System and method for integrated dual side cooling of power modules of inverter

Abstract

The invention relates to a system and method for integrated bilateral cooling of a power module of an inverter. A system for an electric vehicle includes: an inverter housing including an inner wall, a first channel, and an outer surface; and a heat sink coupled to an outer surface of the inverter housing, the heat sink including a second channel; wherein a first passage in the inverter housing and a second passage in the heat sink define a cooling circuit, and wherein the first passage is fluidly connected to the second passage for coolant to pass through the cooling circuit.

Description

Technical Field

[0001] Various embodiments of the present disclosure relate generally to inverter cooling systems, and more particularly, to systems and methods for integrated double-sided cooling of power modules of an inverter. Background Art

[0002] The inverter system may include a power module, an inverter housing, and a printed circuit board ("PCB"). Thermal load management of the inverter system may be necessary to improve the performance and reliability of the system. A cooling loop may be used to transfer heat from the power module to cool the power module. Improper cooling of the power module may result in improper operation of the inverter system.

[0003] The present disclosure is directed to overcoming one or more of these challenges described above. Summary of the invention

[0004] In some aspects, the technology described herein relates to a system for an electric vehicle, the system comprising: an inverter housing comprising an inner wall, a first channel, and an outer surface; and a radiator coupled to the outer surface of the inverter housing, the radiator comprising a second channel; wherein the first channel in the inverter housing and the second channel in the radiator define a cooling circuit, and wherein the first channel is fluidly connected to the second channel to allow coolant to pass through the cooling circuit.

[0005] In some aspects, the technology described herein relates to a system, wherein the cooling circuit further includes two connecting channels connecting the first cooling channel and the second cooling channel.

[0006] In some aspects, the technology described herein relates to a system wherein the two connecting channels are in the heat sink.

[0007] In some aspects, the technology described herein relates to a system further comprising: an inverter housing cover, wherein the first channel is defined by an inner wall of the inverter housing and the inverter housing cover.

[0008] In some aspects, the technology described herein relates to a system wherein the heat sink is coupled to the inverter housing by friction stir welding.

[0009] In some aspects, the technology described herein relates to a system further comprising: a gasket fluidly sealing the heat sink to the inverter housing.

[0010] In some aspects, the technology described herein relates to a system wherein the heat sink further includes cooling fins in the second channel.

[0011] In some aspects, the technology described herein relates to a system wherein the inverter housing further includes a heat sink in the first channel.

[0012] In some aspects, the technology described herein relates to a system, wherein the inverter includes: the inverter housing, the heat sink, and a power module coupled to the inverter housing, the power module configured to convert direct current into alternating current, wherein the heat sink is configured to cool the power module.

[0013] In some aspects, the technology described herein relates to a vehicle including an inverter described herein.

[0014] In some aspects, the technology described herein relates to an inverter comprising: a housing comprising a first cooling channel; and a heat sink comprising a second cooling channel, wherein the heat sink is coupled to the housing, wherein the first cooling channel and the second cooling channel provide a cooling circuit for the inverter.

[0015] In some aspects, the technology described herein relates to an inverter, wherein the first cooling channel includes a heat sink.

[0016] In some aspects, the technology described herein relates to an inverter, wherein the second cooling channel includes a heat sink.

[0017] In some aspects, the technology described herein relates to an inverter, wherein the heat sink is coupled to the housing by welding.

[0018] In some aspects, the technology described herein relates to an inverter, wherein the cooling circuit further includes two connecting channels connecting the first channel and the second channel.

[0019] In some aspects, the technology described herein relates to a system comprising: an inverter configured to convert direct current from a battery into alternating current to drive an electric motor, the inverter comprising: a power module; an inverter housing coupled to the power module, the inverter housing comprising a first channel; an inverter housing cover covering the first channel; and a heat sink coupled to the inverter housing, the heat sink comprising a second channel and two connecting channels, wherein the first channel is fluidly connected to the second channel via the two connecting channels so that a coolant passes through the inverter to cool the power module.

[0020] In some aspects, the technology described herein relates to a system wherein the first channel includes a heat sink.

[0021] In some aspects, the technology described herein relates to a system wherein the second channel includes a heat sink.

[0022] In some aspects, the technology described herein relates to a system wherein the heat sink is coupled to the inverter housing by welding.

[0023] In some aspects, the technology described herein relates to a system wherein the inverter further comprises: a printed circuit board on a side of the heat sink opposite the inverter housing cover.

[0024] Additional objects and advantages of the disclosed embodiments will be set forth in part in the following description and in part will be apparent from the description or may be learned by practice of the disclosed embodiments. Objects and advantages of the disclosed embodiments will be realized and obtained by the elements and combinations particularly pointed out in the appended claims. It should be understood that both the foregoing general description and the following detailed description are exemplary and illustrative only and are not limitations of the disclosed embodiments claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate various exemplary embodiments and, together with the description, serve to explain the principles of the disclosed embodiments.

[0026] Figure 1 An exemplary system infrastructure for a vehicle is shown, including a combined inverter and converter including an inverter package, according to one or more embodiments.

[0027] Figure 2 An exemplary inverter package including a cooling loop according to one or more embodiments is shown.

[0028] Figure 3 An exemplary inverter package including a cooling circuit having first and second cooling channels according to one or more embodiments is shown.

[0029] Figure 4 A cross-sectional view of an exemplary inverter package including a cooling circuit having first and second cooling channels according to one or more embodiments is shown.

[0030] Figure 5 An exploded view of an exemplary inverter package including a cooling circuit having first and second cooling channels according to one or more embodiments is shown.

[0031] Fig. 6A A heat sink and an inverter housing are shown according to one or more embodiments.

[0032] Figure 6B A heat sink is shown coupled to an inverter housing according to one or more embodiments.

[0033] Figure 6C An inverter housing, a printed circuit board, a heat sink, and an inverter housing cover are shown according to one or more embodiments.

[0034] Fig.6D A housing cover and an exemplary inverter package are shown according to one or more embodiments.

[0035] Fig. 7A An exemplary inverter package including a cooling loop according to one or more embodiments is shown.

[0036] Figure 7B An exemplary heat sink coupled to coolant channels in an inverter package is shown in accordance with one or more embodiments.

[0037] Figure 8 A top view of an exemplary inverter housing coupled to a heat sink is shown in accordance with one or more embodiments.

[0038] Fig. 9 An exemplary heat sink is shown in accordance with one or more embodiments. DETAILED DESCRIPTION

[0039] The foregoing general description and the following detailed description are merely exemplary and illustrative, and are not limitations on the claimed features. As used herein, the terms "comprises," "having," "including," or other variations thereof are intended to cover non-exclusive inclusions, such that a process, method, article, or device that includes a series of elements includes not only those elements, but may also include other elements that are not explicitly listed or inherent to such a process, method, article, or device. In this disclosure, unless otherwise stated, relative terms such as "about," "substantially," and "approximately" are used to indicate a possible variation of ±10% of the stated value. In this disclosure, unless otherwise stated, any numerical value may include a possible variation of ±10% of the stated value.

[0040] The terms used below may be interpreted in their broadest reasonable manner, even though the terms are used in conjunction with the detailed description of certain specific examples of the present disclosure. Indeed, certain terms may even be emphasized below; however, any term intended to be interpreted in any restrictive manner will be so clearly and specifically defined in this detailed description section. For example, in the context of the present disclosure, a switching device may be described as a switch or a device, but may refer to any device used to control power flow in a circuit. For example, a switch may be, for example, a metal oxide semiconductor field effect transistor (MOSFET), a bipolar junction transistor (BJT), an insulated gate bipolar transistor (IGBT), or a relay, or any combination thereof, but is not limited thereto.

[0041] Various embodiments of the present disclosure relate generally to inverter cooling systems, and more particularly, to systems and methods for integrated double-sided cooling of power modules of an inverter.

[0042] An inverter, such as one used to drive an electric motor in an electric vehicle, is responsible for converting high voltage direct current ("HVDC") into alternating current ("AC") to drive the electric motor. The inverter may include a housing, a power module, a printed circuit board ("PCB"), and a cooling circuit (also referred to as a cooling system). The power module may include one or more silicon carbide ("SiC")-based power switches that provide relatively high power density and efficiency required to extend battery range and performance. The power module may include circuits and components configured to convert DC current from an electric vehicle battery into AC current, which may be used in an electric motor that drives a propulsion system. The housing of the inverter may structurally connect the components of the inverter together. The PCB may include a control and gate driver board. The control and gate driver board may also include active components, such as a power supply, an active discharge, and a gate driver. As described herein, the cooling circuit of the inverter may transfer waste heat (e.g., heat generated during operation) from the system to a coolant associated with a fluid circuit, and transfer the fluid to a radiator, a heat exchanger, or other engine components.

[0043] The inverter system may have a high ambient temperature during operation. The performance, assembly process and time, and reliability of the power module of the inverter system may all depend on the built-in coolant structure. The cooling structure of the inverter system can improve performance and reliability. Some inverter systems utilize thermal management methods to cool the active components of the power module. For example, some thermal management methods may include connecting a heat sink to a first side and a second side of the power module. By utilizing multiple heat sinks, the manufacturing process of the system may be more complicated, and this may lead to increased costs for assembly and materials. In addition, due to the increased complexity leading to more errors, multiple heat sinks may lead to an increased scrap rate of components (e.g., power modules) during construction. In addition, due to the increase in the number of sealed components in the inverter, an inverter system using two heat sinks may have an increased risk of coolant leaking in the inverter system.

[0044] One or more embodiments of the systems described herein can provide a cooling circuit (e.g., a cooling system) within the inverter. The cooling circuit can include a first channel built into the inverter housing, the inverter housing including a housing cover as a wall defining the side of the first channel. The cooling circuit can include a second channel mounted directly and sealed inside the inverter housing (e.g., the second channel is defined by a heat sink). The first channel and the second channel can include a heat sink structure to increase cooling.

[0045] One or more embodiments of the systems described herein can provide thermal management of power modules with multiple cooling elements, thermal management of power modules, and thermal management of the internal temperature of the inverter. One or more embodiments can reduce the complexity and cost of assembling inverter housing components (e.g., inverter covers) and the scrap rate of components within the inverter system. One or more embodiments can provide a single (only one) radiator within the cooling system. A single radiator can reduce complexity and reduce the chance of coolant leakage within the inverter system. One or more embodiments of the systems described herein can allow direct sintering of power modules with inverter housings.

[0046] One or more embodiments of the systems described herein can reduce the risk of coolant leaking into the interior of the inverter by integrating coolant channels within the housing geometry while maintaining fluid flow as much as possible over the external area of ​​the inverter housing. One or more embodiments of the systems described herein can include a cooling circuit with pin-shaped heat sinks attached to dissipate heat into the coolant flowing through the cooling circuit. The pin-shaped heat sinks can connect the inverter housing cover to the inverter housing. In addition, the pin-shaped heat sinks can be attached to the cover of the inverter housing from the outside and can be pressed against the housing for heat conduction.

[0047] One or more embodiments of the systems described herein may include a cooling circuit including a second channel defined by a heat sink. The heat sink may be made of a different material than the inverter housing and may have better thermal conductivity. The heat sink may be hermetically sealed to the inverter housing.

[0048] Figure 1 An exemplary system infrastructure for a vehicle according to one or more embodiments is shown, the exemplary system infrastructure including a combined inverter and converter including an inverter packaging system. In the context of the present disclosure, the combined inverter and converter may be referred to as an inverter. Figure 1 As shown, the electric vehicle 100 may include an inverter 110, a motor 190, and a battery 195. The inverter 110 may include a component that receives power from an external source and outputs power to charge the battery 195 of the electric vehicle 100. The inverter 110 may include an inverter package 200. The inverter 110 may, for example, convert DC power from the battery 195 in the electric vehicle 100 into AC power to drive the motor 190 of the electric vehicle 100, but the embodiment is not limited thereto. The inverter 110 may be bidirectional and may convert DC power into AC power, or, for example, convert AC power into DC power during regenerative braking. The inverter 110 may be a three-phase inverter, a single-phase inverter, or a multi-phase inverter.

[0049] Figure 2 An exemplary inverter package 200 including a cooling loop 214 according to one or more embodiments is shown. The inverter package 200 may include an inverter housing 204, a heat sink 202, a printed circuit board ("PCB") 206, and a power module 208 (e.g., one or more power modules, e.g., three power modules, e.g., six power modules). The inverter package 200 may include a first cover 210, a second cover 212, a cooling loop 214, a first open space 216, and a second open space 217. The inverter housing may be configured to fix the power module 208, the cooling loop 214, and the PCB 206. For example, the power module 208 may be sintered to the inverter housing 204. The first cover 210 may be located on a first top side of the inverter package 200, and the second cover 212 may be located on a second bottom side opposite to the first cover 210. The first open space 216 (e.g., a first gap) may be located within the inverter housing 204, between the second cover 212 and the PCB 206. A second open space 217 (eg, a second gap) may be located within the inverter housing 204 between the heat sink 202 and the PCB 206 .

[0050] The cooling circuit 214 may include an inlet 218, an outlet 220, a first side cooling channel 222, a second side cooling channel 224, and a connecting channel 230 (e.g., two connecting channels). The cooling circuit 214 may transfer waste heat (e.g., heat generated during operation) from the inverter package 200 to the coolant flowing through the cooling circuit 214, and transfer the fluid to a radiator, a heat exchanger, or other engine components. The flow of the coolant may be indicated by arrows in the cooling circuit 214. The inlet 218 may be located on a third side of the inverter package 200, between the first cover 210 and the second cover 212. The outlet 220 may be located on a fourth side of the inverter package 200, also between the first cover 210 and the second cover 212, and on a side of the inverter package 200 opposite to the third side.

[0051] The inlet 218 can be configured to receive coolant into the cooling circuit 214, while the outlet 220 can discharge the coolant from the cooling circuit 214. The first side cooling channel 222 can be formed by an inner wall 260 (eg, Figure 3 ) and the first cover 210 of the inverter housing 204. Therefore, the inner wall 260 defining the cavity in the inverter housing 204 and the surface 250 of the first cover 210 can define the first side cooling channel 222. The connection between the first cover 210 and the portion of the inverter housing 204 that defines the first side cooling channel 222 can be an airtight seal 232. For example, the airtight seal can be a friction stir welding seal, an ultrasonic welding seal, a brazing seal, or a gasket seal. The first side cooling channel 222 can have a substantially rectangular cross-section at the XC-ZC axis cross-section. In addition, as will be discussed in more detail below, the first side cooling channel 222 may include heat sinks 238 extending in the ZC direction (as shown in FIG. 1 ). Figure 3 shown).

[0052] The second side cooling channel 224 can be defined by a radiator 202 having a hollow interior or a hollow interior with pin-shaped fins or corrugated fins to increase the heat exchange surface with the cooling fluid. The interior of the radiator 202 can be configured to allow coolant to flow from the first end 231a of the radiator 202 to the second end 231b of the radiator 202. As will be discussed in more detail below, the first end 231a and the second end 231b of the radiator 202 can be structures that fluidly couple the radiator 202 to the inverter housing 204. The radiator 202 can have a first surface 252 and a second surface 254 opposite the first surface 252 along the ZC axis.

[0053] For example, the first surface 252 of the heat sink 202 can be coupled to the inverter housing 204 (e.g., the outer surface 226) and / or the power module 208 via a thermal interface material (TIM). For example, the TIM can include an epoxy, silicone, or other elastomeric product. For example, the TIM can be provided as a dielectric pad, a heat sink, a thermal compound, a thermal gel (e.g., a dispensable gel), a thermal tape, a phase change material, a gap pad, a thermal grease, or a replaceable thermal material. An advantage of the inverter package 200 with a TIM can be that the heat sink 202 can have a stronger and / or more durable connection to the inverter housing 204 and / or the power module 208. The heat sink 202 can be coupled to the copper plate 746 (e.g., via an airtight seal, for example). Figure 7B shown).

[0054] The power module 208 (e.g., three power modules) can be located between the heat sink 202 and the inverter housing 204. The power module 208 can be in contact with the first surface 252 of the heat sink 202. The power module 208 can include one or more silicon carbide-based power devices that provide relatively high power density and efficiency required to extend battery range and performance. The power module 208 may include circuits and components configured to convert direct current (DC) from the battery 195 into alternating current (AC) current that can be used in a drive motor that can drive the wheels. The power module 208 can be mounted on one or more power board assemblies.

[0055] The power module 208 may include a combination of transistors, diodes, metal oxide semiconductor field effect transistors (MOSFETs), insulated gate bipolar transistors (IGBTs), and silicon controlled rectifiers (SCRs). The power module 208 may include a combination of transistors that may allow for the ability to convert current from the battery 195 through the direction of the drive motor. Additionally, the power module 208 may include a device for inverting applications, such as converting direct current to alternating current.

[0056] Portions of the inverter housing 204 may transfer heat to the coolant within the first side cooling passage 222. The power module 208 along with portions of the inverter housing 204 may transfer heat to the coolant within the second side cooling passage 224 of the heat sink 202.

[0057] The second surface 254 of the heat sink 202 may be adjacent to the second open space 217. The heat sink 202 may be configured to transfer heat to the second side cooling channels 224 located within the heat sink 202. For example, heat may be dissipated from the PCB 206, pass through the second open space 217, and be received by the heat sink 202. The heat may then be transferred to the coolant within the second side cooling channels 224.

[0058] The second side cooling channel 224 may also include a connecting channel 230 (eg, two connecting channels) including a first end 231a and a second end 231b of the heat sink 202. The connecting channel 230 may be configured to fluidically connect the first side cooling channel 222 to the second side cooling channel 224. Fig. 7A and Figure 7B As described in more detail in , the connecting channel 230 may include a hollow chamber portion perpendicular to the first side cooling channel 222 such that the coolant in the hollow chamber portion flows in the ZC axial direction.

[0059] The inverter housing 204 may include a fixing point 228 (e.g., one or more fixing points, e.g., two fixing points). The fixing point 228 may be threaded and configured to receive a screw that couples the PCB 206 to the inverter housing 204. The fixing point 228 may be located in a position that reduces mechanical stress on the PCB 206 and minimizes scrap during use of the inverter package 200. The first open space 216 may be located between a second surface of the PCB 206 and the second cover 212, the second surface of the PCB 206 being opposite to the first surface of the PCB 206.

[0060] Figure 3 An exemplary inverter package 200 including a cooling circuit 214 according to one or more embodiments is shown. An inner wall 260 of the inverter housing 204, a surface 262 of the inverter housing 204, and a surface 250 of the first cover 210 may define a first side cooling channel 222. From the perspective of the XC-YC plane, the inner wall 260 may correspond to the shape of the first cover 210. The inner wall 260 may include two openings corresponding to the inlet 218 and the outlet 220 of the inverter housing 204. The surface 262 of the inverter housing 204 may include an opening (e.g., two openings) corresponding to the connecting channel 230.

[0061] The first side cooling channel 222 may include heat sinks 238 (e.g., twelve pin-shaped heat sinks, e.g., thirty-six pin-shaped heat sinks). The heat sink 238 may be configured in an extruded, flat, corrugated, pin-shaped, folded, bonded, actively fanned, stamped, or cross-cut configuration. The heat sink 238 may extend from a surface 262 of the inverter housing 204 to a surface 250 of the first cover 210, and the surface 262 may be positioned opposite the first cover 210. The heat sink 238 may be, for example, three groups of four by four heat sinks. Each group of heat sinks 238 may be located opposite the power module 208 within the inverter package 200. The above Figure 3 The elements described in may be similar in structure and function to Figure 2 The corresponding elements described in .

[0062] Figure 4The cooling circuit 214 of the exemplary inverter package 200 according to one or more embodiments is shown. The arrows located within the cooling circuit 214 may indicate the flow of the coolant through the cooling circuit 214. The coolant may enter the cooling circuit through the inlet 218. The coolant may continue to flow through the first side cooling channel 222 and through the second side cooling channel 224 along the flow path of the arrow. The coolant may flow from the inlet 218 through the first side cooling channel 222 in the YC axis direction and out through the outlet 220. The coolant may also flow substantially perpendicular to the first side cooling channel 222 in the ZC axis direction after entering through the inlet 218 and entering the first side cooling channel 222 to enter the second side cooling channel 224 through the connecting channel 230.

[0063] The coolant may then flow through the second side cooling channel 224 in the YC axis direction and then flow substantially perpendicular to the second side cooling channel 224 in the ZC axis direction and merge with the first side cooling channel 222 by exiting through the outlet of the connecting channel 230. As the coolant flows through the cooling circuit 214, heat may flow into the coolant from the inverter housing 204, the power module 208, the PCB 206, and the heat sink 202. The heated coolant may then be discharged from the cooling circuit 214 through the outlet 220.

[0064] Figure 5 An exploded view of an exemplary inverter package 200 including a cooling circuit having first and second cooling channels according to one or more embodiments is shown. The inverter package 200 may include an inverter housing 204, a first cover 210, a second cover 212, a power module 208, a heat sink 202, and a PCB 206. The inverter housing 204 may be configured to receive and couple to the first cover 210 and the second cover 212. The first cover 210, together with the inverter housing 204 (e.g., the inner wall 260 and the surface 262), may define a first coolant channel (e.g., Figure 2 ) as shown in the first side cooling channel 222 .

[0065] FIG. 6A to FIG. 6D An assembly operation of an exemplary inverter package 200 including a cooling loop 214 is shown in accordance with one or more embodiments.

[0066] Fig. 6A 2 and an inverter housing 204 according to one or more embodiments are shown. The heat sink 202 and the inverter housing 204 can be combined to form the inverter package 200. As shown by the arrows, the heat sink 202 can be coupled to the inverter housing 204. Before coupling the heat sink 202, the power module 208 can be sintered to the inverter housing 204. When installed, the first surface (e.g., Figure 2The first surface 252 shown in FIG. 2 may contact the surface 226 of the inverter housing 204 and the power modules 208 (eg, three power modules). The connection of the heat sink 202 to the inverter housing 204 may be at Figure 6B Further described in .

[0067] Figure 6B A heat sink 202 is shown mounted to an inverter housing 204 in accordance with one or more embodiments. Figure 6B 2 and the inverter housing 204 are shown once coupled (e.g., installed). Once the heat sink 202 and the inverter housing 204 are aligned, the coupling can be performed. Alignment can include, for example, aligning the first end 231a with the opening 631a in the surface 262 of the inverter housing 204. Alignment can also include, for example, aligning the second end 231b with the opening 631b in the surface 262 of the inverter housing 204. Figure 8 The heat sink 202 may include fixing points 634 (eg, four fixing points) configured to receive screws and securely fix the heat sink 202 to the inverter housing 204.

[0068] The fixing point 634 may include a mounting hole. The fixing point 634 may be circular or any polygonal shape. The fixing point 634 may have a threaded interior configured to receive a screw. For example, the heat sink 202 may include a fixing point 634 on each of the four corners of the heat sink 202. The heat sink 202 may be coupled to the inverter housing 204 by a set of screws located at the fixing point 634. For example, before the heat sink 202 is fixed to the inverter housing 204, a washer (e.g., washer 740) may be placed in place to surround the end 231a and the end 231b.

[0069] Figure 6C An inverter housing 204, a PCB 206, a heat sink 202, and a second cover 212 according to one or more embodiments are shown. The heat sink 202 can be mounted to the inverter housing 204, and the PCB 206 and the second cover 212 can be mounted to the inverter housing 204. The heat sink 202 can be mounted to the inverter housing 204, and the PCB 206 can be mounted to the inverter housing 204. The PCB 206 can include a fixing point 228 (e.g., two fixing points). The fixing point 228 can include a mounting hole. The fixing point 228 can be circular or any polygon. The fixing point 228 can be threaded and configured to receive a screw (not shown) that couples the PCB 206 to the inverter housing 204. The fixing point 228 can be aligned with an extension 234 (e.g., two extensions) of the inverter housing 204. The extension 234 can be cylindrical and configured to receive a screw.

[0070] PCB 206 can be coupled to inverter housing 204, and second cover 212 can be mounted to inverter housing 204. For example, second cover 212 can include fixing points 642 (e.g., two fixing points). For example, second cover 212 can include fixing points 642 (e.g., a first fixing point along a first edge of second cover 212 and a second fixing point along a second edge of second cover 212, the second edge being adjacent to and connected to the first edge of second cover 212). Fixing points 642 can include mounting holes. Fixing points 642 can be circular or any polygonal shape. Fixing points 634 can be threaded and configured to receive screws that couple second cover 212 to inverter housing 204.

[0071] Fig.6D A housing cover (e.g., first cover 210) and an exemplary inverter package 200 according to one or more embodiments are shown. The first cover 210 can be mounted to the inverter housing 204. For example, the inverter housing 204 can include a protruding surface 644 extending from a surface of the inverter housing 204. The inner wall 260 can correspond to the protruding surface 644. The protruding surface 644 can extend around the first side cooling channel 222 located in the inverter housing 204. The protruding surface 644 can receive the first cover 210. The first cover 210 can be friction stir welded (e.g., in Figure 2 The first cover 210 is fixed to the raised surface 644 of the inverter housing at the airtight seal 232 shown. The surface 250 of the first cover 210 facing the inverter housing 204 can be configured to define the inner wall of the first side cooling channel 222.

[0072] Fig. 7A An exemplary inverter package 200 including a cooling loop 214 is shown in accordance with one or more embodiments. Fig. 7A Shows Figure 2 2 is a cross-section of the inverter package 200 described in . The inverter package 200 may include a connection channel 230 (eg, two connection channels). The connection channel 230 may be defined by the ends 231 a , 231 b of the heat sink 202 .

[0073] Figure 7B An exemplary heat sink 202 coupled to an inverter housing 204 according to one or more embodiments is shown. The heat sink 202 may, for example, define a second side cooling channel 224 and a connecting channel 230 (e.g., two connecting channels). The second side cooling channel 224 may include a heat sink 744. The heat sink 744 may be configured to be extruded, flat, corrugated, pin-shaped, folded, bonded, actively fanned, stamped, or cross-cut. The heat sink 744 may, for example, be dispersed with similar spacing along the YC axis. The heat sink 744 may, for example, extend from one side of the heat sink 202 and extend half the distance of the second side cooling channel 224 in the ZC direction.

[0074] The copper plate 746 may be located between the heat sink 202 and the inverter housing 204. The copper plate 746 may remove heat from the power module 208 (see Figure 2 ) and the inverter housing 204 to the coolant within the second side cooling channel 224.

[0075] The inverter housing 204 may also include a coolant inlet 742. The coolant inlet 742 portion of the inverter housing 204 may be formed by a brazing or pressing process. The coolant inlet 742 may be shaped to receive the ends 231a, 231b of the radiator 202. For example, from the perspective of the XC-YC plane, the coolant inlet 742 may be a rectangle with rounded corners. In addition, the coolant inlet 742 may include a gasket 740 or an O-ring surrounding the connecting channel 230. The gasket 740 may fluidly seal the connection between the inverter housing 204 and the radiator 202. Fig. 7A and Figure 7B The elements described in may be similar in structure and function to Figure 2 The corresponding elements described in .

[0076] Figure 8 A top view of an exemplary inverter housing 204 coupled to a heat sink 202 according to one or more embodiments is shown. For example, ends (e.g., ends 231a, 231b) of the heat sink 202 can be welded to openings (e.g., openings 631a, 631b) of the inverter housing 204. The openings 631a, 631b can be configured to fluidly couple the first side cooling passage 222 of the inverter housing 204 to the connecting passage 230.

[0077] Fig. 9 An exemplary heat sink according to one or more embodiments is shown.The heat sink 202 can have a first surface 252 (eg, copper plate 746) and a second surface 254 opposite the first surface 252 along the ZC axis.

[0078] The copper plate 746 may include pin-shaped fins or corrugated fins or a die-cast structure with different cooling structures (pins, corrugated pins, fins, etc.). The material of the heat sink 202 (including the copper plate 746) may be selected based on the thermal properties required to draw heat away from the power module 208. For example, the heat sink 202 may include an aluminum alloy or copper. The heat sink 202 may be formed by using a hard or soft TIM 760 (such as Fig. 7A 2 (shown) in contact with the power module 208. The second surface 254 may be a heat sink cap constructed as a sheet metal component.

[0079] One or more embodiments of the system described herein can provide thermal management of power modules with multiple cooling elements, thermal management of power modules, and thermal management of the internal temperature of the inverter. One or more embodiments can reduce the complexity and cost of assembling inverter housing components (e.g., inverter covers) and the scrap rate of components within the inverter system.

[0080] Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. It is intended that the specification and examples be considered exemplary only, with the true scope and spirit of the invention being indicated by the following claims.

Claims

1. A system for an electric vehicle, the system comprising: An inverter housing, the inverter housing comprising an inner wall, a first channel and an outer surface; as well as a heat sink coupled to an outer surface of the inverter housing, the heat sink comprising a second channel; wherein the first channel in the inverter housing and the second channel in the radiator define a cooling circuit, and Wherein, the first passage is fluidly connected to the second passage to allow coolant to pass through the cooling circuit.

2. The system according to claim 1, wherein: The cooling circuit further includes two connecting passages connecting the first passage and the second passage.

3. The system according to claim 2, wherein: The two connecting channels are in the radiator.

4. The system according to claim 1, further comprising: Inverter housing cover, The first channel is defined by an inner wall of the inverter housing and the inverter housing cover.

5. The system according to claim 1, wherein: The heat sink is coupled to the inverter housing by friction stir welding.

6. The system according to claim 1, further comprising: A gasket fluidly seals the heat sink to the inverter housing.

7. The system according to claim 1, wherein: The heat sink further includes cooling fins in the second channel.

8. The system according to claim 1, wherein: The inverter housing further includes a heat sink in the first channel.

9. An inverter comprising the system according to claim 1, wherein: The inverter comprises: The inverter housing; the radiator; and a power module coupled to the inverter housing, the power module being configured to convert direct current into alternating current, Wherein, the heat sink is configured to cool the power module.

10. A vehicle comprising the inverter according to claim 9.

11. An inverter, comprising: a housing including a first cooling passage; as well as a radiator including a second cooling channel, wherein the radiator is coupled to the housing, The first cooling channel and the second cooling channel provide a cooling circuit for the inverter.

12. The inverter according to claim 11, wherein: The first cooling channel includes cooling fins.

13. The inverter according to claim 11, wherein: The second cooling channel includes cooling fins.

14. The inverter according to claim 11, wherein: The heat sink is coupled to the housing by welding.

15. The inverter according to claim 11, wherein: The cooling circuit further includes two connecting channels connecting the first cooling channel and the second cooling channel.

16. A system, comprising: An inverter configured to convert direct current from a battery into alternating current to drive a motor, wherein the inverter comprises: Power module; an inverter housing coupled to the power module, the inverter housing comprising a first channel; an inverter housing cover, the inverter housing cover covering the first passage; and a radiator coupled to the inverter housing, the radiator comprising a second channel and two connecting channels, The first channel is fluidically connected to the second channel through the two connecting channels, so that the coolant passes through the inverter to cool the power module.

17. The system of claim 16, wherein: The first channel includes cooling fins.

18. The system of claim 16, wherein: The second channel includes cooling fins.

19. The system of claim 16, wherein: The heat sink is coupled to the inverter housing by welding.

20. The system of claim 16, wherein: The inverter further comprises: A printed circuit board is provided on a side of the heat sink opposite to the inverter housing cover.

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