A method for manufacturing a copper powder sintered surface communicating microchannel heat sink device

Abstract

The application belongs to the technical field of chip heat dissipation, and discloses a copper powder sintering surface connected micro-channel heat dissipation heat sink device and a preparation method thereof. The application realizes the preparation of the surface connected micro-channel of the heat sink by using the thermal conductivity and sintering property of copper powder and combining with the micro-channel structure design. Compared with the traditional preparation process, the preparation process of the application is simple, the cost is low, the heat dissipation efficiency and the heat conduction performance are higher, the heat sink has good plasticity by using copper powder as the preparation material, and the shape design and customized manufacturing can be performed according to actual needs. The application solves the problems of the complex preparation process and high cost of the micro-channel heat sink in the prior art and the problem that the micro-channel heat sink cannot meet the requirements of the shape, size and material of the heat sink in special scenes, and is suitable for the fields of electronic devices, optoelectronic devices and the like.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip heat dissipation, and in particular to a preparation method of a copper powder sintering surface connected micro-channel heat dissipation heat sink device. BACKGROUND

[0002] With the continuous development and expansion of application fields of electronic products, the heat dissipation demand is increasingly prominent. Micro-channel heat dissipation technology is an important technical means to solve the heat dissipation problem of high-power electronic devices. Compared with traditional fan heat dissipation, aluminum plate heat dissipation and other methods, the micro-channel heat sink can quickly export heat through micro-channels, and has the advantages of high heat dissipation efficiency, small size, light weight and the like.

[0003] However, the existing micro-channel heat sink preparation process is complex, requires expensive preparation equipment and materials, and has high manufacturing cost, and cannot meet the requirements of shape, size, material and the like of the heat sink in some special scenarios.

[0004] Therefore, the present application provides a preparation method of a micro-channel heat dissipation structure, which utilizes the thermal conductivity and sintering property of copper powder, and combines with the micro-channel structure design to realize the preparation of the surface connected micro-channel heat sink.

[0005] CONTENT

[0006] The present application aims to provide a preparation method of a copper powder sintering surface connected micro-channel heat dissipation heat sink device, so as to solve the problems of complex preparation process, high cost and the like of the existing micro-channel heat sink, and the problem of being unable to meet the requirements of shape, size, material and the like of the heat sink in special scenarios.

[0007] In order to achieve the above-mentioned purpose, the present application provides the following technical scheme:

[0008] A copper powder sintering surface connected micro-channel heat dissipation heat sink device, comprising a micro-channel template and a graphite mold, the micro-channel template comprising a substrate and a micro-channel structure obtained on the substrate by etching or mechanical processing, and the graphite mold being connected in a top-down manner, and the internal structure of the graphite mold being adapted to the micro-channel structure; when the graphite mold and the micro-channel template are assembled and connected, a gap is left between the graphite mold and the micro-channel structure.

[0009] Preferably, the micro-channel template is made of copper.

[0010] A preparation method of a copper powder sintering surface connected micro-channel heat dissipation heat sink device, comprising the following steps:

[0011] S1, processing a substrate according to a required micro-channel structure to obtain a micro-channel template, processing a graphite mold adapted to the micro-channel template, and preparing raw materials including at least copper powder and an organic binder;

[0012] S2, assemble the microchannel template with the graphite mold, and reserve a gap between the microchannel template and the graphite mold;

[0013] S3, fill the copper powder into the gap between the microchannel template and the graphite mold, and shake to make the copper powder uniformly filled in the gap;

[0014] S4, put the microchannel template filled with the copper powder in step S3 into a tube furnace for sintering, and set the sintering program in the furnace, including that the highest temperature is 950 DEG C and the maintaining time is 90 minutes;

[0015] S5, perform surface treatment on the sintered microchannel structure heat sink to remove the residual copper powder.

[0016] Preferably, the thickness of the microporous layer is determined by changing the size of the graphite mold in step S1.

[0017] Preferably, the copper powder in step S1 is electrolytic copper powder, which is 100-300 mesh, and the organic binder is acetone.

[0018] Preferably, the atmosphere in the furnace in step S4 is set to 5% hydrogen and 95% nitrogen.

[0019] The principle of the technical scheme is that the copper powder is filled into the gap between the microchannel template and the graphite mold, the copper powder is uniformly filled in the gap between the microchannel template and the graphite mold by shaking, the filled copper powder forms a microchannel structure by sintering, the preparation of the heat sink surface connected with the microchannel is realized by using the thermal conductivity and sintering property of the copper powder and combining the microchannel structure design, and the sample can be prevented from being oxidized in the sintering process by setting the atmosphere in the furnace to 5% hydrogen and 95% nitrogen.

[0020] The beneficial effects of the technical scheme are that the preparation of the heat sink surface connected with the microchannel is realized by using the thermal conductivity and sintering property of the copper powder and combining the microchannel structure design, compared with the prior art, the preparation process of the heat sink is simple, the cost is low, the heat dissipation efficiency is high, the heat sink can be widely applied in the fields of electronic devices, optoelectronic devices and the like, and has important application prospect and economic benefits. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a structure diagram of the microchannel template in the embodiment of the application;

[0022] Figure 2 It is a structure diagram of the graphite mold in the embodiment of the application;

[0023] Figure 3 It is an assembly drawing of the microchannel template and the graphite mold in the embodiment of the application;

[0024] Figure 4Figure 2 is a partial side view of the micro-channel template and graphite mold after being assembled and filled with copper powder in the embodiment of the present application;

[0025] The names of the corresponding marks in the drawings are: micro-channel template 1, base 11, micro-channel structure 12, graphite mold 2, copper powder 3. DETAILED DESCRIPTION

[0026] The present application will be further described in detail below in conjunction with the drawings and embodiments:

[0027] As Figure 1 shown is a micro-channel template 1 in a copper powder sintering surface connected micro-channel heat dissipation heat sink device, the bottom is a copper-based base 11, and the top of the base 11 is formed by processing to form a micro-channel structure 12.

[0028] As Figure 2 shown is a graphite mold 2 in a copper powder sintering surface connected micro-channel heat dissipation heat sink device, the graphite mold 2 is connected up and down, and the internal structure of the graphite mold 2 is adapted to the micro-channel structure 12.

[0029] As Figure 3 shown, the graphite mold 2 can be assembled on the micro-channel template 1, and after the graphite mold 2 is assembled on the micro-channel template 1, a certain gap is left between the micro-channel structure 12 and the internal structure of the graphite mold 2 for filling the copper powder 3.

[0030] Figure 4 Figure 4 is a side view of the micro-channel template 1 after being filled with copper powder 3, and a gap is maintained between the internal structure of the graphite mold 2 and the micro-channel structure 12 on both sides, and a gap is also maintained between the bottom of the internal structure of the graphite mold 2 and the micro-channel structure 12, and the gaps are uniformly filled with the copper powder 3.

[0031] The specific implementation process is as follows:

[0032] Step 1, the micro-channel structure 12 is obtained on the micro-channel template 1 by processing, as Figure 1 shown, the internal structure of the graphite mold 2 is adapted to the micro-channel structure 12 by processing, as Figure 2 shown, the copper powder (electrolytic copper powder, 100-300 mesh) and the organic binder (glycerol) and other raw materials are prepared;

[0033] Step 2, the micro-channel template 1 and the graphite mold 2 are assembled, and a certain gap is left between the internal structure of the graphite mold 2 and the micro-channel structure 12, as Figure 3 shown;

[0034] Step 3, the copper powder 3 is filled into the gap between the micro-channel structure 12 and the graphite mold 2, and the entire device is shaken to make the copper powder 3 uniformly filled in the gap, and the partial side view of the device after being filled with the copper powder 3 is as Figure 4 shown;

[0035] Step 4, the device filled with copper powder 3 is put into a tube furnace for sintering, the sintering program in the furnace is set, the highest temperature is set to 950℃, the sintering time is maintained for 90 minutes, in order to prevent the sample from being oxidized during the sintering process, the atmosphere in the furnace is set to 5% hydrogen and 95% nitrogen;

[0036] Step 5, the sintered micro-channel heat sink is surface treated, after the treatment operation such as removing the residual copper powder, the micro-channel heat sink is obtained.

[0037] The above is only an embodiment of the present application, and the specific technical solutions or characteristics known in the art are not described in detail. It should be noted that for those skilled in the art, without departing from the technical solutions, a number of modifications and improvements can be made, which should be considered as the protection scope of the present application, and these will not affect the effect and practicality of the present application. The protection scope of the present application should be subject to the content of its claims, and the specific implementation mode and the like recorded in the specification can be used to explain the content of the claims.

Claims

1. A copper powder sintered surface-communicating microchannel heat sink device, characterized by: The micro-channel template comprises a substrate and a micro-channel structure obtained on the substrate by etching or mechanical processing, and the graphite mold is connected in a top-down manner and has an internal structure matching the micro-channel structure; when the graphite mold is assembled with the micro-channel template, a gap is left between the graphite mold and the micro-channel structure.

2. A copper powder sintered surface-communicating microchannel heat sink device according to claim 1, wherein: The micro-channel template is made of copper.

3. A preparation method of a copper powder sintered surface-communicating micro-channel heat dissipation heat sink device according to claim 1, comprising the following steps: S1, processing a substrate according to a required micro-channel structure to obtain a micro-channel template, and processing a graphite mold matching the micro-channel template, and preparing raw materials including at least copper powder and an organic binder; S2, assembling the micro-channel template with the graphite mold and reserving a gap between the micro-channel template and the graphite mold; S3, filling the copper powder into the gap between the micro-channel template and the graphite mold and shaking to uniformly fill the copper powder in the gap; S4, placing the micro-channel template filled with the copper powder in a tube furnace for sintering, and setting a sintering program in the furnace, including a maximum temperature of 950 DEG C and a maintaining time of 90 minutes; S5, performing surface treatment on the sintered micro-channel structure heat sink to remove residual copper powder.

4. The method of claim 3, wherein the copper powder is sintered at a temperature of 900- 1000 °C for 1-3 hours in a vacuum or in an inert gas atmosphere. The thickness of the micro-porous layer is determined by changing the size of the graphite mold in step S1.

5. The method of claim 3, wherein the copper powder is sintered at a temperature of 900- 1000 °C for 1-3 hours in a vacuum or in an inert gas atmosphere. The copper powder in step S1 is electrolytic copper powder with a size of 100-300 mesh, and the organic binder is glycerol.

6. The method of claim 3, wherein the copper powder is sintered at a temperature of 900- 1000 °C for 1-2 hours in a vacuum or in an inert gas atmosphere. The atmosphere in the furnace in step S4 is set to 5% hydrogen and 95% nitrogen.

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