A die bonding machine with dispensing and debugging functions

Abstract

The present application discloses a die bonding machine with a dispensing and debugging function, which relates to the technical field of semiconductor packaging equipment, and includes a dispensing mechanism, a wafer mechanism, a swing arm mechanism, and a solid material mechanism, wherein the dispensing mechanism has a unique adjustment component design, and accurately controls the dispensing amount and position through components such as sliding variable resistance elements, ejector pins, and preload springs. In addition, the dispensing mechanism is also equipped with a positioning component, a glue spreading component, and a probe component, which ensures the stability and accuracy of the dispensing head debugging process.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor packaging equipment, and in particular to a die bonding machine with a dispensing and debugging function. Background Art

[0002] The die bonder is one of the important equipment in the semiconductor manufacturing process. It is mainly used to accurately install the chips cut from the wafer onto the base, and to apply glue to the base before installing the chips. The chips are placed on the base and bonded with glue. With the continuous miniaturization and integration of semiconductor devices, the precision requirements of the die bonder process are getting higher and higher. The existing die bonders need to be debugged before they are put into production. When debugging the glue dispensing, the glue dispensing height is judged by human eyes and experience, and the glue dispensing height cannot be accurately confirmed. In this way, when the glue dispensing head descends to a small height, it is easy to cause insufficient glue, resulting in a failure of the die bonder; when the glue dispensing head descends to a large height, it is easy to cause the glue dispensing head to wear too quickly and the glue amount is too much, resulting in increased costs. This method is not only inefficient, but also easy to cause uneven glue dispensing, which in turn affects the quality and reliability of the chip.

[0003] In order to improve the accuracy and stability of dispensing, the common technical means at present is to use an air pressure regulating device to control the pressure of the dispensing head, and to achieve different dispensing forces by adjusting the air pressure. Although this method can improve the accuracy of dispensing to a certain extent, it still has some shortcomings in practical applications. The air pressure regulating device is greatly affected by environmental factors and is prone to fluctuations. Therefore, how to improve the stability of the regulating device while ensuring the accuracy of dispensing has become a technical problem that needs to be solved urgently. Summary of the invention

[0004] In order to overcome the above-mentioned technical problems, the present application provides a die bonding machine with a dispensing and debugging function.

[0005] The present application provides a die bonding machine with dispensing and debugging functions, which adopts the following technical solutions:

[0006] A crystal bonding machine with a dispensing and debugging function comprises a dispensing mechanism, a wafer mechanism, a swing arm mechanism and a solid material mechanism, wherein the wafer mechanism comprises a wafer disk, the solid material mechanism comprises a transfer base, a solid material disk is fixedly arranged on the transfer base, the swing arm mechanism comprises a turret arranged between the solid material disk and the wafer disk, a wafer suction head is fixedly arranged at the end of the turret, the dispensing mechanism comprises a dispensing arm and an adjustment component, a shell is arranged at the bottom of the dispensing arm, a limit slot is arranged at the bottom of the shell, a dispensing head is movably arranged in the limit slot, the adjustment component comprises a sliding variable resistance element arranged in the shell, a linear guide is fixedly arranged on the inner wall of the shell, a guide groove is arranged on the linear guide, the adjustment component also comprises a pin slidably arranged in the guide groove, the pin is arranged in a U shape, the pin comprises a contact end at the top and a fixed end at the bottom, the fixed end is fixedly connected to the top of the dispensing head, and the contact end is in sliding contact with the surface of the sliding variable resistance element.

[0007] By adopting the above technical solution, using ejector pins, preload springs and sliding variable resistance elements, when dispensing debugging is required, the dispensing head will repeatedly move up and down during the dispensing process, thereby driving the ejector pin to slide along the guide groove, causing relative movement between the contact end of the ejector pin and the sliding variable resistance element, thereby changing the resistance value of the sliding variable resistance element. This setting enables the device to calculate the difference in actual displacement of the dispensing head based on the difference in resistance before and after. The distance between the current position of the dispensing head and the target position that needs to be adjusted can be calculated in the system program. In this process, by adjusting the setting of the component, it can provide more stable feedback during use, is less affected by external temperature and air pressure, and has higher stability.

[0008] In a specific possible implementation scheme, through grooves are oppositely opened on both sides of the limit slot to form an adjustment slot, an adjustment seat is fixed on the adjustment slot by bolts, and a preload spring is arranged between the adjustment seat and the dispensing head.

[0009] By adopting the above technical solution, the setting of the preload spring makes the preload force of the dispensing head adjustable, which expands the dispensing pressure range of the dispensing head and further expands the glue output range of the dispensing head. The operator can adjust the height of the adjustment seat through the bolt according to actual usage.

[0010] In a specific possible implementation scheme, a high-precision ball screw assembly is provided between the dispensing arm and the housing, and a sliding connection is provided between the housing and the dispensing arm via a slide rail.

[0011] By adopting the above technical solution, the high-precision ball screw assembly is used to enable the system to automatically control the distance between the housing and the dispensing arm, thereby adjusting the height of the dispensing head.

[0012] In a specific possible implementation scheme, the dispensing mechanism also includes a positioning component, which includes a slide rail cylinder fixedly arranged on the side wall of the dispensing arm, a guide rail seat being slidably arranged on the slide rail cylinder, and the positioning component also includes a positioning roller arranged on the guide rail seat.

[0013] By adopting the above technical solution, the positioning roller is driven by the slide cylinder to extend downward. Before the dispensing process begins, the positioning roller is used to detect the contour of the solid material tray. The solid material tray is traced and mapped through the stroke of the transfer base, so that the equipment can obtain the size data of the solid material tray, thereby improving the accuracy of dispensing.

[0014] In a specific possible implementation scheme, the glue dispensing mechanism also includes a glue spreading assembly, which includes a glue guide seat arranged above the glue dispensing arm, and a glue guide plate is fixedly arranged at one end of the glue guide seat facing the glue dispensing head. The glue guide plate is horizontally arranged and has a glue guide groove on the top.

[0015] By adopting the above technical solution, the setting of the glue guide plate and the glue guide groove is used to clean the glue remaining on the glue dispensing head, so that the wafers of the same batch can be glued evenly.

[0016] In a specific possible implementation manner, a cavity is provided in the glue guiding seat to form a sol cavity, a heating element is provided in the sol, and a glue flow channel communicating with the glue guiding groove is provided in the sol cavity.

[0017] In a specific feasible implementation scheme, the glue spreading assembly also includes a glue spreading motor and a horizontal axis. A sliding hole is provided on the top of the glue guiding seat and is slidably connected to the horizontal axis. A return spring is sleeved on the horizontal axis and the return spring abuts against the glue guiding seat. A rotating push block is fixedly provided on the output shaft of the glue spreading motor, and the rotating push block is arranged to be elliptical.

[0018] By adopting the above technical solution, by setting the glue spreading component, by setting the glue flow channel, the glue flow channel is used to drain the residual glue, and drain the glue to the sol chamber for storage. The glue is heated to a constant temperature by the heating element in the sol chamber, which can prevent the glue from solidifying. The glue spreading motor cooperates with the elliptical rotating push block, and the setting of the reset spring enables the glue guide seat to continuously move back and forth. This movement mode cooperates with the glue dispensing arm to move up and down to dispense glue. When the glue dispensing arm moves up after dispensing glue, the rotating push block drives the glue guide seat to move so that the glue guide groove cleans the residual glue on the glue dispensing head.

[0019] In a specific feasible implementation scheme, a probe assembly is also fixedly provided on the dispensing arm, and the probe assembly includes a locking cylinder and a guide sleeve fixedly provided on the dispensing arm, a locking shaft is fixedly provided on the output shaft of the locking cylinder, the locking shaft is slidably provided in the guide sleeve, and an optical position sensor transmitter is fixedly provided on the outside of the guide sleeve.

[0020] In a specific possible implementation mode, a circular hole matching the lock shaft is opened on the turret to form a lock hole, and an optical position sensor receiver is fixedly arranged at the top of the turret at a position corresponding to the optical position sensor transmitter.

[0021] By adopting the above technical solution, the optical position sensor transmitter and the optical position sensor receiver are set up to accurately move the turret. When the turret moves to the bottom of the dispensing arm, the timing of the lock shaft extending can be controlled through the signals of the optical position sensor transmitter and the optical position sensor receiver. The lock shaft is used to lock the turret and press the turret down. This setting can ensure that the turret places the wafer adsorbed by the wafer suction head on the base at a predetermined position, thereby improving the accuracy of the wafer placement process.

[0022] In a specific possible implementation scheme, the swing arm mechanism also includes a guide column, the end of the turret is slidably connected to the guide column, a compression spring is sleeved on the guide column, and the top of the compression spring abuts against the turret.

[0023] By adopting the above technical solution, the compression spring is used to reset the turret, and the guide column plays a guiding role in the up and down movement of the turret.

[0024] In summary, the present application includes at least one of the following beneficial technical effects:

[0025] 1. Through the setting of the dispensing mechanism, the dispensing mechanism includes a dispensing arm and an adjustment component at its bottom, and the adjustment component includes a housing, a limit slot, an ejector pin, and a sliding variable resistance element. The dispensing head moves upward during the dispensing process, and this movement drives the ejector pin to slide in the guide groove, thereby changing the resistance value of the sliding variable resistance element. The system program can accurately calculate the height that the dispensing head needs to adjust according to the change in resistance value.

[0026] 2. Through the setting of the positioning component, the positioning component includes a slide rail cylinder and a positioning roller. The slide rail cylinder drives the positioning roller to pop out and detect the contour of the solid material tray, thereby obtaining the size data of the solid material tray and improving the accuracy of dispensing.

[0027] 3. Through the setting of the glue spreading component, the glue spreading component includes a glue guide seat, a glue guide plate and a glue guide groove. This component is used to clean the glue remaining on the glue dispensing head to ensure uniform glue dispensing of wafers in the same batch. In addition, the glue spreading component also has a glue flow channel and a sol chamber for draining and storing glue. Brief Description of the Drawings

[0028] Figure 1 is the front view of the embodiment of the present application;

[0029] Figure 2 is the top view of the embodiment of the present application;

[0030] Figure 3 is the rear view of the embodiment of the present application;

[0031] Figure 4 is the specific structural view of the guide post and the compression spring;

[0032] Figure 5 is the specific structural view of the glue spreading assembly;

[0033] Figure 6 is the specific structural view of the positioning assembly;

[0034] Figure 7 is the sectional view of the specific structure of the glue spreading assembly;

[0035] Figure 8 is the three-dimensional view of the dispensing mechanism;

[0036] Fig. 9 is the three-dimensional view of the adjusting assembly;

[0037] Fig.10 and Fig.11 is the sectional view of the adjusting assembly.

[0038] Description of the Reference Numerals: 1, dispensing arm; 11, linear guide rail; 111, guide groove; 12, ejector pin; 121, contact end; 122, fixed end; 13, sliding rheostat element; 14, dispensing head; 15, housing; 151, adjusting groove; 152, adjusting seat; 153, limiting card slot; 16, preloading spring; 17, high-precision ball screw assembly; 171, slide rail; 18, slide rail cylinder; 19, positioning roller; 20, guide rail seat; 21, glue guiding seat; 211, heating element; 212, glue guiding plate; 213, glue guiding groove; 214, glue flow channel; 215, sol cavity; 22, glue spreading motor; 23, rotating push block; 24, return spring; 25, horizontal axis; 31, crystal disk; 33, turret; 331, locking hole; 332, wafer suction head; 333, locking cylinder; 34, locking shaft; 35, guide sleeve; 36, optical position sensor transmitter; 37, optical position sensor receiver; 38, guide post; 39, compression spring; 42, solid material tray; 43, transfer base; 5, substrate; 51, base. Detailed Description of the Embodiment

[0039] The following further describes the present application in detail in conjunction with the attached Figure 1-11 drawings.

[0040] In the description of the invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the invention.

[0041] The present application embodiment discloses a die bonding machine with a dispensing debugging function, referring to Figures 1 to 3 A crystal bonding machine with a dispensing and debugging function includes a dispensing mechanism, a wafer mechanism, a swing arm mechanism and a solid material mechanism. The wafer mechanism includes a wafer disk 31, on which a cut wafer is placed. The solid material mechanism includes a transfer base 43, on which a solid material disk 42 is fixedly arranged. The solid material disk 42 is used to place a substrate 5. The substrate 5 is provided with a plurality of grooves to form a base 51, and the base 51 is used to install the wafer. A two-axis transfer platform is arranged at the bottom of the transfer base 43, and the two-axis transfer platform drives the transfer base 43 to move in the x-axis and y-axis directions. The swing arm mechanism includes a turret 33 arranged between the solid material disk 42 and the wafer disk 31, and a wafer suction head 332 is fixedly arranged at the end of the turret 33, and the wafer suction head 332 is set to be conventional. The wafer suction head 332 is used to absorb the wafer cut into small pieces. The dispensing mechanism includes a dispensing arm 1 and an adjustment component. A conventional driving device is arranged at the top of the dispensing arm 1, and the driving device can drive the dispensing arm 1 to move up and down. A housing 15 is provided at the bottom of the dispensing arm 1. The housing 15 is slidably connected to the dispensing arm 1 through a slide rail 171, so that the housing 15 can move up and down relative to the dispensing arm 1. A limit slot 153 is provided at the bottom of the housing 15. A dispensing head 14 is movably provided in the limit slot 153. The dispensing head 14 is used to apply glue. The dispensing head 14 is configured as a press-type dispensing head.

[0042] Reference Figures 9 to 11In order to enable the dispensing head 14 to be adjusted, the adjustment component includes a sliding variable resistance element 13 arranged in the shell 15, and the sliding variable resistance element 13 is composed of a spirally wound resistance wire. A linear guide rail 11 is fixedly arranged on the inner wall of the shell 15, and a guide groove 111 is opened on the linear guide rail 11. The adjustment component also includes a pin 12 slidably arranged in the guide groove 111, and the pin 12 is set in a U shape. The pin 12 includes a contact end 121 at the top and a fixed end 122 at the bottom. All parts of the pin 12 except the fixed end 122 and the contact end can slide in the guide groove 111. The fixed end 122 is fixedly connected to the top of the dispensing head 14, and the contact end 121 is set to a conductive material and is in sliding contact with the surface of the sliding variable resistance element 13. After the device is started, the contact end 121 will be energized. When the dispensing head 14 moves up and down in the limit slot 153, the ejector pin 12 moves synchronously with the movement of the dispensing head 14, so that the contact end 121 can slide along the surface of the sliding variable resistance element 13, and finally the resistance output by the sliding variable resistance element 13 changes. In order to enable the dispensing head 14 to quickly reset after moving upward, a preload spring 16 is provided in the limit slot 153. Through slots are provided on opposite sides of the limit slot 153 to form an adjustment slot 151, and an adjustment seat 152 is fixed on the adjustment slot 151 by bolts. The bolts and the adjustment slot 151 can be locked to fix the adjustment seat 152, and the bolts can slide up and down along the adjustment slot 151 to adjust the height of the adjustment seat 152. The preload spring 16 is arranged between the adjustment seat 152 and the dispensing head 14. The top of the preload spring 16 abuts against the adjustment seat 152, and the bottom abuts against the dispensing head 14. The preload spring 16 can adjust the preload force when the dispensing head 14 is pressed down, thereby adjusting the pressure when the dispensing head 14 contacts the wafer. A high-precision ball screw assembly 17 is arranged between the dispensing arm 1 and the housing 15. The high-precision ball screw assembly 17 is a conventional structure. Through the arrangement of the high-precision ball screw assembly 17, the relative position between the dispensing arm 1 and the housing 15 is adjustable, so as to facilitate the automatic dynamic adjustment of the dispensing head 14 during the working process.

[0043] Reference Figure 6The dispensing mechanism also includes a positioning component, which includes a slide cylinder 18 fixedly arranged on the side wall of the dispensing arm 1, and a guide rail seat 20 is slidably arranged on the slide cylinder 18. The positioning component also includes a positioning roller 19 arranged on the guide rail seat 20. The positioning component is arranged on the dispensing arm 1 and moves with the dispensing arm 1. Before dispensing, the motor drives the guide rail seat 20 to move downward, so that the positioning roller 19 extends. The two-axis transfer platform drives the transfer base 43 to move, so that the positioning roller 19 moves along the outline of the solid material tray 42. Since the two-axis transfer platform is controlled by the program, the contour of the solid material tray 42 can be mapped according to the moving path of the two-axis transfer platform under the rolling of the positioning roller 19. After the positioning roller 19 moves along the solid material tray 42, the equipment calculates the outline and size of the solid material tray 42, which is convenient for the equipment to accurately position.

[0044] Reference Figure 5 , Figure 7 and Figure 8 The glue dispensing mechanism also includes a glue spreading component, which includes a glue guide seat 21 arranged above the glue dispensing arm 1. This setting prevents the glue guide seat 21 from moving up and down with the glue dispensing arm 1. A glue guide plate 212 is fixedly arranged at one end of the glue guide seat 21 facing the glue dispensing head 14. The glue guide plate 212 is arranged horizontally and has a glue guide groove 213 on its top. The glue guide plate 212 extends toward the direction of the glue dispensing head 14. The size of the glue guide groove 213 is matched with the size of the glue dispensing head 14. A cavity is opened in the glue guide seat 21 to form a sol cavity 215. A heating element 211 is arranged in the sol cavity 215. The sol cavity 215 is opened with a glue flow channel 214 connected to the glue guide groove 213. The glue flow channel 214 is inclined toward the sol cavity 215, so that the glue can flow from the glue flow channel 214 into the sol cavity 215. The setting of the heating element 211 can prevent the glue from cooling and solidifying.

[0045] The glue spreading assembly also includes a glue spreading motor 22 and a horizontal axis 25. A sliding hole is provided on the top of the glue guide seat 21 to be slidably connected with the horizontal axis 25. A reset spring 24 is sleeved on the horizontal axis 25. One end of the reset spring 24 abuts against the glue guide seat 21. A rotating push block 23 is fixedly provided on the output shaft of the glue spreading motor 22. The rotating push block 23 is set to an ellipse. The rotating push block 23 is driven to rotate by the glue spreading motor 22. The rotating push block 23 is set to an ellipse. Each rotation will push the glue guide seat 21 to compress the reset spring 24 twice. The reset spring 24 pushes the glue guide seat 21 to reset twice under the action of its own elastic force, thereby driving the glue guide plate 212 to move toward the direction of the glue dispensing head 14, so that the glue dispensing head 14 can enter the glue guide groove 213, and the glue remaining on the glue dispensing head 14 is cleaned up by contacting the glue guide groove 213. The cleaned glue can flow into the sol chamber 215 along the glue flow channel 214.

[0046] Reference Fig.10, a probe assembly is also fixedly provided on the dispensing arm 1, and the probe assembly includes a locking cylinder 333 and a guide sleeve 35 fixedly provided on the dispensing arm 1. A locking shaft 34 is fixedly provided on the output shaft of the locking cylinder 333, and the locking shaft 34 is slidably inserted into the guide sleeve 35, and the locking cylinder 333 drives the locking shaft 34 to extend out of the guide sleeve 35. An optical position sensor transmitter 36 is fixedly provided on the outside of the guide sleeve 35. A circular hole matching the locking shaft 34 is provided on the turret 33 to form a locking hole 331, and an optical position sensor receiver 37 is fixedly provided on the top of the turret 33 at a position corresponding to the optical position sensor transmitter 36. When the turret 33 rotates to the bottom of the dispensing arm 1, the optical position sensor receiver 37 is aligned with the optical position sensor transmitter 36, and the device receives a signal to control the action of the locking cylinder 333, driving the locking shaft 34 to extend out of the guide sleeve 35 and insert into the locking hole 331. Refer to Figure 4 The swing arm mechanism also includes a guide column 38, the end of the turret 33 is slidably connected to the guide column 38, a compression spring 39 is sleeved on the guide column 38, the top of the compression spring 39 abuts against the turret 33, the lock shaft 34 is inserted into the lock hole 331, and the turret 33 is continuously pressed down to move the turret 33 downward, and the wafer suction head 332 moves downward with the turret 33 and places the wafer on the base 51. A rotation drive assembly is provided at the bottom of the guide column 38.

[0047] The implementation principle of the embodiment of the present application is: after starting the equipment, the positioning roller 19 is driven to extend out, the dispensing arm 1 moves, and the two-axis transfer platform drives the transfer base 43 to move, so that the solid material tray 42 moves close to the positioning roller 19, and the positioning roller 19 rolls along the contour of the solid material tray 42 for one circle to measure the size of the solid material tray 42.

[0048] Since the driving device is controlled by a program, the driving device drives the dispensing arm 1 to move up and down, and the dispensing head 14 contacts the base 51 and discharges glue, and the glue is applied inside the base 51. When dispensing debugging is required, since the dispensing head 14 is not adapted to the height of the base 51 before the height is adjusted, and the dispensing head 14 must contact the base 51 and discharge glue when dispensing, when the dispensing head 14 contacts the base 51, the dispensing head 14 moves upward in the limit slot 153, thereby pushing the contact end 121 of the ejector pin 12 to slide upward along the sliding variable resistance element 13, and causing the resistance value of the sliding variable resistance element 13 to change. Since the corresponding glue output of the dispensing head 14 under different pressures is determined, the corresponding glue output of the dispensing head 14 under different pressures is input into the system in advance, and then a required reasonable glue output is preset, and the height of the dispensing head 14 that reaches the glue output is set to the minimum, where the minimum height refers to the contact end 121 of the ejector pin 12 being located at the lowest position of the sliding variable resistance element 13. In this process, the greater the amplitude of the upward movement of the contact end 121 along the sliding variable resistance element 13, the greater the distance that needs to be adjusted. According to the above principle, when debugging the dispensing, the operator needs to control the high-precision ball screw assembly 17 to move the housing 15 downward and drive the position of the dispensing head 14 to move downward first. This setting is to ensure that the dispensing head 14 can move upward when it contacts the base 51 for the first time, and the system receives a resistance change value of the sliding variable resistance element 13. If the resistance change value cannot be received at the first contact, it is necessary to continue to control the high-precision ball screw assembly 17 to drive the housing 15 to move downward until the system receives the resistance change. The device receives the resistance change and calculates the distance difference according to the preset appropriate dispensing position. The system then automatically controls the high-precision ball screw assembly 17 to drive the housing 15 to move, thereby adjusting the height of the dispensing head 14. The setting of the preload spring 16 is used to adjust the pressure of the dispensing head 14, thereby controlling the amount of glue discharged by the dispensing head 14. The operator can adjust the height of the preload spring 16 as needed. The setting of the preload spring 16 makes the pressure range of the dispensing head 14 adjustable during dispensing.

[0049] After adjusting the height of the glue dispensing head 14, the driving device drives the glue dispensing arm 1 to move up and down, and the glue dispensing head 14 follows the up and down movement to apply glue to the base 51. The glue dispensing head 14 moves down to apply glue and then moves up. At this time, the rotating push block 23 is driven by the glue applying motor 22 to move the glue guide groove 213 toward the glue dispensing head 14. The glue guide groove 213 contacts the glue dispensing head 14 to clean up the residual glue on the glue dispensing head 14.

[0050] The turret 33 is driven by the rotary drive assembly to reciprocate between the wafer disk 31 and the solid material disk 42. The driving motor drives the rotating crystal frame to rotate and load the material and cooperates with the wafer suction head 332 to adsorb the wafer, so that the wafer adsorbed on the wafer disk 31 is moved to the base 51. During this process, when the turret 33 moves to the bottom of the dispensing arm 1, the optical position sensor receiver 37 is aligned with the optical position sensor transmitter 36. The device receives the signal and controls the locking cylinder 333 to drive the lock shaft 34 to insert into the lock hole 331 and press down the turret 33. The wafer suction head 332 cooperates with the turret 33 to move down and place the adsorbed wafer on the base 51. The wafer is bonded to the base 51 by glue.

[0051] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A crystal bonding machine with a dispensing and debugging function, comprising a dispensing mechanism, a wafer mechanism, a swing arm mechanism and a solid material mechanism, wherein the wafer mechanism comprises a wafer disk (31), the solid material mechanism comprises a transfer base (43), a solid material disk (42) is fixedly arranged on the transfer base (43), the solid material disk (42) is used to place a substrate (5), a plurality of grooves are provided on the substrate (5) to form a base (51), the swing arm mechanism comprises a turret (33) arranged between the solid material disk (42) and the wafer disk (31), a wafer suction head (332) is fixedly arranged at the end of the turret (33), and the characteristics are as follows: The dispensing mechanism comprises a dispensing arm (1) and an adjustment component. The dispensing arm (1) is provided with a shell (15) at the bottom. A limit slot (153) is provided at the bottom of the shell (15). A dispensing head (14) is movably provided in the limit slot (153). The adjustment component comprises a sliding variable resistance element (13) provided in the shell (15). A linear guide rail (11) is fixedly provided on the inner wall of the shell (15). A guide groove (111) is provided on the linear guide rail (11). The adjustment component also comprises a pin (12) slidably provided in the guide groove (111). The pin (12) is provided in a U shape. The invention comprises a contact end (121) at the top and a fixed end (122) at the bottom, wherein the fixed end (122) is fixedly connected to the top of the dispensing head (14), and the contact end (121) is in sliding contact with the surface of the sliding variable resistance element (13). A high-precision ball screw assembly (17) is arranged between the dispensing arm (1) and the housing (15), and the high-precision ball screw assembly (17) moves the housing (15) downward and drives the dispensing head (14) downward to ensure that the dispensing head (14) can move upward when it contacts the base (51) for the first time, and enables the system to receive the resistance change value of the sliding variable resistance element (13).

2. The die bonding machine with dispensing and debugging function according to claim 1, characterized in that: Through grooves are provided on opposite sides of the limit slot (153) to form an adjustment slot (151); an adjustment seat (152) is fixedly provided on the adjustment slot (151) by means of bolts; and a preload spring (16) is provided between the adjustment seat (152) and the dispensing head (14).

3. The die bonding machine with dispensing and debugging function according to claim 1, characterized in that: The housing (15) and the dispensing arm (1) are slidably connected via a slide rail (171).

4. The die bonding machine with dispensing and debugging function according to claim 1, characterized in that: The dispensing mechanism further comprises a positioning assembly, the positioning assembly comprising a slide rail cylinder (18) fixedly arranged on the side wall of the dispensing arm (1), a guide rail seat (20) slidably arranged on the slide rail cylinder (18), and the positioning assembly further comprises a positioning roller (19) arranged on the guide rail seat (20).

5. The die bonding machine with dispensing and debugging function according to claim 1, characterized in that: The glue dispensing mechanism also includes a glue spreading component, and the glue spreading component includes a glue guide seat (21) arranged above the glue dispensing arm (1), and a glue guide plate (212) is fixedly arranged at one end of the glue guide seat (21) facing the glue dispensing head (14), and the glue guide plate (212) is horizontally arranged and has a glue guide groove (213) on its top.

6. The die bonding machine with dispensing and debugging function according to claim 5, characterized in that: The glue guide seat (21) is provided with a cavity to form a glue sol chamber (215), a heating element (211) is arranged in the glue sol chamber (215), and the glue sol chamber (215) is provided with a glue flow channel (214) connected to the glue guide groove (213).

7. The die bonding machine with dispensing and debugging function according to claim 5, characterized in that: The glue spreading assembly further comprises a glue spreading motor (22) and a transverse shaft (25); a sliding hole is provided on the top of the glue guide seat (21) and is slidably connected to the transverse shaft (25); a return spring (24) is sleeved on the transverse shaft (25); the return spring (24) abuts against the glue guiding seat (21); a rotating push block (23) is fixedly provided on the output shaft of the glue spreading motor (22); and the rotating push block (23) is arranged to be elliptical.

8. The die bonding machine with dispensing and debugging function according to claim 1, characterized in that: The dispensing arm (1) is also fixedly provided with a probe assembly, and the probe assembly comprises a locking cylinder (333) and a guide sleeve (35) fixedly provided on the dispensing arm (1); a locking shaft (34) is fixedly provided on the output shaft of the locking cylinder (333); the locking shaft (34) is slidably inserted into the guide sleeve (35); and an optical position sensor transmitter (36) is fixedly provided on the outside of the guide sleeve (35).

9. The die bonding machine with dispensing and debugging function according to claim 8, characterized in that: The turret (33) is provided with a circular hole matching the locking shaft (34) to form a locking hole (331), and an optical position sensor receiver (37) is fixedly arranged at the top of the turret (33) at a position corresponding to the optical position sensor transmitter (36).

10. The die bonding machine with dispensing and debugging function according to claim 1, characterized in that: The swing arm mechanism also includes a guide column (38), the end of the turret (33) is slidably connected to the guide column (38), a compression spring (39) is sleeved on the guide column (38), and the top of the compression spring (39) abuts against the turret (33).

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