Material testing system with sensor state testing

Abstract

Examples of a material testing system that allows testing one or more test sensors of a material testing machine are described herein. In some examples, such testing may ensure that each test sensor operates properly. In some examples, the test may be performed manually, periodically, and / or automatically in response to some indication that the test sensor may fail. In some examples, if the test results indicate that one or more sensors fail, further testing using the material testing machine may be prohibited. This prohibition may ensure that tests performed using the material testing machine remain reliable and available rather than becoming untrusted due to failure of the test sensor.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to and the benefit of U.S. Provisional Application No. 63 / 529,507, filed on July 28, 2023, entitled “Material Testing Systems with Sensor Status Tests,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates generally to material testing systems and, more particularly, to material testing systems with sensor condition testing. Background Art

[0004] Materials testing machines are used to test properties of various material specimens (eg, tensile / compressive strength). Sensors of the materials testing machine can take measurements during testing of various material specimens, and the properties of the specimens can be evaluated based on the sensor measurements.

[0005] By comparing such a system with the present disclosure set forth in the remainder of this application with reference to the accompanying drawings, the limitations and disadvantages of conventional and traditional methods will become apparent to those skilled in the art. Summary of the invention

[0006] The present disclosure is directed to a materials testing system utilizing sensor state testing substantially as illustrated in and / or as described in conjunction with at least one of the accompanying drawings and as more fully set forth in the claims.

[0007] These and other advantages, aspects and novel features of the present disclosure, as well as details of illustrated examples thereof, will be more fully understood from the following description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 An example materials testing system according to aspects of the present disclosure is shown.

[0009] Figure 2 The present disclosure shows various aspects of Figure 1 Block diagram of a materials testing system.

[0010] Figure 3 A flow chart is shown, which illustrates various aspects of the present disclosure. Figure 1 to Figure 2 An example material testing workflow for a material testing system.

[0011] Figure 4 A flow chart is shown, which illustrates various aspects of the present disclosure. Figure 1 to Figure 2 Example test method creation process for a materials testing system.

[0012] Figure 5a to Figure 5f The present disclosure shows various aspects of the Figure 3 During the material testing workflow Figure 1 to Figure 2 An example of a screen output of a materials testing system's user interface.

[0013] Figure 6a to Figure 6b The present disclosure shows various aspects of the Figure 4 During the test method creation process Figure 1 to Figure 2 An example of a screen output of a materials testing system's user interface.

[0014] Figure 7 A flow chart is shown, which illustrates various aspects of the present disclosure. Figure 1 to Figure 2 An example sensor testing process for a materials testing system.

[0015] Figure 8 The present disclosure shows various aspects of the Figure 7 During the sensor testing process Figure 1 to Figure 2 Example screen output of the user interface of a materials testing system.

[0016] The drawings are not necessarily drawn to scale. Where appropriate, the same or similar reference numerals are used to indicate similar or identical elements in the drawings. For example, a reference numeral using a letter (e.g., clamp 124a, clamp 124b) refers to each instance of the same reference numeral (e.g., clamp 124) without the letter. DETAILED DESCRIPTION

[0017] The present disclosure relates to material testing systems that allow one or more test sensors of a material testing machine to be tested to determine whether the sensor is still operating properly. In some examples, the test can be performed manually, periodically, and / or automatically in response to some indication that the test sensor may have failed. In some examples, if the test results indicate that one or more sensors have failed, the use of the material testing machine for further testing can be inhibited. Such inhibition can ensure that the tests performed using the material testing machine remain reliable and usable, rather than becoming untrustworthy due to the failure of the test sensor.

[0018] Some examples of the present disclosure relate to a material testing system, which includes: a material testing machine, which includes a test sensor, a test actuator, and a test controller, which is configured to control the test actuator; and a computing device, which is configured to communicate with the material testing machine, the computing device including a processing circuit system, which is configured to: use the material testing machine to perform a sensor testing method, the sensor testing method including a method for testing a test sensor of the material testing machine; determine whether the test sensor of the material testing machine is operating correctly based on a test result of the sensor testing method; and in response to determining that the test sensor is not operating correctly, prohibit the use of the material testing machine to perform further testing methods.

[0019] In some examples, determining whether the test sensor is operating correctly includes determining whether a measurement result of the test sensor during execution of the sensor testing method is within a specified tolerance of an expected measurement result, the test result including the measurement result of the test sensor during execution of the sensor testing method. In some examples, the computing device further includes a memory circuit system storing a time parameter, and the processing circuit system is further configured to: in response to determining that the test sensor is operating correctly, perform the sensor testing method again after a certain time delay, and the time delay is determined based on the time parameter stored in the memory circuit system. In some examples, the sensor testing method includes a first sensor testing method, the test result includes a first test result, the test sensor includes a first test sensor, the material testing machine further includes a second test sensor, and the processing circuit system is further configured to: in response to determining that the first test sensor is operating correctly, perform a second sensor testing method using the material testing machine, and determine whether the second test sensor of the material testing machine is operating correctly based on the second test result of the second sensor testing method.

[0020] In some examples, the processing circuit system is further configured to: in response to determining that the second test sensor is operating correctly, successively perform the additional sensor test method for each additional test sensor of the material testing machine until each additional test sensor has been determined to be operating correctly, or until an additional test sensor is determined to be operating incorrectly. In some examples, the system further includes a user interface configured to: output input prompts related to the sensor test method, and receive one or more user inputs in response to the input prompts, the processing circuit system is further configured to: identify one or more test parameters of the sensor test method based on the one or more inputs, and generate the sensor test method based on the one or more test parameters. In some examples, the processing circuit system is further configured to determine whether there is an indication that the test sensor of the material testing machine is not operating correctly based on an event record stored in the memory circuit system of the computing device, the event record including a log of events that occurred during setup, execution, or analysis of the test method, wherein the sensor test method is performed in response to determining that there is an indication that the test sensor is not operating correctly.

[0021] Some examples of the present disclosure relate to a non-transitory computer-readable medium including machine-readable instructions that, when executed by a processor, cause the processor to perform the following operations: use a material testing machine to perform a sensor testing method, the material testing machine including a test sensor, a test actuator, and a test controller, the test controller being configured to control the test actuator, the sensor testing method including a method for testing the test sensor of the material testing machine; determine whether the test sensor of the material testing machine operates correctly based on a test result of the sensor testing method; and in response to determining that the test sensor does not operate correctly, prohibit the use of the material testing machine to perform further testing methods.

[0022] In some examples, determining whether the test sensor is operating correctly includes determining whether a measurement result of the test sensor during execution of the sensor testing method is within a specified tolerance of an expected measurement result, the test result including a measurement result of the test sensor during execution of the sensor testing method. In some examples, the non-transitory computer readable medium further includes a time parameter, and the machine readable instructions, when executed by the processor, further cause the processor to perform the sensor testing method again after a time delay in response to determining that the test sensor is operating correctly, the time delay being determined based on the time parameter. In some examples, the sensor testing method includes a first sensor testing method, the test result includes a first test result, the test sensor includes a first test sensor, the material testing machine further includes a second test sensor, and the machine readable instructions, when executed by the processor, further cause the processor to perform the following operations: in response to determining that the first test sensor is operating correctly, perform a second sensor testing method using the material testing machine; and determine whether the second test sensor of the material testing machine is operating correctly based on a second test result of the second sensor testing method.

[0023] In some examples, the machine-readable instructions, when executed by the processor, further cause the processor to perform the following operations: in response to determining that the second test sensor is operating correctly, sequentially perform an additional sensor test method for each additional test sensor of the material testing machine until each additional test sensor has been determined to be operating correctly, or until an additional test sensor is determined to be operating incorrectly. In some examples, the machine-readable instructions, when executed by the processor, further cause the processor to perform the following operations: outputting input prompts for the sensor test method via a user interface; receiving one or more user inputs in response to the input prompts via the user interface; identifying one or more test parameters for the sensor test method based on the one or more inputs; and generating the sensor test method based on the one or more test parameters. In some examples, the machine-readable instructions, when executed by the processor, further cause the processor to perform the following operations: determine whether there is an indication that the test sensor of the material testing machine is not operating correctly based on an event record stored in the memory circuitry of the computing device, the event record including a log of events that occurred during setup, execution, or analysis of the test method, wherein the sensor test method is performed in response to determining that there is an indication that the test sensor is not operating correctly.

[0024] Some examples of the present disclosure relate to a method, comprising: performing a sensor testing method using a material testing machine, the material testing machine comprising a test sensor, a test actuator, and a test controller, the test controller being configured to control the test actuator, the sensor testing method comprising a method for testing the test sensor of the material testing machine; determining, via a processing circuit system of a computing device, whether the test sensor of the material testing machine operates correctly based on a test result of the sensor testing method; and in response to determining that the test sensor does not operate correctly, prohibiting the use of the material testing machine to perform further testing methods.

[0025] In some examples, determining whether the test sensor is operating properly includes determining whether a measurement result of the test sensor during execution of the sensor testing method is within a specified tolerance of an expected measurement result, the test result including a measurement result of the test sensor during execution of the sensor testing method. In some examples, the method further includes: in response to determining that the test sensor is operating properly, executing the sensor testing method again after a certain time delay, the time delay being determined based on a time parameter stored in the memory circuit system of the computing device. In some examples, the sensor testing method includes a first sensor testing method, the test result includes a first test result, the test sensor includes a first test sensor, the material testing machine further includes a second test sensor, and the method further includes: in response to determining that the first test sensor is operating properly, performing a second sensor testing method using the material testing machine; and determining, via the processing circuit system, whether the second test sensor of the material testing machine is operating properly based on a second test result of the second sensor testing method.

[0026] In some examples, the method further includes: in response to determining that the second test sensor is operating correctly, successively performing the additional sensor test method for each additional test sensor of the materials testing machine until each additional test sensor has been determined to be operating correctly, or until an additional test sensor is determined to be operating incorrectly. In some examples, the method further includes: determining, via the processing circuitry based on an event log stored in the memory circuitry of the computing device, whether there is an indication that the test sensor of the materials testing machine is not operating correctly, the event log including a log of events that occurred during setup, execution, or analysis of the test method, wherein the sensor test method is performed in response to determining that there is an indication that the test sensor is not operating correctly.

[0027] Figure 1An example material testing system 100 is shown. As shown, the material testing system 100 includes a material testing machine 102 (also referred to as a universal testing machine) and a computing system 200 connected to the material testing machine 102 via a cable 106. Although shown as being physically connected, in some examples, the connection may be wireless rather than wired.

[0028] exist Figure 1 In some examples, the material testing machine 102 includes a frame 112. In some examples, the frame 112 provides rigid structural support for other components of the material testing machine 102. As shown, the frame 112 includes a top plate 114 and a bottom base 116 connected by two columns 118. In some examples, the columns 118 of the frame 112 can accommodate the guide rails and / or drive shafts 212 of the material testing machine 102 (see, e.g., Figure 2 ).

[0029] exist Figure 1 In the example of FIG. 1 , the movable lateral carrier 120 extends between the columns 118. In some examples, the movable lateral carrier 120 can be connected to rails and / or drive shafts 212 housed in the columns 118, and / or the movable lateral carrier 120 can be configured to move toward and / or away from the base 116 by (e.g., motorized) actuation of (multiple) drive shafts 212. Although in Figure 1 One movable transverse carrier 120 is shown in the example of FIG. 1 , but in some examples, the material testing machine 102 may have multiple movable transverse carriers 120 and / or other movable components.

[0030] exist Figure 1 In the example of FIG. 1 , the clamping device 122 is attached to the bottom base 116 of the frame 112 and the movable lateral carrier 120. As shown, the lower clamping device 122a includes a clamp 124a, while the upper clamping device 122b includes both a test sensor 126 and a clamp 124b. Figure 1 One test sensor 126 and two fixtures 124 are shown in the example of FIG. 1 , but in some examples, the testing machine 102 may include more or fewer test sensors 126 and / or fixtures 124 .

[0031] exist Figure 1In the example of , the clamp 124 holds the test specimen 128. Although shown as a (e.g., steel) rope, in some examples, the test specimen 128 can be some other type of material and / or component. Although shown as a rope holder, in some examples, the clamp 124a and / or the clamp 124b can be alternatively or additionally configured as a bolt holder, a wedge clamp, a side acting grip, a manual clamp, a roller clamp, a capstan clamp, and / or a syringe holder. In some examples, one or both of the clamps in the clamp 124 can be replaced by a pressure plate that is configured to squeeze the test specimen 128.

[0032] exist Figure 1 In some examples, test sensor 126 is connected to fixture 124 so that test sensor 126 can measure the force acting on fixture 124 (and / or specimen 128, lateral carrier 120, etc.). In some examples, test sensor 126 can be a load cell and / or a transducer. In some examples, test sensor 126 can be some other type of sensor.

[0033] In some examples, the material testing machine 102 can be configured for static mechanical testing. For example, the material testing machine 102 can be configured for compression strength testing, tensile strength testing, shear strength testing, bending strength testing, flexural strength testing, tear strength testing, peel strength testing (e.g., adhesive strength), torsion strength testing, and / or any other compression and / or tension testing. Additionally or alternatively, the material testing machine 102 can be configured to perform dynamic testing.

[0034] In some examples, the material testing machine 102 is configured to interface with the computing system 200 to perform the testing method. For example, the computing system 200 may interface with the controller 214 (e.g., see Figure 2 ) to perform the test method. In some examples, the operator (or other user) may first use computing system 200 to set up the test method, then use computing system 200 to perform the test method, and finally use computing system 200 to analyze the results of the test method.

[0035] Figure 2 is a block diagram showing details of computing system 200 and additional details of material testing machine 102. Figure 2 In some examples, the example materials testing machine 102 includes one or more actuators 210 coupled to one or more drive shafts 212. In some examples, the actuators 210 can be used to provide force to and / or cause movement of the drive shafts 212. In some examples, the actuators 210 can include electric motors, pneumatic actuators, hydraulic actuators, piezoelectric actuators, relays, and / or switches.

[0036] The drive shaft 212 is further shown connected to the movable lateral carrier 120, such that movement of the drive shaft(s) 212 via the actuator(s) 210 will result in movement of the movable lateral carrier 120. Figure 2 In the example of FIG. 2 , the drive shaft 212 is named as the drive shaft 212 , but in some examples, the drive shaft 212 may be some other mechanical device that moves the movable lateral carrier 120 through the induction of the actuator(s) 210 .

[0037] The example material testing machine 102 further includes a controller 214 in electrical communication with the actuator(s) 210. In some examples, the controller 214 may include processing circuitry and / or memory circuitry. In some examples, the controller 214 may be configured to control the material testing machine 102 based on one or more commands, control inputs, and / or test parameters. In some examples, the controller 214 may be configured to convert the commands, control inputs, and / or test parameters (e.g., received from the computing system 200) into appropriate (e.g., electrical) signals that may be delivered to the actuator(s) 210, thereby controlling the operation of the material testing machine 102 (e.g., via the actuator(s) 210). For example, the controller 214 may provide one or more signals that command more or less power to be provided to the actuator(s) 210, thereby increasing or decreasing the force applied.

[0038] exist Figure 2 In some examples, the controller 214 is further electrically connected to the clamping device 122 (e.g., the clamp 124 and the test sensor(s) 126). In some examples, the controller 214 can be configured to convert commands, control inputs, and / or test parameters (e.g., received from the computing system 200) into appropriate (e.g., electrical) signals that can be transmitted to the clamp 124, thereby controlling the operation of the clamp 124 (e.g., clamping or unclamping). In some examples, the controller 214 can be configured to convert commands, control inputs, and / or parameters (e.g., received from the computing system 200) into appropriate (e.g., electrical) signals that can be transmitted to the sensor(s) 126, thereby controlling the operation of the sensor(s) 126. In some examples, the controller 214 can be configured to convert measurement data received from the sensor(s) 126, and / or send the measurement data to the computing system 200.

[0039] The example controller 214 is further in electrical communication with a control panel 216 of the material testing machine 102. In some examples, the control panel 216 may include one or more input devices (e.g., buttons, switches, sliders, knobs, microphones, dials, and / or other electromechanical input devices). In some examples, an operator may use the control panel 216 to directly control the material testing machine 102. In some examples, the controller 214 may be configured to convert commands, control inputs, and / or test parameters received via the control panel 216 into appropriate (e.g., electrical) signals that may be delivered to the actuator(s) 210 and / or the fixture(s) 124 to control the material testing machine 102.

[0040] The controller 214 is also shown in electrical communication with a network interface 218 b of the material testing machine 102. In some examples, the network interface 218 b includes hardware, firmware, and / or software for connecting the material testing machine 102 to a complementary network interface 218 a of the computing system 200. In some examples, the controller 214 can receive information (e.g., commands) from the computing system 200 via the network interface 218 and / or send information (e.g., measurement data from the sensor(s) 126) to the computing system 200 via the network interface 218.

[0041] exist Figure 2 In the example of , computing system 200 includes interconnected computing device 202 and user interface (UI) 204. As shown, UI 204 may include one or more input devices 206 configured to receive input from a user, and one or more output devices 208 configured to provide output to the user.

[0042] In some examples, the one or more input devices 206 may include one or more touch screens, mice, keyboards, buttons, switches, sliders, knobs, microphones, dials, and / or other input devices 206. In some examples, the one or more output devices 208 may include one or more display screens / touch screens, speakers, lights, haptic devices, and / or other output devices 208. In some examples, the output device(s) 208 (e.g., display screens) of the UI 204 may output one or more representations of the material testing workflow 300 configured to guide a user through the setup, execution, and / or analysis of a test method performed by the material testing machine 102. In some examples, the output device(s) 208 (e.g., display screens) of the UI 204 may output one or more representations of the test method creation process 400 configured to help a user easily and / or quickly generate a test method and / or the material testing workflow 300.

[0043] exist Figure 2In the example of FIG. 1 , the example computing device 202 includes a network interface 218a. As shown, one network interface 218a communicates with a network interface 218b of the material testing machine 102 via the cable 106. As shown, the computing device 102 further includes a network interface 218a that communicates with a network 220 (e.g., the Internet). Figure 2 In the example of FIG. 2 , the computing device 202 communicates with the remote interface 230 via the network 220 and the network interface 218 a. As shown, the network interface 218 a is electrically connected to the common electrical bus 220 of the computing device 202 .

[0044] Computing device 202 further includes processing circuitry 224 connected to common electrical bus 220. In some examples, processing circuitry 224 may include one or more processors. In some examples, processing circuitry 224 is configured to process information received from UI 204, data import device(s) 108, and / or material testing machine 102. In some examples, processing circuitry 224 is configured to transmit commands and / or test parameters to material testing machine 102 (e.g., via network interface(s) 218a). In some examples, processing circuitry 224 is configured to output information to an operator via UI 204. In some examples, processing circuitry 224 is configured to execute machine-readable instructions stored in memory circuitry 226.

[0045] The example computing device 202 further includes a memory circuit system 226 connected to the common electrical bus 220. As shown, the memory circuit system 226 includes several parameters 232 (and / or parameter values), one or more data repositories 234, the material testing workflow 300, the test method creation process 400, and the sensor testing process 700.

[0046] In some examples, data repository 234 can include several different data structures (e.g., a database, a lookup table, etc.). Data repository 234 can store both historical data (e.g., previous workflows 300, test methods, parameters 232, test results, reports, prompts 602, user input, etc.) and current data (e.g., mappings between user input and parameters 232). In some examples, historical data can be associated with timestamps and / or other data (e.g., data with similar timestamps). Although in Figure 2 202 , but in some examples, repository 234 may be separate from computing device 202 and / or in communication with computing device 202 (eg, via network interface 218a).

[0047] Although in Figure 2224, but in some examples, material testing workflow 300, test method creation process 400, and / or sensor testing process 700 may be implemented using discrete circuitry (e.g., of processing circuitry 224). In some examples, material testing workflow 300, test method creation process 400, and / or sensor testing process 700 are implemented using non-transitory machine-readable instructions stored in memory circuitry 226.

[0048] In some examples, processing circuitry 224 is configured to execute machine-readable instructions of material testing workflow 300 to guide a user through the setup, execution, and / or analysis of a test method for material testing machine 102. In some examples, setup (and / or creation) of a test method may involve setting values ​​for several (e.g., test, sample, analysis, etc.) parameters 232 that define the test method and / or the analysis of the test results. In some examples, UI 204 is configured to show (and / or otherwise output) one or more workflow screens 500 that show parameters 232 during execution of material testing workflow 300 and / or allow a user to manually set parameters.

[0049] In some examples, during the sensor testing process 700, one or more sensor testing methods are set up and / or executed for testing the test sensor(s) 126 of the material testing machine 102. In some examples, the test method(s) may be executed manually (e.g., via the material testing workflow 300). In some examples, the test method(s) may be executed automatically, for example, in response to the expiration of a particular time limit and / or an indication that one or more sensors 126 have failed. In some examples, if the test results of the sensor testing method(s) indicate that one or more sensors 126 have failed, further test methods (e.g., for testing the specimen 128) may be inhibited from being executed. In some examples, the inhibition may continue until the test results of the sensor testing method(s) indicate that all of the test sensors 126 are functioning properly.

[0050] In some examples, during the test method creation process 400, the computing device 202 is configured to receive input from a user (e.g., via the UI 204) and use the input to generate and / or set (e.g., test, sample, analysis, etc.) parameters 232 that define, set up, and / or create the test method. In some examples, the number of prompted user inputs may be much smaller than the number of parameters 232, and / or a single user input may be used as a basis for setting several different parameters 232. Various analyses may also be used to optimize the parameters 232 to meet certain criteria, save time, and / or reduce the likelihood of errors. Because the number of user input prompts is much smaller than the number of parameters 232, the process of configuring a test method (and / or test result analysis) may be significantly shortened and / or simplified compared to manual configuration using the material testing workflow 300.

[0051] Figure 3 is a flow chart illustrating example workflow states of an example material testing workflow 300. Although a particular order of workflow states is shown, in some examples, a user's progression through the material testing workflow 300 may be customizable such that additional and / or fewer workflow states may be implemented in operation. Additionally, many alternative progressions through the workflow 300 may be possible.

[0052] In some examples, a user may be required to log in and / or be authenticated before using and / or progressing through the material testing workflow 300. In some examples, user authentication may be via biometrics (e.g., fingerprint, retina, face, etc.), near field communication (e.g., RFID, NFC, Bluetooth, barcode, etc.), cloud-based (e.g., Oauth, Google, single sign-on), key, and / or multi-factor authentication.

[0053] Although the material testing workflow 300 is sometimes described below as performing certain actions for ease of understanding, it should be understood that one or more of the above-mentioned components of the material testing system 100 (e.g., the processing circuit system 224, the UI 204, etc.) can act on behalf of the material testing workflow 300 (and / or according to its instructions).

[0054] In some examples, the material testing workflow 300 progresses through workflow states to guide a user through the setup, execution, and analysis of a test method for the material testing machine 102. In some examples, a particular workflow state can be associated with an output of the UI 204 (e.g., a workflow screen 500, see FIG. 5). Some preliminary workflow states can also be associated with one or more parameters 232 (e.g., shown and / or set via the workflow screen 500). In some examples, the parameter(s) 232 can be used to define and / or execute a test method, and / or analyze the results of a test method.

[0055] exist Figure 3 In the example of the first workflow state 302, the first workflow state is a sample setup state 302 (and / or a plurality of sample setup states 302). During the example sample setup state(s) 302, the material testing workflow 300 prompts the operator to provide sample parameters 232 (including information related to a set of specimens 128 for the sample) and (e.g., global) test parameters 232 (including information related to a set of test methods to be used to test the specimens 128 for the sample). The information prompted (and / or collected) during the sample setup state(s) 302 may be information applicable to all specimens 128 and test methods, such as the date the test(s) will be run, the date the specimens 128 were manufactured / shipped / packaged, identification information of the operator (e.g., number, name, etc.), identification information of the gripping device(s) (e.g., number(s), name(s), etc.), and / or other information relevant to all tests of all specimens 128.

[0056] exist Figure 3 In the example of FIG. 3 , the sample setup state 302 is followed by one or more test specimen and / or test method setup states 304. During the test specimen and / or test method setup state(s) 304, the material testing workflow 300 prompts the operator to provide (and / or the material testing workflow collects) specimen parameters 232 (including information related to a particular specimen 128 of the sample), and / or test parameters 232 (including information related to a particular test method to be used to test the particular specimen 128).

[0057] For example, the test parameters 232 may include the date the test is to be run, identification information for the test (e.g., number, name, type, description, etc.), target start / end positions of the clamp(s) 124, target start / end positions of the lateral head 120, target distance / direction of movement by the lateral head 120, target speed of movement of the lateral head 120, expected test result(s) (e.g., break location / type, distance moved before break, force applied before break, post-test characteristics of the specimen, etc.), time(s) at which the sensor(s) 126 should make measurement(s), and / or other information related to a particular test method. As another example, the specimen parameters 232 may include the date the specimen 128 was manufactured / shipped / packaged, identification information for the specimen 128 (e.g., number, name, description, etc.), pre-test characteristics of the specimen 128 (e.g., measurement results / size, material type, weight, color, shape, modulus, ultimate tensile strength, etc.), and / or other information related to a particular specimen.

[0058] Figure 5a to Figure 5c Example workflow screens 500a through 500c are shown that may be presented via the UI 204 during the test specimen(s) and / or test method setup state 304. Figure 5a In the example of FIG. 5 , workflow screen 500 a presents several different types of testing methods that may be selected. Figure 5b The example workflow screen 500b in presents several different sample parameters 232 that may be specified. Figure 5c An example workflow screen 500c is shown showing several test parameters 232 that may be specified.

[0059] The workflow screens 500a to 500c have several input fields 502 in which information (e.g., sample / test parameter 232) may be shown and / or entered. And in fact, several of these input fields 502 already have information entered therein. In some examples, each input field 502 may correspond to a sample parameter 232 and / or a test parameter 232, and the information present therein is used to set the sample parameter 232 and / or the test parameter 232.

[0060] exist Figure 3, the test specimen and / or test method setup state 304 is followed by a test method execution state 306 (and / or multiple test method execution states 306). During the test method execution state(s) 306, the computing device 202 communicates with the material testing machine 102 (e.g., via the network interface 218) to execute the test method on the test specimen 128. In some examples, execution of the test method may involve using the material testing machine 102 according to the (e.g., test / specimen / sample) parameters 232 set during the test specimen(s) and / or test method setup state 304 and / or the sample(s) setup state 302. For example, the processing circuitry 224 of the computing device 202 may determine and / or send one or more parameters 232 and / or commands to the material testing machine 102, and the controller 214 of the material testing machine 102 may control the actuator(s) 210 of the material testing machine 102 according to the command(s) and / or parameter(s) 232 to execute the test method. In some examples, execution of a test method (e.g., via test method execution state(s) 306) may result in certain movement and / or operation of the materials testing machine 102 over a certain period of time, certain forces applied to the specimen 128, and / or some (multiple) (e.g., force) measurements of the test sensor(s) 126.

[0061] exist Figure 3 In the example of FIG. 3 , the test method execution state 306 is followed by one or more post-test analysis setup states 308. During the post-test analysis setup state(s) 308, the material testing workflow 300 prompts the operator to provide (and / or the material testing workflow collects) information and / or one or more analysis reports related to the analysis of the test method performed during the test method execution state 306.

[0062] For example, the information prompted to be provided (and / or collected) during the post-test specimen analysis setup state 308 may include post-test characteristics of the specimen 128 (e.g., specimen parameters 232), actual parameters of the test (e.g., test parameters 232), actual results of the test (e.g., test parameters 232), test result report formats (e.g., report parameters 232), and / or other information related to the test method and / or analysis of the test sample. As another example, the information prompted to be provided (and / or collected) during the post-test specimen analysis setup state 308 may include calculation analysis parameters 232, such as one or more algorithms that can be used to evaluate the results of the test method (and / or generate additional test results), and / or one or more thresholds and / or threshold ranges (e.g., the test results can be determined by the thresholds and / or threshold ranges to determine whether the specimen 128 passed or failed the test). Although in Figure 3304, but in some examples, the post-test specimen analysis setup state 308 may be integrated into the test specimen(s) and / or test method setup state 304.

[0063] Figure 5d to Figure 5f Workflow screens 500d through 500f that may be presented via the UI 204 during the post-test specimen analysis setup state(s) 308 are shown. Figure 5d and Figure 5e The example workflow screens 500d and 500e in illustrative examples show various computational analysis parameters 232 that may be set during the post-test specimen analysis setup state 308. Figure 5f An example workflow screen 500f is shown with various report parameters 232 that may be set to configure reports during the post-test specimen analysis setup state 308.

[0064] exist Figure 3 In the example of the material testing workflow 300, the one or more post-test specimen analysis setup states 308 are followed by one or more post-test specimen analysis calculation states 310 of the material testing workflow 300. During the post-test specimen analysis calculation state(s) 310, the processing circuit system 224 of the computing device 202 may perform one or more calculations based on information collected during the previous post-test specimen analysis setup state(s) 308 (e.g., calculation analysis parameters 232) and the results of the test method. In some examples, the results of the test method may include measurements of forces and / or loads applied to the specimen 128 (and / or measured by the test sensor 126) over a period of time (e.g., of the test method). In some examples, during the post-test specimen analysis calculation state(s) 310, the processing circuit system 224 of the computing device 202 may additionally (or alternatively) perform one or more calculations based on information about the specimen and / or the test method (e.g., sample / specimen / test parameters 232).

[0065] For example, processing circuitry 224 may use test results and / or samples, specimens, tests, and / or computed analysis parameters 232 to assess the strength, reliability, quality, grade, elasticity, and / or other characteristics of specimen 128. As another example, processing circuitry 224 may use test results and / or samples, specimens, tests, and / or computed analysis parameters 232 to guess at the structure and / or composition of specimen 128. As another example, processing circuitry may use test results and / or samples, specimens, tests, and / or computed analysis parameters 232 to guess at the future performance of specimen 128.

[0066] exist Figure 3In the example of FIG. 3 , the material testing workflow 300 (set at state 302) repeats states 304 to 310 for all test methods and / or test specimens for the test sample. As shown, after state 310, the material testing workflow 300 repeats to the next test method and / or test specimen (assuming there is another test method or test specimen) at state 314, and then returns to state 304. Once states 304 to 310 have been completed for all test methods and / or test specimens for the test sample, the material testing workflow 300 passes through one or more reporting states 316, in which the material testing workflow 300 can provide a report on the results and / or analysis of the test sample according to the operator instructions. In some examples, one or more reports can be provided to the remote interface 230 via the network 220.

[0067] Figure 4 2 is a flow chart illustrating example operations of a test method creation process 400. In some examples, during the test method creation process 400, the computing device 202 is configured to receive user input (e.g., via the UI 204) and use the user input to generate and / or set (e.g., test, sample, analysis, etc.) parameters 232 that would otherwise be set through the material testing workflow 300. In some examples, before using the test method creation process 400 and / or making progress through the test method creation process, the user may need to log in and / or be authenticated, as discussed above. Although the test method creation process 400 is sometimes described below as performing certain actions for ease of understanding, it should be understood that one or more of the above-described components of the material testing system 100 (e.g., the processing circuitry 224, the UI 204, etc.) may act on behalf of (and / or according to the instructions of) the test method creation process 400.

[0068] exist Figure 4 In the example of FIG. 4 , the test method creation process 400 begins at block 402, where the test method creation process 400 outputs one or more questions and / or other prompts (e.g., via UI 204) to obtain input from an operator and / or other user. In some examples, the questions and / or other prompts may seek to obtain input about the user's testing intent, expectations, goals, and / or specimens, which may be converted into parameters 232 that define the test method and / or test result analysis. As shown, at block 402, the test method creation process 400 also receives the user input that the prompt(s) seek to obtain.

[0069] Figure 6a to Figure 6b An example of a creation screen 600 that may be shown during block 402 (and / or other blocks) of the test method creation process 400 is shown. Figure 6a to Figure 6bIn the example of , the creation screen 600 includes several prompts 602, each of which is adjacent to an input field 502. As shown, some of the input fields 502 include drop-down menus with several options to select from, while other input fields 502 allow free-form text entry. Although most of the input fields 502 have some information typed in, at least one input field 502 remains empty.

[0070] Figure 6b The example workflow screen 600b in FIG. 5 further illustrates an example result graph 604 that can be additionally used to accept input from a user (e.g., via a cursor). For example, a user can interact with the graph 604 to select a particular portion (e.g., A, B, C, D, or E). In some examples, selecting a particular portion of the result graph 604 can select a particular option from the input field 502. Figure 6b In the example of FIG. 6 , the user selected portion E of the result graph 604 and thus selected “Break Point” in response to the prompt 602 regarding the most relevant property of the specimen 128 (e.g., as opposed to elasticity, yield strength, ultimate strength, etc.). In some examples, a different selection of the most relevant property of the specimen 128 (e.g., via the graph 604 or input field 502 d) may cause the test method creation process 400 to select a different calculation analysis parameter 232.

[0071] exist Figure 4 In the example shown in FIG. 4 , the test method creation process 400 determines at block 404 (e.g., after receiving an indication that the user has finished entering information) whether any input fields 502 from block 402 are still empty and / or unset. If there are still empty and / or unset input fields 502, the test method creation process 400 identifies one or more suggested inputs for the empty input fields 502 at block 406.

[0072] In some examples, identification of suggested inputs may involve analyzing prior inputs (e.g., stored in the data repository 234) to identify the most recent and / or most frequently used input(s) for a particular (e.g., empty) input field 502. In some examples, the test method creation process 400 may additionally (or alternatively) consider other factors, such as the logged in user and / or the materials testing machine 102 being used (e.g., to determine the most recent / most frequently used inputs for a particular user and / or machine 102). For example, a particular materials testing machine 102 (and / or gripping device 122, clamp 124, sensor 126, etc.) may always be used for compression, in which case the test method creation process 400 may suggest "crush" in answer to the question "Will the specimen be bent, stretched, or crushed?" In some examples, the test method creation process 400 may additionally consider other prior inputs (e.g., to determine the most recent / most frequently used inputs when a particular input pattern exists).

[0073] In some examples, a more complex analysis can be used, where the test method creation process 400 attempts to use previous input data (e.g., stored in the repository 234) to identify one or more input patterns that match the current input pattern. In some examples, one or more machine learning algorithms (e.g., cluster analysis, K-nearest neighbors, etc.) can be used for pattern matching. This pattern matching can then be used to identify inputs to suggest.

[0074] In some examples, the suggested inputs identified at block 406 may be output to the user via UI 204. In some examples, the test method creation process 400 may provide an explanation as to why the suggestion was made. In some examples, the suggested inputs may be implemented and / or used as actual inputs (e.g., accepting the suggestion in response to input received via UI 204). Although block 406 is described as occurring after the user input at block 402 ends, in some examples, the suggestion(s) of block 406 may occur while the user is typing, so that the user may see the suggested inputs themselves before actually selecting the inputs.

[0075] For example, Figure 6a to Figure 6b An example of suggested inputs presented on a creation screen 600a is shown. In the example of FIG. 6 , the suggested inputs are the grayed-out inputs in input fields 502a and 502b. In some examples, multiple input suggestions may be made. For example, both the American Society for Testing and Materials (ASTM) and the International Organization for Standardization (ISO) may be suggested for input field 502a, with the user being allowed to select one (or both) of these suggestions. In some examples, a single input suggestion may be made from several possible choices. For example, in Figure 6bIn the example of FIG. 5 , input field 502 c shows a suggestion to use the stress axis and the strain axis instead of other potential axis selections (eg, load and displacement, load and time, etc.).

[0076] exist Figure 4 In the example of FIG. 4 , after block 406, the test method creation process 400 proceeds to block 408, where the test method creation process 400 identifies one or more parameters 232 (and / or parameter values) of the material testing workflow 300 based on the input(s) received at blocks 402 and / or 406. In some examples, the identification may involve converting a single input into multiple parameters 232 (and / or parameter values) such that all parameters 232 may be set with fewer inputs than required to set each parameter 232 individually. In some examples, the conversion may use one or more data structures (e.g., one or more data structures of a data repository 234) that map inputs to parameters 232. Such data structures may be particularly fruitful in situations where there are a limited number of known inputs that may be entered in response to a particular prompt 602 and / or in situations where a drop-down menu input field 502 is used (e.g., to provide a limited number of known inputs as options). In some examples, if there are parameters 232 that cannot be directly associated with an input, the parameters 232 may be assigned default values ​​(eg, stored in memory circuitry 226 ) that are known to be broadly applicable in most situations.

[0077] Where appropriate, after block 408, the test method creation process 400 identifies one or more parameters 232 (and / or parameter values) to suggest to the user at block 410. In some examples, the parameter(s) 232 (and / or parameter value(s)) may be suggested if one or more parameters 232 (and / or parameter values) remain unidentified and / or unset after block 408. In some examples, even if the parameters 232 (and / or parameter values) are set at block 408, the parameters 232 (and / or parameter values) may be suggested if changing to the suggested parameters 232 (and / or parameter values) would save time, reduce the likelihood of error, and / or make the parameters 232 (and / or test method) conform to certain standards.

[0078] In some examples, the test method creation process 400 identifies the suggested parameter(s) 232 based on one or more inputs received at blocks 402 and / or 406. For example, one of the user inputs at block 402 may identify a particular standard, and the test method creation process 400 may evaluate the parameters 232 according to the standard and identify one or more parameters 232 that should be adjusted to meet the standard (e.g., based on the materials testing machine 102, other parameters 232, and / or other inputs).

[0079] In some examples, the test method creation process 400 identifies the suggested parameter(s) 232 based on one or more other existing and / or previous parameters 232. For example, the test method creation process 400 can evaluate the previous parameters 232 in light of the current specimen parameters 232 (e.g., indicating that the specimen 128 is a particular material) and identify one or more particular test parameters 232 as being most commonly / recently used in the past in conjunction with the specimen parameters 232.

[0080] In some examples, the test method creation process 400 can use a more complex analysis, where the test method creation process 400 attempts to use previous parameters 232 and / or inputs (e.g., stored in the repository 234) to identify one or more patterns that match the current pattern of parameters 232 and / or inputs. In some examples, one or more machine learning algorithms (e.g., cluster analysis, K-nearest neighbors, etc.) can be used for pattern matching. In some examples, the test method creation process 400 can additionally (or alternatively) identify suggested parameter(s) 232 based on previous test results (e.g., stored in the repository 234).

[0081] In some examples, the suggested parameter(s) 232 identified at block 410 can be output to the user via UI 204. In some examples, the test method creation process 400 can provide an explanation as to why the suggestion was made. In some examples, the suggested parameter(s) 232 can be used as the actual parameter(s) 232 (e.g., in response to input received via UI 204 accepting the suggestion).

[0082] exist Figure 4 In the example of FIG. 4 , after block 410, the test method creation process 400 proceeds to block 412, where the test method creation process 400 generates the material testing workflow 300 using the parameters 232 identified at blocks 410 and / or 408 (and / or the input received at blocks 402 and / or 406). In some examples, when using the parameters 232 to generate the material testing workflow 300, the test method creation process 400 can define a test method.

[0083] After block 412, the test method creation process 400 generates one or more documents based on the received input, the current parameters 232 (and / or parameter values), and / or the generated material testing workflow 300 (and / or test method) at block 414. For example, the document(s) may provide instructions on how to use the material testing workflow 300 and / or how to set up, execute the test method, and / or analyze the results of the test method. Such documentation may be useful to an operator responsible for using the generated material testing workflow 300 and / or setting up, executing the test method, and / or analyzing the results of the test method.

[0084] After block 414, the test method creation process 400 generates and / or provides a tutorial at block 416 (e.g., via the UI 204). In some examples, the tutorial may instruct the user on how to set up the material testing machine 102, operate the material testing machine 102, progress through the material testing workflow 300, and / or set up, execute a test method, and / or analyze the results of a test method (e.g., via the material testing workflow 300). In some examples, the tutorial may provide access to a human or automated assistant to provide guidance on how to set up the material testing machine 102, operate the material testing machine 102, progress through the material testing workflow 300, and / or set up, execute a test method, and / or analyze the results of a test method.

[0085] exist Figure 4 In the example of FIG. 4 , after block 416, the test method creation process 400 proceeds to block 418, where the test method creation process 400 allows the user to use and / or progress through the generated material testing workflow 300. By allowing the user to progress through the workflow 300, the user is allowed to view and / or modify any desired parameters 232. For example, the user may use the test method creation process 400 to easily set values ​​for many parameters 232, but be aware that several parameters 232 must be set in some manner to define the test method and / or analyze the test results as desired. In such an example, the user may manually customize the parameters 232 to the desired degree.

[0086] In some examples, block 418 may include using the material testing machine 102 (and / or via communication with the material testing machine) to execute the test method defined by the identified parameters 232 of the workflow 300. For example, a user may use the test method execution state(s) 306 of the workflow 300 to execute the test method using the set parameters 232. Thereafter, at block 420, the results of the test method are compiled and / or output via one or more reports (e.g., via the post-test states 308, 310, and / or 316 of the workflow 300).

[0087] In some examples, the report(s) may be provided to a remote user via a network 220 (eg, the Internet) using a remote interface 230. In such examples, the report may take the form of a website, web platform, or other online interface.

[0088] Although blocks 418 and 420 are shown as part of the test method creation process 400 for the purpose of completeness and understanding, one of ordinary skill in the art will appreciate that blocks 418 and 420 may be performed outside of the test method creation process 400. As shown, the test method creation process 400 ends after block 420.

[0089] Figure 7 is a flow chart illustrating an example operation of a sensor testing process 700. In some examples, during the sensor testing process 700, one or more sensor testing methods are set and / or performed for testing the test sensor(s) 126 of the material testing machine 102. In some examples, by periodically testing the test sensors 126 via the testing methods, the sensor testing process 700 ensures that the test sensors 126 are operating correctly and are not compromised by certain problems (e.g., sensor drift, overload, poor calibration, and / or other problems that affect the reliability, accuracy, and / or correct operation of the test sensor(s) 126). In some examples, if the test results indicate that one or more sensors 126 are malfunctioning, further test methods (e.g., of the specimen 128) may be inhibited from being performed. Such inhibition may ensure that the tests performed using the material testing machine remain reliable and usable, rather than becoming untrustworthy due to a malfunctioning test sensor. In some examples, inhibition may be terminated manually and / or when the test results indicate that all sensors 126 are operating correctly.

[0090] In some examples, a user may be required to log in and / or be authenticated before using and / or progressing through the sensor testing process 700, as discussed above. Although the sensor testing process 700 is sometimes described below as performing certain actions for ease of understanding, it should be understood that one or more of the above-described components of the material testing system 100 (e.g., the processing circuit system 224, the UI 204, etc.) may act on behalf of (and / or according to the instructions of) the sensor testing process 700.

[0091] exist Figure 7 In the example of FIG. 7 , the sensor testing process 700 begins at block 702, where the sensor testing process 700 sets up one or more test methods to test the test sensor(s) 126 of the material testing machine 102. In some examples, the one or more test methods may be set up using the material testing workflow 300. In some examples, the one or more test methods may be set up and / or created using the creation process 400.

[0092] In some examples, each test sensor 126 of the material testing machine 102 is associated with its own unique test method. In some examples, a particular test sensor 126 may be associated with a particular test method by specifying (e.g., via the test parameter(s) 232) that the particular test sensor 126 is the test sensor to be used for the test.

[0093] In some examples, the specimen 128 in the test method for testing the sensor 126 can be an item with a known weight (e.g., specified as part of the sample / specimen parameter(s) 232). Thus, the sensor testing process 700 can determine whether the test sensor 126 is operating properly by comparing the weight (and / or force) measurements of the test sensor 126 during the test method to the known weight (and / or force). In some examples, if the measured weight is the same as the known weight or within a certain tolerance of the known weight, it can be determined that the test sensor 126 has passed the test. In some examples, the tolerance can be specified as part of the analysis parameter(s) 232.

[0094] Figure 8 An example creation screen 600c is shown that may be displayed when using the creation process 400 to create a test method for testing a test sensor 126 of a material testing machine 102. As shown, the creation screen 600c has Figure 6a The creation screen 600a has a similar prompt 602. However, the information filled in the input field 502 of the creation screen 600c is different from the information of the creation screen 600a.

[0095] exist Figure 8 In the example of FIG. 6A , the information populated in the input fields 502 in the creation screen 600c is customized for the purpose of creating a test method for testing the test sensor 126 of the material testing machine 102. In particular, the creation screen 600c shows information in the input field 502e that identifies the specimen 128 as corresponding to the identifier TSW50. In some examples, the identifier may correspond to an item of known (e.g., 50 pounds) weight that is used as the specimen 128 for testing the test sensor(s) 126.

[0096] exist Figure 8 In the example of , the suggested inputs populate the other input fields 502 of the creation screen 600c. In some examples, the creation process 400 can identify the suggested inputs based on the identifier of the specimen 128 in the input field 502c. For example, one or more data repositories 234 can store one or more data structures that map the identifier of the specimen 128 with other information about the specimen 128, the test method, and / or the result analysis. In some examples, the identifier of the specimen 128 can be considered as an input and / or a specimen parameter 232.

[0097] In some examples, one or more other parameters 232 that are not traditionally part of the material testing workflow 300 may also be provided at block 702. For example, the sensor testing process 700 may prompt for and / or receive input specifying one or more time parameters 232 representing a time period, frequency, number of times, and / or other variables indicating how often the test method(s) should be performed (e.g., for all test sensors 126 or for a particular test sensor 126) to intervene in the test method / sample / coupon 128.

[0098] As another example, the sensor test process 700 may prompt for and / or receive input specifying one or more log parameters 232 that represent one or more conditions that may trigger a need to test the test sensor(s) 126 via the appropriate test method(s). In some examples, the material testing system 100 may maintain a data log (e.g., via one or more data repositories 234) that records measurements (and other data) of the test sensor(s) 126 from previous sensor measurements, previous test results, previous test methods, and / or previous material testing workflows 300. In some examples, the sensor test process 700 may analyze the recorded data to determine whether any of the conditions represented by the log parameters 232 have been met to determine whether the sensor(s) 126 need to be tested via the appropriate test method(s).

[0099] Examples of conditions represented by the log parameters 232 may include certain data trends, such as a series of test method measurements (e.g., made by a test sensor 126) that indicate potential sensor drift, sensor overload, and / or poor calibration (e.g., based on other measurements made during previous test methods by the same test sensor 126 and / or by other test sensors 126). Another example may include exceeding one or more thresholds that sensor measurements should never (or rarely) reach.

[0100] exist Figure 7In the example of FIG. 7 , after block 702, the sensor test process 700 proceeds to block 704, where the sensor test process 700 determines whether the time parameter 232 indicates that it is time to perform the sensor test method(s). In some examples, the sensor test process 700 may further consider data (e.g., implemented via the processing circuit system 224 and / or implemented via machine-readable instructions in the memory circuit system 226) from the counter (e.g., date / time / test method / sample / test specimen 128) of the computing device 202 when determining whether it is time to perform the sensor test method(s). If the sensor test process 700 determines that it is time to perform the sensor test method(s), the sensor test process 700 proceeds to block 708, where the sensor test process 700 performs the test method(s) set at block 702. However, if the sensor test process 700 determines that it is not yet time to perform the sensor test method(s), the sensor test process 700 proceeds to block 706.

[0101] At block 706, the sensor test process 700 analyzes the data log (e.g., stored via the data repository 234) to see if there is evidence that any of the conditions represented by the log parameters 232 are satisfied. If no such evidence is found, the sensor test process 700 returns to the test time determination block 704. However, if the sensor test process 700 does find evidence that one or more of the conditions represented by the log parameters 232 are satisfied, the sensor test process 700 proceeds to block 708, where the sensor test process 700 performs the sensor test method(s).

[0102] Although in Figure 7 704 and discussed above as occurring in a particular order, but in some examples, the order of blocks 704 and 706 may be reversed such that block 706 occurs first and block 704 occurs later (e.g., in the event that the result of block 706 is no). In either case, if the result of either block 704 and / or 706 is yes, the sensor testing process 700 next proceeds to block 708, where the sensor testing process 700 performs the sensor testing method(s).

[0103] In some examples, the computing device 202 communicates with the material testing machine 102 (e.g., via the network interface 218) to perform the sensor test method(s), as discussed above. In some examples, the execution of the sensor test method(s) may involve using the material testing machine 102 according to the (e.g., test / coupon / sample) parameters 232 set by the creation process 400 and / or during the material testing workflow 300, as discussed above. Although shown as being automatically performed by the sensor testing process 700, in some examples, the sensor test method(s) may be manually performed by a user at any time (e.g., via the material testing workflow 300).

[0104] exist Figure 7 In the example of FIG. 7 , after executing the sensor test method at block 708, the sensor test process 700 proceeds to block 710, where the sensor test process 700 analyzes the test results of the sensor test method to determine whether the particular test sensor 126 tested by the test method passed the test. In some examples, the analysis of the test results may include comparing one or more force measurements and / or one or more statistical representations of one or more force measurements (e.g., mean, mode, median, etc.) of the test sensor 126 to one or more expected measurements and / or one or more threshold tolerances (e.g., represented via analysis parameters 232). For example, the sensor test process 700 may compare the average force measurement of the test sensor 126 to the expected force measurement and determine that the test sensor 126 passed the test method because the average force measurement, while not exactly the same as the expected force measurement, is within a tolerable range (e.g., + / - 2 pounds) of the expected force measurement.

[0105] As shown, if the sensor test process 700 determines that the test sensor 126 passes the test method, the sensor test process 700 proceeds to block 712 after block 710. At block 712, the sensor test process 700 determines whether the material testing machine 102 has another test sensor 126 that needs to be (or has not yet been) tested (and / or whether another associated test method needs to be performed or has not yet been performed). If so, the sensor test process 700 returns to block 708, where the next test method is performed.

[0106] If it is determined at block 710 that all test sensors 126 have passed the test method(s), and no additional test sensors 126 are found to require testing at block 712, the sensor testing process 700 proceeds to block 714, where the sensor testing process 700 enables further test methods to be performed using the material testing machine 102 (e.g., to perform the test method on the specimen 128 that requires testing). In some examples, the user may also manually enable further test methods to be performed. After enabling further test methods to be performed at block 714, the sensor testing process 700 returns to block 704 (although in some examples, the sensor testing process 700 may instead return to block 702 or end).

[0107] However, if at block 710 the test sensor 126 is found to have failed the test method, the sensor testing process 700 proceeds to block 716, where further test methods are prohibited from being performed using the material testing machine 102. In some examples, this prohibition can ensure that the test results of other test methods are reliable and are not discarded due to a malfunction of the test sensor(s) 126. In some examples, the sensor testing process 700 proceeds to block 716 only if a certain number (e.g., stored in the memory circuitry 226) of the test sensors 126 have failed their test methods. Although shown as returning to block 708 after block 716, in some examples, the sensor testing process 700 may alternatively end after block 716.

[0108] The disclosed sensor testing process 700 allows for testing one or more test sensors 126 of a material testing machine 102 to ensure that each test sensor 126 is operating properly. Testing may be performed manually, periodically, and / or in response to some indication that a test sensor 126 may be malfunctioning. In some examples, in the event that the test results indicate that one or more sensors 126 are malfunctioning, and / or until the test results indicate that all sensors 126 are operating properly, further test methods may be inhibited from being executed (e.g., the test method is not executed to test the test sensor(s) 126). Such inhibition may ensure that test results of other test methods are reliable and usable, rather than being discredited due to a malfunctioning test sensor 126.

[0109] The method and / or system can be implemented with hardware, software, or a combination of hardware and software. The method and / or system can be implemented in a centralized manner in at least one computing system, or in a distributed manner with different elements spread over several interconnected computing systems or cloud systems. Any type of computing system or other device adapted to perform the method described herein is suitable. A typical combination of hardware and software can be a general computing system with a program or other code, which controls the computing system when loaded and executed so that the computing system performs the method described herein. Another typical implementation may include a dedicated integrated circuit or chip. Some implementations may include a non-transient machine-readable (e.g., computer-readable) medium (e.g., a flash drive, an optical disk, a magnetic storage disk, etc.), which stores one or more lines of code executable by a machine on the non-transient machine-readable medium, so that the machine performs the process as described herein.

[0110] Although the present method and / or system has been described with reference to certain embodiments, it will be appreciated by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the present method and / or system. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the scope of the present disclosure. Therefore, the present method and / or system is not intended to be limited to the specific embodiments disclosed, but the present method and / or system will include all embodiments falling within the scope of the appended claims.

[0111] As used herein, "and / or" refers to any one or more items in the list connected by "and / or". As an example, "x and / or y" refers to any element in the three-element set {(x), (y), (x, y)}. In other words, "x and / or y" means "one or both of x and y". As another example, "x, y and / or z" refers to any element in the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}. In other words, "x, y and / or z" means "one or more of x, y and z".

[0112] As used herein, the terms "eg" and "for example" introduce a list of one or more non-limiting examples, instances, or illustrations.

[0113] As used herein, the terms "coupled," "coupled to," and "coupled with" refer to structural and / or electrical connections, whether attached, attached, connected, joined, fastened, associated, and / or otherwise secured, respectively. As used herein, the term "attach" refers to attaching, coupling, connecting, joining, fastening, associated, and / or otherwise secured. As used herein, the term "connect" refers to attaching, attaching, coupling, joining, fastening, associated, and / or otherwise secured.

[0114] As used herein, the terms "circuit" and "circuitry" refer to physical electronic components (i.e., hardware) and any software and / or firmware ("code") that may configure, be executed by, and / or otherwise be associated with the hardware. As used herein, for example, a particular processor and memory may constitute a first "circuit" when executing a first one or more lines of code, and may constitute a second "circuit" when executing a second one or more lines of code. As used herein, a circuitry is "operable" and / or "configured" to perform a function when the circuitry includes the necessary hardware and / or code (if necessary) to perform the function, regardless of whether performance of the function is disabled or enabled (e.g., by a user-configurable setting, a factory adjustment, etc.).

[0115] As used herein, control circuitry may include digital circuit systems and / or analog circuit systems, discrete circuit systems and / or integrated circuit systems, microprocessors, DSPs, etc., located on one or more circuit boards to form part or all of a controller and / or software, hardware and / or firmware for controlling a welding process and / or equipment such as a power supply or a wire feeder.

[0116] As used herein, the term "processor" refers to a processing device, device, program, circuit, component, system and subsystem, whether implemented in hardware, software in tangible form or both, and whether or not it is programmable. As used herein, the term "processor" includes, but is not limited to, one or more computing devices, hard-wired circuits, signal modification devices and systems, devices and machines for controlling systems, central processing units, programmable devices and systems, field programmable gate arrays, application-specific integrated circuits, systems on chip, systems including discrete components and / or circuits, state machines, virtual machines, data processors, processing facilities and any combination of the above components. The processor may be, for example, any type of general-purpose microprocessor or microcontroller, a digital signal processing (DSP) processor, an application-specific integrated circuit (ASIC), a graphics processing unit (GPU), a reduced instruction set computer (RISC) processor with an advanced RISC machine (ARM) core, etc. The processor may be coupled to a memory device and / or integrated with a memory device.

[0117] As used herein, the terms "memory" and / or "memory device" refer to computer hardware or circuitry for storing information for use by a processor and / or other digital device. The memory and / or memory device may be any suitable type of computer memory or any other type of electronic storage medium, such as read-only memory (ROM), random access memory (RAM), cache memory, compact disk read-only memory (CDROM), electro-optical memory, magneto-optical memory, programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), computer-readable media, etc. The memory may include, for example, non-transitory memory, non-transitory processor-readable medium, non-transitory computer-readable medium, non-volatile memory, dynamic RAM (DRAM), volatile memory, ferroelectric RAM (FRAM), first-in-first-out (FIFO) memory, last-in-first-out (LIFO) memory, stack memory, non-volatile RAM (NVRAM), static RAM (SRAM), cache, buffer, semiconductor memory, magnetic memory, optical memory, flash memory, flash memory card, compact flash memory card, memory card, secure digital memory card, micro card, mini card, expansion card, smart card, memory stick, multimedia card, picture card, flash memory device, subscriber identity module (SIM) card, hardware drive (HDD), solid state drive (SSD), etc. The memory may be configured to store code, instructions, applications, software, firmware and / or data, and may be external to the processor, internal to the processor, or both internal and external to the processor.

Claims

1. A material testing system, comprising: a material testing machine comprising a test sensor, a test actuator, and a test controller configured to control the test actuator; as well as a computing device configured to communicate with the materials testing machine, the computing device comprising processing circuitry configured to: using the material testing machine to perform a sensor testing method, the sensor testing method comprising a method for testing the test sensor of the material testing machine, determining whether the test sensor of the material testing machine is operating correctly based on the test results of the sensor testing method, and In response to determining that the test sensor is not operating properly, further testing methods are inhibited from being performed using the materials testing machine.

2. The system of claim 1, wherein: Determining whether the test sensor is operating properly includes determining whether measurements of the test sensor during execution of the sensor testing method are within a specified tolerance of expected measurements, the test results including measurements of the test sensor during execution of the sensor testing method.

3. The system of claim 1, wherein: The computing device further includes a memory circuit system that stores a time parameter, and the processing circuit system is further configured to: in response to determining that the test sensor operates correctly, execute the sensor testing method again after a certain time delay, and the time delay is determined based on the time parameter stored in the memory circuit system.

4. The system of claim 1, wherein: The sensor testing method comprises a first sensor testing method, the test result comprises a first test result, the test sensor comprises a first test sensor, the material testing machine further comprises a second test sensor, and the processing circuitry is further configured to: In response to determining that the first test sensor is operating properly, performing a second sensor testing method using the materials testing machine, and A determination is made as to whether the second test sensor of the materials testing machine is operating properly based on a second test result of the second sensor testing method.

5. The system of claim 4, wherein: The processing circuit system is further configured to: in response to determining that the second test sensor is operating correctly, successively perform an additional sensor testing method for each additional test sensor of the materials testing machine until each additional test sensor has been determined to be operating correctly or until an additional test sensor is determined to be operating incorrectly.

6. The system of claim 1, further comprising: A user interface, wherein the user interface is configured to: outputting input prompts for the sensor test method, and receiving one or more user inputs in response to the input prompts, The processing circuit system is further configured to: identifying one or more test parameters for the sensor testing method based on the one or more inputs, and The sensor test method is generated based on the one or more test parameters.

7. The system of claim 1, wherein: The processing circuit system is further configured to determine whether there is an indication that the test sensor of the materials testing machine is not operating properly based on an event record stored in the memory circuit system of the computing device, the event record including a log of events occurring during setup, execution, or analysis of a testing method, wherein the sensor testing method is performed in response to determining that there is an indication that the test sensor is not operating properly.

8. A non-transitory computer readable medium comprising machine readable instructions which, when executed by a processor, cause the processor to: performing a sensor testing method using a material testing machine, the material testing machine comprising a test sensor, a test actuator, and a test controller, the test controller configured to control the test actuator, the sensor testing method comprising a method for testing the test sensor of the material testing machine; determining whether the test sensor of the material testing machine is operating correctly based on the test results of the sensor testing method; as well as In response to determining that the test sensor is not operating properly, further testing methods are inhibited from being performed using the materials testing machine.

9. The non-transitory computer readable medium of claim 8, wherein: Determining whether the test sensor is operating properly includes determining whether measurements of the test sensor during execution of the sensor testing method are within a specified tolerance of expected measurements, the test results including measurements of the test sensor during execution of the sensor testing method.

10. The non-transitory computer readable medium of claim 8, further comprising a time parameter, wherein the machine readable instructions, when executed by the processor, further cause the processor to execute the sensor testing method again after a time delay in response to determining that the test sensor is operating correctly, wherein the time delay is determined based on the time parameter.

11. The non-transitory computer readable medium of claim 8, wherein: The sensor testing method comprises a first sensor testing method, the test result comprises a first test result, the test sensor comprises a first test sensor, the material testing machine further comprises a second test sensor, and the machine-readable instructions, when executed by the processor, further cause the processor to: in response to determining that the first test sensor is operating properly, performing a second sensor testing method using the materials testing machine; as well as A determination is made as to whether the second test sensor of the materials testing machine is operating properly based on a second test result of the second sensor testing method.

12. The non-transitory computer readable medium of claim 11, wherein: The machine-readable instructions, when executed by the processor, further cause the processor to perform the following operations: in response to determining that the second test sensor is operating correctly, successively perform an additional sensor testing method for each additional test sensor of the materials testing machine until each additional test sensor has been determined to be operating correctly or until an additional test sensor is determined not to be operating correctly.

13. The non-transitory computer readable medium of claim 8, wherein: The machine readable instructions, when executed by the processor, further cause the processor to: Outputting input prompts related to the sensor testing method via a user interface; receiving, via the user interface, one or more user inputs in response to the input prompt; identifying one or more test parameters for the sensor testing method based on the one or more inputs; as well as The sensor test method is generated based on the one or more test parameters.

14. The non-transitory computer readable medium of claim 8, wherein: The machine-readable instructions, when executed by the processor, further cause the processor to perform the following operations: determine whether there is an indication that the test sensor of the materials testing machine is not operating properly based on an event record stored in the memory circuitry of the computing device, the event record comprising a log of events that occurred during setup, execution, or analysis of a testing method, wherein the sensor testing method is performed in response to determining that there is an indication that the test sensor is not operating properly.

15. A method comprising: performing a sensor testing method using a material testing machine, the material testing machine comprising a test sensor, a test actuator, and a test controller configured to control the test actuator, the sensor testing method comprising a method for testing a test sensor of the material testing machine; determining, via processing circuitry of a computing device, whether the test sensor of the materials testing machine is operating properly based on test results of the sensor testing method; as well as In response to determining that the test sensor is not operating properly, further testing methods are inhibited from being performed using the materials testing machine.

16. The method of claim 15, wherein: Determining whether the test sensor is operating properly includes determining whether measurements of the test sensor during execution of the sensor testing method are within a specified tolerance of expected measurements, the test results including measurements of the test sensor during execution of the sensor testing method.

17. The method of claim 15, further comprising executing the sensor testing method again after a time delay in response to determining that the test sensor is operating properly, the time delay being determined based on a time parameter stored in memory circuitry of the computing device.

18. The method of claim 15, wherein: The sensor testing method comprises a first sensor testing method, the test result comprises a first test result, the test sensor comprises a first test sensor, the material testing machine further comprises a second test sensor, and the method further comprises: In response to determining that the first test sensor is operating properly, performing a second sensor testing method using the materials testing machine; and A determination is made, via the processing circuitry, whether the second test sensor of the materials testing machine is operating properly based on a second test result of the second sensor testing method.

19. The method of claim 18, further comprising: In response to determining that the second test sensor is operating properly, an additional sensor testing method is successively performed for each additional test sensor of the materials testing machine until each additional test sensor has been determined to be operating properly or until an additional test sensor is determined not to be operating properly.

20. The method of claim 15, further comprising determining, via the processing circuitry, whether there is an indication that the test sensor of the materials testing machine is not operating properly based on an event log stored in memory circuitry of the computing device, the event log comprising a log of events that occurred during setup, execution, or analysis of a test method, wherein The sensor testing method is performed in response to determining that there is an indication that the test sensor is not operating properly.

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