High-fault-tolerance spring type contact interface

By designing a high-fault-tolerant spring contact interface, using spring pins and redundant design, the accuracy and stress problems of existing slotted interfaces on thick PCB boards are solved, achieving high reliability and low-cost installation and maintenance.

CN223093164UActive Publication Date: 2025-07-11BEIJING HANCHEN TECO TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202421469411.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-26
Publication Date
2025-07-11
Estimated Expiration
2034-06-26

AI Technical Summary

Technical Problem

When handling PCB boards with thicknesses of more than 1.6mm, the existing slotted interfaces have high accuracy requirements and cannot withstand high stress. The lack of standard parts on the market, resulting in limited applications in special occasions.

Method used

A high-fault-tolerant spring-type contact interface is designed, adopting a combined structure of spring pin motherboard, gold-plated contact surface adapter plate and test plate. The spring pin elastic contact and redundant design ensure contact reliability and anti-displacement ability.

Benefits of technology

It achieves high-precision alignment, strong stress resistance, easy installation, simple maintenance, high working reliability, and reduces equipment design and processing costs.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223093164U_ABST
    Figure CN223093164U_ABST
Patent Text Reader

Abstract

The utility model relates to a high fault tolerance spring type contact interface, which is used for electrical contact arranged on a circuit board, the contact interface structure comprises a group of spring needles, a mother board, a group of adapter plates and a test board, the spring needles are welded on the mother board to form a spring needle group, needle heads with the diameter of 0.9 mm are used, and the stroke is 2mm; the adapter plate is manufactured by processing a PCB (printed circuit board), two 4.25 mm * 6.6 mm gold-plated contact surfaces are arranged on the adapter plate, the distance between the two 4.25 mm * 6.6 mm gold-plated contact surfaces is 10.16 mm, each contact surface is provided with four welding points, and the two contact surfaces are finally welded on the user board. The high-fault-tolerance spring type contact interface is simple in structure and easy and accurate in butt joint; high operability is achieved, and the allowable dislocation range is large; the electrical connection capability is strong and the stability is good; installation is convenient, maintenance is simple, and working reliability is high.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to a high-fault-tolerant spring-type contact interface, and particularly to a circuit interface that is different from and superior to a slot type. Background Art

[0002] Slot type interface and spring-type contact interface: one is a contact by elastic sheet extrusion. The interface board is inserted into a slot composed of elastic sheets, and good contact is ensured by the extrusion force. The contact points will have displacement and wear; the other is spring-type contact. The interface board is a large gold-plated plane. The contact surface of the interface board is perpendicular to the spring pins. The needle tips are pushed along the axial direction of the spring pins, and good contact is ensured by the pushing force. The contact points have no relative displacement and no wear will occur.

[0003] Most traditional slot type interfaces are PCI slots. The thickness of the matching socket is 1 - 1.6 mm. Most of the plug-in boards are PCBs with gold finger interfaces and are small in size. The slots are standard parts. For example, memory modules, boards, etc. all use this kind of interface. This kind of interface requires high precision, and the plug-in objects are small in size and cannot withstand large stresses. It is only suitable for the docking of standard parts with a certain small size and small volume. However, in some special occasions, if the thickness of the PCB board to be plugged exceeds 1.6 mm and the size far exceeds that of the memory module, reaching more than 200 * 200 mm, the PCB board manufacturer does not have the process of plating copper on the side of the PCB, and there is no corresponding slot type interface standard part in the market. Content of the Utility Model

[0004] 1. To solve the above deficiencies, the utility model proposes a high-fault-tolerant spring-type contact interface, which includes a set of spring pin mother boards, a set of gold-plated contact surface adapter boards, and a test board. Its characteristics are as follows:

[0005] For the high-fault-tolerant spring-type contact interface, the spring pin group, the spring pins are purchased from the market, the diameter of the tail of the needle tube is φ0.8 mm, the mother board is a PCB board with a thickness of 3.5 mm, the spring pins are welded on the pads of the mother board, and two pads are in a group with a spacing of 2.54 mm, and the spacing between groups is 10.16 mm. The diameter of the round surface of the pad is 1.57 mm, and the aperture is 0.95 mm; the adapter board is a double-sided PCB board with a thickness of 1.5 mm. One side is the contact surface with two contact surfaces with a spacing of 10.16 mm, and the size is 4.25 mm * 6.6 mm. The other side is the welding surface with 8 pads. Each contact surface is connected to the corresponding 4 pads through "vias". The adapter board is connected to the test board through the pads; the test board is a user board, which is a double-sided board. On each side, two pads of the interface part are in a group with a spacing of 2.54 mm, and the spacing between groups is 10.16 mm.

[0006] Further, the spring pin set is made by welding spring pins with a travel of 2 mm on the motherboard. The pin head is a spherical surface, which can ensure that each spring pin reliably contacts the adapter board. The diameter of the tail of the spring pin is 0.8 mm, which is convenient for welding on the motherboard;

[0007] Further, the adapter board has a gold-plated contact surface to prevent the contact surface from oxidizing, and adopts a redundant design. One contact surface corresponds to two spring pins, which can fully ensure the contact reliability. The outer shape adopts an I-shaped structure, which is convenient for installation on the test board;

[0008] Further, the outer shape of the interface part of the test board is embedded, which is convenient for installing the adapter board and ensuring the position accuracy of the contact surface;

[0009] This interface has a simple structure, light weight, and is convenient for stable installation on a large circuit board; it has high alignment accuracy and a large tolerance range; it has strong stress resistance and good stability; it is easy to install, simple to maintain, and has high working reliability. Description of the Drawings

[0010] Through the following description and in conjunction with the drawings, the present invention will become clearer. These drawings are used to explain the embodiments of the present invention.

[0011] Figure 1 It is a schematic structural diagram of the high-fault-tolerant spring-type contact interface of the present invention;

[0012] Description of the Reference Numerals in the Drawings

[0013] 1. Spring pin 2. Motherboard 3. Adapter board

[0014] 4. Test board

[0015] Figure 2 It is a front view of the adapter board structure of the high-fault-tolerant spring-type contact interface of the present invention;

[0016] Figure 3 It is a side view of the adapter board structure of the high-fault-tolerant spring-type contact interface of the present invention;

[0017] Figure 4 It is a schematic structural diagram of the test board of the high-fault-tolerant spring-type contact interface of the present invention. Detailed Embodiments

[0018] The present invention proposes a high-fault-tolerant spring-type contact interface, as Figure 1As shown in the figure, it includes spring pins 1, a motherboard 2, an adapter board 3, and a test board 4. Among them, the spring pins 1 have a needle tip diameter of φ0.9mm, a stroke of 2mm, and a needle tail diameter of 0.8mm, and are then welded to the motherboard 2. The motherboard 2 has a thickness of 3.5mm. The spring pin welding pads on the board are grouped in pairs, with a spacing of 2.54mm between each pair, and a spacing of 10.16mm between groups, completing the electrical connection part of the spring pin group on the motherboard. In contact with the spring pins above is the adapter board 3. The adapter board 3 is embedded in the test board 3. The spring pins 1 are docked with the adapter board 3, and through elastic electrical contact, a spring-type contact interface is realized.

[0019] The present utility model proposes a highly fault-tolerant spring-type contact interface, as Figure 2 and 3 shown. The adapter board 3 has a thickness of 1.5mm and adopts an I-shaped outer shape, which is convenient for fixing on the test board and preventing displacement. There are 2 gold-plated contact surfaces with a spacing of 10.16mm on the board, and one surface corresponds to a group of spring pins (2 pieces, redundant design).

[0020] The present utility model proposes a highly fault-tolerant spring-type contact interface, as Figure 4 shown. The test board 4 has a thickness of 2.5mm. A groove is milled at the docking part with the adapter board 3 for fixing the adapter board 3, realizing the precise positioning of the adapter board and the spring pin group.

[0021] The working principle of the highly fault-tolerant spring-type contact interface proposed by the present utility model is to utilize the elasticity of the spring pins to achieve elastic contact at the contact points, ensuring that each contact point can be electrically connected. And the spring pins are combined redundantly, with 2 pieces in a group. As long as one is in contact, electrical contact can be achieved. Since the adapter board uses a large contact surface, the possibility of misalignment of the spring pin contact points is greatly reduced. The contact surface of the adapter board is 4.25mm * 6.6mm. Therefore, the misalignment range of the spring pins is enlarged to ±1.27mm in the vertical direction and ±3.3mm in the horizontal direction. The protrusions at both ends of the adapter board can be firmly stuck in the test board designed with grooves, which can not only make the position accuracy of the adapter board reliable, but also increase the mechanical strength of the adapter board. Cooperating with the spring pin group welded on the motherboard, it is very convenient for installation and maintenance. Using the redundant combination of spring pins and the wide contact surface of the adapter board greatly increases the anti-misalignment ability of the above spring-type contact interface, greatly reduces the docking accuracy requirements of the interface, reduces the accuracy requirements for the equipment structure design, and also reduces the processing cost and maintenance cost.

Claims

1. A highly fault-tolerant spring-type contact interface, comprising a set of spring pin motherboards, a set of gold-plated contact surface adapter plates, and a test board, characterized in that: For the high-fault-tolerant contact spring interface, the tail diameter of the spring pin needle tube is φ0.8mm, the motherboard is a PCB board with a thickness of 3.5mm, the spring pins are welded on the motherboard pads. Two pads form a group, with a spacing of 2.54mm between groups, and the spacing between groups is 10.16mm. The diameter of the round surface of the pad is 1.57mm, and the hole diameter is 0.95mm; the adapter board is a double-sided PCB, with a thickness of 1.5mm. One side is the contact surface, having two contact surfaces with a spacing of 10.16mm, with a size of 4.25mm * 6.6mm. The other side is the welding surface with 8 pads. Each contact surface is connected to 4 corresponding pads through "vias". The adapter board is connected to the test board through the pads; the test board is a user board, which is a double-sided board. On each side, two pads in the interface part form a group, with a spacing of 2.54mm between groups, and the spacing between groups is 10.16mm.

2. The highly fault-tolerant spring-type contact interface according to claim 1, wherein: The stroke of the spring pin is 2mm, and the needle tip is a spherical surface, which can ensure that each spring pin reliably contacts the adapter board. The tail diameter of the spring pin is 0.8mm, which is convenient for welding on the motherboard.

3. The highly fault-tolerant spring-type contact interface according to claim 1, wherein: The contact surface of the adapter board is gold-plated to prevent oxidation of the contact surface, and a redundant design is adopted. One contact surface corresponds to two spring pins, which can fully ensure the contact reliability. The outer shape adopts an I-shaped structure, which is convenient for installation on the test board.

4. The highly fault-tolerant spring-type contact interface according to claim 1, wherein: The outer shape of the interface part of the test board is embedded, which is convenient for installing the adapter board and ensures the position accuracy of the contact surface.