Liquid cooling method and system for three-dimensional stacked chips based on microchannels

Abstract

The present application relates to the field of heat dissipation technology, and provides a liquid cooling heat dissipation method and system for three-dimensional stacked chips based on microchannels, the method comprising: obtaining thermal imaging image information of each chip of the three-dimensional stacked chip within a preset time period; the thermal imaging image information comprises a plurality of thermal imaging images, one chip corresponds to one thermal imaging image information; for each liquid-cooled microchannel, based on the thermal imaging image information corresponding to the liquid-cooled microchannel, determining the target heat change information of the chip part corresponding to the liquid-cooled microchannel within the preset time period; for each liquid-cooled microchannel, based on the target heat change information corresponding to the liquid-cooled microchannel, generating the target coolant flow rate corresponding to the liquid-cooled microchannel, and based on the target coolant flow rate, controlling the first micro pump corresponding to the liquid-cooled microchannel to pump coolant into the liquid-cooled microchannel. The method solves the heat dissipation difficulty problem caused by the high power consumption of three-dimensional stacked chips.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a liquid cooling method and system for three-dimensional stacked chips based on microchannels. Background Art

[0002] With the rapid development of electronic technology, the functions of integrated circuit chips are becoming increasingly powerful, and their integration and power consumption are also increasing. Especially in the field of high-performance computing and data centers, three-dimensional stacked chip technology is widely used to meet the needs of higher performance and smaller volume. Three-dimensional stacked chips achieve higher interconnection density and faster signal transmission speed by vertically integrating multiple chips together. However, as the power consumption of chips increases, the heat dissipation problem becomes increasingly prominent and becomes an important factor limiting chip performance and reliability. Summary of the invention

[0003] The present application provides a liquid cooling method and system for three-dimensional stacked chips based on microchannels to solve the problems raised by the above background technology.

[0004] In a first aspect, the present application provides a liquid cooling method for three-dimensional stacked chips based on microchannels, wherein a surface of each chip of the three-dimensional stacked chip is provided with uniformly distributed liquid cooling microchannels, each liquid cooling microchannel includes a cooling liquid inlet and a cooling liquid outlet, the cooling liquid inlet of each liquid cooling microchannel is connected to a first container through a microchannel, the cooling liquid outlet of each liquid cooling microchannel is connected to a second container through a microchannel, the first container is connected to the second container through a microchannel, a first micro pump is provided between each cooling liquid inlet and the first container, and a second micro pump is provided between the first container and the second container, the method comprises:

[0005] Acquire thermal imaging image information of each chip of the three-dimensional stacked chip within a preset time period through a preset thermal imaging camera module; the thermal imaging image information includes a plurality of thermal imaging images, and one chip corresponds to one thermal imaging image information;

[0006] For each of the liquid-cooling microchannels, determining target heat change information of a chip portion corresponding to the liquid-cooling microchannel within the preset time period based on thermal imaging image information corresponding to the liquid-cooling microchannel;

[0007] For each of the liquid-cooling microchannels, a target coolant flow rate corresponding to the liquid-cooling microchannel is generated based on the target heat change information corresponding to the liquid-cooling microchannel, and a first micropump corresponding to the liquid-cooling microchannel is controlled based on the target coolant flow rate to pump coolant into the liquid-cooling microchannel.

[0008] In a possible implementation, determining the target heat change information of the chip part corresponding to the liquid-cooling microchannel within the preset time period based on the thermal imaging image information corresponding to the liquid-cooling microchannel includes:

[0009] Performing finite element segmentation processing on the surface of the chip portion corresponding to the liquid-cooling microchannel to obtain a plurality of finite element units of the chip portion corresponding to the liquid-cooling microchannel;

[0010] For each of the finite element units, generating temperature change information of the finite element unit within the preset time period based on the thermal imaging image information, and generating initial heat change information of the finite element unit within the preset time period based on the temperature change information;

[0011] The target calorie change information is generated based on each of the initial calorie change information.

[0012] In a possible implementation, the step of generating the temperature change information of the finite element unit within the preset time period based on the thermal imaging image information, and generating the initial heat change information of the finite element unit within the preset time period based on the temperature change information includes:

[0013] Arranging the thermal imaging images of the thermal imaging image information in sequence based on a time series to obtain a thermal imaging image sequence;

[0014] Sequentially acquiring the temperature corresponding to each thermal imaging image of the finite element unit in the thermal imaging image sequence to obtain a temperature sequence of the finite element unit in the preset time period; the temperature sequence is temperature change information of the finite element unit in the preset time period;

[0015] Sequentially acquiring the temperature difference between two adjacent temperatures in the temperature sequence to obtain a temperature difference sequence;

[0016] An initial heat change sequence of the finite element unit within the preset time period is generated based on the volume, density, specific heat capacity and the temperature difference sequence of the finite element unit; the initial heat change sequence is the initial heat change information.

[0017] In a possible implementation, the generating the target heat change information based on each of the initial heat change information includes:

[0018] The initial heat at the same sequence position of each of the initial heat change sequences is added together to obtain a target heat change sequence; the target heat change sequence is the target heat change information.

[0019] In a possible implementation, the target heat change information is a target heat change sequence, and generating a target coolant flow rate corresponding to the liquid cooling microchannel based on the target heat change information corresponding to the liquid cooling microchannel includes:

[0020] Adding each target heat in the target heat change sequence to obtain a sum of the target heat, and obtaining an absolute value of the sum of the target heat;

[0021] comparing the absolute value with a preset absolute value;

[0022] If the absolute value is less than the preset absolute value, determining the current coolant flow rate of the liquid-cooled microchannel as the target coolant flow rate;

[0023] If the absolute value is not less than the preset absolute value, the target coolant flow rate is generated based on the target heat change sequence.

[0024] In a possible implementation, generating the target coolant flow rate based on the target heat change sequence includes:

[0025] Obtaining a ratio of the sum of the target calories to the duration corresponding to the preset time period;

[0026] The target coolant flow rate is determined based on the ratio and a current coolant flow rate of the liquid-cooled microchannel.

[0027] In a possible implementation, determining the target coolant flow rate based on the ratio and the current coolant flow rate of the liquid-cooled microchannel includes:

[0028] Acquire an initial heat dissipation power corresponding to the target coolant flow rate, and add the initial heat dissipation power to the ratio to obtain a target heat dissipation power;

[0029] The target coolant flow rate is generated based on the target heat dissipation power.

[0030] In a possible implementation, generating the coolant flow rate based on the target heat dissipation power includes:

[0031] Determining a temperature drop rate of the coolant flowing through the liquid cooling microchannel based on the target heat dissipation power;

[0032] pass Obtaining the target coolant flow rate; wherein, is the target coolant flow rate, is the target heat dissipation power, is the density of the coolant, is the cross-sectional area of ​​the liquid-cooling microchannel, is the specific heat capacity of the coolant, is the temperature drop rate.

[0033] In a second aspect, the present application provides a liquid cooling and heat dissipation system for a three-dimensional stacked chip based on a microchannel, wherein a surface of each chip of the three-dimensional stacked chip is provided with a uniformly distributed liquid cooling microchannel, each liquid cooling microchannel comprises a cooling liquid inlet and a cooling liquid outlet, the cooling liquid inlet of each liquid cooling microchannel is connected to a first container through a microchannel, the cooling liquid outlet of each liquid cooling microchannel is connected to a second container through a microchannel, the first container is connected to the second container through a microchannel, a first micro pump is provided between each cooling liquid inlet and the first container, and a second micro pump is provided between the first container and the second container, the system comprises:

[0034] An acquisition module, used to acquire thermal imaging image information of each chip of the three-dimensional stacked chip within a preset time period through a preset thermal imaging module; the thermal imaging image information includes a plurality of thermal imaging images, and one chip corresponds to one thermal imaging image information;

[0035] A determination module, configured to determine, for each of the liquid-cooling microchannels, target heat change information of a chip portion corresponding to the liquid-cooling microchannel within the preset time period based on thermal imaging image information corresponding to the liquid-cooling microchannel;

[0036] The control module is used to generate a target coolant flow rate corresponding to each of the liquid-cooling microchannels based on the target heat change information corresponding to the liquid-cooling microchannel, and control the first micropump corresponding to the liquid-cooling microchannel to pump coolant into the liquid-cooling microchannel based on the target coolant flow rate.

[0037] The present application provides a liquid cooling and heat dissipation method and system for three-dimensional stacked chips based on microchannels, the method comprising: a surface of each chip of the three-dimensional stacked chip is provided with uniformly distributed liquid cooling microchannels, each liquid cooling microchannel comprises a cooling liquid inlet and a cooling liquid outlet, the cooling liquid inlet of each liquid cooling microchannel is connected to a first container through a microchannel, the cooling liquid outlet of each liquid cooling microchannel is connected to a second container through a microchannel, the first container and the second container are connected through a microchannel, a first micro pump is provided between each cooling liquid inlet and the first container, and a second micro pump is provided between the first container and the second container, the method comprising: using a preset thermal imaging camera model The group obtains thermal imaging image information of each chip of the three-dimensional stacked chip within a preset time period; the thermal imaging image information includes multiple thermal imaging images, one chip corresponds to one thermal imaging image information; for each of the liquid-cooled microchannels, the target heat change information of the chip part corresponding to the liquid-cooled microchannel within the preset time period is determined based on the thermal imaging image information corresponding to the liquid-cooled microchannel; for each of the liquid-cooled microchannels, the target coolant flow rate corresponding to the liquid-cooled microchannel is generated based on the target heat change information corresponding to the liquid-cooled microchannel, and the first micro pump corresponding to the liquid-cooled microchannel is controlled based on the target coolant flow rate to pump coolant into the liquid-cooled microchannel. This method can quickly and effectively remove the heat generated by the chip by setting evenly distributed liquid-cooled microchannels on the surface of each chip of the three-dimensional stacked chip and utilizing the efficient heat transfer capacity of liquid cooling. It solves the heat dissipation difficulty caused by the high power consumption of the three-dimensional stacked chip, can prevent the chip from overheating, and improves the performance and reliability of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0039] Figure 1 A schematic diagram of a process flow of a microchannel-based three-dimensional stacked chip liquid cooling method provided in an embodiment of the present application;

[0040] Figure 2 A schematic block diagram of the structure of a microchannel-based three-dimensional stacked chip liquid cooling and heat dissipation system provided in an embodiment of the present application;

[0041] Figure 3 A schematic block diagram of the structure of a terminal device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] The flowcharts shown in the accompanying drawings are only examples and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may also be decomposed, combined or partially merged, so the actual execution order may change according to actual conditions.

[0044] It should also be understood that the terms used in this application specification are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in this application specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0045] It should be further understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0046] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0047] See also Figure 1 , Figure 1 A flow chart of a microchannel-based three-dimensional stacked chip liquid cooling method provided in an embodiment of the present application, wherein a surface of each chip of the three-dimensional stacked chip is provided with uniformly distributed liquid cooling microchannels, each liquid cooling microchannel includes a cooling liquid inlet and a cooling liquid outlet, the cooling liquid inlet of each liquid cooling microchannel is connected to the first container through a microchannel, the cooling liquid outlet of each liquid cooling microchannel is connected to the second container through a microchannel, the first container and the second container are connected through a microchannel, a first micro pump is provided between each of the cooling liquid inlets and the first container, a second micro pump is provided between the first container and the second container, a cooling liquid circulation pipeline is provided in the second container for cooling the cooling liquid flowing into the second container, and when the cooling liquid temperature in the second container is cooled to a preset temperature, the cooling liquid in the second container is pumped into the first container by the second micro pump,

[0048] like Figure 1As shown, the microchannel-based three-dimensional stacked chip liquid cooling method provided in the embodiment of the present application includes steps S1 to S3.

[0049] Step S1, obtaining thermal imaging image information of each chip of the three-dimensional stacked chip within a preset time period through a preset thermal imaging module; the thermal imaging image information includes multiple thermal imaging images, and one chip corresponds to one thermal imaging image information.

[0050] Wherein, for each of the chips, the thermal imaging image information of the chip is the thermal imaging image information of the surface opposite to the surface of the chip on which the liquid-cooling microchannel is arranged.

[0051] Step S2: for each of the liquid-cooling microchannels, determine the target heat change information of the chip part corresponding to the liquid-cooling microchannel within the preset time period based on the thermal imaging image information corresponding to the liquid-cooling microchannel.

[0052] Specifically, determining the target heat change information of the chip part corresponding to the liquid-cooling microchannel within the preset time period based on the thermal imaging image information corresponding to the liquid-cooling microchannel includes the following steps:

[0053] Performing finite element segmentation processing on the surface of the chip portion corresponding to the liquid-cooling microchannel to obtain a plurality of finite element units of the chip portion corresponding to the liquid-cooling microchannel;

[0054] For each of the finite element units, generating temperature change information of the finite element unit within the preset time period based on the thermal imaging image information, and generating initial heat change information of the finite element unit within the preset time period based on the temperature change information;

[0055] The target calorie change information is generated based on each of the initial calorie change information.

[0056] The step of generating the temperature change information of the finite element unit within the preset time period based on the thermal imaging image information, and generating the initial heat change information of the finite element unit within the preset time period based on the temperature change information, comprises the following steps:

[0057] Arranging the thermal imaging images of the thermal imaging image information in sequence based on a time series to obtain a thermal imaging image sequence;

[0058] The temperature corresponding to the finite element unit in each thermal imaging image of the thermal imaging image sequence is sequentially acquired to obtain a temperature sequence of the finite element unit in the preset time period; the temperature sequence is the temperature change information of the finite element unit in the preset time period; specifically, for each of the thermal imaging images, a color temperature matching analysis is performed on the corresponding part of the finite element unit on the thermal imaging image to obtain the temperature corresponding to the finite element unit on the thermal imaging image;

[0059] Sequentially acquiring the temperature difference between two adjacent temperatures in the temperature sequence to obtain a temperature difference sequence; specifically, for two adjacent temperatures in the temperature sequence, subtracting the previous temperature from the latter temperature to obtain the temperature difference between the two adjacent temperatures;

[0060] An initial heat change sequence of the finite element unit within the preset time period is generated based on the volume, density, specific heat capacity of the finite element unit and the temperature difference sequence; the initial heat change sequence is the initial heat change information. Specifically, for each temperature difference in the temperature difference sequence, the temperature difference, the volume, density, and specific heat capacity of the finite element unit are multiplied to obtain an initial heat corresponding to the temperature difference.

[0061] The step of generating the target heat change information based on each of the initial heat change information comprises the following steps:

[0062] The initial heat of the same sequence position of each of the initial heat change sequences is added to obtain a target heat change sequence; the target heat change sequence is the target heat change information. Exemplarily, the initial heat sequence includes three groups: 2, 3, 6, 7; 4, 8, 9, 10; 5, 9, 1, 2, and the target heat change sequence is 2+4+5, 3+8+9, 6+9+1, 7+10+2.

[0063] It can be understood that step S2 can accurately obtain the target heat change information of the chip parts corresponding to each of the liquid-cooling microchannels within the preset time period through the finite element analysis method, which helps to improve the reliability of the liquid cooling method.

[0064] Step S3: for each of the liquid-cooling microchannels, a target coolant flow rate corresponding to the liquid-cooling microchannel is generated based on the target heat change information corresponding to the liquid-cooling microchannel, and based on the target coolant flow rate, a first micropump corresponding to the liquid-cooling microchannel is controlled to pump coolant into the liquid-cooling microchannel.

[0065] Specifically, the step of generating a target coolant flow rate corresponding to the liquid-cooling microchannel based on the target heat change information corresponding to the liquid-cooling microchannel comprises the following steps:

[0066] Adding each target heat in the target heat change sequence to obtain a sum of the target heat, and obtaining an absolute value of the sum of the target heat;

[0067] comparing the absolute value with a preset absolute value;

[0068] If the absolute value is less than the preset absolute value, the current coolant flow rate of the liquid-cooled microchannel is determined to be the target coolant flow rate; it can be understood that if the absolute value is less than the preset absolute value, it means that the heat change of the liquid-cooled microchannel within the preset time period is within the allowable range, and the current coolant flow rate of the liquid-cooled microchannel meets the cooling demand of the liquid-cooled microchannel;

[0069] If the absolute value is not less than the preset absolute value, the target coolant flow rate is generated based on the target heat change sequence.

[0070] Wherein, generating the target coolant flow rate based on the target heat change sequence comprises the following steps:

[0071] Obtaining a ratio of the sum of the target calories to the duration corresponding to the preset time period;

[0072] The target coolant flow rate is determined based on the ratio and the current coolant flow rate of the liquid-cooled microchannel; specifically, an initial heat dissipation power corresponding to the target coolant flow rate is obtained, and the initial heat dissipation power is added to the ratio to obtain the target heat dissipation power; the target coolant flow rate is generated based on the target heat dissipation power; wherein the initial heat dissipation power corresponding to the target coolant flow rate is stored in a preset database.

[0073] Wherein, generating the coolant flow rate based on the target heat dissipation power comprises the following steps:

[0074] Determine the temperature drop rate of the coolant flowing through the liquid-cooling microchannel based on the target heat dissipation power; specifically, input the target heat dissipation power into a preset temperature drop rate prediction model to obtain the temperature drop rate, and the temperature drop rate prediction model is a pre-trained neural network model;

[0075] pass Obtaining the target coolant flow rate; wherein, is the target coolant flow rate, is the target heat dissipation power, is the density of the coolant, is the cross-sectional area of ​​the liquid-cooling microchannel, is the specific heat capacity of the coolant, is the temperature drop rate.

[0076] It can be understood that through step S3, the heat dissipation capacity of each liquid-cooled microchannel can be matched with its heat demand. On the one hand, insufficient heat dissipation caused by too low a coolant flow rate can be avoided. On the other hand, energy waste and condensation caused by too high a coolant flow rate can be avoided to cause damage to chips and circuits.

[0077] The method provided in this embodiment can quickly and effectively remove the heat generated by the chip by setting evenly distributed liquid cooling microchannels on the surface of each chip of the three-dimensional stacked chip and utilizing the efficient heat transfer capability of liquid cooling. This solves the heat dissipation difficulty caused by the high power consumption of the three-dimensional stacked chip, can prevent the chip from overheating, and improves the performance and reliability of the chip.

[0078] The method provided in this embodiment can reduce energy loss and ensure the safety of the discharge process during the discharge process of a new energy vehicle.

[0079] See also Figure 2 , Figure 2 A schematic block diagram of the structure of a microchannel-based three-dimensional stacked chip liquid cooling and heat dissipation system 100 provided in an embodiment of the present application, wherein a surface of each chip of the three-dimensional stacked chip is provided with uniformly distributed liquid cooling microchannels, each liquid cooling microchannel includes a cooling liquid inlet and a cooling liquid outlet, the cooling liquid inlet of each liquid cooling microchannel is connected to a first container through a microchannel, the cooling liquid outlet of each liquid cooling microchannel is connected to a second container through a microchannel, the first container and the second container are connected through a microchannel, a first micro pump is provided between each cooling liquid inlet and the first container, and a second micro pump is provided between the first container and the second container, such as Figure 2 As shown, the microchannel-based three-dimensional stacked chip liquid cooling and heat dissipation system 100 provided in the embodiment of the present application includes:

[0080] The acquisition module 110 is used to acquire thermal imaging image information of each chip of the three-dimensional stacked chip within a preset time period through a preset thermal imaging module; the thermal imaging image information includes multiple thermal imaging images, and one chip corresponds to one thermal imaging image information.

[0081] The determination module 120 is used to determine, for each of the liquid-cooling microchannels, target heat change information of a chip portion corresponding to the liquid-cooling microchannel within the preset time period based on the thermal imaging image information corresponding to the liquid-cooling microchannel.

[0082] The control module 130 is used to generate a target coolant flow rate corresponding to each of the liquid-cooling microchannels based on the target heat change information corresponding to the liquid-cooling microchannel, and control the first micropump corresponding to the liquid-cooling microchannel to pump coolant into the liquid-cooling microchannel based on the target coolant flow rate.

[0083] It should be noted that technicians in the relevant technical field can clearly understand that for the convenience and simplicity of description, the specific working process of the system and each module described above can refer to the process in the aforementioned microchannel-based three-dimensional stacked chip liquid cooling method embodiment, and will not be repeated here.

[0084] The microchannel-based three-dimensional stacked chip liquid cooling and heat dissipation system 100 provided in the above embodiment can be implemented in the form of a computer program. The computer program can be used in a computer program such as Figure 3 The system is run on the terminal device 200 shown.

[0085] See also Figure 3 , Figure 3 The present invention provides a schematic block diagram of the structure of a terminal device 200 according to an embodiment of the present application. The terminal device 200 includes a processor 201 and a memory 202. The processor 201 and the memory 202 are connected via a device bus 203, wherein the memory 202 may include a non-volatile storage medium and an internal memory.

[0086] The non-volatile storage medium can store a computer program. The computer program includes program instructions, and when the program instructions are executed by the processor 201, the processor 201 can execute any of the above-mentioned three-dimensional stacked chip liquid cooling and heat dissipation methods based on microchannels.

[0087] The processor 201 is used to provide computing and control capabilities to support the operation of the entire terminal device 200.

[0088] The internal memory provides an environment for the operation of the computer program in the non-volatile storage medium. When the computer program is executed by the processor 201, the processor 201 can execute any of the above-mentioned microchannel-based three-dimensional stacked chip liquid cooling methods.

[0089] Those skilled in the art will understand that Figure 3 The structure shown in the figure is only a block diagram of a partial structure related to the scheme of the present application, and does not constitute a limitation on the terminal device 200 involved in the scheme of the present application. The specific terminal device 200 may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0090] It should be understood that the processor 201 may be a central processing unit (CPU), and the processor 201 may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among them, the general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0091] In some embodiments, the processor 201 is used to run a computer program stored in the memory to implement the following steps:

[0092] Acquire thermal imaging image information of each chip of the three-dimensional stacked chip within a preset time period through a preset thermal imaging camera module; the thermal imaging image information includes a plurality of thermal imaging images, and one chip corresponds to one thermal imaging image information;

[0093] For each of the liquid-cooling microchannels, determining target heat change information of a chip portion corresponding to the liquid-cooling microchannel within the preset time period based on thermal imaging image information corresponding to the liquid-cooling microchannel;

[0094] For each of the liquid-cooling microchannels, a target coolant flow rate corresponding to the liquid-cooling microchannel is generated based on the target heat change information corresponding to the liquid-cooling microchannel, and a first micropump corresponding to the liquid-cooling microchannel is controlled based on the target coolant flow rate to pump coolant into the liquid-cooling microchannel.

[0095] It should be noted that technical personnel in the relevant field can clearly understand that for the convenience and simplicity of description, the specific working process of the terminal device 200 described above can refer to the process of the aforementioned microchannel-based three-dimensional stacked chip liquid cooling method, which will not be repeated here.

[0096] An embodiment of the present application also provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by one or more processors, the one or more processors implement the microchannel-based three-dimensional stacked chip liquid cooling method provided in the embodiment of the present application.

[0097] The computer-readable storage medium may be an internal storage unit of the terminal device 200 in the aforementioned embodiment, such as a hard disk or memory of the terminal device 200. The computer-readable storage medium may also be an external storage device of the terminal device 200, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped with the terminal device 200.

[0098] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A liquid cooling method for three-dimensional stacked chips based on microchannels, characterized in that: A surface of each chip of the three-dimensional stacked chip is provided with uniformly distributed liquid cooling microchannels, each liquid cooling microchannel includes a cooling liquid inlet and a cooling liquid outlet, the cooling liquid inlet of each liquid cooling microchannel is connected to the first container through a microchannel, the cooling liquid outlet of each liquid cooling microchannel is connected to the second container through a microchannel, the first container and the second container are connected through a microchannel, a first micro pump is provided between each cooling liquid inlet and the first container, and a second micro pump is provided between the first container and the second container, and the method comprises: Acquire thermal imaging image information of each chip of the three-dimensional stacked chip within a preset time period through a preset thermal imaging module; the thermal imaging image information includes a plurality of thermal imaging images, and one chip corresponds to one thermal imaging image information; For each of the liquid-cooling microchannels, determining target heat change information of a chip portion corresponding to the liquid-cooling microchannel within the preset time period based on thermal imaging image information corresponding to the liquid-cooling microchannel; For each of the liquid-cooling microchannels, a target coolant flow rate corresponding to the liquid-cooling microchannel is generated based on the target heat change information corresponding to the liquid-cooling microchannel, and a first micropump corresponding to the liquid-cooling microchannel is controlled to pump coolant into the liquid-cooling microchannel based on the target coolant flow rate; Wherein, determining the target heat change information of the chip part corresponding to the liquid-cooling microchannel within the preset time period based on the thermal imaging image information corresponding to the liquid-cooling microchannel comprises the following steps: Performing finite element segmentation processing on the surface of the chip portion corresponding to the liquid-cooling microchannel to obtain a plurality of finite element units of the chip portion corresponding to the liquid-cooling microchannel; For each of the finite element units, generating temperature change information of the finite element unit within the preset time period based on the thermal imaging image information, and generating initial heat change information of the finite element unit within the preset time period based on the temperature change information; generating the target heat change information based on each of the initial heat change information; The step of generating the temperature change information of the finite element unit within the preset time period based on the thermal imaging image information, and generating the initial heat change information of the finite element unit within the preset time period based on the temperature change information, comprises the following steps: Arranging the thermal imaging images of the thermal imaging image information in sequence based on a time series to obtain a thermal imaging image sequence; Sequentially acquiring the temperature corresponding to each thermal imaging image of the finite element unit in the thermal imaging image sequence to obtain a temperature sequence of the finite element unit in the preset time period; the temperature sequence is temperature change information of the finite element unit in the preset time period; Sequentially acquiring the temperature difference between two adjacent temperatures in the temperature sequence to obtain a temperature difference sequence; An initial heat change sequence of the finite element unit within the preset time period is generated based on the volume, density, specific heat capacity and the temperature difference sequence of the finite element unit; the initial heat change sequence is the initial heat change information.

2. The liquid cooling method for three-dimensional stacked chips based on microchannels according to claim 1 is characterized in that: The generating the target heat change information based on each of the initial heat change information includes: The initial heat at the same sequence position of each of the initial heat change sequences is added together to obtain a target heat change sequence; the target heat change sequence is the target heat change information.

3. The liquid cooling method for three-dimensional stacked chips based on microchannels according to claim 1 is characterized in that: The target heat change information is a target heat change sequence, and the target coolant flow rate corresponding to the liquid cooling microchannel is generated based on the target heat change information corresponding to the liquid cooling microchannel, including: Adding each target heat in the target heat change sequence to obtain a sum of the target heat, and obtaining an absolute value of the sum of the target heat; comparing the absolute value with a preset absolute value; If the absolute value is less than the preset absolute value, determining the current coolant flow rate of the liquid-cooled microchannel as the target coolant flow rate; If the absolute value is not less than the preset absolute value, the target coolant flow rate is generated based on the target heat change sequence.

4. The liquid cooling method for three-dimensional stacked chips based on microchannels according to claim 3 is characterized in that: The generating the target coolant flow rate based on the target heat change sequence comprises: Obtaining a ratio of the sum of the target calories to the duration corresponding to the preset time period; The target coolant flow rate is determined based on the ratio and a current coolant flow rate of the liquid-cooled microchannel.

5. The liquid cooling method for three-dimensional stacked chips based on microchannels according to claim 4 is characterized in that: The step of determining the target coolant flow rate based on the ratio and the current coolant flow rate of the liquid-cooled microchannel comprises: Acquire an initial heat dissipation power corresponding to the target coolant flow rate, and add the initial heat dissipation power to the ratio to obtain a target heat dissipation power; The target coolant flow rate is generated based on the target heat dissipation power.

6. The microchannel-based three-dimensional stacked chip liquid cooling method according to claim 5, characterized in that: The generating the coolant flow rate based on the target heat dissipation power comprises: Determining a temperature drop rate of the coolant flowing through the liquid cooling microchannel based on the target heat dissipation power; pass Obtaining the target coolant flow rate; wherein, is the target coolant flow rate, is the target heat dissipation power, is the density of the coolant, is the cross-sectional area of ​​the liquid-cooling microchannel, is the specific heat capacity of the coolant, is the temperature drop rate.

7. A three-dimensional stacked chip liquid cooling system based on microchannels, characterized in that: A surface of each chip of the three-dimensional stacked chip is provided with uniformly distributed liquid cooling microchannels, each liquid cooling microchannel includes a cooling liquid inlet and a cooling liquid outlet, the cooling liquid inlet of each liquid cooling microchannel is connected to the first container through a microchannel, the cooling liquid outlet of each liquid cooling microchannel is connected to the second container through a microchannel, the first container and the second container are connected through a microchannel, a first micro pump is provided between each cooling liquid inlet and the first container, and a second micro pump is provided between the first container and the second container, and the system comprises: An acquisition module, used to acquire thermal imaging image information of each chip of the three-dimensional stacked chip within a preset time period through a preset thermal imaging module; the thermal imaging image information includes a plurality of thermal imaging images, and one chip corresponds to one thermal imaging image information; A determination module, configured to determine, for each of the liquid-cooling microchannels, target heat change information of a chip portion corresponding to the liquid-cooling microchannel within the preset time period based on thermal imaging image information corresponding to the liquid-cooling microchannel; A control module, for generating a target coolant flow rate corresponding to each of the liquid-cooling microchannels based on target heat change information corresponding to the liquid-cooling microchannel, and controlling a first micropump corresponding to the liquid-cooling microchannel to pump coolant into the liquid-cooling microchannel based on the target coolant flow rate; Wherein, determining the target heat change information of the chip part corresponding to the liquid-cooling microchannel within the preset time period based on the thermal imaging image information corresponding to the liquid-cooling microchannel comprises the following steps: Performing finite element segmentation processing on the surface of the chip portion corresponding to the liquid-cooling microchannel to obtain a plurality of finite element units of the chip portion corresponding to the liquid-cooling microchannel; For each of the finite element units, generating temperature change information of the finite element unit within the preset time period based on the thermal imaging image information, and generating initial heat change information of the finite element unit within the preset time period based on the temperature change information; generating the target heat change information based on each of the initial heat change information; The step of generating the temperature change information of the finite element unit within the preset time period based on the thermal imaging image information, and generating the initial heat change information of the finite element unit within the preset time period based on the temperature change information, comprises the following steps: Arranging the thermal imaging images of the thermal imaging image information in sequence based on a time series to obtain a thermal imaging image sequence; Sequentially acquiring the temperature corresponding to each thermal imaging image of the finite element unit in the thermal imaging image sequence to obtain a temperature sequence of the finite element unit in the preset time period; the temperature sequence is temperature change information of the finite element unit in the preset time period; Sequentially acquiring the temperature difference between two adjacent temperatures in the temperature sequence to obtain a temperature difference sequence; An initial heat change sequence of the finite element unit within the preset time period is generated based on the volume, density, specific heat capacity and the temperature difference sequence of the finite element unit; the initial heat change sequence is the initial heat change information.

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