Chip testing device

Abstract

A chip testing device disclosed by the present invention comprises a shell, a coaxial spring needle module, a high-frequency board and SMP connectors, the high-frequency board is arranged in the shell, the coaxial spring needle module comprises a plurality of groups of coaxial needles, each coaxial needle comprises a needle body, a needle head and a needle tail, the needle head is used for vertically contacting a pin of a chip, the needle tail is in contact with the high-frequency board, a plurality of SMP connectors are arranged, and the SMP connectors are arranged in the shell. The SMP connector comprises joints, and the joints are welded with the high-frequency board and are communicated with the coaxial needles in a one-to-one correspondence manner. According to the chip testing device, the manufacturing process is simplified, the line length and complexity are reduced, and the assembling and operating time is greatly shortened, so that the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component testing, and in particular to a chip testing device. Background Art

[0002] Driven by the mobile communications industry, especially 5G millimeter waves, the testing of antenna chips has gradually received attention and developed.

[0003] In the prior art, the structure of the chip testing device usually includes a test socket and a radio frequency probe. There are generally two schemes for the structure of the test socket, one is a design including a socket and a high-frequency board containing a control circuit, and the other is a design including a socket with a radio frequency connector and a control circuit; the former has the defect that the high-frequency board containing the control circuit is complex in design, the update iteration speed is slow, and the high-frequency board has higher requirements in material selection and manufacturing process, and the manufacturing cycle is long; the latter has the defect that the socket and the control circuit are connected through a J30J rectangular connector, which will make the entire link longer, and the interference between the low-frequency line and the high-frequency line, as well as voltage instability and voltage drop, etc., have a certain impact on the stability and accuracy of the test. The radio frequency probe needs to be manually adjusted through the probe station, which contains a microscope and a three-axis adjustment rod, etc. It is large in size, has additional accessories and equipment, resulting in high cost, and complicated operation.

[0004] Therefore, it is necessary to provide a new chip testing device to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to provide a miniaturized chip testing device, simplify the signal transmission line, reduce the influence of the low-frequency line on the high-frequency signal transmission, and have high efficiency.

[0006] To achieve the above object, the present invention adopts the following technical solution:

[0007] A chip testing device comprises: a shell, a coaxial spring needle module, a high-frequency board and an SMP connector, wherein the high-frequency board is arranged in the shell, the coaxial spring needle module comprises a plurality of groups of coaxial needles, the coaxial needles comprise a needle body, a needle head and a needle tail, the needle head is used to vertically contact the pin of the chip, the needle tail contacts the high-frequency board, a plurality of SMP connectors are arranged, the SMP connector comprises a joint, the joint is welded to the high-frequency board and is electrically connected with the coaxial needles in a one-to-one correspondence.

[0008] As a further improved technical solution of the present invention, the housing comprises an outer shell and a cover body that are buckled with each other, and a locking member is sequentially passed through the cover body, the high-frequency board and the bottom wall of the outer shell and fixed.

[0009] As a further improved technical solution of the present invention, the chip testing device also includes a fixing plate, which is arranged in the shell, and the high-frequency board is clamped between the bottom wall of the shell and the fixing plate, and the cover body, the fixing plate, the high-frequency board and the bottom wall of the shell are sequentially penetrated and fixed by the locking member.

[0010] As a further improved technical solution of the present invention, the chip testing device also includes a first base, the bottom wall of the shell is provided with a first hollow portion connecting the inside and outside of the shell, the radial outer contour of the first base is adapted to the first hollow portion, the first base is arranged in the first hollow portion, the coaxial spring needle module is arranged in the first base, and the coaxial needle is at least partially located inside the shell and at least partially located outside the shell.

[0011] As a further improved technical solution of the present invention, the first base includes a first clamping plate and a second clamping plate, the first clamping plate is provided with a first through hole, the second clamping plate is provided with a corresponding second through hole, the coaxial spring needle module also includes a probe seat, the coaxial needle is arranged on the probe seat, and the probe seat is fixed to the first base and is at least partially located in the first through hole and the second through hole.

[0012] As a further improved technical solution of the present invention, the probe seat is adapted to the first through hole and the second through hole, the first through hole includes a first hole portion and a second hole portion, the first hole portion is far away from the second through hole relative to the second hole portion, the aperture of the second hole portion is larger than the aperture of the first hole portion, the second through hole includes a third hole portion and a fourth hole portion, the third hole portion is far away from the first through hole relative to the fourth hole portion, and the aperture of the fourth hole portion is larger than the aperture of the third hole portion.

[0013] As a further improved technical solution of the present invention, the outer wall of the shell is provided with a plurality of mounting grooves and a third through hole connecting the mounting grooves with the interior of the shell, the SMP connector is arranged in the mounting groove, the connector includes a center pin, and the center pin is at least partially welded to the high-frequency board and at least partially located in the mounting groove.

[0014] As a further improved technical solution of the present invention, the chip testing device also includes a second base, and the bottom wall of the shell is also provided with a second hollow portion connecting the inside and outside of the shell, the second base is arranged in the second hollow portion, and the first base and the second base have one side facing the inside of the shell flush with the inner bottom wall of the shell, and one side of the high-frequency board at least partially abuts against the first base, the second base and the inner bottom wall of the shell.

[0015] As a further improved technical solution of the present invention, the inner bottom wall of the outer shell is provided with a plurality of first grooves, the side of the first clamping plate away from the second clamping plate is oriented in the same direction as the inner bottom wall of the outer shell, the first clamping plate is provided with a plurality of second grooves, the second base is provided with a plurality of third grooves, and the probe seat is provided with a plurality of fourth grooves, the fourth groove, the second groove, the first groove and the third groove are connected in sequence, the center needle is at least partially located in the third groove, and the coaxial needle is at least partially located in the fourth groove.

[0016] As a further improved technical solution of the present invention, the coaxial needle includes a high-frequency probe and a grounding probe, the high-frequency probe is at least partially located in the fourth groove, and one side of the high-frequency board at least partially abuts the probe seat, the first clamping plate, the inner bottom wall of the outer shell and the second base, so that each group of connected fourth grooves, second grooves, first grooves and third grooves forms a closed channel.

[0017] Compared with the prior art, the chip testing device of the present invention has the following beneficial effects: the coaxial spring needle module, high-frequency board and SMP connector are integrated to make the volume of the whole device smaller, the needle head of the coaxial needle contacts the pin of the chip, the needle tail contacts the high-frequency board, and the joint of the SMP connector is welded to the high-frequency board, which can effectively support the transmission of high-frequency signals, and by optimizing impedance matching, the influence of low-frequency lines on signal transmission is reduced. The chip testing device simplifies the process technology, reduces the length and complexity of the line, and greatly reduces the time of assembly and operation, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of a chip testing device according to a specific embodiment of the present invention;

[0019] Figure 2 A schematic diagram of the three-dimensional structure of a chip testing device according to a specific embodiment of the present invention from another perspective;

[0020] Figure 3 for Figure 2 Schematic diagram of the enlarged structure of the A area in the middle;

[0021] Figure 4 It is a schematic diagram of the exploded structure of a chip testing device according to a specific embodiment of the present invention;

[0022] Figure 5 A schematic front view of a chip testing device according to a specific embodiment of the present invention;

[0023] Figure 6 for Figure 5 Schematic diagram of the cross-section structure along XX;

[0024] Figure 7 for Figure 6 Schematic diagram of the enlarged structure of the middle B area;

[0025] Figure 8 for Figure 5 Schematic diagram of the cross-section structure along YY;

[0026] Fig. 9 for Figure 8 Schematic diagram of the enlarged structure of the middle C area;

[0027] Fig.10 It is a schematic diagram of the exploded structure of a housing according to a specific embodiment of the present invention;

[0028] Fig.11 A partial top view of a chip testing device according to a specific embodiment of the present invention;

[0029] Fig.12 for Fig.11 Schematic diagram of the partial decomposition structure;

[0030] Fig.13 It is a schematic diagram of assembling a coaxial spring pin module and a first base according to a specific embodiment of the present invention;

[0031] Fig.14 for Fig.13 Schematic diagram of the enlarged structure of the D region in the middle;

[0032] Fig.15 It is a schematic cross-sectional structure diagram of a coaxial spring pin module and a first base according to a specific embodiment of the present invention;

[0033] Fig.16 for Fig.15 Schematic diagram of the enlarged structure of the middle E region;

[0034] Fig.17 It is a schematic diagram of a partially exploded structure of a coaxial spring pin module and a first base according to a specific embodiment of the present invention;

[0035] Fig.18 It is a schematic diagram of the three-dimensional structure of a coaxial spring pin module according to a specific embodiment of the present invention;

[0036] Fig.19 for Fig.18 Schematic diagram of the enlarged structure of the middle F region;

[0037] Fig. 20 It is a schematic diagram of the exploded structure of a coaxial spring pin module according to a specific embodiment of the present invention;

[0038] Fig.21 It is a schematic diagram of the exploded structure of the SMP connector and the second base according to a specific embodiment of the present invention;

[0039] Fig. 22 It is a schematic cross-sectional structure diagram of an SMP connector according to a specific embodiment of the present invention;

[0040] Fig.23 It is a schematic diagram of a left view and a front view of a connecting socket according to a specific embodiment of the present invention;

[0041] Fig.24 A schematic diagram of a chip testing device according to a specific embodiment of the present invention;

[0042] Fig.25 It is an application schematic diagram of a chip testing device according to a specific embodiment of the present invention;

[0043] Fig.26 The figure is a schematic diagram of the structure of a chip to be tested according to a specific embodiment of the present invention. DETAILED DESCRIPTION

[0044] The exemplary embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. If there are several embodiments, the features of these embodiments can be combined with each other without conflict. When the description refers to the drawings, unless otherwise specified, the same numbers in different drawings represent the same or similar elements. The contents described in the following exemplary embodiments do not represent all embodiments consistent with the present invention; on the contrary, they are only examples of devices, products and / or methods consistent with some aspects of the present invention as recorded in the claims of the present invention.

[0045] The terms used in the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the scope of protection of the present invention. The singular forms "a", "said" or "the" used in the specification and claims of the present invention are also intended to include plural forms, unless the context clearly indicates other meanings.

[0046] It should be understood that the words used in the specification and claims of the present invention, such as "first", "second" and similar words, do not indicate any order, quantity or importance, but are only used to distinguish the names of features. Similarly, words such as "one" or "an" do not indicate a quantitative limitation, but indicate the existence of at least one. Unless otherwise specified, words such as "front", "rear", "upper", "lower" and similar words appearing in the present invention are only for the convenience of explanation and are not limited to a specific position or a spatial orientation. Words such as "include" or "comprise" are an open-ended expression, meaning that the elements appearing before "include" or "comprise" include the elements appearing after "include" or "comprise" and their equivalents, which does not exclude that the elements appearing before "include" or "comprise" may also include other elements. If "several" appears in the present invention, it means two or more.

[0047] See also Figures 1 to 26 As shown, an embodiment of the present invention discloses a chip testing device, which realizes miniaturization of the device and can effectively support the transmission of high-frequency signals. The chip testing device is a static connector between a circuit board and a chip, which can make the replacement test of the chip more convenient, without the need to repeatedly weld and remove the chip, thereby reducing the damage to the chip and the circuit board, and can achieve a fast and efficient testing effect.

[0048] See also Figure 1 , Figure 2 and Figure 4 As shown, the chip testing device includes a housing 1, a coaxial spring needle module 2, a high-frequency board 3 and an SMP (subminiature push-in) connector 4. The high-frequency board 3 is arranged in the housing 1, one end of the coaxial spring needle module 2 is in contact with the high-frequency board 3, and the other end is in contact with the chip, one end of the SMP connector 4 is welded to the high-frequency board 3, and the other end is connected to the coaxial cable.

[0049] See also Figure 1 , Figure 2 , Figure 4 and Fig.10 As shown, the housing 1 includes a shell 11 and a cover 12 that are interlocked, and the two are adapted to each other and locked and fixed by a locking member 81. The cover 12, the high-frequency board 3 and the bottom wall of the shell 11 are provided with corresponding mounting holes. The locking member 81 passes through the mounting holes of the cover 12, the high-frequency board 3 and the bottom wall of the shell 11 in sequence and is fixed to fix the cover 12, the high-frequency board 3 and the shell 11. The top of the shell 11 is open, and sinking grooves 116 are provided on both sides of the opening. The corresponding two sides of the cover 12 are provided in the sinking grooves 116, and the surface of the cover 12 exposed to the outside is flush with the corresponding surface of the shell 11. In this embodiment, the shell 1 is roughly in the shape of a rectangular parallelepiped, and the sinking groove 116 is sunken downward from the short sides of the top of the shell 11; further, one end of the sinking groove 116 extends to one long side of the shell 11, and the other end is a certain distance away from the other long side of the shell 11, that is, the length of the sinking groove 116 is less than the length of the short side of the shell 11, and the short side of the shell 11 also has a portion protruding relative to the sinking groove 116, and the cover body 12 is provided with a notch 121 for avoiding this portion. In this way, the side surface and the lower surface of the cover body 12 at least partially abut the shell 11, and the outer surface of the shell 1 is relatively flat.

[0050] See also Figure 4 , Figure 6 and Figure 8As shown, the chip testing device also includes a fixing plate 5, which is arranged in the shell 1, and the high-frequency board 3 is clamped between the bottom wall of the shell 11 and the fixing plate 5. One side of the high-frequency board 3 at least partially abuts against the bottom wall of the shell 11, and the other side at least partially abuts against the fixing plate 5. Similarly, the fixing plate 5 is also provided with a mounting hole, and the locking member 81 is sequentially penetrated through the mounting holes of the cover body 12, the fixing plate 5, the high-frequency board 3 and the bottom wall of the shell 11 and fixed to fix the cover body 12, the fixing plate 5, the high-frequency board 3 and the shell 11.

[0051] See also Figures 2 to 4 , Figures 10 to 13 As shown, the coaxial spring needle module 2 is installed in the device through the first base 6, and the bottom wall of the shell 11 is provided with a first hollow portion 111 connecting the inside and outside of the shell 1, the radial outer contour of the first base 6 is adapted to the first hollow portion 111, and the first base 6 is arranged in the first hollow portion 111. Further, there is no fixed connection between the first base 6 and the first hollow portion 111, and the first base 6 is installed from the first hollow portion 111. After it is in place, the first base 6, the high-frequency board 3 and the fixing plate 5 can be screwed and fixed by fasteners to position the coaxial spring needle module 2 to contact the high-frequency board 3; when the coaxial spring needle module 2 needs to be replaced, the first base 6 together with the coaxial spring needle module 2 arranged on the first base 6 can be removed by loosening the fasteners, which is convenient for disassembly and assembly. The outer wall of the shell 11 is also provided with a strip groove 118 for easy operation.

[0052] See also Figures 2 to 4 , Figures 13 to 17As shown, the coaxial spring needle module 2 includes a coaxial needle 21 and a probe seat 22, multiple groups of coaxial needles 21 are arranged on the probe seat 22, the probe seat 22 is fixed to the first base 6, and the coaxial needle 21 is at least partially located inside the housing 1 and at least partially located outside the housing 1. The coaxial needle 21 includes a needle body 211 and a needle head 212 and a needle tail 213 at both ends. The needle head 212 is used to vertically contact the pins of the chip, and the needle tail 213 contacts the high-frequency board 3. The first base 6 includes a first clamping plate 61 and a second clamping plate 62. The first clamping plate 61 is provided with a first through hole 611, and the second clamping plate 62 is provided with a corresponding second through hole 621. The probe seat 22 is at least partially located in the first through hole 611 and at least partially located in the second through hole 621. The probe seat 22 is adapted to the first through hole 611 and the second through hole 621. Further, the first through hole 611 includes a first hole portion 6111 and a second hole portion 6112, wherein the first hole portion 6111 is away from the second through hole 621 relative to the second hole portion 6112, and the aperture of the second hole portion 6112 is larger than the aperture of the first hole portion 6111; the second through hole 621 includes a third hole portion 6211 and a fourth hole portion 6212, wherein the third hole portion 6211 is away from the first through hole 611 relative to the fourth hole portion 6212, and the aperture of the fourth hole portion 6212 is larger than the aperture of the third hole portion 6211. In other words, the apertures of the upper and lower ends of the entire hole formed by the first through hole 611 and the second through hole 621 are smaller than the aperture of the middle part, and the outer diameters of the upper and lower ends of the probe seat 22 are smaller than the middle part. In this way, while ensuring that the first base 6 limits the probe seat 22 in the radial direction, the probe seat 22 is also clamped and limited in the axial direction, so that the probe seat 22 is fixed to the first base 6.

[0053] For further information, see Fig.15 , Fig.16 , Fig.16 and Fig. 20As shown, the probe seat 22 includes a first needle seat 222 and a second needle seat 223, wherein the first needle seat 222 is at least partially located in the first through hole 611, and the second needle seat 223 is at least partially located in the second through hole 621. Specifically, the first needle seat 222 includes a first base 2221 and a second base 2222, wherein the first base 2221 is away from the second needle seat 223 relative to the second base 2222, and the first base 2221 is adapted to the first hole 6111, and the second base 2222 is adapted to the second hole 6112; the second needle seat 223 includes a third base 2231 and a fourth base 2232, wherein the third base 2231 is away from the first needle seat 222 relative to the fourth base 2232, and the third base 2231 is adapted to the third hole 6211, and the fourth base 2232 is adapted to the fourth hole 6212. A first connecting wall 6113 is provided between the first hole portion 6111 and the second hole portion 6112, and a first abutting wall 2223 is provided between the first base portion 2221 and the second base portion 2222. The first abutting wall 2223 abuts against the first connecting wall 6113, and a side of the first base portion 2221 away from the second base portion 2222 is flush with a side of the first clamping plate 61 away from the second clamping plate 62, and a side of the second base portion 2222 away from the first base portion 2221 is flush with a side of the first clamping plate 61 close to the second clamping plate 62. A second connecting wall 6213 is provided between the third hole portion 6211 and the fourth hole portion 6212, a second abutting wall 2233 is provided between the third base portion 2231 and the fourth base portion 2232, the second abutting wall 2233 abuts against the second connecting wall 6213, and a side of the third base portion 2231 away from the fourth base portion 2232 is flush with a side of the second clamping plate 62 away from the first clamping plate 61, and a side of the fourth base portion 2232 away from the third base portion 2231 is flush with a side of the second clamping plate 62 close to the first clamping plate 61. The first clamping plate 61 is at least partially fitted with the second clamping plate 62, and the first needle seat 222 is at least partially fitted with the second needle seat 223. In this way, the limiting fixation between the probe seat 22 and the first base 6 is realized with a simple structure, and the flatness of the two after being fixed is ensured, so that the whole after the probe seat 22 and the first base 6 are fixed can be assembled more easily.

[0054] See also Figure 1 , Figure 2 , Figure 8 and Fig. 9As shown, the outer wall of the housing 11 is provided with a plurality of inwardly recessed mounting grooves 112 and a third through hole 113 connecting the mounting grooves 112 and the interior of the housing 1, the SMP connector is provided in the mounting groove 112, the SMP connector 4 includes a connector 41 and a connection seat 42, the connector 41 includes a center pin 411, the connector 41 is provided in the connection seat 42 and the two are welded after positioning, the connection seat 42 is provided in the mounting groove 112, the center pin 411 is at least partially welded to the high-frequency board 3 and at least partially located in the mounting groove 112. Furthermore, the outer contour of the connection seat 42 is adapted to the mounting groove 112, so as to ensure the external flatness of the housing 1 after the SMP connector 4 is installed in the mounting groove 112. The number of connectors 41 and coaxial pins 21 is the same, and the two are connected one by one.

[0055] See also Figure 8 , Fig. 9 , Fig.10 , Fig. 22 and Fig.23 As shown, the connection base 42 is provided with a fourth through hole 421 and a fifth through hole 422, wherein the fourth through hole 421 is used to install the connector 41, and the fifth through hole 422 is used to fix the connection base 42. The connector 41 is adapted to the fourth through hole 421, and the fourth through hole 421 is connected to the third through hole 113. The center pin 411 is at least partially located in the fourth through hole 421, and penetrates the third through hole 113 to the inside of the housing 1 and is welded to the high-frequency board 3. Furthermore, the connection base 42 is also provided with a welding hole 423 that penetrates from the radial side of the fourth through hole 421 to the outer side wall of the connection base 42, so as to facilitate welding the plug 41 to the connection base 42. The mounting groove 112 of the shell 11 is also provided with a sixth through hole 117 connecting the mounting groove 112 and the inside of the shell 1. The fifth through hole 422 is coaxially connected with the sixth through hole 117 and axially corresponds to the fixing plate 5 inside the shell 1. The fifth through hole 422, the sixth through hole 117 and the fixing plate 5 are screwedly fixed to the fifth through hole 422, the sixth through hole 117 and the fixing plate 5 by fasteners to fix the SMP connector 4, the shell 11 and the fixing plate 5 in connection.

[0056] See also Figure 2 , Figure 4 , Figures 10 to 12 As shown, the chip testing device of this embodiment also includes a second base 7. The bottom wall of the shell 11 is also provided with a second hollow portion 114 connecting the inside and outside of the shell 1. The second base 7 is arranged in the second hollow portion 114, and the second base 7, the high-frequency board 3 and the fixing plate 5 can be screwed and fixed by fasteners.

[0057] For further information, see Figure 4 , Figure 6 , Figure 8 , Figures 10 to 13 , Fig.21As shown, the first base 6 and the second base 7 are flush with the inner bottom wall of the shell 11 on one side facing the inside of the housing 1, and the high frequency board 3 has one side at least partially abutting against the first base 6, the second base 7 and the inner bottom wall of the shell 11, and the other side of the high frequency board 3 at least partially abutting against the fixing plate 5. The inner bottom wall of the shell 11 is provided with a plurality of concave first grooves 115, the first clamping plate 61 is provided with a side away from the second clamping plate 62 in the same direction as the inner bottom wall of the shell 11, the first clamping plate 61 is provided with a plurality of concave second grooves 612, the second base 7 is provided with a plurality of concave third grooves 71, the probe seat 22 is provided with a fourth groove 221, and the fourth groove 221 is provided on the first needle seat 222. The first groove 115, the second groove 612, the third groove 71 and the fourth groove 221 have the same depth and width. When the entire device is assembled, the fourth groove 221, the second groove 612, the first groove 115 and the third groove 71 are connected in sequence, and one side of the high-frequency board 3 at least partially abuts the first needle seat 22 of the probe seat 22, the first clamping plate 61, the inner bottom wall of the housing 11 and the second base 7, so that each group of connected fourth grooves 221, second grooves 612, first grooves 115 and third grooves 71 forms a closed channel, the center needle 411 of the connector 41 is at least partially located in the third groove 71, and the coaxial needle 21 is at least partially located in the fourth groove 221. Such a setting can play a role in avoiding the high-frequency channel between the one-to-one conductive coaxial needle 21 and the connector 41. On the basis of effectively supporting high-frequency signal transmission, by optimizing impedance matching, the influence of low-frequency lines on high-frequency signal transmission is reduced, thereby ensuring stable and low-loss signal transmission under high-frequency conditions.

[0058] See also Figure 2 , Figure 3 , Fig.13 , Fig.14 , Fig.18 , Fig.19 and Fig. 20As shown, the coaxial needle 21 includes a high-frequency probe 201 and a grounding probe 202. In each group of coaxial needles 21, two grounding probes 202 are arranged on both sides of the high-frequency probe 201, and the high-frequency probe 201 is at least partially located in the fourth groove 221. The needle bodies 211 of the high-frequency probe 201 and the grounding probe 202 are both arranged in the probe seat 22, the needle heads 212 are at least partially exposed from the second needle seat 223, and the needle tails 213 are at least partially exposed from the first needle seat 222. The lengths of the high-frequency probe 201 and the grounding probe 202 are equal. The first needle seat 222 is provided with a first needle hole 2224 that passes through the first base 2221 and the second base 2222, and the second needle seat 223 is provided with a second needle hole 2234 that passes through the third base 2231 and the fourth base 2232. The first needle hole 2224 is coaxial with and connected to the second needle hole 2234, and is used to set the high-frequency probe 201; the needle body 211 of the high-frequency probe 201 is at least partially located in the first needle hole 2224 and at least partially located in the second needle hole 2234, the needle head 212 is at least partially exposed from one end of the second needle hole 2234 away from the first needle hole 2224, and the needle tail 213 is at least partially exposed from one end of the first needle hole 2224 away from the second needle hole 2234. The first needle seat 222 is also provided with a third needle hole 2225 that passes through the first base 2221 and the second base 2222, and the second needle seat 223 is provided with a fourth needle hole 2235 that passes through the third base 2231 and the fourth base 2232. The third needle hole 2225 is coaxial with and connected to the fourth needle hole 2235, and is used to set the grounding probe 202; the needle body 211 of the grounding probe 202 is at least partially located in the third needle hole 2225 and at least partially located in the fourth needle hole 2235, the needle head 212 is at least partially exposed from one end of the fourth needle hole 2235 away from the third needle hole 2225, and the needle tail 213 is at least partially exposed from one end of the third needle hole 2225 away from the fourth needle hole 2235.

[0059] See also Figure 3 , Figure 7 , Fig.18 , Fig.19 and Fig. 20As shown, the second needle seat 223 also includes a plurality of bosses 2236, the bosses 2236 protrude from a side of the third base 2231 away from the fourth base 2232, the second needle hole 2234 and the fourth needle hole 2235 both penetrate the bosses 2236, the third base 2231 and the fourth base 2232, and the needle tips 212 of the high-frequency probe 201 and the grounding probe 202 are exposed from the bosses 2236. Furthermore, a recessed platform groove 2237 is provided on the side of the boss 2236 away from the third base 2231, and the side of the boss 2236 away from the third base 2231 has a first wall 2238 and a second wall 2239, wherein the first wall 2238 is the wall of the boss 2236 as a whole farthest from the third base 2231, and the second wall 2239 is the bottom wall of the recessed platform groove 2237, the high-frequency probe 201 is exposed from the second wall 2239, and the grounding probe 202 is exposed from the first wall 2238.

[0060] See also Fig.13 , Fig.14 , Figures 18 to 20 As shown, the fourth groove 221 is connected to the first needle hole 2224, and a platform 2211 is arranged in the fourth groove 221, and the top wall of the platform 2211 is located between the bottom wall of the fourth groove 221 and the wall of the first base 2221 away from the second base 2222. The high-frequency probe 201 also includes a first insulator 214 and a second insulator 215 sleeved on the outer periphery, and the first insulator 214 sleeves and fits the part of the needle body 211 close to the needle tail 213 and the part of the needle tail 213 close to the needle body 211, and the needle tail 213 is at least partially exposed outside the first insulator 214; further, the side of the first insulator 214 close to the needle head 212 at least partially abuts the top wall of the platform 2211, and the side of the first insulator 214 away from the needle head 212 is flush with the wall of the first base 2221 away from the second base 2222. The second insulator 215 is sleeved over and fits the portion of the needle body 211 close to the needle head 212 and the portion of the needle head 212 close to the needle body 211, and the needle head 212 is at least partially exposed outside the second insulator 215; further, the second insulator 215 is at least partially located in the second needle hole 2234 and at least partially exposed in the sink groove 2237, and the side of the second insulator 215 away from the needle tail 213 is flush with the first wall 2238.

[0061] See also Fig.24 As shown, the chip testing device of this embodiment contacts the pins of the device under test, i.e., the chip, through the needle head 212 of the coaxial needle 21, and the needle tail 213 contacts the high-frequency board 3. The high-frequency board 3 leads out the high-frequency circuit and is welded to the SMP connector 4, so that the pins of the device under test are connected by the coaxial needle 21, the high-frequency board 3, and the SMP connector 4 in sequence.

[0062] See also Fig.25 and Fig.26As shown, in one embodiment of the present invention, the chip to be tested 10 is placed in the test frame 20. The test frame 20 shown in the figure can place four chips to be tested 10 at the same time. A limit shaft 30 is installed on the test frame 20 to limit the chip testing device. The bottom wall of the shell 11, the high-frequency board 3, the fixing plate 5 and the cover body 12 are preset with axially corresponding holes. The limit shaft 20 passes through these holes in sequence, and the outer periphery of the limit shaft 20 is sleeved with a spring 40. The spring 40 is located between the test frame 20 and the bottom wall of the shell 11 of the chip testing device to achieve elastic operation and precise positioning. Specifically, the chip to be tested 10 is a KU antenna chip, and the chip testing device measures its electrical characteristics at millimeter wave frequencies. The chip to be tested 10 has eight test points, namely eight pins 101. Therefore, eight groups of coaxial pins 21 and eight SMP connectors 4 are correspondingly provided in the chip testing device, and the coaxial pins 21 correspond vertically to the pins 101 of the chip to be tested 10 one by one. The chip testing device does not require a probe station as a base, has a small size, and greatly reduces the steps and time in the production, assembly and operation processes, significantly improving efficiency; at the same time, it can adapt to the inverted, small space, quick insertion and other characteristics of the chip 10 to be tested, providing a new testing method.

[0063] In summary, compared with the prior art, the chip testing device of the present invention has the following advantages: the coaxial spring needle module 2, the high-frequency board 3 and the SMP connector 4 are integrated to make the volume of the whole device smaller, the needle head 212 of the coaxial needle 21 contacts the pin of the chip, the needle tail 213 contacts the high-frequency board, and the connector 41 of the SMP connector 4 is welded with the high-frequency board 3, which can effectively support the transmission of high-frequency signals, and by optimizing impedance matching, the influence of low-frequency lines on signal transmission is reduced. The chip testing device simplifies the process technology, reduces the length and complexity of the line, and greatly reduces the time of assembly and operation, thereby improving production efficiency.

[0064] The above implementation modes are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. The understanding of this specification should be based on the technical personnel in the relevant technical field. Although this specification has described the present invention in detail with reference to the above embodiments, ordinary technical personnel in the field should understand that the technical personnel in the relevant technical field can still modify or replace the present invention with equivalents, and all technical solutions and improvements thereof that do not depart from the spirit and scope of the present invention should be covered within the scope of the claims of the present invention.

Claims

1. A chip testing device, characterized in that: include: A housing (1), a coaxial spring needle module (2), a high-frequency board (3) and an SMP connector (4); the high-frequency board (3) is arranged in the housing (1); the coaxial spring needle module (2) comprises a plurality of groups of coaxial needles (21); the coaxial needles (21) comprise a needle body (211), a needle head (212) and a needle tail (213); the needle head (212) is used to vertically contact the pin of a chip; the needle tail (213) contacts the high-frequency board (3); a plurality of SMP connectors (4) are provided; the SMP connector (4) comprises a joint (41); the joint (41) is welded to the high-frequency board (3) and is electrically connected to the coaxial needles (21) in a one-to-one correspondence.

2. The chip testing device according to claim 1, characterized in that: The housing (1) comprises an outer shell (11) and a cover (12) which are interlocked, and a locking member (81) is sequentially passed through the cover (12), the high-frequency board (3) and the bottom wall of the outer shell (11) and fixed.

3. The chip testing device according to claim 2, characterized in that: The chip testing device further comprises a fixing plate (5), wherein the fixing plate (5) is arranged in the shell (1), the high-frequency board (3) is clamped between the bottom wall of the shell (11) and the fixing plate (5), and the cover body (12), the fixing plate (5), the high-frequency board (3) and the bottom wall of the shell (11) are sequentially penetrated and fixed by the locking member (81).

4. The chip testing device according to claim 2, characterized in that: The chip testing device further comprises a first base (6); a bottom wall of the housing (11) is provided with a first hollow portion (111) communicating the interior and exterior of the housing (1); a radial outer contour of the first base (6) is adapted to the first hollow portion (111); the first base (6) is arranged on the first hollow portion (111); the coaxial spring needle module (2) is arranged on the first base (6); and the coaxial needle (21) is at least partially located inside the housing (1) and at least partially located outside the housing (1).

5. The chip testing device according to claim 4, characterized in that: The first base (6) comprises a first clamping plate (61) and a second clamping plate (62), the first clamping plate (61) is provided with a first through hole (611), the second clamping plate (62) is provided with a corresponding second through hole (621), the coaxial spring needle module (2) further comprises a probe seat (22), the coaxial needle (21) is arranged on the probe seat (22), the probe seat (22) is fixed to the first base (6) and is at least partially located in the first through hole (611) and the second through hole (621).

6. The chip testing device according to claim 5, characterized in that: The probe seat (22) is adapted to the first through hole (611) and the second through hole (621); the first through hole (611) includes a first hole portion (6111) and a second hole portion (6112); the first hole portion (6111) is away from the second through hole (621) relative to the second hole portion (6112); the aperture of the second hole portion (6112) is larger than the aperture of the first hole portion (6112); the second through hole (621) includes a third hole portion (6211) and a fourth hole portion (6212); the third hole portion (6211) is away from the first through hole (611) relative to the fourth hole portion (6212); the aperture of the fourth hole portion (6212) is larger than the aperture of the third hole portion (6211).

7. The chip testing device according to claim 5, characterized in that: The outer wall of the housing (11) is provided with a plurality of mounting grooves (112) and a third through hole (113) connecting the mounting grooves (112) and the interior of the housing (1); the SMP connector (4) is arranged in the mounting groove (112); the connector (41) includes a center pin (411); the center pin (411) is at least partially welded to the high-frequency board (3) and at least partially located in the mounting groove (112).

8. The chip testing device according to claim 7, characterized in that: The chip testing device further comprises a second base (7); the bottom wall of the shell (11) is further provided with a second hollow portion (114) connecting the inside and outside of the shell (1); the second base (7) is arranged in the second hollow portion (114); one side of the first base (6) and the second base (7) facing the inside of the shell (1) is flush with the inner bottom wall of the shell (11); and one side of the high-frequency board (3) at least partially abuts against the first base (6), the second base (7) and the inner bottom wall of the shell (11).

9. The chip testing device according to claim 8, characterized in that: The inner bottom wall of the shell (11) is provided with a plurality of first grooves (115); a side of the first clamping plate (61) away from the second clamping plate (62) faces the same direction as the inner bottom wall of the shell (11); the first clamping plate (6) is provided with a plurality of second grooves (612); the second base (7) is provided with a plurality of third grooves (71); the probe seat (22) is provided with a plurality of fourth grooves (221); the fourth grooves (221), the second grooves (612), the first grooves (115) and the third grooves (71) are connected in sequence; the center needle (411) is at least partially located in the third groove (71); and the coaxial needle (21) is at least partially located in the fourth groove (221).

10. The chip testing device according to claim 9, characterized in that: The coaxial needle (21) comprises a high-frequency probe (201) and a grounding probe (202); the high-frequency probe (201) is at least partially located in the fourth groove (221); one side of the high-frequency board (3) at least partially abuts against the probe seat (22), the first clamping plate (61), the inner bottom wall of the housing (11) and the second base (7), so that each group of the fourth groove (221), the second groove (612), the first groove (115) and the third groove (71) that are connected form a closed channel.

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