A fully automatic wafer size grinding control device and method

Abstract

The present invention discloses a fully automatic chip size grinding control device and method, which relates to the field of chip grinding measurement technology, including a chip information acquisition module, a rough grinding and fine grinding initial measurement evaluation module, and a rough grinding and fine grinding process dynamic adjustment module. Through the coordination of two-dimensional scanning guns and other equipment, accurate acquisition of grinding information is achieved. The rough grinding initial measurement is based on micrometer measurement and system analysis to evaluate the chip status; the number of grinding circles is adjusted according to multiple measurements and intelligent calculations during rough grinding; the fine grinding initial measurement is combined with multi-data evaluation, and fine grinding is also dynamically adjusted according to measurement and calculation. The device and method use the MES system and intelligent manufacturing equipment to accurately evaluate and intelligently adjust each process, effectively solving many drawbacks of traditional manual grinding, improving chip grinding accuracy, efficiency and quality, and promoting chip grinding to move towards intelligent production.

Description

Technical Field

[0001] The invention relates to the field of wafer grinding measurement technology, and in particular to a fully automatic wafer size grinding control device and method. Background Art

[0002] With the development of science and technology, the traditional chip size grinding method has exposed many problems. Under the background of existing technology, the grinding process mainly relies on manual operation. For example, the calculation of the grinding amount is done manually, which is not only inefficient but also prone to calculation errors. The number of running circles of the grinding equipment is set manually to the meter. This method has poor accuracy because human operation is easily affected by factors such as fatigue and negligence. At the same time, there is a lot of uncertainty in avoiding changes by relying on personnel experience. The experience differences of different personnel may lead to uneven product quality. Moreover, manual repeated initiation, testing, adjustment and other actions are required to complete the setting cycle of the number of grinding circles. The whole process is cumbersome and difficult to realize intelligent manufacturing process, which cannot meet the requirements of modern industry for high-precision, high-efficiency and intelligent production.

[0003] The current chip size grinding control device may have the following problems: 1. The traditional chip size grinding control method has serious deficiencies in the calculation of grinding amount and the setting of the number of equipment running circles. In terms of grinding amount calculation, it relies on manual calculation of the grinding amount for each circle. Manual calculation will be interfered by subjective factors, such as the calculator's concentration, calculation ability and experience differences, etc., which will cause the calculation results to deviate greatly and be unstable. In setting the number of running circles of the grinding equipment, it relies on manual setting of the number of circles to the meter, which is not only inefficient, but also difficult to ensure the accuracy of the setting, which is not conducive to improving the quality of chip products. At the same time, it will also reduce production efficiency, increase production costs, and weaken the company's competitiveness in the market.

[0004] 2. The previous chip size grinding control method had obvious defects in dealing with changes. It only relied on personnel experience to avoid changes. However, personnel experience is limited and subjective. The experience levels of different operators vary. They will make different judgments and handle the same changes differently, and cannot make timely and effective adjustments, making it difficult to stably control the chip grinding process, which is not conducive to ensuring the consistency and stability of chip production.

[0005] 3. The conventional chip size grinding control operation process uses manual repetitive initiation, testing, and adjustment. The operation process is cumbersome and non-intelligent, the links are inefficient, and there are problems such as time waste and error-proneness. For example, data processing and circle adjustment after manual testing are time-consuming and error-prone, which is not conducive to large-scale and efficient production, and it is difficult to meet the speed and output requirements of industrial development, which hinders the automation and intelligence improvement of enterprises. Summary of the invention

[0006] The purpose of the present invention is to provide a fully automatic chip size grinding control device and method to solve the problems existing in the background technology.

[0007] In order to solve the above technical problems, the present invention adopts the following technical solution: The present invention provides a fully automatic chip size grinding control device, including: a chip information acquisition module, which is used to evaluate the information acquisition process of the grinding control device when grinding the chip.

[0008] The rough grinding first measurement and evaluation module is used to perform the first rough grinding measurement and evaluation on the wafer before the rough grinding process starts, and then evaluate whether the size state of the wafer before the rough grinding process starts meets the size state requirements of the rough grinding process.

[0009] The rough grinding process dynamic adjustment module is used to perform the rough grinding process of the wafer when the size state of the wafer meets the normal state requirements before the rough grinding process begins, and evaluate the grinding control device during the rough grinding process of the wafer to optimize the rough grinding process.

[0010] The fine grinding first test evaluation module is used to evaluate whether the size state of the wafer meets the size state requirements of the fine grinding process after the wafer completes the rough grinding process.

[0011] The fine grinding process dynamic adjustment module is used to perform the wafer fine grinding process when the size state of the wafer meets the size state requirements of the fine grinding process, and evaluate the grinding control device to optimize the fine grinding process.

[0012] In a second aspect, the present invention provides a fully automatic chip size grinding control method, comprising: step one, chip information acquisition: evaluating the information acquisition process of the grinding control device when the chip is grinding.

[0013] Step 2: Rough grinding first measurement and evaluation: Before the rough grinding process begins, the wafer is measured and evaluated for the first time to evaluate whether the wafer size before the rough grinding process meets the size requirements of the rough grinding process.

[0014] Step 3, dynamic adjustment of the rough grinding process: When the size state of the wafer meets the normal state requirements before the rough grinding process begins, the wafer rough grinding process is carried out, and during the rough grinding process of the wafer, the grinding control device is evaluated to optimize the rough grinding process.

[0015] Step 4: First test and evaluation of fine grinding: After the wafer has completed the rough grinding process, evaluate whether the size of the wafer meets the size requirements of the fine grinding process.

[0016] Step 5: Dynamic adjustment of the fine grinding process: When the size state of the wafer meets the size state requirement of the fine grinding process, the wafer fine grinding process is performed, and the grinding control device is evaluated to optimize the fine grinding process.

[0017] The beneficial effects of the present invention are as follows: 1. A fully automatic chip size grinding control device and method provided by the present invention, in the process of chip information acquisition, realizes comprehensive acquisition and transmission of chip information through the cooperation of a two-dimensional scanner, an MES system, a counter with a communication interface, a micrometer with a communication function, a serial port server and grinding equipment, etc. Through optical recognition technology and encoding conversion technology, the chip label information is converted into a digital signal and transmitted to the MES system wirelessly, which is beneficial to improving the accuracy and efficiency of information collection. As the core processing center, the MES system realizes centralized management and scheduling of chip information and grinding parameters through connection with various devices, which helps to optimize the parameter setting and control of the grinding process.

[0018] 2. In the initial test and evaluation process of chip grinding in the embodiment of the present invention, whether it is the rough grinding stage using a micrometer with communication function to perform precise measurement and system analysis, or the fine grinding stage using multi-stage measurements to obtain data such as the initial minimum value of fine grinding, the current minimum value of the chip after rough grinding, and the maximum value of the fine grinding process for data comparison, it is possible to accurately judge the chip status in advance, ensure the effectiveness of the rough grinding process, and ensure the smooth progress of the fine grinding process, lay the foundation for high-quality promotion of the entire chip grinding process, effectively improve the accuracy and stability of grinding production, and avoid problems in subsequent processes due to insufficient early evaluation that affect chip quality and production efficiency.

[0019] 3. In the rough grinding process of the wafer, the embodiment of the present invention realizes real-time monitoring and optimization of the grinding process through the dynamic adjustment module of the rough grinding process. The wafer is measured multiple times by a micrometer with communication function to obtain the dimensional data of the grinding process, and the data is analyzed through the MES system. The number of grinding circles and process parameters are dynamically adjusted according to the analysis results, which is conducive to ensuring that the wafer meets the predetermined dimensional requirements in each step of the grinding process, thereby improving the grinding efficiency and accuracy.

[0020] 4. In the embodiment of the present invention, during the fine grinding process of the wafer, a dynamic adjustment module of the fine grinding process is used to realize real-time monitoring and optimization of the grinding process. The wafer is measured multiple times by a micrometer with communication function to obtain dimensional data of the grinding process, and the data is analyzed through the MES system. The number of grinding circles and process parameters are dynamically adjusted according to the analysis results, which is conducive to ensuring that the wafer meets the predetermined dimensional requirements in each step of the grinding process, thereby improving the grinding efficiency and accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 It is a schematic diagram of the system structure connection of the present invention.

[0023] Figure 2 It is a schematic flow chart of the implementation steps of the present invention. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] See also Figure 1 As shown, the present invention provides a fully automatic chip size grinding control device, the system includes: a chip information acquisition module, a rough grinding first test evaluation module, a rough grinding process dynamic adjustment module, a fine grinding first test evaluation module, a fine grinding process dynamic adjustment module and a database.

[0026] The chip information acquisition module is connected to the rough grinding first test evaluation module and the database respectively, the rough grinding first test evaluation module is connected to the rough grinding process dynamic adjustment module and the database respectively, the rough grinding process dynamic adjustment module is connected to the fine grinding first test evaluation module and the database respectively, the fine grinding first test evaluation module is connected to the fine grinding process dynamic adjustment module and the database respectively, and the fine grinding process dynamic adjustment module is connected to the database.

[0027] The wafer information acquisition module is used to evaluate the information acquisition process of the grinding control device when the wafer is being ground.

[0028] In a specific embodiment, the information acquisition process of the evaluation grinding control device when the chip is grinding, the specific evaluation process is as follows: the grinding control device corresponding to the fully automatic chip size grinding includes a two-dimensional scanning gun, a computer display, an MES system, a counter with a communication interface, a micrometer with communication function, a serial port server and grinding equipment.

[0029] The two-dimensional scanner directly contacts and scans the wafer label through the built-in scanning function, and converts the wafer information on the wafer label into a digital signal through the internal optical recognition technology and code conversion technology. The digital signal is transmitted to the MES system wirelessly. After receiving the wafer information obtained from the scanner, the MES system stores the wafer information in the database, and establishes a connection with the remaining devices in the grinding control device through the communication function. The MES system is connected to the grinding equipment through a specific serial communication protocol, and then the wafer information is transmitted to the grinding equipment for setting the grinding parameters before grinding. After the serial port server is connected to the MES system, the wafer information and grinding parameters in the MES system are forwarded to each device in the grinding control device through a specific protocol, and the data parameters received from each device in the grinding control device are transmitted to the MES system, thereby realizing the information acquisition of the grinding control device when the wafer is grinding.

[0030] It should be noted that the chip information includes but is not limited to the product number, batch number, raw material information and preset values ​​of grinding parameters corresponding to the chip type. Wireless includes Bluetooth and wireless communication protocols in specific frequency bands. The two-dimensional scanner is the front-end device for collecting chip information. The MES system serves as the core information processing and coordination center. The computer monitor is connected to the MES system via a network cable or other suitable communication cable to display the information processed by the MES system. The processed information includes chip information, grinding parameters and measurement data. A counter with a communication interface is connected to the grinding equipment to receive relevant command information such as the number of grinding turns forwarded by the MES system through the serial port server, and at the same time, the current status of the counter is fed back to the MES system. The grinding parameters include the number of grinding turns, grinding pressure and grinding speed of the grinding equipment.

[0031] The rough grinding first measurement and evaluation module is used to perform the first rough grinding measurement and evaluation on the wafer before the rough grinding process starts, and then evaluate whether the size state of the wafer before the rough grinding process starts meets the size state requirements of the rough grinding process.

[0032] In a specific embodiment, the rough grinding initial measurement and evaluation of the wafer is performed before the rough grinding process begins. The specific process is as follows: in the initial measurement stage before the rough grinding process begins, various parts of the wafer are measured by a micrometer with a communication function, and the wafer size data is obtained. The wafer size data includes test value 1, test value 2 and test value 3. The size of the wafer size data corresponding to the test value is compared by the EMS system, and the minimum observed value of the corresponding wafer size in the initial rough grinding measurement is obtained, and the minimum observed value is recorded as After the wafer is cut and ground by the grinding control device, the cut and ground wafer is cut into wafer fragments, and each wafer fragment is measured by a micrometer with a communication function to obtain the size value of each wafer fragment after cutting. The corresponding size values ​​of each wafer fragment are compared by the EMS system, and then the minimum value of the corresponding size values ​​of each wafer fragment is recorded as the minimum value of the cutting inspection, and the minimum value of the cutting inspection is recorded as , get the fine grinding target value from the database .

[0033] It should be noted that the various parts refer to the center, edge and different angles of the chip.

[0034] In a specific embodiment, the evaluation of whether the wafer size state meets the size state requirements of the rough grinding process is performed as follows: , Cutting test minimum value and fine grinding target value , the result of analyzing whether the chip size state meets the size state requirements of the rough grinding process is obtained, and the judgment result is recorded as , Contains values ​​1 and 0. When the value is 1, it means that the chip size state meets the size state requirements of the rough grinding process. When the value is 0, it indicates that the chip size state does not meet the size state requirements of the rough grinding process.

[0035] The minimum observed value , Cutting test minimum value and fine grinding target value Substitute the rough grinding process size state discriminant formula:

[0036] , get the determination result of chip size status ,in Indicates 0.08 mm.

[0037] It should be noted that when the chip size status does not meet the size status requirements of the rough grinding process, it is judged as an abnormal chip, an abnormal order is initiated, and the previous entry status of the chip is released. Only when the abnormality is released can the operation continue. For example, if it is a problem with the parameter setting of the grinding equipment, such as the wrong number of grinding circles or inaccurate grinding speed, it is necessary to adjust the equipment parameters. If it is a problem with the chip material, such as uneven hardness, it is necessary to replace the chip or process the material.

[0038] The rough grinding process dynamic adjustment module is used to perform the rough grinding process of the wafer when the size state of the wafer meets the normal state requirements before the rough grinding process begins, and evaluate the grinding control device during the rough grinding process of the wafer to optimize the rough grinding process.

[0039] In a specific embodiment, the rough grinding process and the fine grinding process of the wafer are performed, and the specific process is as follows: when the size state of the wafer meets the size state requirements of the rough grinding process and the fine grinding process, the rough grinding number of circles and the rough grinding process specification coefficient preset in the rough grinding process and the fine grinding number of circles and the fine grinding process specification coefficient preset in the fine grinding process after the rough grinding first measurement and the rough grinding process are obtained from the database, and the rough grinding number of circles, the rough grinding process specification coefficient, the fine grinding number of circles and the fine grinding process specification coefficient are recorded as , , , , and then the wafer is ground in a rough grinding process and a fine grinding process, wherein Indicates the number corresponding to the number of grinding circles. .

[0040] In a specific embodiment, the process of evaluating the grinding control device to optimize the rough grinding during the rough grinding process of the wafer is as follows: Step 1, according to the minimum observed value of the corresponding wafer size in the rough grinding first measurement When the wafer is rough ground for the second time, the various parts of the wafer are measured by a micrometer with communication function to obtain the rough grinding test value. , , , select the rough grinding test value through the EMS system , , The minimum value among them is recorded as the minimum value of the second rough grinding test. , by calculating the formula

[0041] , get the value of the first test circle of rough grinding , is the number of first grinding laps, if , it indicates that the second rough grinding test is normal and this stage is completed. , it indicates an abnormality, then the calculation formula

[0042] , get the number of second grinding turns for rough grinding , Indicates rounding down.

[0043] Step 2: Obtain the minimum values ​​of the three rough grinding measurements through the EMS system , calculated by the formula:

[0044] , get the value of the second test circle of rough grinding ,like , then the three tests of rough grinding are normal and this stage is completed. , it indicates an abnormality, then the calculation formula is:

[0045] , get the third grinding number of rough grinding .

[0046] Step 3. Obtain the minimum values ​​of the four rough grinding measurements through the EMS system ,like , then the rough grinding process is completed. If , then manually input the number of grinding tail turns.

[0047] It should be noted that the "normal" in "then it indicates that the rough grinding and second measurement are normal" means that the size of the wafer is smaller than the lower limit of the size required by the rough grinding process, that is, , indicating that the rough grinding size is controlled within the rough grinding process requirements, and the rough grinding stage has completed the requirements for reducing the chip size as planned, without insufficient grinding. The "abnormal" in "abnormal" means that the minimum size of the chip is still greater than the lower limit of the size required by the rough grinding process, that is, For example, insufficient grinding amount, changes in the hardness of the grinding material leading to reduced grinding efficiency, etc., the wafer is not ground to the expected size, and it is necessary to continue to adjust the grinding parameters to correct it.

[0048] It should also be noted that when the minimum value R of the four rough grinding measurements is obtained through the EMS system and When the rough grinding process is started, the staff calculates the number of additional grinding turns based on experience or specific process standards, and then manually enters the number of turns into the corresponding parameter setting column on the equipment's operating interface to start the equipment to perform additional grinding on the wafer until the wafer size meets the requirements of the rough grinding process.

[0049] During the rough grinding process of the wafer, the embodiment of the present invention realizes real-time monitoring and optimization of the grinding process through the rough grinding process dynamic adjustment module, measures the wafer multiple times through a micrometer with communication function, obtains dimensional data of the grinding process, and performs data analysis through the MES system. The number of grinding circles and process parameters are dynamically adjusted according to the analysis results, which is beneficial to ensure that the wafer meets the predetermined dimensional requirements in each step of the grinding process, thereby improving the grinding efficiency and accuracy.

[0050] The fine grinding first test evaluation module is used to evaluate whether the size state of the wafer meets the size state requirements of the fine grinding process after the wafer completes the rough grinding process.

[0051] In a specific embodiment, the wafer is subjected to the first fine grinding measurement and evaluation after the rough grinding process is completed. The specific process is as follows: after the rough grinding process is completed and before the fine grinding process begins, the minimum value of the first fine grinding measurement is obtained through the EMS system, and the minimum value of the first measurement is recorded as When the wafer is finished with the rough grinding process and is undergoing the first fine grinding measurement, the wafer that has completed the rough grinding process is measured by a micrometer with communication function to obtain the size of the wafer that has completed the rough grinding process, which is recorded as the current minimum value. , obtain the ideal upper limit of the size that the wafer reaches after the fine grinding process is completed from the database, and record the ideal upper limit of the size as the maximum value of the fine grinding process .

[0052] It should be noted that, for example, the wafer may be slightly deformed after being placed for a period of time after rough grinding, and the minimum size after this deformation can be understood as the current minimum value. In the fine grinding first test evaluation, it is used together with the first test minimum value and the fine grinding process maximum value to determine whether fine grinding can be started.

[0053] In a specific embodiment, the evaluation of whether the wafer size state meets the size state requirements of the fine grinding process is as follows: the minimum value of the first measurement is recorded as , current minimum value and fine grinding process maximum , the result of determining whether the wafer size meets the size requirement of the fine grinding process is recorded as , Contains values ​​1 and 0. When the value is 1, it means that the chip size state meets the size state requirements of the fine grinding process. When the value is 0, it indicates that the chip size state does not meet the size state requirements of the fine grinding process.

[0054] The minimum value of the first measurement is recorded as , current minimum value and fine grinding process maximum Substitute into the fine grinding process size state discriminant formula:

[0055] , get the determination result of chip size status ,in Indicates 0.03 mm.

[0056] In the initial test and evaluation process of chip grinding in the embodiment of the present invention, no matter it is the rough grinding stage using a micrometer with communication function to perform precise measurement and system analysis, or the fine grinding stage using multi-stage measurement to obtain data comparison such as the initial minimum value of fine grinding, the current minimum value of the chip after rough grinding, and the maximum value of the fine grinding process, the chip status can be accurately judged in advance, the effectiveness of the rough grinding process can be guaranteed while ensuring the smooth progress of the fine grinding process, laying the foundation for high-quality promotion of the entire chip grinding process, effectively improving the accuracy and stability of grinding production, and avoiding problems in subsequent processes due to insufficient early evaluation that affect chip quality and production efficiency.

[0057] The fine grinding process dynamic adjustment module is used to perform the wafer fine grinding process when the size state of the wafer meets the size state requirements of the fine grinding process, and evaluate the grinding control device to optimize the fine grinding process.

[0058] In a specific embodiment, the process of evaluating the grinding control device to optimize the rough grinding during the fine grinding process of the wafer is as follows: Stage 1, when the wafer size state meets the size state requirements of the fine grinding process, the minimum value of the fine grinding second measurement is obtained through the EMS system , according to the minimum value of the first measurement, recorded as , the minimum value of the fine grinding The minimum value of the first measurement is recorded as Substitute into the calculation formula to get the value of the first test circle of fine grinding ,like , it indicates that the fine grinding test is normal. , it indicates abnormality, then the second grinding number of fine grinding can be calculated by the calculation formula .

[0059] Stage 2: Obtain the minimum values ​​of the three fine grinding tests through the EMS system , the fine grinding secondary test circle value is calculated by the calculation formula ,like , then the three measurements of fine grinding are normal, and there is no need to calculate the number of third grinding turns of fine grinding. , it indicates abnormality, then the third grinding circle number of fine grinding can be calculated by the calculation formula .

[0060] Stage 3: Obtain the minimum values ​​of the four fine grinding tests through the EMS system ,like , then the fine grinding process is completed. If , then manually input the number of grinding tail turns.

[0061] It should be noted that the calculations mentioned in Stage 1 and Stage 2 , , and The calculation formula is the same as that in Step 1 and Step 2, and will not be repeated here.

[0062] During the wafer fine grinding process, the embodiment of the present invention realizes real-time monitoring and optimization of the grinding process through the fine grinding process dynamic adjustment module, measures the wafer multiple times through a micrometer with communication function, obtains dimensional data of the grinding process, and performs data analysis through the MES system. The number of grinding circles and process parameters are dynamically adjusted according to the analysis results, which is beneficial to ensure that the wafer meets the predetermined dimensional requirements in each step of the grinding process, thereby improving the grinding efficiency and accuracy.

[0063] See also Figure 2 As shown, a fully automatic chip size grinding control method includes the following steps: Step 1, chip information acquisition: evaluate the information acquisition process of the grinding control device when the chip is grinding.

[0064] Step 2: Rough grinding first measurement and evaluation: Before the rough grinding process begins, the wafer is measured and evaluated for the first time to evaluate whether the wafer size before the rough grinding process meets the size requirements of the rough grinding process.

[0065] Step 3, dynamic adjustment of the rough grinding process: When the size state of the wafer meets the normal state requirements before the rough grinding process begins, the wafer rough grinding process is carried out, and during the rough grinding process of the wafer, the grinding control device is evaluated to optimize the rough grinding process.

[0066] Step 4: First test and evaluation of fine grinding: After the wafer has completed the rough grinding process, evaluate whether the size of the wafer meets the size requirements of the fine grinding process.

[0067] Step 5: Dynamic adjustment of the fine grinding process: When the size state of the wafer meets the size state requirement of the fine grinding process, the wafer fine grinding process is performed, and the grinding control device is evaluated to optimize the fine grinding process.

[0068] The present invention provides a fully automatic chip size grinding control device and method. In the process of chip information acquisition, the comprehensive acquisition and transmission of chip information are realized through the cooperation of a two-dimensional scanner, an MES system, a counter with a communication interface, a micrometer with a communication function, a serial port server, a grinding device and other equipment. The chip label information is converted into a digital signal through optical recognition technology and encoding conversion technology, and is transmitted to the MES system wirelessly, which is beneficial to improving the accuracy and efficiency of information collection. The MES system, as a core processing center, realizes centralized management and scheduling of chip information and grinding parameters through connection with various devices, which is helpful to optimize the parameter setting and control of the grinding process.

[0069] The above contents are merely examples and explanations of the concept of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the concept of the invention or exceed the scope defined in this specification, they shall all fall within the protection scope of the present invention.

Claims

1. A fully automatic chip size grinding control device, comprising a grinding control device body and a fully automatic chip size grinding control system, characterized in that: The fully automatic wafer size grinding control system includes: A wafer information acquisition module, used to evaluate the information acquisition process of the grinding control device when the wafer is being ground; A rough grinding first measurement and evaluation module is used to perform a rough grinding first measurement and evaluation on the wafer before the rough grinding process begins, and then evaluate whether the wafer size state before the rough grinding process begins meets the size state requirements of the rough grinding process; A rough grinding process dynamic adjustment module is used to perform the rough grinding process of the wafer when the size state of the wafer meets the normal state requirement before the rough grinding process starts, and to evaluate the grinding control device during the rough grinding process of the wafer to optimize the rough grinding process; The fine grinding first test evaluation module is used to evaluate whether the size state of the wafer meets the size state requirements of the fine grinding process after the wafer completes the rough grinding process; A dynamic adjustment module for fine grinding process, which is used to perform the wafer fine grinding process when the size state of the wafer meets the size state requirements of the fine grinding process, and evaluate the process of optimizing the fine grinding by the grinding control device; The wafer is subjected to the first rough grinding measurement and evaluation before the rough grinding process begins. The specific process is as follows: In the initial test phase before the rough grinding process begins, the various parts of the wafer are measured by a micrometer with communication function to obtain the wafer size data. The wafer size data includes test value 1, test value 2 and test value 3. The MES system compares the size of the wafer size data corresponding to the test value, and then obtains the minimum observed value of the corresponding wafer size in the initial rough grinding test. The minimum observed value is recorded as After the wafer is cut and ground by the grinding control device, the cut and ground wafer is cut into wafer fragments, and each wafer fragment is measured by a micrometer with a communication function to obtain the size value of each wafer fragment after cutting. The corresponding size values ​​of each wafer fragment are compared by the MES system, and then the minimum value of the corresponding size value of each wafer fragment is recorded as the minimum value of the cutting inspection, and the minimum value of the cutting inspection is recorded as , get the fine grinding target value from the database ; The specific process of evaluating whether the wafer size state meets the size state requirements of the rough grinding process is as follows: Based on the minimum observed value , Cutting test minimum value and fine grinding target value , the result of analyzing whether the chip size state meets the size state requirements of the rough grinding process is obtained, and the judgment result is recorded as , Contains values ​​1 and 0. When the value is 1, it means that the chip size state meets the size state requirements of the rough grinding process. When the value is 0, it indicates that the wafer size state does not meet the size state requirements of the rough grinding process; The minimum observed value , Cutting test minimum value and fine grinding target value Substitute the rough grinding process size state discriminant formula: ； Obtain the determination result of the wafer size status ,in Indicates 0.08 mm.

2. The fully automatic wafer size grinding control device according to claim 1, characterized in that: The information acquisition process of the evaluation grinding control device when the wafer is grinding is as follows: The grinding control device corresponding to the fully automatic wafer size grinding includes a two-dimensional scanner, a computer display, an MES system, a counter with a communication interface, a micrometer with communication function, a serial port server and grinding equipment; The two-dimensional scanner directly contacts and scans the wafer label through the built-in scanning function, and converts the wafer information on the wafer label into a digital signal through the internal optical recognition technology and code conversion technology. The digital signal is transmitted to the MES system wirelessly. After receiving the wafer information obtained from the scanner, the MES system stores the wafer information in the database, and establishes a connection with the remaining devices in the grinding control device through the communication function. The MES system is connected to the grinding equipment through the serial communication protocol, and then the wafer information is transmitted to the grinding equipment for setting the grinding parameters before grinding. After the serial port server is connected to the MES system, the wafer information and grinding parameters in the MES system are forwarded to each device in the grinding control device through the protocol, and the data parameters received from each device in the grinding control device are transmitted to the MES system, so as to realize the information acquisition of the grinding control device when the wafer is grinding.

3. The fully automatic wafer size grinding control device according to claim 2, characterized in that: The specific process of performing the rough grinding process and the fine grinding process of the wafer is as follows: When the wafer size state meets the size state requirements of the rough grinding process and the fine grinding process, the rough grinding number of grinding circles and the rough grinding process specification coefficient preset in the rough grinding process and the fine grinding number of grinding circles and the fine grinding process specification coefficient preset in the fine grinding process are obtained from the database after the rough grinding first measurement and the rough grinding process is completed, and the rough grinding number of grinding circles, the rough grinding process specification coefficient, the fine grinding number of grinding circles and the fine grinding process specification coefficient are recorded as , , , , and then the wafer is ground in a rough grinding process and a fine grinding process, wherein Indicates the number corresponding to the number of grinding circles. .

4. The fully automatic wafer size grinding control device according to claim 3, characterized in that: After the rough grinding process is completed, the wafer is subjected to the first measurement and evaluation of fine grinding. The specific process is as follows: After the rough grinding process is completed and before the fine grinding process begins, the minimum value of the first fine grinding test is obtained through the MES system and recorded as When the wafer is finished with the rough grinding process and is undergoing the first fine grinding measurement, the wafer that has completed the rough grinding process is measured by a micrometer with communication function to obtain the size of the wafer that has completed the rough grinding process, which is recorded as the current minimum value. , obtain the ideal size upper limit value that the wafer reaches after the fine grinding process is completed from the database, and record the ideal size upper limit value as the maximum value of the fine grinding process .

5. The fully automatic wafer size grinding control device according to claim 4, characterized in that: The specific process of evaluating whether the wafer size state meets the size state requirements of the fine grinding process is as follows; According to the minimum value of the first measurement, it is recorded as , current minimum value and fine grinding process maximum , the result of determining whether the wafer size meets the size requirement of the fine grinding process is recorded as , Contains values ​​1 and 0. When the value is 1, it means that the chip size state meets the size state requirements of the fine grinding process. When the value is 0, it indicates that the wafer size state does not meet the size state requirements of the fine grinding process; The minimum value of the first measurement is recorded as , current minimum value and fine grinding process maximum Substitute into the fine grinding process size state discriminant formula: ； Obtain the determination result of the wafer size status ,in Indicates 0.03 mm.

6. A fully automatic wafer size grinding control method for executing the fully automatic wafer size grinding control device according to any one of claims 1 to 5, characterized in that: The steps include: Step 1, wafer information acquisition: evaluating the information acquisition process of the grinding control device when the wafer is being ground; Step 2: Rough grinding first measurement and evaluation: Before the rough grinding process begins, the wafer is measured and evaluated for the first time to evaluate whether the wafer size before the rough grinding process meets the size requirements of the rough grinding process; Step 3, dynamic adjustment of the rough grinding process: when the size state of the wafer meets the normal state requirement before the rough grinding process starts, the wafer rough grinding process is performed, and during the rough grinding process of the wafer, the grinding control device is evaluated to optimize the rough grinding process; Step 4: First test and evaluation of fine grinding: After the wafer has completed the rough grinding process, evaluate whether the size of the wafer meets the size requirements of the fine grinding process; Step 5: Dynamic adjustment of the fine grinding process: When the size state of the wafer meets the size state requirement of the fine grinding process, the wafer fine grinding process is performed, and the grinding control device is evaluated to optimize the fine grinding process.

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