Economical alloy bump structure and application thereof in IC packaging

Abstract

The invention relates to an economical alloy bump structure and application thereof in IC (integrated circuit) packaging, the structure comprises an irregular geometrical alloy bump made of copper-tin alloy or copper-zinc alloy, a substrate and a chip, the alloy bump is in a triangular cone shape or a spiral shape, the surface of the alloy bump is provided with a plurality of bulges and grooves, and the inside of the alloy bump is provided with a variable cross-section heat dissipation channel; and the functional parts of the signal transmission layer and the electromagnetic shielding layer, and the alloy bumps are connected with the chip or the substrate in a micro-welding mode of high-temperature welding or vibration welding. The structure is stable and reliable in design, has excellent heat dissipation performance and impact resistance, is low in production cost, and is suitable for large-scale production.

Description

Technical Field

[0001] The invention relates to an economical alloy bump structure and application thereof in IC packaging. Background Art

[0002] In the modern electronics industry, integrated circuit packaging technology is a key link in connecting chips to the outside world. As an important component of IC packaging, the alloy bump structure is responsible for connecting the chip to the substrate or printed circuit board. This structure not only needs to have sufficient mechanical strength to withstand the stress during assembly and transportation, but also needs to have good thermal conductivity to dissipate the heat generated by the chip during operation to prevent the chip from overheating and affecting performance.

[0003] However, there are some problems in the design and manufacturing of traditional alloy bump structures. First, traditional bump structures usually use a single alloy material, such as precious metals such as gold and silver. Although these materials have excellent performance, they are expensive and not suitable for large-scale production. Secondly, the design of these alloy bump structures is not optimized for the overall performance of IC packaging, resulting in the reliability, heat dissipation and impact resistance of the package being affected. In addition, traditional manufacturing processes, such as casting and welding, are not only inefficient, but also prone to material waste, increasing production costs.

[0004] Therefore, there is a need for an economical alloy bump structure and its application in IC packaging to solve the problem of high cost of existing alloy bumps. Summary of the invention

[0005] The purpose of the present invention is to solve the above deficiencies in the prior art and provide an economical alloy bump structure and its application in IC packaging. By optimizing the material selection, structural design and packaging process of the gold bump, not only the cost is reduced, but also the reliability, heat dissipation and impact resistance of the packaging are significantly improved. The following is a specific solution:

[0006] An economical alloy bump structure and its application in IC packaging, comprising an alloy bump, a substrate and a chip, wherein the alloy bump is a copper-tin alloy or a copper-zinc alloy, and the alloy bump is in an irregular geometric shape, which is a triangular cone or a spiral shape. The alloy bump comprises a plurality of protrusions and grooves, and a heat dissipation channel is arranged inside the protrusion. The alloy bump is connected to the chip or the substrate by micro-welding, and the micro-welding method is high-temperature welding or vibration welding. The cross-section of the heat dissipation channel is a variable cross-section structure, and the cross-section variation of the variable cross-section structure includes circular, elliptical or rectangular. The protrusion also comprises a functional part, and a signal transmission layer and an electromagnetic shielding layer are arranged in the functional part, wherein the material of the signal transmission layer is a high-conductivity material, and the material of the electromagnetic shielding layer is a high-magnetic permeability material.

[0007] The protrusions and grooves are both arranged on the upper surface of the alloy bump, and the heat dissipation channel is arranged on the side of the alloy bump. The material of the heat dissipation channel is the same as that of the alloy bump. This design ensures the consistency of the thermal expansion coefficient of the entire structure, reduces the stress concentration caused by uneven thermal expansion, thereby effectively preventing structural deformation caused by temperature changes, and improving the stability and reliability of the product.

[0008] The cross-section of the starting part of the groove is circular, and as the groove extends, the cross-section transitions to a circle with a smaller area than the starting part. The cross-section of the starting part of the groove is circular, elliptical or rectangular, and as the groove extends, the cross-section transitions to a shape with a smaller area. This unique design allows natural air convection to form inside the groove, enhancing the heat dissipation effect, especially in the transition area of ​​the groove cross-section. Due to the change in shape, the air flow is disturbed, which effectively improves the heat dissipation efficiency and avoids local overheating.

[0009] The cross section of the initial part of the groove is an ellipse. As the groove extends, the cross section transitions to an ellipse with a smaller area than the initial part, so that natural air convection is formed inside the groove, which enhances the heat dissipation effect. Especially in the transition area of ​​the groove cross section, due to the change in shape, the air flow is disturbed, which effectively improves the heat dissipation efficiency and avoids local overheating.

[0010] The cross section of the initial part of the groove is rectangular, and as the groove extends, the cross section transitions to a rectangle with a smaller area than the initial part, so that natural air convection is formed inside the groove, enhancing the heat dissipation effect. Especially in the transition area of ​​the groove cross section, due to the change in shape, the air flow is disturbed, which effectively improves the heat dissipation efficiency and avoids local overheating.

[0011] The signal transmission layer is arranged inside the alloy bump, and its material is a highly conductive material, such as copper or silver, which greatly improves the signal transmission speed and quality. At the same time, the electromagnetic shielding layer is arranged outside the signal transmission layer, and uses a high magnetic permeability material such as iron or nickel, which effectively shields external electromagnetic interference and ensures the stability and safety of the signal.

[0012] The signal transmission layer is arranged on the outer surface of the protrusion. Such a design not only protects the signal transmission layer, but also further enhances the signal transmission efficiency.

[0013] The electromagnetic shielding layer is arranged on the inner surface of the heat dissipation channel, which neither affects the heat dissipation effect of the heat dissipation channel nor ensures the integrity of the electromagnetic shielding.

[0014] Beneficial effects: In terms of material selection, this solution uses copper-tin alloy or copper-zinc alloy as the material of the alloy bump. Compared with traditional materials, copper-tin alloy or copper-zinc alloy has lower cost and is easy to mass produce, thereby effectively reducing production costs;

[0015] Secondly, in terms of structural design, the alloy bumps include triangular cone or spiral shapes, as well as protrusion and groove designs, which not only increase the stability of the structure, but also improve the reliability of the package; this design enables the alloy bumps to effectively disperse stress when subjected to external impact, thereby improving impact resistance. In addition, the setting of the heat dissipation channel enables heat to be quickly and effectively conducted away from the chip, thereby improving the heat dissipation of the package.

[0016] Furthermore, in the packaging process, this solution uses micro-welding to connect the alloy bumps to the chip or substrate. This high-temperature welding or vibration welding method makes the connection more secure and improves the reliability of the packaging. At the same time, the variable cross-sectional structure design of the heat dissipation channel, including circular, elliptical or rectangular, makes the heat conduction process more uniform, further improving the heat dissipation efficiency.

[0017] In addition, the alloy bump of the present solution also includes a functional part, in which the signal transmission layer and the electromagnetic shielding layer are made of high conductive material and high magnetic permeability material respectively. This design not only ensures the fast and stable signal transmission, but also provides effective electromagnetic shielding to prevent external electromagnetic interference and improve the anti-interference ability of the package. In general, the present solution not only reduces the cost but also significantly improves the reliability, heat dissipation and impact resistance of the package by optimizing the material selection, structural design and packaging process of the alloy bump. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a three-dimensional perspective schematic diagram of an economical alloy bump structure of the first embodiment;

[0019] Figure 2 is a three-dimensional perspective schematic diagram of an economical alloy bump structure of the second embodiment;

[0020] Figure 3 is a three-dimensional perspective schematic diagram of an economical alloy bump structure of the third embodiment;

[0021] Figure 4 is a three-dimensional perspective schematic diagram of an economical alloy bump structure of the fourth embodiment;

[0022] Figure 5 is a three-dimensional perspective schematic diagram of an economical alloy bump structure of the fifth embodiment;

[0023] Figure 6 is a three-dimensional perspective schematic diagram of an economical alloy bump structure of Example 6;

[0024] Figure 7 It is a schematic diagram of a raised three-dimensional perspective of an economical alloy bump structure;

[0025] Figure 8It is a schematic side view of a protrusion of an economical alloy bump structure;

[0026] In the figure: 1. alloy bump, 2. protrusion, 3. groove, 5. heat dissipation channel, 6. functional part, 7. signal transmission layer, 8. electromagnetic shielding layer. DETAILED DESCRIPTION

[0027] In order to deepen the understanding of the present invention, the present invention will be further described in detail below in conjunction with embodiments and drawings. The embodiments are only used to explain the present invention and do not constitute a limitation on the protection scope of the present invention.

[0028] Embodiment 1:

[0029] An economical alloy bump structure and its application in IC packaging, comprising an alloy bump 1, a substrate and a chip, wherein the alloy bump 1 is a copper-zinc alloy and has an irregular geometric shape, wherein the irregular geometric shape is a spiral shape, wherein the alloy bump 1 comprises a plurality of protrusions 2 and grooves 3, wherein a heat dissipation channel 5 is arranged inside the protrusion 2, wherein the alloy bump 1 is connected to the chip or the substrate by micro-welding, wherein the micro-welding method is high-temperature welding or vibration welding, wherein the cross-section of the heat dissipation channel 5 is a variable cross-section structure, wherein the cross-section variation of the variable cross-section structure includes a circle, an ellipse or a rectangle, wherein the protrusion 2 further comprises a functional part 6, wherein a signal transmission layer 7 and an electromagnetic shielding layer 8 are arranged inside the functional part 6, wherein the material of the signal transmission layer 7 is a high-conductivity material, and the material of the electromagnetic shielding layer 8 is a high-magnetic permeability material.

[0030] The protrusion 2 and the groove 3 are both arranged on the upper surface of the alloy bump 1, and the heat dissipation channel 5 is arranged on the side of the alloy bump 1. The material of the heat dissipation channel 5 is the same as that of the alloy bump 1. The cross-section of the starting part of the groove 3 is circular. As the groove 3 extends, the cross-section transitions to a circle with a smaller area than the starting part. The signal transmission layer 7 is made of copper or silver, and the electromagnetic shielding layer 8 is made of iron or nickel. The signal transmission layer 7 is arranged on the outer surface of the protrusion 2, and the electromagnetic shielding layer 8 is arranged on the inner surface of the heat dissipation channel 5.

[0031] Embodiment 2:

[0032] An economical alloy bump structure and its application in IC packaging, comprising an alloy bump 1, a substrate and a chip, wherein the alloy bump 1 is a copper-zinc alloy and has an irregular geometric shape, wherein the irregular geometric shape is a spiral shape, wherein the alloy bump 1 comprises a plurality of protrusions 2 and grooves 3, wherein a heat dissipation channel 5 is arranged inside the protrusion 2, wherein the alloy bump 1 is connected to the chip or the substrate by micro-welding, wherein the micro-welding method is high-temperature welding or vibration welding, wherein the cross-section of the heat dissipation channel 5 is a variable cross-section structure, wherein the cross-section variation of the variable cross-section structure includes a circle, an ellipse or a rectangle, wherein the protrusion 2 further comprises a functional part 6, wherein a signal transmission layer 7 and an electromagnetic shielding layer 8 are arranged inside the functional part 6, wherein the material of the signal transmission layer 7 is a high-conductivity material, and the material of the electromagnetic shielding layer 8 is a high-magnetic permeability material.

[0033] The protrusion 2 and the groove 3 are both arranged on the upper surface of the alloy bump 1, and the heat dissipation channel 5 is arranged on the side of the alloy bump 1. The material of the heat dissipation channel 5 is the same as that of the alloy bump 1. The cross-section of the starting part of the groove 3 is elliptical. As the groove 3 extends, the cross-section transitions to an ellipse with a smaller area than the starting part. The signal transmission layer 7 is made of copper or silver, and the electromagnetic shielding layer 8 is made of iron or nickel. The signal transmission layer 7 is arranged on the outer surface of the protrusion 2, and the electromagnetic shielding layer 8 is arranged on the inner surface of the heat dissipation channel 5.

[0034] Embodiment three:

[0035] An economical alloy bump structure and its application in IC packaging, comprising an alloy bump 1, a substrate and a chip, wherein the alloy bump 1 is a copper-zinc alloy and has an irregular geometric shape, wherein the irregular geometric shape is a spiral shape, wherein the alloy bump 1 comprises a plurality of protrusions 2 and grooves 3, wherein a heat dissipation channel 5 is arranged inside the protrusion 2, wherein the alloy bump 1 is connected to the chip or the substrate by micro-welding, wherein the micro-welding method is high-temperature welding or vibration welding, wherein the cross-section of the heat dissipation channel 5 is a variable cross-section structure, wherein the cross-section variation of the variable cross-section structure includes a circle, an ellipse or a rectangle, wherein the protrusion 2 further comprises a functional part 6, wherein a signal transmission layer 7 and an electromagnetic shielding layer 8 are arranged inside the functional part 6, wherein the material of the signal transmission layer 7 is a high-conductivity material, and the material of the electromagnetic shielding layer 8 is a high-magnetic permeability material.

[0036] The protrusion 2 and the groove 3 are both arranged on the upper surface of the alloy bump 1, and the heat dissipation channel 5 is arranged on the side of the alloy bump 1. The material of the heat dissipation channel 5 is the same as that of the alloy bump 1. The cross-section of the starting part of the groove 3 is a rectangle. As the groove 3 extends, the cross-section transitions to a rectangle with a smaller area than the starting part. The signal transmission layer 7 is made of copper or silver, and the electromagnetic shielding layer 8 is made of iron or nickel. The signal transmission layer 7 is arranged on the outer surface of the protrusion 2, and the electromagnetic shielding layer 8 is arranged on the inner surface of the heat dissipation channel 5.

[0037] Embodiment 4:

[0038] An economical alloy bump structure and its application in IC packaging, comprising an alloy bump 1, a substrate and a chip, wherein the alloy bump 1 is a copper-tin alloy and has an irregular geometric shape, which is a triangular pyramid. The alloy bump 1 comprises a plurality of protrusions 2 and grooves 3, a heat dissipation channel 5 is arranged inside the protrusion 2, the alloy bump 1 is connected to the chip or the substrate by micro-welding, which is high-temperature welding or vibration welding, the cross-section of the heat dissipation channel 5 is a variable cross-section structure, and the cross-section variation of the variable cross-section structure includes circular, elliptical or rectangular, the protrusion 2 also comprises a functional part 6, a signal transmission layer 7 and an electromagnetic shielding layer 8 are arranged inside the functional part 6, wherein the material of the signal transmission layer 7 is a high-conductivity material, and the material of the electromagnetic shielding layer 8 is a high-magnetic permeability material.

[0039] The protrusion 2 and the groove 3 are both arranged on the upper surface of the alloy bump 1, and the heat dissipation channel 5 is arranged on the side of the alloy bump 1. The material of the heat dissipation channel 5 is the same as that of the alloy bump 1. The cross-section of the starting part of the groove 3 is circular. As the groove 3 extends, the cross-section transitions to a circle with a smaller area than the starting part. The signal transmission layer 7 is made of copper or silver, and the electromagnetic shielding layer 8 is made of iron or nickel. The signal transmission layer 7 is arranged on the outer surface of the protrusion 2, and the electromagnetic shielding layer 8 is arranged on the inner surface of the heat dissipation channel 5.

[0040] Embodiment five:

[0041] An economical alloy bump structure and its application in IC packaging, comprising an alloy bump 1, a substrate and a chip, wherein the alloy bump 1 is a copper-tin alloy and has an irregular geometric shape, which is a triangular pyramid. The alloy bump 1 comprises a plurality of protrusions 2 and grooves 3, a heat dissipation channel 5 is arranged inside the protrusion 2, the alloy bump 1 is connected to the chip or the substrate by micro-welding, which is high-temperature welding or vibration welding, the cross-section of the heat dissipation channel 5 is a variable cross-section structure, and the cross-section variation of the variable cross-section structure includes circular, elliptical or rectangular, the protrusion 2 also comprises a functional part 6, a signal transmission layer 7 and an electromagnetic shielding layer 8 are arranged inside the functional part 6, wherein the material of the signal transmission layer 7 is a high-conductivity material, and the material of the electromagnetic shielding layer 8 is a high-magnetic permeability material.

[0042] The protrusion 2 and the groove 3 are both arranged on the upper surface of the alloy bump 1, and the heat dissipation channel 5 is arranged on the side of the alloy bump 1. The material of the heat dissipation channel 5 is the same as that of the alloy bump 1. The cross-section of the starting part of the groove 3 is elliptical. As the groove 3 extends, the cross-section transitions to an ellipse with a smaller area than the starting part. The signal transmission layer 7 is made of copper or silver, and the electromagnetic shielding layer 8 is made of iron or nickel. The signal transmission layer 7 is arranged on the outer surface of the protrusion 2, and the electromagnetic shielding layer 8 is arranged on the inner surface of the heat dissipation channel 5.

[0043] Embodiment six:

[0044] An economical alloy bump structure and its application in IC packaging, comprising an alloy bump 1, a substrate and a chip, wherein the alloy bump 1 is a copper-tin alloy and has an irregular geometric shape, which is a triangular pyramid. The alloy bump 1 comprises a plurality of protrusions 2 and grooves 3, a heat dissipation channel 5 is arranged inside the protrusion 2, the alloy bump 1 is connected to the chip or the substrate by micro-welding, which is high-temperature welding or vibration welding, the cross-section of the heat dissipation channel 5 is a variable cross-section structure, and the cross-section variation of the variable cross-section structure includes circular, elliptical or rectangular, the protrusion 2 also comprises a functional part 6, a signal transmission layer 7 and an electromagnetic shielding layer 8 are arranged inside the functional part 6, wherein the material of the signal transmission layer 7 is a high-conductivity material, and the material of the electromagnetic shielding layer 8 is a high-magnetic permeability material.

[0045] The protrusion 2 and the groove 3 are both arranged on the upper surface of the alloy bump 1, and the heat dissipation channel 5 is arranged on the side of the alloy bump 1. The material of the heat dissipation channel 5 is the same as that of the alloy bump 1. The cross-section of the starting part of the groove 3 is a rectangle. As the groove 3 extends, the cross-section transitions to a rectangle with a smaller area than the starting part. The signal transmission layer 7 is made of copper or silver, and the electromagnetic shielding layer 8 is made of iron or nickel. The signal transmission layer 7 is arranged on the outer surface of the protrusion 2, and the electromagnetic shielding layer 8 is arranged on the inner surface of the heat dissipation channel 5.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution of the present invention, which should be included in the scope of the claims of the present invention.

Claims

1. An economical alloy bump structure and its application in IC packaging, characterized in that: It includes an alloy bump, a substrate and a chip, wherein the alloy bump is a copper-tin alloy or a copper-zinc alloy, and the alloy bump is in an irregular geometric shape, which is a triangular cone or a spiral shape. The alloy bump includes a plurality of protrusions and grooves, and a heat dissipation channel is provided inside the protrusion. The alloy bump is connected to the chip or the substrate by micro-welding, and the micro-welding method is high-temperature welding or vibration welding. The cross-section of the heat dissipation channel is a variable cross-section structure, and the cross-section changes of the variable cross-section structure include circular, elliptical or rectangular. The protrusion also includes a functional part, and a signal transmission layer and an electromagnetic shielding layer are provided in the functional part, wherein the material of the signal transmission layer is a high-conductivity material, and the material of the electromagnetic shielding layer is a high-magnetic permeability material.

2. The economical alloy bump structure and its application in IC packaging according to claim 1, characterized in that: The protrusions and the grooves are both arranged on the upper surface of the alloy bump, the heat dissipation channel is arranged on the side surface of the alloy bump, and the material of the heat dissipation channel is the same as that of the alloy bump.

3. The economical alloy bump structure and its application in IC packaging according to claim 1, characterized in that: The cross section of the initial part of the groove is circular, and as the groove extends, the cross section transitions to a circle with a smaller area than the initial part.

4. The economical alloy bump structure and its application in IC packaging according to claim 1, characterized in that: The cross section of the initial part of the groove is an ellipse, and as the groove extends, the cross section transitions to an ellipse with a smaller area than the initial part.

5. The economical alloy bump structure and its application in IC packaging according to claim 1, characterized in that: The cross section of the initial part of the groove is a rectangle, and as the groove extends, the cross section transitions to a rectangle with a smaller area than the initial part.

6. The economical alloy bump structure and its application in IC packaging according to claim 1, characterized in that: The material of the signal transmission layer is copper or silver, and the material of the electromagnetic shielding layer is iron or nickel.

7. The economical alloy bump structure and its application in IC packaging according to claim 1, characterized in that: The signal transmission layer is arranged on the outer surface of the protrusion.

8. The economical alloy bump structure and its application in IC packaging according to claim 1, characterized in that: The electromagnetic shielding layer is arranged on the inner surface of the heat dissipation channel.

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