Liquid cooling heat dissipation system convenient for maintaining memory

Abstract

The invention relates to a liquid cooling heat dissipation system facilitating memory maintenance, and belongs to the technical field of memory heat dissipation, the liquid cooling heat dissipation system comprises a base, an upper cover, an elastic piece, a water inlet and outlet pipe, a memory, a PCB card, fasteners and a memory connector, the elastic piece is fixedly installed in the base, the upper cover is fixedly connected with the base, the water inlet and outlet pipe is fixedly communicated with the upper cover, the fasteners are uniformly and fixedly installed on the base, and the memory connector is fixedly connected with the upper cover. The PCB card is rotationally connected with a memory connector, the memory can be clamped in the base through the memory connector, the memory is provided with a memory chip, memory clamping grooves are formed in the two sides of the memory, the base is provided with a base liquid flow channel, and the two ends of the base liquid flow channel are communicated with the water inlet and outlet pipe. According to the internal memory radiator, fluid flows in a main channel in the internal memory radiator, heat is brought out of equipment, meanwhile, a movable space structure of the elastic piece and the internal memory connector is designed, internal memories can be replaced at any time, maintenance does not need to be carried out too much time, the internal memories can be used at any time when inserted, and the radiator can be used by a plurality of internal memories at the same time.

Description

Technical Field

[0001] The present invention relates to the technical field of memory heat dissipation, and in particular to a memory liquid cooling system that is convenient for maintenance. Background Art

[0002] The server consists of components such as processors, hard disks, memory, and system buses, which are similar to general computer architectures. However, due to the need to provide highly reliable services, higher requirements are placed on processing power, stability, reliability, security, scalability, and manageability. This also causes the heat generated by the server during operation to be higher than that generated by ordinary computers.

[0003] As the computing power of servers becomes stronger and stronger, the bandwidth requirements for memory are also getting higher and higher. As a result, the power consumption of the whole machine increases rapidly, and air cooling is difficult to meet. Liquid cooling is a necessary option, and liquid cooling of memory has become one of the key technologies. There are currently two liquid cooling solutions for memory on the market. The first solution is to use a single memory for heat dissipation. A small water tank is installed on the top of the memory radiator. The heat generated by the memory is transferred to the small water tank, and then the heat is taken away by the external air flow. There is no heat exchange with the outside. The second solution is installed on the memory to exchange fluid with the outside to take away the heat, but the radiator needs to be disassembled for maintenance, and the maintainability is very poor. Summary of the invention

[0004] The present invention provides a liquid cooling system for memory that is easy to maintain, which solves the problems raised in the above-mentioned background technology. The fluid is allowed to flow in the main channel of the memory radiator to bring the heat out of the device. At the same time, the movable space structure of the spring and the memory connector is designed, so that the memory can be replaced at any time without spending too much time on maintenance. It can be plugged in and used at any time, and multiple memories can use the radiator at the same time.

[0005] The solution of the present invention to solve the above technical problems is as follows: a liquid cooling heat dissipation system for memory that is convenient to maintain, comprising a base, an upper cover, a spring, an inlet and outlet water pipes, a memory, a PCB board, a fastener, and a memory connector, wherein the spring is fixedly installed in the base, the upper cover is fixedly connected to the base, the inlet and outlet water pipes are fixedly connected to the upper cover, the base is evenly fixed with fasteners, the PCB board is rotatably connected with a memory connector, the memory can be connected to the base through the memory connector, the memory is provided with a memory chip, memory card slots are provided on both sides of the memory, the base is provided with a base liquid flow channel, and both ends of the base liquid flow channel are connected with the inlet and outlet water pipes.

[0006] Based on the above technical solution, the present invention can also be improved as follows.

[0007] Furthermore, the memory connector is provided with a card block adapted to the memory card slot, and the card block of the memory connector can be positioned by being inserted into the memory card slot of the memory.

[0008] Furthermore, an opening and closing cavity is provided on the inner wall of the base corresponding to the memory connector, so that the memory connector can stably rotate in the opening and closing cavity.

[0009] Furthermore, when the memory is installed in the base, the memory chip of the memory is in close contact with the spring sheet, so that the spring sheet and the memory chip can be in contact with each other to exchange heat and cool down through the coolant in the liquid flow channel of the base.

[0010] Furthermore, the fastener is connected to the PCB board through bolts.

[0011] Furthermore, a rectangular through hole is opened on the top of the upper cover, and the length of the rectangular through hole is greater than the memory.

[0012] Furthermore, the upper cover seals the liquid flow channel of the base, and the interior can be cleaned by removing the upper cover.

[0013] The beneficial effects of the present invention are as follows: the present invention provides a memory liquid cooling and heat dissipation system that is convenient for maintenance, and has the following advantages:

[0014] 1. The fasteners of the base can be connected to the PCB board through bolts. The memory is inserted at the PCB board. The memory can be placed in the base for use. When the memory is inserted, the memory connector can be inserted into the memory card slot of the memory to position it. When the memory is placed in the base, the spring is in close contact with the memory chip of the memory. The server liquid cooling device can input the coolant from one side of the inlet and outlet pipe into the base liquid flow channel of the base and then output it through another inlet and outlet pipe, so that the server coolant can flow in the base liquid flow channel of the base, and the spring can accurately liquid-cool the memory chip of the memory;

[0015] 2. Such a memory liquid cooling system allows the fluid to flow in the main channel of the memory radiator to bring the heat out of the device. At the same time, the movable space structure of the shrapnel and the memory connector is designed so that the memory can be replaced at any time without spending too much time on maintenance. It can be plugged in and used at any time, and multiple memories can use the radiator at the same time.

[0016] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. The specific implementation of the present invention is given in detail by the following embodiments and their accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0018] Figure 1 A three-dimensional rendering of a memory liquid cooling and heat dissipation system for convenient maintenance provided by an embodiment of the present invention;

[0019] Figure 2 A top view of a memory liquid cooling and heat dissipation system for convenient maintenance provided by an embodiment of the present invention;

[0020] Figure 3 A schematic diagram of the structure of a base in a memory liquid cooling and heat dissipation system for convenient maintenance provided by an embodiment of the present invention;

[0021] Figure 4 A schematic diagram of a structure of a memory in a memory liquid cooling and heat dissipation system for convenient maintenance provided by an embodiment of the present invention;

[0022] Figure 5 A schematic diagram of a structure for facilitating maintenance of a memory connector closed state in a memory liquid cooling and heat dissipation system provided by an embodiment of the present invention;

[0023] Figure 6 A schematic diagram of a structure for facilitating maintenance of an open state of a memory connector in a memory liquid cooling and heat dissipation system provided by an embodiment of the present invention;

[0024] Figure 7 A schematic diagram of the structure inside a base in a memory liquid cooling and heat dissipation system for convenient maintenance provided by an embodiment of the present invention;

[0025] Figure 8 A schematic diagram of a structure for opening and closing a cavity in a memory liquid cooling and heat dissipation system for convenient maintenance provided by an embodiment of the present invention;

[0026] Fig. 9 A schematic diagram of the structure of a memory card slot in a memory liquid cooling and heat dissipation system for convenient maintenance provided by an embodiment of the present invention.

[0027] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0028] 1. Base; 2. Upper cover; 3. Shrapnel; 4. Water inlet and outlet pipes; 5. Memory; 6. PCB board; 7. Fasteners; 8. Memory connector; 9. Memory chip; 10. Memory card slot; 11. Opening and closing cavity; 12. Base liquid flow channel. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1-9The principles and features of the present invention are described, and the examples are only used to explain the present invention and are not used to limit the scope of the present invention. In the following paragraphs, the present invention is described in more detail by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become clearer according to the following description and claims. It should be noted that the drawings are all in a very simplified form and are not in precise proportions, and are only used to facilitate and clearly assist in explaining the purpose of the embodiments of the present invention.

[0030] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a component centered. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may also be a component centered. When a component is considered to be "set on" another component, it may be directly set on the other component or there may also be a component centered. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0032] like Figure 1-9 As shown, the present invention provides a memory liquid cooling and heat dissipation system which is convenient for maintenance, comprising a base 1, an upper cover 2, a spring 3, an inlet and outlet pipe 4, a memory 5, a PCB board 6, a fastener 7, and a memory connector 8. The spring 3 is fixedly installed in the base 1, the upper cover 2 is fixedly connected to the base 1, the inlet and outlet pipes 4 are fixedly connected to the upper cover 2, the base 1 is evenly fixedly installed with fasteners 7, the PCB board 6 is rotatably connected with the memory connector 8, the memory 5 can be connected to the base 1 through the memory connector 8, the memory 5 is provided with a memory chip 9, memory card slots 10 are provided on both sides of the memory 5, the base 1 is provided with a base liquid flow channel 12, and both ends of the base liquid flow channel 12 are connected with the inlet and outlet pipes 4.

[0033] Preferably, the memory connector 8 is provided with a card block adapted to the memory card slot 10 , and the card block of the memory connector 8 can be inserted into the memory card slot 10 of the memory 5 to position it.

[0034] Preferably, an opening and closing cavity 11 is provided on the inner wall of the base 1 corresponding to the memory connector 8 , so that the memory connector 8 can stably rotate in the opening and closing cavity 11 .

[0035] Preferably, when the memory 5 is installed in the base 1 , the memory chip 9 of the memory 5 is in close contact with the spring 3 , so that the spring 3 and the memory chip 9 can be in contact with each other for heat exchange and cooling through the coolant in the base liquid channel 12 .

[0036] Preferably, the fastener 7 is connected to the PCB board 6 via bolts.

[0037] Preferably, a rectangular through hole is opened on the top of the upper cover 2 , and the length of the rectangular through hole is greater than the memory 5 .

[0038] Preferably, the upper cover 2 covers the base liquid flow channel 12, and the interior can be cleaned by removing the upper cover 2.

[0039] The specific working principle and use method of the present invention are as follows: the fastener 7 of the base 1 can be connected to the PCB board 6 by bolts, the memory 5 is inserted at the PCB board 6, the memory 5 can be placed in the base 1 for use, when the memory 5 is inserted, the memory connector 8 can be inserted into the memory card slot 10 of the memory 5 to position it, when the memory 5 is placed in the base 1, the spring 3 is in close contact with the memory chip 9 of the memory 5, the server liquid cooling equipment can input the coolant from one side of the water inlet and outlet pipe 4 into the base liquid flow channel 12 of the base 1 and then output it through another water inlet and outlet pipe 4, so that the server coolant can circulate in the base liquid flow channel 12 of the base 1, and the spring 3 can accurately liquid-cool the memory chip 9 of the memory 5.

[0040] It should be noted that, in this document, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Contents not described in detail in this specification belong to the prior art known to professionals in the field.

[0041] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any ordinary technician in the industry can smoothly implement the present invention as shown in the drawings and described above. However, any equivalent changes, modifications and evolutions made by technicians familiar with the profession without departing from the scope of the technical solution of the present invention using the technical content disclosed above are all equivalent embodiments of the present invention. At the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the present invention are still within the protection scope of the technical solution of the present invention.

Claims

1. A memory liquid cooling system that is convenient for maintenance, comprising a base (1), an upper cover (2), a spring (3), an inlet and outlet water pipe (4), a memory (5), a PCB board (6), a fastener (7), and a memory connector (8), characterized in that: The spring sheet (3) is fixedly installed in the base (1), the upper cover (2) is fixedly connected to the base (1), the water inlet and outlet pipes (4) are fixedly connected to the upper cover (2), the base (1) is evenly fixedly installed with fasteners (7), the PCB board (6) is rotatably connected with a memory connector (8), the memory (5) can be connected to the base (1) through the memory connector (8), the memory (5) is provided with a memory chip (9), and memory card slots (10) are provided on both sides of the memory (5), and the base (1) is provided with a base liquid flow channel (12), and both ends of the base liquid flow channel (12) are connected with the water inlet and outlet pipes (4).

2. According to claim 1, a memory liquid cooling system that is easy to maintain, characterized in that: The memory connector (8) is provided with a card block adapted to the memory card slot (10).

3. According to claim 1, a memory liquid cooling system that is easy to maintain, characterized in that: An opening and closing cavity (11) is provided on the inner wall of the base (1) corresponding to the memory connector (8).

4. According to claim 1, a memory liquid cooling and heat dissipation system that is convenient for maintenance, characterized in that: When the memory (5) is installed in the base (1), the memory chip (9) of the memory (5) is in close contact with the spring (3).

5. According to claim 1, a memory liquid cooling and heat dissipation system that is convenient for maintenance, characterized in that: The fastener (7) is connected to the PCB board (6) via bolts.

6. According to claim 1, a memory liquid cooling system that is easy to maintain, characterized in that: A rectangular through hole is provided on the top of the upper cover (2), and the length of the rectangular through hole is greater than the memory (5).

7. The memory liquid cooling system for easy maintenance according to claim 1, characterized in that: The upper cover (2) seals the base liquid flow channel (12).

Images