Polishing protection device and chemical mechanical polishing system

Abstract

The utility model discloses a polishing protection device and a chemical mechanical polishing system, and the polishing protection device comprises a check ring with an annular structure, which is arranged on the peripheral side of a polishing disk; the fixed end of the lifting assembly is connected to a base of the polishing system, and the movable end of the lifting assembly is connected to the check ring so as to drive the check ring to move in the vertical direction; the lifting assembly is provided with a protective sleeve so as to prevent polishing waste liquid from entering the lifting assembly.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of semiconductor manufacturing, and in particular to a polishing protection device and a chemical mechanical polishing system. BACKGROUND

[0002] The integrated circuit industry is the core of the information technology industry and plays a key role in promoting the transformation and upgrading of the manufacturing industry to digitalization and intelligence. Chips are the carriers of integrated circuits, and chip manufacturing involves integrated circuit design, wafer manufacturing, wafer processing, electrical measurement, cutting and packaging, and testing processes. Among them, chemical mechanical polishing is one of the five core processes in the wafer manufacturing process.

[0003] Chemical mechanical polishing (CMP) is a global planarization ultra-precision surface processing technology. Chemical mechanical polishing usually attracts the wafer to the bottom surface of the carrier head, the side of the wafer with the deposition layer abuts against the upper surface of the polishing pad, and the carrier head rotates with the polishing pad under the actuation of the drive assembly and gives the wafer downward load; the polishing liquid is supplied to the upper surface of the polishing pad and distributed between the wafer and the polishing pad, so that the wafer completes the chemical mechanical polishing of the wafer under the joint action of chemical and mechanical.

[0004] During the polishing process, the polishing disc rotates at a certain speed, and the polishing waste liquid and cleaning water on the surface of the polishing pad will be thrown out under the action of centrifugal force. In order to control the influence of the polishing waste liquid on the polishing unit, an annular retaining ring is usually arranged on the outer periphery of the polishing disc, and the retaining ring is provided with a lifting mechanism. The lifting mechanism drives the retaining ring to move up and down to cooperate with the interaction of the carrier head and the load cup, preventing the uncontrolled throwing out of the polishing waste liquid.

[0005] In the prior art, the lifting mechanism usually does not have a waterproof function, and the polishing waste liquid will enter the inside of the lifting mechanism and flow along the lifting mechanism to the lower rack of the CMP system, causing the components in the corresponding area of the lower rack to be flooded, thereby affecting the safety of the operation of the CMP system. UTILITY MODEL CONTENT

[0006] Therefore, the present application provides a polishing protection device and a chemical mechanical polishing system to at least partially solve the above problems.

[0007] According to a first aspect of the present application, a polishing protection device is provided for protecting the polishing disc in the polishing system, which comprises:

[0008] a retaining ring of annular structure arranged on the outer periphery of the polishing disc;

[0009] A lifting assembly has a fixed end connected to a base of the polishing system and a moving end connected to the baffle ring to move the baffle ring vertically.

[0010] The lifting assembly is provided with a protective sleeve to prevent the polishing waste liquid from entering the interior of the lifting assembly.

[0011] In some embodiments, the lifting assembly includes a guide sleeve arranged on the outer periphery of the moving end, and the protective sleeve is arranged on the outer periphery of the guide sleeve.

[0012] In some embodiments, the guide sleeve is a cylindrical structure including a guide seat and a guide cylinder, the guide seat is fixed to the base, and the guide cylinder is arranged above the guide seat and is slidingly connected to the outer periphery of the moving end.

[0013] In some embodiments, the protective sleeve includes a first protective sleeve arranged on the outer periphery of the guide cylinder, and the first protective sleeve is connected to the moving end.

[0014] In some embodiments, the protective sleeve includes a second protective sleeve arranged on the outer periphery of the first protective sleeve and fixed to the base.

[0015] In some embodiments, the protective sleeve includes a third protective sleeve arranged on the outer periphery of the second protective sleeve and fixed to the moving end.

[0016] In some embodiments, the outer periphery of the guide cylinder is provided with an annular protrusion, the number of the protrusions is at least one, and the protrusions are arranged on the upper part of the guide cylinder.

[0017] In some embodiments, the outer periphery of the guide cylinder is a tapered structure, the outer diameter of the upper end is smaller than that of the lower end, so that the gap between the first protective sleeve and the guide cylinder gradually decreases from top to bottom.

[0018] In some embodiments, when the moving end with the baffle ring moves upward to the working position, the protrusions are located above the lower end surface of the first protective sleeve.

[0019] In some embodiments, the first protective sleeve is a single-end open cylindrical structure, and the opening is arranged downward.

[0020] In some embodiments, the second protective sleeve is a two-end open cylindrical structure, and is arranged on the outer side of the first protective sleeve in a spaced manner; the second protective sleeve includes a fixed flange arranged above the guide seat.

[0021] In some embodiments, the third protective sleeve is a single-end open cylindrical structure, the opening is arranged downward, and the third protective sleeve is arranged on the outer side of the second protective sleeve in a spaced manner.

[0022] In some embodiments, the guide seat is a disc structure, and the protective sleeve is arranged above the guide seat.

[0023] In some embodiments, a liquid discharge groove is arranged above the guide seat to discharge the liquid falling through the protective sleeve and the guide cylinder.

[0024] In some embodiments, when the moving end of the lifting assembly drives the blocking ring to move upward to the working position, the first protective sleeve, the second protective sleeve and the third protective sleeve overlap in the vertical direction.

[0025] In some embodiments, when the moving end of the lifting assembly drives the blocking ring to move downward to the standby position, there are gaps between the lower end surface of the first protective sleeve and the guide seat, between the upper end surface of the second protective sleeve and the top wall of the third protective sleeve, and between the lower end surface of the third protective sleeve and the fixed flange of the second protective sleeve.

[0026] In some embodiments, the guide cylinder is a cylindrical structure, and at least one sealing groove for mounting a sealing ring is arranged on the outer periphery of the guide cylinder, the sealing groove is arranged on the upper part of the guide cylinder, and the first protective sleeve is in sliding sealing connection with the guide cylinder through the sealing ring.

[0027] In some embodiments, the guide seat is a disc structure, and a liquid discharge groove is arranged above the guide seat to discharge the liquid falling through the protective sleeve and the guide cylinder.

[0028] In some embodiments, when the moving end of the lifting assembly drives the blocking ring to move upward to the working position, the sealing ring is located in the vertical overlapping section of the guide cylinder and the first protective sleeve.

[0029] According to the second aspect of the embodiments of the present application, a chemical mechanical polishing system is provided, which comprises a polishing disc, a carrier head, a liquid supply device and a dressing device, the carrier head presses a wafer to be polished against a polishing pad above the polishing disc, the liquid supply device supplies polishing liquid towards the polishing pad and the wafer, and the dressing device is used for dressing the surface of the polishing pad; and the polishing protection device described above is further included to block the polishing waste liquid from entering the inside of the lifting assembly.

[0030] The beneficial effects of the present application include:

[0031] a. The lifting assembly of the polishing protection device is provided with a protective sleeve to block the polishing waste liquid from entering the inside of the lifting assembly, so as to avoid the polishing waste liquid from infiltrating along the lifting assembly to the lower rack of the CMP system and causing the water to enter the corresponding parts, thereby ensuring the safety and stability of the operation of the CMP system.

[0032] b.The protective sleeve is a processed component rather than a consumable product, which has no risk of aging and damage, effectively ensuring the protection effect of the lifting assembly; at the same time, the protective sleeve has no aging replacement problem, reducing the maintenance operation time of the CMP system;

[0033] c.There is a gap between the lower end face of the first protective sleeve and the guide seat, between the upper end face of the second protective sleeve and the top wall of the third protective sleeve, and between the lower end face of the third protective sleeve and the fixing flange of the second protective sleeve, so that the protective sleeve does not interfere with the adjacent components when the stop ring is restored to the standby position;

[0034] d.The lifting assembly is provided with a guide, and the guide comprises a guide cylinder, and an annular protrusion is arranged on the outer periphery of the guide cylinder, and the protrusion is integrally formed with the guide cylinder; the protrusion is arranged to extend outward and downward from the outer side wall of the guide cylinder, so as to prevent the liquid attached to the outer side wall of the guide cylinder from moving upward;

[0035] e.The outer periphery of the guide cylinder is in a conical structure, and the outer diameter of the upper end is smaller than that of the lower end, so that the first gap formed by the first protective sleeve and the guide cylinder gradually decreases from top to bottom, thereby increasing the difficulty of the polishing waste liquid moving upward from bottom to top through the first gap, and improving the waterproof effect of the lifting assembly;

[0036] f.A transition section is arranged between the guide cylinder and the guide seat, and the outer side wall of the transition section is in a conical structure, and the outer diameter of the transition section gradually increases from top to bottom, which is beneficial to the rapid entry of the fluid into the drainage groove and then flows to the waste liquid discharge outlet through the drainage groove;

[0037] g.A drainage groove is arranged above the guide seat, and the drainage groove is used for discharging the liquid falling through the protective sleeve and the guide cylinder, so as to concentrate the small amount of liquid entering the interior through the protective sleeve to be discharged to the outside of the CMP system through the drainage groove, and prevent the liquid from affecting the safe operation of other components in the CMP system. BRIEF DESCRIPTION OF DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments described in the present application, and other drawings can also be obtained by those skilled in the art according to these drawings.

[0039] Figure 1 is a schematic view of a polishing protection device provided by an embodiment of the present application;

[0040] Figure 2 is a schematic view of a lifting assembly provided with a protective sleeve according to an embodiment of the present application;

[0041] Figure 3 isFigure 2 A local enlarged view at the middle A;

[0042] Figure 4 is a schematic view of a guide cylinder provided by an embodiment of the present application;

[0043] Figure 5 is a schematic view of a mobile terminal moving to a high position with a blocking ring provided by an embodiment of the present application;

[0044] Figure 6 is a schematic view of a lifting assembly provided with a protective sleeve according to another embodiment of the present application;

[0045] Figure 7 is a schematic view of a mobile terminal moving to a high position with a blocking ring according to an embodiment; Figure 6 is a schematic view of a mobile terminal moving to a high position with a blocking ring according to an embodiment;

[0046] Figure 8 is a schematic view of a chemical mechanical polishing system according to an embodiment of the present application. DETAILED DESCRIPTION

[0047] In order to make the personnel in the art better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the embodiments of the present application shall fall within the scope of protection of the embodiments of the present application.

[0048] The terminology used in this application is merely for the purpose of describing particular embodiments and is not intended to limit the present application. The singular forms "a", "an", and "the" used in this application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0049] It should be understood that although the terms "first", "second", "third", etc. are used to describe various information in the present application, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information without departing from the scope of the present application. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0050] Figure 1is a schematic view of the polishing protection device 100 provided by an embodiment of the utility model, the polishing protection device 100 is used for Figure 8 The protection of the polishing disc 200 in the chemical mechanical polishing system 1000 is shown. Specifically, the polishing protection device 100 includes a baffle 10, which is annular in structure and is arranged on the outer periphery of the polishing disc 200 to block the polishing waste liquid that is thrown off from the upper side of the polishing disc 200 by centrifugal force and to inhibit the outward diffusion of the polishing waste liquid to pollute other areas.

[0051] Specifically, a polishing pad is arranged on the upper side of the polishing disc, and polishing liquid is supplied between the wafer and the polishing pad, and the wafer that is pressed against the surface of the polishing pad is subjected to chemical mechanical polishing under the action of chemical and mechanical forces to remove the material on the surface of the wafer; after polishing, deionized water (DIW) is supplied to the surface of the polishing pad to clean the pollutants remaining on the surface of the polishing pad; these pollutants and the deionized water will be thrown to the inner side wall of the baffle 100 under the action of centrifugal force and will be guided to the waste liquid discharge port under the action of gravity.

[0052] The polishing protection device 100 further includes a lifting assembly 20, which includes a fixed end 21 and a moving end 22, as shown in Figure 2 The fixed end 21 is connected to the base 1100 of the chemical mechanical polishing system 1000, and the moving end 22 is the output shaft of the lifting assembly 20 and is connected to the baffle 10 to drive the baffle 10 to move in the vertical direction to cooperate with Figure 8 The loading and unloading of the carrier head 300 and the control of the throwing range of the polishing waste liquid are shown.

[0053] Specifically, when the carrier head 300 loads the wafer from the loading cup, it needs to move towards the direction in which the polishing disc 200 is located, at which time the moving end 22 of the lifting assembly 20 drives the baffle 10 to move downwards to avoid interference between the carrier head and the baffle 10; when the carrier head moves to the upper side of the polishing disc 200 and starts to implement polishing by pressing the loaded wafer against the polishing pad, the moving end 22 of the lifting assembly 20 drives the baffle 10 to move upwards, so that at least part of the baffle 10 is located above the polishing pad to block the polishing waste liquid from splashing outwards, thereby controlling the throwing area of the polishing waste liquid and avoiding pollution of other areas of the polishing system by the polishing waste liquid. It should be noted that the loading cup is usually arranged on the side of the polishing disc 200 and is arranged on the moving path of the carrier head 300 to facilitate the loading of the wafer from the loading cup by the carrier head 300 or the unloading of the wafer of the carrier head 300 to the loading cup.

[0054] Generally, the lifting assembly 20 has no waterproof function, and the polishing waste liquid can enter the inside of the lifting assembly 20 and flow along the lifting assembly 20 to the lower rack of the CMP system, so that the parts in the corresponding area of the lower rack of the CMP system are waterlogged, thereby affecting the safety of the operation of the CMP system.

[0055] To solve the above problems, the polishing protection device 100 provided by the utility model further includes a protective sleeve 30, which can improve the waterproofness of the lifting assembly 20, block the polishing waste liquid from entering the inside of the lifting assembly 20, and especially prevent the polishing waste liquid from splashing to the moving end 22 of the lifting assembly 20 and flowing into the guide cylinder 23b of the guide 23 mentioned below.

[0056] Figure 2 is a schematic view of the lifting assembly 20 provided with the protective sleeve 30 according to an embodiment of the utility model, in which the lifting assembly 20 includes a guide 23, and the guide 23 is sleeved on the outer circumferential side of the moving end 22.

[0057] The guide 23 is fixed to the check ring 10 through an adapter plate 40, and the adapter plate 40 is connected between the moving end 22 and the check ring 10, so that the moving end 22 can drive the check ring 10 to move in the vertical direction. Figure 2 It is noted that the check ring 10 is partially shown by a dotted line, which is annular in structure and has a certain height in the vertical direction.

[0058] Further, the guide 23 is a cylindrical structure, and a vertical through hole is arranged in the inside of the guide 23, and the moving end 22 is slidingly connected in the through hole, so that the moving end 22 can move in the vertical direction under the limitation of the guide 23.

[0059] The guide 23 includes a guide seat 23a and a guide cylinder 23b, as shown in Figure 4 The guide seat 23a is fixed to the base 1100, and the guide cylinder 23b is arranged above the guide seat 23a, and the two are integrally formed.

[0060] Figure 2 The moving end 22 is slidingly connected in the through hole of the guide cylinder 23b, and thus the check ring 10 fixed through the adapter plate 40 is stably moved in the vertical direction.

[0061] In the utility model, the protective sleeve 30 is arranged on the outer circumferential side of the guide 23 to improve the waterproof performance of the lifting assembly 20, so as to inhibit the polishing waste liquid or other fluids from entering the inside of the lifting assembly 20 and avoid the liquid entering the lower rack of the CMP system through the lifting assembly 20 to cause the parts in the corresponding area to be waterlogged.

[0062] Furthermore, the protective sleeve 30 includes a first protective sleeve 31, a second protective sleeve 32, and a third protective sleeve 33, which are arranged sequentially from the inside to the outside, based on the guide member 23. Figure 2 As shown.

[0063] Figure 2 In the middle, the mobile terminal 22 and the connected retaining ring 10 are in the low position, i.e. the standby position, so as to cooperate with the carrier head 300 to complete the loading and unloading of the wafer. Figure 3 yes Figure 2 A magnified view of point A in the middle, to more clearly show the positional relationship between adjacent components.

[0064] The first protective sleeve 31 is a cylindrical structure with a single-end opening facing downwards. It is fitted around the outer periphery of the guide tube 23b. The first protective sleeve 31 is connected to the moving end 22, so that the first protective sleeve 31 can move up and down synchronously with the moving end 22 to provide protection for a part of the moving end 22 and the guide tube 23b.

[0065] The second protective sleeve 32 is a cylindrical structure with openings at both ends, and is spaced apart on the outside of the first protective sleeve 31. The second protective sleeve 32 is fitted onto the outer periphery of the first protective sleeve 31, and is fixed to the base 1100. That is, the second protective sleeve 32 is fixed and its main function is to provide protection for the guide cylinder 23b.

[0066] Furthermore, the second protective sleeve 32 includes a fixed flange 32a, which is disposed above the guide seat 23a and is detachably connected to the base 1100. When the moving end 22 moves upward with the first protective sleeve 31 and the retaining ring 10, the lower part of the guide cylinder 23b will inevitably be exposed to the outside, and polishing waste liquid may splash onto the outer periphery of the guide cylinder 23b.

[0067] In order to reduce or suppress the occurrence of the above situation, the configured second protective sleeve 32 can cover the lower area of ​​the guide cylinder 23b to prevent polishing waste liquid and other fluids from splashing onto the moving end 22 of the lifting assembly 20.

[0068] Figure 5 This is a schematic diagram of a mobile terminal 22 with a retaining ring 10 moving to a high position according to an embodiment of the present invention. At this time, at least a portion of the retaining ring 10 is located on the upper side of the polishing disk 200 to control the polishing waste liquid centrifugally scattered from the surface of the polishing disk.

[0069] The first protective sleeve 31 and the second protective sleeve 32 are spaced apart to avoid interference between components, thereby ensuring the smooth up-and-down movement of the movable end 22.

[0070] Depend on Figure 5 It can be seen that a second gap G2 with an upward opening is formed between the first protective sleeve 31 and the second protective sleeve 32.Figure 3 As shown, if the second gap G2 is not blocked, the polishing waste liquid will enter the interior of the second protective sleeve 32 along the second gap G2, and then adhere to the outer peripheral wall of the guide cylinder 23b. As the moving end 22 moves up and down, the liquid adhering to the outer peripheral wall of the guide cylinder 23b will enter the interior of the first protective sleeve 31 along the first gap G1 between the guide cylinder 23b and the first protective sleeve 31, and the liquid will further flow down the frame along the moving end 22, contaminating the corresponding components of the CMP system.

[0071] In order to solve the above-mentioned technical problems, the polishing protection device of this utility model is also equipped with a third protective sleeve 33. The third protective sleeve 33 is a cylindrical structure with a single-end opening, and its opening is downward and spaced out on the outside of the second protective sleeve 32.

[0072] Specifically, the third protective sleeve 33 is fitted onto the outer periphery of the second protective sleeve 32 to form a third gap G3 between the third protective sleeve 33 and the second protective sleeve 32, such as Figure 3 As shown. The third gap G3 is set downwards, and the liquid splashed onto the third protective sleeve 33 will slide downwards due to gravity and will hardly enter the second gap G2, thereby preventing the polishing waste liquid from moving towards the inner side where the moving end 22 is located.

[0073] Furthermore, the third protective sleeve 33 is connected to the mobile end 22 and is a follower component, which can move with the mobile end 22.

[0074] Figure 2 and Figure 5 The protective sleeve 30 shown also has the following characteristics:

[0075] When the moving end 22 of the lifting assembly 20 moves the retaining ring 10 downward to the standby position, there are gaps between the lower end face of the first protective sleeve 31 and the guide seat 23a, between the upper end face of the second protective sleeve 32 and the top wall of the third protective sleeve 33, and between the lower end face of the third protective sleeve 33 and the fixing flange 32a of the second protective sleeve 32. When the retaining ring 10 returns to the standby position, the protective sleeve 30 will not interfere with adjacent components.

[0076] At the same time, when the moving end 22 of the lifting assembly 20 drives the retaining ring 10 to move upward to the working position, the first protective sleeve 31, the second protective sleeve 32 and the third protective sleeve 33 overlap in the vertical direction and combine with each other to form a tight waterproof system, thereby inhibiting the movement of polishing waste liquid toward the interior of the lifting assembly 20.

[0077] It should be noted that consumables such as bellows can also be used instead of the protective sleeve 30, but the consumables have the risk of aging and damage. Taking the bellows as an example, if the bellows are directly sleeved on the outer side of the lifting assembly 20 and fixed at the moving end 22, the bellows will reciprocatingly stretch and contract up and down, and if the number of stretching and contracting exceeds the service life, the bellows will be damaged and water-proof failure will occur. Such water-proof failure is not easy to be detected, and the CMP system rack under the machine frame may be infiltrated with water, which affects the safety of the CMP system.

[0078] Compared with the technical solution of using consumables such as bellows alone, the protective sleeve 30 provided by the utility model is a processed part, which does not have the risk of aging and damage, effectively guarantees the protection effect of the lifting assembly 20, and at the same time, the processed part does not have the problem of regular replacement, which is beneficial to reducing the workload of the CMP system maintenance operation.

[0079] Figure 4 is a schematic view of the guide cylinder 23b provided by an embodiment of the utility model, in the embodiment, the outer peripheral side of the guide cylinder 23b is provided with an annular protrusion 23b-1, and the protrusion 23b-1 is integrally formed with the guide cylinder 23b.

[0080] Further, the protrusion 23b-1 is arranged to extend downward from the outer side wall of the guide cylinder 23b outward, so as to prevent the liquid attached to the outer side wall of the guide cylinder 23b from moving upward. In some embodiments, the included angle between the protrusion 23b-1 and the central axis of the guide cylinder 23b is 15-85°.

[0081] The transverse dimension of the protrusion 23b-1 is related to the first gap G1, and it is necessary to ensure that the protrusion 23b-1 does not interfere with the inner side wall of the first protective sleeve 31, so that the guide cylinder 23b can move smoothly in the first protective sleeve 31. In some embodiments, the transverse dimension of the protrusion 23b-1 is 2-8mm.

[0082] The number of protrusions 23b-1 is at least one, so as to achieve the purpose of blocking the upward movement of the liquid. Figure 4 In the shown embodiment, the number of protrusions 23b-1 is a pair, and the two are arranged on the outer peripheral wall of the guide cylinder 23b.

[0083] Further, the protrusion 23b-1 is arranged at the upper part of the guide cylinder 23b, so as to facilitate the cooperation of the first protective sleeve 31. When the moving end 22 with the blocking ring 10 moves upward to the working position, the protrusion 23b-1 is always located on the upper side of the lower end surface of the first protective sleeve 31, so as to prevent the guide cylinder 23b and the first protective sleeve 31 from being completely separated without overlapping in the vertical direction.

[0084] If the guide cylinder 23b and the first protective sleeve 31 do not overlap in the vertical direction, the first gap G1 has been damaged, and a small amount of polishing waste liquid can move to the moving end 22 through the third gap G3 and the second gap G2 in turn, which is not conducive to ensuring the waterproofness of the lifting assembly 20.

[0085] Figure 4 In the embodiment shown, the number of protrusions 23b-1 is one pair, which is arranged in the vertical direction at the upper part of the guide cylinder 23b. Generally, the top end of the guide cylinder 23b is configured with an annular protrusion 23b-1, and such arrangement is conducive to controlling the vertical size of the guide cylinder 23b, so that the guide cylinder 23b cooperates with the first protective sleeve 31 to form the first gap G1.

[0086] In the utility model, the outer circumferential side of the guide cylinder 23b is a conical structure, and the outer diameter of the upper end is smaller than that of the lower end, so that the first gap G1 formed by the first protective sleeve 31 and the guide cylinder 23b gradually decreases from top to bottom, thereby increasing the difficulty of the polishing waste liquid moving from bottom to top towards the lifting assembly 20 through the first gap G1, and further improving the waterproof effect of the lifting assembly 20. Figure 3

[0087] In the embodiment shown, the guide seat 23a is a disc-shaped structure, and the protective sleeve 30 is arranged above the guide seat 23a. Figure 2 Further, the upper part of the guide seat 23a is configured with a liquid discharge groove 23a-1, which is used for discharging the liquid falling through the protective sleeve 30 and the guide cylinder 23a, so as to discharge the small amount of liquid entering the inside through the protective sleeve 30 to outside of the CMP system through the liquid discharge groove 23a-1, and prevent the liquid from affecting the safe operation of other components in the CMP system. It should be noted that the liquid discharge groove 23a-1 is horizontally and openly arranged on the guide seat 23a, as shown in

[0088] Figure 1 so as to facilitate the rapid discharge of the liquid to the base 1100 with a certain slope, and further guide the liquid to the waste liquid discharge outlet, so as to avoid the accumulation of the liquid in the guide seat 23a, which causes the liquid level to rise and backflow to the inside of the guide cylinder 23b.

[0089] Referring to Figure 2 and Figure 5 , a small amount of liquid entering between the second protective sleeve 32 and the guide cylinder 23b flows downward under the action of gravity, and finally enters the liquid discharge groove 23a-1 through the gap between the inner side wall of the fixed flange 32a and the outer side wall of the guide cylinder 23b.

[0090] ​Since the guide cylinder 23b is a conical structure with a small upper part and a large lower part, the gap between the second protective sleeve 32 and the guide cylinder 23b gradually decreases from top to bottom, and therefore a small amount of liquid entering between the second protective sleeve 32 and the guide cylinder 23b can quickly enter the liquid discharge groove 23a-1.

[0091] Meanwhile, Figure 4 In the guide 23 shown, the transition section 23c is arranged between the guide cylinder 23b and the guide seat 23a. The outer side wall of the transition section 23c is a conical structure, and the outer diameter of the transition section 23c gradually increases from top to bottom, and the gap between the transition section 23c and the inner side wall of the fixed flange 32a gradually decreases from top to bottom, which is also conducive to the rapid flow of fluid to the liquid discharge groove 23a-1.

[0092] Figure 6 is a schematic view of the lifting assembly 20 provided with the protective sleeve 30 according to another embodiment of the present utility model, which has the same parts as Figure 2 The technical solutions shown have the same parts, and the differences between the two technical solutions will be introduced below.

[0093] Further, the number of protective sleeves 30 is one, that is, the first protective sleeve 31 is arranged on the outer circumferential side of the guide cylinder 23b of the guide 23.

[0094] Meanwhile, the guide cylinder 23b is a cylindrical structure, and at least one sealing groove is arranged on the outer circumferential side of the guide cylinder 23b for mounting the sealing ring 24, so that the first protective sleeve 31 is in sliding sealing connection with the guide cylinder 23b through the sealing ring 24.

[0095] In this embodiment, the number of mounting grooves is two, which are arranged on the upper part of the guide cylinder 23b and are spaced apart along the vertical direction of the guide cylinder 23b to mount the corresponding sealing ring 24, thereby achieving the sliding sealing connection between the first protective sleeve 31 and the guide cylinder 23b.

[0096] It should be noted that when the moving end 22 of the lifting assembly 20 drives the stop ring 10 to move upward to the working position, as Figure 7 As shown, the sealing ring 24 is located in the vertical overlapping section between the guide cylinder 23b and the first protective sleeve 31 to prevent the guide cylinder 23b and the first protective sleeve 31 from being separated from each other and causing water leakage.

[0097] Further, the guide seat 23a of the guide 23 is a disc-shaped structure, and the liquid discharge groove 23b is arranged above the guide seat 23a to discharge the liquid falling through the protective sleeve 30 and the guide cylinder 23b. Figure 6 The function of the liquid discharge groove 23b in the embodiment is the same as Figure 2 in the embodiment, which will not be repeated here.

[0098] It should be noted that the protective sleeve 30 is made of corrosion-resistant material, such as polyoxymethylene (POM) and the like. At the same time, the surface of the material of the protective sleeve 30 has a certain hydrophobicity, especially the third protective sleeve 33 located at the outermost side, thereby preventing the liquid from adhering to the surface of the protective sleeve 30 and crystallizing.

[0099] In some embodiments, the first protective sleeve 31 and the third protective sleeve 33 are made of a material with a certain strength, such as stainless steel and the like, and the second protective sleeve 32 is made of plastic, such as POM. In this way, the materials of the adjacent protective sleeves 30 are different, so as to avoid the mutual adhesion of the protective sleeves 30 made of the same material and affect the smoothness of the movement of the components.

[0100] At the same time, the utility model also provides a kind of chemical mechanical polishing system 1000, its schematic diagram is as shown in Figure 8 Chemical mechanical polishing system 1000 includes polishing disc 200, carrier head 300, liquid supply device 400 and trimming device 500, it also includes Figure 1 The polishing protective device 100 shown in the figure is arranged outside the polishing disc 200 to control the centrifugal spun-out polishing waste liquid and / or cleaning water.

[0101] Specifically, the polishing pad is arranged on the upper surface of the polishing disc 200 and rotates along the axis together with the polishing disc 200;The horizontally movable carrier head 300 is arranged above the polishing pad, and the lower surface of the carrier head 300 is loaded with the wafer to be polished;The trimming device 500 includes trimming arm and trimming head, which are arranged on one side of the polishing disc 200, and the trimming arm drives the rotating trimming head to swing to trim the surface of the polishing pad;The liquid supply device 400 is arranged above the polishing pad to spread the polishing liquid on the surface of the polishing pad.

[0102] The polishing protective device 100 is arranged on the outer circumferential side of the polishing disc 200, and the lifting assembly 20( Figure 1 Shown) of the polishing protective device 100 can drive the blocking ring 10 to move along the vertical direction;The lifting assembly 20 is provided with a protective sleeve 30, which can block the polishing waste liquid from entering the inside of the lifting assembly 20.

[0103] It should be noted that the polishing waste liquid entering the inside of the lifting assembly 20 means that the polishing liquid adheres to the inner side wall of the moving end 22, and then flows to the inside of the guide cylinder 23b along the moving end 22, and then flows to the fixed end 21 and its inside. These polishing waste liquids will flow along the lifting assembly 20 to the lower rack of the CMP system, so that the components in the corresponding area of the lower rack are flooded.

[0104] Those skilled in the art can appreciate that the units and method steps of the examples described in combination with the embodiments disclosed herein can be realized in electronic hardware, or in a combination of computer software and electronic hardware. Whether the functions are realized in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to realize the described functions for each specific application, but such implementation should not be considered beyond the scope of the embodiments of the present application.

[0105] The above embodiments are only used to illustrate but not to limit the embodiments of the present application. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application, and all equivalent technical solutions belong to the scope of the embodiments of the present application. The patent protection scope of the embodiments of the present application should be defined by the claims.

Claims

1. A polishing protection device for protecting the polishing disc in a polishing system, characterized in that, include: A ring-shaped retaining ring is disposed on the outer periphery of the polishing disk; The lifting assembly has its fixed end connected to the base of the polishing system and its movable end connected to the retaining ring, so as to drive the retaining ring to move vertically. The lifting assembly is equipped with a protective sleeve to prevent polishing waste liquid from entering the interior of the lifting assembly.

2. The polishing protection device according to claim 1, characterized in that, The lifting assembly includes a guide member sleeved on the outer periphery of the moving end, and a protective sleeve disposed on the outer periphery of the guide member.

3. The polishing protection device according to claim 2, characterized in that, The guide is a cylindrical structure, which includes a guide seat and a guide tube. The guide seat is fixed to the base, and the guide tube is disposed above the guide seat and slidably connected to the outer periphery of the moving end.

4. The polishing protection device according to claim 3, characterized in that, The protective sleeve includes a first protective sleeve, which is fitted onto the outer periphery of the guide tube, and the first protective sleeve is connected to the mobile end.

5. The polishing protection device according to claim 4, characterized in that, The protective sleeve includes a second protective sleeve, which is fitted onto the outer periphery of the first protective sleeve and fixed to the base.

6. The polishing protection device according to claim 5, characterized in that, The protective sleeve includes a third protective sleeve, which is fitted onto the outer periphery of the second protective sleeve and fixed to the movable end.

7. The polishing protection device according to claim 4, characterized in that, The outer periphery of the guide tube is provided with annular protrusions, and there is at least one protrusion located on the upper part of the guide tube.

8. The polishing protection device according to claim 7, characterized in that, The outer periphery of the guide tube has a conical structure, with its upper outer diameter being smaller than its lower outer diameter, so that the gap between the first protective sleeve and the guide tube gradually decreases from top to bottom.

9. The polishing protection device according to claim 8, characterized in that, When the mobile end moves to the working position with the retaining ring, the protrusion is located on the upper side of the lower end face of the first protective sleeve.

10. The polishing protection device according to claim 4, characterized in that, The first protective sleeve is a cylindrical structure with an opening at one end and the opening is oriented downwards.

11. The polishing protection device according to claim 5, characterized in that, The second protective sleeve is a cylindrical structure with openings at both ends, and is spaced apart on the outside of the first protective sleeve; the second protective sleeve includes a fixing flange, which is disposed above the guide seat.

12. The polishing protection device according to claim 6, characterized in that, The third protective sleeve is a cylindrical structure with an opening at one end, with its opening facing downwards and spaced apart on the outside of the second protective sleeve.

13. The polishing protection device according to claim 3, characterized in that, The guide seat has a disc-shaped structure, and the protective sleeve is disposed on top of the guide seat.

14. The polishing protection device according to claim 13, characterized in that, A drain trough is provided above the guide seat to drain the liquid that falls through the protective sleeve and guide cylinder.

15. The polishing protection device according to claim 12, characterized in that, When the moving end of the lifting component drives the retaining ring to move upward to the working position, the first protective sleeve, the second protective sleeve and the third protective sleeve overlap in the vertical direction.

16. The polishing protection device according to claim 12, characterized in that, When the moving end of the lifting assembly drives the retaining ring to move downward to the standby position, there are gaps between the lower end face of the first protective sleeve and the guide seat, between the upper end face of the second protective sleeve and the top wall of the third protective sleeve, and between the lower end face of the third protective sleeve and the fixing flange of the second protective sleeve.

17. The polishing protection device according to claim 4, characterized in that, The guide tube has a cylindrical structure, and at least one sealing groove for installing a sealing ring is provided on its outer periphery. The sealing groove is located on the upper part of the guide tube, and the first protective sleeve is slidably sealed to the guide tube through the sealing ring.

18. The polishing protection device according to claim 17, characterized in that, The guide seat has a disc-shaped structure with a drain trough on top to discharge the liquid that falls through the protective sleeve and guide cylinder.

19. The polishing protection device according to claim 17, characterized in that, When the moving end of the lifting component drives the retaining ring to move upward to the working position, the sealing ring is located in the vertical overlap section between the guide cylinder and the first protective sleeve.

20. A chemical mechanical polishing system, characterized in that, The device includes a polishing pad, a support head, a liquid supply device, and a trimming device. The support head presses the wafer to be polished against a polishing pad above the polishing pad. The liquid supply device supplies polishing liquid between the polishing pad and the wafer. The trimming device is used to trim the surface of the polishing pad. The device also includes a polishing protection device as described in any one of claims 1 to 19 to prevent polishing waste liquid from entering the interior of the lifting assembly.

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