Packaging device for wiegand filaments

Abstract

The invention relates to the technical field of Wiegand fiber packaging, in particular to a Wiegand fiber packaging device which comprises two substrates and two shells, the two shells are movably clamped together, the two substrates are arranged in the two shells, clamping grooves are formed in the inner sides of the shells, and the clamping grooves are arranged in the clamping grooves. Wafer layers are movably installed on the opposite faces of the two substrates through clamping mechanisms, the clamping mechanisms are arranged in the substrates, and insulating partition plates are arranged at the ends, away from the substrates, of the wafer layers; the insulating partition plates, the wafer layer and the substrate are installed together through the clamping mechanism, through the arrangement of the two sets of connecting rods, the two sets of insulating partition plates can automatically clamp Wiegand wires, the substrate is installed in the shells, the two sets of shells are pressed and spliced together, and the wafer layer and the insulating partition plates are bonded together. And meanwhile, one end of the liquid pushing clamping mechanism is clamped into the clamping groove, the shell is limited and fixed, and operation is convenient and efficient.

Description

Technical Field

[0001] The invention relates to the technical field of packaging, in particular to a packaging device for Wiegand wires. Background Art

[0002] Wiegand wire is a magnetic alloy wire based on the Wiegand effect. After adding an induction coil to the Wiegand wire and placing it in a magnetic field, when the polarity of the external magnetic field changes and the magnetic induction intensity reaches the excitation threshold, an electric pulse signal can be generated in the induction coil. Based on this characteristic, people have created a Wiegand sensor that does not require power and works through a dual-pole excitation method. When the magnetic field polarity changes one circle, the sensor outputs a pair of positive and negative electric pulse signals, and the signal amplitude is independent of the speed of the magnetic field change, and can work at close to zero speed.

[0003] For example, the Chinese patent with announcement number CN112599516A discloses a packaging device for Wiegand wire, including a substrate, a wafer layer, an insulating partition layer, and an insulating shell for packaging. An induction coil is etched on the wafer layer, and the induction coil is connected to the output pin through a connecting wire. The number of wafer layers is one or two. When the number of wafer layers is one, the wafer layer is arranged between the substrate and the insulating partition layer or on the side of the insulating partition layer away from the substrate. When the number of wafer layers is two, the wafer layer includes an upper wafer layer and a lower wafer layer, and the lower wafer layer is arranged between the substrate and the insulating partition layer.

[0004] However, the above scheme has the following shortcomings: in the above patent, the Wiegand wire is directly wrapped in the insulating material by bonding the upper and lower layers of the insulating partition, which solves the trouble caused by threading the wire. At the same time, the induction coil is etched on the wafer, which solves the problem of coil resistance caused by the traditional winding method. However, in the process of packaging the Wiegand wire, the operator needs to brush glue on the upper and lower insulating partitions, and then continuously adjust the positions of the two sets of insulating partitions to align them before the Wiegand wire can be fixed. The operation is more troublesome. For this reason, we have introduced a new packaging device for Wiegand wire. Summary of the invention

[0005] The object of the present invention is to provide a packaging device for Wiegand wires to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A packaging device for Wiegand wires, comprising two groups of substrates and two groups of shells, the two groups of shells being movably clamped together, the two groups of substrates being arranged in the two groups of shells, the inner sides of the shells being provided with clamping grooves, the opposite surfaces of the two groups of substrates being movably mounted with wafer layers through a clamping mechanism, the clamping mechanism being arranged in the substrates, the wafer layers being provided with insulating partitions at one end away from the substrates, the insulating partitions being clamped by the clamping mechanism, the opposite surfaces of the two groups of insulating partitions being provided with mounting grooves, a Wiegand wire being arranged between the two groups of mounting grooves, the opposite surfaces of the wafer layers and the insulating partitions being provided with a plurality of groups of grooves, the grooves being connected with the two groups of liquid guide cavities, the plurality of groups of liquid guide cavities being provided in the wafer layers, the ends of the liquid guide cavities being away from the grooves being connected with liquid storage cavities, the liquid storage cavities being provided in the substrates;

[0008] A liquid pushing clamping mechanism is provided in the liquid storage cavity, and two groups of the liquid pushing clamping mechanisms are connected to the trigger mechanism. The trigger mechanism is arranged in the substrate. After the two groups of shells are assembled together, the shells press the trigger mechanism, so that the liquid pushing clamping mechanism is disconnected from the trigger mechanism, and the glue is pushed into the groove through the liquid pushing clamping mechanism to fix the wafer layer and the insulating partition together. At the same time, one end of the liquid pushing clamping mechanism is clamped in the clamping groove to limit the two groups of shells.

[0009] Preferably, the clamping mechanism includes two groups of clamping plates, and the clamping plate is fixedly connected to a T-shaped slider at one end close to the substrate, and the T-shaped slider is slidably connected to a T-shaped slide groove, and the T-shaped slide groove is opened in the substrate. A first spring is fixedly connected in the T-shaped slide groove, and the other end of the first spring is fixedly connected to the T-shaped slider, and the opposite surfaces of the two groups of clamping plates are fixedly connected to limiting rods, and limiting grooves are opened on both sides of the wafer layer, and the limiting rods are clamped in the limiting grooves.

[0010] Preferably, the liquid pushing clamping mechanism includes a liquid pushing plate, which is slidably connected to the liquid storage cavity, and the back surfaces of the two groups of liquid pushing plates are fixedly connected with baffles, and a yield groove is provided in the upper end of the baffle, and the baffle is slidably connected to the slide groove at one end away from the liquid pushing plate, and the slide groove is opened in the base plate, one end of the slide groove is connected to the liquid storage cavity, and the other end is connected to the external environment, and a second spring is fixedly connected to the liquid storage cavity, and the other end of the second spring is fixedly connected to the liquid pushing plate, and the opposite surfaces of the two groups of liquid pushing plates are fixedly connected with hanging rods, and the hanging rods extend into the connecting cavity away from the end of the liquid pushing plate, and the connecting cavity is opened in the base plate.

[0011] Preferably, the trigger mechanism includes a T-block, which is slidably connected in the connecting cavity, a third spring is fixedly connected to the lower end of the T-block, the other end of the third spring is fixedly connected to the connecting cavity, two groups of hanging grooves are opened on the outer side of the T-block, and one end of the hanging rod away from the liquid pushing plate is clamped in the hanging groove.

[0012] Preferably, the two groups of opposite surfaces of the substrates are fixedly connected with connecting rods, the two groups of opposite ends of the connecting rods are fixedly connected with insertion rods, and slots are provided, and the insertion rods are inserted into the slots, and the two groups of opposite surfaces of the outer shells are fixedly connected with sealing rings, and sealing grooves are provided, and the sealing rings are inserted into the sealing grooves.

[0013] Preferably, the back surfaces of the two groups of connecting rods are fixedly connected with sliders, and the sliders are slidably connected in positioning grooves, and the positioning grooves are provided on the inner side of the shell.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention installs the insulating partition and the wafer layer together with the substrate through a clamping mechanism, and through the setting of two groups of connecting rods, the two groups of insulating partitions can automatically clamp the Wiegand wires, install the substrate into the outer shell, and press the two groups of outer shells together, at this time the trigger mechanism is triggered, so that the liquid pushing clamping mechanism is separated from the trigger mechanism, and the glue in the liquid storage chamber is pushed into the groove between the wafer layer and the insulating partition through the liquid pushing clamping mechanism, so that the wafer layer and the insulating partition are bonded together, and at the same time, one end of the liquid pushing clamping mechanism will be clamped into the clamping groove to limit and fix the outer shell, and the operation is convenient and efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the cross-sectional structure of the present invention;

[0016] Figure 2 It is a cross-sectional structural schematic diagram of the connection state of two groups of insulating partitions of the present invention;

[0017] Figure 3 This is a schematic cross-sectional view of the shell of the present invention in a separated state;

[0018] Figure 4 It is a schematic diagram of the cross-sectional structure of the connecting rod of the present invention;

[0019] Figure 5 This is a schematic diagram of the cross-sectional structure of the T-block of the present invention;

[0020] Figure 6 It is a three-dimensional structural schematic diagram of the connection relationship between the wafer layer and the clamping plate of the present invention;

[0021] Figure 7 It is a schematic diagram of the front view structure of the Wiegand wire of the present invention in a clamped state.

[0022] In the figure: 1. substrate; 2. slide groove; 3. slider; 4. hanging groove; 5. connecting rod; 6. limiting rod; 7. third spring; 8. liquid storage chamber; 9. wafer layer; 10. insulating partition; 11. clamping plate; 12. groove; 13. liquid pushing plate; 14. T-block; 15. baffle; 16. sealing ring; 17. sealing groove; 18. shell; 19. snap-in groove; 20. positioning groove; 21. liquid guiding chamber; 22. connecting chamber; 23. Wiegand wire; 24. hanging rod; 25. second spring; 26. giving way groove; 27. plug-in rod; 28. mounting groove; 29. ​​first spring; 30. T-slide groove; 31. T-sliding block; 32. limiting groove; 33. slot. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] See also Figure 1-7 , the present invention provides a technical solution:

[0025] Embodiment 1:

[0026] A packaging device for Wiegand wires, comprising two groups of substrates 1 and two groups of shells 18, the two groups of shells 18 are movably clamped together, the opposite surfaces of the two groups of shells 18 are fixedly connected with sealing rings 16, and sealing grooves 17 are provided, the sealing rings 16 are inserted into the sealing grooves 17, when the two groups of shells 18 are installed together, the sealing rings 16 will be clamped into the sealing grooves 17, and the sealing rings 16 are clamped into the sealing grooves 17, so that after the two groups of shells 18 are installed together, the interior is in a sealed state, the two groups of substrates 1 are arranged in the two groups of shells 18, the inner side of the shells 18 is provided with clamping grooves 19, the opposite surfaces of the two groups of substrates 1 are movably mounted with wafer layers 9 through a clamping mechanism, a special coil is etched on one end of the wafer layer 9 close to an insulating partition 10, and the coil etched on the wafer layer 9 can be connected to an output pin through a connecting line;

[0027] A clamping mechanism is arranged in the substrate 1, an insulating partition 10 is arranged at one end of the wafer layer 9 away from the substrate 1, and the insulating partition 10 is clamped by the clamping mechanism, mounting grooves 28 are arranged in the opposite surfaces of the two groups of insulating partitions 10, and a Wiegand wire 23 is arranged between the two groups of mounting grooves 28. Through the arrangement of the two groups of mounting grooves 28, the Wiegand wire 23 is clamped between the two groups of insulating partitions 10, a plurality of groups of grooves 12 are arranged in the opposite surfaces of the wafer layer 9 and the insulating partition 10, the grooves 12 are connected with the two groups of liquid guide cavities 21, and the plurality of groups of liquid guide cavities 21 are arranged in the wafer layer 9, and the end of the liquid guide cavity 21 away from the groove 12 is connected with the liquid storage cavity 8, and the liquid storage cavity 8 is arranged in the substrate 1, and the arrangement of the liquid guide cavity 21 is used to guide the glue into the groove 12;

[0028] A liquid pushing clamping mechanism is provided in the liquid storage cavity 8. Both sets of liquid pushing clamping mechanisms are connected to the trigger mechanism. The trigger mechanism is arranged in the substrate 1. After the two sets of outer shells 18 are assembled together, the outer shell 18 presses the trigger mechanism so that the liquid pushing clamping mechanism is disconnected from the trigger mechanism. The glue is pushed into the groove 12 through the liquid pushing clamping mechanism, so that the wafer layer 9 and the insulating partition 10 are fixed together. At the same time, one end of the liquid pushing clamping mechanism is clamped in the clamping groove 19 to limit the two sets of outer shells 18.

[0029] Embodiment 2:

[0030] On the basis of Example 1, in order to enable the wafer layer 9 to be connected to the insulating partition 10 during the installation process, the liquid pushing clamping mechanism includes a liquid pushing plate 13, which is slidably connected to the liquid storage chamber 8. The back surfaces of the two groups of liquid pushing plates 13 are fixedly connected with baffles 15, and a clearance groove 26 is provided in the upper end of the baffle 15. Under normal conditions, the baffle 15 will block several groups of liquid guide chambers 21. When the clearance groove 26 moves to the position of the liquid guide chamber 21, the glue will enter the liquid guide chamber 21. The end of the baffle 15 away from the liquid pushing plate 13 is slidably connected to the slide groove 2. The slide groove 2 is provided in the substrate 1. One end of the slide groove 2 is connected to the liquid storage chamber 8, and the other end is connected to the external environment. The baffle 15 is guided by the setting of the slide groove 2. A second spring 25 is fixedly connected to the liquid storage chamber 8, and the other end of the second spring 25 is fixedly connected to the liquid pushing plate 13.

[0031] The opposite surfaces of the two groups of liquid pushing plates 13 are fixedly connected with hanging rods 24, and the end of the hanging rod 24 away from the liquid pushing plate 13 extends into the connecting cavity 22, and the connecting cavity 22 is opened in the base plate 1. When the inner sides of the two groups of shells 18 are in contact with the T-block 14, the two groups of shells 18 are pressed inward to drive the T-block 14 in contact with them to move inward. When the T-block 14 moves inward, the hanging rod 24 will be separated from the clamping state with the hanging groove 4. At this time, under the elastic force of the second spring 25, the liquid pushing plate 13 moves along the liquid storage cavity 8. When the liquid pushing plate 13 moves, it drives the baffle 15 to move, so that the clearance groove 26 moves to the position of the liquid guide cavity 21;

[0032] The clamping plate mechanism includes two groups of clamping plates 11, one end of the clamping plate 11 close to the substrate 1 is fixedly connected with a T-shaped slider 31, the T-shaped slider 31 is slidably connected to the T-shaped slide groove 30, the T-shaped slide groove 30 is arranged in the substrate 1, a first spring 29 is fixedly connected in the T-shaped slide groove 30, the other end of the first spring 29 is fixedly connected to the T-shaped slider 31, the opposite surfaces of the two groups of clamping plates 11 are fixedly connected to the limiting rod 6, both sides of the wafer layer 9 are arranged with limiting grooves 32, the limiting rod 6 is clamped in the limiting grooves 32, and the two groups of clamping plates 11 are pushed outward to place the wafer layer 9 and the insulating partition 10 between the two groups of clamping plates 11. After the placement is completed, the push on the clamping plates 11 is released. At this time, under the elastic force of the first spring 29, the limiting rod 6 will be clamped into the limiting groove 32, and the two groups of clamping plates 11 will also clamp the insulating partition 10;

[0033] The trigger mechanism includes a T-shaped block 14, which is slidably connected to the connecting cavity 22. The lower end of the T-shaped block 14 is fixedly connected to the third spring 7, and the other end of the third spring 7 is fixedly connected to the connecting cavity 22. Two groups of hanging grooves 4 are opened on the outer side of the T-shaped block 14, and the end of the hanging rod 24 away from the liquid pushing plate 13 is clamped in the hanging groove 4. When the inner sides of the two groups of shells 18 are in contact with the T-shaped block 14, the two groups of shells 18 are pressed inward to drive the T-shaped block 14 in contact with them to move inward. When the T-shaped block 14 moves inward, the hanging rod 24 will be separated from the clamping state with the hanging groove 4. At this time, under the elastic force of the second spring 25, the liquid pushing plate 13 moves along the liquid storage cavity 8;

[0034] The two groups of base plates 1 are fixedly connected to the opposite surfaces with connecting rods 5, and the two groups of connecting rods 5 are fixedly connected to the opposite ends with plug rods 27, and slots 33 are provided, and the plug rods 27 are inserted into the slots 33, and the two groups of insulating partitions 10 are assembled together, and the Wiegand wire 23 is arranged between the two groups of mounting grooves 28. During the assembly process, it is ensured that the plug rods 27 connected to the connecting rods 5 can be inserted into the corresponding slots 33, and the two groups of shells 18 are fixedly connected to the opposite surfaces with sealing rings 16, and sealing grooves 17 are provided, and the sealing rings 16 are inserted into the sealing grooves 17. When the two groups of shells 18 are installed together, the sealing rings 16 will be snapped into the sealing grooves 17, and the sealing rings 16 are snapped into the sealing grooves 17, so that after the two groups of shells 18 are installed together, the interiors thereof are in a sealed state;

[0035] The back sides of the two groups of connecting rods 5 are fixedly connected with sliders 3, which slide into the positioning grooves 20. The positioning grooves 20 are opened on the inner side of the shell 18. The sliders 3 slide into the positioning grooves 20, so that the substrate 1 will not shake in the shell 18.

[0036] Working principle: when in use, push the two groups of clamping plates 11 outwards and place the wafer layer 9 and the insulating partition 10 between the two groups of clamping plates 11. After placement, release the push on the clamping plates 11. At this time, under the elastic force of the first spring 29, the limit rod 6 will be clamped into the limit groove 32, and the two groups of clamping plates 11 will also clamp the insulating partition 10. According to the above method, another group of substrates 1 are installed together with the wafer layer 9 and the insulating partition 10 through the clamping plates 11, and the two groups of insulating partitions 10 are assembled together. At the same time, the Wiegand wire 23 is set between the two groups of installation grooves 28. During the assembly process, ensure that the plug 27 connected to the connecting rod 5 can be plugged into the corresponding slot 33;

[0037] Install the substrate 1 into the housing 18. During the installation of the substrate 1, ensure that the slider 3 moves along the positioning groove 20. After the substrate 1 enters the housing 18, splice the two sets of housings 18 together so that the sealing ring 16 is inserted into the sealing groove 17. When the inner sides of the two sets of housings 18 are in contact with the T-block 14, press the two sets of housings 18 inward to drive the T-block 14 in contact with them to move inward. When the T-block 14 moves inward, the hanging rod 24 The state of being disconnected from the hanging groove 4 is released. At this time, under the elastic force of the second spring 25, the liquid pushing plate 13 moves along the liquid storage chamber 8. When the liquid pushing plate 13 moves, the baffle 15 is driven to move, so that the giving way groove 26 moves to the position of the liquid guiding chamber 21. At this time, as the liquid pushing plate 13 continues to move, the glue in the liquid storage chamber 8 will enter into several groups of liquid guiding chambers 21 in sequence, and then enter into the groove 12 from several groups of liquid guiding chambers 21, so that the wafer layer 9 and the insulating partition 10 are bonded together;

[0038] When the glue in the liquid storage chamber 8 is pushed into the groove 12, the snap-in end of the baffle 15 will snap into the snap-in groove 19 located on the inner side of the shell 18, so that the two groups of shells 18 are limited in position, thereby fixing the two groups of shells 18 together.

[0039] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A packaging device for Wiegand wires, comprising two sets of substrates and two sets of housings, characterized in that: The two groups of shells are movably connected together, the two groups of substrates are arranged in the two groups of shells, the inner side of the shells is provided with a connecting groove, the opposite surfaces of the two groups of substrates are movably installed with a wafer layer through a clamping mechanism, the clamping mechanism is arranged in the substrate, the end of the wafer layer away from the substrate is provided with an insulating partition, the insulating partition is clamped by the clamping mechanism, the opposite surfaces of the two groups of insulating partitions are provided with mounting grooves, and a Wiegand wire is arranged between the two groups of mounting grooves, the opposite surfaces of the wafer layer and the insulating partition are provided with a plurality of grooves, the grooves are connected with the two groups of liquid guide cavities, the plurality of liquid guide cavities are arranged in the wafer layer, the end of the liquid guide cavity away from the groove is connected with the liquid storage cavity, and the liquid storage cavity is arranged in the substrate; A liquid pushing clamping mechanism is provided in the liquid storage cavity, and two groups of the liquid pushing clamping mechanisms are connected to the trigger mechanism. The trigger mechanism is arranged in the substrate. After the two groups of shells are assembled together, the shells press the trigger mechanism, so that the liquid pushing clamping mechanism is disconnected from the trigger mechanism, and the glue is pushed into the groove through the liquid pushing clamping mechanism to fix the wafer layer and the insulating partition together. At the same time, one end of the liquid pushing clamping mechanism is clamped in the clamping groove to limit the two groups of shells.

2. A packaging device for Wiegand wire according to claim 1, characterized in that: The clamping plate mechanism includes two groups of clamping plates, one end of the clamping plate close to the substrate is fixedly connected to a T-shaped slider, the T-shaped slider is slidably connected to the T-shaped slide groove, the T-shaped slide groove is opened in the substrate, a first spring is fixedly connected in the T-shaped slide groove, the other end of the first spring is fixedly connected to the T-shaped slider, the opposite surfaces of the two groups of clamping plates are fixedly connected to limiting rods, limiting grooves are opened on both sides of the wafer layer, and the limiting rods are clamped in the limiting grooves.

3. The packaging device of Wiegand wire according to claim 1, characterized in that: The liquid pushing clamping mechanism includes a liquid pushing plate, which is slidably connected to the liquid storage cavity. The back surfaces of the two groups of liquid pushing plates are fixedly connected with baffles, and a yield groove is opened in the upper end of the baffle. The end of the baffle away from the liquid pushing plate is slidably connected to the slide groove, and the slide groove is opened in the base plate. One end of the slide groove is connected to the liquid storage cavity, and the other end is connected to the external environment. A second spring is fixedly connected in the liquid storage cavity, and the other end of the second spring is fixedly connected to the liquid pushing plate. The opposite surfaces of the two groups of liquid pushing plates are fixedly connected with hanging rods, and the hanging rod extends into the connecting cavity away from the end of the liquid pushing plate, and the connecting cavity is opened in the base plate.

4. A packaging device for Wiegand wire according to claim 3, characterized in that: The trigger mechanism includes a T-block, which is slidably connected in the connecting cavity. A third spring is fixedly connected to the lower end of the T-block, and the other end of the third spring is fixedly connected to the connecting cavity. Two groups of hanging grooves are opened in the outer side of the T-block, and the end of the hanging rod away from the liquid pushing plate is clamped in the hanging groove.

5. The packaging device of Wiegand wire according to claim 1, characterized in that: The two groups of opposite surfaces of the base plates are fixedly connected with connecting rods, the two groups of opposite ends of the connecting rods are fixedly connected with plug rods, and slots are provided, and the plug rods are inserted into the slots. The two groups of opposite surfaces of the outer shells are fixedly connected with sealing rings, and sealing grooves are provided, and the sealing rings are inserted into the sealing grooves.

6. A packaging device for Wiegand wire according to claim 5, characterized in that: The back surfaces of the two groups of connecting rods are fixedly connected with sliding blocks, and the sliding blocks are slidably connected in the positioning grooves, and the positioning grooves are arranged on the inner side of the shell.

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