Detection image viewing method and system for chip bonding circuit detection

Abstract

The invention discloses a detection image viewing method and system for chip bonding line detection. The detection image viewing method comprises the following steps: acquiring a detection image set consisting of a plurality of detection images shot by a plurality of different shooting distances at the same detection position of a detected chip bonding line; selecting a corresponding image transformation area on a first detection picture displayed on the current image interface, switching a first image in the current image transformation area to images in other detection pictures according to the image switching instruction, and keeping the image, displayed outside the image transformation area, of the current interface unchanged, by replacing the frame selection area in the currently displayed picture with the corresponding area image in other pictures with different focal lengths, a detector can identify and analyze the connection state of the detected metal wire by observing and comparing the switched image in the frame selection area and the current picture outside the frame selection area, so that the detection efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of three-dimensional space circuit detection, and in particular to a detection image viewing method and system for chip bonding circuit detection. Background Art

[0002] Chip bonding is an important wire bonding method in the chip production process. It ensures that the chip can work normally by establishing an electrical connection between the internal circuit of the chip and the external package pins or circuit boards. In the bonding process, metal wires such as gold wire, copper wire or aluminum wire are usually used as connecting wires. Under the action of ultrasonic vibration and pressure, these wires are tightly connected with the chip pads and the package pins or pads on the circuit board to form a strong mechanical connection and electrical connection. Among them, the detection of chip bonding circuits is an important part of the chip packaging and testing process, which aims to ensure that the electrical connection between the internal circuit of the chip and the external package pins or circuit boards is correct, strong and defect-free. . During the inspection process, the inspector often takes a photo of the chip bonding circuit to be inspected, and then zooms in on the image of the chip bonding circuit to be inspected on the display screen to check the status of each metal wire. However, in the actual chip bonding circuit image viewing process, due to the small size and dense arrangement of each metal wire, multiple metal wires are often overlapped, so that the lower metal wires cannot be accurately distinguished or partially distinguished from the image taken by the upper camera device after being blocked, and it is difficult to distinguish the contour and connection status of the lower metal wires. If multiple detection images at different heights are taken to present the metal wires at different heights respectively, the metal wires at different heights will often be clear in one detection image and blurred in another detection image, making it impossible to combine these metal wires at different heights for clear comparative analysis, affecting the detection efficiency. Summary of the invention

[0003] In view of the deficiencies in the prior art, the present invention provides a detection image viewing method for chip bonding circuit detection, comprising:

[0004] Obtain a test picture set consisting of multiple test pictures taken at different shooting distances at the same test position of the tested chip bonding circuit;

[0005] In response to the area selection action, a corresponding image transformation area is selected on the first detection image displayed on the current image interface;

[0006] According to the image switching instruction, the first image of the first detection picture in the image transformation area is switched to the replacement image, and the image of the first detection picture outside the image transformation area displayed on the current interface is kept unchanged, and the replacement image is the image of other detection pictures in the detection picture set to which the first detection picture belongs at the position of the corresponding image transformation area.

[0007] Preferably, the detection picture set includes multiple detection pictures obtained by shooting multiple metal wires arranged overlapping each other at the same height with different focal lengths, or shooting at different heights with fixed focal lengths, wherein the detection picture set includes detection pictures in which the contours of different metal wires can be clearly seen.

[0008] Preferably, obtaining a detection picture set consisting of multiple detection pictures taken at different shooting distances at the same inspection position of the bonding circuit of the chip under test includes: for the bonding circuit of the chip under test in which multiple metal wires are arranged overlappingly above and below, taking multiple pictures of the bonding circuit of the chip under test above the same position using different focal lengths and the same height, or using fixed focal lengths and different heights, to obtain a corresponding detection picture set consisting of multiple detection pictures of the bonding circuit of the chip under test, wherein the detection picture set contains corresponding detection pictures in which different metal wires among the multiple overlapping metal wires can be clearly seen.

[0009] Preferably, the method of switching the first image of the first detection picture in the image transformation area to a replacement image according to the image switching instruction, and keeping the image of the first detection picture displayed on the current interface outside the image transformation area unchanged includes: after receiving the image switching instruction, obtaining the corresponding detection picture set and picture queue order according to the first detection picture displayed on the current interface; after simultaneously receiving the keyboard CTL or ALT or Shift key action and the mouse wheel rolling action, calling the replacement image of the corresponding detection picture area according to the picture queue order, and presenting it in the image transformation area displayed on the current image interface, and keeping the image of the first detection picture displayed on the current interface outside the image transformation area unchanged.

[0010] Preferably, the response area selection action to select the corresponding image transformation area on the first detection picture displayed on the current image interface also includes: obtaining the interface coordinate position of the image transformation area selected by the area selection action on the current image interface, and generating the relative area coordinates of the image transformation area on the first detection picture according to the interface coordinate position and the position of the first detection picture displayed on the current image interface.

[0011] The present invention also discloses a detection image viewing system for chip bonding circuit detection, comprising an image acquisition module, an area frame selection module and an image replacement module, wherein the image acquisition module acquires a detection image set consisting of multiple detection images taken at different shooting distances at the same inspection position of the tested chip bonding circuit; the area frame selection module is used to respond to the area frame selection action to select a corresponding image transformation area on the first detection image displayed on the current image interface; the image replacement module is used to switch the first image of the first detection image in the image transformation area to a replacement image according to an image switching instruction, and keep the image of the first detection image displayed on the current interface outside the image transformation area unchanged, and the replacement image is an image of other detection images in the detection image set to which the first detection image belongs at the location of the corresponding image transformation area.

[0012] Preferably, the detection picture set includes multiple detection pictures obtained by shooting multiple metal wires arranged overlapping each other at the same height with different focal lengths, or shooting at different heights with fixed focal lengths, wherein the detection picture set includes detection pictures in which the contours of different metal wires can be clearly seen.

[0013] Preferably, the image acquisition module also includes: for a bonding circuit of a chip under test having multiple metal wires arranged overlappingly above and below, taking multiple photographs of the bonding circuit of the chip under test at the same position using different focal lengths and the same height or using fixed focal lengths and different heights, obtaining multiple inspection images of the bonding circuit of the chip under test to form a corresponding inspection image set, wherein the inspection image set includes corresponding inspection images that can clearly see different metal wires in the multiple overlapping metal wires.

[0014] Preferably, the image replacement module also includes: after receiving an image switching instruction, obtaining a corresponding detection picture set and picture queue order according to the first detection picture displayed on the current interface; after simultaneously receiving the keyboard CTL or ALT or Shift key action, and the mouse wheel scrolling action, calling up a replacement image of the corresponding detection picture area according to the picture queue order, and presenting it in the image transformation area displayed on the current image interface, and keeping the image of the first detection picture displayed on the current interface outside the image transformation area unchanged.

[0015] Preferably, the area selection module also includes: obtaining the interface coordinate position of the image transformation area selected by the area selection action on the current image interface, and generating the relative area coordinates of the image transformation area on the first detection image according to the interface coordinate position and the position of the first detection image displayed on the current image interface.

[0016] The present invention discloses a detection image viewing method and system for chip bonding circuit detection. By shooting a plurality of images of the tested chip bonding circuit at different shooting distances at the same inspection position, each metal wire in the tested chip bonding circuit can be clearly displayed in different images. By adding a frame to a base image, a corresponding image transformation area is selected on a first detection image displayed on a current image interface in response to an area frame selection action. According to an image switching instruction, the first image of the first detection image in the image transformation area is switched to a replacement image. At the same time, the image of the first detection image displayed on the current interface outside the image transformation area is kept unchanged, so that the detection personnel can identify and obtain the status of the tested metal wire by observing the different images switched in the frame selection area, so as to timely determine the fault location and cause, improve the detection efficiency, and reduce the detection error rate.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0019] Figure 1 The present invention is a schematic diagram of the steps of a detection image viewing method for chip bonding circuit detection disclosed in an embodiment of the present invention.

[0020] Figure 2 A metal wire detection image at a focal length disclosed in an embodiment of the present invention.

[0021] Figure 3 This is a metal wire detection image at another focal length disclosed in an embodiment of the present invention.

[0022] Figure 4 This is a metal wire detection image at another focal length disclosed in an embodiment of the present invention.

[0023] Figure 5 This is a schematic diagram of specific steps of step S3 disclosed in one embodiment of the present invention.

[0024] Figure 6 The present invention is a schematic diagram of the structure of a detection image viewing system for chip bonding circuit detection disclosed in an embodiment of the present invention. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] In the present invention, unless otherwise clearly specified and limited, the technical terms or scientific terms used herein shall have the common meanings understood by persons with ordinary skills in the field to which the present invention belongs. The words "first", "second" and similar words used in the patent application specification and claims of the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "an" do not indicate a quantity limitation, but indicate the existence of at least one.

[0027] Chip bonding is an important wire bonding method in the chip production process. It ensures that the chip can work normally by establishing an electrical connection between the internal circuit of the chip and the external package pins or circuit board. In the bonding process, metal wires such as gold wire, copper wire or aluminum wire are usually used as connecting wires. Under the action of ultrasonic vibration and pressure, these wires are tightly connected to the chip pads and the package pins or pads on the circuit board to form a strong mechanical connection and electrical connection. Among them, the detection of chip bonding circuits is an important part of the chip packaging and testing process, which aims to ensure that the electrical connection between the internal circuit of the chip and the external package pins or circuit board is correct, strong and defect-free. During the detection process, the inspector often takes a photo of the chip bonding circuit to be inspected, and then zooms in on the image of the chip bonding circuit to be inspected on the display screen to check the status of each metal wire. However, in the actual chip bonding circuit image viewing process, due to the small size and dense arrangement of each metal wire, multiple metal wires are often overlapped, so that the lower metal wires cannot be accurately distinguished or partially distinguished from the image taken by the upper camera device after being blocked, and it is difficult to distinguish the contour and connection status of the lower metal wires. If multiple detection images at different heights are taken to present the metal wires at different heights respectively, the metal wires at different heights will often be clear in one detection image and blurred in another detection image, making it impossible to combine these metal wires at different heights for clear comparative analysis, affecting the detection efficiency.

[0028] Therefore, this embodiment discloses a detection image viewing method for chip bonding circuit detection, as shown in the attached Figure 1 As shown, the following steps are included.

[0029] Step S1, obtaining a test picture set consisting of a plurality of test pictures taken at different shooting distances at the same test position of the tested chip bonding circuit.

[0030] Specifically, the shooting distance is the sum of the object distance and the focal length of the camera device, and is changed by adjusting the size of the object distance or the focal length respectively, or adjusting the size of the object distance or the focal length at the same time. In the process of adjusting the focal length or shooting height, the clarity of the metal wires in the multiple images captured at the same inspection point of the chip bonding circuit under test shows significant differences. For example, when there are multiple metal wires stacked up and down on the chip bonding circuit, the clarity of the metal wires near the imaging focus will be much greater than the metal wires near the remaining focal points. Finally, on the test image, the metal wires near the imaging focus will have clear outlines, while the outlines of the remaining metal wires superimposed thereon will be blurred and blurred. After switching to other focal lengths, when there is a metal wire near the corresponding focal position, the outline of the metal wire will appear relatively clear, while the outlines of the other metal wires superimposed on it will be blurred and blurred, so that the state of the metal wire can be observed and analyzed. Therefore, in the case where there are multiple metal wires overlapping each other, resulting in the metal wires at the bottom being blocked and unable to be effectively observed and analyzed, multiple inspection pictures taken at different focal lengths are adjusted so that the multiple metal wires stacked up and down can be clearly presented in different inspection pictures. By switching inspection pictures taken at the same position but with different focal lengths, the inspectors can clearly view the different metal wire shapes stacked up and down, reducing visual blockage and detection misjudgment caused by the overlap of different metal wires, and improving detection accuracy.

[0031] In this embodiment, the detection picture set includes multiple detection pictures obtained by photographing multiple metal wires arranged in an overlapping manner using different focal lengths and the same height, or by photographing multiple metal wires at different fixed focal lengths at different heights, wherein the detection picture set includes detection pictures in which the contours of different metal wires can be clearly seen. The step S1 also includes: for a bonding circuit of a chip under test with multiple metal wires arranged in an overlapping manner, photographing the bonding circuit of the chip under test multiple times using different focal lengths and the same height, or by photographing the bonding circuit of the chip under test at the same position, and obtaining multiple detection pictures of the bonding circuit of the chip under test to form a corresponding detection picture set, wherein the detection picture set includes corresponding detection pictures in which the contours of different metal wires in the multiple metal wires arranged in an overlapping manner can be clearly seen.

[0032] In the inspection pictures taken at different focal lengths and at the same height, or at different heights with a fixed focal length, the clarity of the metal wire at different positions is different, as shown in the attached figure. Figure 2-4 As shown in the figure, the metal wires blocked by overlap are highlighted because the metal wires in front are blurred, making them difficult to be ignored. The cross-arranged metal wires have clear outlines because the surrounding metal wires are blurred, making them easy to locate. The inspectors can identify and confirm the different metal wires in the inspection area by observing each inspection picture.

[0033] Step S2, in response to the area selection action, a corresponding image transformation area is selected on the first detection image displayed on the current image interface.

[0034] Specifically, a region near the bonded line being tested is framed. In this embodiment, the region frame selection action is associated with the fault detection device. When a fault is detected, the fault detection device automatically locks the fault region of the bonded line, and automatically frames and marks the fault region on the first detection image on the screen. The framed region is used to limit the image transformation range. Within the defined framed region, the image content is switched according to the acquired detection images, and the image content outside the framed region is kept unchanged to ensure that the transformed image content is the area around the problematic bonded line, focusing the attention of the detection personnel, avoiding interference from unnecessary environments, and improving detection efficiency and accuracy.

[0035] In another embodiment, the area selection action can also be configured as a user sending a selection instruction. The user selects the first detection image on the screen with a mouse to select the selected area, thereby increasing detection flexibility.

[0036] In this embodiment, the step S2 further includes: obtaining the interface coordinate position of the image transformation area selected by the area selection action on the current image interface, and generating the relative area coordinates of the image transformation area on the first detection image according to the interface coordinate position and the position of the first detection image displayed on the current image interface. Through coordinate conversion, the relative position of the selected area in each detection image is locked to ensure that the position of the image transformed in the selected area is the same in each image to be tested, so that the content displayed in the selected area in the image display interface is the same area of ​​the fault bonding line, and it is ensured that there is no offset in the connection between the switching image in the selected area and the surrounding non-selected area.

[0037] Step S3, according to the image switching instruction, switches the first image of the first detection picture in the image transformation area to a replacement image, and keeps the image of the first detection picture outside the image transformation area displayed on the current interface unchanged, and the replacement image is the image of other detection pictures in the detection picture set to which the first detection picture belongs at the position of the corresponding image transformation area.

[0038] Specifically, by switching images within a fixed frame selection area, the states of the metal wires presented in different images are observed and compared with images outside the frame selection area.

[0039] In this embodiment, as shown in the attached Figure 5 As shown, step S3 includes the following contents.

[0040] Step S31, after receiving the image switching instruction, obtain the corresponding detection picture set and picture queue order according to the first detection picture displayed on the current interface.

[0041] Step S32, after simultaneously receiving the keyboard CTL or ALT or Shift key action and the mouse wheel scrolling action, the replacement image of the corresponding detection image area is called according to the image queue sequence, and presented in the image transformation area displayed in the current image interface, and the image of the first detection image displayed on the current interface outside the image transformation area is kept unchanged.

[0042] Specifically, by pressing the CTL or ALT or Shift key or other pre-set keys on the keyboard to enter the image switching mode, and switching between images by using the mouse wheel at the same time, the user experience and browsing speed of the inspector are improved. Among them, the detection image retrieval can select different implementation methods according to different image storage and display forms. In this embodiment, each detection image in the detection image set is superimposed and arranged in the form of layers in the order of the image queue, and the step S32 also includes the following content.

[0043] Step S321, the detection images in the detection image set to which the first detection image belongs are sequentially stacked and arranged in the current image interface in the order of the image queue to form a detection image layer, and the coordinates of the points with the same layer coordinates in each detection image layer are the same in the current interface.

[0044] Step S322, after receiving the scrolling action of the mouse wheel, obtain the scrolling direction and scrolling amplitude of the mouse wheel, if the scrolling amplitude is greater than a threshold, implement the type of event corresponding to the scrolling direction of the mouse wheel, the event includes a hiding event and a showing event.

[0045] Step S323, if the type of event corresponding to the mouse wheel scrolling direction is a hidden event, the image in the image transformation area displayed in the current image interface is made transparent so that the replacement image in the next layer detection picture is displayed in the image transformation area displayed in the current image interface.

[0046] Step S334: if the event type corresponding to the scrolling direction of the mouse wheel is a display event, then the replacement image in the previous layer detection picture of the image displayed in the image transformation area displayed in the current image interface is materialized.

[0047] In another embodiment, each detection image in the detection image set is stored in a memory and retrieved according to a mouse operation, and the step S32 further includes the following content.

[0048] Step S101, obtaining the scrolling direction and scrolling amplitude of the mouse wheel, and if the scrolling amplitude is greater than a threshold, implementing an event of the type corresponding to the scrolling direction of the mouse wheel, wherein the event includes a first call event and a second call event.

[0049] Step S102, if the type of event corresponding to the mouse wheel scrolling direction is the first call event, then according to the relative area coordinates of the image transformation area on the first detection image, obtain the replacement image in the next detection image and present it in the image transformation area displayed in the current image interface.

[0050] Step S103, if the type of event corresponding to the mouse wheel scrolling direction is a second call event, then according to the relative area coordinates of the image transformation area on the first detection image, obtain the replacement image in the previous detection image and present it in the image transformation area displayed in the current image interface.

[0051] The invention discloses a detection image viewing method for chip bonding circuit detection. By shooting a plurality of images of a tested chip bonding circuit at different shooting distances at the same inspection position, each metal wire in the tested chip bonding circuit can be clearly displayed in different images. By adding a frame to a base image, a corresponding image transformation area is selected on a first detection image displayed on a current image interface in response to an area frame selection action. According to an image switching instruction, the first image of the first detection image in the image transformation area is switched to a replacement image. Meanwhile, the image of the first detection image displayed on the current interface outside the image transformation area is kept unchanged. The detection personnel can identify and obtain the status of the tested metal wire by observing the different images switched in the frame selection area, so as to timely determine the fault location and cause, improve the detection efficiency, and reduce the detection error rate.

[0052] In another embodiment, the present invention also discloses a detection image viewing system for chip bonding circuit detection, as shown in the attached Figure 6 As shown, there are an image acquisition module 1, an area selection module 2 and an image replacement module 3. The image acquisition module 1 obtains a detection image set consisting of multiple detection images taken at different shooting distances at the same inspection position of the bonding circuit of the chip under test. The area selection module 2 is used to select a corresponding image transformation area on the first detection image displayed on the current image interface in response to the area selection action. The image replacement module 3 is used to switch the first image of the first detection image in the image transformation area to a replacement image according to the image switching instruction, and keep the image of the first detection image displayed on the current interface outside the image transformation area unchanged, and the replacement image is the image of other detection images in the detection image set to which the first detection image belongs at the location of the corresponding image transformation area.

[0053] In this embodiment, the detection picture set includes multiple detection pictures obtained by shooting multiple metal wires arranged overlapping each other at the same height using different focal lengths, or shooting at different heights using a fixed focal length, wherein the detection picture set includes detection pictures in which the contours of different metal wires can be clearly seen.

[0054] In this embodiment, the image acquisition module also includes: for a bonding circuit of a chip under test having multiple metal wires arranged overlappingly above and below, taking multiple photos of the bonding circuit of the chip under test at the same position using different focal lengths and the same height, or using fixed focal lengths and different heights, and obtaining multiple detection images of the bonding circuit of the chip under test to form a corresponding detection image set, wherein the detection image set includes corresponding detection images that can clearly see different metal wires in the multiple overlapping metal wires.

[0055] In this embodiment, the image replacement module also includes: after receiving an image switching instruction, obtaining a corresponding detection picture set and picture queue order according to the first detection picture displayed on the current interface; after simultaneously receiving the keyboard CTL or ALT or Shift key action and the mouse wheel scrolling action, calling up the replacement image of the corresponding detection picture area according to the picture queue order, and presenting it in the image transformation area displayed in the current image interface, and keeping the image of the first detection picture displayed on the current interface outside the image transformation area unchanged.

[0056] In this embodiment, the area selection module also includes: obtaining the interface coordinate position of the image transformation area selected by the area selection action on the current image interface, and generating the relative area coordinates of the image transformation area on the first detection image based on the interface coordinate position and the position of the first detection image displayed on the current image interface.

[0057] The specific functions of the detection image viewing system for chip bonding circuit detection described above correspond to the detection image viewing method for chip bonding circuit detection disclosed in the previous embodiment, so it will not be described in detail here. For details, please refer to the detection image viewing method for chip bonding circuit detection disclosed in the previous embodiment. It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referred to each other.

[0058] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

[0059] In conclusion, the above is only a preferred embodiment of the present invention, and all equivalent changes and modifications made according to the scope of the patent application of the present invention should fall within the scope of the patent of the present invention.

Claims

1. A detection image viewing method for chip bonding circuit detection, characterized in that: include: Obtain a test picture set consisting of multiple test pictures taken at different shooting distances at the same test position of the tested chip bonding circuit; In response to the area selection action, a corresponding image transformation area is selected on the first detection image displayed on the current image interface; According to the image switching instruction, the first image of the first detection picture in the image transformation area is switched to the replacement image, and the image of the first detection picture outside the image transformation area displayed on the current interface is kept unchanged, and the replacement image is the image of other detection pictures in the detection picture set to which the first detection picture belongs at the position of the corresponding image transformation area.

2. The detection image viewing method for chip bonding circuit detection according to claim 1, characterized in that: The detection picture set includes multiple detection pictures obtained by shooting multiple metal wires arranged overlapping each other at the same height using different focal lengths, or shooting at different heights with a fixed focal length, wherein the detection picture set includes detection pictures in which the contours of different metal wires can be clearly seen.

3. The detection image viewing method for chip bonding circuit detection according to claim 2, characterized in that: The test picture set consisting of multiple test pictures taken at different shooting distances at the same test position of the tested chip bonding circuit includes: For a chip bonding circuit under test having multiple metal wires arranged overlappingly above and below, photograph the chip bonding circuit under test multiple times at the same position using different focal lengths and the same height, or using fixed focal lengths and different heights, to obtain multiple inspection pictures of the chip bonding circuit under test to form a corresponding inspection picture set, wherein the inspection picture set includes corresponding inspection pictures in which different metal wires among the multiple overlapping metal wires can be clearly seen.

4. The detection image viewing method for chip bonding circuit detection according to claim 1, characterized in that: The step of switching the first image of the first detection picture in the image transformation area to the replacement image according to the image switching instruction and keeping the image of the first detection picture displayed on the current interface outside the image transformation area unchanged includes: After receiving the image switching instruction, the corresponding detection picture set and picture queue sequence are obtained according to the first detection picture displayed on the current interface; After receiving the keyboard CTL, ALT or Shift key action and the mouse wheel scrolling action at the same time, the replacement image of the corresponding detection image area is called according to the image queue order, and presented in the image transformation area displayed in the current image interface, and the image of the first detection image displayed on the current interface outside the image transformation area is kept unchanged.

5. The detection image viewing method for chip bonding circuit detection according to claim 4, characterized in that: The response area frame selection action selects a corresponding image transformation area on the first detection image displayed on the current image interface, and further includes: The interface coordinate position of the image transformation area selected by the area selection action on the current image interface is obtained, and the relative area coordinates of the image transformation area on the first detection image are generated according to the interface coordinate position and the position of the first detection image displayed on the current image interface.

6. A detection image viewing system for chip bonding circuit detection, characterized in that: include: An image acquisition module acquires a detection image set consisting of multiple detection images taken at different camera distances at the same inspection position of the bonding circuit of the chip under test; A region selection module, used for selecting a corresponding image transformation region on the first detection image displayed on the current image interface in response to the region selection action; An image replacement module is used to switch the first image of the first detection picture in the image transformation area to a replacement image according to an image switching instruction, and keep the image of the first detection picture outside the image transformation area displayed on the current interface unchanged, and the replacement image is the image of other detection pictures in the detection picture set to which the first detection picture belongs at the location of the corresponding image transformation area.

7. The detection image viewing system for chip bonding circuit detection according to claim 6, characterized in that: The detection picture set includes multiple detection pictures obtained by shooting multiple metal wires arranged overlapping each other at the same height with different focal lengths, or shooting at different heights with fixed focal lengths, wherein the detection picture set includes detection pictures in which the contours of different metal wires can be clearly seen.

8. The detection image viewing system for chip bonding circuit detection according to claim 7, characterized in that: The image acquisition module also includes: for a bonding circuit of a chip under test having multiple metal wires arranged overlappingly above and below, taking multiple photos of the bonding circuit of the chip under test at the same position using different focal lengths and the same height, or using fixed focal lengths and different heights, and obtaining multiple detection photos of the bonding circuit of the chip under test to form a corresponding detection photo set, wherein the detection photo set contains corresponding detection photos that can clearly see different metal wires in the multiple overlapping metal wires.

9. The detection image viewing system for chip bonding circuit detection according to claim 8, characterized in that: The image replacement module also includes: After receiving the image switching instruction, the corresponding detection picture set and picture queue sequence are obtained according to the first detection picture displayed on the current interface; After receiving the keyboard CTL, ALT or Shift key action and the mouse wheel scrolling action at the same time, the replacement image of the corresponding detection image area is called according to the image queue order, and presented in the image transformation area displayed in the current image interface, and the image of the first detection image displayed on the current interface outside the image transformation area is kept unchanged.

10. The detection image viewing system for chip bonding circuit detection according to claim 9, characterized in that: The area selection module also includes: The interface coordinate position of the image transformation area selected by the area selection action on the current image interface is obtained, and the relative area coordinates of the image transformation area on the first detection image are generated according to the interface coordinate position and the position of the first detection image displayed on the current image interface.

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