sublimation point where the gas solidifies. For example, the first temperature can be greater than or equal to 125°C. Generally, the emitted gas needs to be cooled to below 30°C before being discharged into the factory exhaust pipe. Therefore, for example, the second temperature can be less than 125°C, and further, the second temperature can be less than or equal to 30°C.

[0068] It should be understood that the cooling device is not limited to the curing equipment for the organic planarization layer on the display substrate, but can also be applied to the process gas emission scenario of other film layers on the substrate. Depending on the temperature and composition of the process gas emission, the first temperature and the second temperature can also be other temperature thresholds.

[0069] Furthermore, by way of example, the pre-cooling treatment of the gas discharged from the process chamber by the pre-cooling unit 100, so that the gas is cooled to a first temperature that keeps the gas in a gaseous state, specifically includes:

[0070] Cooling medium is supplied to a target number of cooling groups 110 through the cooling medium distribution pipeline 120, so that the operation of the target number of cooling groups 110 is controlled individually so that the gas reaches the first temperature after being cooled by the pre-cooling unit 100.

[0071] Different numbers of the cooling groups 110 operating will have different cooling effects on the gas. Therefore, by controlling the number of operating cooling groups 110, multi-level control of the pre-cooling unit 100 can be achieved.

[0072] For example, when one cooling group 110 is operating, it can cool the gas to a third temperature; when two cooling groups 110 are operating, it can cool the gas to a fourth temperature; and when three cooling groups 110 are operating, it can cool the gas to the first temperature. Exemplarily, the third temperature is greater than the fourth temperature, and the fourth temperature is greater than the first temperature. This allows the cooling device to be applicable to more application scenarios, selecting an appropriate number of cooling groups 110 to operate based on the temperature and composition of the exhaust gas. When a higher temperature is required after the gas has passed through the pre-cooling unit 100, some cooling groups 110 can be set to not operate; when a lower temperature is required after the gas has passed through the pre-cooling unit 100, more or all cooling groups 110 can be activated.

[0073] The following points need to be explained:

[0074] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0075] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0076] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0077] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. The scope of protection of this disclosure shall be determined by the scope of the claims.

Claims

1. A cooling device for cooling gases emitted from process equipment; characterized in that, The cooling device is used to manufacture the film layer of the display substrate. The cooling device includes a pre-cooling unit and a secondary cooling unit sequentially arranged along the gas emission direction on the exhaust pipe of the process equipment; wherein... The precooling unit has an inlet end and an outlet end, and the precooling unit includes at least one cooling group disposed between the inlet end and the outlet end. The precooling unit is configured to cool the gas to a first temperature, the first temperature being greater than the sublimation point at which the gas solidifies. The secondary cooling unit includes at least one cooling pipe with an inner diameter greater than or equal to a threshold and a cooling assembly disposed on the outer wall of the cooling pipe. The cooling pipe is connected to the exhaust end. The secondary cooling unit is configured to cool the gas to a second temperature, which is lower than the first temperature.

2. The cooling device according to claim 1, characterized in that, The precooling unit includes at least two cooling groups arranged in series or parallel, and the precooling unit also includes a cooling medium distribution pipeline connected to the cooling groups, and the cooling medium distribution pipeline is configured to independently provide cooling medium to each cooling group.

3. The cooling device according to claim 2, characterized in that, The cooling medium distribution pipeline includes at least two cooling medium branch pipelines and a control switch. Each cooling medium branch pipeline is connected to at least one of the cooling groups. The control switch is used to control the on / off state of each cooling medium branch pipeline.

4. The cooling device according to claim 1, characterized in that, The cooling group includes cooling coil groups, and each cooling coil group includes several cooling coils arranged at intervals.

5. The cooling device according to claim 2, characterized in that, The cooling assembly includes a cooling coil wound around the cooling pipe.

6. A process equipment, characterized in that, include: A process chamber, wherein an exhaust pipe is connected to the process chamber; and The cooling device as described in any one of claims 1 to 5, wherein the cooling device is disposed on the exhaust pipe.

7. A method for manufacturing a substrate, characterized in that, A first film layer on a substrate is formed using the process equipment as described in claim 6, wherein during the formation of the first film layer, the gas discharged from the process chamber is cooled by the cooling device.

8. The method according to claim 7, characterized in that, The cooling of the gas discharged from the process chamber by the cooling device specifically includes: The gas discharged from the process chamber is pre-cooled by the pre-cooling unit to cool the gas to a first temperature that keeps the gas in a gaseous state. The gas, after being cooled by the pre-cooling unit, is further cooled by the secondary cooling unit to a second temperature at which at least a portion of the gas solidifies.

9. The method according to claim 8, characterized in that, The first temperature is greater than or equal to 125°C; the second temperature is less than 125°C.

10. The method according to claim 8, characterized in that, When applied to the cooling device as described in claim 2, the pre-cooling treatment of the gas discharged from the process chamber by the pre-cooling unit to cool the gas to a first temperature that keeps the gas in a gaseous state specifically includes: Cooling medium is supplied to a target number of cooling groups through the cooling medium distribution pipeline to individually control the operation of the target number of cooling groups so that the gas reaches the first temperature after being cooled by the pre-cooling unit.

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