OLED display mother board, OLED display panel and preparation method thereof

Abstract

The invention discloses an OLED display mother board, an OLED display panel and a preparation method of the OLED display mother board, and the OLED display mother board comprises a bearing substrate; the plurality of display units are arranged on one side of the bearing substrate; the supporting pieces are arranged on the side, provided with the multiple display units, of the bearing substrate, orthographic projections of the display units on the bearing substrate and orthographic projections of the supporting pieces on the bearing substrate are not overlapped, and the orthographic projections of the display units on the bearing substrate and the orthographic projections of the supporting pieces on the bearing substrate are perpendicular to each other in the direction perpendicular to the bearing substrate. The height of the supporting piece is smaller than or equal to that of the display unit; the acid-proof film is arranged on the side, comprising the multiple display units and the multiple supporting pieces, of the bearing substrate, and part of the side face of the bearing substrate is covered with the acid-proof film.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an OLED display motherboard, an OLED display panel and a preparation method thereof. Background Art

[0002] At present, in the display field, OLED (Organic Light-Emitting Diode) has the advantages of self-luminescence, fast response, wide viewing angle, high brightness, bright colors, and light weight compared to LCD (Liquid Crystal Display), and is regarded as the next generation display technology.

[0003] Among them, in the preparation of OLED display panels, the technology of rigid substrate plus flexible packaging has been enthusiastically sought after by major panel manufacturers due to its huge advantages of high strength and low cost. However, the OLED display motherboard prepared by this technology is easily damaged during the chemical thinning process, resulting in a low yield. Summary of the invention

[0004] The embodiments of the present application provide an OLED display motherboard, an OLED display panel and a method for manufacturing the same, so as to improve the technical problem that the OLED display motherboard is easily damaged during the chemical thinning process and has a low yield.

[0005] According to a first aspect of an embodiment of the present application, an OLED display motherboard is provided, comprising:

[0006] A carrier substrate;

[0007] A plurality of display units are arranged on one side of the carrier substrate;

[0008] A plurality of support members are arranged on one side of the carrier substrate including the plurality of display units, wherein the orthographic projections of the display units on the carrier substrate and the orthographic projections of the support members on the carrier substrate do not overlap each other, and in a direction perpendicular to the carrier substrate, the height of the support members is less than or equal to the height of the display units;

[0009] The acid-proof film is arranged on one side of the carrier substrate including the plurality of display units and the plurality of support members, and the acid-proof film covers a portion of the side surface of the carrier substrate.

[0010] In some embodiments, the carrier substrate includes a plurality of cutting lanes configured to cut the OLED display motherboard, the cutting lanes are located in the spacing area of ​​the display unit, and the orthographic projection of the support member on the carrier substrate is located outside the cutting lanes.

[0011] In some embodiments, the supporting substrate includes a first area and a second area arranged around the first area, and the plurality of display units are arranged in the first area. The supporting members include a plurality of first supporting members arranged in the first area and a plurality of second supporting members arranged in the second area, wherein, in a direction perpendicular to the supporting substrate, a height of the plurality of first supporting members in the first area is equal to a height of the display unit, and a height of the plurality of second supporting members in the second area is less than a height of the display unit.

[0012] In some embodiments, in a direction extending from the first region to the second region, heights of the plurality of second support members disposed in the second region decrease sequentially.

[0013] In some embodiments, the display units are arranged in an array in the first region of the carrier substrate, a plurality of the first support members are distributed in spacing regions of a plurality of columns of the display units, and in the spacing regions, a plurality of the first support members are arranged parallel to the column direction.

[0014] In some embodiments, the first support member is a columnar support member or a strip support member.

[0015] In some embodiments, the width of the strip support is less than or equal to 2 mm; and / or

[0016] The diameter of the cross section of the columnar support member is less than or equal to 2 mm.

[0017] In some embodiments, the plurality of second support members include a plurality of first sub-support members close to the side edge of the carrier substrate, and / or a plurality of second sub-support members located at a plurality of top corners of the carrier substrate, wherein the plurality of first sub-support members are arranged in a direction parallel to the side edge of the carrier substrate.

[0018] In some embodiments, the first sub-support member is a columnar support member or a strip support member, wherein the width of the strip support member is less than or equal to 2 mm, and the diameter of the cross section of the columnar support member is less than or equal to 2 mm.

[0019] In some embodiments, the second sub-support member is a columnar support member.

[0020] In some embodiments, the support member is made of a photocurable material.

[0021] In some embodiments, the edge of the acid-proof film exceeds the edge of the supporting substrate by 1-2 mm.

[0022] In some embodiments, an adhesive layer is included, and the adhesive layer is disposed on a side of the carrier substrate and extends to a first surface of the acid-proof film, where the first surface is a surface of the acid-proof film close to the carrier substrate.

[0023] In some embodiments, the carrier substrate is a glass substrate.

[0024] According to a second aspect of the embodiments of the present application, an OLED display panel is provided, which is formed by cutting the OLED display motherboard.

[0025] In some embodiments, the OLED display panel includes a base substrate, and a driving circuit layer, a light emitting layer, and an encapsulation layer sequentially disposed on one side of the base substrate.

[0026] According to a third aspect of an embodiment of the present application, a method for preparing an OLED display panel is provided, comprising:

[0027] providing a carrier substrate;

[0028] forming a plurality of display units on one side of the carrier substrate;

[0029] forming a plurality of supporting members on one side of the carrier substrate including the plurality of display units;

[0030] Forming an acid-proof film on one side of the carrier substrate including the plurality of display units and the plurality of support members to obtain an OLED display motherboard to be cut;

[0031] The OLED display motherboard to be cut is subjected to thinning and cutting processes to obtain a plurality of OLED display panels.

[0032] In some embodiments, after the thinning process, the thickness of the carrier substrate of the OLED display motherboard to be cut is 100-300 μm.

[0033] The OLED display motherboard provided in the embodiment of the present application has a plurality of support members arranged on the carrier substrate of the OLED display motherboard. On the one hand, the plurality of support members arranged between the plurality of display units can increase the adhesion between the acid-proof film and the carrier substrate of the OLED display motherboard. On the other hand, the plurality of support members arranged in the edge area of ​​the carrier substrate can effectively reduce the obvious step difference between the acid-proof film and the carrier substrate. At the same time, the adhesion between the acid-proof film and the carrier substrate can also be increased, thereby effectively reducing the possibility of damage to the acid-proof film during the chemical thinning process, thereby improving the technical problem that the OLED display motherboard is easily damaged during the chemical thinning process and has a low yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A schematic structural diagram of a cross section of an OLED display motherboard in the related art provided by the present application;

[0035] Figure 2 A schematic structural diagram of a cross section of an OLED display motherboard provided in an embodiment of the present application;

[0036] Figure 3 A schematic top view of an OLED display motherboard provided in an embodiment of the present application;

[0037] Figure 4 A schematic top view of another OLED display motherboard provided in an embodiment of the present application;

[0038] Figure 5 A schematic top view of another OLED display motherboard provided in an embodiment of the present application;

[0039] Figure 6 A schematic top view of another OLED display motherboard provided in an embodiment of the present application;

[0040] Figure 7 A schematic top view of another OLED display motherboard provided in an embodiment of the present application;

[0041] Figure 8 A schematic top view of another OLED display motherboard provided in an embodiment of the present application;

[0042] Fig. 9 A schematic top view of another OLED display motherboard provided in an embodiment of the present application;

[0043] Fig.10 A schematic top view of another OLED display motherboard provided in an embodiment of the present application

[0044] Fig.11 A schematic top view of another OLED display motherboard provided in an embodiment of the present application;

[0045] Fig.12 A schematic top view of another OLED display motherboard provided in an embodiment of the present application;

[0046] Fig.13 A schematic top view of another OLED display motherboard provided in an embodiment of the present application;

[0047] Fig.14 A schematic top view of another OLED display motherboard provided in an embodiment of the present application;

[0048] Fig.15 A schematic top view of another OLED display motherboard provided in an embodiment of the present application;

[0049] Fig.16 A schematic top view of another OLED display motherboard provided in an embodiment of the present application;

[0050] Fig.17 A schematic structural diagram of a cross section of another OLED display motherboard provided in an embodiment of the present application;

[0051] Fig.18 A schematic diagram of a process for preparing an OLED display motherboard provided in an embodiment of the present application;

[0052] Fig.19 A schematic diagram of the structure of an OLED display panel provided in an embodiment of the present application;

[0053] Fig. 20 A schematic flow chart of a method for preparing an OLED display panel provided in an embodiment of the present application. DETAILED DESCRIPTION

[0054] In order to better understand the technical solutions provided by the embodiments of this specification, the technical solutions of the embodiments of this specification are described in detail below through the accompanying drawings and specific embodiments. It should be understood that the embodiments of this specification and the specific features in the embodiments are detailed descriptions of the technical solutions of the embodiments of this specification, rather than limitations on the technical solutions of this specification. In the absence of conflict, the embodiments of this specification and the technical features in the embodiments can be combined with each other.

[0055] In this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of more restrictions, the elements limited by the statement "comprise one..." do not exclude the existence of other identical elements in the process, method, article or equipment including the elements. The term "more than two" includes two or more than two situations.

[0056] In the related technologies, compared with the traditional rigid packaging and flexible packaging technologies, the hybrid technology using rigid substrate plus flexible packaging has the advantages of high strength and low cost, and is enthusiastically sought after by major panel manufacturers. Among them, for large and medium-sized OLED display panels, glass substrates are usually used as substrates. In the chemical thinning process of the prepared OLED display motherboard, concentrated sulfuric acid, hydrofluoric acid and other etching solutions are usually used to chemically thin the glass substrate of the OLED display motherboard. Therefore, it is necessary to protect the multiple display units on the OLED display motherboard. Usually, a layer of acid-proof film is coated on one side of the OLED display motherboard containing multiple display units, so as to use the acid-proof film to protect the multiple display units on the OLED display motherboard from etching.

[0057] However, during chemical thinning, Figure 1 As shown, there is a large gap between the acid-proof film 1 and the substrate 2 of the OLED display motherboard, and there is also an obvious step difference between the acid-proof film 1 and the substrate 2 of the OLED display motherboard in the edge area of ​​the OLED display motherboard, so the acid-proof film 1 has poor adhesion on the OLED display motherboard and is easily damaged during the chemical thinning process, which will cause damage to the OLED display motherboard 1.

[0058] In view of this, in the first aspect of the embodiment of the present application, as Figure 2 As shown, an OLED display motherboard is provided, comprising: a carrier substrate 10, a plurality of display units 20, a plurality of support members 30 and an acid-proof film 40, wherein the plurality of display units 20 are arranged on one side of the carrier substrate 10, the plurality of support members 30 are arranged on the side of the carrier substrate 10 including the plurality of display units 20, and the orthographic projections of the display units 20 on the carrier substrate 10 and the orthographic projections of the support members 30 on the carrier substrate 10 do not overlap each other, in a direction perpendicular to the carrier substrate 10, the height of the support members 30 is less than or equal to the height of the display units 20, the acid-proof film 40 is arranged on the side of the carrier substrate 10 including the plurality of display units 20 and the plurality of support members 30, and the acid-proof film 40 covers a portion of the side surface of the carrier substrate 10.

[0059] Specifically, in the present embodiment, the carrier substrate 10 includes a first surface, a second surface, and a side surface connecting the first surface and the second surface. A plurality of display units 20 and a plurality of support members 30 are disposed on the first surface of the carrier substrate 10. The acid-proof film 40 is also disposed on the first surface of the carrier substrate 10 and covers the plurality of display units 20 and the plurality of support members 30. At the same time, the acid-proof film 40 also covers a portion of the side surface of the carrier substrate 10. It should be noted that Figure 2 Only the relative position of the acid-proof film 40 is shown in the figure. In the actual preparation process, the edge of the acid-proof film 40 will not be as Figure 2As shown in FIG. 1 , the substrate 10 extends away from the supporting substrate 10 , but is attached to a partial area of ​​the side surface of the supporting substrate 10 due to the influence of gravity.

[0060] In the present embodiment, a plurality of support members 30 are provided on the carrier substrate 10 of the OLED display motherboard. On the one hand, the plurality of support members 30 provided between the plurality of display units 20 can increase the adhesion between the acid-proof film 40 and the carrier substrate 10 of the OLED display motherboard. On the other hand, the plurality of support members 30 provided in the edge area of ​​the carrier substrate 10 can effectively reduce the step difference between the acid-proof film 40 and the carrier substrate 10. At the same time, the adhesion between the acid-proof film 40 and the carrier substrate 10 can also be increased, thereby effectively reducing the possibility of damage to the acid-proof film 40 during the chemical thinning process, thereby improving the technical problem that the OLED display motherboard is easily damaged during the chemical thinning process and the yield is low.

[0061] In some embodiments, the carrier substrate 10 includes a plurality of cutting lanes configured to cut the OLED display motherboard, the cutting lanes are located in the spacing area of ​​the display unit 20, and the orthographic projection of the support member 30 on the carrier substrate 10 is located outside the cutting lanes.

[0062] It is understandable that after the OLED display motherboard undergoes the chemical thinning process, a cutting process is also included, in which the OLED display motherboard is cut to obtain multiple OLED display panels, wherein the cutting of the OLED display motherboard is performed according to the multiple cutting lanes on the carrier substrate 10 of the OLED display motherboard. If the orthographic projection of the support member 30 on the carrier substrate 10 is located within the range of the cutting lanes, it will affect the subsequent cutting process of the OLED display motherboard. Therefore, in this embodiment, the support member 30 is set to avoid the cutting lanes to avoid affecting the subsequent cutting process of the OLED display motherboard.

[0063] Specifically, in the present embodiment, the cutting path is arranged adjacent to the display unit 20, and a plurality of support members 30 are arranged on a side of the cutting path away from the display unit 20, so that in the subsequent cutting process, after the OLED display panel is effectively cut through the plurality of cutting paths, the plurality of support members 30 remain on the carrier substrate 10 of the OLED display motherboard after cutting, so as to avoid the plurality of support members 30 affecting the morphology of the OLED display panel obtained after cutting.

[0064] In some embodiments, Figure 3As shown, the carrier substrate 10 includes a first area 10a and a second area 10b arranged around the first area 10a, a plurality of display units 20 are arranged in the first area 10a, and the support member 30 includes a plurality of first support members 31 arranged in the first area 10a and a plurality of second support members 32 arranged in the second area 10b, wherein, in a direction perpendicular to the carrier substrate 10, a height of the plurality of first support members 31 in the first area 10a is equal to a height of the display unit 20, and a height of the plurality of second support members 32 in the second area 10b is less than a height of the display unit 20.

[0065] It should be noted that the second area 10b in this embodiment is the same as the edge area of ​​the aforementioned carrier substrate 10. In this embodiment, by setting the height of the plurality of first support members 31 in the first area 10a to be equal to the height of the display unit 20, the plurality of first support members 31 disposed between the plurality of display units 20 can effectively increase the adhesion area between the acid-proof film 40 and the carrier substrate 10, thereby effectively increasing the adhesion between the acid-proof film 40 and the carrier substrate 10. If the height of the plurality of first support members 31 in the first area 10a is less than the height of the display unit 20, the adhesion area between the acid-proof film 40 and the carrier substrate 10 will be reduced, resulting in insufficient improvement in the adhesion between the acid-proof film 40 and the carrier substrate 10. If the height of the plurality of first support members 31 in the first area 10a is greater than the height of the display unit 20, the acid-proof film 40 covering the first support members 31 is easily damaged, thereby causing the OLED display motherboard to be easily damaged during the chemical thinning process.

[0066] Furthermore, in the present embodiment, the height of the plurality of second support members 32 disposed in the second region 10b of the carrier substrate 10 is smaller than the height of the display unit 20. It is understandable that, since the display unit 20 has a certain thickness, there is a step difference between the acid-proof film 40 covering the second region 10b of the carrier substrate 10. By disposing a plurality of second support members 32 that are smaller than the height of the display unit 20, the step difference between the acid-proof film 40 and the carrier substrate 10 can be reduced. At the same time, the adhesion between the acid-proof film 40 and the carrier substrate 10 can also be increased, thereby effectively reducing the possibility of damage to the acid-proof film 40 during the chemical thinning process, thereby improving the technical problem that the OLED display motherboard is easily damaged during the chemical thinning process and the yield is low.

[0067] In some embodiments, in a direction extending from the first region 10a to the second region 10b, the heights of the plurality of second support members 32 disposed in the second region 10b decrease sequentially.

[0068] It can be understood that in this embodiment, by reducing the heights of the plurality of second support members 32 in a direction extending from the first region 10a of the carrier substrate 10 to the second region 10b of the carrier substrate 10, the step difference between the acid-proof film 40 and the carrier substrate 10 can be effectively reduced.

[0069] In some embodiments, Figure 3 As shown, the display units 20 are arranged in an array in the first area 10a of the carrier substrate 10, and a plurality of first support members 31 are distributed in the spacing areas of the plurality of columns of display units 20. In the spacing areas, the plurality of first support members 31 are arranged parallel to the column direction.

[0070] In the present embodiment, considering that among the multiple display units 20 in the same column, the area of ​​the spacing region between two adjacent display units 20 is relatively small and it is difficult to set the first support member 31, in the present embodiment, the multiple first support members 31 are set in the spacing region between the multiple columns of display units 20, and the multiple first support members 31 are arranged parallel to the column direction.

[0071] For example, Figures 3 to 5 As shown, the first support member 31 is a columnar support member or a strip support member.

[0072] Specifically, in this embodiment, Figure 3 As shown, a plurality of columnar support members 31 arranged in the spacing area of ​​the multi-column display unit 20 are evenly arranged parallel to the column direction. The columnar support members 31 are formed by dispensing glue. By dispensing a plurality of columnar support members 31 formed by dispensing glue in the spacing area of ​​the multi-column display unit 20, the adhesion between the acid-proof film 40 and the supporting substrate 10 of the OLED display motherboard can be increased, thereby effectively reducing the possibility of damage to the acid-proof film 40 during the chemical thinning process, thereby improving the technical problem that the OLED display motherboard is easily damaged during the chemical thinning process and the yield is not high. Preferably, the cross-section of the columnar support member is circular.

[0073] Furthermore, in this embodiment, if Figure 4 and Figure 5 As shown, a plurality of strip support members 31 disposed in the spacing area of ​​the multi-column display units 20 are evenly arranged parallel to the column direction. It can be understood that the strip support member 31 can be a long strip support member or a plurality of adjacent short strip support members. For example, the strip support member 31 disposed in the spacing area of ​​the multi-column display units 20 is a single strip support member with a longer length, or the strip support member disposed in the spacing area of ​​the multi-column display units 20 includes a plurality of shorter strip support members.

[0074] Among them, the strip support members 31 are formed by linear glue painting. By arranging multiple strip support members 31 formed by glue painting in the spacing area of ​​the multi-column display units 20, the adhesion between the acid-proof film 40 and the supporting substrate 10 of the OLED display motherboard can be increased, thereby effectively reducing the possibility of damage to the acid-proof film 40 during the chemical thinning process, and further improving the technical problem that the OLED display motherboard is easily damaged during the chemical thinning process and the yield is low.

[0075] In some embodiments, the width of the strip-shaped support member is less than or equal to 2 mm; and / or the diameter of the cross section of the columnar support member is less than or equal to 2 mm.

[0076] Understandably, since the area on the carrier substrate 10 of the OLED display motherboard for setting the support member 30 is limited, the size of the support member 30 needs to be limited to adapt to the structure of the OLED display motherboard. Therefore, in the first area 10a, the cross-sectional diameter of the columnar support member formed by the dispensing method needs to be less than or equal to 2 mm, preferably, the cross-sectional diameter of the columnar support member is 1.5 mm, and the width of the strip support member formed by the linear glue painting method needs to be less than or equal to 2 mm, preferably, the width of the strip support member is 1.5 mm.

[0077] In some embodiments, please refer to Figures 6 to 16 As shown in the figure, the multiple second support members 32 include a multiple first sub-support members 320 close to the side 13 of the carrier substrate 10, and / or a multiple second sub-support members 321 located at multiple vertex corners of the carrier substrate 10, wherein the multiple first sub-support members 320 are arranged in a direction parallel to the side of the carrier substrate 10.

[0078] Specifically, in this embodiment, Figures 6 to 8 As shown, the plurality of second support members 32 in the second region 10b of the carrier substrate 10 include a plurality of first sub-support members 320 close to the side of the carrier substrate 10, or, as shown in FIG. Figures 9 and 10 As shown, it includes a plurality of second sub-support members 321 located at a plurality of vertex corners of the carrier substrate 10, or as Figures 11 to 16 As shown, it includes a plurality of first sub-support members 320 close to the side edge 13 of the carrier substrate 10 and a plurality of second sub-support members 321 located at a plurality of vertices of the carrier substrate 10 .

[0079] Among them, by arranging multiple first sub-support members 320 and / or multiple second sub-support members 321 in the second area 10b of the carrier substrate 10, the obvious step difference between the acid-proof film 40 and the carrier substrate 10 can be effectively reduced. At the same time, the adhesion between the acid-proof film 40 and the carrier substrate 10 can be increased, thereby effectively reducing the possibility of damage to the acid-proof film 40 during the chemical thinning process, thereby improving the technical problem that the OLED display motherboard is easily damaged during the chemical thinning process and the yield is low.

[0080] Further, in this embodiment, the first sub-support member 320 is a columnar support member or a strip support member, wherein the width of the strip support member is less than or equal to 2 mm, and the diameter of the cross section of the columnar support member is less than or equal to 2 mm.

[0081] Specifically, in this embodiment, if the first sub-support member 320 is a columnar support member, the columnar support member can be formed by dispensing. By providing a plurality of columnar support members formed by dispensing, the obvious step difference between the acid-proof film 40 and the supporting substrate 10 can be effectively reduced. At the same time, the adhesion between the acid-proof film 40 and the supporting substrate 10 of the OLED display motherboard can also be increased, thereby effectively reducing the possibility of damage to the acid-proof film 40 during the chemical thinning process.

[0082] It is understandable that since the area in the second region 10b of the carrier substrate 10 for setting the first sub-support member 320 is limited, the size of the first sub-support member 320 needs to be limited to adapt to the structure of the OLED display motherboard. Therefore, in the second region 10b, the cross-sectional diameter of the columnar support member formed by dispensing needs to be less than or equal to 2 mm. Preferably, the cross-sectional diameter of the columnar support member is 1.5 mm.

[0083] Furthermore, in the present embodiment, if the first sub-support member 320 is a strip support member, the strip support member can be formed by means of linear glue, and a plurality of strip support members are arranged along a direction parallel to the side of the supporting substrate 10. It can be understood that the strip support member can be a long strip support member or a plurality of short strip support members. By setting a plurality of strip support members formed by linear glue, the obvious step difference between the acid-proof film 40 and the supporting substrate 10 can be effectively reduced. At the same time, the adhesion between the acid-proof film 40 and the supporting substrate 10 of the OLED display motherboard can also be increased, thereby effectively reducing the possibility of damage to the acid-proof film 40 during the chemical thinning process.

[0084] Similarly, since the area in the second region 10b of the carrier substrate 10 for setting the first sub-support member 320 is limited, the size of the first sub-support member 320 needs to be limited to adapt to the structure of the OLED display motherboard. Therefore, in the second region 10b, the width of the strip support member formed by the linear glue painting method needs to be less than 2 mm. Preferably, the width of the strip support member is 1.5 mm.

[0085] In some embodiments, the second sub-support member 321 is a columnar support member.

[0086] In this embodiment, since the second sub-support member 321 is arranged at the top corner of the receiving substrate 10, it is difficult to adopt a strip-shaped support member for the second sub-support member 321 due to the shape restriction of the top corner of the receiving substrate 10, and only a columnar support member can be adopted. When a columnar support member is adopted, preferably, the cross-section of the columnar support member is circular or square.

[0087] Specifically, the number of the second sub-support members 321 disposed at each vertex of the receiving substrate 10 may be single or multiple. Schematically, as shown in FIG. Figure 4 As shown, when the number of the second sub-support members 321 arranged at a vertex corner of the receiving substrate 10 is single, the area of ​​the positive projection of the single columnar support member on the supporting substrate 10 is large, and the size of the cross-section of the columnar support member can be adjusted according to the area of ​​the region at the vertex corner of the supporting substrate 10 that can be used to set the columnar support member. If the area of ​​the region at the vertex corner of the supporting substrate 10 that can be used to set the columnar support member is large, the size of the cross-section of the columnar support member can be designed to be larger, and if the area of ​​the region at the vertex corner of the supporting substrate 10 that can be used to set the columnar support member is small, the size of the cross-section of the columnar support member naturally needs to be designed to be smaller.

[0088] In this embodiment, when there are multiple second sub-support members 321 disposed at a vertex of the receiving substrate 10 , the multiple second sub-support members 321 are multiple columnar support members, and the cross-sections of the multiple columnar support members are circular or square.

[0089] In some embodiments, the material of the support member 30 is a photocurable material.

[0090] In this embodiment, preferably, the material of the support member 30 is a UV light-curing material, that is, after being dispensed or linearly drawn, the material can undergo a curing reaction under UV light irradiation to form a support member 30 with a certain supporting strength.

[0091] In some embodiments, the edge of the acid-proof film 40 extends beyond the edge of the carrier substrate 10 by 1-2 mm.

[0092] In the present embodiment, in order to prevent etching solution from penetrating into the OLED display motherboard from the edge of the acid-proof film 40 during the chemical thinning process of the display template and causing damage to the structure of the display unit 20, the edge of the acid-proof film 40 needs to extend beyond the edge of the carrier substrate 10 by 1-2 mm. Preferably, the edge of the acid-proof film 40 extends beyond the edge of the carrier substrate 10 by 1.5 mm.

[0093] In some embodiments, Figure 2 As shown, the OLED display motherboard also includes an adhesive layer 50 , which is disposed on the side of the carrier substrate 10 and extends to the first surface of the acid-proof film 40 , which is the surface of the acid-proof film 40 close to the carrier substrate 10 .

[0094] In this embodiment, the acid-proof film 40 includes a first surface close to the side of the supporting substrate 10 and a second surface away from the side of the supporting substrate 10, wherein the adhesive layer 50 is arranged on the side of the supporting substrate 10 and extends to the first surface of the acid-proof film 40. The material of the adhesive layer 50 is a photocurable material. Preferably, the material of the adhesive layer 50 is a UV light-curable material. When the UV light-curable material is coated on the side of the supporting substrate 10 and the first surface of the acid-proof film 40, the adhesive layer 50 can be obtained after UV light exposure.

[0095] The acid-proof film 40 is a PET type acid-proof film or a PI type acid-proof film.

[0096] In some embodiments, the carrier substrate 10 is a glass substrate.

[0097] Specifically, in the present embodiment, chemical thinning of the OLED display motherboard is to thin the carrier substrate 10. Usually, the carrier substrate 10 is a glass substrate, and the glass substrate is thinned by chemical etching. The thickness of the carrier substrate 10 before thinning is in the range of 0.4-0.6 mm, and the thickness of the carrier substrate 10 after thinning is in the range of 0.1-0.3 mm. Preferably, the thickness of the carrier substrate 10 after thinning is 0.15 mm, or the thickness of the carrier substrate 10 after thinning is 0.2 mm. By thinning the carrier substrate 10, the OLED display panel can be made thinner and lighter.

[0098] In some embodiments, the OLED display motherboard further includes a plurality of test components, and the plurality of test components are disposed on a side of the carrier substrate 10 including the plurality of display units 20 .

[0099] Specifically, in this embodiment, a test element group (TEG) is used to test the display unit 20 to confirm whether the function of the display unit 20 is defective, wherein a plurality of test elements are distributed in the first area 10a and the second area 10b of the carrier substrate 10, or are only distributed in the second area 10b of the carrier substrate 10, wherein Fig.17 As shown, since the second area 10b has sufficient area for arranging multiple test components 60, multiple test components 60 are usually arranged in the second area 10b, and the orthographic projections of the multiple test components 60 on the carrier substrate 10 do not overlap with the orthographic projections of the multiple support members 30 on the carrier substrate 10.

[0100] Furthermore, if Fig.18 As shown, a method for preparing an OLED display motherboard is provided, comprising:

[0101] S10, providing a carrier substrate;

[0102] S20, forming a plurality of display units on one side of the carrier substrate;

[0103] S30, forming a plurality of supporting members on a side of the carrier substrate including the plurality of display units;

[0104] S40, forming an acid-proof film on one side of the carrier substrate including the plurality of display units and the plurality of support members;

[0105] The acid-proof film covers part of the side surface of the carrier substrate, the orthographic projection of the display unit on the carrier substrate and the orthographic projection of the support member on the carrier substrate do not overlap each other, and in the direction perpendicular to the carrier substrate, the height of the support member is less than or equal to the height of the display unit.

[0106] Specifically, by providing an acid-proof film, and the acid-proof film covers part of the side surface of the carrier substrate, when the carrier substrate is chemically thinned by chemical etching, the acid-proof film can effectively protect the multiple display units on the carrier substrate to prevent etching solutions such as concentrated sulfuric acid and hydrofluoric acid from damaging the structure of the multiple display units.

[0107] Furthermore, by arranging a plurality of support members on the carrying substrate, on the one hand, the plurality of support members arranged between the plurality of display units can increase the adhesion between the acid-proof film and the carrying substrate of the OLED display motherboard, and on the other hand, the plurality of support members arranged in the edge area of ​​the carrying substrate can effectively reduce the obvious step difference between the acid-proof film and the carrying substrate, and at the same time, can also increase the adhesion between the acid-proof film and the carrying substrate, thereby effectively reducing the possibility of damage to the acid-proof film during the chemical thinning process, and further improving the technical problem that the OLED display motherboard is easily damaged during the chemical thinning process and the yield is low.

[0108] According to a second aspect of the embodiments of the present application, an OLED display panel is provided, which is formed by cutting the OLED display motherboard described in the first aspect.

[0109] It should be noted that, in the present embodiment, after the chemical thinning process of the OLED display motherboard, a cutting process is also included, that is, the OLED display motherboard is cut to obtain multiple OLED display panels, wherein the cutting of the OLED display motherboard is performed according to multiple cutting lanes on the carrier substrate of the OLED display motherboard. In the present embodiment, the support member is arranged to avoid the cutting lanes to avoid affecting the subsequent cutting process of the OLED display motherboard.

[0110] Specifically, in the present embodiment, the cutting path is arranged adjacent to the display unit, and a plurality of support members are arranged on a side of the cutting path away from the display unit, so that in a subsequent cutting process, after the OLED display motherboard is effectively cut through a plurality of cutting paths, a plurality of support members remain on the carrier substrate of the cut OLED display motherboard, so as to avoid the plurality of support members affecting the morphology of the OLED display panel obtained after cutting.

[0111] Furthermore, if Fig.19 As shown, the structure of the OLED display panel includes a base substrate 210, and a driving circuit layer 220, a light-emitting layer 230 and an encapsulation layer 240 sequentially arranged on the base substrate 210, wherein the encapsulation layer 240 adopts an inorganic film layer, and the encapsulation layer 240 is used to protect the light-emitting layer 230 and the driving circuit layer 220.

[0112] Among them, the cut OLED display panel includes a base substrate 210 and a driving circuit layer 220, a light-emitting layer 230 and an encapsulation layer 240 sequentially arranged on one side of the base substrate 210. It should be noted that before the OLED display motherboard is cut, the structure of the multiple display units 20 arranged on one side of the carrier substrate 10 includes a driving circuit layer 220, a light-emitting layer 230 and an encapsulation layer 240. After the OLED display motherboard is cut along the cutting path, the carrier substrate 10 becomes a part of the OLED display panel. Specifically, in this embodiment, the cut carrier substrate serves as the base substrate of the OLED display panel, so that in the preparation process of the OLED display panel, there is no need to set up a separate base substrate, which is beneficial to saving preparation steps and improving the preparation efficiency of the OLED display panel.

[0113] In some embodiments, the base substrate 210 of the OLED display panel is a glass substrate, and the thickness of the base substrate 210 is 100-300 μm. Preferably, the thickness of the base substrate 210 is 150-220 μm, for example, the thickness of the base substrate 210 is 150 μm, 160 μm, 170 μm, 180 μm, 190 μm, 200 μm, 210 μm or 220 μm.

[0114] Furthermore, a polarizer and a cover layer may be provided on the light-emitting side of the OLED display panel obtained by cutting, and the cover layer may be used to physically protect the OLED display panel.

[0115] In the third aspect of the embodiment of the present application, Fig. 20 As shown, a method for preparing an OLED display panel is also provided, comprising:

[0116] S50, providing a carrier substrate;

[0117] S60, forming a plurality of display units on one side of the carrier substrate;

[0118] S70, forming a plurality of supporting members on a side of the carrier substrate including the plurality of display units;

[0119] S80, forming an acid-proof film on one side of the carrier substrate including the multiple display units and the multiple support members to obtain an OLED display motherboard to be cut;

[0120] S90, thinning and cutting the OLED display motherboard to be cut to obtain a plurality of OLED display panels.

[0121] The acid-proof film covers part of the side surface of the carrier substrate, the orthographic projection of the display unit on the carrier substrate and the orthographic projection of the support member on the carrier substrate do not overlap each other, and in the direction perpendicular to the carrier substrate, the height of the support member is less than or equal to the height of the display unit.

[0122] Specifically, in the present embodiment, after obtaining the OLED display motherboard to be cut, a plurality of OLED display panels are obtained by subjecting the OLED display motherboard to be cut to thinning and cutting processes, wherein the thinning process is to thin the supporting substrate of the OLED display motherboard to be cut by chemical thinning, and the cutting process is to cut the OLED display motherboard to be cut into a plurality of OLED display panels according to the cutting lines.

[0123] In some embodiments, after the thinning process, the thickness of the carrier substrate of the OLED display motherboard to be cut is 100-300 μm.

[0124] Preferably, after thinning, the thickness of the carrier substrate of the OLED display motherboard to be cut is 150-220 μm, for example, the thickness of the carrier substrate is 150 μm, 160 μm, 170 μm, 180 μm, 190 μm, 200 μm, 210 μm or 220 μm, etc.

[0125] The OLED display motherboard provided in the embodiment of the present application has multiple support members arranged on the supporting substrate of the OLED display motherboard. On the one hand, the multiple support members arranged between the multiple display units can increase the adhesion between the acid-proof film and the supporting substrate of the OLED display motherboard. On the other hand, the multiple support members arranged in the edge area of ​​the OLED display motherboard can effectively reduce the obvious step difference between the acid-proof film and the supporting substrate of the OLED display motherboard. At the same time, the adhesion between the acid-proof film and the supporting substrate of the OLED display motherboard can also be increased, thereby effectively reducing the possibility of damage to the acid-proof film during the chemical thinning process, thereby improving the technical problem that the OLED display motherboard is easily damaged during the chemical thinning process and the yield is low.

[0126] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

[0127] Although the preferred embodiments of this specification have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of this specification.

[0128] Obviously, those skilled in the art can make various changes and modifications to this specification without departing from the spirit and scope of this specification. Thus, if these modifications and variations of this specification fall within the scope of the claims of this specification and their equivalents, this specification is also intended to include these modifications and variations.

Claims

1. An OLED display motherboard, characterized in that: include: A carrier substrate; A plurality of display units are arranged on one side of the carrier substrate; A plurality of support members are arranged on one side of the carrier substrate including the plurality of display units, wherein the orthographic projections of the display units on the carrier substrate and the orthographic projections of the support members on the carrier substrate do not overlap each other, and in a direction perpendicular to the carrier substrate, the height of the support members is less than or equal to the height of the display units; The acid-proof film is arranged on one side of the carrier substrate including the plurality of display units and the plurality of support members, and the acid-proof film covers a portion of the side surface of the carrier substrate.

2. The OLED display motherboard according to claim 1, characterized in that: The carrier substrate includes a plurality of cutting lanes configured to cut the OLED display motherboard, the cutting lanes are located in the spacing area of ​​the display unit, and the orthographic projection of the support member on the carrier substrate is located outside the cutting lanes.

3. The OLED display motherboard according to claim 1, characterized in that: The supporting substrate includes a first area and a second area arranged around the first area, and the multiple display units are arranged in the first area. The supporting members include multiple first supporting members arranged in the first area and multiple second supporting members arranged in the second area, wherein in a direction perpendicular to the supporting substrate, the height of the multiple first supporting members in the first area is equal to the height of the display unit, and the height of the multiple second supporting members in the second area is less than the height of the display unit.

4. The OLED display motherboard according to claim 3, characterized in that: In a direction extending from the first area to the second area, the heights of the plurality of second support members disposed in the second area decrease sequentially.

5. The OLED display motherboard according to claim 3, characterized in that: The display units are arranged in an array in the first region of the carrier substrate, a plurality of the first support members are distributed in the spacing regions of a plurality of columns of the display units, and in the spacing regions, a plurality of the first support members are arranged parallel to the column direction.

6. The OLED display motherboard according to claim 5, characterized in that: The first support member is a columnar support member or a strip support member.

7. The OLED display motherboard according to claim 6, characterized in that: The width of the strip support is less than or equal to 2 mm; and / or The diameter of the cross section of the columnar support member is less than or equal to 2 mm.

8. The OLED display motherboard according to claim 3, characterized in that: The multiple second support members include multiple first sub-support members close to the side of the carrier substrate, and / or multiple second sub-support members located at multiple vertex corners of the carrier substrate, wherein the multiple first sub-support members are arranged in a direction parallel to the side of the carrier substrate.

9. The OLED display motherboard according to claim 8, characterized in that: The first sub-support member is a columnar support member or a strip support member, wherein the width of the strip support member is less than or equal to 2 mm, and the diameter of the cross section of the columnar support member is less than or equal to 2 mm.

10. The OLED display motherboard according to claim 9, characterized in that: The second sub-support member is a columnar support member.

11. The OLED display motherboard according to claim 1, characterized in that: The material of the support member is a light-curing material.

12. The OLED display motherboard according to claim 1, characterized in that: The edge of the acid-proof film exceeds the edge of the supporting substrate by 1-2 mm.

13. The OLED display motherboard according to claim 1, characterized in that: The adhesive layer comprises an adhesive layer, which is arranged on the side of the carrier substrate and extends to the first surface of the acid-proof film. The first surface is the surface of the acid-proof film close to the carrier substrate.

14. The OLED display motherboard according to claim 1, characterized in that: The supporting substrate is a glass substrate.

15. An OLED display panel, characterized in that: It is formed by cutting the OLED display motherboard described in claims 1-14.

16. The OLED display panel according to claim 15, characterized in that: The OLED display panel includes a base substrate, and a driving circuit layer, a light emitting layer and a packaging layer which are sequentially arranged on one side of the base substrate.

17. A method for preparing an OLED display panel, characterized in that: include: providing a carrier substrate; forming a plurality of display units on one side of the carrier substrate; forming a plurality of supporting members on one side of the carrier substrate including the plurality of display units; On one side of the carrier substrate including the plurality of display units and the plurality of support members, an acid-proof film is formed to obtain an OLED display motherboard to be cut; The OLED display motherboard to be cut is subjected to thinning and cutting processes to obtain a plurality of OLED display panels.

18. The method for preparing an OLED display panel according to claim 17, characterized in that: After the thinning process, the thickness of the carrier substrate of the OLED display motherboard to be cut is 100-300 μm.

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