Window and display device including same

Abstract

Disclosed are a window and a display device including the same. The window includes: a base layer; a first layer disposed on the base layer; a second layer disposed on the first layer; and a third layer disposed on the second layer. Each of the first layer, the second layer, and the third layer includes a first compound. When a ratio of an actual volume of the material to a total volume occupied by the material is defined as a packing density and the actual volume is defined by subtracting a void volume from the total volume, each of the first layer and the third layer has a packing density of about 75% to about 85% of a packing density of the second layer.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2023-0103115 filed on August 7, 2023, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] The present disclosure relates to a window and a display device including the window. Background Art

[0003] Display devices provide image information to users and are applied to various multimedia devices such as televisions, mobile phones, tablet computers, and gaming units. In recent years, various types of flexible display devices that can be folded or bent have been developed. The shape of flexible display devices can be changed in various ways (e.g., by folding, curling, or bending), making them easier to carry.

[0004] A flexible display device includes a foldable or bendable display panel and a window. However, the window of the flexible display device may be deformed due to a folding or bending operation, or may be easily damaged by an external impact. Summary of the invention

[0005] The present disclosure may provide a window having low reflectivity, excellent durability, and a thin thickness, and the difficulty of its manufacturing process is reduced.

[0006] The present disclosure may provide a display device having low reflectivity, excellent durability, and a thin thickness, and whose difficulty of a manufacturing process is reduced.

[0007] An embodiment of the window includes: a base layer; a first layer disposed on the base layer; a second layer disposed on the first layer; and a third layer disposed on the second layer. Each of the first layer, the second layer, and the third layer includes a first compound, and when a ratio of an actual volume of the material to a total volume occupied by the material is defined as a packing density and the actual volume is defined by subtracting a void volume from the total volume, each of the first layer and the third layer has a packing density of about 75% to about 85% of the packing density of the second layer.

[0008] In an embodiment, the first compound includes one of silicon nitride, silicon oxide, aluminum oxide, aluminum oxynitride, silicon oxynitride, silicon aluminum oxynitride, niobium oxide, aluminum nitride, magnesium fluoride, magnesium oxide, titanium oxide, germanium oxide, magnesium aluminum oxide, barium fluoride, calcium fluoride, dysprosium fluoride, ytterbium fluoride, yttrium fluoride, cerium fluoride, tantalum oxide, hafnium oxide, zirconium oxide, yttrium oxide, molybdenum oxide and diamond-like carbon.

[0009] In an embodiment, the first compound includes silicon nitride.

[0010] In an embodiment, each of the first layer, the second layer, and the third layer consists of the first compound.

[0011] In an embodiment, the packing density of the first layer is substantially equal to the packing density of the third layer.

[0012] In an embodiment, the packing density of each of the first layer and the third layer is about 80% of the packing density of the second layer.

[0013] In an embodiment, each of the first layer and the third layer has a refractive index equal to or greater than about 1.78 and equal to or less than about 1.87 at a wavelength of about 550 nm, and the second layer has a refractive index equal to or greater than about 1.98 and equal to or less than about 2.15 at a wavelength of about 550 nm.

[0014] In an embodiment, the first layer and the third layer have the same refractive index as each other at a wavelength of about 550 nm.

[0015] In an embodiment, the second layer is disposed directly on the first layer, and the third layer is disposed directly on the second layer.

[0016] In an embodiment, the first layer has a thickness equal to or greater than about 78 nm and equal to or less than about 94 nm, the second layer has a thickness equal to or greater than about 120 nm and equal to or less than about 146 nm, and the third layer has a thickness equal to or greater than about 15 nm and equal to or less than about 19 nm.

[0017] In an embodiment, the window further comprises a fourth layer disposed on the third layer and comprising perfluoropolyether (PFPE).

[0018] In an embodiment, the fourth layer has a thickness equal to or greater than about 20 nm and equal to or less than about 30 nm.

[0019] In an embodiment, the window further includes a fifth layer disposed between the third layer and the fourth layer and having a refractive index equal to or greater than about 1.43 and equal to or less than about 1.52 at a wavelength of about 550 nm.

[0020] In an embodiment, the fifth layer includes a fifth-first layer disposed on the third layer and a fifth-second layer disposed between the fifth-first layer and the fourth layer.

[0021] In an embodiment, the fifth-first layer has a planar structure, and the fifth-second layer has a columnar structure.

[0022] In an embodiment, the window further comprises a sixth layer disposed on the third layer, comprising the first compound, and having a packing density substantially the same as a packing density of the second layer.

[0023] An embodiment of the display device includes a display module and a window disposed on the display module. The window includes: a first layer disposed on the display module; a second layer disposed on the first layer; and a third layer disposed on the second layer. Each of the first layer, the second layer, and the third layer includes the same compound, and when the ratio of the actual volume of the material to the total volume occupied by the material is defined as the packing density and the actual volume is defined by subtracting the void volume from the total volume, each of the first layer and the third layer has a packing density of about 75% to about 85% of the packing density of the second layer.

[0024] In an embodiment, a display module includes: a base substrate; a circuit layer disposed on the base substrate; a light emitting element layer including a light emitting element and disposed on the circuit layer; and an anti-reflection layer including a color filter overlapped with the light emitting element and disposed on the light emitting element layer.

[0025] In an embodiment, the display device further includes a fourth layer disposed on the third layer and including perfluoropolyether (PFPE).

[0026] In an embodiment, the upper surface of the fourth layer defines an outermost surface of the window.

[0027] According to the above, since the window includes a plurality of layers disposed on a substrate layer and including a predetermined material, the window has low reflectivity, excellent durability, and a thin thickness, thereby reducing the difficulty of the manufacturing process of the window. Therefore, a display device including the window also has low reflectivity, excellent durability, and a thin thickness, and reduces the difficulty of the manufacturing process of the display device including the window. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other advantages of the present disclosure will become readily apparent by referring to the following detailed description when considered in conjunction with the accompanying drawings, in which:

[0029] Figure 1A is an assembled perspective view of a display device according to an embodiment of the present disclosure;

[0030] Figure 1B is an exploded perspective view of a display device according to an embodiment of the present disclosure;

[0031] Figure 2 is a cross-sectional view of a display device according to an embodiment of the present disclosure;

[0032] Figure 3 is a cross-sectional view of a portion of a display module according to an embodiment of the present disclosure;

[0033] Figure 4 is a cross-sectional view of a window according to an embodiment of the present disclosure;

[0034] Figure 5is a cross-sectional view of a window according to an embodiment of the present disclosure; and

[0035] Figure 6 is a cross-sectional view of a window according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0036] In the present disclosure, it will be understood that when an element (or region, layer or portion) is referred to as being "on", "connected to" or "coupled to" another element or layer, it can be directly on, directly connected to or directly coupled to the other element or layer, or intervening elements or layers may be present.

[0037] The same reference numerals always refer to the same elements. In the accompanying drawings, the thickness, proportions and sizes of the components are exaggerated in order to effectively describe the technical content. As used herein, the word "or" refers to a logical "or", so that unless the context otherwise indicates, the expression "A, B or C" means "A and B and C", "A and B but not C", "A and C but not B", "B and C but not A", "A but not B and not C", "B but not A and not C" and "C but not A and not B".

[0038] It will be understood that, although the terms first, second, etc. can be used here to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Therefore, without departing from the teaching of the present disclosure, the first element discussed below can be referred to as the second element. As used herein, unless the context clearly indicates otherwise, the singular form "one", "one (kind / person)" and "the (described)" are also intended to include plural forms.

[0039] For ease of description, spatially relative terms such as “under,” “beneath,” “lower,” “over,” “upper,” etc. may be used here to describe the relationship between one element or feature and another element or features as shown in the figures.

[0040] It will also be understood that when the terms "include" and "comprising" and their variations are used in this specification, it indicates the presence of the stated features, integers, steps, operations, elements or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components or groups thereof.

[0041] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0042] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0043] Figure 1A is an assembled perspective view of a display device DD according to an embodiment of the present disclosure. Figure 1B is an exploded perspective view of a display device DD according to an embodiment of the present disclosure.

[0044] Reference Figure 1A and Figure 1B , the display device DD may be activated in response to an electrical signal. The display device DD may display an image IM and may sense an external input. The display device DD may be applied to various embodiments. For example, the display device DD may be applied to a tablet computer, a notebook computer, a computer, or a smart TV. In this embodiment, a smart phone is described as a representative example of the display device DD.

[0045] The display device DD may display an image IM toward a third direction DR3 through a display surface FS substantially parallel to each of the first direction DR1 and the second direction DR2. The display surface FS through which the image IM is displayed may correspond to the front surface FS of the display device DD and the window WM. Hereinafter, the display surface and the front surface of the display device DD and the front surface of the window WM are labeled with the same symbol FS. The image IM may include a video as well as a still image. Figure 1A A clock widget and application icons are shown as representative examples of the image IM.

[0046] In the present embodiment, the front surface (or upper surface) and the rear surface (or lower surface) of each component of the display device DD can be defined relative to the direction of displaying the image IM. The front surface and the rear surface can be opposite to each other in the third direction DR3, and the normal direction of each of the front surface and the rear surface can be substantially parallel to the third direction DR3. The separation distance between the front surface and the rear surface of each component in the third direction DR3 can correspond to the thickness of each component in the third direction DR3. The directions indicated by the first direction DR1, the second direction DR2 and the third direction DR3 are opposite to each other, and therefore, the directions indicated by the first direction DR1, the second direction DR2 and the third direction DR3 can be changed to other directions. In the following description, the expression "when viewed in a plane" or "in a plane" can refer to the state viewed in the third direction DR3.

[0047] The display device DD may sense a user input applied thereto from the outside. The user input may include various forms of input (such as a part of the user's body, light, heat, or pressure). The user input may be provided in various ways. The display device DD may sense a user input applied to a side surface or a rear surface of the display device DD according to the structure of the display device DD, and the present disclosure should not be limited thereto or thereby.

[0048] Reference Figure 1A and Figure 1B , the display device DD may include a window WM, a display module DM, and an outer housing HU. In this embodiment, the window WM and the outer housing HU may be combined with each other to provide an appearance of the display device DD. In this embodiment, the outer housing HU, the display module DM, and the window WM may be sequentially stacked in the third direction DR3.

[0049] The window WM may include an optically transparent material. The window WM may include an insulating panel. For example, the window WM may include a glass material, a plastic material, or a combination thereof.

[0050] As described above, the front surface FS of the window WM may define the front surface of the display device DD. The transmission area TA may be an optically transparent area. For example, the transmission area TA may be an area having a visible light transmittance of about 90% or more.

[0051] The bezel area BZA may be an area having a relatively low transmittance compared to the transmission area TA. The bezel area BZA may define the shape of the transmission area TA. The bezel area BZA may be disposed adjacent to the transmission area TA and may surround the transmission area TA.

[0052] The bezel area BZA may have a predetermined color. The bezel area BZA may cover the peripheral area NAA of the display module DM to prevent the peripheral area NAA from being seen from the outside. However, this is merely an example, and according to an embodiment of the present disclosure, the bezel area BZA may be omitted from the window WM.

[0053] The display module DM may display an image IM and may sense an external input. The image IM may be displayed through the front surface IS of the display module DM. The front surface IS of the display module DM may include an active area AA and a peripheral area NAA. The active area AA may be an area activated in response to an electrical signal.

[0054] In the present embodiment, the active area AA may be an area that displays the image IM and senses the external input. The transmissive area TA may overlap at least the active area AA. For example, the transmissive area TA may overlap the entire surface or at least a portion of the active area AA. Therefore, the user may view the image IM through the transmissive area TA or may provide an external input, however, this is merely an example. According to an embodiment, the area through which the image IM is displayed and the area through which the external input is sensed may be separated from each other in the active area AA, and they should not be limited to a specific embodiment.

[0055] The peripheral area NAA may be covered by the bezel area BZA. The peripheral area NAA may be disposed adjacent to the active area AA. The peripheral area NAA may surround the active area AA. A driving circuit or driving line for driving the active area AA may be disposed in the peripheral area NAA.

[0056] The display module DM may include a display panel and a sensor layer. The image IM may be substantially displayed by the display panel, and the external input may be substantially sensed by the sensor layer. Since the display module DM includes both the display panel and the sensor layer, the display module DM may display the image IM and may sense the external input substantially at the same time. This will be described in more detail later.

[0057] The display device DD may further include a driving circuit. The driving circuit may include a flexible circuit board and a main circuit board. The flexible circuit board may be electrically connected to the display module DM. The flexible circuit board may connect the display module DM to the main circuit board, however, this is merely an example. According to an embodiment, the flexible circuit board may not be connected to the main circuit board, and the flexible circuit board may be a rigid substrate.

[0058] The flexible circuit board may be connected to a pad (or "pad") of the display module DM disposed in the peripheral area NAA. The flexible circuit board may provide an electrical signal to the display module DM to drive the display module DM. The electrical signal may be generated by the flexible circuit board or the main circuit board. The main circuit board may include various driving circuits for driving the display module DM or a connector for providing power. The main circuit board may be connected to the display module DM through the flexible circuit board.

[0059] Figure 1B The unfolded state of the display module DM is shown as a representative example, however, at least a portion of the display module DM may be bent. In the present embodiment, a portion of the display module DM may be bent toward the rear surface of the display module DM, and the portion bent toward the rear surface may be a portion connected to the main circuit board. Therefore, the main circuit board may be assembled while overlapping the rear surface of the display module DM.

[0060] The outer housing HU may be coupled to the window WM to define the appearance of the display device DD. The outer housing HU may provide a predetermined inner space. The display module DM may be accommodated in the inner space.

[0061] The outer housing HU may have a material with relatively high rigidity. For example, the outer housing HU may include glass, plastic or metal material or a plurality of frames or plates or a combination thereof. The outer housing HU may stably protect the components of the display device DD accommodated in the inner space from external impact.

[0062] Figure 2 is a cross-sectional view of a display device DD according to an embodiment of the present disclosure.

[0063] Reference Figure 2 , the display device DD may include a display module DM and a window WM. The display module DM may be combined with the window WM through an adhesive layer AD. The display module DM of the display device DD may include a display panel 100, a sensor layer 200, and an anti-reflection layer 300. Among the layers of the display module DM, the anti-reflection layer 300 may be combined with the window WM through an adhesive layer AD.

[0064] The display panel 100 may have a configuration that basically generates an image. The display panel 100 may be a light-emitting display panel. For example, the display panel 100 may be an organic light-emitting display panel, an inorganic light-emitting display panel, a micro-LED display panel, or a nano-LED display panel. The display panel 100 may be referred to as a display layer.

[0065] The display panel 100 may include a base substrate 110 , a circuit layer 120 , a light emitting element layer 130 , and an encapsulation layer 140 .

[0066] The base substrate 110 may be a member that provides a base surface on which the circuit layer 120 is disposed. The base substrate 110 may be a rigid base or a flexible base that is bendable, foldable, or rollable. The base substrate 110 may be a glass base, a metal base, or a polymer base, however, it should not be limited thereto or thereby. According to an embodiment, the base substrate 110 may be an inorganic layer, an organic layer, or a composite material layer.

[0067] The base substrate 110 may have a multilayer structure. For example, the base substrate 110 may include a first synthetic resin layer, an inorganic layer having a single layer or multilayer structure, and a second synthetic resin layer disposed on the inorganic layer. Each of the first synthetic resin layer and the second synthetic resin layer may include a polyimide-based resin, however, it should not be particularly limited.

[0068] The circuit layer 120 may be disposed on the base substrate 110. The circuit layer 120 may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line.

[0069] The light emitting element layer 130 may be disposed on the circuit layer 120. The light emitting element layer 130 may include a light emitting element. As an example, the light emitting element may include an organic light emitting material, an inorganic light emitting material, an organic-inorganic light emitting material, a quantum dot, a quantum rod, a micro LED, or a nano LED.

[0070] The encapsulation layer 140 may be disposed on the light emitting element layer 130. The encapsulation layer 140 may protect the light emitting element layer 130 from moisture, oxygen, and foreign matter such as dust particles. The encapsulation layer 140 may include at least one inorganic layer. The encapsulation layer 140 may include a stacked structure of inorganic layer / organic layer / inorganic layer.

[0071] The sensor layer 200 may be disposed on the display panel 100. The sensor layer 200 may sense an external input applied thereto from the outside. The external input may be a user input. The user input may include various forms of input, such as a part of the user's body, light, heat, a pen, or pressure.

[0072] The sensor layer 200 may be formed on the display panel 100 through a continuous process. In this case, the sensor layer 200 may be directly disposed on the display panel 100. In the present disclosure, the expression “the sensor layer 200 is directly disposed on the display panel 100” means that there is no intervening element between the sensor layer 200 and the display panel 100. That is, a separate adhesive member may not be disposed between the sensor layer 200 and the display panel 100.

[0073] The anti-reflection layer 300 may be directly disposed on the sensor layer 200. The anti-reflection layer 300 may reduce the reflectivity with respect to external light incident on the display device DD from the outside. The anti-reflection layer 300 may be formed on the sensor layer 200 by a continuous process. The anti-reflection layer 300 may include a color filter. The color filter may be arranged in a predetermined manner. The arrangement of the color filter may be determined by considering the color of light emitted from the pixels included in the display panel 100. In addition, the anti-reflection layer 300 may further include a black matrix adjacent to the color filter. The anti-reflection layer 300 will be described in detail later.

[0074] According to an embodiment, the sensor layer 200 may be omitted. In this case, the anti-reflection layer 300 may be directly disposed on the display panel 100. According to an embodiment, positions of the sensor layer 200 and the anti-reflection layer 300 may be changed from each other.

[0075] Although not shown in the drawings, according to an embodiment, the display device DD may further include an optical layer disposed on the anti-reflection layer 300. As an example, the optical layer may be formed on the anti-reflection layer 300 by a continuous process. The optical layer may control the direction of light incident from the display panel 100 to improve the front brightness of the display device DD. As an example, the optical layer may include an organic insulating layer and a high refractive index layer, openings are defined through the organic insulating layer to correspond to light emitting areas of pixels included in the display panel 100, respectively, and the high refractive index layer covers the organic insulating layer and fills in the openings. The high refractive index layer may have a refractive index higher than that of the organic insulating layer.

[0076] The window WM may provide a front surface of the display device DD. The window WM may include a glass film or a synthetic resin film as its base film. The window WM may also include a functional layer such as an anti-reflection layer or an anti-fingerprint layer. Figures 4 to 6 The functional layers included in the window WM are described. Although not shown in the figure, the window WM may also include a border area BZA (refer to Figure 1B ) overlaid border patterns.

[0077] Figure 3 is a cross-sectional view of a portion of a display module DM according to an embodiment of the present disclosure. Figure 3 FIG. 1 shows a cross section of a portion of a light emitting element LD and a portion of a pixel circuit PC included in a display module DM. Figure 3 The components of the display module DM are described in detail.

[0078] The display panel 100 included in the display module DM may include a base substrate 110. The base substrate 110 may be a member that provides a base surface on which the circuit layer 120 is disposed. The base substrate 110 may be a glass substrate, a metal substrate, a plastic substrate, or a silicon substrate, however, it should not be limited thereto or thereby. According to an embodiment, the base substrate 110 may be an inorganic layer, an organic layer, or a composite material layer.

[0079] The buffer layer 10br may be disposed on the base substrate 110. The buffer layer 10br may prevent metal atoms or impurities from diffusing upward from the base substrate 110 to the first semiconductor pattern SP1. The first semiconductor pattern SP1 may include a channel region AC1 of a silicon transistor S-TFT. The buffer layer 10br may control a heat supply rate during a crystallization process for forming the first semiconductor pattern SP1 so that the first semiconductor pattern SP1 may be uniformly formed.

[0080] The first semiconductor pattern SP1 may be disposed on the buffer layer 10br. The first semiconductor pattern SP1 may include a silicon semiconductor. As an example, the silicon semiconductor may include amorphous silicon, polycrystalline silicon, or single crystal silicon. For example, the first semiconductor pattern SP1 may include low temperature polycrystalline silicon.

[0081] Figure 3 Only a portion of the first semiconductor pattern SP1 disposed on the buffer layer 10br is shown, and the first semiconductor pattern SP1 may also be disposed in other regions. The first semiconductor pattern SP1 may be arranged in a specific regular pattern throughout the pixel. The first semiconductor pattern SP1 may have different electrical properties depending on whether the first semiconductor pattern SP1 is doped or whether it is doped with an N-type dopant or a P-type dopant. The first semiconductor pattern SP1 may include a first region having a relatively high conductivity and a second region having a relatively low conductivity. The first region may be doped with an N-type dopant or a P-type dopant. The P-type transistor may include a region doped with a P-type dopant, and the N-type transistor may include a region doped with an N-type dopant. The second region may be an undoped region or a region doped with a concentration lower than that of the first region.

[0082] The conductivity of the first region may be greater than that of the second region and may be substantially used as an electrode or a signal line. The second region may substantially correspond to an active region (or channel) of a transistor. In other words, a portion of the first semiconductor pattern SP1 may be an active region of a transistor, another portion of the first semiconductor pattern SP1 may be a source or drain of the transistor, and another portion of the first semiconductor pattern SP1 may be a connection electrode or a connection signal line.

[0083] A source region SE1 (or source), a channel region AC1 (or channel), and a drain region DE1 (or drain) of the silicon transistor S-TFT may be formed by the first semiconductor pattern SP1. The source region SE1 and the drain region DE1 may extend from the channel region AC1 in opposite directions to each other in cross section.

[0084] Although not shown in the figure, the rear surface metal layer may be disposed under each of the silicon transistor S-TFT and the oxide transistor O-TFT. The rear surface metal layer may overlap with the pixel circuit PC and may prevent external light from reaching the pixel circuit PC. The rear surface metal layer may be disposed between the base substrate 110 and the buffer layer 10br. According to an embodiment, the rear surface metal layer may be disposed between the second insulating layer 20 and the third insulating layer 30. The rear surface metal layer may include a reflective metal. As an example, the rear surface metal layer may include silver (Ag), an alloy containing silver (Ag), molybdenum (Mo), an alloy containing molybdenum (Mo), aluminum (Al), an alloy containing aluminum (Al), aluminum nitride (AlN), tungsten (W), tungsten nitride (WN), copper (Cu), p+ doped amorphous silicon, etc. The rear surface metal layer may be connected to an electrode or wiring and may receive a constant voltage or signal from the electrode or wiring. According to an embodiment, the rear surface metal layer may be a floating electrode isolated from other electrodes or wiring. According to an embodiment, an inorganic barrier layer may also be disposed between the base substrate 110 and the buffer layer 10br.

[0085] The first insulating layer 10 may be disposed on the buffer layer 10br. The first insulating layer 10 may overlap with the pixel in common and may cover the first semiconductor pattern SP1. The first insulating layer 10 may be an inorganic layer or an organic layer, and may have a single layer or a multilayer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In the present embodiment, the first insulating layer 10 may have a single layer structure of a silicon oxide layer. Not only the first insulating layer 10, but also the insulating layer of the circuit layer 120 described later may be an inorganic layer or an organic layer, and may have a single layer or a multilayer structure. The inorganic layer may include at least one of the above materials, however, it should not be limited thereto or thereby.

[0086] The gate GT1 of the silicon transistor S-TFT may be disposed on the first insulating layer 10. The gate GT1 may be a part of a metal pattern. The gate GT1 may overlap the channel region AC1. The gate GT1 may be used as a mask in a process of doping the first semiconductor pattern SP1. The gate GT1 may include titanium (Ti), silver (Ag), an alloy containing silver (Ag), molybdenum (Mo), an alloy containing molybdenum (Mo), aluminum (Al), an alloy containing aluminum (Al), aluminum nitride (AlN), tungsten (W), tungsten nitride (WN), copper (Cu), indium tin oxide (ITO), indium zinc oxide (IZO), etc., however, it should not be particularly limited.

[0087] The second insulating layer 20 may be disposed on the first insulating layer 10 and may cover the gate GT1. The third insulating layer 30 may be disposed on the second insulating layer 20. The second electrode CE20 of the storage capacitor Cst may be disposed between the second insulating layer 20 and the third insulating layer 30. In addition, the first electrode CE10 of the storage capacitor Cst may be disposed between the first insulating layer 10 and the second insulating layer 20.

[0088] The second semiconductor pattern SP2 may be disposed on the third insulating layer 30. The second semiconductor pattern SP2 may include a channel region AC2 of an oxide transistor O-TFT described later. The second semiconductor pattern SP2 may include an oxide semiconductor. The second semiconductor pattern SP2 may include a transparent conductive oxide (TCO) such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), zinc oxide (ZnO), or indium oxide (In 2 O 3 ).

[0089] The oxide semiconductor may include a plurality of regions that are distinguished from each other according to whether the transparent conductive oxide is reduced. The region in which the transparent conductive oxide is reduced (hereinafter, referred to as the "reduction region") has a greater conductivity than the region in which the transparent conductive oxide is not reduced (hereinafter, referred to as the "non-reduction region"). The reduction region may be substantially used as a source / drain or a signal line of a transistor. The non-reduction region may substantially correspond to a semiconductor region (or active region or channel) of a transistor. In other words, a portion of the second semiconductor pattern SP2 may be a semiconductor region of a transistor, another portion of the second semiconductor pattern SP2 may be a source / drain region of a transistor, and the other portion of the second semiconductor pattern SP2 may be a signal transmission region.

[0090] A source region SE2 (or source), a channel region AC2 (or channel), and a drain region DE2 (or drain) of the oxide transistor O-TFT may be formed by the second semiconductor pattern SP2. The source region SE2 and the drain region DE2 may extend from the channel region AC2 in opposite directions in cross section.

[0091] The fourth insulating layer 40 may be disposed on the third insulating layer 30. The fourth insulating layer 40 may overlap in common with the pixel and may cover the second semiconductor pattern SP2. Although not shown in the figure, the fourth insulating layer 40 may be an insulating pattern overlapping the gate electrode GT2 of the oxide transistor O-TFT and exposing the source region SE2 and the drain region DE2 of the oxide transistor O-TFT.

[0092] The gate GT2 of the oxide transistor O-TFT may be disposed on the fourth insulating layer 40. The gate GT2 of the oxide transistor O-TFT may be a portion of the metal pattern. The gate GT2 of the oxide transistor O-TFT may overlap the channel region AC2.

[0093] The fifth insulating layer 50 may be disposed on the fourth insulating layer 40 and may cover the gate electrode GT2. The first connection electrode CNE1 may be disposed on the fifth insulating layer 50. The first connection electrode CNE1 may be connected to the drain region DE1 of the silicon transistor S-TFT via a contact hole defined through the first insulating layer 10, the second insulating layer 20, the third insulating layer 30, the fourth insulating layer 40, and the fifth insulating layer 50.

[0094] The sixth insulating layer 60 may be disposed on the fifth insulating layer 50. The second connection electrode CNE2 may be disposed on the sixth insulating layer 60. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 via a contact hole defined through the sixth insulating layer 60. The seventh insulating layer 70 may be disposed on the sixth insulating layer 60 and may cover the second connection electrode CNE2. The eighth insulating layer 80 may be disposed on the seventh insulating layer 70.

[0095] Each of the sixth insulating layer 60, the seventh insulating layer 70, and the eighth insulating layer 80 may be an organic layer. As an example, each of the sixth insulating layer 60, the seventh insulating layer 70, and the eighth insulating layer 80 may include a general polymer such as benzocyclobutene (BCB), polyimide, hexamethyldisiloxane (HMDSO), polymethylmethacrylate (PMMA), or polystyrene (PS), a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer, a vinyl alcohol polymer, or a blend thereof.

[0096] The light emitting element layer 130 may be disposed on the circuit layer 120. The light emitting element layer 130 may include a light emitting element LD and a pixel defining layer PDL.

[0097] The light emitting element LD may include a first electrode AE ​​(or a pixel electrode), a light emitting layer EML, and a second electrode CE (or a common electrode). Each of the light emitting layer EML and the second electrode CE may be commonly formed throughout the pixel.

[0098] The first electrode AE ​​of the light emitting element LD may be disposed on the eighth insulating layer 80. The first electrode AE ​​of the light emitting element LD may be a semi-transmissive electrode, a transmissive electrode, or a reflective electrode. According to an embodiment, the first electrode AE ​​of the light emitting element LD may include a reflective layer formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a compound thereof and a transparent or semi-transparent electrode layer formed on the reflective layer. The transparent or semi-transparent electrode layer may include a layer selected from indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ) and aluminum-doped zinc oxide (AZO). For example, the first electrode AE ​​of the light emitting element LD may have a stacked structure of ITO / Ag / ITO.

[0099] The pixel defining layer PDL may be disposed on the eighth insulating layer 80. The pixel defining layer PDL may have a light absorbing property. For example, the pixel defining layer PDL may have a black color. The pixel defining layer PDL may include a black colorant. The black colorant may include a black dye or a black pigment. The black colorant may include carbon black, a metal material such as chromium, or an oxide thereof. The pixel defining layer PDL may correspond to a light blocking pattern having a light blocking property.

[0100] The pixel defining layer PDL may cover a portion of the first electrode AE ​​of the light emitting element LD. As an example, the pixel defining layer PDL may be provided with an opening PDL-OP defined therethrough to expose a portion of the first electrode AE ​​of the light emitting element LD. The pixel defining layer PDL may increase the distance between the edge of the first electrode AE ​​of the light emitting element LD and the second electrode CE. Therefore, an arc may be prevented from occurring on the edge of the first electrode AE ​​by the pixel defining layer PDL.

[0101] Although not shown in the figure, the hole control layer may be disposed between the first electrode AE ​​and the light-emitting layer EML. The hole control layer may include a hole transport layer and may further include a hole injection layer. The electron control layer may be disposed between the light-emitting layer EML and the second electrode CE. The electron control layer may include an electron transport layer and may further include an electron injection layer. The hole control layer and the electron control layer may be formed in common throughout a plurality of pixels using an open mask.

[0102] The encapsulation layer 140 may be disposed on the light emitting element layer 130. The encapsulation layer 140 may include an inorganic layer 141, an organic layer 142, and an inorganic layer 143 sequentially stacked, however, the layers included in the encapsulation layer 140 should not be limited thereto or thereby.

[0103] The inorganic layers 141 and 143 can protect the light emitting element layer 130 from moisture and oxygen, and the organic layer 142 can protect the light emitting element layer 130 from foreign matter such as dust particles. The inorganic layers 141 and 143 may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer 142 may include an acrylic organic layer, however, it should not be limited thereto or thereby.

[0104] The sensor layer 200 may be disposed on the display panel 100. The sensor layer 200 may be referred to as a sensor, an input sensing layer, or an input sensing panel. The sensor layer 200 may include a sensor base layer 210, a first conductive layer 220, a sensing insulating layer 230, and a second conductive layer 240.

[0105] The sensor base layer 210 may be directly disposed on the display panel 100. The sensor base layer 210 may be an inorganic layer including at least one of silicon nitride, silicon oxynitride, and silicon oxide. According to an embodiment, the sensor base layer 210 may be an organic layer including epoxy resin, acrylic resin, or imide resin. The sensor base layer 210 may have a single-layer structure or a multi-layer structure in which a plurality of layers are stacked in the third direction DR3.

[0106] Each of the first conductive layer 220 and the second conductive layer 240 may have a single layer structure or a multilayer structure of a plurality of layers stacked in the third direction DR3. The first conductive layer 220 and the second conductive layer 240 may include conductive lines to define sensing electrodes having a mesh shape. The conductive lines may not overlap the opening PDL-OP and may overlap the pixel defining layer PDL.

[0107] The conductive layer having a single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium zinc tin oxide (IZTO), etc. In addition, the transparent conductive layer may include a conductive polymer such as PEDOT, a metal nanowire, graphene, etc.

[0108] The conductive layer having a multi-layer structure may include a metal layer. The metal layer may have a three-layer structure of titanium / aluminum / titanium. The conductive layer having a multi-layer structure may include at least one metal layer and at least one transparent conductive layer.

[0109] The sensing insulating layer 230 may be disposed between the first conductive layer 220 and the second conductive layer 240. The sensing insulating layer 230 may include an inorganic layer. The inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0110] According to an embodiment, the sensing insulating layer 230 may include an organic layer. The organic layer may include at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin.

[0111] The anti-reflection layer 300 may be disposed on the sensor layer 200. The anti-reflection layer 300 may include a light shielding pattern 310, a color filter 320, and a planarization layer 330.

[0112] The anti-reflection layer 300 may reduce the reflectivity of external light. The anti-reflection layer 300 may include a color filter 320. The color filter 320 may be provided in plurality, and the color filter 320 may be arranged in a predetermined manner by considering the color of light emitted from the pixels included in the display panel 100. According to an embodiment, the anti-reflection layer 300 may reduce the reflectivity of the display module DM with respect to external light using the color filter 320 that does not include a retarder and a polarizer. According to an embodiment, the anti-reflection layer 300 of the display module DM may not include a polarizing film or a polarizing layer.

[0113] The material for the light shielding pattern 310 should not be particularly limited as long as the material absorbs light. The light shielding pattern 310 may be a layer having a black color. The light shielding pattern 310 may include a black colorant. The black colorant may include a black dye or a black pigment. The black colorant may include carbon black, a metal material such as chromium, or an oxide thereof.

[0114] The light shielding pattern 310 may cover the second conductive layer 240 of the sensor layer 200. The light shielding pattern 310 may prevent external light from being reflected from the second conductive layer 240. The light shielding pattern 310 may overlap a portion of the pixel defining layer PDL.

[0115] The light shielding pattern 310 may be provided with a separation opening 310-OP2 defined therethrough. The separation opening 310-OP2 may overlap with the first electrode AE ​​of the light emitting element LD. Each of the color filters 320 may overlap with the first electrode AE ​​of the light emitting element LD corresponding thereto. Each of the color filters 320 may cover the corresponding separation opening 310-OP2. Each of the color filters 320 may contact the light shielding pattern 310.

[0116] The planarization layer 330 may cover the light shielding pattern 310 and the color filter 320. The planarization layer 330 may include an organic material and may provide a flat surface thereon. According to an embodiment, the planarization layer 330 may be omitted.

[0117] Figure 4 is a cross-sectional view of a window WM according to an embodiment of the present disclosure. Figure 5 is a cross-sectional view of a window WM-1 according to an embodiment of the present disclosure. Figure 6 is a cross-sectional view of window WM-2 according to an embodiment of the present disclosure.

[0118] Reference Figure 4 , the window WM may include a base layer BL, a first layer LY1 disposed on the base layer BL, a second layer LY2 disposed on the first layer LY1 , ​​and a third layer LY3 disposed on the second layer LY2 .

[0119] The base layer BL may include a transparent material. The base layer BL may include a glass substrate or a polymer film. The base layer BL may be a chemically tempered glass substrate. In the case where the base layer BL is a chemically tempered glass substrate, the base layer BL may have high mechanical strength while having a thin thickness, and therefore, the base layer BL may be used as a window of a foldable display device. In the case where the base layer BL is a polymer film, the base layer BL may include a polyimide (PI) film or a polyethylene terephthalate (PET) film. The base layer BL of the window WM may have a single-layer or multi-layer structure. As an example, the base layer BL may have a structure in which a plurality of polymer films are bonded to each other by an adhesive member, or may have a structure in which a glass substrate is bonded to a polymer film by an adhesive. The base layer BL may include a flexible material. The base layer BL may have a thickness equal to or greater than about 1 μm and equal to or less than about 60 μm. Preferably, the thickness of the base layer BL may be about 20 μm. Figure 4 The base layer BL having a rectangular shape when viewed in cross section is shown as a representative example, however, the base layer BL should not be limited thereto or thereby. According to an embodiment, the base layer BL may have a shape in which the edge of the upper surface of the base layer BL is rounded (is rounded). More specifically, the upper surface of the base layer BL is not substantially rounded from the bezel area BZA (refer to FIG. 1 ). Figure 1B )The overlapping edges can be rounded (rounded).

[0120] The first layer LY1 may be directly disposed on the base layer BL. The second layer LY2 may be directly disposed on the first layer LY1, and the third layer LY3 may be directly disposed on the second layer LY2. Since the second layer LY2 having a relatively high refractive index is disposed on the first layer LY1 having a relatively low refractive index, and the third layer LY3 having a relatively low refractive index is disposed on the second layer LY2, the window WM and the display device DD including the window WM may have low reflective properties, wear-resistant properties, and scratch-resistant properties, and the window WM may be thinner than a conventional low-reflective window. As a result, the difficulty of the manufacturing process of the display device DD may be reduced.

[0121] Each of the first layer LY1, the second layer LY2, and the third layer LY3 may include a first compound. The first layer LY1, the second layer LY2, and the third layer LY3 may include the same material as each other. The first compound may include silicon nitride, silicon oxide, aluminum oxide, aluminum oxynitride, silicon oxynitride, silicon aluminum oxynitride, niobium oxide (NbO) 2 O 5 ), aluminum nitride (AlN), magnesium fluoride (MgF 2 ), magnesium oxide (MgO), titanium oxide (TiO 2 ), germanium oxide (GeO 2 ), magnesium aluminum oxide (MgAl 2 O 4 ), barium fluoride (BaF 2 ), calcium fluoride (CaF 2 ), Dysprosium fluoride (DyF 3 ), Ytterbium fluoride (YbF 3 ), yttrium fluoride (YF 3 ), cerium fluoride (CeF 3 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 )、ZrO 2 ), yttrium oxide (Y 2 O 3 ), molybdenum oxide (MoO 3 ) and diamond-like carbon. The chemical formula of silicon nitride can be Si 3 N 4 The chemical formula of silicon oxide can be SiO 2 The chemical formula of aluminum oxide can be Al 2 O 3 The chemical formula of aluminum oxynitride can be (AlN) x (Al 2 O 3 ) 1-x , x is a real number equal to or greater than about 0.30 and equal to or less than about 0.37. The chemical formula of silicon oxynitride may be Si b Oc N d , b is a real number equal to or greater than 1 and equal to or less than 3, c is a real number equal to or greater than 0 and equal to or less than 2, and d is a real number equal to or greater than 0 and equal to or less than 4. "c" and "d" are not equal to 0 at the same time. Silicon aluminum oxynitride can be represented by Si 6- e Al e O e N 8-e , and "e" is a real number greater than 0 and equal to or less than 4.2. As an example, the first compound may include silicon nitride. The first compound may be composed of silicon nitride. Each of the first layer LY1, the second layer LY2, and the third layer LY3 may include the first compound. As an example, each of the first layer LY1, the second layer LY2, and the third layer LY3 may include silicon nitride. The first layer LY1, the second layer LY2, and the third layer LY3 including the first compound may have a high hardness, and thus the durability and scratch resistance of the first layer LY1, the second layer LY2, and the third layer LY3 may be improved.

[0122] In the following description, the packing density is defined as the ratio of the actual volume of the material to the total volume occupied by the material. In the following description, the actual volume is defined as the volume obtained by subtracting the void volume from the total volume. The actual volume refers to the volume of the space filled by the substance. The void volume refers to the volume of the empty space not occupied by the substance. The packing density of each of the first layer LY1 and the third layer LY3 may be equal to or greater than about 75% of the packing density of the second layer LY2 and equal to or less than about 85% of the packing density of the second layer LY2. The first layer LY1 and the third layer LY3 may have substantially the same packing density. The packing density of each of the first layer LY1 and the third layer LY3 may be about 80% of the packing density of the second layer LY2. The increase in packing density may refer to a relatively small void volume and may allow the average distance between the constituent materials to be reduced, resulting in more light scattering and more light refraction. Therefore, the refractive index increases. In the case where two films have the same material, a film with a relatively high packing density may have a refractive index higher than the refractive index of another film with a relatively low packing density. That is, each layer may have a packing density that is directly proportional to its refractive index. Therefore, the refractive index of the first layer LY1, the second layer LY2 and the third layer LY3 can be controlled by adjusting the packing density of the first layer LY1, the second layer LY2 and the third layer LY3. The first layer LY1, the second layer LY2 and the third layer LY3 of the window WM can have different refractive indices from each other while including the same first compound by using the relationship between the packing density and the refractive index. The refractive index of each of the first layer LY1 and the third layer LY3 at a wavelength of about 550nm may be equal to or greater than about 1.78 and equal to or less than about 1.87, and the refractive index of the second layer LY2 at a wavelength of about 550nm may be equal to or greater than about 1.98 and equal to or less than about 2.15. The first layer LY1 and the third layer LY3 may have substantially the same refractive index at a wavelength of about 550nm. As an example, the refractive index of each of the first layer LY1 and the third layer LY3 at a wavelength of about 550nm may be about 1.82, and the refractive index of the second layer LY2 at a wavelength of about 550nm may be about 2.04. In the case where the refractive index of each of the first layer LY1 and the third layer LY3 at a wavelength of about 550 nm is greater than about 1.87 or the refractive index of the second layer LY2 at a wavelength of about 550 nm is greater than about 2.15, chromatic aberration increases and the optical characteristics of the window WM deteriorate. In the case where the refractive index of each of the first layer LY1 and the third layer LY3 at a wavelength of about 550 nm is less than about 1.78, the packing density is too low, and thus the difficulty of the manufacturing process increases.

[0123] The first layer LY1 may have a thickness d1 equal to or greater than about 78 nm and equal to or less than about 94 nm. The second layer LY2 may have a thickness d2 equal to or greater than about 120 nm and equal to or less than about 146 nm. The third layer LY3 may have a thickness d3 equal to or greater than about 15 nm and equal to or less than about 19 nm. As an example, the thickness d1 of the first layer LY1 may be about 85.48 nm, the thickness d2 of the second layer LY2 may be about 133.69 nm, and the thickness d3 of the third layer LY3 may be about 17.30 nm. In the case where the thickness d1 of the first layer LY1, the thickness d2 of the second layer LY2, and the thickness d3 of the third layer LY3 are greater than about 94 nm, about 146 nm, and about 19 nm, respectively, the chromatic aberration may increase, and therefore, the optical properties of the window WM may deteriorate. When the thickness d1 of the first layer LY1, the thickness d2 of the second layer LY2, and the thickness d3 of the third layer LY3 are less than about 78 nm, about 120 nm, and about 15 nm, respectively, the durability and scratch resistance of the window WM may be deteriorated. The first layer LY1, the second layer LY2, and the third layer LY3 may be deposited by a sputtering process.

[0124] The window WM may further include a fourth layer LY4 disposed above the third layer LY3. The fourth layer LY4 may include perfluoropolyether (PFPE). The fourth layer LY4 may be an anti-fingerprint coating. The fourth layer LY4 may have a refractive index equal to or greater than about 1.43 and equal to or less than about 1.52 at a wavelength of about 550 nm. As an example, the refractive index of the fourth layer LY4 at a wavelength of about 550 nm may be about 1.48. The upper surface of the fourth layer LY4 may correspond to the outermost surface of the window WM. The fourth layer LY4 may have a thickness d4 equal to or greater than about 20 nm and equal to or less than about 30 nm. As an example, the thickness d4 of the fourth layer LY4 may be about 25 nm. In the case where the thickness d4 of the fourth layer LY4 is greater than about 30 nm, the chromatic aberration increases and the optical properties of the window WM deteriorate. In the case where the thickness d4 of the fourth layer LY4 is less than about 20 nm, the anti-fingerprint properties deteriorate. The fourth layer LY4 may be deposited by an electron beam or thermal evaporation deposition process.

[0125] The window WM may further include a fifth layer LY5 disposed between the third layer LY3 and the fourth layer LY4. The fifth layer LY5 may be disposed directly on the third layer LY3. The fifth layer LY5 may be disposed directly on the lower surface of the fourth layer LY4. The fifth layer LY5 may compensate for the optical properties of the window WM, and the fifth layer LY5 may improve the durability of the window WM by enhancing the adhesion between the fourth layer LY4 and the third layer LY3. The fifth layer LY5 may improve the scratch resistance of the window WM. The fifth layer LY5 may include silicon oxide. The fifth layer LY5 may have a refractive index equal to or greater than about 1.43 and equal to or less than about 1.52 at a wavelength of about 550 nm. As an example, the refractive index of the fifth layer LY5 at a wavelength of about 550 nm may be about 1.48. In the case where the refractive index of the fifth layer LY5 at a wavelength of about 550 nm is greater than about 1.52, the chromatic aberration increases and the optical properties of the window WM deteriorate. The fifth layer LY5 may have a thickness d5 equal to or greater than about 78 nm and equal to or less than about 94 nm. As an example, the thickness d5 of the fifth layer LY5 may be about 85.49 nm. In the case where the thickness d5 of the fifth layer LY5 is greater than about 94 nm, the chromatic aberration increases and the optical properties of the window WM deteriorate. In the case where the thickness d5 of the fifth layer LY5 is less than about 78 nm, the compensation for the optical properties will be insufficient, and the fourth layer LY4 and the third layer LY3 will not be in close contact with each other. As a result, the durability of the window WM will deteriorate, and the scratch resistance of the window WM will deteriorate. The fifth layer LY5 may be deposited by a sputtering process or a thermal evaporation deposition process.

[0126] and Figure 4 The window WM shown in is different. Figure 5 The window WM-1 shown in FIG. 1 may include a fifth layer LY5 configured to include a fifth-first layer LY5-1 and a fifth-second layer LY5-2. Figure 5 In this section, the description of window WM-1 will focus on Figure 4 The features of the window WM shown in FIG.

[0127] The fifth layer LY5 of the window WM-1 may include a fifth-first layer LY5-1 disposed on the third layer LY3 and a fifth-second layer LY5-2 disposed between the fifth-first layer LY5-1 and the fourth layer LY4. The fifth-first layer LY5-1 may be directly disposed on the third layer LY3. The fifth-second layer LY5-2 may be directly disposed on the fifth-first layer LY5-1. The fifth-second layer LY5-2 may be directly disposed on the lower surface of the fourth layer LY4. The fifth-second layer LY5-2 may improve the durability of the window WM-1 by strengthening the adhesion between the fourth layer LY4 and the fifth-first layer LY5-1. The fifth-first layer LY5-1 and the fifth-second layer LY5-2 may include silicon oxide. The fifth-first layer LY5-1 may have a planar structure, and the fifth-second layer LY5-2 may have a columnar structure. The planar structure refers to SiO 2 The crystal structure is α-quartz structure. The columnar structure refers to SiO 2 The crystal structure is a β-tridymite structure. The fifth-first layer LY5-1 may be deposited by a sputtering process. The fifth-second layer LY5-2 may be deposited by a thermal evaporation deposition process. The fifth-first layer LY5-1 may have a thickness d5-1 equal to or greater than about 58 nm and equal to or less than about 72 nm. The fifth-second layer LY5-2 may have a thickness d5-2 equal to or greater than about 8 nm and equal to or less than about 25 nm. In the case where the thickness d5-1 of the fifth-first layer LY5-1 is greater than about 72 nm or the thickness d5-2 of the fifth-second layer LY5-2 is greater than about 25 nm, the chromatic aberration increases and the optical properties of the window WM-1 deteriorate. In the case where the thickness d5-1 of the fifth-first layer LY5-1 is less than about 58 nm or the thickness d5-2 of the fifth-second layer LY5-2 is less than about 8 nm, the compensation of the optical properties will be insufficient, and the fourth layer LY4 and the third layer LY3 will not be in close contact with each other. As a result, the durability of the window WM-1 may be deteriorated, and the scratch resistance property of the window WM-1 may be deteriorated.

[0128] and Figure 5 The window shown in WM-1 is different. Figure 6 The window WM-2 shown in FIG. 1 may also include a sixth layer LY6 and a seventh layer LY7. Figure 6 In this section, the description of window WM-2 will focus on Figure 4 and Figure 5 The features of windows WM and WM-1 shown in FIG.

[0129] The window WM-2 may include a sixth layer LY6. The sixth layer LY6 may be disposed on the third layer LY3. The sixth layer LY6 may be disposed directly on the third layer LY3. The sixth layer LY6 may include a first compound. The sixth layer LY6 may include substantially the same compound as the first layer LY1, the second layer LY2, or the third layer LY3. As an example, the sixth layer LY6 may include silicon nitride. The sixth layer LY6 may be composed of the first compound. The sixth layer LY6 may be composed of silicon nitride. The sixth layer LY6 may have a packing density substantially the same as that of the second layer LY2. The sixth layer LY6 may have a refractive index equal to or greater than about 1.98 and equal to or less than about 2.15 at a wavelength of about 550 nm. The sixth layer LY6 and the second layer LY2 may have the same refractive index as each other at a wavelength of about 550 nm. As an example, the refractive index of the sixth layer LY6 at a wavelength of about 550 nm may be about 2.04. In the case where the refractive index of the sixth layer LY6 at a wavelength of about 550nm is greater than about 2.15, the chromatic aberration will increase, and thus the optical properties of the window WM-2 will deteriorate. In the case where the refractive index of the sixth layer LY6 is less than about 1.98 at a wavelength of about 550nm, the filling density will be too low, and thus the difficulty of the manufacturing process will increase. The sixth layer LY6 may be directly disposed on the third layer LY3. The second layer LY2 having a relatively high refractive index may be disposed on the first layer LY1 having a relatively low refractive index, the third layer LY3 having a relatively low refractive index may be disposed on the second layer LY2, and the sixth layer LY6 having a relatively high refractive index may be disposed on the third layer LY3. Therefore, the window WM-2 and the display device DD including the window WM-2 may have low reflective properties, wear-resistant properties, and scratch-resistant properties, and the window WM may be thinner than a conventional low-reflective window. As a result, the difficulty of the manufacturing process of the display device DD may be reduced. The sixth layer LY6 may have a thickness d6 equal to or greater than about 120nm and equal to or less than about 146nm. As an example, the thickness d6 of the sixth layer LY6 may be about 133.69 nm. In the case where the thickness d6 of the sixth layer LY6 is greater than about 146 nm, the chromatic aberration may increase and the optical properties of the window WM-2 may deteriorate. In the case where the thickness d6 of the sixth layer LY6 is less than about 120 nm, the durability and scratch resistance of the window WM-2 may deteriorate. The sixth layer LY6 may be deposited by a sputtering process.

[0130] The window WM-2 may include a seventh layer LY7. The seventh layer LY7 may be disposed on the sixth layer LY6. The seventh layer LY7 may be disposed directly on the sixth layer LY6. The seventh layer LY7 may be disposed directly on the lower surface of the fifth layer LY5. The seventh layer LY7 may be disposed directly on the lower surface of the fifth-first layer LY5-1. The seventh layer LY7 may include a first compound. The seventh layer LY7 may include the same compound as the first layer LY1, the second layer LY2, or the third layer LY3. As an example, the seventh layer LY7 may include silicon nitride. The seventh layer LY7 may be composed of the first compound. The seventh layer LY7 may be composed of silicon nitride. The seventh layer LY7 may have a packing density substantially the same as that of the first layer LY1 or the third layer LY3. The seventh layer LY7 may have a refractive index equal to or greater than about 1.78 and equal to or less than about 1.87 at a wavelength of about 550 nm. The seventh layer LY7, the first layer LY1, and the third layer LY3 may have a refractive index substantially the same as that of each other at a wavelength of about 550 nm. As an example, the refractive index of the seventh layer LY7 at a wavelength of about 550nm may be about 1.82. In the case where the refractive index of the seventh layer LY7 at a wavelength of about 550nm is greater than about 1.87, the chromatic aberration increases, and thus the optical properties of the window WM-2 deteriorate. In the case where the refractive index of the seventh layer LY7 at a wavelength of about 550nm is less than about 1.78, the filling density is too low, and thus the difficulty of the manufacturing process increases. The seventh layer LY7 may be directly disposed on the sixth layer LY6. The second layer LY2 having a relatively high refractive index may be disposed on the first layer LY1 having a relatively low refractive index, the third layer LY3 having a relatively low refractive index may be disposed on the second layer LY2, the sixth layer LY6 having a relatively high refractive index may be disposed on the third layer LY3, and the seventh layer LY7 having a relatively low refractive index may be disposed on the sixth layer LY6. Therefore, the window WM-2 and the display device DD including the window WM-2 may have low reflection properties, wear resistance properties, and scratch resistance properties, and the window WM-2 may be thinner than a conventional low reflection window. As a result, the difficulty of the manufacturing process of the display device DD can be reduced. The seventh layer LY7 may have a thickness d7 equal to or greater than about 15 nm and equal to or less than about 19 nm. As an example, the thickness d7 of the seventh layer LY7 may be about 17.30 nm. In the case where the thickness d7 of the seventh layer LY7 is greater than about 19 nm, the chromatic aberration increases and the optical properties of the window WM-2 deteriorate. In the case where the thickness d7 of the seventh layer LY7 is less than about 15 nm, the durability and scratch resistance of the window WM-2 deteriorate. The seventh layer LY7 may be deposited by a sputtering process.

[0131] Hereinafter, the results of evaluating the optical characteristics, durability, and scratch resistance of the window in terms of reflectivity, transmittance, color difference, and hardness will be described in detail.

[0132] The window according to Embodiment Example 1 has a structure in which a first layer is provided on a member including glass, a second layer is provided on the first layer, a third layer is provided on the second layer, a fifth layer is provided on the third layer, and a fourth layer is provided on the fifth layer. The first layer included in the window of Embodiment Example 1 includes Si 3 N 4 and has a thickness of about 85.48 nm. The second layer included in the window of Example 1 includes Si 3 N 4 and has a thickness of about 133.69 nm. The third layer included in the window of Example 1 includes Si 3 N 4 The first layer, the second layer, and the third layer are deposited by a sputtering method, and the first layer and the third layer have a packing density corresponding to about 75% of the packing density of the second layer. The refractive index of the first layer and the third layer at a wavelength of about 550 nm is measured to be about 1.78, and the refractive index of the second layer at a wavelength of about 550 nm is measured to be about 2.04. The fifth layer includes SiO 2 And has a thickness of about 85.49nm. The fifth layer is deposited by a thermal evaporation method. The refractive index of the fifth layer at a wavelength of about 550nm is measured to be about 1.48. The fourth layer may include perfluoropolyether (PFPE) and has a thickness of about 25nm. The fourth layer is deposited by a thermal evaporation method. The refractive index of the fourth layer at a wavelength of about 550nm is measured to be about 1.48. Except that the first and third layers have a packing density corresponding to about 80% of the packing density of the second layer and have a refractive index of about 1.82, the window according to Example 2 of Embodiment is formed in the same manner as the window of Example 1 of Embodiment. Except that the first and third layers have a packing density corresponding to about 85% of the packing density of the second layer and have a refractive index of about 1.87, the window according to Example 3 of Embodiment is formed in the same manner as the window of Example 1 of Embodiment. Except that the first and third layers have a packing density corresponding to about 70% of the packing density of the second layer and have a refractive index of about 1.73, the window according to Comparative Example 1 is formed in the same manner as the window of Example 1 of Embodiment. The window according to Comparative Example 2 was formed identically to the window of Embodiment Example 1, except that the first layer and the third layer had a packing density corresponding to about 90% of the packing density of the second layer and had a refractive index of about 2.00.

[0133] In order to evaluate the optical properties according to the refractive index of the first layer, the second layer and the third layer of the window, the reflectivity, transmittance and color difference were measured by adjusting the packing density of the first layer, the second layer and the third layer and the refractive index based on a wavelength of about 550nm, and the results are shown in Table 1 below. As the reflectivity becomes lower and the transmittance becomes higher, the low reflection property is improved, and when the color difference is equal to or less than about 2.0, the color reproducibility is considered to be excellent. The color difference is the difference ((ΔL*)) observed at an incident illumination angle in a range of about 0 degrees to about 60 degrees relative to normal incidence under an International Commission on Illumination (CIE) illuminant selected from the group consisting of the following items 2 +(a* 2 -a* 1 ) 2 +(b* 2 -b* 1 ) 2 ) 0.5 The obtained values ​​are: A series light source, B series light source, C series light source, D series light source and F series light source. L* represents the brightness in the CIE color coordinate system, a* 1 and b* 1 represents the color coordinate when viewed from normal incidence, a* 2 and b* 2 Indicates the color coordinates when viewed from the angle of incident illumination.

[0134] Table 1

[0135] Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Reflectivity(%) 4.72 4.71 4.61 4.68 6.03 Transmittance (%) 95.19 95.23 95.30 5.07 93.91 L* 26.50 26.66 26.90 26.69 28.78 a* -0.90 -0.39 0.10 -0.97 2.89 b* -1.80 -1.76 -1.63 -1.62 -0.54 Chromatic Aberration 2.02 1.80 1.64 1.89 2.94

[0136] Referring to Table 1, compared with Comparative Example 2, Example 1 to Example 3 have low reflectivity and have excellent optical properties as a low reflective layer. In addition, Comparative Example 2 has a color difference significantly exceeding two (2), so the color reproducibility of Comparative Example 2 is not excellent, but Example 1 to Example 3 have a color difference of approximately 2 or less than 2, so the color reproducibility of Example 1 to Example 3 is excellent. Compared with Example 1 to Example 3, Comparative Example 1 does not show a significant difference in reflectivity and color difference. However, since the difficulty of the manufacturing process of setting the refractive index of the first layer to the third layer to about 1.73 by adjusting the packing density increases, Comparative Example 1 is not suitable for large-scale production.

[0137] In order to evaluate the optical characteristics according to the thickness of the first layer, the second layer and the third layer of the window, the reflectivity, transmittance and color difference were measured by adjusting the thickness of the first layer, the second layer and the third layer based on a wavelength of about 550 nm, and the results are shown in the following Table 2. The window of Example 2 is the same as the window of Example 2 shown in Table 1. The window of Comparative Example 4 is the same as the window of Example 2, except that the first layer, the second layer, the third layer and the fifth layer have thicknesses of about 70 nm, about 115 nm, about 10 nm and about 70 nm, respectively. The window of Comparative Example 5 is the same as the window of Example 2, except that the first layer, the second layer, the third layer and the fifth layer have thicknesses of about 100 nm, about 152 nm, about 30 nm and about 100 nm, respectively. Regarding reflectivity, transmittance, color difference, L*, a* 1 , b* 1 , a* 2 and b* 2 The description is basically the same as that in reference table 1.

[0138] Table 2

[0139] Comparison Example 4 Example 2 Comparative Example 5 Reflectivity(%) 5.73 4.71 7.67 Transmittance (%) 94.20 95.23 92.28 L* 28.84 26.66 30.77 a* 10.93 -0.39 3.40 b* -18.73 -1.76 7.17 Chromatic Aberration 21.68 1.80 7.93

[0140] Referring to Table 2, Example 2 has a low reflectivity and has excellent optical characteristics as a low reflective layer compared to Comparative Examples 4 and 5. In addition, Comparative Examples 4 and 5 have a color difference significantly exceeding two (2), and therefore, the color reproducibility of Comparative Examples 4 and 5 is not excellent, but Example 2 has a color difference less than 2, and therefore, the color reproducibility of Example 2 is excellent.

[0141] In order to evaluate the durability and scratch resistance of the window, the hardness Gpa of the window of Example 2 and the hardness Gpa of the window of Comparative Example 6 (shown in Tables 1 and 2) were measured by the Berkovich indenter hardness (Gpa) test based on indentation depths of about 100 nm and about 150 nm, and the results are shown in the following Table 3. The window of Comparative Example 6 includes a member including glass, and does not include the above-mentioned first to fifth layers.

[0142] Table 3

[0143]

[0144] Referring to Table 3, Embodiment Example 2 has excellent hardness at two indentation depths compared to Comparative Example 6. Therefore, Embodiment Example 2 has improved durability and scratch resistance properties compared to Comparative Example 6.

[0145] Although the present disclosure has been described with reference to the embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications can be made thereto without departing from the scope and spirit of the present disclosure as set forth in the following claims.

Claims

1. A window, comprising: Base layer; A first layer, disposed on the base layer; a second layer, disposed on the first layer; as well as A third layer is provided on the second layer, wherein each of the first layer, the second layer, and the third layer comprises a first compound, and when a ratio of an actual volume of a material to a total volume occupied by the material is defined as a packing density and the actual volume is defined by subtracting a void volume from the total volume, each of the first layer and the third layer has a packing density of 75% to 85% of the packing density of the second layer.

2. The window according to claim 1, wherein: The first compound includes one of silicon nitride, silicon oxide, aluminum oxide, aluminum nitride oxide, silicon nitride oxide, silicon aluminum nitride oxide, niobium oxide, aluminum nitride, magnesium fluoride, magnesium oxide, titanium oxide, germanium oxide, magnesium aluminum oxide, barium fluoride, calcium fluoride, dysprosium fluoride, ytterbium fluoride, yttrium fluoride, cerium fluoride, tantalum oxide, hafnium oxide, zirconium oxide, yttrium oxide, molybdenum oxide and diamond-like carbon.

3. The window according to claim 1, wherein: The first compound includes silicon nitride.

4. The window according to claim 1, wherein: Each of the first layer, the second layer, and the third layer is composed of the first compound.

5. The window according to claim 1, wherein: The packing density of the first layer is equal to the packing density of the third layer.

6. The window according to claim 1, wherein: The packing density of each of the first layer and the third layer is 80% of the packing density of the second layer.

7. The window according to claim 1, wherein: Each of the first layer and the third layer has a refractive index equal to or greater than 1.78 and equal to or less than 1.87 at a wavelength of 550 nm, and the second layer has a refractive index equal to or greater than 1.98 and equal to or less than 2.15 at a wavelength of 550 nm.

8. The window according to claim 1, wherein: The first layer and the third layer have the same refractive index as each other at a wavelength of 550 nm.

9. The window according to claim 1, wherein: The second layer is disposed directly on the first layer, and the third layer is disposed directly on the second layer.

10. The window according to claim 1, wherein: The first layer has a thickness equal to or greater than 78 nm and equal to or less than 94 nm, the second layer has a thickness equal to or greater than 120 nm and equal to or less than 146 nm, and the third layer has a thickness equal to or greater than 15 nm and equal to or less than 19 nm.

11. The window of claim 1 further comprising a fourth layer disposed on the third layer and comprising a perfluoropolyether.

12. The window according to claim 11, wherein The fourth layer has a thickness equal to or greater than 20 nm and equal to or less than 30 nm. 13 . The window according to claim 11 , further comprising a fifth layer disposed between the third layer and the fourth layer and having a refractive index equal to or greater than 1.43 and equal to or less than 1.52 at a wavelength of 550 nm.

14. The window according to claim 13, wherein: The fifth layer includes: A fifth-first layer, disposed on the third layer; and The fifth-second layer is arranged between the fifth-first layer and the fourth layer.

15. The window according to claim 14, wherein: The fifth-first layer has a planar structure, and the fifth-second layer has a columnar structure. 16 . The window according to claim 1 , further comprising a sixth layer disposed on the third layer, comprising the first compound, and having the same packing density as that of the second layer.

17. A display device, comprising: Display module; as well as A window is arranged on the display module, the window comprising: a first layer arranged on the display module; a second layer arranged on the first layer; and a third layer arranged on the second layer. wherein each of the first layer, the second layer, and the third layer comprises the same compound, and when the ratio of the actual volume of the material to the total volume occupied by the material is defined as the packing density and the actual volume is defined by subtracting the void volume from the total volume, each of the first layer and the third layer has a packing density of 75% to 85% of the packing density of the second layer.

18. The display device according to claim 17, wherein: The display module comprises: base substrate; A circuit layer is arranged on the base substrate; a light emitting element layer, comprising light emitting elements and disposed on the circuit layer; and The anti-reflection layer includes a color filter overlapped with the light emitting element and disposed on the light emitting element layer. 19 . The display device according to claim 17 , further comprising a fourth layer disposed on the third layer and comprising perfluoropolyether.

20. The display device according to claim 19, wherein: An upper surface of the fourth layer defines an outermost surface of the window.

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