Power semiconductor water-cooling packaging device and water-cooling control method

Abstract

The present application discloses a power semiconductor water-cooled packaging device and a water-cooled control method, comprising a substrate and a chip, wherein the chip comprises a first surface and a second surface opposite to the first surface, wherein the first surface is mounted on the substrate, and further comprising: a heat sink and a shell, wherein the heat sink comprises an evaporation side, a liquid storage cavity and a condensation side, wherein the liquid storage cavity is used to store a cooling medium, wherein the cooling medium is configured to evaporate when heated on the evaporation side and condense when cooled on the condensation side, wherein the condensation side comprises a plurality of protrusions arranged at intervals, wherein the protrusions extend to the outside of the condensation side, wherein the interior of the protrusions is hollow and communicated with the liquid storage cavity, wherein the shell is arranged at the periphery of the plurality of protrusions to enclose the plurality of protrusions, wherein the space surrounded by the plurality of protrusions and the shell forms a cooling cavity, wherein the cooling cavity is used to store a water-cooled medium, wherein the first end of the shell is provided with at least one water inlet, and the second end of the shell is provided with at least one water outlet. The present application can increase the contact area between the liquid storage cavity and the cooling cavity, and improve the heat exchange efficiency.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a power semiconductor water-cooled packaging device and a water-cooling control method. Background Art

[0002] With the widespread application of power semiconductor devices in high-power and high-frequency fields, heat dissipation has become an important factor limiting device performance and reliability. Especially in high-power, high-heat-density semiconductor chips, the heat generated during operation cannot be effectively and timely dissipated, which may cause chip overheating, performance degradation, and even thermal failure. Traditional heat dissipation methods, such as air cooling and natural heat dissipation, often cannot meet the heat dissipation requirements of these high-power devices, especially in the case of high-density packaging and miniaturized design, the heat dissipation problem is particularly prominent.

[0003] To solve this problem, water cooling technology has been increasingly used as an efficient heat dissipation method. The water cooling system has high thermal conductivity and heat capacity, which can quickly and effectively remove the heat generated by high-power devices and keep the devices within a suitable operating temperature range. However, existing power semiconductor water-cooled packaging devices still have the problem of low heat dissipation efficiency. Summary of the invention

[0004] The present application provides a power semiconductor water-cooled package device and a water-cooling control method, in order to overcome the problem of low heat dissipation efficiency of power semiconductor water-cooled package devices in the prior art.

[0005] This application solves the above technical problems through the following technical solutions:

[0006] A power semiconductor water-cooled package device comprises a substrate and a chip, wherein the chip comprises a first surface and a second surface opposite to the first surface, wherein the first surface is mounted on the substrate, and further comprises: a heat sink and a housing, wherein the heat sink comprises:

[0007] an evaporation side, the evaporation side being in contact with the second surface;

[0008] A condensation side, arranged opposite to the evaporation side;

[0009] A liquid storage chamber, for storing a cooling medium, wherein the cooling medium is configured to evaporate when heated at the evaporation side and condense when cooled at the condensation side;

[0010] The condensation side includes a plurality of convex parts arranged at intervals, the convex parts extend to the outside of the condensation side, the interior of the convex parts is hollow and communicated with the liquid storage cavity;

[0011] The shell is arranged on the outer periphery of the plurality of protrusions to close the plurality of protrusions. The space surrounded by the plurality of protrusions and the shell forms a cooling cavity, and the cooling cavity is used to store a water-cooling medium. The first end of the shell is provided with at least one water inlet, and the second end of the shell is provided with at least one water outlet.

[0012] A water cooling control method for a power semiconductor water cooling package device, comprising the power semiconductor water cooling package device as described above, the water cooling control method comprising:

[0013] Starting the power unit to circulate the water-cooling medium;

[0014] obtaining the temperature of the cooling medium and the pressure in the liquid storage chamber,

[0015] If the temperature is greater than a preset value, the cooling unit is activated;

[0016] If the temperature is lower than a preset value and the pressure is higher than a preset value, the output power of the power unit is increased to speed up the flow rate of the water-cooling medium.

[0017] The positive and progressive effect of the present application is that the present application makes the evaporation side of the heat sink contact with the second surface of the chip, and utilizes the phase change of the cooling medium on the evaporation side to efficiently take away the heat of the chip, thereby realizing the rapid transfer and diffusion of the heat of the chip. The design of multiple raised parts on the condensation side increases the heat dissipation area, and at the same time, it is connected with the liquid storage cavity through the internal hollow structure, further improving the heat exchange efficiency of the cooling medium. The raised part on the condensation side is enclosed by the shell and forms a cooling cavity. By storing the water-cooled medium in the cooling cavity, the heat on the condensation side is taken away by water cooling, further reducing the temperature of the heat sink and improving the overall heat dissipation performance. The interval setting of the raised part can effectively increase the contact area between the raised part and the water-cooled medium, thereby improving the cooling efficiency. By surrounding the raised part on the condensation side by the shell, the cooling cavity and the liquid storage cavity are independently designed, effectively isolating the liquid storage cavity and the cooling cavity, avoiding mutual interference between the two, and can also increase the contact area between the liquid storage cavity and the cooling cavity, thereby improving the heat exchange efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic structural diagram of a power semiconductor water-cooling packaging device according to an embodiment of the present application;

[0019] Figure 2 A schematic structural diagram of a heat sink for a power semiconductor water-cooled package device according to an embodiment of the present application;

[0020] Figure 3 A first cross-sectional view of a heat sink and a housing of a power semiconductor water-cooled package device according to an embodiment of the present application;

[0021] Figure 4A second cross-sectional view of a heat sink and a housing of a power semiconductor water-cooled package device according to an embodiment of the present application;

[0022] Figure 5 This is a schematic structural diagram of a power semiconductor water-cooling packaging device according to another embodiment of the present application. DETAILED DESCRIPTION

[0023] The present application is further described below by way of examples, but the present application is not limited to the scope of the examples.

[0024] like Figure 1-Figure 4 As shown, this embodiment provides a power semiconductor water-cooled package device, including a substrate 100 and a chip 200 , wherein the chip 200 includes a first surface 210 and a second surface 220 opposite to the first surface 210 , and the first surface 210 is mounted on the substrate 100 .

[0025] The power semiconductor water-cooled package device further includes: a heat sink 300 and a shell 400. The heat sink 300 includes: an evaporation side 310, a liquid storage chamber 330 and a condensation side 320. The evaporation side 310 contacts the second surface 220. The condensation side 320 is arranged opposite to the evaporation side 310. The liquid storage chamber 330 is used to store a cooling medium, and the cooling medium is configured to evaporate when heated at the evaporation side 310 and condense when cooled at the condensation side 320. The condensation side 320 includes a plurality of protrusions arranged at intervals, the protrusions extend to the outside of the condensation side 320, the interior of the protrusions is hollow, and communicates with the liquid storage chamber 330. The shell 400 is arranged on the periphery of the plurality of protrusions to close the plurality of protrusions, and the space surrounded by the plurality of protrusions and the shell 400 forms a cooling chamber 430, and the cooling chamber 430 is used to store a water-cooling medium, and the first end of the shell 400 is provided with at least one water inlet 410, and the second end of the shell 400 is provided with at least one water outlet 420.

[0026] The present application makes the evaporation side 310 of the heat sink 300 contact the second surface 220 of the chip 200, and utilizes the phase change of the cooling medium on the evaporation side 310 to efficiently take away the heat of the chip 200, thereby realizing the rapid transfer and diffusion of the heat of the chip 200. The multiple raised portions on the condensation side 320 are designed to increase the heat dissipation area, and at the same time, are connected to the liquid storage chamber 330 through the internal hollow structure, further improving the heat exchange efficiency of the cooling medium. The raised portion on the condensation side 320 is enclosed by the shell 400 and forms a cooling chamber 430. By storing the water-cooled medium in the cooling chamber 430, the heat on the condensation side 320 is taken away by water cooling, further reducing the temperature of the heat sink 300 and improving the overall heat dissipation performance. The interval arrangement of the raised portions can effectively increase the contact area between the raised portions and the water-cooled medium, thereby improving the cooling efficiency. By surrounding the raised portion of the condensation side 320 through the shell 400, the cooling chamber 430 and the liquid storage chamber 330 are designed independently, which effectively isolates the liquid storage chamber 330 from the cooling chamber 430 to avoid mutual interference between the two, and can also increase the contact area between the liquid storage chamber 330 and the cooling chamber 430 to improve heat exchange efficiency.

[0027] The cooling medium may be a water-ethylene glycol mixture or diethyl ether. The water-cooling medium may be water.

[0028] In some embodiments, Figure 2 and Figure 3 As shown, the protrusions include a plurality of first protrusions 321 and a plurality of second protrusions 322. There is a gap between the first and second ends of the first protrusions 321 and the housing 400 to allow the water-cooling medium to pass through. The middle of the second protrusions 322 is open to allow the water-cooling medium to pass through, and the first and second ends of the second protrusions 322 are connected to the housing 400. The first protrusions 321 and the second protrusions 322 are arranged alternately in a cycle.

[0029] This solution optimizes the flow path of the water-cooling medium and improves the contact efficiency and heat exchange effect between the water-cooling medium and the heat source by designing a plurality of alternating first protrusions 321 and second protrusions 322 on the condensation side 320. The middle opening design of the second protrusion 322 and the gap between the first and tail ends of the first protrusion 321 and the shell 400 enable the cooling medium to flow evenly and effectively through each first protrusion 321 and the second protrusion, avoiding local overheating and enhancing the cooling effect.

[0030] In some embodiments, the housing 400 includes a water inlet 410, the first protrusion 321 is disposed near the water inlet 410, and the water inlet 410 is disposed near the middle of the first protrusion 321. This design can ensure that the water-cooling medium can flow evenly through the first protrusion 321 when entering.

[0031] In some embodiments, the housing 400 includes a water outlet 420, the first protrusion 321 is disposed near the water outlet 420, and the water outlet 420 is disposed near the middle of the first protrusion 321. This design can ensure that the water-cooling medium can flow evenly through the first protrusion 321 when flowing out.

[0032] In some embodiments, there is a gap between the top surfaces of the first protrusion 321 and the second protrusion 322 and the housing 400 to further increase the contact area between the water-cooling medium and the first protrusion 321 and the second protrusion 322, thereby improving the cooling efficiency.

[0033] In some embodiments, the design of the protrusion is not limited thereto, and the protrusion may adopt a circuitous layout.

[0034] like Figure 1 As shown, in some embodiments, the power semiconductor water-cooled package device also includes a circulation pipeline 510, a power unit 520 and a cooling unit 530. The circulation pipeline 510 connects the water inlet 410 and the water outlet 420. The power unit 520 is arranged on the circulation pipeline 510 to circulate the water-cooling medium. The cooling unit 530 is arranged on the circulation pipeline 510 to cool the water-cooling medium. Specifically, the power unit 520 can be a water pump. The cooling unit 530 adopts a cooler or a heat exchanger. By setting the circulation pipeline 510 and the power unit 520, it is ensured that the water-cooling medium can continuously circulate between the cooling chamber 430, the water inlet 410 and the water outlet 420, avoiding the retention of the cooling medium and improving the efficiency of the overall heat dissipation system. The cooling unit 530 cools the water-cooling medium in the circulation pipeline 510 so that the water-cooling medium entering the cooling chamber 430 is always in a low temperature state, thereby improving the heat transfer effect of the condensation side 320 and ensuring the stability and efficiency of the entire cooling system. The circulation pipeline 510 , the power unit 520 and the cooling unit 530 may also be arranged on the side end surface of the housing 400 .

[0035] In some embodiments, the power semiconductor water-cooled package device further includes a temperature sensor for measuring the temperature of the water-cooling medium, and the temperature sensor is connected to the cooling unit 530 and / or the power unit 520 in communication. The temperature sensor is used to monitor the temperature of the water-cooling medium, so that the system can grasp the cooling effect of the cooling medium in real time and avoid heat dissipation failure caused by excessive temperature. After the temperature sensor is connected to the cooling unit 530 and / or the power unit 520 in communication, the cooling intensity of the cooling unit 530 or the circulation speed of the power unit 520 can be dynamically adjusted according to the temperature change of the cooling medium, thereby optimizing the heat dissipation efficiency and reducing energy consumption.

[0036] like Figure 5As shown (the elastic member 630 is in a compressed state in the figure), in some embodiments, the power semiconductor water-cooling package device further includes a pressure detection device 600 for detecting the pressure in the liquid storage chamber 330, and the pressure detection device 600 is communicatively connected with the cooling unit 530 and / or the power unit 520. The pressure detection device 600 increases the safety and operational stability of the system, and further optimizes the cooling performance by monitoring the pressure state.

[0037] Specifically, the heat sink 300 is also provided with a pressure detection channel 340, which is connected to the liquid storage chamber 330 and is located at the side end of the upper area of ​​the heat sink 300, and the pressure detection channel 340 extends to the outside of the heat sink 300. The pressure detection device 600 includes a pressure detection member 610 and a distance detection sensor 620. The pressure detection member 610 is arranged in the pressure detection channel 340 and can reciprocate along the extension direction of the pressure detection channel 340. The distance detection sensor 620 is arranged toward the pressure detection member 610 to detect the distance from the pressure detection member 610. The pressure detection member 610 is configured such that: when the pressure of the liquid storage chamber 330 increases, the pressure detection member 610 moves outward along the extension direction of the pressure detection channel 340, and when the pressure of the liquid storage chamber 330 decreases, the pressure detection member 610 moves inward along the extension direction of the pressure detection channel 340. The pressure detection device 600 further includes an elastic member 630 and a fixing member 640. The fixing member 640 is disposed outside the pressure detection channel 340. The fixing member 640 is fixed to the external structure to provide support for the elastic member 630. The pressure detection member 610 is connected to the fixing member 640 through the elastic member 630. The pressure detection device 600 is configured as follows: when the pressure inside the liquid storage chamber 330 increases, the pressure detection member 610 moves outward along the extension direction of the pressure detection channel 340 and compresses the elastic member 630. When the pressure in the liquid storage chamber 330 decreases, the elastic member 630 pushes the pressure detection member 610 to move inward along the extension direction of the pressure detection channel 340.

[0038] The pressure detection device 600 further includes a limit column 650 , which is disposed at the maximum travel of the moving path of the pressure detection component 610 and is used to limit the pressure detection component 610 from continuing to move outward.

[0039] This embodiment also provides a water cooling control method for a power semiconductor water cooling package device, which includes the above-mentioned power semiconductor water cooling package device. The water cooling control method includes:

[0040] S10, start the power unit and circulate the water cooling medium;

[0041] S20, obtaining the temperature of the cooling medium and the pressure in the liquid storage chamber,

[0042] S21, if the temperature is greater than the preset value, start the cooling unit;

[0043] S22. If the temperature is lower than the preset value and the pressure is higher than the preset value, the output power of the power unit is increased to speed up the flow rate of the water-cooling medium.

[0044] This water cooling control method monitors the temperature of the cooling medium and the pressure of the liquid storage chamber in real time to intelligently control the operating status of the cooling unit and the power unit. When the temperature is higher than the preset value, the cooling unit is started to cool down. When the temperature is lower than the preset value and the pressure is higher than the preset value, the cooling medium circulation is accelerated by increasing the output power of the power unit to ensure efficient heat dissipation of the system. This method not only improves the heat dissipation efficiency and system stability, but also reduces energy consumption, adapts to the heat dissipation requirements under different working conditions, and provides a solution for intelligent water cooling control methods.

[0045] In some embodiments, the water cooling control method for a power semiconductor water-cooled package device further includes: S23 , if the temperature is greater than a preset value, and the pressure is greater than a preset value, reducing the output power of the chip 200 .

[0046] In some embodiments, the water cooling control method for a power semiconductor water-cooled package device further includes: S24, if the temperature is less than a preset value, and the pressure is less than a preset value, shutting down the cooling unit and reducing the output power of the power unit.

[0047] Although the specific embodiments of the present application are described above, it should be understood by those skilled in the art that this is only for illustration, and the protection scope of the present application is limited by the attached claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present application, but these changes and modifications fall within the protection scope of the present application. In addition, some features, structures or characteristics in one or more embodiments of the present application may be appropriately combined.

Claims

1. A power semiconductor water-cooled package device, comprising a substrate and a chip, wherein the chip comprises a first surface and a second surface opposite to the first surface, and the first surface is mounted on the substrate, characterized in that: Also includes: A heat sink and a housing, wherein the heat sink comprises: an evaporation side, the evaporation side being in contact with the second surface; A condensation side, arranged opposite to the evaporation side; A liquid storage chamber, for storing a cooling medium, wherein the cooling medium is configured to evaporate when heated at the evaporation side and condense when cooled at the condensation side; The condensation side includes a plurality of convex parts arranged at intervals, the convex parts extend to the outside of the condensation side, the interior of the convex parts is hollow and communicated with the liquid storage cavity; The shell is arranged on the outer periphery of the plurality of protrusions to close the plurality of protrusions, the space surrounded by the plurality of protrusions and the shell forms a cooling cavity, the cooling cavity is used to store a water-cooling medium, the first end of the shell is provided with at least one water inlet, and the second end of the shell is provided with at least one water outlet; The raised portion comprises: A plurality of first protrusions, wherein a gap exists between the first and the second ends of the first protrusions and the shell to allow the water-cooling medium to pass through; A plurality of second protrusions, wherein the middle of the second protrusion is open to allow the water-cooling medium to pass through, and the first and last ends of the second protrusion are connected to the shell; The first protrusions and the second protrusions are arranged alternately in a cycle.

2. The power semiconductor water-cooling package device according to claim 1, characterized in that: The shell includes a water inlet, the first protrusion is arranged close to the water inlet, and the water inlet is arranged close to the middle of the first protrusion.

3. The power semiconductor water-cooling package device according to claim 1, characterized in that: The shell includes a water outlet, the first protrusion is arranged close to the water outlet, and the water outlet is arranged close to the middle of the first protrusion.

4. The power semiconductor water-cooling package device according to any one of claims 1 to 3, characterized in that: Also includes: A circulation pipeline connecting the water inlet and the water outlet; A power unit is arranged on the circulation pipeline to circulate the water-cooling medium; A cooling unit is arranged on the circulation pipeline to cool the water-cooling medium.

5. The power semiconductor water-cooling package device according to claim 4, characterized in that: It also includes a temperature sensor for measuring the temperature of the water-cooling medium, and the temperature sensor is communicatively connected with the cooling unit and / or the power unit.

6. The power semiconductor water-cooling package device according to claim 4, characterized in that: It also includes a pressure detection device for detecting the pressure in the liquid storage chamber, and the pressure detection device is communicatively connected with the cooling unit and / or the power unit.

7. A water cooling control method for a power semiconductor water cooling package device, characterized in that: The power semiconductor water-cooling package device according to any one of claims 4 to 6, wherein the water-cooling control method comprises: Starting the power unit to circulate the water-cooling medium; obtaining the temperature of the cooling medium and the pressure in the liquid storage chamber, If the temperature is greater than a preset value, the cooling unit is activated; If the temperature is lower than a preset value and the pressure is higher than a preset value, the output power of the power unit is increased to speed up the flow rate of the water-cooling medium.

8. The water cooling control method for a power semiconductor water cooling package device according to claim 7, characterized in that: Also includes: If the temperature is greater than a preset value and the pressure is greater than a preset value, the output power of the chip is reduced.

9. The water cooling control method for a power semiconductor water cooling package device according to claim 8, characterized in that: The method also includes shutting down the cooling unit and reducing the output power of the power unit if the temperature is less than a preset value and the pressure is less than a preset value.

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