Heat dissipation projector bracket

Abstract

The present invention relates to a heat dissipation projector bracket. The heat dissipation projector bracket relates to the technical field of projector brackets; the heat dissipation projector bracket comprises a first aluminum alloy heat dissipation module, a second aluminum alloy heat dissipation module, a VC heat spreader, a plastic tray, an upper heat-conducting copper tube, a height adjustment button, a lower heat-conducting copper tube, an aluminum alloy base, a semiconductor refrigeration plate, and a mainboard. The present invention transmits temperature to the VC heat spreader and the upper and lower heat-conducting copper tubes through the semiconductor refrigeration plate, thereby controlling the temperature of the air intake around and at the bottom of the projector, keeping the air intake temperature at a low temperature before entering the projector, thereby reducing the internal temperature of the projector. Due to the internal PWM fan heat dissipation logic of the projector, the fan speed will decrease as the temperature decreases, thereby reducing the noise of the entire projector. After the heat dissipation housing is fixed to the VC heat spreader by adsorption through a magnetic plate, the threaded sleeve is rotated to adjust the position of the threaded sleeve, thereby pressing the rubber plate against the side of the projector, which can also fix the projector.

Description

Technical Field

[0001] The invention belongs to the technical field of projector brackets, and in particular relates to a heat dissipation projector bracket. Background Art

[0002] A projector is a device that can project images or videos onto a screen. It can be connected to computers, VCDs, DVDs, BDs, game consoles, DVs, etc. through different interfaces to play corresponding video signals.

[0003] Many projectors on the market currently suffer from issues like overheating and excessive noise during operation. Overheating can lead to deteriorating image quality and diminishing internal optical and mechanical lifespans, creating a negative user experience.

[0004] Therefore, a heat dissipation projector bracket is proposed to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a heat dissipation projector bracket with a simple structure and reasonable design in order to solve the above problems, so as to solve the problem of excessive temperature when the projector is working.

[0006] The present invention achieves the above-mentioned purpose through the following technical solutions:

[0007] A heat dissipation projector bracket, comprising a first aluminum alloy heat dissipation module, a second aluminum alloy heat dissipation module, a VC heat sink, a plastic tray, an upper heat-conducting copper tube, a height adjustment button, a lower heat-conducting copper tube, an aluminum alloy base, a semiconductor cooling plate and a mainboard;

[0008] The upper thermal copper tube, height adjustment knob, lower thermal copper tube and aluminum alloy base constitute a "lower thermal conductive assembly". The upper thermal copper tube, height adjustment knob, lower thermal copper tube and aluminum alloy base are arranged from top to bottom in sequence. The upper end of the upper thermal copper tube is fixedly connected to the middle of the bottom surface of the plastic tray, the lower end of the upper thermal copper tube is connected to the height adjustment knob, the height adjustment knob is connected to the upper end of the lower thermal copper tube, and the lower end of the lower thermal copper tube is fixedly connected to the upper surface of the aluminum alloy base.

[0009] The mainboard and semiconductor cooling plate are installed in the plastic tray, and a VC heat spreader is installed above the plastic tray. The VC heat spreader is located above the mainboard and semiconductor cooling plate, and the first aluminum alloy heat dissipation module and the second aluminum alloy heat dissipation module are adsorbed on the VC heat spreader by magnetic attraction.

[0010] As a further optimization solution of the present invention, the first aluminum alloy heat dissipation module and the second aluminum alloy heat dissipation module are distributed on both sides of the projector, and the projector is mounted on a VC heat sink.

[0011] As a further optimization scheme of the present invention, the first aluminum alloy heat dissipation module and the second aluminum alloy heat dissipation module both include a heat dissipation shell, and air inlet and outlet slots are provided on both sides of the heat dissipation shell. A motor is fixedly installed in the heat dissipation shell through a bracket, and fan blades are fixedly provided on the rotating shaft of the motor. The motor and the fan blades are fans with PWM function.

[0012] As a further optimization solution of the present invention, a magnetic plate is fixedly provided on the bottom surface of the heat dissipation housing, and the magnetic plate is adsorbed and fixed on the upper surface of the VC heat spreader.

[0013] As a further optimization scheme of the present invention, the height adjustment button is a cylindrical structure, and a conical groove is provided on the inner wall of the upper end of the height adjustment button. The upper end opening of the conical groove is large and the lower end opening is small. An internal thread is provided on the inner wall of the lower end of the height adjustment button, and an external thread structure is provided on the outer ring of the upper end of the lower heat-conducting copper tube, and the external thread structure is connected with the internal thread.

[0014] As a further optimization scheme of the present invention, a plurality of arc-shaped elastic plates are further provided at the upper end of the lower heat-conducting copper tube, gaps are provided between the plurality of arc-shaped elastic plates, a circular ring structure is formed between the plurality of arc-shaped elastic plates, and the outer ring of the arc-shaped elastic plate is also provided with an external thread structure.

[0015] As a further optimization solution of the present invention, the diameter of the upper heat-conducting copper tube is smaller than the diameter of the lower heat-conducting copper tube.

[0016] As a further optimization solution of the present invention, a threaded rod is fixedly provided on the side of the heat dissipation shell close to the projector, a threaded sleeve is connected to the threaded rod through threaded cooperation, a pressure plate is fixedly provided on the end of the threaded sleeve, and the pressure plate is pressed onto the side of the projector.

[0017] As a further optimization solution of the present invention, a rubber plate is fixedly provided on a side of the pressing plate away from the threaded sleeve.

[0018] As a further optimization solution of the present invention, a plurality of threaded rods are provided.

[0019] As a further optimization solution of the present invention, it also includes a bottom power heat dissipation module, which includes an air inlet, a heat dissipation outlet duct and a heat dissipation mechanism. The upper heat-conducting copper tube and the lower heat-conducting copper tube are both hollow round rod structures, and the upper heat-conducting copper tube and the lower heat-conducting copper tube are connected to each other. The air inlet is arranged at the upper end of the upper heat-conducting copper tube, and the air inlet is connected to the inside and outside of the upper heat-conducting copper tube. A plurality of air inlets are provided, and the plurality of air inlets are distributed at equal angles along the axis of the upper heat-conducting copper tube.

[0020] The heat dissipation air outlet duct is fixedly arranged at the lower end of the lower heat-conducting copper tube. The heat dissipation air outlet duct has an L-shaped duct structure. The upper end of the heat dissipation air outlet duct is connected to the interior of the lower heat-conducting copper tube, and the lower end of the heat dissipation air outlet duct faces the upper surface of the aluminum alloy base. There are multiple heat dissipation air outlet ducts, and the multiple heat dissipation air outlet ducts are distributed at equal angles along the axis of the upper heat-conducting copper tube.

[0021] As a further optimization solution of the present invention, a heat dissipation mechanism bracket is fixedly provided on the inner wall of the lower heat-conducting copper tube, and the heat dissipation mechanism is fixedly installed on the heat dissipation mechanism bracket.

[0022] As a further optimization scheme of the present invention, a suction cup is fixedly provided on the outer ring of the aluminum alloy base, the upper end of the suction cup extends out of the upper surface of the aluminum alloy base, and a pressure stabilizing area is formed between the part of the suction cup extending out of the upper surface of the aluminum alloy base and the aluminum alloy base.

[0023] The beneficial effects of the present invention are:

[0024] 1. The present invention conducts temperature to the VC heat sink and the upper and lower heat-conducting copper tubes through semiconductor refrigeration sheets, thereby controlling the temperature of the air intake around and at the bottom of the projector, keeping the air intake temperature at a low temperature before entering the projector. The internal temperature of the projector is reduced, solving many problems of excessively high projector temperatures, thereby increasing the service life of the projector. Due to the internal PWM fan heat dissipation logic of the projector, the fan speed will decrease as the temperature drops, thereby reducing the noise of the entire projector, solving the problem of high projector noise, and increasing the user experience for a better audition.

[0025] 2. In the present invention, the upper heat-conducting copper tube and the lower heat-conducting copper tube can be extended and retracted by rotating the height adjustment knob to adjust the upper and lower heights of the projection bracket, which is practical and convenient.

[0026] 3. In the present invention, after the heat dissipation housing is fixed on the VC heat spreader by the magnetic plate, the threaded sleeve is rotated to adjust its position, so that the rubber plate is pressed against the side of the projector, which can also fix the projector.

[0027] 4. In the present invention, the heat dissipation mechanism is activated, and the heat dissipation mechanism absorbs the heat dissipated from the bottom of the aluminum alloy base from the air inlet. The heat passes through the upper heat-conducting copper tube, the lower heat-conducting copper tube and the heat dissipation outlet duct in sequence and is blown vertically to the upper surface of the aluminum alloy base. On the one hand, the heat dissipation effect is enhanced, and on the other hand, the stability of the aluminum alloy base when it is fixed can be increased by changing the heat discharge direction.

[0028] 5. In the present invention, a pressure-stabilizing area is formed between the portion of the suction cup extending from the upper surface of the aluminum alloy base and the aluminum alloy base. When the heat discharged from the heat dissipation air outlet duct blows onto the upper surface of the aluminum alloy base, it will eventually push the upper outer circle of the suction cup, causing the upper surface of the aluminum alloy base to be pushed downward or outward around the periphery, thereby increasing the stability of the aluminum alloy base and avoiding the problem of instability caused by vibration of the entire bracket due to the setting of the heat dissipation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic structural diagram of a heat dissipation projector bracket according to the present invention from one viewing angle;

[0030] Figure 2 This is a schematic diagram of the disassembled structure of the heat dissipation projector bracket of the present invention;

[0031] Figure 3 This is a schematic structural diagram of the heat dissipation projector bracket of the present invention from another perspective;

[0032] Figure 4 is a cross-sectional view of a heat dissipation projector bracket of the present invention;

[0033] Figure 5 Schematic diagram of the structure of the first aluminum alloy heat dissipation module and the second aluminum alloy heat dissipation module of the present invention;

[0034] Figure 6 The present invention Figure 4 A schematic diagram of the structure at center A;

[0035] Figure 7 This is a heat simulation diagram of the heat dissipation of the heat dissipation projector bracket of the present invention;

[0036] Figure 8 2 is a schematic diagram of the heat dissipation projector bracket structure in Example 2 of the present invention;

[0037] Figure 9 This is a schematic structural diagram of the aluminum alloy base in Example 2 of the present invention;

[0038] Figure 10 This is a heat simulation diagram of the heat dissipation of the heat dissipation projector bracket in Example 2 of the present invention.

[0039] In the figure: a first aluminum alloy heat dissipation module 1, a second aluminum alloy heat dissipation module 2, a VC heat sink 3, a plastic tray 4, an upper thermal conductive copper tube 5, a height adjustment button 6, a lower thermal conductive copper tube 7, an aluminum alloy base 8, a semiconductor refrigeration plate 9, a mainboard 10, a projector 11, a conical groove 12, an internal thread 13, a gap 14, an arc-shaped elastic plate 15, a fan blade 16, a motor 17, an air inlet and outlet groove 18, a magnetic plate 19, a threaded rod 20, a threaded sleeve 21, a pressure plate 22, a rubber plate 23, a heat dissipation housing 24, an air inlet 25, a suction cup 26, a heat dissipation and air outlet duct 27, a heat dissipation mechanism 28, a heat dissipation mechanism bracket 29, and a voltage stabilizing area 30. DETAILED DESCRIPTION

[0040] The present application is described in further detail below in conjunction with the accompanying drawings. It is necessary to point out that the following specific implementation methods are only used to further illustrate the present application and cannot be understood as limiting the scope of protection of the present application. Technicians in this field can make some non-essential improvements and adjustments to the present application based on the above application content.

[0041] In Example 1, Figures 1 to 7 As shown, a heat dissipation projector bracket includes a first aluminum alloy heat dissipation module 1, a second aluminum alloy heat dissipation module 2, a VC heat sink 3, a plastic tray 4, an upper heat-conducting copper tube 5, a height adjustment button 6, a lower heat-conducting copper tube 7, an aluminum alloy base 8, a semiconductor cooling plate 9 and a mainboard 10.

[0042] Among them, the upper thermal conductive copper tube 5, the height adjustment button 6, the lower thermal conductive copper tube 7 and the aluminum alloy base 8 constitute a "lower thermal conductive component", which are arranged from top to bottom in sequence. The upper end of the upper thermal conductive copper tube 5 is fixedly connected to the middle of the bottom surface of the plastic tray 4, the lower end of the upper thermal conductive copper tube 5 is connected to the height adjustment button 6, the height adjustment button 6 is connected to the upper end of the lower thermal conductive copper tube 7, and the lower end of the lower thermal conductive copper tube 7 is fixedly connected to the upper surface of the aluminum alloy base 8.

[0043] Among them, the plastic tray 4 is equipped with a main board 10 and a semiconductor cooling plate 9. The main board 10 is used to control the semiconductor cooling plate 9. The working principle of the semiconductor cooling plate 9 is mainly based on the Peltier effect. When direct current passes through a galvanic couple composed of two different semiconductor materials (N-type and P-type) connected in series, heat absorption and heat release phenomena will occur at both ends of the galvanic couple, thereby achieving the purpose of cooling. The semiconductor cooling plate 9 is usually composed of N-type semiconductor material and P-type semiconductor material, which are connected in series in the circuit. When the direct current is turned on, when the current flows from the N-type element to the joint of the P-type element, the joint will absorb heat and form a cold end; on the contrary, when the current flows from the P-type element to the joint of the N-type element, it will release heat and form a hot end. When the current passes through the semiconductor material, energy transfer will occur, causing heat to transfer from one end to the other end, thereby generating a temperature difference and forming a cold and hot end. The inside of the cooling plate is composed of hundreds of pairs of thermoelectric piles connected by electric couples to enhance the cooling (or heating) effect. The magnitude of heat absorption and heat release is determined by the magnitude of the current and the number of element pairs of semiconductor materials N and P; this is existing technology and will not be described in detail here.

[0044] A VC vapor chamber 3 is also installed above the plastic tray 4 , and the VC vapor chamber 3 is located above the main board 10 and the semiconductor cooling plate 9 .

[0045] The heat dissipation projection bracket is driven by a mainboard 10 to drive a semiconductor refrigeration plate 9 to perform upper cooling and lower heat conduction.

[0046] The upper cooling is to conduct cold air to the VC heat spreader 3 by the semiconductor cooling plate 9, so that the temperature of the VC heat spreader 3 is kept at a low temperature.

[0047] Among them, the first aluminum alloy heat dissipation module 1 and the second aluminum alloy heat dissipation module 2 are magnetically adsorbed on the VC heat sink 3, thereby introducing cold air into the first aluminum alloy heat dissipation module 1 and the second aluminum alloy heat dissipation module 2, so that the external air passes through the first aluminum alloy heat dissipation module 1 and the second aluminum alloy heat dissipation module 2, and replaces the cold air to enter the interior of the projector.

[0048] It should be noted that the projector 11 is mounted on the VC heat sink 3 , and the first aluminum alloy heat dissipation module 1 and the second aluminum alloy heat dissipation module 2 are distributed on both sides of the projector.

[0049] Furthermore, the first aluminum alloy heat dissipation module 1 and the second aluminum alloy heat dissipation module 2 can also be overlapped and magnetically attracted together, which can be adjusted according to actual needs.

[0050] As attached Figure 7 As shown, the semiconductor refrigeration plate 9 conducts heat from the upper heat-conducting copper tube 5 to the lower heat-conducting copper tube 7, and then to the aluminum alloy base 8 for heat dissipation.

[0051] Among them, the first aluminum alloy heat dissipation module 1 and the second aluminum alloy heat dissipation module 2 both include a heat dissipation shell 24, and air inlet and outlet grooves 18 are provided on both sides of the heat dissipation shell 24. A magnetic plate 19 is fixedly provided on the bottom surface of the heat dissipation shell 24, and the magnetic plate 19 is adsorbed and fixed on the upper surface of the VC heat spreader 3. A motor 17 is fixedly installed in the heat dissipation shell 24 through a bracket, and a fan blade 16 is fixed on the rotating shaft of the motor 17. The motor 17 and the fan blade 16 are fans with PWM function. When the projector 11 is located between a pair of heat dissipation shells 24, the fan blade 16 rotates to blow air toward the side of the projector 11.

[0052] Furthermore, a threaded rod 20 is fixedly provided on the side of the heat dissipation shell 24 close to the projector 11, and a threaded sleeve 21 is connected to the threaded rod 20 through threaded cooperation. A pressure plate 22 is fixedly provided at the end of the threaded sleeve 21, and a rubber plate 23 is fixedly provided on the side of the pressure plate 22 away from the threaded sleeve 21. There are multiple threaded rods 20. When the heat dissipation shell 24 is fixed on the VC heat spreader 3 by the magnetic plate 19, the threaded sleeve 21 is rotated to adjust the position of the threaded sleeve 21, so that the rubber plate 23 is pressed against the side of the projector 11, which can also fix the projector 11 at the same time.

[0053] The present invention conducts temperature to the VC heat spreader 3 and the upper and lower heat-conducting copper tubes 5 and 7 through the semiconductor refrigeration sheet 9, thereby controlling the temperature of the air intake around and at the bottom of the projector 11, so that the air intake temperature is kept at a low temperature when entering the projector 11. The internal temperature of the projector 11 is reduced, and due to the internal PWM fan heat dissipation logic of the projector, the fan speed will decrease as the temperature drops, thereby reducing the noise of the entire projector.

[0054] The present invention solves the problem of excessive temperature of many projectors 11, thereby increasing the service life of the projector 11; solves the problem of high noise of the projector 11, and increases the user experience of better audition.

[0055] The upper heat-conducting copper tube 5 and the lower heat-conducting copper tube 7 can be extended and retracted by rotating the height-adjusting knob 6 to adjust the upper and lower heights of the projection bracket, which is practical and convenient.

[0056] Specifically, the height adjustment button 6 is a cylindrical structure, and a conical groove 12 is provided on the inner wall of the upper end of the height adjustment button 6. The upper end opening of the conical groove 12 is large and the lower end opening is small. An internal thread 13 is provided on the inner wall of the lower end of the height adjustment button 6. An external thread structure is provided at the outer ring of the upper end of the lower heat-conducting copper tube 7. The external thread structure is connected with the internal thread 13. The diameter of the upper heat-conducting copper tube 5 is smaller than the diameter of the lower heat-conducting copper tube 7. A plurality of arc-shaped elastic plates 15 are further provided on the upper end of the lower heat-conducting copper tube 7. A gap 14 is provided between the plurality of arc-shaped elastic plates 15 to form a circular space between the plurality of arc-shaped elastic plates 15. Ring structure, the outer ring of the arc-shaped elastic plate 15 is also provided with an external thread structure. When the height adjustment knob 6 is rotated so that the internal thread 13 is located at the outer ring of the circular ring structure, the height adjustment knob 6 can press and fix the circular ring structure, thereby clamping and fixing the upper heat-conducting copper tube 5 in the lower heat-conducting copper tube 7. When the height adjustment knob 6 is rotated so that the arc-shaped elastic plate 15 is located in the conical groove 12, due to the elastic effect of the arc-shaped elastic plate 15 itself, the upper end of the arc-shaped elastic plate 15 opens outward, thereby achieving the purpose of loosening the upper heat-conducting copper tube 5. At this time, the height of the upper heat-conducting copper tube 5 relative to the lower heat-conducting copper tube 7 can be adjusted.

[0057] In the present invention, other conventional methods can also be used to adjust the height of the projector 11, which will not be described in detail here.

[0058] In Example 2, Figures 8 to 10 As shown, a heat dissipation projector bracket also includes a bottom power heat dissipation module, which includes an air inlet 25, a heat dissipation outlet duct 27 and a heat dissipation mechanism 28. The upper heat-conducting copper tube 5 and the lower heat-conducting copper tube 7 are both hollow round rod structures, and the upper heat-conducting copper tube 5 and the lower heat-conducting copper tube 7 are connected to each other. The air inlet 25 is arranged at the upper end of the upper heat-conducting copper tube 5, and the air inlet 25 connects the inside and outside of the upper heat-conducting copper tube 5. There are multiple air inlets 25, and the multiple air inlets 25 are distributed at equal angles along the axis of the upper heat-conducting copper tube 5; the heat dissipation outlet duct 27 is fixedly arranged at the lower end of the lower heat-conducting copper tube 7, and the heat dissipation outlet duct 27 is an L-shaped duct structure. The upper end of the heat dissipation outlet duct 27 is connected to the inside of the lower heat-conducting copper tube 7, and the heat dissipation outlet The lower end of the pipe 27 faces the upper surface of the aluminum alloy base 8, and a plurality of heat dissipation outlet pipes 27 are provided, and the plurality of heat dissipation outlet pipes 27 are distributed at equal angles along the axis of the upper heat-conducting copper tube 5; a heat dissipation mechanism bracket 29 is fixedly provided on the inner wall of the lower heat-conducting copper tube 7, and the heat dissipation mechanism 28 is fixedly installed on the heat dissipation mechanism bracket 29. When working, the heat dissipation mechanism 28 is started, and the heat dissipation mechanism 28 absorbs the heat dissipated from the bottom of the aluminum alloy base 8 from the air inlet 25. The heat passes through the upper heat-conducting copper tube 5, the lower heat-conducting copper tube 7 and the heat dissipation outlet pipes 27 in turn and is blown vertically to the upper surface of the aluminum alloy base 8. On the one hand, the heat dissipation effect is enhanced, and on the other hand, the stability of the aluminum alloy base 8 when it is fixed can be increased by changing the heat discharge direction.

[0059] Furthermore, in the present invention, a suction cup 26 is fixedly provided at the outer ring of the aluminum alloy base 8, and the bottom of the suction cup 26 is adsorbed and fixed to the fixed object. The upper end of the suction cup 26 extends out of the upper surface of the aluminum alloy base 8, and a voltage stabilizing area 30 is formed between the part of the suction cup 26 extending out of the upper surface of the aluminum alloy base 8 and the aluminum alloy base 8. When the heat discharged from the heat dissipation outlet duct 27 blows to the upper surface of the aluminum alloy base 8, it will eventually push the upper outer ring of the suction cup 26, so that the upper surface of the aluminum alloy base 8 is subjected to a downward or outward pushing force around, thereby increasing the stability of the aluminum alloy base 8 and avoiding the problem of instability caused by vibration of the entire bracket due to the setting of the heat dissipation module.

[0060] It should be noted that the heat dissipation mechanism 28 is a combination of a conventional motor and fan blades, which will not be described in detail here.

[0061] The above-described embodiments merely illustrate several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, and all such variations and improvements fall within the scope of protection of the present invention.

Claims

1. A heat dissipation projector bracket, characterized in that: It comprises a first aluminum alloy heat dissipation module (1), a second aluminum alloy heat dissipation module (2), a VC heat sink (3), a plastic tray (4), an upper heat-conducting copper tube (5), a height adjustment button (6), a lower heat-conducting copper tube (7), an aluminum alloy base (8), a semiconductor cooling plate (9) and a mainboard (10); The upper heat-conducting copper tube (5), the height adjustment button (6), the lower heat-conducting copper tube (7) and the aluminum alloy base (8) form a "lower heat-conducting assembly". The upper heat-conducting copper tube (5), the height adjustment button (6), the lower heat-conducting copper tube (7) and the aluminum alloy base (8) are arranged in sequence from top to bottom. The upper end of the upper heat-conducting copper tube (5) is fixedly connected to the middle of the bottom surface of the plastic tray (4). The lower end of the upper heat-conducting copper tube (5) is connected to the height adjustment button (6). The height adjustment button (6) is connected to the upper end of the lower heat-conducting copper tube (7). The lower end of the lower heat-conducting copper tube (7) is fixedly connected to the upper surface of the aluminum alloy base (8). The plastic tray (4) is provided with a main board (10) and a semiconductor cooling plate (9), and a VC heat spreader (3) is also provided above the plastic tray (4). The VC heat spreader (3) is located above the main board (10) and the semiconductor cooling plate (9), and the first aluminum alloy heat dissipation module (1) and the second aluminum alloy heat dissipation module (2) are magnetically adsorbed on the VC heat spreader (3).

2. The heat dissipation projector bracket according to claim 1, characterized in that: The first aluminum alloy heat dissipation module (1) and the second aluminum alloy heat dissipation module (2) are distributed on both sides of the projector (11), and the projector (11) is mounted on the VC heat sink (3).

3. The heat dissipation projector bracket according to claim 2, characterized in that: The first aluminum alloy heat dissipation module (1) and the second aluminum alloy heat dissipation module (2) both comprise a heat dissipation housing (24), both sides of which are provided with air inlet and outlet slots (18), a motor (17) is fixedly mounted in the heat dissipation housing (24) via a bracket, a fan blade (16) is fixedly arranged on the rotating shaft of the motor (17), and the motor (17) and the fan blade (16) are fans with a PWM function.

4. The heat dissipation projector bracket according to claim 3, characterized in that: A magnetic plate (19) is fixedly provided on the bottom surface of the heat dissipation housing (24), and the magnetic plate (19) is adsorbed and fixed on the upper surface of the VC heat spreader (3).

5. The heat dissipation projector bracket according to claim 1, characterized in that: The height adjustment button (6) is a cylindrical structure. A conical groove (12) is provided on the inner wall of the upper end of the height adjustment button (6). The upper end opening of the conical groove (12) is large, and the lower end opening is small. An internal thread (13) is provided on the inner wall of the lower end of the height adjustment button (6). An external thread structure is provided at the outer ring of the upper end of the lower heat-conducting copper tube (7). The external thread structure is connected with the internal thread (13).

6. The heat dissipation projector bracket according to claim 5, characterized in that: The upper end of the lower heat-conducting copper tube (7) is further provided with a plurality of arc-shaped elastic plates (15), gaps (14) are provided between the plurality of arc-shaped elastic plates (15), a circular ring structure is formed between the plurality of arc-shaped elastic plates (15), and the outer ring of the arc-shaped elastic plate (15) is also provided with an external thread structure. The diameter of the upper heat-conducting copper tube (5) is smaller than the diameter of the lower heat-conducting copper tube (7).

7. The heat dissipation projector bracket according to claim 3, characterized in that: A threaded rod (20) is fixedly provided on a side of the heat dissipation housing (24) close to the projector (11); a threaded sleeve (21) is connected to the threaded rod (20) through threaded engagement; a pressure plate (22) is fixedly provided at the end of the threaded sleeve (21); the pressure plate (22) is pressed onto the side of the projector (11); a plurality of threaded rods (20) are provided; a rubber plate (23) is fixedly provided on a side of the pressure plate (22) away from the threaded sleeve (21).

8. The heat dissipation projector bracket according to claim 1, characterized in that: The invention also includes a bottom power heat dissipation module, which includes an air inlet (25), a heat dissipation outlet duct (27) and a heat dissipation mechanism (28). The upper heat-conducting copper tube (5) and the lower heat-conducting copper tube (7) are both hollow round rod structures, and the upper heat-conducting copper tube (5) and the lower heat-conducting copper tube (7) are connected to each other. The air inlet (25) is arranged at the upper end of the upper heat-conducting copper tube (5), and the air inlet (25) is connected to the inside and outside of the upper heat-conducting copper tube (5). There are multiple air inlets (25), and the multiple air inlets (25) are distributed at equal angles along the axis of the upper heat-conducting copper tube (5). The heat dissipation air outlet duct (27) is fixedly arranged at the lower end of the lower heat-conducting copper tube (7), and the heat dissipation air outlet duct (27) is an L-shaped duct structure. The upper end of the heat dissipation air outlet duct (27) is connected to the interior of the lower heat-conducting copper tube (7), and the lower end of the heat dissipation air outlet duct (27) faces the upper surface of the aluminum alloy base (8). There are multiple heat dissipation air outlet ducts (27), and the multiple heat dissipation air outlet ducts (27) are distributed at equal angles along the axis of the upper heat-conducting copper tube (5).

9. The heat dissipation projector bracket according to claim 8, characterized in that: A heat dissipation mechanism bracket (29) is fixedly provided on the inner wall of the lower heat-conducting copper tube (7), and the heat dissipation mechanism (28) is fixedly mounted on the heat dissipation mechanism bracket (29).

10. The heat dissipation projector bracket according to claim 8, characterized in that: A suction cup (26) is fixedly provided at the outer ring of the aluminum alloy base (8), the upper end of the suction cup (26) extends out of the upper surface of the aluminum alloy base (8), and a voltage stabilizing area (30) is formed between the portion of the suction cup (26) extending out of the upper surface of the aluminum alloy base (8) and the aluminum alloy base (8).

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