A space optical camera focal plane and electronic control assembly capable of preventing molecular contamination of a detector target surface by electronic components and an assembly process method thereof

Abstract

The application relates to a space optical camera focal plane and electric control assembly and an assembling process method thereof, in particular to a space optical camera focal plane and electric control assembly and an assembling process method thereof which can prevent electronic components from causing molecular pollution to a detector target surface, and solve the problem that existing components are difficult to simultaneously meet the molecular pollution protection requirement of the detector target surface and the space load integration requirement. The component comprises a front-to-rear focal plane assembly and an electric control assembly; the focal plane assembly comprises a front panel, a focal plane assembly shell which surrounds the front panel to form a cavity, and a detector pre-welding assembly, a focal plane circuit board and a heat transfer plate which are arranged in the cavity from front to rear; the detector pre-welding assembly comprises a detector base and a detector pressing plate from rear to front, and a detector arranged in the inner hole of the detector base; the rear end surface of the detector and the stepped surface of the inner hole of the detector base, and the front end surface of the detector pre-welding assembly and the front panel are circumferentially sealed; the shell of the electric control assembly and the focal plane assembly shell surround the cavity to be communicated.

Description

Technical Field

[0001] The present invention relates to a focal plane and electric control component of a space optical camera and an assembly method thereof, and in particular to a focal plane and electric control component of a space optical camera and an assembly method thereof, which can prevent electronic components from causing molecular contamination to a detector target surface. Background Art

[0002] The focal plane assembly is used for imaging in space optical cameras and is one of the important components of space optical cameras. The imaging devices in the focal plane assembly, such as CMOS, CCD detectors, etc., have very high requirements for contamination control on their target surfaces. In addition to the need to control larger particle pollution such as dust, it is also necessary to control molecular contamination. Molecular contamination mainly refers to organic molecules and water molecules volatilized from organic materials in other external payloads and the electronic components inside the space optical camera itself in the vacuum and low temperature environment on orbit. Since the operating temperature of the detector is usually lower than the temperature of the electronic components, molecular contamination is very easy to deposit on the target surface of the detector. If molecular contamination is deposited on the target surface of the detector, it will cause transmission energy loss, thereby affecting the use effect. This situation is more obvious in the ultraviolet band, and the ultraviolet camera is much more sensitive to molecular contamination than the visible light camera. In the ultraviolet band, when the molecular contamination level is 2.5mg / m 2 The transmission energy loss in the ultraviolet band is about 10%, while in the visible light band with the same molecular contamination level, the transmission energy loss is usually 0.5% to 2%. Therefore, in the process of developing space optical cameras, it is particularly important to take into account how to prevent molecular contamination of the detector target surface in space optical cameras.

[0003] The enclosed configurations currently proposed in relevant literature can, to a certain extent, prevent external molecular contamination from entering the detector target surface of space optical cameras. However, they cannot prevent molecular contamination from volatilization from the electronic components of the focal plane assembly within the space optical camera. To reduce the source of molecular contamination, the electronic components of existing focal plane assemblies typically consist only of the focal plane circuit board. The remaining electronic components and electronic control components of the traditional focal plane assembly, excluding the focal plane circuit board, are combined into an electronic control box, which is installed outside the space optical camera and connected to the electronic control box via cables. However, this configuration of the focal plane and electronic control components makes it difficult to meet the increasingly stringent application requirements for integrated and lightweight space payloads. Summary of the Invention

[0004] The purpose of the present invention is to solve the technical problem that the existing configuration of the focal plane and electronic control components of a space optical camera is difficult to simultaneously meet the requirements of molecular contamination protection of the detector target surface and the application requirements of integration and lightweight of space payloads, and to provide a space optical camera focal plane and electronic control components and their assembly process method that can prevent electronic components from causing molecular contamination to the detector target surface.

[0005] See alsoFigure 1 The concept of the present application is that a space optical camera generally comprises an optical assembly, a focal plane assembly and an electric control assembly. The present application completely isolates the target surface 1091 of the detector 109 in the focal plane assembly 01 from the rear-end circuit board, and the target surface 1091 of the detector 109 and the front-end optical assembly 03 in the space optical camera are located in the same cavity at the front end (i.e. the front-end cavity A1 shown in Figure 1 ), and the rear-end circuit board is located in another cavity at the rear end (i.e. the rear-end cavity A2 shown in Figure 1 ), which comprises all the circuit boards in the traditional focal plane assembly and the traditional electric control assembly including the focal plane circuit board 114; the focal plane circuit board 114 and the rest of the circuit boards are connected through the inter-circuit board connectors; in this way, the molecules volatilized from the focal plane and the electronic components in the electric control assembly in the vacuum low-temperature environment cannot reach the target surface 1091 of the detector 109, and will not affect imaging, and all the circuit boards required by the space optical camera are integrated into the whole machine, without the need for an external electric control box, thereby improving the integration and lightweight degree of the whole machine.

[0006] To solve the above technical problems and achieve the above concept, the technical scheme adopted by the present application is as follows:

[0007] A space optical camera focal plane and electric control assembly capable of preventing the electronic components from causing molecular pollution to the target surface of the detector, which is characterized in that:

[0008] The space optical camera focal plane and electric control assembly comprises a focal plane assembly and an electric control assembly arranged in sequence from front to back;

[0009] The focal plane assembly comprises a front panel, a focal plane assembly shell, a detector pre-welding assembly, a focal plane circuit board and a heat transfer plate;

[0010] One side of the front panel in front is used for connecting the optical assembly in the space optical camera, and a light passing hole one is arranged at the center of the panel surface; the focal plane assembly shell is arranged at the rear side of the front panel, and the two are detachably and fixedly connected to surround a cavity with an open rear end; the detector pre-welding assembly, the focal plane circuit board and the heat transfer plate are arranged in sequence from front to back in the cavity surrounded by the front panel and the focal plane assembly shell;

[0011] The detector pre-welding assembly comprises a detector base and a detector pressing plate arranged coaxially in sequence from rear to front, and a detector arranged coaxially in the stepped inner hole of the detector base; the detector pressing plate and the detector base are detachably and sealingly fixedly connected, so that the rear end surface of the detector abuts against the stepped surface of the stepped inner hole of the detector base, so as to realize the circumferential sealing connection between the two surfaces; a light passing hole two is arranged at the center of the panel surface of the detector pressing plate; the detector is a photoelectric detector after removing the target surface protection glass in front of the target surface of the photoelectric detector itself;

[0012] The detector welding front assembly is detachably fixed with the focal plane circuit board and the front panel, and the pins on the rear end surface of the detector extend out of the rear end surface of the detector base and are electrically and mechanically welded with the focal plane circuit board, the front end surface of the detector welding front assembly is circumferentially sealed with the front panel, so as to isolate the target surface of the detector in the front end cavity formed by the detector welding front assembly, the front panel and the shell of the optical assembly;

[0013] The heat transfer boss on the front side of the lower end of the heat transfer plate is in contact with the rear end surface of the detector after passing through the through slot on the focal plane circuit board, so as to conduct heat; the upper end of the heat transfer plate extends out of the notch arranged above the front end of the focal plane assembly shell, and is used for external connection of a heat pipe; the heat transfer plate is detachably fixed with the front panel;

[0014] The electric control assembly includes an electric control assembly shell and a plurality of electric control assembly circuit boards stacked in the electric control assembly shell in the front-rear direction; each two adjacent electric control assembly circuit boards and the electric control assembly circuit board at the front end are connected through a circuit board interconnector; the electric control assembly shell and the focal plane assembly shell form an intercommunicating cavity.

[0015] Further, in order to facilitate heat control, a heat transfer plate heat insulation pad one, a heat transfer plate heat insulation pad two and a heat insulation plate are further included;

[0016] The heat transfer plate heat insulation pad one and the heat transfer plate heat insulation pad two are arranged on the front and rear sides of one side of the upper end of the heat transfer plate, so as to separate the heat transfer plate from the front panel and the focal plane assembly shell, so as to reduce the heat transferred by the heat transfer plate to the front panel and the focal plane assembly shell;

[0017] The heat insulation plate is arranged on the rear side of the heat transfer plate and located in the inner cavity of the focal plane assembly shell, and is detachably fixed with the focal plane assembly shell;

[0018] A through hole is arranged on the heat insulation plate for passing the circuit board interconnector connecting the electric control assembly circuit board at the front end and the focal plane circuit board.

[0019] Further, in order to ensure the strength of the detector base while having a heat insulation effect, the detector base is made of titanium alloy TC4 material; in order to make the heat transfer plate have a better effect of leading out heat when the temperature of the detector is too high, and to remove molecular contamination deposited on the target surface of the detector through baking, the heat transfer plate is made of copper alloy or aluminum alloy; the gap between the heat transfer boss and the rear end surface of the detector is coated with heat-conducting silicone rubber; a heating sheet is pasted on the heat transfer plate to bake the detector and remove the molecular contamination deposited on the target surface of the detector; in order to make the heat insulation plate have a better heat insulation effect, the heat insulation plate is made of polyimide material.

[0020] Further, in order to use better in different wave bands, the application gives the preferred scheme for the visible light wave band and the ultraviolet wave band respectively.

[0021] For the visible light wave band, in order to prevent the better effect of molecular pollution when used in the visible light wave band, the detector welding front assembly further comprises anti-pollution glass II, anti-pollution glass pressing plate and anti-pollution glass I.

[0022] The material, structure and size of the anti-pollution glass II are the same as those of the target surface protective glass; the anti-pollution glass II is arranged in the light passing hole II and is pasted and connected with the front end surface of the detector;

[0023] The outer circumferential surface and the inner hole of the anti-pollution glass pressing plate are both stepped with the front end being larger than the rear end; the rear end of the anti-pollution glass pressing plate is inserted into the light passing hole II, the front end flange of the anti-pollution glass pressing plate is detachably and sealingly connected with the detector pressing plate, the rear end surface of the anti-pollution glass pressing plate is tightly attached to the front surface of the anti-pollution glass II, and the anti-pollution glass II is pressed tightly;

[0024] The anti-pollution glass I is fixedly arranged at the front end of the inner hole of the anti-pollution glass pressing plate, and the rear end surface thereof is attached to the stepped surface in the inner hole.

[0025] Further, for the visible light wave band, in order to ensure a certain coaxiality and easily put the detector into the inner hole of the detector pedestal, and in order to have a better sealing effect, the detector welding front assembly further comprises sealing ring II, sealing ring III and sealing ring IV;

[0026] The gap between the outer circumferential surface of the detector and the corresponding inner circumferential surface of the stepped inner hole of the detector pedestal is 0.05mm-0.1mm;

[0027] A sealing ring groove II is arranged on the front end surface of the detector pressing plate and contacts the rear surface of the front end flange of the anti-pollution glass pressing plate; the sealing ring II is arranged in the sealing ring groove II, and the front end flange of the anti-pollution glass pressing plate is sealingly connected with the detector pressing plate through the sealing ring II;

[0028] A sealing ring groove III is arranged on the front end surface of the detector pedestal and contacts the rear end surface of the detector pressing plate; the sealing ring III is arranged in the sealing ring groove III, and the detector pressing plate is sealingly connected with the detector pedestal;

[0029] A sealing ring groove IV is arranged on the stepped surface of the stepped inner hole of the detector pedestal; the sealing ring IV is arranged in the sealing ring groove IV, and the rear end surface of the detector is sealingly connected with the stepped surface of the stepped inner hole of the detector pedestal in the circumferential direction;

[0030] The sealing ring two, the sealing ring three and the sealing ring four are metal sealing rings. The sealing ring two, the sealing ring three and the sealing ring four are metal sealing rings, so that the sealing effect is ensured, the vacuum aging and volatilization problems of the rubber sealing ring are avoided, and the problem of the vacuum organic matter volatilization of the rubber sealing ring polluting the detector is avoided.

[0031] For the ultraviolet band, in order to have better heat insulation effect when used in the ultraviolet band, especially in the extreme ultraviolet band, the temperature is prevented from being too high to affect the performance of the detector, and the detector pre-welding assembly further comprises a first heat insulation pad;

[0032] The first heat insulation pad is coaxially arranged on the front side of the detector pressing plate and is detachably and sealingly connected with the detector pressing plate.

[0033] The first heat insulation pad is coaxially arranged on the front side of the detector pressing plate and is detachably and sealingly connected with the detector pressing plate.

[0034] Further, for the ultraviolet band, the detector pre-welding assembly further comprises a sealing ring two, a sealing ring three and a sealing ring four.

[0035] The gap between the outer circumferential surface of the detector and the inner circumferential surface of the stepped inner hole of the detector base is 0.05mm-0.1mm.

[0036] A sealing ring groove two is arranged on the front end surface of the detector pressing plate and in contact with the rear end surface of the first heat insulation pad; the sealing ring two is arranged in the sealing ring groove two, and the first heat insulation pad and the detector pressing plate are sealingly connected through the sealing ring two.

[0037] A sealing ring groove three is arranged on the front end surface of the detector base and in contact with the rear end surface of the detector pressing plate; the sealing ring three is arranged in the sealing ring groove three, and the detector pressing plate and the detector base are sealingly connected.

[0038] A sealing ring groove four is arranged on the stepped surface of the stepped inner hole of the detector base; the sealing ring four is arranged in the sealing ring groove four, so that the rear end surface of the detector and the stepped surface of the stepped inner hole of the detector base are circumferentially sealingly connected.

[0039] The sealing ring two, the sealing ring three and the sealing ring four are metal sealing rings.

[0040] Further, it further comprises a sealing ring one.

[0041] The front panel is a box cover shape with a first annular boss arranged on the rear side plate surface; the front end and the rear end of the focal plane assembly shell are both open, the front end is sleeved on the first annular boss, and the front panel is detachably and fixedly connected to form a cavity with an open rear end.

[0042] A second annular boss coaxial with the first annular boss is arranged on the rear side surface of the front panel and inside the first annular boss, and the position and shape of the second annular boss match the position and shape of the front end surface of the detector pre-welding assembly;

[0043] A sealing ring groove I is arranged on the rear end surface of the second annular boss and in contact with the front end surface of the detector pre-welding assembly, and the sealing ring I is arranged in the sealing ring groove I to circumferentially seal the front end surface of the detector pre-welding assembly and the front panel;

[0044] The sealing ring I is a metal sealing ring.

[0045] The second annular boss arranged on the rear side surface of the front panel can easily ensure the size and shape tolerance during processing. The sealing ring I is a metal sealing ring, which can also ensure the sealing effect while avoiding the problems of vacuum aging and volatilization when using a rubber sealing ring, thereby avoiding the pollution of the detector caused by the volatilization of vacuum organic matter of the rubber sealing ring.

[0046] Further, in order to reduce the installation stress borne by the focal plane circuit board during installation, a plurality of trimming pads are further included;

[0047] The plurality of trimming pads are evenly distributed between the focal plane circuit board and the front panel along the periphery of the front side surface of the focal plane circuit board, the height of the trimming pad in the front-rear direction is equal to the size of the gap between the focal plane circuit board and the front panel, and the focal plane circuit board, the trimming pad and the front panel are detachably fixed. The trimming pad is used to reduce the installation stress borne by the focal plane circuit board when connecting the focal plane circuit board and the front panel.

[0048] Meanwhile, the present application also provides an assembly process of the focal plane and the electronic control assembly of the spatial optical camera which can prevent the electronic assembly from causing molecular pollution to the target surface of the detector, and the special feature thereof lies in comprising the following steps:

[0049] Step 1: all the parts to be assembled except the detector are subjected to vacuum degassing treatment;

[0050] Step 2: the detector and the parts to be assembled contained in the detector pre-welding assembly which are subjected to vacuum degassing treatment in step 1 are assembled, and the assembly of the detector pre-welding assembly is completed;

[0051] During the assembly process, the detector pressing plate is constantly polished until the rear end surface of the detector tightly abuts against the stepped surface of the stepped inner hole of the detector base;

[0052] Step 3: detachably fix the probe welding pre-assembly in step 2 to the focal plane circuit board after the vacuum degassing treatment in step 1, and electrically weld the pins on the rear end face of the probe to the focal plane circuit board;

[0053] Step 4: detachably fix the probe welding pre-assembly in step 3, which has completed the electrically welded connection between the pins on the rear end face of the probe and the focal plane circuit board, to the focal plane circuit board, detachably fix the probe welding pre-assembly to the front panel after the vacuum degassing treatment in step 1, and connect the probe welding pre-assembly and the front panel in a circumferential sealing manner;

[0054] Step 5: pass the heat transfer boss on the lower end front side panel of the heat transfer plate after the vacuum degassing treatment in step 1 through the through slot provided on the focal plane circuit board which is detachably fixed to the front panel in step 4, so that the heat transfer boss contacts the rear end face of the probe; then detachably fix the heat transfer plate to the front panel to complete the installation of the heat transfer plate;

[0055] Step 6: fit the focal plane assembly housing after the vacuum degassing treatment in step 1 to the heat transfer plate, the focal plane circuit board and the probe welding pre-assembly which are connected to the front panel in step 5, wherein the lower end of the heat transfer plate, the focal plane circuit board and the probe welding pre-assembly are located inside the focal plane assembly housing, and the upper end of the heat transfer plate protrudes from the notch provided on the front end of the focal plane assembly housing above for external heat pipe connection; then detachably fix the focal plane assembly housing to the front panel to complete the assembly of the focal plane assembly;

[0056] Step 7: assemble the to-be-assembled parts of the electric control assembly after the vacuum degassing treatment in step 1 with the focal plane assembly assembled in step 6, specifically:

[0057] First, position the to-be-assembled electric control assembly circuit boards after the vacuum degassing treatment in step 1 and the focal plane circuit board in the focal plane assembly assembled in step 6 in a front-rear direction stacking arrangement;

[0058] Then, connect each adjacent two electric control assembly circuit boards in the stacking arrangement and the electric control assembly circuit board at the front end to the focal plane circuit board through a circuit board interconnector, and connect each layer of electric control assembly circuit boards and the focal plane circuit board through a stud;

[0059] Finally, fit the electric control assembly housing after the vacuum degassing treatment in step 1 outside the connected electric control assembly circuit boards, and connect the electric control assembly housing to the focal plane assembly housing in the focal plane assembly assembled in step 6;

[0060] Complete the assembly of the focal plane and the electric control assembly.

[0061] The beneficial effects of the present application are:

[0062] (1) The focal plane and electric control assembly of the space optical camera capable of preventing electronic components from causing molecular contamination to the detector target surface of the present application, on the one hand, the detector pressing plate and the detector base are detachably and sealingly fixed, the circumferential sealing connection between the rear end surface of the detector and the stepped surface of the stepped hole of the detector base, and the circumferential sealing between the front end surface of the detector welding pre-assembly and the front panel, so that the target surface of the detector is isolated in the front end cavity surrounded by the detector welding pre-assembly, the front panel and the shell of the optical assembly, so that the target surface of the detector is located in a different cavity from the cavity where the focal plane circuit board and the electric control assembly circuit board are located, so that the molecules volatilized from the electronic components in the focal plane and electric control assembly in the vacuum low temperature environment cannot reach the target surface of the detector, thereby avoiding the influence on imaging; on the other hand, in the present application, the circuit boards between each two adjacent electric control assembly circuit boards and the circuit board between the frontmost electric control assembly circuit board and the focal plane circuit board are connected by the circuit board connector, so that the required circuit boards of the space optical camera are integrated into the whole machine, without external electric control box, improving the integration and lightweight degree of the whole machine; thus, the present application meets the application requirements of the integration and lightweight of the detector target surface molecular contamination protection and space load; therefore, the present application solves the technical problem that the existing focal plane and electric control assembly configuration of the space optical camera cannot simultaneously meet the application requirements of the integration and lightweight of the detector target surface molecular contamination protection and space load.

[0063] (2) The isolation structure design of the focal plane assembly in the present application can effectively avoid the entry of internal and external molecular contamination from the rear end cavity where the electronic components such as the focal plane circuit board and the electric control assembly circuit board are located into the front end cavity where the detector target surface is located, and can effectively avoid the deposition of molecular contamination to the detector target surface.

[0064] (3) The present application provides two preferred schemes of the focal plane and electric control assembly of the space optical camera capable of preventing electronic components from causing molecular contamination to the detector target surface. In the first preferred scheme, in addition to the detector base, the detector pressing plate and the detector, the detector welding pre-assembly preferably further comprises the second anti-contamination glass, the anti-contamination glass pressing plate and the first anti-contamination glass; the first preferred scheme is suitable for the visible light band, and the anti-molecular contamination effect is better when used in the visible light band. In the second preferred scheme, in addition to the detector base, the detector pressing plate and the detector, the detector welding pre-assembly preferably further comprises the first heat insulation pad; the second preferred scheme is not only suitable for the visible light band, but also suitable for the ultraviolet band, especially in the extreme ultraviolet band; the second preferred scheme has better heat insulation effect, which can better avoid the influence of high temperature on the performance of the detector.

[0065] (4) The metal sealing ring is preferably used for sealing in the application, which can avoid vacuum aging and volatilization problems when the rubber sealing ring is used, and further can avoid the problem of vacuum organic volatilization pollution of the detector.

[0066] (5) The heat transfer plate is arranged in the application, and preferably the heat transfer plate heat insulation pad one, heat transfer plate heat insulation pad two and heat insulation plate are further arranged, so that the working temperature of the detector can be more conveniently, better and more effectively ensured; in addition, the heating sheet is preferably pasted on the heat transfer plate in the application, and the detector can be actively heated by the heating sheet to remove the molecular contamination attached to the target surface of the detector, and the molecular contamination prevention effect is better.

[0067] (6) The space optical camera focal plane and the electric control assembly capable of preventing the electronic assembly from causing molecular contamination to the target surface of the detector in the application realize the physical isolation of the circuit board and the optical element, and all the circuit boards required by the space optical camera can be integrated into the whole machine, without the external electric control box, so that the integration degree and the lightweight degree of the whole machine are improved. BRIEF DESCRIPTION OF DRAWINGS

[0068] Figure 1 is the schematic diagram of the inventive concept of the application;

[0069] Figure 2 is the exploded view of the focal plane assembly in embodiment 1 of the application;

[0070] Figure 3 is the assembly view of the focal plane assembly in embodiment 1 of the application;

[0071] Figure 4 is the front view of the combination before welding of the detector in embodiment 1 of the application;

[0072] Figure 5 is the sectional view along the line A-A in Figure 4 .

[0073] The explanation of the numbers in the figure is as follows:

[0074] 01-focal plane assembly, 101-front panel, 102-sealing ring one, 103-anti-pollution glass one, 104-anti-pollution glass pressing plate, 105-sealing ring two, 106-detector pressing plate, 107-anti-pollution glass two, 108-sealing ring three, 109-detector, 1091-target surface, 110-sealing ring four, 111-detector base, 112-heat transfer plate heat insulation pad one, 113-trimming pad, 114-focal plane circuit board, 115-heat transfer plate, 116-heat transfer plate heat insulation pad two, 117-focal plane assembly shell, 118-heat insulation plate, 02-electric control assembly, 03-optical assembly, A1-front end cavity, A2-rear end cavity. DETAILED DESCRIPTION

[0075] The application will be described in detail below in conjunction with the drawings and specific embodiments.

[0076] Referring to Figure 1 The application is a space optical camera focal plane and electronic control assembly which can prevent electronic components from causing molecular contamination to the detector target surface, comprising a focal plane assembly 01 and an electronic control assembly 02 arranged in sequence from front to back.

[0077] Referring to Figure 2 and Figure 3 The above-mentioned focal plane assembly 01 comprises a front panel 101, a focal plane assembly shell 117, a detector soldering front assembly, a focal plane circuit board 114 and a heat transfer plate 115. One side of the front of the front panel 101 is used to connect the optical assembly 03 in the space optical camera, and a light passing hole one is arranged at the center of the panel surface. When the front panel 101 is connected with the optical assembly 03, a sealing connection is also adopted, and the sealing groove can be arranged on the front panel 101 or the optical assembly 03. The above-mentioned focal plane assembly shell 117 is arranged at the rear side of the front panel 101, and the two are detachably fixed to form a cavity with an open rear end. The above-mentioned detector soldering front assembly, focal plane circuit board 114 and heat transfer plate 115 are arranged in sequence from front to back in the cavity formed by the front panel 101 and the focal plane assembly shell 117. Referring to Figure 4 and Figure 5 The above-mentioned detector soldering front assembly comprises a detector base 111 and a detector pressing plate 106 arranged coaxially in sequence from back to front, and a detector 109 arranged coaxially in the stepped inner hole of the detector base 111. The detector base 111 is used to place the detector 109 therein, and fixes the detector 109 together with the detector pressing plate 106. In order to ensure a certain coaxiality and easily put the detector 109 into the inner hole of the detector base 111, preferably, the gap between the outer peripheral surface of the detector 109 and the inner peripheral surface of the stepped inner hole of the detector base 111 corresponding thereto is 0.05mm-0.1mm. The detector pressing plate 106 is used to press and fix the detector 109, that is, by detachably sealing and fixedly connecting the detector pressing plate 106 with the detector base 111, the rear end surface of the detector 109 is tightly attached to the stepped surface of the stepped inner hole of the detector base 111, so that the two surfaces are connected in circumferential sealing. A light passing hole two is arranged at the center of the panel surface of the detector pressing plate 106. The above-mentioned detector 109 is a photoelectric detector after removing the target surface protection glass in front of the target surface of the photoelectric detector itself. Referring to Figure 3 and Figure 1The probe welding front assembly is detachably fixed between the focal plane circuit board 114 and the front panel 101, and the pins on the rear end surface of the probe 109 extend out of the rear end surface of the probe base 111 and are electrically and fixedly connected with the focal plane circuit board 114, the front end surface of the probe welding front assembly is circumferentially sealed with the front panel 101, so as to isolate the target surface 1091 of the probe 109 in the front end cavity A1 formed by the probe welding front assembly, the front panel 101 and the shell of the optical assembly 03; the heat transfer boss on the lower end front side surface of the heat transfer plate 115 is in contact with the rear end surface of the probe 109 after passing through the through slot arranged on the focal plane circuit board 114, so as to conduct heat; the upper end of the heat transfer plate 115 extends out of the gap arranged on the front end of the focal plane assembly shell 117, and is used for externally connecting a heat pipe, so as to lead out heat when the temperature of the probe 109 is too high; and the heat transfer plate 115 is detachably fixed with the front panel 101.

[0078] Referring to Figure 1 The electric control assembly 02 includes an electric control assembly shell and a plurality of electric control assembly circuit boards arranged in the electric control assembly shell in a front-rear direction; each two adjacent electric control assembly circuit boards and the electric control assembly circuit board at the front end are connected through a circuit board interconnector; and the electric control assembly shell, the focal plane assembly shell 117, the front panel 101 and the probe welding front assembly form a rear end cavity A2 in communication.

[0079] The space optical camera focal plane and electric control assembly capable of preventing electronic components from causing molecular pollution to a probe target surface of the present application is suitable for space optical cameras of all wave bands, and is particularly suitable for ultraviolet wave band imaging cameras because the sensitivity of ultraviolet wave bands to organic molecular pollution is higher than that of other wave bands. In order to make the space optical camera focal plane and electric control assembly capable of preventing electronic components from causing molecular pollution to a probe target surface of the present application, the application effect is better when it is applied under different wave band conditions, and the present application has two preferred schemes, namely two embodiments, embodiment 1 and embodiment 2. The preferred scheme corresponding to embodiment 1 is suitable for visible light wave bands, and the effect of preventing molecular pollution is better when it is used in visible light wave bands. The preferred scheme corresponding to embodiment 2 is suitable not only for visible light wave bands but also for ultraviolet wave bands, especially extreme ultraviolet wave bands; the preferred scheme corresponding to embodiment 2 has better heat insulation effect, and can better avoid high temperature and affect the performance of the probe. The difference between the above-mentioned embodiment 1 and embodiment 2 in the present application is only that the structure of the probe welding front assembly is different.

[0080] Figure 4 and Figure 5The structure of the detector pre-welding assembly in Example 1 is shown in FIG. 1. In Example 1, the detector pre-welding assembly described above comprises, in addition to the detector base 111 and the detector pressing plate 106 coaxially arranged in sequence from back to front, and the detector 109 coaxially arranged in the stepped inner hole of the detector base 111, the anti-pollution glass II 107, the anti-pollution glass pressing plate 104, and the anti-pollution glass I 103. The material, structure, and size of the anti-pollution glass II 107 are the same as the above-mentioned target surface protective glass of the photoelectric detector itself, and the target surface protective glass of the photoelectric detector itself is usually used instead; the anti-pollution glass II 107 is arranged in the above-mentioned light passing hole II and is pasted and connected with the front end surface of the detector 109; the anti-pollution glass pressing plate 104 is used to press the anti-pollution glass II 107; the outer periphery and the inner hole of the anti-pollution glass pressing plate 104 are both stepped, with the front end being larger and the rear end being smaller; the rear end of the anti-pollution glass pressing plate 104 is inserted into the above-mentioned light passing hole II, and the front end flange of the anti-pollution glass pressing plate 104 is detachably and sealingly connected with the detector pressing plate 106, so that the rear end surface of the anti-pollution glass pressing plate 104 tightly abuts against the front surface of the anti-pollution glass II 107, thereby pressing the anti-pollution glass II 107; the anti-pollution glass I 103 is fixedly arranged at the front end of the inner hole of the anti-pollution glass pressing plate 104, and its rear end surface abuts against the stepped surface in the inner hole, thereby strengthening the protection against external pollutants during the circuit debugging stage. In this Example 1, in order to achieve better sealing effect, the detector pre-welding assembly further comprises a sealing ring II 105, a sealing ring III 108, and a sealing ring IV 110. A sealing ring groove II is arranged on the front end surface of the above-mentioned detector pressing plate 106, in contact with the rear surface of the front end flange of the anti-pollution glass pressing plate 104; the sealing ring II 105 is arranged in the sealing ring groove II, thereby sealingly connecting the front end flange of the anti-pollution glass pressing plate 104 with the detector pressing plate 106; a sealing ring groove III is arranged on the front end surface of the above-mentioned detector base 111, in contact with the rear end surface of the detector pressing plate 106; the sealing ring III 108 is arranged in the sealing ring groove III, thereby sealingly connecting the detector pressing plate 106 with the detector base 111; a sealing ring groove IV is arranged on the stepped surface of the stepped inner hole of the above-mentioned detector base 111; the sealing ring IV 110 is arranged in the sealing ring groove IV, thereby sealingly connecting the rear end surface of the detector 109 with the stepped surface of the stepped inner hole of the detector base 111; and in this Example 1, the sealing ring II 105, the sealing ring III 108, and the sealing ring IV 110 are all metal sealing rings, so that the sealing effect is ensured, and the problems of vacuum aging and volatilization of rubber sealing rings are avoided, thereby avoiding the pollution of the detector by the volatilization of vacuum organic substances of rubber sealing rings. Figure 2 and Figure 3 The structure of the focal plane assembly in Example 1 is shown in FIG. 2.

[0081] The embodiment 2 of the present application is different from the embodiment 1 of the present application only in that the anti-pollution glass two 107, the anti-pollution glass pressing plate 104 and the anti-pollution glass one 103 in the front assembly of the detector in the embodiment 1 are replaced by a first heat insulation pad as a whole (as the structure of the embodiment 2 is similar to that of the embodiment 1, the only difference is this, therefore, the related drawings of the embodiment 2 are not given in the present application), then the first heat insulation pad is coaxially arranged at the front side of the detector pressing plate 106 and detachably and sealingly connected with the detector pressing plate 106, and the first heat insulation pad is provided with a light passing hole three. At this time, the sealing ring groove two is arranged at the position where the front end surface of the detector pressing plate 106 is in contact with the rear end surface of the first heat insulation pad, the sealing ring two 105 is arranged in the sealing ring groove two, and the first heat insulation pad is sealingly connected with the detector pressing plate 106 through the sealing ring two 105. In order to achieve better heat insulation effect, the thermal conductivity of the first heat insulation pad is preferably less than 1 W / (m·K), and in the embodiment 2, the first heat insulation pad is made of polyimide material.

[0082] In order to facilitate heat control, referring to Figure 2 and Figure 3 , the focal plane of the space optical camera of the embodiment 1 and the embodiment 2 of the present application which can prevent the electronic components from causing molecular pollution to the detector target surface and the electric control components, preferably further comprise a heat transfer plate heat insulation pad one 112, a heat transfer plate heat insulation pad two 116 and a heat insulation plate 118. The heat transfer plate heat insulation pad one 112 and the heat transfer plate heat insulation pad two 116 are respectively arranged at the front and rear sides of the upper end side of the heat transfer plate 115, used to separate the heat transfer plate 115 from the front panel 101 and the focal plane assembly housing 117, so as to reduce the heat transferred by the heat transfer plate 115 to the front panel 101 and the focal plane assembly housing 117; the heat insulation plate 118 is arranged at the rear side of the heat transfer plate 115 and located in the inner cavity of the focal plane assembly housing 117, and is detachably and fixedly connected with the focal plane assembly housing 117; a through hole for passing the inter-circuit board connector connecting the frontmost end electric control component circuit board and the focal plane circuit board 114 is arranged on the heat insulation plate 118. In the embodiment 1 and the embodiment 2, in order to ensure the strength of the detector base 111 while having heat insulation effect, the detector base 111 is made of titanium alloy TC4 material; in order to make the heat transfer plate 115 have better heat dissipation effect when the temperature of the detector 109 is too high, the heat transfer plate 115 is made of copper alloy or aluminum alloy, and the gap between the heat transfer protrusions and the rear end surface of the detector 109 is coated with heat-conducting silicone rubber; in order to be able to remove the deposited molecular pollution on the target surface 1091 of the detector 109 by baking, a heating sheet is pasted on the heat transfer plate 115; in order to make the heat insulation plate 118 have better heat insulation effect, the heat insulation plate 118 is made of polyimide material.

[0083] Referring to Figure 2 and Figure 3In order to make the circumferential sealing effect between the front end face of the detector pre-welding assembly and the front panel 101 better, the focal plane of the space optical camera of the embodiment 1 and the embodiment 2 which can prevent the electronic components from causing molecular pollution to the detector target face, preferably further comprises a sealing ring one 102. The front panel 101 is a box cover type with a first annular boss arranged on the rear side panel face along the circumference. The front end and the rear end of the focal plane assembly shell 117 are both open, the front end is sleeved on the first annular boss, and the front panel 101 is detachably and fixedly connected to form a cavity with the rear end open. A second annular boss coaxial with the first annular boss is arranged on the rear side panel face of the front panel 101 at a position inside the first annular boss, and the position and shape of the second annular boss match the position and shape of the front end face of the detector pre-welding assembly. A sealing ring groove one is arranged on the rear end face of the second annular boss at a position in contact with the front end face of the detector pre-welding assembly. The sealing ring one 102 is arranged in the sealing ring groove one to circumferentially seal between the front end face of the detector pre-welding assembly and the front panel 101. The second annular boss arranged on the rear side panel face of the front panel can easily ensure the dimensional and geometric tolerance during processing. In the embodiment 1 and the embodiment 2, the sealing ring one 102 is a metal sealing ring. When the metal sealing ring is used, the vacuum aging and volatilization problems of the rubber sealing ring can be avoided, and the problem of the vacuum organic matter volatilization pollution of the detector caused by the rubber sealing ring can also be avoided. In the embodiment 1 and the embodiment 2, the sealing ring one 102, the sealing ring two 105, the sealing ring three 108 and the sealing ring four 110 are all indium wire sealing rings. The width and depth of the sealing ring groove one, the sealing ring groove two, the sealing ring groove three and the sealing ring groove four need to be designed according to the size of the corresponding sealing ring. The sealing ring one 102, the sealing ring two 105 and the sealing ring three 108 are used for circumferential sealing of the detector 109 to prevent the organic pollutants generated by the circuit board from entering the front end cavity A1 where the target face 1091 of the detector 109 is located. The sealing ring four 110 is used for back sealing of the detector 109 to prevent the organic pollutants generated by the circuit board from entering the front end cavity A1 where the target face 1091 of the detector 109 is located.

[0084] In order to reduce the installation stress borne by the focal plane circuit board 114 during installation, referring to Figure 2 and Figure 3The focal plane and the electronic control assembly of the space optical camera capable of preventing the electronic assembly from causing molecular contamination to the detector target surface according to the embodiment 1 and the embodiment 2 of the present application preferably further comprises a plurality of trimming pads 113. The plurality of trimming pads 113 are evenly distributed between the focal plane circuit board 114 and the front panel 101 along the periphery of the front side of the focal plane circuit board 114, the height of the trimming pads 113 in the front-rear direction is equal to the size of the gap between the focal plane circuit board 114 and the front panel 101, and the focal plane circuit board 114, the trimming pads 113 and the front panel 101 are detachably fixed. After the trimming pads 113 are used, the mounting stress borne by the focal plane circuit board 114 when the focal plane circuit board 114 is connected with the front panel 101 can be reduced.

[0085] Meanwhile, the present application further provides an assembly process of the focal plane and the electronic control assembly of the space optical camera capable of preventing the electronic assembly from causing molecular contamination to the detector target surface, which comprises the following steps:

[0086] Step 1: all the components to be assembled except the detector 109 are subjected to vacuum degassing treatment;

[0087] Step 2: the detector 109 and the components to be assembled contained in the above-mentioned detector pre-welding assembly which have been subjected to vacuum degassing treatment in step 1 are assembled, and the assembly of the detector pre-welding assembly is completed;

[0088] During the assembly process, the detector pressing plate 106 is constantly polished until the rear end surface of the detector 109 tightly abuts the stepped surface of the stepped inner hole of the detector base 111;

[0089] For the embodiment 1, the step 2 is specifically as follows: the anti-contamination glass one 103 is first adhered to the anti-contamination glass pressing plate 104 by using epoxy adhesive and is cured for 12 hours; then the sealing ring four 110, the detector 109 with the target surface protective glass, i.e. the anti-contamination glass two 107, are sequentially loaded into the detector base 111; then the sealing ring three 108 is loaded into the sealing ring groove three; then the detector pressing plate 106 is placed on the sealing ring three 108, the detector pressing plate 106 and the detector base 111 are connected by using screws, and during the connection process, the detector pressing plate 106 is constantly polished until the rear end surface of the detector 109 tightly abuts the stepped surface of the stepped inner hole of the detector base 111; then the sealing ring two 105 is loaded into the sealing ring groove two; finally, the rear end of the anti-contamination glass pressing plate 104 with the anti-contamination glass one 103 assembled thereon and cured for 12 hours is inserted into the detector pressing plate 106, the anti-contamination glass pressing plate 104 and the detector pressing plate 106 are connected by using screws, and during the connection process, the anti-contamination glass pressing plate 104 is constantly polished to ensure that it can compact the anti-contamination glass two 107, and the assembly of the detector pre-welding assembly in the embodiment 1 is completed;

[0090] For the present embodiment 2, the step 2 is specifically as follows: the sealing ring four 110 and the detector 109 are sequentially installed into the detector base 111; then the sealing ring three 108 is installed into the sealing ring groove three; then the detector pressing plate 106 is placed on the sealing ring three 108, the detector pressing plate 106 and the detector base 111 are connected by screws, and the detector pressing plate 106 is constantly polished during the connecting process until the rear end surface of the detector 109 is tightly attached to the step surface of the stepped hole of the detector base 111; then the sealing ring two 105 is installed into the sealing ring groove two; finally, the first heat insulation pad is placed on the sealing ring two 105, and the first heat insulation pad and the detector pressing plate 106 are connected by screws;

[0091] Step 3: the detector welding pre-assembly assembled in step 2 is detachably fixed and installed on the focal plane circuit board 114 treated by vacuum degassing in step 1, and the pins on the rear end surface of the detector 109 are electrically connected and welded with the focal plane circuit board 114; in the present embodiment 1 and the embodiment 2, the detector welding pre-assembly assembled in step 2 is detachably fixed and installed on the focal plane circuit board 114 treated by vacuum degassing in step 1 by screws and nuts; after the detector welding pre-assembly is fixed and installed on the focal plane circuit board 114, the pins on the rear end surface of the detector 109 are electrically connected and welded with the focal plane circuit board 114, which can avoid that the pollutants generated by welding fall on the target surface 1091 of the detector 109, and at the same time, the ring mirror requirement during welding is reduced;

[0092] Step 4: the detector welding pre-assembly, which is detachably fixed and installed on the focal plane circuit board 114 and in which the pins on the rear end surface of the detector 109 are electrically connected and welded with the focal plane circuit board 114, is detachably connected with the front panel 101 treated by vacuum degassing in step 1, and the front end surface of the detector welding pre-assembly is circumferentially and sealingly connected with the front panel 101 during the connecting process; in the present embodiment 1 and the embodiment 2, the sealing ring one 102 is installed into the sealing ring groove one, the detector welding pre-assembly, in which the pins on the rear end surface of the detector 109 are electrically connected and welded with the focal plane circuit board 114, is placed on the sealing ring one 102, and then the detector welding pre-assembly is connected with the front panel 101 by screws; since the present embodiment 1 and the embodiment 2 preferably further include the cutting pad 113, the height of the cutting pad 113 in the front-rear direction is polished to be equal to the size of the gap between the focal plane circuit board 114 and the front panel 101 in step 4, and then the polished cutting pad 113 is installed into the gap, and the focal plane circuit board 114 and the front panel 101 are connected by screws, so that the installation stress borne by the focal plane circuit board 114 is small;

[0093] Step 5: The heat transfer boss on the lower end of the heat transfer plate 115 is passed through the through slot on the focus surface circuit board 114 which is detachably fixed to the front panel 101 in step 4, so that the heat transfer boss is in contact with the rear end surface of the detector 109; then the heat transfer plate 115 is detachably fixed to the front panel 101, and the installation of the heat transfer plate 115 is completed; since the heat transfer plate heat insulation pad one 112 and the heat transfer plate heat insulation pad two 116 are also included in the embodiment 1 and the embodiment 2, in step 5, when the heat transfer plate 115 is detachably fixed to the front panel 101, the guide rod on the front panel of the heat transfer plate heat insulation pad two 116 is sequentially passed through the heat transfer plate 115 and the heat transfer plate heat insulation pad one 112, and then the front panel 101 is detachably fixed, so that the heat of the heat transfer plate 115 is isolated from the rest of the structure by the heat transfer plate heat insulation pad one 112 and the heat transfer plate heat insulation pad two 116;

[0094] Step 6: The focus surface assembly shell 117 after the vacuum deaeration treatment in step 1 is sleeved on the heat transfer plate 115, the focus surface circuit board 114 and the detector welding pre-assembly which are connected to the front panel 101 in step 5, wherein the lower end of the heat transfer plate 115, the focus surface circuit board 114 and the detector welding pre-assembly are located inside the focus surface assembly shell 117, and the upper end of the heat transfer plate 115 protrudes from the notch set on the front end of the focus surface assembly shell 117 above for external connection of the heat pipe; then the focus surface assembly shell 117 is detachably fixed to the front panel 101, and the assembly of the focus surface assembly 01 is completed; in the embodiment 1 and the embodiment 2, the focus surface assembly shell 117 is detachably fixed to the front panel 101 by screws; since the heat insulation plate 118 is also included in the embodiment 1 and the embodiment 2, the heat insulation plate 118 needs to be connected to the focus surface assembly shell 117 by screws in step 6, and the assembly of the focus surface assembly 01 in the embodiment 1 and the embodiment 2 is completed;

[0095] Step 7: The components to be assembled in the above-mentioned electric control assembly 02 after the vacuum deaeration treatment in step 1 are assembled with the focus surface assembly 01 assembled in step 6, specifically:

[0096] First, the above-mentioned electric control assembly circuit boards to be assembled after the vacuum deaeration treatment in step 1 are positioned by the stopper and then arranged in a stacked manner along the front-rear direction with the focus surface circuit board 114 in the focus surface assembly 01 assembled in step 6;

[0097] Then, each adjacent two of the above electric control assembly circuit boards arranged in a stack are connected through a circuit board interconnector, and the frontmost electric control assembly circuit board and the focal plane circuit board 114 are connected through a screw post; in the embodiment 1 and the embodiment 2, when the frontmost electric control assembly circuit board and the focal plane circuit board 114 are connected through the circuit board interconnector, the circuit board interconnector passes through the above-mentioned via hole arranged on the heat insulation plate 18;

[0098] Finally, the above-mentioned electric control assembly housing after the vacuum degassing treatment in step 1 is sleeved outside the connected electric control assembly circuit board, and the electric control assembly housing is connected with the focal plane assembly housing 117 in the focal plane assembly 01 assembled in step 6;

[0099] The assembly of the focal plane and the electric control assembly is completed.

[0100] For the above-mentioned embodiment 2 suitable for the ultraviolet band, especially the extreme ultraviolet band, the assembly of the focal plane and the electric control assembly of the space optical camera capable of preventing the electronic assembly from causing molecular pollution to the detector target surface can also be assembled by using the structure of the embodiment 1 in the electronic debugging process, and after the debugging is completed, the anti-pollution glass II 107, the anti-pollution glass pressing plate 104 and the anti-pollution glass I 103 in the combination before the detector is welded are disassembled, the anti-pollution glass II 107, the anti-pollution glass pressing plate 104 and the anti-pollution glass I 103 are replaced by the first heat insulation pad as a whole, and then the assembly is performed according to the corresponding assembly method of the above-mentioned embodiment 2, so that the molecular pollution in the debugging process can be reduced.

[0101] In summary, the focal plane and the electric control assembly of the space optical camera capable of preventing the electronic assembly from causing molecular pollution to the detector target surface not only realize the physical isolation of the circuit board and the optical element, and can effectively prevent molecular pollution, but also integrate all the circuit boards required by the space optical camera into the whole machine, without external electric control box, so that the integration degree and the lightweight degree of the whole machine are improved.

Claims

1. A space optical camera focal plane and electronic control assembly capable of preventing electronic components from causing molecular contamination to a detector target surface, characterized in that: it comprises a focal plane assembly (01) and an electronic control assembly (02) arranged in sequence from front to back; the focal plane assembly (01) comprises a front panel (101), a focal plane assembly shell (117), a detector pre-welding assembly, a focal plane circuit board (114) and a heat transfer plate (115); one side of the front of the front panel (101) is used to connect the optical assembly (03) in the space optical camera, and a light passing hole one is arranged at the center of the panel surface; the focal plane assembly shell (117) is arranged on the rear side of the front panel (101), and the two are detachably and fixedly connected to form a cavity with an open rear end; the detector pre-welding assembly, the focal plane circuit board (114) and the heat transfer plate (115) are arranged in sequence from front to back in the cavity formed by the front panel (101) and the focal plane assembly shell (117); the detector pre-welding assembly comprises a detector base (111) and a detector pressing plate (106) arranged coaxially in sequence from back to front, and a detector (109) arranged coaxially in a stepped inner hole of the detector base (111); the detector (109) is tightly attached to the step surface of the stepped inner hole of the detector base (111) by detachably and sealingly connecting the detector pressing plate (106) and the detector base (111), so that the two surfaces are sealingly connected in the circumferential direction; a light passing hole two is arranged at the center of the panel surface of the detector pressing plate (106); the detector (109) is a photoelectric detector after removing the target surface protection glass in front of the target surface of the photoelectric detector itself; the detector pre-welding assembly, the focal plane circuit board (114) and the front panel (101) are detachably and fixedly connected, and the pins on the rear end surface of the detector (109) extend out of the rear end surface of the detector base (111) and are electrically and weldedly connected with the focal plane circuit board (114), and the front end surface of the detector pre-welding assembly is sealingly connected with the front panel (101) in the circumferential direction, so as to isolate the target surface (1091) of the detector (109) in a front end cavity (A1) formed by the detector pre-welding assembly, the front panel (101) and the shell of the optical assembly (03); the heat transfer boss on the front side of the lower end of the heat transfer plate (115) is in contact with the rear end surface of the detector (109) after passing through the through slot arranged on the focal plane circuit board (114) to conduct heat; the upper end of the heat transfer plate (115) extends out of the notch arranged on the front end of the focal plane assembly shell (117) to externally connect a heat pipe; the heat transfer plate (115) is detachably and fixedly connected with the front panel (101); the electronic control assembly (02) comprises an electronic control assembly shell and a plurality of electronic control assembly circuit boards stacked in the electronic control assembly shell in the front-rear direction; each two adjacent electronic control assembly circuit boards and the electronic control assembly circuit board at the front end are connected through a circuit board interconnector; and the electronic control assembly shell and the focal plane assembly shell (117) form a cavity in communication. ​ ​ ​ ​ 2. The focal plane and electronic control assembly of a space optical camera capable of preventing electronic components from causing molecular contamination to the detector target surface according to claim 1, characterized in that: further comprising a heat transfer plate thermal insulation pad one (112), a heat transfer plate thermal insulation pad two (116) and a thermal insulation plate (118); the heat transfer plate thermal insulation pad one (112) and the heat transfer plate thermal insulation pad two (116) are respectively arranged on the front and rear sides of the upper end of the heat transfer plate (115), for separating the heat transfer plate (115) from the front panel (101) and the focal plane assembly housing (117) to reduce the heat transferred by the heat transfer plate (115) to the front panel (101) and the focal plane assembly housing (117); the thermal insulation plate (118) is arranged on the rear side of the heat transfer plate (115) and located in the inner cavity of the focal plane assembly housing (117), and is detachably fixed to the focal plane assembly housing (117); a through hole is arranged on the thermal insulation plate (118) for the passage of a circuit board interconnector connecting the frontmost electronic control assembly circuit board and the focal plane circuit board (114).

3. The focal plane and electronic control assembly of a space optical camera capable of preventing electronic components from causing molecular contamination to the detector target surface according to claim 2, characterized in that: the detector base (111) is made of titanium alloy TC4 material; the heat transfer plate (115) is made of copper alloy or aluminum alloy; the gap between the heat transfer boss and the rear end surface of the detector (109) is coated with heat-conducting silicone rubber; a heating sheet is attached to the heat transfer plate (115) to bake the detector (109) and remove the molecular contamination deposited on the target surface (1091) of the detector (109); the thermal insulation plate (118) is made of polyimide material.

4. The focal plane and electronic control assembly of a space optical camera capable of preventing electronic components from causing molecular contamination to the detector target surface according to claim 2, characterized in that: the detector pre-welding assembly further comprises a second anti-contamination glass (107), an anti-contamination glass pressing plate (104) and a first anti-contamination glass (103); the material, structure and size of the second anti-contamination glass (107) are the same as those of the target surface protective glass; the second anti-contamination glass (107) is arranged in the light passing hole two and is attached to the front end surface of the detector (109); the outer periphery and inner hole of the anti-contamination glass pressing plate (104) are stepped, with the front end being larger than the rear end; the rear end of the anti-contamination glass pressing plate (104) is inserted into the light passing hole two, and the front end flange of the anti-contamination glass pressing plate (104) is detachably and sealingly fixed to the detector pressing plate (106), so that the rear end surface of the anti-contamination glass pressing plate (104) tightly abuts against the front surface of the second anti-contamination glass (107) to press the second anti-contamination glass (107); the first anti-contamination glass (103) is fixedly arranged at the front end of the inner hole of the anti-contamination glass pressing plate (104), and its rear end surface abuts against the stepped surface in the inner hole.

5. The focal plane and electronic control assembly of a space optical camera capable of preventing electronic components from causing molecular contamination to the detector target surface according to claim 4, characterized in that: The detector pre-welding assembly further comprises a sealing ring two (105), a sealing ring three (108) and a sealing ring four (110); The gap between the outer circumferential surface of the detector (109) and the corresponding inner circumferential surface of the stepped inner hole of the detector base (111) is 0.05mm-0.1mm; A sealing ring groove two is arranged on the front end surface of the detector pressing plate (106) at a position in contact with the rear surface of the front end flange of the anti-pollution glass pressing plate (104); the sealing ring two (105) is arranged in the sealing ring groove two, and the front end flange of the anti-pollution glass pressing plate (104) is sealed and connected with the detector pressing plate (106) through the sealing ring two (105); A sealing ring groove three is arranged on the front end surface of the detector base (111) at a position in contact with the rear end surface of the detector pressing plate (106); the sealing ring three (108) is arranged in the sealing ring groove three, and the detector pressing plate (106) is sealed and connected with the detector base (111); A sealing ring groove four is arranged on the stepped surface of the stepped inner hole of the detector base (111); the sealing ring four (110) is arranged in the sealing ring groove four, so that the rear end surface of the detector (109) is circumferentially sealed and connected with the stepped surface of the stepped inner hole of the detector base (111); The sealing ring two (105), the sealing ring three (108) and the sealing ring four (110) are all metal sealing rings.

6. The spatial optical camera focal plane and electronic control assembly capable of preventing electronic components from causing molecular pollution to a detector target surface according to claim 2, wherein: The detector pre-welding assembly further comprises a first heat insulation pad; The first heat insulation pad is coaxially arranged on the front side of the detector pressing plate (106) and is detachably and sealingly fixedly connected with the detector pressing plate (106); A light passing hole three is arranged on the first heat insulation pad.

7. The spatial optical camera focal plane and electronic control assembly capable of preventing electronic components from causing molecular pollution to a detector target surface according to claim 6, wherein: The detector pre-welding assembly further comprises a sealing ring two (105), a sealing ring three (108) and a sealing ring four (110); The gap between the outer circumferential surface of the detector (109) and the corresponding inner circumferential surface of the stepped inner hole of the detector base (111) is 0.05mm-0.1mm; A sealing ring groove two is arranged on the front end surface of the detector pressing plate (106) at a position in contact with the rear end surface of the first heat insulation pad; the sealing ring two (105) is arranged in the sealing ring groove two, and the first heat insulation pad is sealed and connected with the detector pressing plate (106) through the sealing ring two (105); A sealing ring groove three is arranged on the front end surface of the detector base (111) at a position in contact with the rear end surface of the detector pressing plate (106); the sealing ring three (108) is arranged in the sealing ring groove three, and the detector pressing plate (106) is sealed and connected with the detector base (111). A sealing ring groove four is arranged on the step surface of the stepped inner hole of the detector base (111), and the sealing ring four (110) is arranged in the sealing ring groove four to achieve circumferential sealing connection between the rear end surface of the detector (109) and the step surface of the stepped inner hole of the detector base (111). The sealing ring two (105), the sealing ring three (108) and the sealing ring four (110) are metal sealing rings.

8. The space optical camera focal plane and electronic control assembly capable of preventing electronic components from causing molecular pollution to a detector target surface according to any one of claims 1 to 7, characterized in that: Further comprising a sealing ring one (102); The front panel (101) is a box cover-shaped structure with a first annular boss arranged on the rear side surface, the front and rear ends of the focal plane assembly shell (117) are both open, and the front end is sleeved on the first annular boss to be detachably and fixedly connected with the front panel (101) to form a cavity with an open rear end; A second annular boss coaxial with the first annular boss is arranged on the rear side surface of the front panel (101) and located inside the first annular boss, and the position and shape of the second annular boss are matched with the position and shape of the front end surface of the detector pre-welding assembly; A sealing ring groove one is arranged on the rear end surface of the second annular boss and located in contact with the front end surface of the detector pre-welding assembly, and the sealing ring one (102) is arranged in the sealing ring groove one to achieve circumferential sealing between the front end surface of the detector pre-welding assembly and the front panel (101). The sealing ring one (102) is a metal sealing ring.

9. The space optical camera focal plane and electronic control assembly capable of preventing electronic components from causing molecular pollution to a detector target surface according to claim 8, characterized in that: Further comprising a plurality of trimming pads (113); The plurality of trimming pads (113) are evenly distributed between the focal plane circuit board (114) and the front panel (101) along the periphery of the front side surface of the focal plane circuit board (114), the height of the trimming pad (113) in the front-rear direction is equal to the size of the gap between the focal plane circuit board (114) and the front panel (101), and the focal plane circuit board (114), the trimming pad (113) and the front panel (101) are detachably and fixedly connected; the trimming pad (113) is used to reduce the installation stress borne by the focal plane circuit board (114) when the focal plane circuit board (114) is connected with the front panel (101).

10. A method for assembling the focal plane of a space optical camera with the electronic control assembly, which can prevent the electronic assembly from causing molecular contamination to the detector target surface, according to any one of claims 1 to 9, characterized in that, The method comprises the following steps: Step 1: vacuum degassing treatment is performed on all the components to be assembled except the detector (109); Step 2: the detector (109) and the components to be assembled included in the detector pre-welding assembly which have been subjected to the vacuum degassing treatment in step 1 are assembled to complete the assembly of the detector pre-welding assembly; During the assembly process, the detector pressing plate (106) is constantly polished until the rear end surface of the detector (109) is tightly attached to the step surface of the stepped inner hole of the detector base (111); Step 3: The probe welding pre-assembly in step 2 is detachably fixed and mounted on the focal plane circuit board (114) treated by vacuum degassing in step 1, and the pins on the rear end face of the probe (109) are electrically connected and welded with the focal plane circuit board (114); Step 4: The probe welding pre-assembly in step 3, which is detachably fixed and mounted on the focal plane circuit board (114) and whose rear end face pins are electrically connected and welded with the focal plane circuit board (114), is detachably fixed with the front panel (101) treated by vacuum degassing in step 1, and when connected, the front end face of the probe welding pre-assembly is circumferentially sealed and connected with the front panel (101); Step 5: The heat transfer boss on the lower end front side of the heat transfer plate (115) treated by vacuum degassing in step 1 is passed through the through slot provided on the focal plane circuit board (114) which is detachably fixed with the front panel (101) in step 4, so that the heat transfer boss contacts the rear end face of the probe (109); then the heat transfer plate (115) is detachably fixed with the front panel (101), completing the installation of the heat transfer plate (115); Step 6: The focal plane assembly housing (117) treated by vacuum degassing in step 1 is sleeved on the heat transfer plate (115), the focal plane circuit board (114) and the probe welding pre-assembly connected with the front panel (101) in step 5, wherein the lower end of the heat transfer plate (115), the focal plane circuit board (114) and the probe welding pre-assembly are located inside the focal plane assembly housing (117), and the upper end of the heat transfer plate (115) protrudes from the notch provided on the front end of the focal plane assembly housing (117) above, for external heat pipe; then the focal plane assembly housing (117) is detachably fixed with the front panel (101), completing the assembly of the focal plane assembly (01); Step 7: The components to be assembled in the electric control assembly (02) treated by vacuum degassing in step 1 are assembled with the focal plane assembly (01) assembled in step 6, specifically: First, after the electric control assembly circuit boards to be assembled treated by vacuum degassing in step 1 are positioned by the stopper and arranged in a stacked manner along the front and rear directions with the focal plane circuit board (114) in the focal plane assembly (01) assembled in step 6; Then, each adjacent two electric control assembly circuit boards in the stacked arrangement and the electric control assembly circuit board at the front end are connected by the circuit board connector, and the electric control assembly circuit boards and the focal plane circuit board (114) are connected by the stud; Finally, the electric control assembly housing treated by vacuum degassing in step 1 is sleeved outside the connected electric control assembly circuit boards, and the electric control assembly housing is connected with the focal plane assembly housing (117) in the focal plane assembly (01) assembled in step 6; The assembly of the focal plane and the electric control assembly is completed.

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