Sealing structure for air inlet and air outlet of semiconductor inflation carrier

Abstract

The invention relates to the technical field of semiconductor carriers, in particular to a sealing structure for an air inlet and an air outlet of a semiconductor inflatable carrier, which comprises an air tap bracket and a sealing air tap. The semiconductor inflation carrier comprises an air inlet component. The sealing air tap comprises a sealing ring and an abutting ring. The sealing ring comprises a mounting surface and an abutting surface. The abutting ring comprises a connecting end, a contact face, a binding face and a stretching face. By arranging the clamping ring and the clamping step, air leakage is prevented. And the umbrella-shaped structure of the abutting ring is arranged, so that in the downward pressing process of the air inlet component, the abutting ring can generate elastic deformation, and the sealing effect is guaranteed and maintained. In addition, a high-temperature-resistant reinforcing agent and a tear-resistant material are added in the manufacturing process of the sealing air tap, so that the mechanical property and the thermal stability of the sealing air tap are remarkably improved, and a lubricating coating is arranged on the surface of the sealing air tap, so that the influence of dust on the sealing effect is prevented.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor carriers, and in particular to a sealing structure for air inlets and outlets of semiconductor gas-filled carriers. Background Art

[0002] Wafer carriers, a type of semiconductor carrier, are precision carriers designed specifically for semiconductor wafers. They are designed to meet strict clean room standards to ensure the physical safety and chemical purity of wafers throughout the manufacturing process. Wafers are the basis of semiconductor devices, and are covered with thousands or even millions of tiny integrated circuits. Any slight contamination or damage may cause a large number of chips to fail, so the importance of wafer carriers is self-evident.

[0003] There is a semiconductor inflatable vehicle that needs to be inflated through a gas source when in use, and inert gas (such as nitrogen) is input to reduce the harm of harmful gases. However, the inflation port of the semiconductor inflatable vehicle does not have a structure for installing a sealing ring, and is only pressed on the gas nozzle of the gas source by gravity, so a sealing ring is needed to seal the inflation structure. Conventional sealing rings are usually structures such as O-rings and V-rings, which are used to maintain the precise connection of connecting parts, but are not suitable for the contact sealing requirements of the inflatable vehicle.

[0004] In addition, conventional silicone sealing rings are prone to aging in high temperature environments, and their sealing performance will decrease accordingly. At the same time, they are prone to tearing, fatigue and other problems during repeated loading and unloading. Therefore, it is necessary to design a sealing structure with superior performance and optimized structure that is suitable for the above-mentioned inflatable vehicle. Summary of the invention

[0005] In view of this, the present invention provides a sealing structure for the gas inlet and outlet of a semiconductor inflatable carrier to solve the above technical problems.

[0006] A sealing structure for the gas inlet and outlet of a semiconductor gas-filled carrier, comprising a gas nozzle bracket and a sealing gas nozzle arranged on the gas nozzle bracket. The semiconductor gas-filled carrier comprises an air inlet component. The sealing gas nozzle comprises a sealing ring and an abutting ring arranged on the sealing ring. The sealing ring is a circular ring-shaped structure, and comprises a mounting surface located on one side thereof, and an abutting surface located on the other side. The mounting surface and the abutting surface are both planes of the sealing ring in the radial direction. The mounting surface contacts and fits with the gas nozzle bracket. The abutting surface is located on the side close to the air inlet component. The abutting ring comprises a connecting end connected to the abutting surface, a contact surface located on the free end of the abutting ring, a fitting surface arranged on one side of the abutting ring, and a stretching surface arranged on the other side of the abutting ring. The contact surface is located at the end of the abutting ring away from the abutting surface, and is an annular plane parallel to the abutting surface. The fitting surface is located on the side of the abutting ring close to the central axis of the sealing gas nozzle. The fitting surface and the abutting surface are arranged at an angle, and the angle between the fitting surface and the abutting surface is angle α. The supplementary angle of angle α is angle β. The stretching surface is located on the other side of the abutting ring away from the central axis of the sealing air nozzle. The stretching surface and the abutting surface are arranged at an angle, and the angle between the stretching surface and the abutting surface is angle θ. The angle β is smaller than the angle θ. The thickness of the abutting ring at the connecting end is greater than the thickness of the free end. The fitting surface and the stretching surface are two non-parallel planes. In the axial section of the abutting ring, the length of the fitting surface is greater than the length of the stretching surface.

[0007] Furthermore, the air nozzle bracket includes a bracket body, an air channel arranged in the bracket body, an air outlet end arranged at one end of the air channel, and a clamping ring arranged on the edge of the air outlet end.

[0008] Furthermore, the support body is also provided with an air inlet, and the air inlet is connected to an air outlet of an air pump through an air pipe.

[0009] Furthermore, the air duct runs through the bracket body and connects the air inlet to the air outlet, the air outlet is located at the end of the air duct, and the clamping ring is an annular protrusion arranged on the outer wall of the air outlet, whose diameter is larger than the diameter of the air outlet, and is located on the free end away from the bracket body.

[0010] Furthermore, the sealing air nozzle is integrally formed by injection molding of a modified silicone material, and a lubricating coating is provided on the surface of the sealing air nozzle.

[0011] Furthermore, the sealing air nozzle is made of modified silicone material with a Shore hardness of 55 to 65 degrees.

[0012] Further, the abutment ring is arranged on the abutment surface of the sealing ring and is an annular umbrella-shaped structure with a free end facing the air intake component.

[0013] Furthermore, the sealing gas nozzle also includes a clamping step arranged on the sealing ring, and the clamping step is a step arranged in the inner diameter direction of the sealing ring and is located at one end close to the abutting surface.

[0014] Compared with the prior art, the sealing structure for the air inlet and outlet of the semiconductor inflatable vehicle provided by the present invention fixes the sealing air nozzle to the air nozzle bracket by setting the clamping ring and the clamping step, thereby preventing the sealing air nozzle from being displaced relative to the air nozzle bracket when the air intake component is pressed on the sealing air nozzle, resulting in air leakage. And by setting the umbrella-shaped structure of the abutment ring, the abutment ring will undergo elastic deformation during the downward pressing process of the air intake component, and because the inclination of the fitting surface is less than the inclination of the stretching surface, the stretching surface will be stretched during the downward pressing process, ensuring that the air intake component is always in contact with the contact surface and the fitting surface, ensuring and maintaining the sealing effect. In addition, by adding high temperature resistant reinforcing agents and tear resistant materials in the manufacturing process of the sealing air nozzle, its mechanical properties and thermal stability are significantly improved, and by providing a lubricating coating on the surface of the sealing air nozzle, dust is prevented from affecting the sealing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic structural diagram of a sealing structure for an air inlet and outlet of a semiconductor inflatable carrier provided by the present invention.

[0016] Figure 2 for Figure 1 A schematic cross-sectional view of a sealing structure for an air inlet and outlet of a semiconductor inflatable carrier in a vertical cross section.

[0017] Figure 3 for Figure 1 A schematic structural diagram of a sealing gas nozzle 20 for a sealing structure of a gas inlet and outlet of a semiconductor inflatable carrier.

[0018] Figure 4 for Figure 3 A schematic cross-sectional view of a sealing gas nozzle 20 of a sealing structure for a gas inlet and outlet of a semiconductor gas-filled carrier in a vertical section.

[0019] Figure 5 for Figure 4 An enlarged view of the sealing gas nozzle 20 at position A of the sealing structure for the gas inlet and outlet of the semiconductor inflatable carrier.

[0020] Explanation of the reference numerals: air nozzle bracket 10, bracket body 11, air duct 12, air outlet end 13, clamping ring 14, air inlet 15, sealing air nozzle 20, sealing ring 21, mounting surface 211, abutting surface 212, clamping step 22, abutting ring 23, connecting end 231, contact surface 232, fitting surface 233, stretching surface 234, air intake component 30. DETAILED DESCRIPTION

[0021] The specific embodiments of the present invention are further described in detail below. It should be understood that the description of the embodiments of the present invention herein is not intended to limit the protection scope of the present invention.

[0022] like Figures 1 to 5 As shown, it is a schematic diagram of the structure of the sealing structure for the gas inlet and outlet of the semiconductor inflatable vehicle provided by the present invention. The sealing structure for the gas inlet and outlet of the semiconductor inflatable vehicle includes a gas nozzle bracket 10, and a sealing gas nozzle 20 arranged on the gas nozzle bracket 10. It can be imagined that the sealing structure for the gas inlet and outlet of the semiconductor inflatable vehicle also includes other functional modules such as gas source, gas pipe, etc., which are well known to those skilled in the art and will not be described one by one here.

[0023] It should be noted that the semiconductor inflatable carrier includes an air inlet component 30. The air inlet component 30 can be a product such as an air inlet of a semiconductor inflatable carrier. It contacts the sealed gas nozzle 20 through gravity or pressure to fill the semiconductor inflatable carrier with gas through the sealed gas nozzle 20. The semiconductor inflatable carrier itself is a prior art and will not be described in detail here.

[0024] The air nozzle bracket 10 is a connecting structure arranged on the air source outlet, and is an integrally formed structure for fixing and connecting the sealing air nozzle 20. The air nozzle bracket 10 includes a bracket body 11, an air passage 12 arranged in the bracket body 11, an air outlet end 13 arranged at one end of the air passage 12, and a clamping ring 14 arranged on the edge of the air outlet end 13.

[0025] An air inlet 15 may also be provided on the support body 11, and the air inlet 15 is connected to the air outlet of an air pump through an air pipe to provide gas. The air channel 12 is a gas flow channel that runs through the support body 11, specifically, it connects the air inlet 15 to the air outlet 13 for gas flow. The air outlet 13 is located at the end of the air channel 12, and is a hollow cylindrical protrusion for connecting the sealing gas nozzle 20. The clamping ring 14 is an annular protrusion provided on the outer side wall of the air outlet 13, and its diameter is larger than the diameter of the air outlet 13, and is located on the free end away from the support body 11, so as to clamp the sealing gas nozzle 20 when connected with the sealing gas nozzle 20, thereby ensuring that the support body 11 and the sealing gas nozzle 20 are reliably connected.

[0026] The sealing air nozzle 20 can be an integrally formed injection molded modified silicone material to ensure the sealing performance of the sealing air nozzle 20. At the same time, since the sealing air nozzle 20 is made of silicone material, the sealing air nozzle 20 has a certain elasticity and can be deformed and rebounded during installation. The silicone material can also be added with high temperature resistant reinforcing agents and tear resistant materials to significantly improve its mechanical properties and thermal stability. The surface of the sealing air nozzle 20 is provided with a lubricating coating to prevent dust particles from being contaminated when static, resulting in the inability to fully fit on the product during use. As in one embodiment of the present invention, the sealing air nozzle 20 is made of a modified silicone material with a Shore hardness of 55 to 65 degrees, so that the sealing air nozzle 20 has a higher hardness, thereby preventing elastic fatigue of the product due to long-term use and affecting the sealing effect.

[0027] The sealing gas nozzle 20 includes a sealing ring 21 , a clamping step 22 disposed on the sealing ring 21 , and an abutting ring 23 disposed on the sealing ring 21 .

[0028] The sealing ring 21 is a circular ring structure, which is used to be sleeved on the gas outlet end 13. The sealing ring 21 is the main part of the sealing gas nozzle 20, and is arranged between the gas nozzle bracket 10 and the gas inlet component 30 to play a sealing role. The sealing ring 21 includes a mounting surface 211 located on one side, and an abutting surface 212 located on the other side. The mounting surface 211 and the abutting surface 212 are both planes of the sealing ring 21 in the radial direction. The mounting surface 211 is a plane that contacts and fits with the gas nozzle bracket 10, and the abutting surface 212 is located on the side close to the gas inlet component 30.

[0029] The clamping step 22 is a step arranged in the inner diameter direction of the sealing ring 21 and is located at one end close to the abutting surface 212. When the sealing ring 21 is sleeved on the gas outlet end 13, the clamping ring 14 will be clamped into the clamping step 22, so as to be clamped together to prevent the sealing gas nozzle 20 from being separated from the gas nozzle bracket 10.

[0030] The abutting ring 23 is arranged on the abutting surface 212 of the sealing ring 21, and is an annular umbrella-shaped structure with a free end facing the air intake component 30. The abutting ring 23 includes a connecting end 231 connected to the abutting surface 212, a contact surface 232 located on the free end of the abutting ring 23, a fitting surface 233 arranged on one side of the abutting ring 23, and a stretching surface 234 arranged on the other side of the abutting ring 23.

[0031] The connecting end 231 is integrally formed with the abutting surface 212. The contact surface 232 is located at the end of the abutting ring 23 away from the abutting surface 212, and is an annular plane parallel to the abutting surface 212. When the air intake component 30 contacts the abutting ring 23, it first contacts and fits with the contact surface 232.

[0032] The fitting surface 233 is located on one side of the abutment ring 23 close to the central axis of the sealing gas nozzle 20. The fitting surface 233 is inclined with the abutment surface 212, and the angle between the fitting surface and the abutment surface is angle α, which is an obtuse angle and increases as the pressure applied by the air intake component 30 to the abutment ring 23 increases. In the limit state, angle α is infinitely close to 180°. In addition, the supplementary angle of angle α is angle β, that is, angle α + angle β is 180°.

[0033] The stretching surface 234 is located on the other side of the abutting ring 23 away from the central axis of the sealing air nozzle 20. The stretching surface 234 is inclined to the abutting surface 212, and the angle between the stretching surface and the abutting surface is angle θ, which is an acute angle and becomes smaller when the pressure applied by the air intake component 30 to the abutting ring 23 increases. In the limit state, the angle θ is 0°, that is, the stretching surface 234 and the abutting surface 212 are completely overlapped. In the free state, the angle θ is greater than the angle β, so that the stretching surface 234 is not parallel to the fitting surface 233. In the cross section along the central axis of the sealing air nozzle 20, the angle between the contour line of the stretching surface 234 and the contour line of the abutting surface 212 is an obtuse angle.

[0034] In order to achieve a sufficient sealing effect during inflation, it is best that the fitting surface 233 and the contact surface 232 can become a plane when pressed against the air intake component 30. Therefore, it is necessary to design the angles β and θ so that when the air intake component 30 presses against the abutment ring 23, the fitting surface 233 and the contact surface 232 can become a plane.

[0035] The angle β in the above structure is smaller than the angle θ, that is, the thickness of the abutting ring 23 at the connecting end 231 is greater than the thickness of the free end, so that the fitting surface 233 and the stretching surface 234 are two non-parallel planes, and therefore, in the axial section of the abutting ring 23, the length of the fitting surface 233 is greater than the length of the stretching surface 234. In use, when the air intake component 30 is placed on the abutting ring 23, it will first contact the contact surface 232, and when it is continuously pressed down under the action of gravity or other pressure, the annular radius of the contact surface 232 will continue to increase, the distance from the contact surface 232 to the abutting surface 212 will continue to decrease, and the angle β and the angle θ will continue to decrease. At this time, since the length of the fitting surface 233 is greater than the length of the stretching surface 234, the stretching surface 234 will be stretched and twisted toward the contact surface 232, so that the contact surface 232 is always in contact with the surface of the air intake component 30. In the process of the air intake component 30 continuously applying pressure to the abutment ring 23, the angle β and the angle θ are continuously decreasing, and the angle β will reach the limit first relative to the angle θ. When the angle β reaches the limit value, the contact surface 232 and the fitting surface 233 are in the same plane, and the fitting surface 233 fits the surface of the air intake component 30. If the air intake component 30 continues to be pressed down, before the stretching surface 234 and the abutment surface 212 are completely fitted, the connecting end 231 has a thickness, and will produce a greater elastic deformation due to the extrusion of the air intake component 30, and have a stronger elastic reaction force, thereby ensuring that the fitting surface 233 and the air intake component 30 are always fitted, and no air leakage occurs.

[0036] Compared with the prior art, the sealing structure for the air inlet and outlet of the semiconductor inflatable carrier provided by the present invention fixes the sealing air nozzle 20 to the air nozzle bracket 10 by setting the clamping ring 14 and the clamping step 22, thereby preventing the sealing air nozzle 20 from being displaced relative to the air nozzle bracket 10 when the air inlet component 30 is pressed on the sealing air nozzle 20, resulting in air leakage. And by setting the umbrella-shaped structure of the abutting ring 23, the abutting ring 23 is elastically deformed during the pressing process of the air inlet component 30, and because the inclination of the fitting surface 233 is less than the inclination of the stretching surface 234, the stretching surface 234 is stretched accordingly during the pressing process, ensuring that the air inlet component 30 is always in contact with the contact surface 232 and the fitting surface 233, ensuring and maintaining the sealing effect. By adding high temperature resistant reinforcing agents and tear resistant materials in the manufacturing process of the sealing air nozzle 20, its mechanical properties and thermal stability are significantly improved, and by providing a lubricating coating on the surface of the sealing air nozzle 20, dust is prevented from affecting the sealing effect.

[0037] The above are only preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention. Any modification, equivalent substitution or improvement within the spirit of the present invention is included in the scope of the claims of the present invention.

Claims

1. A sealing structure for the gas inlet and outlet of a semiconductor inflatable carrier, characterized in that: The sealing structure for the air inlet and outlet of a semiconductor gas-filled carrier comprises a gas nozzle bracket and a sealing gas nozzle arranged on the gas nozzle bracket. The semiconductor gas-filled carrier comprises an air inlet component. The sealing gas nozzle comprises a sealing ring and an abutment ring arranged on the sealing ring. The sealing ring is a circular ring-shaped structure and comprises a mounting surface located on one side and an abutment surface located on the other side. The mounting surface and the abutment surface are both planes of the sealing ring in the radial direction. The mounting surface contacts and fits with the gas nozzle bracket. The abutment surface is located on a side close to the air inlet component. The abutment ring comprises a connecting end connected to the abutment surface, a contact surface located on the free end of the abutment ring, a fitting surface arranged on one side of the abutment ring, and a fitting surface arranged on the other side of the abutment ring. The stretching surface of the abutment ring, the contact surface is located at the end of the abutment ring away from the abutment surface, and is an annular plane parallel to the abutment surface, the fitting surface is located on the side of the abutment ring close to the central axis of the sealing gas nozzle, the fitting surface and the abutment surface are inclined, and the angle between the fitting surface and the abutment surface is α, and the supplementary angle of α is β. The stretching surface is located on the other side of the abutment ring away from the central axis of the sealing gas nozzle, the stretching surface and the abutment surface are inclined, and the angle between the stretching surface and the abutment surface is θ, and the β angle is smaller than the θ angle. The thickness of the abutment ring at the connecting end is greater than the thickness of the free end. The fitting surface and the stretching surface are two non-parallel planes. In the axial cross-section of the abutment ring, the length of the fitting surface is greater than the length of the stretching surface.

2. The sealing structure for the gas inlet and outlet of a semiconductor gas-filled carrier according to claim 1, characterized in that: The air nozzle bracket comprises a bracket body, an air channel arranged in the bracket body, an air outlet end arranged at one end of the air channel, and a clamping ring arranged on the edge of the air outlet end.

3. The sealing structure for the gas inlet and outlet of a semiconductor inflatable carrier according to claim 2, characterized in that: The support body is also provided with an air inlet, which is connected to an air outlet of an air pump through an air pipe.

4. The sealing structure for the gas inlet and outlet of a semiconductor gas-filled carrier as claimed in claim 3, characterized in that: The air passage passes through the bracket body and connects the air inlet to the air outlet, the air outlet is located at the end of the air passage, and the clamping ring is an annular protrusion arranged on the outer wall of the air outlet, with a diameter larger than the diameter of the air outlet, and is located on the free end away from the bracket body.

5. The sealing structure for the gas inlet and outlet of a semiconductor gas-filled carrier according to claim 1, characterized in that: The sealing air nozzle is integrally formed by injection molding of modified silicone material, and a lubricating coating is provided on the surface of the sealing air nozzle.

6. The sealing structure for the gas inlet and outlet of a semiconductor gas-filled carrier as claimed in claim 1, characterized in that: The sealing air nozzle is made of modified silicone material with a Shore hardness of 55 to 65 degrees.

7. The sealing structure for the gas inlet and outlet of a semiconductor gas-filled carrier according to claim 1, characterized in that: The abutment ring is arranged on the abutment surface of the sealing ring and is an annular umbrella-shaped structure with a free end facing the air intake component.

8. The sealing structure for the gas inlet and outlet of a semiconductor gas-filled carrier as claimed in claim 1, characterized in that: The sealing gas nozzle also includes a clamping step arranged on the sealing ring. The clamping step is a step arranged in the inner diameter direction of the sealing ring and is located at one end close to the abutting surface.

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