Microearthquake monitoring system and display device

Abstract

The invention provides a micro-earthquake monitoring system and a display device, and the system comprises a monitoring point confirmation module, a waveform signal collection module, a speed intelligent calculation module, a time intelligent timing module, a waveform processing module, a waveform feature extraction module, an earthquake source determination module, and an earthquake magnitude determination module. Through mutual cooperation of the modules, accurate determination of the earthquake magnitude and the earthquake source position can be realized. According to the scheme, the technical problem that the position of the seismic source cannot be accurately determined due to the fact that noise exists in seismic data in the prior art is solved, and the technical effect of efficiently and accurately determining the magnitude and the position of the seismic source is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of oil and gas exploration monitoring, and in particular to a microseismic monitoring system and a display device. Background Art

[0002] Due to the physical properties of low porosity and low permeability of unconventional oil and gas reservoirs, it is difficult to effectively exploit unconventional oil and gas resources. When exploiting unconventional oil and gas resources, the oil and gas production capacity is generally increased through hydraulic fracturing of tight reservoirs. During hydraulic fracturing, the rock mass will crack and vibrate. In order to achieve oil and gas exploitation, it is necessary to determine the location of the crack point and vibration.

[0003] However, there are noise interference signals in the seismic waveform data, which makes it impossible to accurately determine the location where the rupture point vibration occurs.

[0004] As to how to accurately locate the location where the vibration of the rupture point occurs, no effective solution has been proposed so far. Summary of the invention

[0005] The purpose of the present application is to provide a microseismic monitoring system and a display device, which can remove interference signals in the collected seismic waveforms and perform feature analysis, so as to accurately find the location where the rupture point vibration occurs.

[0006] This specification provides a microseismic monitoring system and a display device which are implemented as follows:

[0007] A microseismic monitoring system, comprising:

[0008] A monitoring point confirmation module is used to confirm the microseismic monitoring point as the target microseismic monitoring point;

[0009] A waveform signal acquisition module, connected to the monitoring point confirmation module, for acquiring waveform data of seismic waves of a target microseismic monitoring point as source waveform data;

[0010] A velocity intelligent calculation module, connected to the waveform signal acquisition module, for calculating the propagation velocity of the seismic wave corresponding to the source waveform data;

[0011] A time intelligent timing module, connected to the waveform signal acquisition module, for determining the time taken to acquire the seismic wave corresponding to the source waveform data;

[0012] A waveform processing module is connected to the waveform signal acquisition module through the waveform transmission module, and is used to pre-process the source waveform data to obtain target waveform data, wherein the pre-processing includes at least one of the following: removing noise, removing interference signals, and removing ground effects;

[0013] A waveform feature extraction module, connected to the waveform processing module, for extracting feature data of the target waveform data;

[0014] A source determination module, connected to the speed intelligent calculation module, the time intelligent timing module and the waveform feature extraction module, for determining the source position of the micro-earthquake according to the propagation speed of the seismic wave corresponding to the source waveform data, the time consumed to collect the seismic wave corresponding to the source waveform data, and the feature data of the target waveform data;

[0015] The magnitude determination module is connected to the waveform feature extraction module and is used to determine the magnitude of the micro-earthquake based on the feature data of the target waveform data.

[0016] In one embodiment, the microseismic monitoring system further includes:

[0017] A three-dimensional model making module is used to obtain the topographic features of the target microseismic monitoring point and to establish a three-dimensional model of the monitoring point according to the topographic features of the target microseismic monitoring point;

[0018] The intelligent marking module is connected to the three-dimensional model making module and the earthquake source determination module, and is used to mark the earthquake source position of the micro-earthquake in the three-dimensional model.

[0019] In one embodiment, the microseismic monitoring system further includes:

[0020] The display module is connected to the magnitude determination module and the three-dimensional model making module, and is used to display the magnitude of the micro-earthquake and the three-dimensional model marked with the source position of the micro-earthquake.

[0021] In one embodiment, the waveform signal acquisition module includes: an S wave acquisition unit and a P wave acquisition unit, wherein:

[0022] The S-wave acquisition unit is used to acquire the seismic S-wave propagating longitudinally at the target microseismic monitoring point;

[0023] The P wave acquisition unit is used to collect seismic P waves that propagate laterally at the target microseismic monitoring point;

[0024] The source waveform data includes: seismic S waves propagating longitudinally and seismic P waves propagating laterally.

[0025] In one embodiment, the waveform processing module includes: a noise removal module, an interference signal removal module and a ground effect removal module, wherein:

[0026] The noise removal module is used to remove noise in source waveform data;

[0027] The interference signal removal module is used to remove interference signals in the source waveform data;

[0028] The ground effect removal module is used to remove the influence of refraction and reflection of seismic waves on source waveform data after reaching the ground.

[0029] In one embodiment, the waveform feature extraction module includes: a spectrum feature extraction module, a time course feature extraction module and a time feature extraction module, wherein:

[0030] The spectrum feature extraction module is used to extract energy distribution feature data of target waveform data at different frequencies;

[0031] The time-course feature extraction module is used to extract the arrival feature data, amplitude feature data and period parameter feature data of the target waveform data;

[0032] The time feature extraction module is used to extract the characteristic data of the change rules of the target waveform data within a preset time.

[0033] A display device for the above-mentioned microseismic monitoring system comprises: a protective shell, and a movable plate arranged inside the protective shell, wherein:

[0034] A through groove is formed on the top of the protective shell, and through grooves are formed on two symmetrical sides of the protective shell;

[0035] The upper part of the movable plate passes through the through slot at the top of the protective shell and is slidably connected to the through slot. The top of the movable plate is fixedly connected to a display screen, and the top of the display screen is fixedly connected to a cover plate.

[0036] A positioning rod is longitudinally fixedly connected inside the protective shell, and the positioning rod passes through the movable plate and is slidably connected with the movable plate.

[0037] In one embodiment, the display device further includes: a card slot and a fixing assembly arranged on the left and right sides of the movable plate, the fixing assembly including: a shell fixedly embedded in the side of the protective shell, and a first rotating shaft connected to the inside of the shell, wherein:

[0038] The first rotating shaft is connected to the housing via a bearing, and a rotating rod is provided on the outer fixed sleeve of the first rotating shaft;

[0039] A clamping block is fixedly connected to the first side of the rotating rod, and the clamping block passes through the through slot on the side of the protective shell and is embedded in the clamping slot on the side of the moving plate; a spring is connected to the second side of the rotating rod;

[0040] The first end of the spring is connected to the rotating rod through a movable hinge seat, and the second end of the spring is connected to the housing through a movable hinge seat;

[0041] The bottom of the rotating rod is fixedly connected to the first end of the rope, the second end of the rope passes through one side of the shell and is fixedly connected to the pull ring outside the shell, the rope is slidably connected to the shell, and the pull ring is in contact with the shell.

[0042] In one embodiment, a first magnet is fixedly connected to an inner wall of the bottom of the protective shell, a groove is formed at the bottom of the movable plate, and a second magnet is fixedly connected to the inside of the groove.

[0043] A method for controlling the above display device, comprising:

[0044] Pull the pull rings on the left and right sides of the moving plate to make the rotating rod rotate around the first rotating axis under the action of the rope, and move the clamping block on the first side of the rotating rod out of the clamping slot provided on the moving plate;

[0045] Press the cover plate to drive the movable plate and the display screen to move downward until the display screen is hidden in the protective shell to prevent the display screen from being exposed to the air all the time;

[0046] When the display screen is hidden in the protective shell, the first magnet is attracted to the second magnet to increase the stability of the display screen inside the protective shell.

[0047] The present application provides a microseismic monitoring system and display device, wherein the system includes: a monitoring point confirmation module, a waveform signal acquisition module, a speed intelligent calculation module, a time intelligent timing module, a waveform processing module, a waveform feature extraction module, a source determination module and a magnitude determination module. The magnitude and source position can be accurately determined through the cooperation between these modules. Furthermore, by providing a display device with a protective shell, a rotating part and a sliding part, the display of earthquake monitoring information can be realized, and the flexibility of the display can be improved. That is, the above scheme solves the existing technical problem that the source position cannot be accurately determined due to the noise in the seismic data, and achieves the technical effect of efficiently and accurately determining the magnitude and source position. Based on the determined magnitude and source position, the geological structure of the oil and gas field can be more clearly understood, which is conducive to the later exploration and exploitation of oil and gas. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the embodiments of this specification, the drawings required for use in the embodiments will be briefly introduced below. The drawings described below are only some embodiments recorded in this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0049] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0050] Figure 1 A system schematic diagram of an embodiment of a microseismic monitoring system provided by the present application;

[0051] Figure 2 A schematic diagram of a module of an embodiment of waveform signal acquisition of a microseismic monitoring system provided by the present application;

[0052] Figure 3 A schematic diagram of a module of an embodiment of a waveform feature extraction module of a microseismic monitoring system provided in the present application;

[0053] Figure 4 A schematic diagram of a module of an embodiment of a waveform processing module of a microseismic monitoring system provided by the present application;

[0054] Figure 5 A schematic diagram of the structure of the display device of the microseismic monitoring system provided in this application;

[0055] Figure 6 This is an enlarged view of point A in the structural schematic diagram of the display device of the microseismic monitoring system provided in the present application. DETAILED DESCRIPTION

[0056] In order to enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this specification.

[0057] In view of the problem that the location of the rupture point vibration cannot be accurately found due to the presence of interference signals in the existing seismic waveform data, a microseismic monitoring system is provided in an embodiment of the present application. Specifically, Figure 1As shown, the system may include: a monitoring point confirmation module 1, a waveform signal acquisition module 2, a waveform transmission module 3, a waveform processing module 4, a waveform feature extraction module 5, a speed intelligent calculation module 6, a time intelligent timing module 7, a source confirmation module 8, and a magnitude confirmation module 9, wherein: the monitoring point confirmation module 1 is used to confirm the microseismic monitoring point as the target microseismic monitoring point; the waveform signal acquisition module 2 is connected to the monitoring point confirmation module 1 and is used to collect the waveform data of the seismic wave of the target microseismic monitoring point as the source waveform data; the speed intelligent calculation module 6 is connected to the waveform signal acquisition module 2 and is used to calculate the propagation speed of the seismic wave corresponding to the source waveform data; the time intelligent timing module 7 is connected to the waveform signal acquisition module 2 and is used to determine the time consumed to collect the seismic wave corresponding to the source waveform data; the waveform processing module 4 ... The waveform transmission module 3 is connected to the waveform signal acquisition module 2, and is used to pre-process the source waveform data to obtain the target waveform data, wherein the pre-processing includes at least one of the following: removing noise, removing interference signals, and removing ground effects; the waveform feature extraction module 5 is connected to the waveform processing module 4, and is used to extract the feature data of the target waveform data; the source determination module 8 is connected to the speed intelligent calculation module 6, the time intelligent timing module 7 and the waveform feature extraction module 5, and is used to determine the source position of the micro-earthquake according to the propagation speed of the seismic wave corresponding to the source waveform data, the time consumed to collect the seismic wave corresponding to the source waveform data, and the feature data of the target waveform data; the magnitude determination module 9 is connected to the waveform feature extraction module 5, and is used to determine the magnitude of the micro-earthquake according to the feature data of the target waveform data.

[0058] Furthermore, in order to display the epicenter location and magnitude of the microseismic, the microseismic monitoring system also includes: a three-dimensional model making module 10, an intelligent marking module 11 and a display module 12, wherein the three-dimensional model making module 10 is used to obtain the terrain characteristics of the target microseismic monitoring point, and establish a three-dimensional model of the monitoring point according to the terrain characteristics of the target microseismic monitoring point; the intelligent marking module 11 is connected to the three-dimensional model making module 10 and the epicenter determination module 8, and is used to calibrate the epicenter location of the microseismic in the three-dimensional model; the display module 12 is connected to the magnitude determination module 9 and the three-dimensional model making module 10, and is used to display the magnitude of the microseismic and the three-dimensional model calibrated with the epicenter location of the microseismic.

[0059] Specifically, the above-mentioned source determination module can determine the epicenter azimuth and epicenter distance of the microearthquake based on the propagation speed of the seismic waves corresponding to the source waveform data, the time consumed to collect the seismic waves corresponding to the source waveform data, and the characteristic data of the target waveform data, and determine the source position of the microearthquake based on the epicenter azimuth and epicenter distance of the microearthquake.

[0060] Seismic waves include two types of seismic waves: S waves that propagate longitudinally and P waves that propagate laterally. Since the vibration direction of the particles of the P wave coincides with the wave ray, the initial motion direction of the P wave can indicate the azimuth of the earthquake source. Specifically, the initial motion direction of the P wave in the two horizontal directions can determine the position of the seismic wave ray, and the initial motion of the P wave in the vertical direction can determine the direction of the seismic wave ray. When the initial motion of the P wave in the vertical direction is upward, the initial motion direction of the P wave particle vibration is opposite to the direction of the earthquake source. When the initial motion of the P wave in the vertical direction is downward, the initial motion direction of the P wave particle vibration is the same as the direction of the earthquake source. At the same time, since the sum vector of the initial motion of the P wave in the two horizontal directions is the projection of the ground displacement on the ground, the epicenter azimuth of the seismic wave can be determined based on the sum vector of the initial motion of the P wave in the two horizontal directions.

[0061] Specifically, according to the microseismic source azimuth and epicenter distance of the microseismic source, determining the microseismic source position may include the following steps:

[0062] S1: Determine the initial moving direction of the P wave according to the data collected by the waveform signal acquisition module;

[0063] S2: Determine the source direction of the microearthquake based on the initial motion direction of the P wave;

[0064] S3: determining the initial amplitude of the P wave in two horizontal directions according to the waveform feature extraction module;

[0065] S4: Determine the epicenter azimuth of the microearthquake based on the source direction and the initial motion amplitude of the P wave in two horizontal directions;

[0066] S5: extracting the arrival times of the P wave and the S wave through a waveform feature extraction module, and determining the arrival time difference between the P wave and the S wave;

[0067] S6: Determine the epicenter distance of the microearthquake according to the time consumed by the time intelligent timing module to collect the seismic wave corresponding to the target waveform data, the arrival time difference between the P wave and the S wave, and the propagation speed of the seismic wave corresponding to the target waveform data calculated by the speed intelligent calculation module;

[0068] S7: The degree of the epicenter azimuth is taken as the target angle, and the epicenter distance is taken as the target distance;

[0069] S8: Take the target monitoring point as the origin and rotate clockwise. The rotation degree is the target angle to determine the source trajectory.

[0070] S9: Taking the target monitoring point as the starting point, take the length of the target distance along the source trajectory to determine the source location.

[0071] The magnitude determination module may determine the magnitude of the micro-earthquake according to the characteristic data of the target waveform data, and specifically, may include the following steps:

[0072] S1: Determine the energy distribution of target waveform data according to the waveform feature extraction module;

[0073] S2: According to the energy distribution, the magnitude of the micro-earthquake is calculated according to the following formula:

[0074] E=10 4.8 ×10 1.5M

[0075] Where E is the energy of the target data waveform, and M is the magnitude of the microearthquake.

[0076] The above-listed method for determining the source location and magnitude is merely an exemplary description and does not constitute an improper limitation on the present application. In actual implementation, a suitable method can be selected according to actual needs, and the present application does not impose any limitation on this.

[0077] Furthermore, the waveform signal acquisition module can be used to acquire two types of seismic waves, namely longitudinal seismic waves and transverse seismic waves. Figure 2 As shown, the waveform signal acquisition module 2 may include: an S-wave acquisition unit 13 and a P-wave acquisition unit 14, wherein: the S-wave acquisition unit 13 is used to acquire the seismic S-waves propagating longitudinally of the target microseismic monitoring point; the P-wave acquisition unit 14 is used to acquire the seismic P-waves propagating laterally of the target microseismic monitoring point; wherein the source waveform data may include: seismic S-waves propagating longitudinally and seismic P-waves propagating laterally.

[0078] Furthermore, the waveform feature extraction module can be used to extract the spectrum features, time course features and time features of the target waveform data. Specifically, Figure 3 As shown, the waveform feature extraction module 5 may include: a spectrum feature extraction module 18, a time-course feature extraction module 19 and a time feature extraction module 20, wherein: the spectrum feature extraction module 18 is used to extract the energy distribution feature data of the target waveform data at different frequencies; the time-course feature extraction module 19 is used to extract the arrival feature data, amplitude feature data and period parameter feature data of the target waveform data; the time feature extraction module 20 is used to extract the change law feature data of the target waveform data within a preset time.

[0079] Furthermore, in order to improve the accuracy of the microseismic monitoring system in determining the source location and magnitude of microseisms, it is necessary to preprocess the source waveform data to remove interference signals. The preprocessing is implemented by the waveform processing module 4. Specifically, Figure 4 As shown, the waveform processing module 4 may include: a noise removal module 15, an interference signal removal module 16 and a ground effect removal module 17, wherein: the noise removal module 15 is used to remove noise in the source waveform data; the interference signal removal module 16 is used to remove interference signals in the source waveform data; the ground effect removal module 17 is used to remove the influence of refraction and reflection of seismic waves after reaching the ground on the source waveform data.

[0080] Specifically, the above-mentioned three-dimensional model making module can express and present the terrain features of the target microseismic monitoring point in a digital way. The basic principle of the three-dimensional model making module to establish a three-dimensional model based on the terrain features of the target microseismic monitoring point is to use geographic data and mathematical models to describe the geometric features and geomorphic features of the terrain of the target microseismic monitoring point, where the geographic data can include: digital elevation model, geological geophysical data, satellite remote sensing images, and the mathematical model can include: surface fitting, interpolation algorithm, cluster analysis.

[0081] In practical applications, the establishment of a three-dimensional model of a target microseismic monitoring point can be achieved through three methods: modeling based on physical models, modeling based on statistical models, and modeling based on image interpretation. Among them, the modeling method based on physical models uses physical principles to simulate the generation and evolution process of terrain. The modeling method based on statistical models is to infer the morphology and distribution of terrain by analyzing the statistical relationship between geographic data. The modeling method based on image interpretation is to extract terrain features and establish a three-dimensional terrain model by interpreting remote sensing images.

[0082] However, it is worth noting that the geographic data, mathematical models and three-dimensional model establishment methods listed above are only exemplary descriptions and do not constitute improper limitations on the present application. In actual implementation, appropriate geographic data, mathematical models and establishment methods can be selected according to site conditions and actual needs to establish a three-dimensional model of the terrain of the target microseismic monitoring point. The present application does not impose any limitations on this.

[0083] Specifically, the above-mentioned display module can display the magnitude of the microseismic event and the three-dimensional model with the calibrated epicenter position of the microseismic event on the display screen in an intuitive and realistic manner. The method of displaying the three-dimensional model of the target microseismic monitoring point through the display module may include: stereoscopic display, rendering technology, and shadow effect. Among them, the stereoscopic display refers to adding a depth of field effect to the three-dimensional model of the terrain of the target microseismic monitoring point through a stereoscopic display device or a layered drawing technology. The rendering technology refers to presenting the real effect of the three-dimensional model of the terrain of the target microseismic monitoring point through the processing of attributes such as light and color. The shadow effect is the shadow effect of the terrain generated by using light and material attributes.

[0084] like Figure 5 As shown, an embodiment of the present application also provides a display device for the above-mentioned microseismic monitoring system, including: a protective shell 21, and a movable plate 22 arranged inside the protective shell, wherein: a through groove is opened on the top of the protective shell 21, and through grooves are opened on symmetrical sides of the protective shell 21; the upper half of the movable plate 22 passes through the through groove on the top of the protective shell 21 and is slidably connected to the through groove, a display screen 23 is fixedly connected to the top of the movable plate 22, and a cover plate 24 is fixedly connected to the top of the display screen 23; a positioning rod 25 is longitudinally fixedly connected to the inside of the protective shell 22, the positioning rod 25 passes through the movable plate 22, and is slidably connected to the movable plate 22, and a card slot and a fixing component are provided on both sides of the movable plate 22.

[0085] By controlling the above fixing components, the display screen 23 can be hidden inside the protective shell 21 to avoid the display screen 23 being exposed to the air all the time, which would shorten the service life of the display screen 23. Specifically, Figure 6As shown, the fixing assembly includes two shells 26, and the two shells 26 are fixedly embedded in the left and right sides of the protective shell 21 respectively. Since the structures of the two shells 26 are the same, the structure of the protective shell 21 is described in detail by taking the shell 26 on the left side of the protective shell 21 as an example. Specifically, the fixing assembly includes: a shell 26 fixedly embedded in the side of the protective shell, and a first rotating shaft 27 connected to the inside of the shell, wherein: the first rotating shaft 27 is connected to the shell 26 through a bearing, and a rotating rod 28 is fixedly sleeved on the outside of the first rotating shaft 27; a block 29 is fixedly connected to the first side of the rotating rod 28, The block 29 passes through the through groove on the side of the protective shell 21 and is embedded in the groove on the side of the movable plate 22; the second side of the rotating rod 28 is connected to a spring 30; the first end of the spring 30 is connected to the rotating rod 28 through a movable hinge seat, and the second end of the spring 30 is connected to the shell 26 through a movable hinge seat; the bottom of the rotating rod 28 is fixedly connected to the first end of the rope 31, the second end of the rope 31 passes through one side of the shell 26, and is fixedly connected to the pull ring 32 outside the shell 26, the rope 31 is slidably connected to the shell 26, and the pull ring 32 is in contact with the shell 26.

[0086] When the display screen 23 is hidden inside the protective shell 21, in order to enhance the stability of the display screen 23 inside the protective shell 21, a first magnet 33 is fixedly connected to the inner wall of the bottom of the shell, a groove is provided at the bottom of the movable plate, and a second magnet 34 is fixedly connected inside the groove.

[0087] The embodiment of the present application also provides a method for controlling the above display device, including:

[0088] Pull the pull rings 32 on the left and right sides of the movable plate 22 to make the rotating rod 28 rotate around the first rotating shaft 27 as the rotating axis under the action of the rope 31, and move the block 29 on the first side of the rotating rod 28 out of the card slot set on the movable plate 22; press the cover plate 24 to drive the movable plate 22 and the display screen 23 to move downward until the display screen 23 is hidden in the protective shell 21 to avoid the display screen 23 being exposed to the air all the time; when the display screen 23 is hidden in the protective shell 21, the first magnet 33 and the second magnet 34 are attracted to increase the stability of the display screen 23 inside the protective shell 21.

[0089] The above-mentioned microseismic monitoring and analysis system based on data analysis is described in detail below in conjunction with a specific embodiment. However, it should be noted that this specific embodiment is only for better illustrating the present invention and does not constitute an improper limitation to the present invention.

[0090] In this example, considering that the existing microseismic monitoring and analysis system cannot remove interference from seismic waveform data and thus cannot accurately confirm the location of the rupture point vibration, a microseismic monitoring system is proposed. By designing a waveform processing module to process the seismic waveform data and a waveform feature extraction module to extract the features of the seismic waveform data, the evolution law of seismic waves in the propagation process can be understood, the location of the earthquake source and the magnitude of the earthquake can be accurately confirmed, and the geological structure of the oil and gas field can be obtained by understanding the evolution law of seismic waves in the propagation process, which is convenient for the later exploration and exploitation of oil and gas.

[0091] Specifically, in this example, a microseismic monitoring system is provided, which can be Figure 1 As shown, it includes: a monitoring point confirmation module 1, a waveform signal acquisition module 2, a waveform transmission module 3, a waveform processing module 4, a waveform feature extraction module 5, a speed intelligent calculation module 6, a time intelligent timing module 7, a source confirmation module 8, a magnitude confirmation module 9, a three-dimensional model making module 10, an intelligent marking module 11, and an intelligent display module 12 (corresponding to the above-mentioned display module), wherein,

[0092] Monitoring point confirmation module 1, used to confirm microseismic monitoring points;

[0093] The waveform signal acquisition module 2 is used to collect the waveform data of the seismic wave, and the waveform signal acquisition module 2 is connected to the output end of the monitoring point confirmation module 1;

[0094] The waveform transmission module 3 is used to transmit the waveform data collected by the waveform signal acquisition module 2, and the waveform transmission module 3 is connected to the output end of the waveform signal acquisition module 2;

[0095] The waveform processing module 4 is used to process the seismic waveform data. The waveform processing module 4 is connected to the output end of the waveform transmission module 3;

[0096] A waveform feature extraction module 5 is used to extract features of seismic waveform data. The waveform feature extraction module 5 is connected to the output end of the waveform processing module 4;

[0097] A velocity intelligent calculation module 6 is used to calculate the propagation velocity of seismic waves. The velocity intelligent calculation module 6 is connected to the output end of the waveform signal acquisition module 2;

[0098] A time intelligent timing module 7 is used to calculate the time consumed to collect seismic waves. The time intelligent timing module 7 is connected to the output end of the waveform signal collection module 2;

[0099] A source confirmation module 8 is used to confirm the source position of the micro-earthquake, and the source confirmation module 8 is connected to the output ends of the velocity intelligent calculation module 6, the time intelligent timing module 7 and the waveform feature extraction module 5;

[0100] A magnitude confirmation module 9 is used to confirm the magnitude of the micro-earthquake, and the magnitude confirmation module 9 is connected to the output end of the waveform feature extraction module 5;

[0101] A three-dimensional model making module 10 is used to convert the terrain features of the monitoring point into a three-dimensional model;

[0102] An intelligent marking module 11 is used to mark the location of the micro-earthquake source in the three-dimensional model after the location of the micro-earthquake source is confirmed. The intelligent marking module 11 is connected to the output end of the source confirmation module 8. The intelligent marking module 11 is connected to the input end of the three-dimensional model making module 10.

[0103] An intelligent display module 12, used to display the magnitude of the micro-earthquake and a three-dimensional model with a source location, the intelligent display module 12 is connected to the output end of the magnitude confirmation module 9 and the three-dimensional model making module 10;

[0104] Specifically, as mentioned above Figure 2 As shown, the waveform signal acquisition module 2 includes: an S wave acquisition module 13 (corresponding to the above-mentioned S wave acquisition unit) and a P wave acquisition module 14 (corresponding to the above-mentioned P wave acquisition unit), wherein:

[0105] The S wave acquisition module 13 is used to acquire the longitudinally propagating seismic S waves;

[0106] The P wave acquisition module 14 is used to acquire seismic P waves that propagate laterally.

[0107] Specifically, as mentioned above Figure 3 As shown, the waveform feature extraction module 5 includes: a spectrum feature extraction module 18, a time course feature extraction module 19 and a time feature extraction module 20, wherein:

[0108] The spectrum feature extraction module 18 is used to extract the energy distribution of seismic waves at different frequencies;

[0109] The time-course feature extraction module 19 is used to extract the arrival time, amplitude and period parameters of the seismic wave;

[0110] The time feature extraction module 20 is used to extract the changing rules of seismic waves within a certain period of time, so as to understand the evolution rules of seismic waves during the propagation process.

[0111] Specifically, as mentioned above Figure 4 As shown, the waveform processing module 4 includes: a noise removal module 15, an interference signal removal module 16 and a ground effect removal module 17, wherein:

[0112] The noise removal module 15 is used to remove noise in the waveform data;

[0113] The interference signal removal module 16 is used to remove interference signals in the waveform data;

[0114] The ground effect removal module 17 is used to remove the influence of refraction and reflection of the waveform after reaching the ground.

[0115] In this example, a display device is also provided. Specifically, as described above Figure 5 As shown, the display device includes: a shell 21 (corresponding to the above-mentioned protective shell), a through groove is opened on the top of the shell 21, a movable plate 22 is slidably provided inside the shell 21, the upper half of the movable plate 22 passes through the through groove and is slidably connected to the through groove, a display screen 23 is fixedly connected to the top of the movable plate 22, a cover plate 24 is fixedly connected to the top of the display screen 23, two positioning rods 25 are fixedly connected to the inside of the shell 21, the two positioning rods 25 both pass through the movable plate 22 and are slidably connected to it, and fixing components are provided on both sides of the movable plate 22.

[0116] Further, taking the fixing component on the left side of the movable plate as an example, the fixing component includes: a shell 26, the shell 26 is fixedly embedded in the left side of the outer shell 21, a card slot is opened on the left side of the movable plate 22, and a through slot is opened on the left side of the outer shell 21. The interior of the shell 26 is connected with a rotating shaft 27 through a bearing, and the external fixed sleeve of the rotating shaft 27 is provided with a rotating rod 28. The first side of the rotating rod 28 is fixedly connected with a card block 29, and the card block 29 passes through the through slot and is embedded in the card slot. The second side of the rotating rod 28 is connected with the first end of the spring 30, and the first end of the spring 30 is connected to the second side of the rotating rod 28 through a movable hinge seat, and the second end of the spring 30 is connected to the shell 26 through a movable hinge seat. The third side of the rotating rod 28 is fixedly connected with the first end of the rope 31, the rope 31 passes through the shell 26 and is slidably connected to the shell 26, and the second end of the rope 31 is fixedly connected with a pull ring 32 and the pull ring 32 contacts the shell 26.

[0117] Furthermore, in order to achieve the purpose of increasing stability, a magnet 1 33 is fixedly connected to the inner wall of the bottom of the shell 21 of the display device, a groove is opened at the bottom of the movable plate 22, and a magnet 2 34 is fixedly connected inside the groove. When the display screen 23 is hidden in the shell 21, the magnet 1 33 and the magnet 2 34 will be attracted together, thereby preventing the display screen 23 from moving up and down randomly inside the shell 21, and increasing the stability of the display screen 23 inside the shell 21.

[0118] In the above example, the waveform processing module is designed to process the seismic waveform data, and the waveform feature extraction module is used to extract the features of the seismic waveform data, so as to understand the evolution law of seismic waves during propagation, accurately confirm the location of the earthquake source and the magnitude of the earthquake, and obtain the geological structure of the oil and gas field by understanding the evolution law of seismic waves during propagation, which is convenient for the subsequent exploration and exploitation of oil and gas.

[0119] The use process of the above-mentioned microseismic monitoring system is described as follows with a specific example:

[0120] First, the microseismic monitoring point can be confirmed by the monitoring point confirmation module. After the monitoring point is confirmed, the waveform signal acquisition module is installed at the monitoring point to collect the waveform data of the seismic wave. When the waveform acquisition module is collecting waveform data, the S wave acquisition module can collect the longitudinally propagating seismic S wave, and the P wave acquisition module can collect the transversely propagating seismic P wave. While collecting waveform data, the propagation speed of the seismic wave is calculated by the speed intelligent calculation module, and the time consumed from the occurrence of the seismic wave to the collection of the seismic wave is calculated by the time intelligent timing module. Then the waveform transmission module transmits the waveform data collected by the waveform signal acquisition module to the waveform processing module. After receiving the waveform data, the waveform processing module processes the waveform data, including: removing noise in the waveform data by the noise removal module, removing interference signals in the waveform data by the interference signal removal module, and removing the waveform effect when arriving at the ground by the ground effect removal module. After the refraction and reflection of the surface, the characteristic data of the seismic waveform data is extracted and analyzed by the waveform feature extraction module, including: extracting the energy distribution of seismic waves at different frequencies by the spectrum feature extraction module, extracting the arrival time, amplitude and period parameters of seismic waves by the time feature extraction module, and extracting the change law of seismic waves within a certain period of time by the time feature extraction module, so as to understand the evolution law of seismic waves in the propagation process, and then the source confirmation module 8 confirms the location of the source according to the characteristic data of the extracted waveform data, the propagation speed of the seismic waves and the time spent on collecting the seismic waves, so as to find the location where the rupture point vibration occurs. Since the waveform processing module pre-processes the waveform data to remove noise, interference signals and ground effects, the accuracy of the location where the rupture point vibration occurs can be guaranteed. The magnitude confirmation module 9 determines the magnitude of the microearthquake according to the extracted waveform data.

[0121] The terrain features of the monitoring point can also be converted into a three-dimensional model through the three-dimensional model production module. Once the source location of the microearthquake is confirmed, the intelligent marking module can mark the location of the source in the three-dimensional model, and the intelligent display module can display the magnitude of the microearthquake and the three-dimensional model with the source location.

[0122] After the use of the smart display module, pull the pull rings on the left and right sides of the movable plate, and the rotating rod can be rotated with the rotating shaft 1 as the rotating shaft under the action of the rope, so that the card block can be moved out of the card slot, and then press the cover plate to move the movable plate, the display screen and the cover plate downward, so that the display screen can be hidden in the shell to avoid the display screen being exposed to the air all the time, thereby preventing dust from adhering to the display screen. When the display screen is hidden in the shell, the first magnet and the second magnet will be attracted together, which can prevent the display screen from moving up and down randomly inside the shell, thereby increasing stability.

[0123] From the above description, it can be seen that the example of the present application processes the seismic waveform data by designing a waveform processing module, wherein: the noise removal module is used to remove noise in the waveform data, the interference signal removal module is used to remove interference signals in the waveform data, and the ground effect removal module is used to remove the influence of refraction and reflection of the waveform after reaching the ground, so as to accurately find the location where the vibration of the rupture point occurs; a waveform feature extraction module is also designed to extract the characteristics of the seismic waveform data, the spectrum feature extraction module is used to extract the energy distribution of seismic waves at different frequencies, the time feature extraction module is used to extract the arrival time, amplitude and period parameters of the seismic waves, and the time feature extraction module is used to extract the change law of seismic waves within a certain period of time, so as to accurately confirm the location of the earthquake source and the magnitude of the earthquake, understand the geological structure of the oil and gas field, and facilitate the later exploration and exploitation of oil and gas.

[0124] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the hardware + program embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0125] The above is a description of a specific embodiment of the specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0126] Although the present application provides method operation steps as described in the embodiments or flowcharts, more or fewer operation steps may be included based on conventional or non-creative labor. The order of steps listed in the embodiments is only one way of executing the order of many steps and does not represent the only execution order. When the actual device or client product is executed, it can be executed in the order of the method shown in the embodiments or the drawings or in parallel (for example, in a parallel processor or multi-threaded processing environment).

[0127] Although the present specification embodiment provides the method operation steps as described in the embodiment or flow chart, more or less operation steps may be included based on conventional or non-creative means. The order of steps listed in the embodiment is only one way in the order of execution of many steps, and does not represent a unique execution order. When the device or terminal product in practice is executed, it can be executed in sequence or in parallel (such as a parallel processor or a multi-threaded processing environment, or even a distributed data processing environment) according to the method shown in the embodiment or the accompanying drawings. The term "include", "comprise" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, product or equipment including a series of elements not only includes those elements, but also includes other elements not clearly listed, or also includes elements inherent to such process, method, product or equipment. In the absence of more restrictions, it is not excluded that there are other identical or equivalent elements in the process, method, product or equipment including the elements.

[0128] For the convenience of description, the above devices are described in various modules according to their functions. Of course, when implementing the embodiments of this specification, the functions of each module can be implemented in the same or more software and / or hardware, or the module implementing the same function can be implemented by a combination of multiple sub-modules or sub-units. The device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0129] Those skilled in the art also know that, in addition to implementing the controller in a purely computer-readable program code, the controller can be made to implement the same function in the form of logic gates, switches, application-specific integrated circuits, programmable logic controllers, and embedded microcontrollers by logically programming the method steps. Therefore, such a controller can be considered as a hardware component, and the devices for implementing various functions included therein can also be considered as structures within the hardware component. Or even, the devices for implementing various functions can be considered as both software modules for implementing the method and structures within the hardware component.

[0130] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0131] Those skilled in the art will appreciate that the embodiments of this specification may be provided as methods, systems or computer program products. Therefore, the embodiments of this specification may take the form of complete hardware embodiments, complete software embodiments or embodiments combining software and hardware. Moreover, the embodiments of this specification may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0132] The present specification embodiments may be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. The present specification embodiments may also be practiced in distributed computing environments where tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules may be located in local and remote computer storage media, including storage devices.

[0133] Each embodiment in this specification is described in a progressive manner, and the same and similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment. In the description of this specification, the description of the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of this specification. In this specification, the schematic representation of the above terms does not necessarily target the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, in the absence of contradiction, a person skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0134] The above is only an example of the embodiment of the present specification and is not intended to limit the embodiment of the present specification. For those skilled in the art, the embodiment of the present specification may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the embodiment of the present specification shall be included in the scope of the claims of the embodiment of the present specification.

Claims

1. A microseismic monitoring system, characterized in that: include: A monitoring point confirmation module is used to confirm the microseismic monitoring point as the target microseismic monitoring point; A waveform signal acquisition module, connected to the monitoring point confirmation module, for acquiring waveform data of seismic waves of a target microseismic monitoring point as source waveform data; A velocity intelligent calculation module, connected to the waveform signal acquisition module, for calculating the propagation velocity of the seismic wave corresponding to the source waveform data; A time intelligent timing module, connected to the waveform signal acquisition module, for determining the time taken to acquire the seismic wave corresponding to the source waveform data; A waveform processing module is connected to the waveform signal acquisition module through the waveform transmission module, and is used to pre-process the source waveform data to obtain target waveform data, wherein the pre-processing includes at least one of the following: removing noise, removing interference signals, and removing ground effects; A waveform feature extraction module, connected to the waveform processing module, for extracting feature data of the target waveform data; A source determination module, connected to the speed intelligent calculation module, the time intelligent timing module and the waveform feature extraction module, for determining the source position of the micro-earthquake according to the propagation speed of the seismic wave corresponding to the source waveform data, the time consumed to collect the seismic wave corresponding to the source waveform data, and the feature data of the target waveform data; The magnitude determination module is connected to the waveform feature extraction module and is used to determine the magnitude of the micro-earthquake based on the feature data of the target waveform data.

2. The microseismic monitoring system according to claim 1, characterized in that: Also includes: A three-dimensional model making module is used to obtain the topographic features of the target microseismic monitoring point and to establish a three-dimensional model of the monitoring point according to the topographic features of the target microseismic monitoring point; The intelligent marking module is connected to the three-dimensional model making module and the earthquake source determination module, and is used to mark the earthquake source position of the micro-earthquake in the three-dimensional model.

3. The microseismic monitoring system according to claim 2, characterized in that: Also includes: The display module is connected to the magnitude determination module and the three-dimensional model making module, and is used to display the magnitude of the micro-earthquake and the three-dimensional model marked with the source position of the micro-earthquake.

4. The microseismic monitoring system according to claim 1, characterized in that: The waveform signal acquisition module includes: an S wave acquisition unit and a P wave acquisition unit, wherein: The S-wave acquisition unit is used to acquire the seismic S-wave propagating longitudinally at the target microseismic monitoring point; The P wave acquisition unit is used to collect seismic P waves that propagate laterally at the target microseismic monitoring point; The source waveform data includes: seismic S waves propagating longitudinally and seismic P waves propagating laterally.

5. The microseismic monitoring system according to claim 1, characterized in that: The waveform processing module includes: a noise removal module, an interference signal removal module and a ground effect removal module, wherein: The noise removal module is used to remove noise in source waveform data; The interference signal removal module is used to remove interference signals in the source waveform data; The ground effect removal module is used to remove the influence of refraction and reflection of seismic waves on source waveform data after reaching the ground.

6. The microseismic monitoring system according to claim 1, characterized in that: The waveform feature extraction module includes: a spectrum feature extraction module, a time course feature extraction module and a time feature extraction module, wherein: The spectrum feature extraction module is used to extract energy distribution feature data of target waveform data at different frequencies; The time-course feature extraction module is used to extract the arrival feature data, amplitude feature data and period parameter feature data of the target waveform data; The time feature extraction module is used to extract the characteristic data of the change rules of the target waveform data within a preset time.

7. A display device for a microseismic monitoring system according to any one of claims 1 to 6, characterized in that: include: A protective shell and a movable plate arranged inside the protective shell, wherein: A through groove is formed on the top of the protective shell, and through grooves are formed on two symmetrical sides of the protective shell; The upper part of the movable plate passes through the through slot at the top of the protective shell and is slidably connected to the through slot. The top of the movable plate is fixedly connected to a display screen, and the top of the display screen is fixedly connected to a cover plate. A positioning rod is longitudinally fixedly connected inside the protective shell, and the positioning rod passes through the movable plate and is slidably connected with the movable plate.

8. The display device according to claim 7, characterized in that: Also includes: The card slots and fixing components are arranged on the left and right sides of the movable plate, and the fixing components include: a shell fixedly embedded in the side of the protective shell, and a first rotating shaft connected to the inside of the shell, wherein: The first rotating shaft is connected to the housing via a bearing, and a rotating rod is provided on the outer fixed sleeve of the first rotating shaft; A clamping block is fixedly connected to the first side of the rotating rod, and the clamping block passes through the through slot on the side of the protective shell and is embedded in the clamping slot on the side of the moving plate; a spring is connected to the second side of the rotating rod; The first end of the spring is connected to the rotating rod through a movable hinge seat, and the second end of the spring is connected to the housing through a movable hinge seat; The bottom of the rotating rod is fixedly connected to the first end of the rope, the second end of the rope passes through one side of the shell and is fixedly connected to the pull ring outside the shell, the rope is slidably connected to the shell, and the pull ring is in contact with the shell.

9. The display device according to claim 7, characterized in that: The inner wall of the bottom of the protective shell is fixedly connected with a first magnet, the bottom of the movable plate is provided with a groove, and the interior of the groove is fixedly connected with a second magnet.

10. A method for controlling the display device according to any one of claims 7 to 9, characterized in that: include: Pull the pull rings on the left and right sides of the moving plate to make the rotating rod rotate around the first rotating axis under the action of the rope, and move the clamping block on the first side of the rotating rod out of the clamping slot provided on the moving plate; Press the cover plate to drive the movable plate and the display screen to move downward until the display screen is hidden in the protective shell to prevent the display screen from being exposed to the air all the time; When the display screen is hidden in the protective shell, the first magnet is attracted to the second magnet to increase the stability of the display screen inside the protective shell.

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