An automatic packaging equipment for TVS chip production

Abstract

The present invention relates to the field of chip packaging, and discloses an automatic packaging device for TVS chip production, which includes two processes: impact and ejection. The impact mechanism of the present invention moves synchronously with the upper mold through a connecting mechanism when the upper mold descends. This descending movement charges the rubber ball. When the upper mold descends to close the mold with the lower mold, the connecting mechanism is transferred to the ejection mechanism. At this time, the restriction of the impact mechanism is released, and the charged rubber ball is released to hit the ear block of the lower mold, thereby causing the lower mold to shake slightly. This shaking can shake the epoxy resin in the mold groove without causing structural damage, which is equivalent to shaking the epoxy resin, thereby avoiding bubbles inside the epoxy resin. When the epoxy resin is cured, since the connecting mechanism has been transferred to the ejection mechanism, the ejection mechanism will synchronously drive the ejection plate to move upward during the process of the upper mold rising and opening, so that the top plate can eject the cured product from the mold groove.

Description

Technical Field

[0001] The invention belongs to the field of chip packaging, and in particular relates to automatic packaging equipment for TVS chip production. Background Art

[0002] TVS chip refers to transient voltage suppressor diode chip. It is a semiconductor device used to protect electronic circuits from transient voltage shocks (such as electrostatic discharge, lightning induction, electrical fast transients, etc.). TVS chip can clamp overvoltage to a safe level in a short time, thereby protecting sensitive electronic components.

[0003] For the packaging process, after wafer cutting, die bonding and wire bonding, a plastic packaging machine is used to encapsulate the chip, bonding wires and part of the lead frame in materials such as epoxy resin to provide physical protection, moisture-proof and electrical insulation for the chip. In the above process, the epoxy resin will produce bubbles due to reasons such as too fast stirring with the curing agent, the release of dissolved gas in the epoxy resin during temperature curing, and the rough or porous surface of the packaging material releasing gas or air. The bubbles will weaken the structural strength of the epoxy resin, resulting in problems such as decreased mechanical properties and decreased insulation properties of the material. Summary of the invention

[0004] 1. Technical problem to be solved: How to avoid the generation of bubbles when using epoxy resin for encapsulation.

[0005] (II) Technical solution: The present invention provides an automatic packaging equipment for TVS chip production, including a main structure and an improved structure. The main structure includes a bottom frame, the top four corners of the bottom frame are connected to longitudinal rods, a lower mold located above the bottom frame is fixed on multiple longitudinal rods, a mold groove is opened on the top of the lower mold, an upper mold movably penetrated with the longitudinal rods is arranged above the lower mold, a top frame fixed to the top of the longitudinal rods is arranged above the upper mold, and a driving mechanism for driving the upper mold to rise and fall along the longitudinal rods is arranged on the top frame; the improved structure includes a top plate located at the bottom end of the mold groove and two connecting plates symmetrically arranged below the lower mold, each connecting plate has two rubber balls symmetrically connected to the top of the front and back, and multiple connecting plates are provided. The rubber balls are symmetrically distributed on the outer front side and the outer back side of the lower mold. At the same time, the outer side of the lower mold is connected with a plurality of ear blocks located directly above the rubber balls. In addition, a cooperative component is also arranged above the base frame, and the cooperative component includes a connecting mechanism, an impact mechanism and a pushing mechanism. The impact mechanism moves synchronously with the upper mold when the upper mold descends through the connecting mechanism, thereby charging the rubber balls. The pushing mechanism moves synchronously with the upper mold when the upper mold rises through the connecting mechanism, thereby driving the top plate to eject the solidified product in the mold groove, and after the connecting mechanism is transferred from the impact mechanism to the pushing mechanism, the charged rubber balls are released, thereby hitting the ear blocks, so that the epoxy resin in the mold groove is shaken evenly.

[0006] Furthermore, the impact mechanism includes two vertical rods symmetrical about the mold groove. The vertical rod passes through the upper mold and the lower mold and is fixed to the connecting plate at its bottom end. A spring is arranged between the connecting plate and the lower mold and is sleeved on the outside of the vertical rod. The top end of the spring is fixed to the bottom end of the lower mold, and the bottom end of the spring is fixed to the connecting plate.

[0007] Furthermore, the ejection mechanism includes two vertical rods 2 which are symmetrical about the mold groove and located outside the vertical rod 1. The bottom ends of the two vertical rods 2 are connected to a connecting frame, and a ejector pin is installed on the top of the connecting frame. The ejector pin passes through the bottom end of the lower mold to the mold groove and is connected to the bottom end of the top plate.

[0008] Furthermore, a plurality of ejector pins are provided, and the plurality of ejector pins are evenly distributed within a range not exceeding the mold cavity, so that the force exerted by the ejector pins on the ejector plate is even.

[0009] Furthermore, the connecting plate is located in the vacant area of ​​the connecting frame, and the two do not contact or interfere with each other.

[0010] Furthermore, the connecting mechanism includes a support arranged between each group of vertical rods one and two and fixed to the top of the upper mold, a horizontal through pipe is installed on the top of the support, a horizontal long groove is penetrated through the top of the through pipe, and a plurality of engaging grooves are penetrated through the top of the through pipe that are evenly distributed along its length direction and vertically connected to the long groove, a engaging rod is inserted into the inside of the through pipe, and a engaging block is fixed to the outside of the engaging rod, and the engaging block can slide along the long groove and engage with the engaging groove by changing its position; in addition, engaging holes that can be inserted with the engaging rod are penetrated through the vertical rods one and two.

[0011] Furthermore, the driving mechanism includes a cylinder consisting of a connecting end and a telescopic end, wherein the connecting end is fixed to the bottom end of the top frame, the telescopic end is inserted into the connecting end, and its bottom end is fixed to the top end of the upper mold.

[0012] Furthermore, a hollow elastic tube can be installed between the connecting plate and the rubber ball. The elastic tube has a certain supporting force and can support the rubber ball.

[0013] (III) Technical Effects:

[0014] 1. In the present invention, the impact mechanism moves synchronously with the upper mold through the connecting mechanism when the upper mold descends. This descending movement will charge the rubber ball. When the upper mold descends to close the mold with the lower mold, the connecting mechanism is transferred to the ejection mechanism. At this time, the restriction of the impact mechanism is released, and the charged rubber ball is released to hit the ear block of the lower mold, thereby causing the lower mold to shake slightly. This shaking can shake the epoxy resin in the mold groove without causing structural damage, which is equivalent to shaking the epoxy resin evenly, thereby avoiding the generation of bubbles inside the epoxy resin. When the epoxy resin is cured, since the connecting mechanism has been transferred to the ejection mechanism, the ejection mechanism will synchronously drive the ejection plate to move upward during the process of the upper mold rising and opening, so that the ejection plate can eject the cured product from the mold groove.

[0015] 2. In the present invention, a hollow elastic tube can be installed between the rubber ball and the connecting plate. Since the elastic tube is hollow, it does not increase much weight, and it can also support the rubber ball, so that the rubber ball can be propped up to a certain height. In this way, the distance between the rubber ball and the ear block can be shortened, avoiding the problem that the rubber ball is insufficiently charged and cannot hit the ear block. Since the added hollow elastic tube is relatively easy to obtain, the height of the hollow elastic tube can be adjusted multiple times according to actual use conditions, so that it can adapt to the impact process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0018] Figure 2 It is a schematic diagram of the driving mechanism structure of the present invention;

[0019] Figure 3 It is a schematic diagram of the top view of the rubber ball and the connecting frame of the present invention;

[0020] Figure 4 It is a schematic diagram of the mold groove structure of the present invention;

[0021] Figure 5 It is a schematic diagram of the structure of the engaging rod and the engaging block of the present invention;

[0022] Figure 6 It is a schematic diagram of the connection mechanism structure of the present invention;

[0023] In the accompanying drawings: 1, base frame; 2, longitudinal rod; 3, lower mold; 4, upper mold; 5, top frame; 6, driving mechanism; 601, connecting end; 602, telescopic end; 7, mold groove; 8, top plate; 9, connecting plate; 10, rubber ball; 11, ear block; 12, cooperative component; 1201, connecting mechanism; 120101, support; 120102, through pipe; 120103, long groove; 120104, engaging groove; 120105, engaging rod; 120106, engaging block; 120107, engaging hole; 1202, impact mechanism; 120201, vertical rod one; 120202, spring; 1203, ejector mechanism; 120301, vertical rod two; 120302, connecting frame; 120303, ejector pin. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0025] The automatic packaging equipment for TVS chip production provided in this specific embodiment is as follows: Figure 1 As shown, it includes a main structure and an improved structure, wherein:

[0026] The main structure includes a bottom frame 1, the top four corners of the bottom frame 1 are connected to longitudinal rods 2, and a lower mold 3 located above the bottom frame 1 is fixed on the longitudinal rods 2. The top of the lower mold 3 is provided with a mold groove 7, and an upper mold 4 is arranged above the lower mold 3 to movably penetrate the longitudinal rods 2. A top frame 5 is arranged above the upper mold 4 and fixed to the top of the longitudinal rods 2. A driving mechanism 6 for driving the upper mold 4 to rise and fall along the longitudinal rods 2 is arranged on the top frame 5. Figure 2 As shown, the driving mechanism 6 includes a cylinder consisting of a connecting end 601 and a telescopic end 602, wherein the connecting end 601 is fixed to the bottom end of the top frame 5, and the telescopic end 602 is inserted into the connecting end 601, and its bottom end is fixed to the top end of the upper mold 4. Since the upper mold 4 is penetrated by multiple longitudinal rods 2, the upper mold 4 can be raised and lowered, that is, the mold closing and mold opening process can be realized through this cylinder.

[0027] The improved structure includes a top plate 8 located at the bottom end of the mold groove 7 and two connecting plates 9 symmetrically arranged below the lower mold 3. The top of each connecting plate 9 is symmetrically connected to two rubber balls 10. The multiple rubber balls 10 are symmetrically distributed on the outside of the front and back of the lower mold 3. Specifically, there are four rubber balls 10 in total. Among the four, two are on the back of the lower mold 3 and two are on the front. None of them contacts the lower mold 3. Correspondingly, multiple ear blocks 11 located directly above the rubber balls 10 are connected to the outside of the lower mold 3. The ear blocks 11 are used to cooperate with the rubber balls 10. The specific cooperation is described below. In addition, a cooperative component 12 is also arranged above the base frame 1. This cooperative component 12 includes a connecting mechanism 1201, an impact mechanism 1202 and a push mechanism 1203. Wherein: the impact mechanism 1202 moves synchronously with the upper mold 4 through the connection mechanism 1201 when the upper mold 4 descends, thereby charging the rubber ball 10; the ejection mechanism 1203 moves synchronously with the upper mold 4 through the connection mechanism 1201 when the upper mold 4 rises, thereby driving the ejector plate 8 to eject the solidified product in the mold groove 7, and, after the connection mechanism 1201 is transferred from the impact mechanism 1202 to the ejection mechanism 1203, the charged rubber ball 10 is released, thereby hitting the ear block 11, so that the epoxy resin in the mold groove 7 is shaken evenly. The time when the connection mechanism 1201 is transferred is after the upper mold 4 descends to the mold closing with the lower mold 3. After the transfer of the connection mechanism 1201, the impact mechanism 1202 is released from the restriction, so the charged rubber ball 10 will hit the ear block 11 upward.

[0028] In general, the equipment is mainly composed of a main structure and an improved structure. The main structure includes a base frame 1, a longitudinal rod 2, a lower mold 3, an upper mold 4, a top frame 5 and a driving mechanism 6. The four corners of the base frame 1 are connected to the longitudinal rod 2, the lower mold 3 is fixed on the longitudinal rod 2, and the upper mold 4 is lifted and lowered along the longitudinal rod 2 by the driving mechanism 6 to achieve mold closing and mold opening. The driving mechanism 6 is composed of a cylinder, the connecting end 601 is fixed on the top frame 5, and the telescopic end 602 is connected to the upper mold 4. The improved structure includes a top plate 8 at the bottom end of the mold groove 7, a connecting plate 9 under the lower mold 3, a rubber ball 10 and an ear block 11. The rubber ball 10 is distributed on the front and back of the lower mold 3, and cooperates with the ear block 11 on the outside of the lower mold 3. The collaborative components include a connecting mechanism 1201, an impact mechanism 1202 and a push mechanism 1203. The impact mechanism 1202 moves synchronously with the upper mold 4 when it descends, charging the rubber ball 10; the ejection mechanism 1203 moves synchronously with the upper mold 4 when it rises, ejecting the cured product in the mold groove 7. When the connecting mechanism 1201 is transferred from the impact mechanism 1202 to the ejection mechanism 1203, the charged rubber ball 10 is released and hits the ear block 11, so that the epoxy resin in the mold groove 7 is evenly distributed. The transfer of the connecting mechanism 1201 occurs after the upper mold 4 and the lower mold 3 are closed, ensuring that the energy of the rubber ball 10 is released at the right time. This design realizes an automated packaging process through ingenious mechanical structure and motion synchronization, improving production efficiency and product quality. The innovation of the equipment lies in using the charging and release of the rubber ball 10 to assist the operation of the mold and ensure the uniform distribution of the epoxy resin.

[0029] The following is a detailed description of the three mechanisms in the collaborative component 12:

[0030] For the impact mechanism 1202, if Figure 1As shown, the impact mechanism 1202 includes two vertical rods 120201 symmetrical about the die groove 7. The vertical rod 120201 penetrates the upper die 4 and the lower die 3 and is fixed to the connecting plate 9 at its bottom end. A spring 120202 is provided between the connecting plate 9 and the lower die 3 and is sleeved on the outside of the vertical rod 120201. The top of the spring 120202 is fixed to the bottom end of the lower die 3, and the bottom end is fixed to the connecting plate 9. In this way, when the upper die 4 moves downward, the vertical rod 120201 is synchronously driven to move downward. In this process, the spring 120202 is stretched, and the energy of the rubber ball 10 comes from the stretching of the spring 120202. Because after the upper die 4 and the lower die 3 are closed, the connecting mechanism 1201 is separated from the impact mechanism 1202, which is equivalent to releasing the connection between the vertical rod 120201 and the upper die 4 in the impact mechanism 1202. Therefore, the spring 120202 will reset and move upward, thereby driving the connecting plate 9 and the rubber ball 10 upward, so that the rubber ball 10 hits the ear block 11. It is worth mentioning that, although the connection between the vertical rod 120201 and the upper mold 4 is released, the whole composed of the vertical rod 120201, the spring 120202, the connecting plate 9 and the rubber ball 10 will not fall downward, because the top of the spring 120202 is connected to the bottom of the lower mold 3, and the bottom is connected to the connecting plate 9. Although this whole has a certain weight and will be pulled downward under the action of gravity, since the spring 120202 needs to reset upward, the movement of this whole is still upward. In addition, a hollow elastic tube can be installed between the rubber ball 10 and the connecting plate 9. While this elastic tube does not increase much weight due to its hollowness, it can also support the rubber ball 10, so that the rubber ball 10 can be propped up to a certain height. In this way, the distance between the rubber ball 10 and the ear block 11 can be shortened, avoiding the problem that the rubber ball 10 is insufficiently charged and cannot hit the ear block 11. Since the added hollow elastic tube is relatively easy to obtain, the height of the hollow elastic tube can be adjusted multiple times according to actual usage so that it can adapt to the impact process.

[0031] For the jacking mechanism 1203, Figure 1 and Figure 4As shown, the ejection mechanism 1203 includes two vertical rods 120301 symmetrically about the mold groove 7 and located outside the vertical rod 1 120201, and the two vertical rods are in the same horizontal direction. The bottom ends of the two vertical rods 120301 are connected to a connecting frame 120302, and the top of the connecting frame 120302 is equipped with an ejector pin 120303, which passes from the bottom end of the lower mold 3 to the mold groove 7 and is connected to the bottom end of the ejector plate 8. In this way, after the connecting mechanism 1201 is transferred to the ejection mechanism 1203, when the upper mold 4 is opened upward, the vertical rod 120301, the connecting frame 120302 and the ejector pin 120303 will be synchronously driven upward, so that the ejector pin 120303 can lift the ejector plate 8, and the ejector plate 8 can be used to eject the solidified product from the mold groove 7. It is worth mentioning that: first, there are multiple ejector pins 120303, and the multiple ejector pins 120303 are evenly distributed within the range not exceeding the die groove 7, so that the force of the ejector pins 120303 to push the ejector plate 8 is uniform; second, as Figure 3 As shown, the connecting plate 9 is located in the vacant area of ​​the connecting frame 120302, and the two do not contact or interfere with each other.

[0032] For the connection mechanism 1201, Figure 1 , Figure 5 and Figure 6As shown, the connection mechanism 1201 includes a support 120101 which is arranged between each set of vertical rods 1 120201 and vertical rods 2 120301 and fixed to the top of the upper mold 4, and a horizontal through pipe 120102 is installed on the top of the support 120101. The top of the through pipe 120102 is penetrated by a horizontal long groove 120103, and the top of the through pipe 120102 is also penetrated by a plurality of card slots evenly distributed along the length direction and vertically connected to the long groove 120103. The engaging groove 120104 and the through pipe 120102 are connected with the engaging rod 120105, and the outer side of the engaging rod 120105 is fixed with the engaging block 120106. The engaging block 120106 can slide along the long groove 120103 and engage with the engaging groove 120104 by changing its position. In addition, the vertical rod 1 120201 and the vertical rod 2 120301 are penetrated by engaging holes 120107 which can be connected with the engaging rod 120105. Under the initial condition, when the upper mold 4 has not yet descended, the engaging rod 120105 is engaged with the vertical rod 120201, that is, the connection mechanism 1201 is connected with the impact mechanism 1202; when the upper mold 4 descends to close the mold with the lower mold 3, the engaging rod 120105 slides to engage with the vertical rod 2 120301, that is, the connection mechanism 1201 is transferred to the push mechanism 1203. It is worth mentioning that the heights of the engaging holes 120107 on the vertical rod 1 120201 and the vertical rod 2 120301 must be different, because the engaging rod 120105 must follow the upper mold 4 to descend to close the mold with the lower mold 3 before it can engage with the engaging hole 120107 on the vertical rod 2 120301, so the height of the engaging hole 120107 on the vertical rod 2 120301 is lower than the engaging hole 120107 on the vertical rod 1 120201. Although the heights of the two are different, both the vertical rod 2 120301 and the vertical rod 1 120201 can pass through the upper mold 4 and the lower mold 3, and in the entire movement process, the overall position of the vertical rod 2 120301 will not shake because it is ultimately restricted by the top plate 8, and therefore will not deviate from the passage point of the mold; and for the vertical rod 1 120201, although it will shake due to the action of the spring 120202 after being separated from the connecting mechanism 1201, as long as the length of the vertical rod 1 120201 is sufficient and its top can always be higher than the upper mold 4, it will not deviate from the passage point of the mold.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automatic packaging device for TVS chip production, including a main structure and an improved structure, characterized in that: The main structure comprises a bottom frame (1), the top four corners of the bottom frame (1) are connected to longitudinal rods (2), a lower die (3) located above the bottom frame (1) is fixed on the plurality of longitudinal rods (2), a die groove (7) is provided on the top of the lower die (3), an upper die (4) movably penetrating the longitudinal rods (2) is arranged above the lower die (3), a top frame (5) fixed to the top of the longitudinal rods (2) is arranged above the upper die (4), and a driving mechanism (6) for driving the upper die (4) to rise and fall along the longitudinal rods (2) is arranged on the top frame (5); The improved structure comprises a top plate (8) located at the bottom end of the mold groove (7) and two connecting plates (9) symmetrically arranged below the lower mold (3). The top of each connecting plate (9) is symmetrically connected to two rubber balls (10) in a front-to-back manner. The plurality of rubber balls (10) are symmetrically distributed on the outer side of the front and back of the lower mold (3). At the same time, the outer side of the lower mold (3) is connected to a plurality of ear blocks (11) located directly above the rubber balls (10). In addition, a cooperative component (12) is also arranged above the base frame (1). The cooperative component (12) comprises a connecting mechanism (1201), an impact mechanism (1202) and a push mechanism (1203).

3. The impact mechanism (1202) moves synchronously with the upper mold (4) through the connecting mechanism (1201) when the upper mold (4) descends, thereby charging the rubber ball (10); the ejection mechanism (1203) moves synchronously with the upper mold (4) through the connecting mechanism (1201) when the upper mold (4) rises, thereby driving the ejector plate (8) to eject the solidified product in the mold groove (7), and after the connecting mechanism (1201) is transferred from the impact mechanism (1202) to the ejection mechanism (1203), the charged rubber ball (10) is released, thereby striking the ear block (11), so that the epoxy resin in the mold groove (7) is shaken evenly.

2. The automatic packaging equipment for TVS chip production according to claim 1, characterized in that: The impact mechanism (1202) comprises two vertical rods (120201) symmetrically arranged about the die groove (7); the vertical rod (120201) penetrates the upper die (4) and the lower die (3) and is fixed at its bottom end to the connecting plate (9); a spring (120202) sleeved on the outside of the vertical rod (120201) is arranged between the connecting plate (9) and the lower die (3); the top end of the spring (120202) is fixed to the bottom end of the lower die (3), and the bottom end of the spring (120202) is fixed to the connecting plate (9).

3. The automatic packaging equipment for TVS chip production according to claim 2, characterized in that: The ejection mechanism (1203) comprises two second vertical rods (120301) symmetrically about the die groove (7) and located outside the first vertical rod (120201); the bottom ends of the two second vertical rods (120301) are connected to a connecting frame (120302); the top end of the connecting frame (120302) is equipped with an ejector pin (120303); the ejector pin (120303) passes from the bottom end of the lower die (3) to the die groove (7) and is connected to the bottom end of the ejector plate (8).

4. The automatic packaging equipment for TVS chip production according to claim 3, characterized in that: A plurality of ejector pins (120303) are provided, and the plurality of ejector pins (120303) are evenly distributed within a range not exceeding the mold cavity (7), so that the force exerted by the ejector pins on the ejector plate (8) is uniform.

5. The automatic packaging equipment for TVS chip production according to claim 3, characterized in that: The connecting plate (9) is located in the vacant area of ​​the connecting frame (120302), and the two do not contact or interfere with each other.

6. The automatic packaging equipment for TVS chip production according to claim 3, characterized in that: The connecting mechanism (1201) comprises a support (120101) which is arranged between each set of vertical rods 1 (120201) and 2 (120301) and fixed to the top of the upper mold (4); a horizontal through pipe (120102) is installed at the top of the support (120101); a horizontal long groove (120103) is penetrated through the top of the through pipe (120102); and a plurality of engaging grooves (120103) are evenly distributed along the length direction thereof and are vertically connected to the long groove (120103) are penetrated through the top of the through pipe (120102). 120104), a locking rod (120105) is inserted into the interior of the through pipe (120102), a locking block (120106) is fixed to the outside of the locking rod (120105), and the locking block (120106) can slide along the long groove (120103) and can be locked with the locking groove (120104) by changing its position; in addition, a locking hole (120107) that can be inserted into the locking rod (120105) is opened through the vertical rod (120201) and the vertical rod (120301).

7. The automatic packaging equipment for TVS chip production according to claim 1, characterized in that: The driving mechanism (6) comprises a cylinder consisting of a connecting end (601) and a telescopic end (602), wherein the connecting end (601) is fixed to the bottom end of the top frame (5), and the telescopic end (602) is inserted into the connecting end (601), and its bottom end is fixed to the top end of the upper mold (4).

8. The automatic packaging equipment for TVS chip production according to claim 1, characterized in that: A hollow elastic tube can be installed between the connecting plate (9) and the rubber ball (10); the elastic tube has a certain supporting force and is capable of supporting the rubber ball (10).

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