A high-precision de-gluing and stripping device and steps for wafer processing

Abstract

A kind of high-precision glue stripping equipment for wafer processing and steps, belong to wafer processing field, to solve when the debris moves in cleaning fluid, they can possibly contact with wafer surface again, cause abrasion to wafer, too much abrasion can cause scratch, pit and other defects on wafer surface, seriously affect the quality and performance of wafer problem, a kind of high-precision glue stripping equipment for wafer processing, including cleaning stripping box, ultrasonic machine fixedly connected outside cleaning stripping box, clamp set inside cleaning stripping box, filter pump machine communicated outside cleaning stripping box, by being provided with push mechanism, when push mechanism moves downward, can push debris downward, relative to prior art, reduce the residence of debris around wafer, so as to achieve the purpose of better stripping effect.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of wafer processing, in particular to a high-precision glue stripping equipment for wafer processing and steps. BACKGROUND

[0002] The high-precision glue stripping equipment for wafer processing is a device that utilizes the high-frequency vibration effect generated by ultrasonic waves in cleaning liquid. When ultrasonic waves propagate in cleaning liquid, they cause the molecules of the liquid to vibrate violently, forming tiny bubbles. These bubbles continuously grow and shrink under the action of ultrasonic waves, and when the bubbles burst, they release a huge amount of energy, generating micro-jets and shock waves with high temperature and high pressure, which can effectively impact the attached matter such as photoresist on the surface of the wafer.

[0003] The patent with publication number CN217325569U includes a box, a cavity is arranged inside the box, a workbench is arranged inside the cavity, a support is arranged on the workbench, a vibrator is fixed on the support, a water storage tank is fixed above the box, the water storage tank is connected with the spray head through a connecting pipe, a blower is fixed on the side of the box, the blower is connected with the cavity through a ventilation hole, a controller is fixed on the front of the box, the controller is connected with the blower, the controller is connected with the spray head, and the controller is connected with the vibrator. The glue stripping and cleaning device for wafers cleans the wafers in a sealed environment, and the placed wafers are contaminated. After cleaning the wafers, the vibrator is vibrated. In the existing ultrasonic cleaning process, the debris detached from the surface of the wafer is easy to move back and forth in the cleaning liquid. These debris may include photoresist particles, metal particles, etc. Due to the vibration effect of ultrasonic waves and the flow of cleaning liquid, the debris is difficult to stay stably in one position. When the debris moves in the cleaning liquid, they are likely to come into contact with the surface of the wafer again, causing wear to the wafer. Excessive wear may cause scratches, pits, and other defects on the surface of the wafer, seriously affecting the quality and performance of the wafer.

[0004] To solve the above problems, a high-precision glue stripping equipment for wafer processing and steps are proposed. SUMMARY

[0005] The purpose of the present application is to provide a high-precision glue stripping equipment for wafer processing and steps, which solves the problem that when the debris moves in the cleaning liquid, they are likely to come into contact with the surface of the wafer again, causing wear to the wafer. Excessive wear may cause scratches, pits, and other defects on the surface of the wafer, seriously affecting the quality and performance of the wafer.

[0006] In order to achieve the above object, the present application provides the following technical scheme: a high-precision glue stripping device for wafer processing, comprising a cleaning and stripping box, an ultrasonic machine fixedly connected to the outside of the cleaning and stripping box, a clamp arranged in the inside of the cleaning and stripping box, a filter pump machine communicated to the outside of the cleaning and stripping box, a pushing mechanism arranged at the upper end of the cleaning and stripping box, and a rotating mechanism arranged at one side of the pushing mechanism;

[0007] The pushing mechanism comprises a sliding assembly and a limiting assembly, and the limiting assembly is arranged at one side of the sliding assembly.

[0008] The sliding assembly comprises a first supporting plate fixedly connected above the cleaning and stripping box, a gas cylinder fixedly connected to the inside of the first supporting plate, a gas rod fixedly connected to the output end of the gas cylinder, a first fixing block fixedly connected to the lower end of the gas rod, a second sliding hole arranged in the lower end of the first fixing block, and a first pushing rod arranged in the inside of the second sliding hole and fixedly connected to one end of the pushing plate.

[0009] Preferably, the central axis of the gas rod is perpendicular to the central axis of the first fixing block.

[0010] Preferably, the first pushing rod is in sliding connection with the first fixing block, the first pushing rod has a cylindrical appearance structure, and the width of the first pushing rod is consistent with the width of the second sliding hole.

[0011] Preferably, the limiting assembly comprises a first rotating shaft fixedly connected to the other end of the first pushing rod, a first gear fixedly connected to the outside of the first rotating shaft, a first rack arranged at the outside of the first gear, a first sliding groove arranged in the inside of the cleaning and stripping box, a second sliding block arranged in the inside of the first sliding groove, and the second sliding block is in fixed connection with the first rack, a guide groove arranged at one side of the first sliding groove, the other end of the first rotating shaft is nested in the inside of the guide groove, a point a is arranged at the upper end of the inside of the guide groove, a point b is arranged at the upper end of the inside of the guide groove, a point c is arranged at the lower end of the outside of the guide groove, a point d is arranged at the lower end of the inside of the guide groove, and the first rack is in fixed connection with the gas rod.

[0012] Preferably, the width of the first sliding groove away from the center of the cleaning and stripping box is greater than the width of the first sliding groove close to the center of the cleaning and stripping box, and the central axis of the first sliding groove is perpendicular to the bottom surface of the cleaning and stripping box.

[0013] Preferably, the left and right ends of the guide groove have a vertical straight line shape, and the upper and lower ends of the guide groove have an inclined straight line shape.

[0014] Preferably, the point a of the guide groove is farther away from the clamp than the point b of the guide groove, and the point c of the guide groove is closer to the clamp than the point d of the guide groove.

[0015] Preferably, the first rotating shaft has a cuboid shape, and the width of the first rotating shaft is smaller than the width of the upper and lower ends of the guide groove.

[0016] Preferably, the rotating mechanism comprises a second rotating shaft fixedly connected to one end of the clamp, a second gear fixedly connected to the other end of the second rotating shaft, a sliding plate arranged on one side of the second gear, a hole arranged in the middle of the inner side of the sliding plate, the width of the upper end of the hole being smaller than the width of the lower end of the hole, the width of the upper end of the hole being consistent with the width of the second rotating shaft, the second rotating shaft being nested in the inner side of the hole, a recess arranged in the inner side of the other end of the sliding plate, a second push rod arranged in the recess, the first fixed block being fixedly connected to the second push rod, and a second rack fixedly connected to the lower end of the first fixed block.

[0017] A high-precision stripping device for wafer processing comprises a clamp, a push mechanism, a rotating mechanism, a cleaning and stripping box, a water tank, a water pump, a water pipe, a water nozzle, a first fixed block, a first push rod, a first gear, a guide groove, a second fixed block, a second push rod, a second gear, a sliding plate, a second rack, a first rotating shaft, a second rotating shaft, and a second rack.

[0018] Compared with the prior art, the device has the following beneficial effects:

[0019] 1. The device can push the debris downward when the push mechanism moves downward, thereby reducing the residence of the debris around the wafer and achieving a better stripping effect. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 The figure is a schematic diagram of the overall three-dimensional structure of the device.

[0021] Figure 2 The figure is a schematic diagram of the left view of the cleaning and stripping box.

[0022] Figure 3 The figure is a schematic diagram of the left view of the sliding plate.

[0023] Figure 4 The figure is a schematic diagram of the left view of the first gear.

[0024] Figure 5 The figure is a schematic diagram of the left view of the guide groove.

[0025] Figure 6 The figure is a schematic diagram of the left view of the Figure 3 The figure is a schematic diagram of the structure at position A.

[0026] As shown in the figure, 1 is a cleaning and stripping box, 2 is an ultrasonic machine, 3 is a clamp, 7 is a filter pump machine, 6 is a pushing mechanism, 5 is a rotating mechanism, 61 is a sliding assembly, 62 is a limiting assembly, 6101 is a first supporting plate, 6102 is a gas cylinder, 6103 is a gas rod, 6105 is a first fixed block, 6106 is a second sliding hole, 6107 is a first pushing rod, 6108 is a pushing plate, 6201 is a first rotating shaft, 6202 is a first gear, 6203 is a first rack, 6204 is a first sliding groove, 6205 is a second sliding block, 6206 is a guide groove, 501 is a second rotating shaft, 502 is a second gear, 503 is a sliding plate, 504 is a hole, 505 is a groove, 506 is a second pushing rod, and 507 is a second rack. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0028] Please refer to Figures 1-6 The present application provides a technical solution: a high-precision glue stripping device for wafer processing, which comprises a cleaning and stripping box 1, an ultrasonic machine 2 fixedly connected to the outer side of the cleaning and stripping box 1, a clamp 3 arranged in the inner side of the cleaning and stripping box 1, a filter pump machine 7 communicated to the outer side of the cleaning and stripping box 1, a pushing mechanism 6 arranged at the upper end of the cleaning and stripping box 1, and a rotating mechanism 5 arranged on one side of the pushing mechanism 6.

[0029] The pushing mechanism 6 comprises a sliding assembly 61 and a limiting assembly 62, and the limiting assembly 62 is arranged on one side of the sliding assembly 61.

[0030] The sliding assembly 61 comprises a first support plate 6101 fixedly connected above the cleaning and stripping tank 1, the inner side of the first support plate 6101 is fixedly connected with a gas cylinder 6102, the output end of the gas cylinder 6102 is fixedly connected with a gas rod 6103, the lower end of the gas rod 6103 is fixedly connected with a first fixed block 6105, the sliding assembly 61 comprises a first support plate 6101 fixedly connected above the cleaning and stripping tank 1, the inner side of the first support plate 6101 is fixedly connected with a gas cylinder 6102, the output end of the gas cylinder 6102 is fixedly connected with a gas rod 6103, the lower end of the gas rod 6103 is fixedly connected with a first fixed block 6105, the lower end of the first fixed block 6105 is internally provided with a second sliding hole 6106, the inner side of the second sliding hole 6106 is provided with a first push rod 6107, one end of the first push rod 6107 is fixedly connected with a push plate 6108, the connection between the first push rod 6107 and the first fixed block 6105 is sliding connection, the appearance structure of the first push rod 6107 is cylindrical, and the width of the first push rod 6107 is consistent with that of the second sliding hole 6106, so that the first push rod 6107 can rotate and slide in the inner side of the second sliding hole 6106.

[0031] The limiting component 62 comprises a first rotating shaft 6201 fixedly connected to the other end of the first push rod 6107, the outer side of the first rotating shaft 6201 is fixedly connected with a first gear 6202, the outer side of the first gear 6202 is provided with a first rack 6203, the inside of the first sliding groove 6204 is provided with a second sliding block 6205, the width of the side of the first sliding groove 6204 away from the center of the cleaning and stripping box 1 is greater than the width of the side of the first sliding groove 6204 close to the center of the cleaning and stripping box 1, and the central axis of the first sliding groove 6204 is perpendicular to the bottom surface of the cleaning and stripping box 1, so that the second sliding block 6205 cannot move out of the inside of the first sliding groove 6204, the second sliding block 6205 and the first rack 6203 are fixedly connected, one side of the first sliding groove 6204 is provided with a guide groove 6206, the other end of the first rotating shaft 6201 is nested in the inside of the guide groove 6206, the upper end inside of the guide groove 6206 is provided with a point a, the upper end inside of the guide groove 6206 is provided with a point b, the lower end outside of the guide groove 6206 is provided with a point c, the lower end inside of the guide groove 6206 is provided with a point d, the left and right ends of the guide groove 6206 are perpendicular to the linear shape, and the upper and lower ends of the guide groove 6206 are inclined to the linear shape, the appearance structure of the first rotating shaft 6201 is a cuboid, and the width of the first rotating shaft 6201 is smaller than the width of the upper and lower ends of the guide groove 6206, so that the first rotating shaft 6201 can rotate when moving to the upper and lower ends of the guide groove 6206, but cannot rotate when moving to the middle of the guide groove 6206, the point a of the guide groove 6206 is farther away from the clamp 3 than the point b of the guide groove 6206, and the point c of the guide groove 6206 is closer to the clamp 3 than the point d of the guide groove 6206, so that the first rotating shaft 6201 can move to the side of the guide groove 6206 away from the clamp 3 when moving down to the point a of the guide groove 6206, and the first rack 6203 and the air rod 6103 are fixedly connected.

[0032] The rotating mechanism 5 comprises a second rotating shaft 501 fixedly connected to one end of the clamp 3, the other end of the second rotating shaft 501 is fixedly connected with a second gear 502, one side of the second gear 502 is provided with a sliding plate 503, the middle inside of the sliding plate 503 is provided with a hole 504, the upper end width of the hole 504 is smaller than the lower end width of the hole 504, the upper end width of the hole 504 is consistent with the width of the second rotating shaft 501, and the appearance structure of the second rotating shaft 501 is a cuboid, the second rotating shaft 501 is nested in the inside of the hole 504, the other side of the sliding plate 503 is internally provided with a groove 505, the inside of the groove 505 is provided with a second push rod 506, the connection between the second push rod 506 and the first fixed block 6105 is fixed connection, and the lower end of the first fixed block 6105 is fixedly connected with a second rack 507.

[0033] A high-precision wafer processing glue stripping device steps: using the clamp 3 wafer clamping fixed, start the cylinder 6102 downward movement, so that the push plate 6108 water flow to the outside and downward movement, so that the debris from the surrounding wafer, and drive the clamp 3 and wafer rotation angle, so that the water flow can be from multiple angles impact stripping complete glue.

[0034] When the need for glue stripping, using the clamp 3 wafer clamping fixed, start the cylinder 6102 downward movement, drive the air rod 6103 and the first fixed block 6105 downward movement, so that the second sliding hole 6106 and the first push rod 6107 downward movement, because the first rotation axis 6201 appearance structure for rectangular, and the width of the first rotation axis 6201 is less than the width of the guide groove 6206 upper and lower ends, so that the first push rod 6107 drive the first gear 6202, the first rotation axis 6201, push plate 6108 downward movement, push water flow downward movement, because the push plate 6108 to a large transverse downward movement, so that a large amount of water downward, not only makes the vertical direction of the debris downward movement, but because the push place no water, so that the water pressure on both sides of the water flow to both sides of the movement, the wafer cleaning, cleaning in multiple directions, so that the glue stripping effect is better.

[0035] After the pushing plate 6108 is pushed down, the cylinder 6102 drives the first rotating shaft 6201 to move upward. Because the point a of the guide groove 6206 is farther away from the clamp 3 than the point b of the guide groove 6206, and the point c of the guide groove 6206 is closer to the clamp 3 than the point d of the guide groove 6206, the left and right ends of the guide groove 6206 are in vertical linear shape, and the upper and lower ends of the guide groove 6206 are in inclined linear shape, so that the first rotating shaft 6201 can move to the inside of the side of the guide groove 6206 close to the clamp 3 when moving to the c point position. The first rotating shaft 6201 uses horizontal movement to drive the first gear 6202 to rotate by being pushed by the first rack 6203, so that the pushing plate 6108 rotates, so that the pushing plate 6108 returns to a smaller area, reducing the possibility of debris being brought back. When the first fixed block 6105 moves upward, the second pushing rod 506 moves upward, driving the sliding plate 503 to move upward. Because the upper end width of the hole 504 is smaller than the lower end width of the hole 504, the upper end width of the hole 504 is consistent with the width of the second rotating shaft 501, and the second rotating shaft 501 is in the shape of a cuboid. After the second rotating shaft 501 contacts the lower end of the hole 504, the second rack 507 contacts the second gear 502, so that the second gear 502, the second rotating shaft 501 and the clamp 3 rotate. Because the point a of the guide groove 6206 is farther away from the clamp 3 than the point b of the guide groove 6206, the clamp 3 and the wafer are driven to rotate at a certain angle, so that the water flow can impact and peel off from multiple angles to complete the delamination, and the second rack 507 is away from the second gear 502. The second gear 502 can rotate to press down with a larger area and continue to work.

[0036] Because the pushing plate 6108 pushes downward to move, it can drive the debris to move downward and separate from the wafer. At this time, the wafer remains at a fixed angle to improve the separation effect.

[0037] It should be noted that in this text, relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.

[0038] While embodiments of the application have been shown and described, it is to be understood that the embodiments described are merely exemplary of the principles and application of the present application. Numerous modifications and adaptions can be effected without departing from the spirit and scope of the present application, which is not limited to the exact construction and arrangement described. It is intended, therefore, to cover all modifications and adaptions that fall within the scope of the claims and their equivalents.

Claims

1. A high-precision adhesive stripping device for wafer processing, comprising a cleaning and stripping box (1), an ultrasonic machine (2) fixedly connected to the outside of the cleaning and stripping box (1), a clamp (3) disposed inside the cleaning and stripping box (1), and a filter pump (7) connected to the outside of the cleaning and stripping box (1), characterized in that: The upper end of the cleaning and stripping box (1) is provided with a pushing mechanism (6), one side of the pushing mechanism (6) is provided with a rotating mechanism (5); The pushing mechanism (6) comprises a sliding assembly (61) and a limiting assembly (62), and the limiting assembly (62) is arranged on one side of the sliding assembly (61). The sliding assembly (61) comprises a first support plate (6101) fixedly connected above the cleaning and stripping box (1), the inner side of the first support plate (6101) is fixedly connected with a gas cylinder (6102), the output end of the gas cylinder (6102) is fixedly connected with a gas rod (6103), the lower end of the gas rod (6103) is fixedly connected with a first fixed block (6105), the lower end of the first fixed block (6105) is internally provided with a second sliding hole (6106), the inner side of the second sliding hole (6106) is provided with a first push rod (6107), one end of the first push rod (6107) is fixedly connected with a push plate (6108), the first push rod (6107) is in sliding connection with the first fixed block (6105), the appearance structure of the first push rod (6107) is cylindrical, the width of the first push rod (6107) is consistent with that of the second sliding hole (6106), the limiting assembly (62) comprises a first rotating shaft (6201) fixedly connected at the other end of the first push rod (6107), the outer side of the first rotating shaft (6201) is fixedly connected with a first gear (6202), the outer side of the first gear (6202) is provided with a first rack (6203), the inside of the cleaning and stripping box (1) is provided with a first sliding groove (6204), the inner side of the first sliding groove (6204) is provided with a second sliding block (6205), the second sliding block (6205) is in fixed connection with the first rack (6203), one side of the first sliding groove (6204) is provided with a guide groove (6206), the other end of the first rotating shaft (6201) is nested in the inner side of the guide groove (6206), the upper end of the guide groove (6206) is internally provided with a point a, the upper end of the guide groove (6206) is internally provided with a point b,The lower end outside of the guide groove (6206) is provided with point C, the lower end inside of the guide groove (6206) is provided with point D, the first rack (6203) and the air rod (6103) are fixedly connected, the left and right ends of the guide groove (6206) are vertically linear in appearance, the upper and lower ends of the guide groove (6206) are inclined linear in appearance, the first rotating shaft (6201) is cuboid in appearance, the width of the first rotating shaft (6201) is less than the width of the upper and lower ends of the guide groove (6206), the rotating mechanism (5) comprises a second rotating shaft (501) fixedly connected to one end of the clamp (3), the other end of the second rotating shaft (501) is fixedly connected with a second gear (502), one side of the second gear (502) is provided with a sliding plate (503), the middle inside of the sliding plate (503) is provided with a hole (504), the upper end width of the hole (504) is less than the lower end width of the hole (504), the upper end width of the hole (504) is consistent with the width of the second rotating shaft (501), the second rotating shaft (501) is cuboid in appearance, the second rotating shaft (501) is nested in the inside of the hole (504), the other side of the sliding plate (503) is internally provided with a recess (505), the inside of the recess (505) is provided with a second push rod (506), the second push rod (506) and the first fixed block (6105) are fixedly connected, and the lower end of the first fixed block (6105) is fixedly connected with a second rack (507).

2. The high-precision stripping apparatus for wafer processing according to claim 1, characterized in that: The central axis of the air rod (6103) is perpendicular to the central axis of the first fixed block (6105).

3. The high-precision stripping apparatus for wafer processing according to claim 1, characterized in that: The width of the first sliding groove (6204) far away from the center side of the cleaning and stripping box (1) is greater than the width of the first sliding groove (6204) close to the center side of the cleaning and stripping box (1), and the central axis of the first sliding groove (6204) is perpendicular to the bottom surface of the cleaning and stripping box (1).

4. The high-precision photoresist stripping apparatus for wafer processing according to claim 1, characterized in that: The point a of the guide groove (6206) is farther away from the clamp (3) than the point b of the guide groove (6206), and the point c of the guide groove (6206) is closer to the clamp (3) than the point d of the guide groove (6206).

5. The steps of the high-precision stripping equipment for wafer processing according to any one of claims 1-4: using the clamp (3) to clamp and fix the wafer, starting the air cylinder (6102) to move downward, so that the push plate (6108) drives the water flow to move outward and downward, so that the debris is away from the periphery of the wafer, and the clamp (3) and the wafer are driven to rotate at a certain angle, so that the water flow can impact and strip from multiple angles to complete the stripping.

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