Switch unit

Abstract

The invention relates to a switching unit (100) comprising: a power module (102); a first bus (130), referred to as an upper bus, and a second bus (128), referred to as a lower bus, connected to each power module (102) so as to distribute a DC voltage (UDC) to the power module, the upper and lower buses each comprising a first plate; and at least one capacitor (136) having two terminals welded to the first and second busbars (128, 130), respectively; the invention relates to a switch unit for a motor vehicle, characterised in that said switch unit comprises a carrier (132) of upper and lower busbars (128, 130) with a fastening pin (702), a first plate of the upper busbar (130) having a hole for receiving the fastening pin (702), the fastening pin (702) being bored to fasten the upper busbar (130) to the carrier (132).

Description

Technical Field

[0001] The invention relates to a switch unit, in particular for a mobile device comprising an inverter associated with a motor. Background Art

[0002] The prior art discloses a switch unit, comprising:

[0003] - power modules; and

[0004] a first busbar, referred to as the upper busbar, and a second busbar, referred to as the lower busbar, connected to each of the power modules in order to distribute a DC voltage to the power modules; and

[0005] - At least one capacitor having two terminals welded to the two busbars respectively.

[0006] In order to keep the busbars in place, it is known to overmould them. However, such overmoulding operations are complex and costly.

[0007] It may therefore be desirable to provide a switching unit which allows to overcome some of the above mentioned problems and limitations. Summary of the invention

[0008] According to a first aspect of the present invention, there is provided a switch unit, the switch unit comprising:

[0009] - Power modules;

[0010] - a first busbar, called an upper busbar, and a second busbar, called a lower busbar, connected to each of the power modules in order to distribute a DC voltage to the power modules, the upper busbar and the lower busbar each comprising a first plate; and

[0011] - at least one capacitor having two terminals welded to a first plate and a second plate of the busbar, respectively;

[0012] Characterized in that the switch unit comprises a carrier of upper and lower busbars with fastening pins, the first plate of the upper busbar having holes for receiving the fastening pins, the fastening pins being staked to fasten the first plate of the upper busbar to the carrier.

[0013] Thus, the busbars staked to the carrier do not need to be overmoulded to remain in place.

[0014] According to the first aspect of the present invention, the present invention may also have one or more of the following optional features in any technically possible combination.

[0015] Optionally, the carriers of the upper and lower busbars have fastening pins, the first plate of the upper busbar has holes for receiving the fastening pins, the fastening pins being staked in to fasten the first plate of the upper busbar to the carrier.

[0016] Optionally, each fastening pin is received in a different receiving hole, respectively.

[0017] Optionally, the first plate of the upper busbar and the first plate of the lower busbar are planar.

[0018] Optionally, the upper busbar and the lower busbar are stacked on each other, and the first plate of the lower busbar is held between the first plate of the upper busbar and the carrier.

[0019] Optionally, the lower busbar is designed to have a high potential, and the upper busbar is designed to have a low potential.

[0020] Optionally, the carrier comprises a bottom on which the first plates of the stacked busbars are located, wherein the first plate of the lower busbar has a hole that makes visible a portion of the first plate of the upper busbar called the connecting portion, wherein the bottom has a hole that makes visible a portion of the first plate of the lower busbar called the connecting portion and at least a portion of the hole of the first plate of the lower busbar, so as to connect the first terminal of the capacitor to the connecting portion of the lower busbar through the hole of the bottom on the one hand and to connect the second terminal of the capacitor to the connecting portion of the upper busbar through the hole of the bottom and through the hole of the lower busbar on the other hand.

[0021] Optionally, a thickness of the connection portion of the first plate of the lower bus bar is smaller than a thickness of a remaining portion of the first plate of the lower bus bar.

[0022] Optionally, the first plate of the upper busbar has a protrusion extending into the hole of the first plate of the lower busbar.

[0023] Optionally, the protrusion has a planar lower connecting wall, the thickness of which is smaller than the remaining portion of the upper busbar first plate.

[0024] Optionally, the carrier has positioning pins for positioning the first plate of the lower busbar.

[0025] Optionally, the locating pins are arranged to hold the first plate of the lower busbar in place perpendicular to the fastening pins.

[0026] Optionally, the locating pin is parallel to the fastening pin.

[0027] Optionally, the positioning pins penetrate into the holes of the lower busbar first plate and allow the lower busbar to be held in place.

[0028] Optionally, the carrier has positioning pins for positioning the first plate of the lower busbar.

[0029] Optionally, the locating pins are arranged to hold the first plate of the lower busbar in place perpendicular to the fastening pins.

[0030] Optionally, the locating pin is parallel to the fastening pin.

[0031] Optionally, each locating pin penetrates into a corresponding hole of the first plate of the lower busbar and allows the lower busbar to be held in place.

[0032] Optionally, each power module implements a switching arm designed to perform conversion between a DC voltage and an AC voltage.

[0033] Optionally, the switch unit also includes a cooling circuit for cooling the power module, the cooling circuit including a cooling shell defining a channel for coolant flow, the cooling shell having an upper cooling surface and a lower cooling surface, both of which are cooled by the coolant flow through the channel, and the power module is pressed against the upper cooling surface to be cooled.

[0034] Optionally, the first plate of the upper busbar is in thermal contact with the lower cooling surface.

[0035] Optionally, the cooling housing further comprises an inlet duct for coolant to enter the cooling housing and an outlet duct for coolant to exit the cooling housing, the inlet duct and the outlet duct each having a section, the sections of the inlet duct and the sections of the outlet duct protruding substantially parallel to each other in the same direction.

[0036] Optionally, a first insulating layer is inserted between the first plate of the upper busbar and the first plate of the lower busbar.

[0037] Optionally, a second insulating layer is located between the top of the first plate of the upper busbar and the lower face of the cooling casing.

[0038] According to a second aspect of the present invention, there is further provided an inverter, comprising the switch unit according to the first aspect of the present invention.

[0039] Optionally, the inverter further comprises a case member, the switch unit is located inside the case member, the case member has two through holes, the section of the inlet duct is inserted into one of the two through holes, and the section of the outlet duct is inserted into the other of the two through holes.

[0040] According to a third aspect of the present invention, there is further provided a mobile device, comprising the switch unit according to the first aspect of the present invention or the inverter according to the second aspect of the present invention.

[0041] The mobile device is, for example, a motor or engine driven land vehicle, train, airplane or drone.

[0042] A land vehicle powered by a motor or engine, such as a motor vehicle, motorcycle, motorized bicycle or motorized wheelchair. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The invention will be better understood from the following description, which is provided by way of example only and with reference to the accompanying drawings, in which:

[0044] Figure 1is a cross-sectional view of an example of a switch unit implementing the present invention,

[0045] Figure 2 is a 3D view of the switch unit,

[0046] Figure 3 is a 3D view of the switch unit with the controller board, cover, and spring system removed.

[0047] Figure 4 is a 3D view of the capacitor of the switching unit,

[0048] Figure 5 is a flow chart of a method for manufacturing a capacitor,

[0049] Figure 6 is a three-dimensional cross-sectional view of the busbar of the switch unit and the carrier of the busbar,

[0050] Figure 7 A 3D view of the busbars of a switch unit, the busbar carriers and the capacitors. In this view, the fastening pins can be seen before they are staked in.

[0051] Figure 8 is similar to Figure 7 View of the mounting pin after it has been staked in.

[0052] Fig. 9 This is a three-dimensional view of the busbar carrier from above.

[0053] Fig.10 is a three-dimensional cross-sectional view of a busbar of a switch unit, a carrier of the busbar, and a capacitor, showing the connection of the capacitor to the busbar,

[0054] Fig.11 is a flow chart of the method of welding capacitors,

[0055] Fig.12 is a cross-sectional view of one of the capacitors, the busbar and its carrier, showing a step of the welding method,

[0056] Fig.13 is a 3D view of the switch cell power module control pins and their environment,

[0057] Fig.14 is a 3D view of the variants of the control pins,

[0058] Fig.15 Yes Display Fig.14 A 3D view of the protrusions of the control pins,

[0059] Fig.16 is a flow chart of a method of manufacturing a switching unit,

[0060] Fig.17is a three-dimensional cross-sectional view of an electrical system such as an inverter that receives a switching unit,

[0061] Fig.18 is a block diagram of a method for assembling an electrical system. DETAILED DESCRIPTION

[0062] In the following description and claims, various components and elements will be spatially positioned relative to each other with reference to an arbitrarily oriented orthogonal coordinate system XYZ, which includes an X direction, a Y direction, and a Z direction. For clarity, the X direction will be referred to as the left-right direction (in the figures, the X direction arrow points to the left), the Y direction will be referred to as the front-back direction (in the figures, the Y direction arrow points to the back), and the Z direction will be referred to as the up-down direction (in the figures, the Z direction arrow points to the top).

[0063] With reference to the drawings, one example of a switch unit 100 embodying the present invention will now be described.

[0064] refer to Figure 1 The switch unit 100 first includes a plurality of power modules 102. In the illustrated example, three power modules 102 are provided. The power modules 102 are placed adjacent to each other, for example.

[0065] The switch unit 100 further includes a controller circuit board 104 for controlling the power module 102. The controller circuit board 104 is located above the power module 102, for example.

[0066] The switch unit 100 further includes a circuit 106 for cooling the power module 102 .

[0067] The cooling circuit 106 includes a cooling housing 108 defining a channel 110 through which a coolant flows. The cooling housing 108 has an upper cooling surface 112 and a lower cooling surface 113, both of which are cooled by the coolant flow through the channel 110. Thus, the power module 102 is pressed against the upper cooling surface 112 in order to be cooled.

[0068] In order to keep the power module 102 pressed against the upper cooling surface 112, the switch unit 100, for example, first comprises a cover 114 located above the power module 102, for example between the controller circuit board 104 and the power module 102. The cover 114 is fastened to the cooling housing 108, for example by screws. The switch unit 100 also comprises a spring system inserted between the cover 114 and the power module 102. The spring system is therefore designed to bear against the cover 114 and push the power module 102 toward the upper cooling surface 112. For each power module 102, the spring system comprises, for example, one leaf spring 116, which is squeezed between the cover 114 and the power module 102.

[0069] The cooling circuit 106 further comprises an inlet duct 118 for coolant to enter the cooling housing 108 and an outlet duct 120 for coolant to flow out of the cooling housing 108. The ducts 118, 120 are located, for example, on the right and left sides of the cooling housing 108, respectively, and protrude vertically downward from the cooling housing 108.

[0070] The switch unit 100 also includes a busbar called a positive busbar 128 and a busbar called a negative busbar 130, which are stacked on each other. Therefore, one of the two busbars 128, 130 forms a lower busbar, while the other forms an upper busbar. The busbar called the positive busbar 130 and the busbar called the negative busbar 128 each include a first plate and a second plate, the first plate being made of the same material as the second plate and being formed integrally with the second plate.

[0071] In the example described, the first plate of each of the two busbars is a flat plate.

[0072] For example, the first plate of the positive busbar 128 is located below the first plate of the negative busbar 130, and the first plate of the negative busbar 130 is located below the cooling housing 108. Therefore, the positive busbar 128 forms the lower busbar and the negative busbar 130 forms the upper busbar. The opposite configuration is also possible.

[0073] Furthermore, a second plate of the positive busbar 128 and a second plate of the negative busbar 130 are arranged along one side of the cooling housing 108 .

[0074] The positive busbar 128 is designed to have a high potential, and the negative busbar 130 is designed to have a low potential lower than the high potential, so the busbars 128 , 130 are designed to have a DC voltage UDC therebetween.

[0075] The busbars 128 , 130 are both connected to each power module 102 via at least one connection terminal extending from their second plates so as to distribute the DC voltage U DC to the power modules 102 .

[0076] In order to hold the busbars 128, 130 in place, the switch unit 100 comprises, for example, a carrier 132, which is made in particular of an electrical insulator, for example of plastic. More precisely, the carrier 132 has a bottom 134 on which the first plates of the busbars 128, 130 are located. The carrier 132 is fastened to the cooling housing 108 in such a way that the first plates of the busbars 128, 130 are located between the lower cooling surface 113 of the cooling housing 108 and the bottom 134 of the carrier 132. The busbars 128, 130 can thus be cooled by the lower cooling surface 113.

[0077] The switch unit 100 further comprises capacitors 136, each comprising two terminals 138, 140 respectively connected to the busbars 128, 130 for receiving a DC voltage UDC. These capacitors 136 are designed to smooth the DC voltage UDC and are generally referred to as DC link capacitors.

[0078] The capacitor 136 is, for example, placed below the busbars 128 , 130 , in particular below the bottom 134 of the carrier 132 , and the terminals 138 , 140 of the capacitor 136 pass through the bottom 134 of the carrier to reach the busbars 128 , 130 , as will be described in more detail below.

[0079] refer to Figure 2 Each power module 102 is designed, for example, to perform conversion between a DC voltage UDC and a corresponding AC voltage (eg, a phase voltage of a motor).

[0080] Therefore, each power module 102 has an external connector 202 designed to carry this AC voltage. The external connector 202 takes the form of a planar rod, preferably with a thickness of at least 0.8 mm.

[0081] The switch unit 100 further comprises a magnetic core 204 of a current sensor surrounding each external connector 202. The magnetic core 204 is annular and has a gap in which a Hall effect sensor may be placed, for example, to measure the current.

[0082] In order to hold the magnetic core 204 in place, the switch unit 100 further comprises a frame 206 supporting the magnetic core 204. The frame 206 is, for example, overmolded around the magnetic core and is fastened to the cooling housing 108, for example by screws.

[0083] refer to Figure 3 In addition to the AC external connector 202, each power module 102 also includes an external connector 302 called a positive connector and an external connector 304 called a negative connector, which are designed to be connected to the positive busbar 128 and the negative busbar 130, respectively. These external connectors 302, 304 take the form of a planar bar, preferably with a thickness of at least 0.8 mm. In the example shown, two negative external connectors 304 are provided for each power module 102.

[0084] To perform the voltage conversion, each power module 102 implements, for example, a switching arm and therefore comprises in a housing 305 two switches 306, 308 connected to each other at a midpoint, which midpoint itself is connected to the AC external connector 202 in order to deliver an AC voltage thereto. The switching arm is connected between the external connectors 302, 304 in order to deliver a DC voltage UDC thereto. For the sake of clarity, these switches 306, 308 are Figure 3It is schematically shown for a single power module 102 in FIG. 1 , but not shown in other modules.

[0085] Each switch 306, 308 is preferably a controllable semiconductor switch, for example a switch based on a transistor such as a Metal Oxide Semiconductor Field Effect Transistor (MOSFET) or indeed an Insulated Gate Bipolar Transistor (IGBT) or even a Gallium Nitride Field Effect Transistor (GaNFET).

[0086] Each power module 102 also has control pins 312, in particular allowing the controller board 104 to control the switching of the switches 306, 308. These control pins 312 are bent so as to have a horizontal section extending out of the housing 305 of the power module 102 and a vertical section rising up to the controller board 104.

[0087] refer to Figure 4 Each capacitor 136 includes a body 402 , and each terminal 138 , 140 includes an inner portion 404 located in the body 402 and an outer portion 406 located outside the body 402 and protruding from the body 402 .

[0088] The body 402 includes, for example, a capacitor 408 and an overmolded portion 410 covering the capacitor 408. The capacitor 408 is a portion of the capacitor 136 that stores electrical energy. The overmolded portion 410 is made of, for example, resin. Therefore, the inner portion 404 of each terminal 138, 140 extends into the overmolded portion 410, for example, so as to be connected to the capacitor 408.

[0089] The outer part 406 of each terminal 138, 140 firstly has a support section 412. The support section 412 is, for example, continuous with the inner part 404. The support section 412 is, for example, planar.

[0090] The outer portion 406 of each terminal 138, 140 also has a connection section 414 designed to be welded to a respective one of the busbars 128, 130, as will be described in detail below. The connection section 414 is attached to the support section 412 by a bend and is remote from the body 402. The connection section 414 has an upper face intended to be pressed against the associated busbar 128, 130 so as to be welded to the associated busbar 128, 130, for example by laser welding.

[0091] In order to prevent the heat generated by welding from reaching the main body 402 through the connecting section 414, the outer portion 406 of each terminal 138, 140 also has a protective section 416 attached to the connecting section 414 through a bent portion so as to be folded between the connecting section 414 and the main body 402. For example, the bent portion between the connecting section 414 and the protective section 416 faces the bent portion between the supporting section 412 and the connecting section 414.

[0092] The outer portion 406 of each terminal 138 , 140 also includes, for example, at least one auxiliary support section 418 which is attached to the connection section 414 by a bend so as to protrude toward the body 402 , for example vertically downwards as in the example shown.

[0093] The auxiliary support section 418 has an end opposite to the connecting section 414, which end is in contact with the main body 402 and, for example, extends into the main body 402. For example, this end is engaged in the overmolded part 410, as in the example shown.

[0094] Furthermore, the end portion preferably has a hook 420, i.e. a protrusion. The protrusion is covered by the overmolded part 410 in the protruding direction of the auxiliary support section 418, i.e. in the vertical direction in the example shown. The hook 420 limits the risk of the auxiliary support section 418 being pulled out of the overmolded part 410 and the risk of the connection section 414 being deformed when the auxiliary support section 418 is pulled parallel to the protruding direction.

[0095] Thus, the connecting section 414 is supported by the support section 412 and, where appropriate, by one or more auxiliary support sections 418 .

[0096] Preferably, each terminal 138, 140, or at least an outer portion 406 thereof, is formed from a single folded planar sheet.

[0097] refer to Figure 5 , one example of a method 600 of manufacturing capacitor 136 will now be described.

[0098] In step 602, terminals 138, 140 are obtained, wherein, for each terminal, the protection section 416 is continuous with the connection section 414. For example, each obtained terminal 138, 140 is planar and, for example, cut from a board. Therefore, before folding the board, the outer portion 406 and the inner portion 404 are coplanar and continuous with each other.

[0099] In step 604, the outer portion 406 is bent between the protection section 416 and the connection section 414 so that the protection section 416 is located below the connection section 414. In step 604, other bending operations may also be performed on the outer portion 406 of the terminal 138, 140 to have, for example, Figure 4 For example, after the protective segment 416 has been folded under the connecting segment 414, the one or more auxiliary support segments 418 can be bent relative to the connecting segment 414. Finally, again for example, the entirety of the inner portion 404 and the support segment 412 can be bent relative to the connecting segment 414.

[0100] In step 606 , the inner portion 404 of the terminal 138 , 140 is fastened to the capacitive device 408 . Thus, the protective section 416 is located between the connecting section 414 and the body 402 , which is free of the overmolded portion 410 .

[0101] In step 608, an overmold portion 410 is formed around the capacitive device 408, around the inner portion 404 of the terminal 138, 140, and around the hook 420 (if provided for this purpose).

[0102] Reference Figure 6 , an insulating layer 502 is provided, for example, above the first plate of the upper busbar 130 to insulate it from the cooling housing 108. Similarly, an insulating layer 504 is interposed between the busbars 128, 130.

[0103] Reference Figure 7 , the carrier 132 has fastening pins 702, which are respectively received in holes produced in the first plate of the upper busbar 130. The fastening pins 702 protrude upward from the bottom 134 of the carrier 132, for example.

[0104] The carrier 132 also has, for example, pins 704 for positioning the lower busbar 128. Each positioning pin 704 penetrates into a corresponding hole of the first plate of the lower busbar 128 and allows the lower busbar 128 to remain in place. In particular, the positioning pins 704 are arranged to hold the first plate of the lower busbar 128 in a position perpendicular to the fastening pins 702. For example, the positioning pins 704 extend parallel to the fastening pins 702, i.e., extend upward.

[0105] Reference Figure 8 , each fastening pin 702 is staked in to fasten the first plate of the upper busbar 130 to the carrier 132. In doing so, the lower busbar 128 is held in place because its first plate is clamped between the first plate of the upper busbar 130 and the bottom 134 of the carrier 132. Staking includes deforming the end of each locating pin 704, such as while hot, to form an abutment for the first plate of the upper busbar 130.

[0106] refer to Fig. 9 , for each capacitor 136, the first plate of the lower busbar 128 has a hole 902 (e.g., a window or even a cutout) so that a portion 904 of the first plate of the upper busbar 130 is visible. This portion 904 is designed to be connected to one of the terminals 138, 140 of the capacitor 136 and is referred to hereinafter as "connection portion 904".

[0107] The connection portion 904 of the upper bus bar 130 has, for example, a protrusion 906 that extends into the hole 902 of the first plate of the lower bus bar 128 .

[0108] Again, for each capacitor 136, the bottom 134 of the carrier 132 has a hole 908 (e.g., a window or even a cutout) which makes a portion 910 of the first plate of the lower busbar 128 visible. This portion 910 is designed to be connected to the other of the terminals 138, 140 of the capacitor 136 and is referred to hereinafter as "connection portion 910". Preferably, the connection portion 910 of the first plate of the lower busbar 128 has a smaller thickness than the rest of the first plate of the lower busbar 128, and for example a thickness of at least 25%. For example, the connection portion 910 has a thickness of at most 0.6 mm, while the first plate of the lower busbar 128 has a thickness of at least 1 mm around the connection portion 910. This smaller thickness makes it easier to solder the terminals 138, 140 of the capacitor 136.

[0109] The hole 908 of the bottom 134 further makes the hole 902 of the first plate of the lower busbar 128 visible. Therefore, through the hole 908 of the bottom 134 and through the hole 902 of the first plate of the lower busbar 128, the connecting portion 904 of the first plate of the upper busbar 130, in particular the protrusion 906, is visible.

[0110] The protrusion 906 has, for example, a connection plane lower wall 912. Preferably, the connection wall 912 has a smaller thickness than the rest of the first plate of the upper busbar 130, and for example, a thickness at least 25% smaller. For example, the connection wall 912 has a thickness of at most 0.6 mm, while the first plate of the lower busbar 128 has a thickness of at least 1 mm around the protrusion 906. This smaller thickness makes it easier to solder the terminals 138, 140 of the capacitor 136.

[0111] Furthermore, for each connection portion 910 of the first plate of the lower busbar 128 , the first plate of the upper busbar 130 has a hole (eg a window or even a cutout) making the connection portion 910 visible.

[0112] refer to Fig.10For each capacitor 136, one of the terminals (the negative terminal 140 in the example shown) is connected to the connection portion 904 of the upper busbar 130, more specifically, to the connection wall 912 of the protrusion 906, for example, by welding. The other terminal (the positive terminal 138 in the example shown) is connected to the connection portion 910 of the lower busbar 128, for example, by welding.

[0113] refer to Fig.11 , one example of a method 1100 for welding the capacitor 136 to the bus bars 128 , 130 will now be described.

[0114] In step 1102, the terminals 138, 140 of the capacitor 136 are pressed against the busbars 128, 130, respectively. For example, the connecting sections 414 of the terminals 138, 140 are pressed against the connecting wall 912 of the protrusion 906 of the upper busbar 130 and the connecting portion 910 of the lower busbar 128, respectively. Preferably, the abutment is plane to plane, for example, abutting at least 20 mm. 2 of board.

[0115] In step 1104 , in order to weld each terminal 138 , 140 to the bus bar 128 , 130 against which the terminal 138 , 140 is pressed, a laser beam is emitted to the bus bar 128 , 130 opposite to the terminal 138 , 140 being pressed.

[0116] Reference Fig.12 , the laser beam 1202 is emitted by the laser 1204 along the direction 1206, sequentially passing through the busbars 128, 130, the connection sections 414 of the pressed terminals 138, 140, the protection sections 416 of the pressed terminals 138, 140, and the body 402 of the capacitor 136. Therefore, the direction 1206 is perpendicular to the connection section 414.

[0117] Furthermore, the presence of the hole in the first plate of the upper busbar 130 allows the laser beam to directly reach the connection portion 910 of the first plate of the lower busbar 128 , with the purpose of welding this connection portion 910 to the terminal of the capacitor 136 against which it is pressed.

[0118] refer to Fig.13 In the frame 206, for each control pin 312, a notch 1302 for positioning the control pin 312 is provided. For the sake of clarity, the positioning notch 1302 is only labeled for one control pin in the figure.

[0119] By means of the positioning notch, the positioning of the control pin 312 can be ensured, which makes it easier to connect the control pin 312 to the circuit board 104. In addition, when such connection is achieved via forceful insertion, the positioning notch 1302 reduces the risk of the control pin 312 being twisted during its forceful insertion.

[0120] For example, the positioning recess 1302 has two walls 1304, 1306, between which an angle between 80° and 100° is formed, preferably between 90° and 95°, more preferably 90°, in order to correctly position the control pin 312. Therefore, the control pin 312 has an end section 1308 terminating in an end 1310. The control pin 312 is designed to be inserted into a corresponding receiving hole of the circuit board 104 via its end 1310. This end section 1308 is, for example, straight (vertical in the example shown) and has a positioning portion 1312, which has a length of at least 5 mm and extends over its entire length to a distance of at most 0.5 mm from each wall 1304, 1306 of the positioning recess 1302.

[0121] therefore, Fig.13 The control pin 312 shown is designed, for example, to be freely (not forcefully) inserted into a receiving hole and then soldered to the circuit board 104 .

[0122] Reference Fig.14 , another example of an embodiment is shown.

[0123] In this other example, the control pin 312 is designed to be forcibly inserted into a receiving hole of the circuit board 104 , for example.

[0124] For this purpose, the end section 1308 has a portion 1402 for strong insertion, the width of which is greater than the receiving hole of the circuit board. For example, the portion 1402 for strong insertion includes two rods, which are connected at their ends and separated by a space in their middle.

[0125] Preferably, the frame 206 has at least one chamfer 1404 for guiding the control pin 312, more specifically the elbow of the control pin 312, toward the positioning recess 1302. Therefore, the chamfer 1404 makes it easier to insert the control pin 312 into the positioning recess 1302, especially vertically.

[0126] Reference Fig.15 The end section 1308 also has a protrusion 1502 protruding perpendicularly to the vertical direction so as to be located above the support portion in the vertical direction, preferably less than 0.1 mm away from the frame 206 in the vertical direction, and preferably in contact with the frame 206.

[0127] Thus, during the forceful insertion of the control pin 312, the projection 1502 is brought into contact with the support portion, which allows a reaction to be applied to the pin. This avoids the need to temporarily provide a detachable abutment during the forceful insertion operation. In particular, the absence of such a temporary abutment allows the tool used to perform the forceful insertion to be greatly simplified.

[0128] The protrusion 1502 is located, for example, between the portion 1402 for strong insertion and the positioning portion 1312 .

[0129] refer to Fig.16 , the method 1600 for manufacturing the switch unit 100 includes, for example, the following steps.

[0130] In step 1602 , a power module 102 having control pins 312 protruding from a housing 305 is obtained.

[0131] In step 1604 , a circuit board 104 is obtained, wherein one hole receives each control pin 312 .

[0132] In step 1606 , the power module 102 is fastened to the cooling housing of the support frame 206 . During this fastening operation, the power module 102 is lowered vertically so that the control pins 312 , which are guided in particular by the chamfers 1502 , respectively penetrate into the positioning recesses 1302 .

[0133] In step 1608 , the circuit board 104 is vertically lowered toward the power module 102 , so that the control pins located in the positioning recesses are respectively inserted into the receiving holes.

[0134] refer to Fig.17 , the switch unit 100 is, for example, designed to form a part of an electrical system, such as an inverter 1702 .

[0135] The inverter 1702 comprises, for example, an electromagnetic compatibility (EMC) filter 1704 connected between the two busbars 128 , 130 and a housing referred to as a general housing 1706 in which the EMC filter 1704 and the switch unit 100 are placed.

[0136] The overall housing 1706 includes, for example, a main portion 1708 having an upper hole 1710 and a cover (not shown) designed to close the upper hole 1710. The overall housing 1706 also includes, for example, a lower hole 1712 for the capacitor 136 to pass through and a cover 1714 for closing the lower hole 1712.

[0137] The inlet duct 118 and the outlet duct 120 have two sections 1716 , 1718 which each project substantially parallel to one another in the same direction.

[0138] The overall housing 1706 then has two holes 1720, 1722 for the passage of the segments 1716, 1718, respectively. Each hole 1720, 1722 has, for example, a seal 1724, 1726 intended to interact with the inserted segments 1716, 1718.

[0139] Thus, the segments 1716, 1718 have respective ends 1728, 1730 outside the overall housing 1706, which are designed to be connected to a system for circulating a coolant. These ends 1728, 1730 may, for example, have an inlet chamfer. Thus, the connection of the cooling circuit is done outside the overall housing 1706, so as to reduce the risk of leakage into the overall housing in the event of a poor seal of the connection.

[0140] refer to Fig.18 , a method 1800 for assembling the electrical system 1702 will now be described.

[0141] In step 1802, the switch unit 100 is inserted into the main housing 1706 through the upper hole 1710. At this time, the sections 1716, 1718 of the conduits 118, 120 are respectively inserted into the holes 1720, 1722 formed in the main part 1708 to guide the positioning of the switch unit 100 in the main housing 1706.

[0142] In step 1804 , the switch unit 100 is fastened to the main portion 1708 of the overall housing 1706 , for example by a threaded connection.

[0143] In step 1806 , the upper hole 1710 of the main portion 1708 is closed by a cover (not shown) of the overall housing 1706 .

[0144] In summary, it will be noted that the present invention is not limited to the above-described embodiments. In particular, it will be apparent to those skilled in the art that various modifications may be made to the above-described embodiments based on the teachings just disclosed to them.

[0145] In particular, the order of the steps of the above-described methods may be changed into any technically possible order.

[0146] In the detailed description of the invention provided above, the terms used must not be construed to limit the invention to the embodiments described in this specification, but must be construed to include all equivalents that those skilled in the art can provide by applying their general knowledge to the practice of the teachings just disclosed to them.

Claims

1. A switch unit (100) comprising: Power module (102); a first busbar (130) called an upper busbar and a second busbar (128) called a lower busbar, connected to each of the power modules (102) to distribute a DC voltage (UDC) to the power modules, the upper busbar and the lower busbar each comprising a first plate; and at least one capacitor (136) having two terminals welded to the first busbar (130) and the second busbar (128), respectively; The switch unit comprises a carrier (132) having fastening pins (702) for the upper busbar and the lower busbar (128, 130), the first plate of the upper busbar (130) having holes for receiving the fastening pins (702), and the fastening pins (702) are staked in to fasten the first plate of the upper busbar (130) to the carrier (132).

2. The switch unit (100) according to claim 1 further includes a cooling circuit for cooling the power module, the cooling circuit includes a cooling shell defining a channel for coolant flow, the cooling shell has an upper cooling surface and a lower cooling surface, both of the upper cooling surface and the lower cooling surface are cooled by the coolant flow through the channel, the power module is pressed against the upper cooling surface so as to be cooled, and the first plate of the upper busbar is in thermal contact with the lower cooling surface.

3. The switch unit (100) according to any one of the preceding claims, wherein: The upper bus bar (130) and the lower bus bar (128) are stacked on each other, and the first plate of the lower bus bar (128) is held between the first plate of the upper bus bar (130) and the carrier (132).

4. The switch unit (100) according to claim 3, wherein: The lower bus bar (128) is designed to have a high potential, and the upper bus bar (130) is designed to have a low potential.

5. The switch unit (100) according to claim 3 or 4, wherein: The carrier (132) comprises a bottom (134) on which the first plates of the stacked busbars (128, 130) are located, wherein the first plate of the lower busbar (128) has a hole (902) which makes visible a portion of the first plate of the upper busbar (130) called the connecting portion (904), and wherein the bottom (134) has a hole (908) which makes visible a portion of the first plate of the lower busbar (128) called the connecting portion (904) and a portion of the lower busbar (128). At least a portion of the hole (902) of the first plate is visible so as to connect the first terminal (138) of the capacitor (136) to the connection portion (910) of the lower busbar (128) through the hole (908) of the bottom (134) on the one hand, and to connect the second terminal (140) of the capacitor (136) to the connection portion (902) of the upper busbar (130) through the hole (908) of the bottom (134) and through the hole (902) of the lower busbar (128) on the other hand.

6. The switch unit (100) according to claim 5, wherein: The connection portion (910) of the first plate of the lower bus bar (128) has a smaller thickness than the remaining portion of the first plate of the lower bus bar (128).

7. The switch unit (100) according to claim 5 or 6, wherein: The first plate of the upper busbar (130) has a protrusion (906) extending into the hole (902) of the first plate of the lower busbar (128).

8. The switch unit (100) according to claim 7, wherein: The protrusion (906) has a flat lower connecting wall (912), the thickness of which is smaller than the thickness of the remaining portion of the first plate of the upper busbar (130).

9. The switch unit (100) according to any one of claims 1 to 8, wherein: The carrier (132) has positioning pins (704) for positioning the first plate of the lower busbar (128). 10 . An inverter comprising the switch unit according to claim 1 .

11. A mobile device, comprising the switch unit according to any one of claims 1 to 9 or the inverter according to claim 10.

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