Service transmission method, optical module and transmission equipment

Abstract

The embodiment of the invention discloses a service transmission method, an optical module and transmission equipment, which are used for reducing the power consumption of the optical module for processing service under the condition that the service type is improved. The method comprises the following steps: firstly, an optical module receives an optical signal, and the optical signal carries service data; secondly, the optical module converts the optical signal into an electrical signal. And thirdly, the optical module performs digital signal processing on the electric signal to obtain a service cell or a service packet. And finally, the optical module sends the service cell or the service packet outwards.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of optical communication technology, and in particular to a service transmission method, an optical module, and a transmission device. Background Art

[0002] The optical transmission device includes an optical module. The optical module has a built-in framing chip. The optical module receives optical signals that have been carrying various services, and encapsulates the optical signals that have been carrying various services into transmission frames. For example, the optical module receives an Ethernet service optical signal, the optical module performs photoelectric conversion on the Ethernet service optical signal to obtain an Ethernet service electrical signal, the Framer chip encapsulates the Ethernet service electrical signal into an Ethernet transmission frame, and the optical module emits the Ethernet transmission frame. For another example, the optical module receives an optical transport network (OTN) service optical signal, the optical module performs photoelectric conversion on the OTN service optical signal to obtain an OTN service electrical signal, the Framer chip encapsulates the OTN service electrical signal into OTN transmission frames of various rates, and the optical module emits the OTN transmission frame.

[0003] It can be seen that the transmission frame emitted by the optical module has different formats depending on the type of service it carries. With the continuous growth of fixed-line, mobile and dedicated line services, the types of frame formats of the transmission frames emitted by the optical module have increased, resulting in a relatively large insertion loss of the transmission frames emitted from the optical module. The optical module on the receiving side needs to process transmission frames of various formats, which increases the power consumption of the optical module on the receiving side. Summary of the invention

[0004] The embodiments of the present application provide a service transmission method, an optical module, and a transmission device, which are used to reduce the power consumption of the optical module in processing services when the service type is improved.

[0005] In the first aspect, an embodiment of the present application provides a method for transmitting a service, the method comprising: first, an optical module receives an optical signal, and the optical signal carries service data. Secondly, the optical module converts the optical signal into an electrical signal. Thirdly, the optical module performs digital signal processing on the electrical signal to obtain a service cell or a service packet. Among them, the optical module can convert various types of services, such as synchronous digital hierarchy services, packet services, Ethernet services, flexible Ethernet networks, fronthaul services, optical transport network services, storage services, data center services or supercomputing services, into service cells or service packets with a unified format based on digital signal processing. Finally, the optical module sends the service cell or the service packet to the outside.

[0006] As shown in this aspect, even with the continuous growth of fixed-line, mobile and dedicated line services, the types of services received by the optical module are increased, and the optical module can convert different services into service cells or service packets in a unified format. Then, another optical module on the receiving side directly receives the service cells or service packets. Since the format of the service cells or service packets is unified, the power consumption of another optical module in processing the service cells or service packets is reduced. Moreover, since various types of services are transmitted through service cells or service packets, the successful transmission of the services is guaranteed and the reliability of service transmission is improved.

[0007] Based on the first aspect, in an optional implementation method, the optical module performs digital signal processing on the electrical signal to obtain a service cell or a service packet, including: the optical module converts the electrical signal into a digital signal; the optical module demaps the digital signal to obtain a demapped signal; the optical module slices the demapped signal to obtain the service cell or the service packet.

[0008] By adopting this implementation method, the optical module can convert various types of services into service cells or service packets in a unified format based on digital signal processing, thereby reducing the power consumption of the optical module in processing service cells or service packets and improving the reliability of service transmission.

[0009] Based on the first aspect, in an optional implementation, the optical module slices the demapped signal to obtain the service cell or the service packet, including: the optical module slices the demapped signal according to the number of bytes or bits to obtain multiple service cells.

[0010] By adopting this implementation method, various types of services can be sliced ​​according to the number of bytes or bits, which improves the efficiency of service exchange and the reliability of service transmission.

[0011] Based on the first aspect, in an optional implementation, the demapped signal includes multiple subframes, and the optical module slices the demapped signal to obtain the service element or the service packet, including: the optical module slices the demapped signal according to the length of the subframe to obtain the service packet, and the service packet includes at least one of the subframes.

[0012] With this implementation, each service packet includes at least one complete subframe, which effectively reduces the packet loss rate of service transmission and improves the reliability of service transmission.

[0013] Based on the first aspect, in an optional implementation, after the optical module slices the demapped signal to obtain the service cell or the service packet, the method also includes: the optical module adds overhead to the service cell or the service packet, and the overhead carries at least one of the following: information indicating the target port, operation and maintenance information, switching information or timing information, wherein the switching information is used to indicate the switching method of the service cell or the service packet, and the timing information is used to indicate the timing of sending the service cell or the service packet.

[0014] By adopting this implementation mode, the increased overhead of the service cell or service packet can ensure the successful exchange of the service and improve the reliability of service transmission.

[0015] Based on the first aspect, in an optional implementation manner, the optical module sending the service cell or the service packet externally includes: the optical module sending the service cell or the service packet to a switching chip through a first transmission medium.

[0016] With this implementation, the optical module is directly connected to the switching chip via the first transmission medium. The optical module can send service cells or service packets to the switching chip via the first transmission medium, and the switching chip then successfully switches the service cells or service packets to the corresponding target port.

[0017] Based on the first aspect, in an optional implementation manner, the optical module sending the service cell or the service packet externally includes: the optical module sending the service cell or the service packet to another optical module through a second transmission medium.

[0018] By adopting this implementation, the optical module is directly connected to another optical module via the second transmission medium, thereby improving the reliability of the transmission of the service cell or service packet and reducing the transmission delay of the service cell or service packet.

[0019] Based on the first aspect, in an optional implementation method, the optical module sends the service cell or the service packet to the outside, including: the optical module converts the service cell or the service packet into a transmission optical signal; the optical module sends the transmission optical signal to the outside through a first transmission medium or a second transmission medium, the first transmission medium is used to connect the optical module and the switching chip, and the second transmission medium is used to connect the optical module and another optical module.

[0020] By adopting this implementation mode, the optical module converts the service cell or service packet into a transmission optical signal, and transmits the service cell or service packet through the transmission optical signal, thereby reducing the transmission delay of the service cell or service packet.

[0021] Based on the first aspect, in an optional implementation, the optical module is a direct detection optical module, and the optical module demaps the digital signal. After obtaining the demapped signal, the method also includes: the optical module performs forward error correction FEC decoding on the demapped signal to obtain a first decoded signal; the optical module slices the demapped signal to obtain the service cell or the service packet, including: the optical module slices the first decoded signal to obtain the service cell or the service packet.

[0022] With this implementation, the input optical fiber of the optical module is used to receive the optical signal that carries the business data. The FEC decoding of the optical module can improve the reliability of the optical signal transmission, reduce the bit error rate of the optical signal, and effectively suppress the inter-symbol interference of the optical signal transmission path.

[0023] Based on the first aspect, in an optional implementation, the optical module is a direct detection optical module or a coherent optical module, and the optical module demaps the digital signal to obtain the demapped signal, and the method further includes: the optical module performs FEC decoding on the demapped signal to obtain a first decoded signal; the optical module slices the demapped signal to obtain the service cell or the service packet, including: the optical module slices the first decoded signal to obtain the service cell or the service packet; after the optical module slices the demapped signal to obtain the service cell or the service packet, the method further includes: the optical module performs FEC encoding on the service cell or the service packet to obtain a first coded signal; the optical module sends the service cell or the service packet externally, including: the optical module sends the first coded signal externally.

[0024] With this implementation, the input optical fiber of the optical module is used to receive the optical signal that carries the service data, and the FEC decoding of the optical module can improve the reliability of the optical signal transmission, reduce the bit error rate of the optical signal, and effectively suppress the inter-symbol interference of the optical signal transmission path. The FEC coding of the optical module can improve the reliability of the service cell or the service packet transmission sent out by the optical module, and reduce the bit error rate of the service cell or service packet.

[0025] Based on the first aspect, in an optional implementation method, the optical module performs digital signal processing on the electrical signal to obtain a service cell or a service packet, including: the optical module performs digital signal processing on the electrical signal to convert it into N first transmission data streams, each of the first transmission data streams includes the service cell or the service packet, and N is an arbitrary integer not less than 1; the optical module performs redundant protection on the N first transmission data streams to convert them into M second transmission data streams, and M is an arbitrary integer greater than N; the optical module sends the service cell or the service packet to the outside, including: the optical module sends the M second transmission data streams to the outside.

[0026] By adopting this implementation, the optical module converts N first transmission data streams into M second transmission data streams, thereby achieving redundant protection for service data transmission and improving the reliability of service transmission.

[0027] In the second aspect, an embodiment of the present application provides a method for transmitting a service, the method comprising: an optical module receives a service cell or a service packet, the service cell or the service packet is used to carry service data; the optical module performs digital signal processing on the service cell or the service packet to obtain an electrical signal; the optical module converts the electrical signal into an optical signal; and the optical module sends the optical signal outward.

[0028] For the description of the beneficial effects of this aspect, please refer to the first aspect and the details will not be repeated here.

[0029] Based on the second aspect, in an optional implementation method, the optical module performs digital signal processing on the service cells or the service packets to obtain an electrical signal, including: the optical module combines the service cells or the service packets into a service flow according to the timing in which the service cells or the service packets are sent; the optical module maps the service flow to obtain a mapping signal; the optical module converts the mapping signal into the electrical signal, which is an analog signal.

[0030] Based on the second aspect, in an optional implementation method, the service cell or the service packet includes an overhead, and the overhead carries at least one of the following: information indicating a target port, operation and maintenance information, switching information or timing information, wherein the switching information is used to indicate a switching method of the service cell or the service packet, and the timing information is used to indicate a timing at which the service cell or the service packet is sent.

[0031] Based on the second aspect, in an optional implementation manner, the optical module receiving the service cell or the service packet includes: the optical module receiving the service cell or the service packet through a first transmission medium.

[0032] Based on the second aspect, in an optional implementation manner, the optical module receiving the service cell or the service packet includes: the optical module receiving the service cell or the service packet through a second transmission medium.

[0033] Based on the second aspect, in an optional implementation method, the optical module receives a service cell or a service packet, including: the optical module receives a transmission optical signal through a first transmission medium or a second transmission medium, the second transmission medium is used to connect the optical module and another optical module, and the first transmission medium is used to connect the optical module and a switching chip; the optical module converts the transmission optical signal into the service cell or the service packet.

[0034] Based on the second aspect, in an optional implementation, the optical module is a direct detection optical module, and after the optical module combines the service cells or the service packets into a service flow according to the timing in which the service cells or the service packets are sent, the method also includes: the optical module performs forward error correction FEC encoding on the service flow to obtain a second coded signal; the optical module maps the service flow to obtain a mapping signal, including: the optical module maps the second coded signal to obtain the mapping signal.

[0035] Based on the second aspect, in an optional implementation method, the optical module is a direct detection optical module or a coherent optical module, and the optical module combines the service cells or the service packets into a service flow according to the timing in which the service cells or the service packets are sent, including: the optical module performs FEC decoding on the service cells or the service packets to obtain a second decoding signal; the optical module combines the second decoding signal into the service flow according to the timing in which the service cells or the service packets are sent.

[0036] Based on the second aspect, in an optional implementation method, the optical module receives a service cell or a service packet, including: the optical module receives Q second transmission data streams, each of the second transmission data streams includes the service cell or the service packet, and Q is an arbitrary integer not less than 1; the optical module performs redundant protection on the Q second transmission data streams to obtain N first transmission data streams, where N is an arbitrary integer not less than 1, and Q is not less than N.

[0037] In the third aspect, an embodiment of the present application provides an optical module, which includes a photoelectric converter and a processor connected in sequence; the photoelectric converter is used to receive an optical signal and convert the optical signal into an electrical signal, and the optical signal carries business data; the processor is used to perform digital signal processing on the electrical signal, obtain a business cell or a business packet, and send the business cell or the business packet to the outside.

[0038] The optical module shown in this aspect is used to execute the method shown in the first aspect. For the description of the specific execution process and beneficial effects, please refer to the first aspect and the details will not be repeated here.

[0039] Based on the third aspect, in an optional implementation, the processor includes a digital signal processor and a switching network interface FIC; the digital signal processor is used to convert the electrical signal into a digital signal, and demap the digital signal to obtain a demapped signal; the FIC is used to slice the demapped signal to obtain the service cell or the service packet.

[0040] In a fourth aspect, an embodiment of the present application provides an optical module, which includes a photoelectric converter and a processor connected in sequence; the photoelectric converter is used to receive a service cell or a service packet, and the service cell or the service packet is used to carry service data; the processor is used to perform digital signal processing on the service cell or the service packet to obtain an electrical signal; the photoelectric converter is also used to convert the electrical signal into an optical signal and send the optical signal to the outside.

[0041] The optical module shown in this aspect is used to execute the method shown in the second aspect. For the description of the specific execution process and beneficial effects, please refer to the second aspect and the details will not be repeated here.

[0042] In a fifth aspect, the present application provides a transmission device, which includes a device board and an optical module connected to the device board, and the optical module is as described in the third aspect above.

[0043] Based on the fifth aspect, in an optional implementation, the processor includes a control interface, the control interface is connected to the device board, and the control interface is used to receive control signaling from the device board.

[0044] In a sixth aspect, the present application provides a transmission device, which includes a device board and an optical module connected to the device board, and the optical module is as described in the fourth aspect above.

[0045] Based on the sixth aspect, in an optional implementation, the processor includes a control interface, the control interface is connected to the device board, and the control interface is used to receive control signaling from the device board.

[0046] In the seventh aspect, an embodiment of the present application provides a switching device, which includes a first optical module and a second optical module; the first optical module is used to receive an optical signal, which carries business data, convert the optical signal into an electrical signal, perform digital signal processing on the electrical signal, obtain a business cell or a business packet, and send the business cell or the business packet to the second optical module; the second optical module is used to receive the business cell or the business packet, perform digital signal processing on the business cell or the business packet, obtain an electrical signal, convert the electrical signal into an optical signal, and send the optical signal to the outside.

[0047] The switching device shown in this aspect is used to execute the method described in any one of the first aspect or the second aspect above. For a description of the specific execution process and beneficial effects, please refer to any one of the first aspect or the second aspect above.

[0048] Based on the seventh aspect, in an optional implementation, the first optical module includes M interfaces, where M is an arbitrary integer not less than 2, and the M interfaces include a first interface and a second interface, the first interface is connected to a first switching chip, the second interface is connected to a second switching chip, and the first switching chip is different from the second switching chip; the first optical module is used to send a first service flow to the first switching chip through the first interface, and the first switching chip is used to send the first service flow to the second optical module; the first optical module is used to send a second service flow to the second switching chip through the second interface, and the second switching chip is used to send the second service flow to the second optical module, and the first service flow and the second service flow are respectively used to carry the service cell or the service packet. Each first interface can be an electrical interface or an optical interface.

[0049] In an eighth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer instructions. When the computer instructions are executed on a computer, the computer executes the method described in any one of the first aspect or the second aspect.

[0050] In a ninth aspect, an embodiment of the present application provides a chip, including a processor. The processor is used to read and execute a computer program stored in a memory to execute the method described in any one of the first aspect or the second aspect. Optionally, the chip also includes a memory, and the memory is connected to the processor through a circuit or wire. Optionally, the chip also includes a control interface or a clock interface.

[0051] In the tenth aspect, an embodiment of the present application provides an optical module, comprising a first photoelectric converter and a processor connected in sequence, the processor comprising a first digital-to-analog conversion interface, the first digital-to-analog conversion interface is connected to the first photoelectric converter, and the processor comprises a medium-range MR interface or a long-range LR interface; the first photoelectric converter is used to receive an optical signal and convert the optical signal into an electrical signal; the first digital-to-analog conversion interface is used to convert the electrical signal into a digital signal; the processor is used to process the digital signal and send the processed signal outward through the MR interface or the LR interface.

[0052] By adopting the structure of the optical module shown in this aspect, since the first optical module directly sends the signal after digital signal processing by the processor through the MR interface or the LR interface, the transmission of the MR interface or the LR interface effectively reduces the insertion loss of the signal after digital signal processing.

[0053] The optical module shown in this aspect can be used to execute the method described in any one of the first aspect or the second aspect above. For the description of the specific execution process and beneficial effects, please refer to the first aspect and the details will not be repeated here.

[0054] Based on the tenth aspect, in an optional implementation, the processor includes a digital signal processor and a framer, the digital signal processor and the framer are connected via an ultra-short distance XSR interface or an extremely short distance VSR, and the framer includes the MR interface or the LR interface.

[0055] With the structure of the optical module implemented in this manner, the digital signal processor and the framer are connected via an XSR interface or a VSR interface. Therefore, the digital signal processor and the framer do not need to be connected via a connector on a circuit board, thereby effectively reducing the length of the electrical connection path between the digital signal processor and the framer (for example, at the centimeter level), thereby effectively reducing the insertion loss of the signal transmitted between the digital signal processor and the framer.

[0056] Based on the tenth aspect, in an optional implementation, the optical module includes a circuit board, and the digital signal processor and the framer are independently mounted on the circuit board.

[0057] With the structure of the optical module implemented in this manner, the digital signal processor and the framer interact with each other through a circuit board. Since the first optical module directly sends the signal processed by the processor through the MR interface or the LR interface, the transmission of the MR interface or the LR interface effectively reduces the insertion loss of the signal processed by the digital signal.

[0058] Based on the tenth aspect, in an optional implementation, the processor includes a digital signal processor and a framer, and the digital signal processor and the framer are connected via a core particle interconnection interface.

[0059] Using the structure of the optical module shown in this aspect, the digital signal processor and the framer are connected through a core interconnection interface. The core interconnection interface effectively reduces the length of the electrical connection path between the digital signal processor and the framer (for example, micrometer level or millimeter level), thereby effectively reducing the insertion loss of the signal transmitted between the digital signal processor and the framer.

[0060] Based on the tenth aspect, in an optional implementation, the digital signal processor and the framer are installed as a whole on a circuit board of the optical module.

[0061] By adopting the structure of the optical module shown in this aspect, since the digital signal processor and the framer are installed as a whole on the circuit board of the optical module, the length of the electrical connection path between the digital signal processor and the framer is effectively reduced, thereby effectively reducing the insertion loss of the signal transmitted between the digital signal processor and the framer.

[0062] Based on the tenth aspect, in an optional implementation, the processor integrates a digital signal processor and a framer, and the processor includes a clock interface and / or a control interface, the control interface is used to receive control signaling, and the clock interface is used to receive a clock synchronization signal.

[0063] The structure of the optical module shown in the present implementation method integrates the functions of the digital signal processor and the framer in the integrated processing module, so that the information interaction between the digital signal processor and the framer does not need to go through a physical interface, but uses the wiring connection inside the processor, thereby effectively reducing the bit error rate of the signal transmitted by the integrated processing module.

[0064] Based on the tenth aspect, in an optional implementation, the MR interface or the LR interface is connected to a transmission medium, and the transmission medium is used to connect a switching chip or another optical module.

[0065] Based on the ten aspects, in an optional implementation, the processor also includes a second digital-to-analog conversion interface, the optical module also includes a second photoelectric converter, the second photoelectric converter is connected to the MR interface or the LR interface, and the second digital-to-analog conversion interface is connected to the second photoelectric converter; the second digital-to-analog conversion interface is used to convert the processed signal into an analog signal, and the second photoelectric converter is used to convert the analog signal into another optical signal and send the other optical signal to the outside.

[0066] By adopting the optical module structure shown in the present implementation, the optical module can send out signals that have been processed by digital signals through optical signals, and can also receive signals that have been processed by digital signals through optical signals, thereby reducing the delay of signal transmission and improving reliability.

[0067] In the eleventh aspect, an embodiment of the present application provides a switching device, including a backplane, an optical module installed on the backplane, and a switching chip. The optical module is as described in any one of the tenth aspect above, and the MR interface or the LR interface of the optical module is connected to the switching chip through the backplane.

[0068] Based on the eleventh aspect, in an optional implementation, the optical module is installed on the backplane through a first device board, the switching chip is installed on the backplane through a second device board, and the first device board and the second device board are connected through the backplane. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] Figure 1a An example diagram of the structure of an embodiment of an optical network;

[0070] Figure 1b for Figure 1a A structural example diagram of a switching device shown;

[0071] Figure 2 A flowchart of the first embodiment of the method for transmitting the service provided by the present application;

[0072] Figure 3 for Figure 1b An example structural diagram of the first optical module shown;

[0073] Figure 4a The first slice example diagram provided for this application;

[0074] Figure 4b The second slice example diagram provided for this application;

[0075] Figure 5 for Figure 1a Another structural example diagram of the switching device shown;

[0076] Figure 6 for Figure 1a Another structural example diagram of the switching device shown;

[0077] Figure 7 for Figure 1b An example structural diagram of a second optical module shown;

[0078] Figure 8 An example diagram of the structure of an embodiment of the switching device provided in this application;

[0079] Fig. 9 A flow chart of the steps of a second embodiment of the method for transmitting the service provided by the present application;

[0080] Fig.10 Another example diagram of the structure of the switching device provided in the present application;

[0081] Fig.11 A flowchart of the third embodiment of the method for transmitting the service provided by the present application;

[0082] Fig.12 The third slice example diagram provided for this application;

[0083] Fig.13a for Fig.10 An exemplary structural diagram of an embodiment of the first optical module shown;

[0084] Fig.13b for Fig.10 Another structural example diagram of an embodiment of the first optical module shown;

[0085] Fig.14 for Fig.10 An exemplary structural diagram of an embodiment of a second optical module is shown;

[0086] Fig.15 for Fig.10 Another structural example diagram of an embodiment of the second optical module shown;

[0087] Fig.16 A flowchart of the fourth embodiment of the method for transmitting the service provided by the present application;

[0088] Fig.17 An example diagram of the structure of an embodiment of a coherent optical module provided in the present application;

[0089] Fig.18 This is another structural example diagram of a coherent optical module provided in the present application;

[0090] Fig.19 This is a diagram showing an example structure of the first embodiment of the optical module provided in this application;

[0091] Fig. 20 This is a diagram showing an example structure of a second embodiment of the optical module provided in this application;

[0092] Fig.21 This is a structural example diagram of a third embodiment of the optical module provided in this application;

[0093] Fig. 22 This is a structural example diagram of a fourth embodiment of the optical module provided in this application;

[0094] Fig.23 This is a diagram showing a fifth structural example of an optical module provided in the present application;

[0095] Fig.24 This is another example structural diagram of a switching device provided in the present application. DETAILED DESCRIPTION

[0096] The embodiments of the present application provide a service transmission method, an optical module, and a transmission device, which can reduce the power consumption of the optical module in processing various services. Figure 1a The optical network includes a switching device 100 for receiving various services. The switching device 100 aggregates various services into transmission frames, and then transmits them to the switching device 140 after being pulled away by the optical system. The switching device 140 parses various services from the transmission frames and sends various services to user-side devices (such as computers, telephones, or televisions, etc.).

[0097] Figure 1b for Figure 1aA structural example diagram of a switching device is shown. Taking the switching device 100 as an example, the switching device 100 includes a first transmission device 101, a switching chip 110 and a second transmission device 120. Among them, the first transmission device 101 can also be called a branch board, the second transmission device 120 can also be called a line board, and the switching chip 110 can also be called a cross board or a switching board. The first transmission device 101 includes a device single board 102 and a first optical module 103 connected to the device single board 102. This example takes the detachable connection between the first optical module 103 and the device single board 102 as an example. In other examples, the first optical module 103 is integrated with the device single board 102 to achieve a non-detachable connection. The second transmission device 120 includes a device single board 121 and a second optical module 122. For the description of the second transmission device 120, please refer to the description of the first transmission device 101, and the details are not repeated. It should be noted that according to specific needs, the type and quantity of single boards included in the switching device 100 may be different. The switching device 100 may also include a power supply 130, a heat dissipation system 131, and an auxiliary single board 132. The power supply 130 is used to supply power to the switching device 100, and may include a main power supply and a backup power supply. The heat dissipation system 131 is used to dissipate heat for the switching device 100. The auxiliary single board 132 is used to provide auxiliary functions such as external alarms or access to external clocks. The device type of the first transmission device 101 may be an optical transmission device, an optical access device, a router, a switch, a wireless base station, a wireless remote access device, a wireless baseband signal processing device, etc., or a computing server (usually referred to as a server), a high performance computer (HPC), a storage server, or a memory resource pool, etc. This example does not limit the type of the first transmission device 101, as long as the first transmission device 101 has an electro-optical conversion function, an optical interface that can be connected to an optical fiber, and an electrical interface that can be connected to the switching chip 110.

[0098] based on Figure 1a As shown in 1b, combined with Figure 2 The execution process of the transmission method of the service provided by the present application is described, wherein: Figure 2 This is a flowchart of the first embodiment of the method for transmitting the service provided in this application.

[0099] Step 201: The first optical module receives an optical signal.

[0100] Combination Figure 1b as well as Figure 3 As shown, the method shown in this embodiment is specifically described, wherein, Figure 3 for Figure 1bA structural example diagram of the first optical module shown. The first optical module 103 includes an input optical fiber 301, which is used to receive an optical signal, and the optical signal carries service data. The service data shown in this embodiment can carry various types of services, such as synchronous digital hierarchy (SDH) services, packet services, Ethernet services, flexible Ethernet (FlexE), fronthaul services, optical transport network (OTN) services, storage services, data center services or supercomputing services, etc. This embodiment does not limit the number of services and specific types carried by the service signal. If the service type carried by the optical signal is OTN service, the data frame included in the optical signal is an OTN frame. The OTN frame can be an optical data unit (ODUk), ODUCn, ODU flexible (flex), or an optical channel transmission unit (optical transport unit k, OTUk), OTUCn, or OTN Flex, etc. Among them, the difference between the ODU frame and the OTU frame is that the OTU frame includes the ODU frame and the OTU overhead, k represents different rate levels, and Cn represents a variable rate. The OTN frame may also be an optical service unit (OSU) frame. OSU is only an example and should not limit the frame structure defined in this application. The name may also be replaced by other names such as low-rate frame, low-speed service frame or optical service data unit frame. With the development of OTN technology, new types of OTN frames may be defined, which are also applicable to this application. For another example, the data frame may also be an optical transport unit (OTUk). For another example, the data frame may also be a signal such as an optical payload unit (OPUk). If the service type carried by the optical signal is Ethernet service, the data frame may be an Ethernet data frame.

[0101] The optical signal received by the first optical module shown in this embodiment includes data frames of various types and rates. For example, the optical signal shown in this embodiment includes ODU1, ODU2, and Ethernet data frames.

[0102] Step 202: The first optical module converts the optical signal into an electrical signal.

[0103] Figure 3In the embodiment, the input optical fiber 301 of the first optical module 103 is connected to the photoelectric converter 302, and the photoelectric converter 302 is used to perform photoelectric conversion (demodulation) on the optical signal to output an electrical signal. The photoelectric converter 302 can be a photodiode (positive intrinsic-negative, PIN) or an avalanche photo diode (avalanche photo diode, APD), etc., and is not specifically limited.

[0104] Step 203: The first optical module performs digital signal processing on the electrical signal to obtain a demapped signal.

[0105] Figure 3 The first optical module 103 shown includes a processor 303 connected to the photoelectric converter 302. The processor 303 may be one or more chips, or one or more integrated circuits. For example, the processor 303 may be one or more optical digital signal processors (oDSP), field-programmable gate arrays (FPGA), application specific integrated circuits (ASIC), system on chip (SoC), central processor unit (CPU), network processor (NP), microcontroller unit (MCU), programmable logic device (PLD), network card chip, storage interface chip or other integrated chip, or any combination of the above chips, or processors, etc., which will not be described in detail.

[0106] Specifically, the processor 303 includes a digital signal processor 321, which may specifically include an analog to digital converter (ADC) and a demapping module. The ADC performs analog-to-digital conversion on the electrical signal from the photoelectric converter 302 to obtain a digital signal. The demapping module of the digital signal processor 321 demaps the digital signal to obtain a demapped signal. In this embodiment, the demapping module cooperates with the hard decision forward error correction (FEC) to perform constellation demapping on the digital signal as an example. Constellation demapping refers to demapping a demapped signal from a constellation diagram. The constellation diagram includes constellation points, such as constellation point 1+j in the QPSK constellation diagram, and the demapping module demaps the bit "01" from the constellation point 1+j. It can be understood that the demapped signal demapped by the demapping module from each constellation point included in the constellation diagram is a binary bit sequence, such as "0101001010101010...", and the demapped signal carries service data. It should be clarified that the description of the processing of the digital signal processor 321 in this embodiment is an optional example and is not limited. For example, the digital signal processor 321 can also perform clock recovery, channel compensation, multiple-in multipleout (MIMO) equalization, carrier phase recovery, dispersion estimation, etc.

[0107] Step 204: The first optical module slices the demapped signal to obtain a service cell or a service packet.

[0108] Figure 3 In the embodiment, the processor 303 also includes a switching network interface (fabric interface controller, FIC) 322 connected to the digital signal processor 321. FIC322 is used to slice the demapped signal to obtain a service cell or a service packet. In this embodiment, the processor 303 includes FIC322 as an example. In other examples, in the first optical module 103, the FIC is an independent chip and is separately provided from the processor 303, and is not specifically limited. Specifically, FIC322 includes a slicing module and an overhead module. The slicing module receives the demapped signal from the demapping module, and slices the demapped signal to obtain a service cell or a service packet.

[0109] Example 1: This example illustrates the process in which the FIC slices the demapped signal to obtain multiple service cells:

[0110] See also Figure 4a As shown, Figure 4aThis is an example diagram of the first type of slicing provided in the present application. After the slicing module receives the demapping signal from the demapping module, it slices it into K slice signals according to the number of bytes or bits. The value of K is any integer greater than 1, and each slice signal includes R bytes or bits. In this embodiment, it is taken that each slice includes R bytes as an example. The slicing module uses the 1st byte to the Rth byte of the demapping signal as the first slice signal, and the slicing module uses the R+1th byte to the 2Rth byte of the demapping signal as the second slice signal, and so on. The slicing module obtains the Kth slice signal. In this embodiment, it is taken that different slice signals include the same number of bytes as an example. Optionally, different slice signals may include different numbers of bytes, and slicing can be performed specifically according to requirements. The overhead module adds overhead (OH) to each slice signal to obtain a service cell. As Figure 4a As shown, the overhead module obtains a service cell 401, which includes OH411 and a first slice signal, and the overhead module obtains a service cell 402, which includes OH412 and a second slice signal. By analogy, the overhead module obtains a service cell 40K, which includes OH41K and a Kth slice signal. Taking the service cell 401 as an example, the OH411 included in the service cell 401 carries at least one of the following items:

[0111] Used to indicate the information of the target port, operation and maintenance information, switching information or timing information. Among them, the target port refers to the port used to receive the service cell 401. For example, the information of the target port may be the target port number or the media access control address (MAC) of the device receiving the service cell 401. The operation and maintenance information can be used to perform a cyclic redundancy check (CRC), etc. The switching information is used to indicate the switching mode of the service cell 401, which may be unicast or multicast. The timing information is used to indicate the timing of sending the service cell 401. For example, among the K service cells, the first optical module first sends the service cell 401, and so on, and finally sends the service cell 40K. Then, the timing information carried in OH411 of the service cell 401 is used to indicate the moment of sending the service cell 401, and the timing information carried in OH41K of the service cell 40K is used to indicate the moment of sending the service cell 40K. This embodiment does not limit the content carried by the timing information. For example, the timing information carried by the OH is used to indicate the order of each service cell in the K service cells. This embodiment does not limit the information carried by the OH. For example, the OH may also carry information for indicating an output electrical interface through which the first optical module outputs the service cell 401.

[0112] Example 2: This example illustrates the process in which the FIC slices the demapped signal to obtain multiple service packets:

[0113] The demapped signal shown in this embodiment may include multiple subframes. For example, if the demapped signal is used to carry Ethernet services, the type of each subframe included in the demapped signal may be an Ethernet data frame. For another example, if the demapped signal is used to carry OTN services, the type of each subframe included in the demapped signal may be an OTN frame. This example takes each subframe included in the demapped signal as an Ethernet data frame as an example. Figure 4b As shown, Figure 4b This is a second example diagram of slicing provided in the present application. After the slicing module receives the demapped signal from the demapping module, it slices it according to the length of each subframe to obtain K sliced ​​signals, where the value of K is any integer greater than 1. For example, if the demapped signal includes K subframes (for example, K Ethernet data frames), the slicing module slices each subframe, and then each obtained service packet includes a subframe. It can be understood that each service packet shown in this embodiment includes a complete subframe. This embodiment takes the example that each service packet includes a subframe. In other examples, each service packet may include more than two complete subframes. For example, the slicing module slices out a complete first subframe and a second subframe from the demapped signal, and so on to the Kth subframe. The overhead module adds OH to each subframe to obtain a service packet. The overhead module obtains service package 421, which includes OH431 and the first subframe. The overhead module obtains service package 422, which includes OH432 and the second subframe. And so on. The overhead module obtains service package 42K, which includes OH43K and the Kth subframe. For the description of OH carried by each service package, please refer to the description of OH in the above example 1, and the details are not repeated here. In this example, each service package includes at least one complete subframe, which effectively reduces the packet loss rate of service transmission and improves the reliability of service transmission.

[0114] Figure 3In the embodiment, the processor 303 of the first optical module also includes a control interface. Specifically, the digital signal processor includes the control interface, or the FIC includes the control interface, which is not specifically limited. The control interface is connected to the device board, and the control interface is used to receive control signaling from the device board. For example, the control signaling is used to instruct the digital signal processor to perform a digital signal processing process. For another example, the control signaling is used to instruct the FIC to perform a slice processing process, etc. This embodiment does not limit the description of the control signaling, as long as the first optical module executes the transmission process of the service shown in this embodiment according to the control instruction. The processor 303 may also include a clock interface. For the description of the location of the clock interface, please refer to the description of the location of the control interface, which is not described in detail. The first optical module receives clock information from the device board according to the clock interface to achieve clock synchronization.

[0115] Step 205: The first optical module sends a service cell or a service packet to the switching chip.

[0116] Step 206: The switching chip sends a service cell or a service packet to the second optical module.

[0117] Figure 5 for Figure 1a Another structural example diagram of the switching device shown. The first optical module shown in this embodiment includes a first electrical interface, and the first electrical interface is connected to the first transmission medium. The first optical module is connected to the switching chip through the first transmission medium. The first transmission medium may be a cable, a wiring of a circuit board, or an electrical connector. In this embodiment, the first transmission medium is a cable as an example. For example, the first optical module includes K first electrical interfaces, that is, a first electrical interface 501, a first electrical interface 502, and so on, a first electrical interface 50K. It should be clear that this embodiment does not limit the number of first electrical interfaces included in the first optical module. Each first electrical interface included in the first optical module is connected to the switching chip through a cable. In this embodiment, the first electrical interface 501 sends a service cell 401 to the switching chip through a cable, and the first electrical interface 502 sends a service cell 402 to the switching chip through a cable. By analogy, the first electrical interface 50K sends a service cell 40K to the switching chip through a cable. In this embodiment, each first electrical interface of the first optical module sends one service cell as an example. In other examples, each first electrical interface of the first optical module can send more than one service cell, which is not specifically limited.

[0118] Continuing to refer to 4a, after receiving each service cell, the switching chip extracts OH from the service cell and determines the target port for receiving the service cell according to the OH. For example, the switching chip obtains the information of the target port according to OH411 (this example takes the information of the target port as an example for indicating the second electrical interface 511 of the second optical module), then the switching chip sends the service cell 401 to the second electrical interface 511 of the second optical module according to OH411. The switching chip obtains the information of the target port according to OH412 (this example takes the information of the target port as an example for indicating the second electrical interface 512 of the second optical module), then the switching chip sends the service cell 402 to the second electrical interface 512 of the second optical module according to OH412. By analogy, the switching chip obtains the information of the target port according to OH41K (this example takes the information of the target port as an example for indicating the second electrical interface 51K of the second optical module), then the switching chip sends the service cell 40K to the second electrical interface 51K of the second optical module according to OH41K. In this embodiment, the switching chip is connected to the second optical module through the first transmission medium. For the description of the first transmission medium, please refer to the description of the first transmission medium mentioned above, and the details are not repeated here. In this embodiment, the first transmission medium is a cable as an example. The switching chip sends the service cell 401 and the service cell 402 to the service cell 40K to the second electrical interface 511 and the second electrical interface 512 to the second electrical interface 51K of the second optical module through the cable. As shown in this embodiment, if the OH carries the switching information, the switching chip switches the service cells according to the switching information. For example, if the switching information is used to indicate unicast, the switching chip sends the service cells to the second optical module by unicast. If the OH carries the operation and maintenance information, the switching chip can perform corresponding operation and maintenance on the service cells according to the operation and maintenance information, for example, perform CRC on the service cells.

[0119] Figure 6 for Figure 1a Another structural example diagram of a switching device is shown. Figure 5 In the example shown, it is taken that the service information unit or service packet between the first optical module and the switching chip is transmitted through an electrical signal, and the service information unit or service packet between the switching chip and the second optical module is transmitted through an electrical signal. Figure 6In the example shown, the service cell or service packet between the first optical module and the switching chip is transmitted via an optical signal, and the service cell or service packet between the switching chip and the second optical module is transmitted via an optical signal, which improves the reliability of the transmission of the service cell or service packet and reduces the transmission delay of the service cell or service packet. The first optical module includes an optoelectronic converter 611, an optoelectronic converter 612 to an optoelectronic converter 61K, which are respectively connected to the FIC. The switching chip includes an optoelectronic converter 621, an optoelectronic converter 622 to an optoelectronic converter 62K, and the optoelectronic converter 621, the optoelectronic converter 622 to the optoelectronic converter 62K are respectively connected to the optoelectronic converter 611, the optoelectronic converter 612 to the optoelectronic converter 61K via a first transmission medium. The first transmission medium shown in this example is an optical transmission medium such as an optical cable, an optical fiber, or an optical waveguide for transmitting optical signals. The switching chip further includes a photoelectric converter 631, a photoelectric converter 632 to a photoelectric converter 63K, and the second optical module includes a photoelectric converter 651, a photoelectric converter 652 to a photoelectric converter 65K, wherein the photoelectric converter 631, the photoelectric converter 632 to the photoelectric converter 63K are respectively connected to the photoelectric converter 651, the photoelectric converter 652 to the photoelectric converter 65K through a first transmission medium. The first transmission medium shown in this embodiment is an optical cable. For the description of the first transmission medium, please refer to the description of the first transmission medium above, and no further details will be given.

[0120] Taking the service cell 401 as an example, the photoelectric converter 611 performs an electro-optical conversion on the service cell 401 from the FIC to obtain a transmission optical signal, and the photoelectric converter 611 transmits the transmission optical signal to the photoelectric converter 621 of the switching chip through an optical cable. The photoelectric converter 621 performs an electro-optical conversion on the transmission optical signal to obtain a service cell, and extracts OH from the service cell, and determines to send the service cell to the photoelectric converter 631 according to the OH, and the photoelectric converter 631 performs an electro-optical conversion on the service cell to obtain a transmission optical signal, and sends the transmission optical signal to the photoelectric converter 651 of the second optical module through an optical cable, and the photoelectric converter 651 performs an electro-optical conversion on the transmission optical signal to obtain the service cell, so as to ensure that the second optical module can successfully receive the service cell from the first optical module.

[0121] This embodiment takes the switching chip exchanging service cells as an example. The switching chip can also exchange service packages. For the description of the switching chip exchanging service packages, please refer to the description of the switching chip exchanging service cells shown in this embodiment, and the details are not repeated here.

[0122] Step 207: The second optical module performs digital signal processing on the service cell or service packet to obtain an electrical signal.

[0123] Combination Figure 7 The figure illustrates the process of the second optical module performing digital signal processing on the service cell or service packet. Figure 7 for Figure 1b The second optical module 122 includes a processor 701, an optoelectronic converter 702, and an output optical fiber 703. The processor 701 shown in this embodiment specifically includes an FIC 711 and a digital signal processor 712. The digital signal processor 712 specifically includes a mapping module and a digital to analog converter (DAC). For a description of the type of processor 701 and a description of the FIC, see Figure 3 As shown, the details are not repeated here.

[0124] The FIC711 of the second optical module specifically includes an overhead extraction module and a combination module. Figure 4a As shown, after receiving the service cell, the overhead extraction module extracts the OH of each service cell. For example, the overhead extraction module extracts OH411 from service cell 401, extracts OH412 from service cell 402, and extracts OH41K from service cell 40K. Each OH shown in this embodiment already carries timing information. For the description of the timing information, please refer to step 204, and the details are not repeated here. The combination module of the second optical module combines the K slice signals from the first optical module into a service flow based on the timing information carried by each OH. Moreover, the timing of each slice signal in the demapped signal is the same as the timing of each slice signal in the service flow. For example, the first slice signal is the first of the K slice signals sent by the first optical module, then the first slice signal is a slice signal in the service flow obtained by the second optical module. The second slice signal is the second of the K slice signals sent by the first optical module, then the second slice signal is the second slice signal in the service flow obtained by the second optical module. The Kth slice signal is the last one of the K slice signals sent by the first optical module, then the Kth slice signal is the last slice signal in the service flow obtained by the second optical module. It should be clear that in this embodiment, the multiple service cells received by the second optical module are all from the same first optical module. In other examples, the multiple service cells received by the second optical module may come from multiple different first optical modules. Then, the second optical module combines the multiple service cells that have been received into a service flow based on the timing information carried by each OH, according to the timing in which the multiple service cells are sent. Optionally, if the OH also carries operation and maintenance information, the FIC can operate and maintain the service cells according to the operation and maintenance information. For example, the FIC performs CRC on the service cells according to the operation and maintenance information.

[0125] The mapping module of the digital signal processor 712 maps the service flow and converts it into a mapping signal. In this embodiment, the mapping module performs constellation mapping on the service flow and converts it into a mapping signal. Constellation mapping means that the mapping module maps each bit of the service flow to a constellation point of the constellation diagram to output a mapping signal. Based on constellation mapping, the spectrum efficiency and anti-noise capability of service transmission can be improved. The DAC receives the mapping signal from the mapping module and performs digital-to-analog conversion on the mapping signal to output an electrical signal, which is an analog signal.

[0126] Step 208: The second optical module converts the electrical signal into an optical signal and emits the optical signal.

[0127] Continue to see Figure 7 As shown, the photoelectric converter 702 receives the electrical signal from the DAC, and performs electro-optical conversion (demodulation) on the electrical signal to obtain an optical signal. The photoelectric converter 702 is connected to the output optical fiber 703, and the photoelectric converter 702 transmits the optical signal through the output optical fiber 703. The photoelectric converter 702 shown in this embodiment can adopt a direct modulation laser (direct modulation laser, DML), an electro-absorption modulated laser (electro-absorption modulated laser, EML) or a vertical cavity surface emitting laser (vertical cavity surface emitting laser, VCSEL). For another example, the photoelectric converter 702 can also adopt the structure of a laser and a photoelectric converter, and the photoelectric converter can be a Mach-Zehnder modulator (MZM) or a micro-ring photoelectric converter (MRM), etc.

[0128] In this embodiment, the second optical module performs digital signal processing as an example. In other examples, the second device board may also perform digital signal processing, wherein the second device board is connected to the second optical module. In this example, the second optical module is only used for photoelectric conversion. For an explanation of the process of the second device board performing digital signal processing to obtain an electrical signal, please refer to the explanation of the second optical module performing digital signal processing to obtain an electrical signal shown above, and no further details will be given.

[0129] Figure 7In the embodiment, the processor 701 of the second optical module may further include a control interface. Specifically, the digital signal processor includes the control interface, or the FIC includes the control interface, which is not specifically limited. The control interface is connected to the device board, and the control interface is used to receive control signaling from the device board. For example, the control signaling is used to instruct the digital signal processor to perform a digital signal processing process. For another example, the control signaling is used to instruct the FIC to perform a combination to obtain a service flow process, etc. This embodiment does not limit the description of the control signaling, as long as the second optical module executes the transmission process of the service shown in this embodiment according to the control instruction. The processor 701 may also include a clock interface. For the description of the location of the clock interface, please refer to the description of the location of the control interface, which is not described in detail. The second optical module receives clock information from the device board according to the clock interface to achieve clock synchronization.

[0130] By adopting the method shown in this embodiment, even if the types of services received by the first optical module are increased with the continuous growth of fixed-line, mobile and dedicated line services, the first optical module can convert different services into service cells or service packets of a unified format. The second optical module directly receives the service cells or service packets, and because the format of the service cells or service packets is unified, the power consumption of the second optical module in processing the service cells or service packets is reduced. Moreover, because various types of services are transmitted through service cells or service packets, the successful transmission of the services is guaranteed and the reliability of service transmission is improved.

[0131] Figure 2 In the embodiment shown, the service cell or service packet emitted by the first optical module needs to be switched to the second optical module through the switching chip. Figure 8 As shown, the first optical module directly sends a service cell or service packet to the second optical module. Figure 8 This is an example diagram of the structure of an embodiment of the switching device provided in the present application. The switching device shown in this embodiment includes multiple optical modules. This embodiment does not limit the number of optical modules included in the switching device. This embodiment takes the switching device including the first optical module 801, the second optical module 802 and the third optical module 803 as an example. Any two of the FIC of the first optical module 801, the FIC of the second optical module 802 and the FIC of the third optical module 803 are connected through a transmission medium. For a description of FIC, please refer to Figure 3 or Figure 7 As shown, the details are not repeated here.

[0132] based on Figure 8 As shown, Fig. 9 This is a flow chart of the steps of a second embodiment of the method for transmitting the service provided in this application.

[0133] Step 901: The first optical module receives an optical signal.

[0134] Step 902: The first optical module converts the optical signal into an electrical signal.

[0135] Step 903: The first optical module performs digital signal processing on the electrical signal to obtain a demapped signal.

[0136] For a description of the execution process of steps 901 to 903 shown in this embodiment, please refer to Figure 2 The corresponding steps 201 to 203 are shown and will not be described in detail.

[0137] Optionally, the FIC of the first optical module 801 shown in this embodiment can also be connected to the device board 804, and the FIC of the first optical module 801 receives the service electrical signal from the device board 804, and the first optical module 801 performs digital signal processing on the service electrical signal from the device board 804 to obtain a demapped signal.

[0138] Step 904: The first optical module slices the demapped signal to obtain a service cell or a service packet.

[0139] For a description of the execution process of step 904 shown in this embodiment, please refer to Figure 2 The corresponding step is shown in step 204 and will not be described in detail.

[0140] Step 905: The first optical module sends a service cell or a service packet to the second optical module.

[0141] Since the FIC of the first optical module shown in this embodiment is connected to the FIC of the second optical module through the second transmission medium, the first optical module can directly send the service cell or service packet to the second optical module through the second transmission medium. For a description of the second transmission medium shown in this embodiment, see Figure 2 The description of the first transmission medium in the corresponding embodiment is not repeated in detail.

[0142] Optionally, the FIC of the first optical module may include a photoelectric converter, and the FIC of the second optical module may include a photoelectric converter. The photoelectric converter of the first optical module is connected to the photoelectric converter of the second optical module via a second transmission medium. Then, the photoelectric converter can perform electro-optical conversion on the service cell or service packet to obtain a transmission optical signal, and send it to the photoelectric converter of the second optical module via the second transmission medium. The photoelectric converter of the second optical module performs photoelectric conversion on the transmission optical signal to obtain a service cell or service packet. For a description of the specific process, please refer to Figure 6 The description of the first optical module sending the transmission optical signal to the switching chip is not described in detail.

[0143] Step 906: The second optical module performs digital signal processing on the service cell or service packet to obtain an electrical signal.

[0144] For the description of the execution process of step 906 shown in this embodiment, please refer to step 207, and the details are not repeated here.

[0145] Step 907: The second optical module converts the electrical signal into an optical signal and emits the optical signal.

[0146] For a description of the execution process of step 906 to step 907 shown in this embodiment, please refer to Figure 2 The corresponding steps 207 to 208 are shown, and the specific execution process is not repeated here.

[0147] Figure 8 In the embodiment shown, for a description of the process of exchanging service cells or service packets between any two optical modules among the first optical module, the second optical module and the third optical module, see Fig. 9 The description of the first optical module sending a service cell or a service packet to the second optical module is not described in detail.

[0148] By adopting the method shown in this embodiment, even if the types of services received by the first optical module are increased with the continuous growth of fixed-line, mobile and dedicated line services, the first optical module can convert different services into service cells or service packets of a unified format. The second optical module directly receives the service cells or service packets. Since the format of the service cells or service packets is unified, the power consumption of the second optical module in processing the service cells or service packets is reduced. Moreover, in the process of the first optical module sending the service cells or service packets to the second optical module, there is no need to exchange them through the switching chip, which reduces the transmission delay of the service cells or service packets.

[0149] Figure 1a In the example shown, the first optical module is connected to a switching chip, and Fig.10 In the illustrated embodiment, the first optical module can be connected to a plurality of different switching chips, wherein: Fig.10 This is another example structural diagram of a switching device provided in the present application.

[0150] The FIC of the first optical module 1001 shown in this embodiment includes multiple electrical interfaces. For example, the FIC of the first optical module includes M electrical interfaces, namely electrical interface 1011, electrical interface 1012 to electrical interface 101M, where M is an integer greater than 1. The M electrical interfaces of the first optical module are respectively connected to M switching chips. For example, electrical interface 1011 is connected to switching chip 1021, electrical interface 1012 is connected to switching chip 1022, and so on, electrical interface 101M is connected to switching chip 102M. The FIC of the second optical module 1021 includes M electrical interfaces, namely electrical interface 1031, electrical interface 1032 to electrical interface 103M. Electrical interface 1031, electrical interface 1032 to electrical interface 103M are respectively connected to switching chip 1021, switching chip 1022 to switching chip 102M.

[0151] based on Fig.10 The switching device shown, Fig.11 This is a flowchart of the steps of the third embodiment of the method for transmitting the service provided in this application.

[0152] Step 1101: The first optical module receives an optical signal.

[0153] Step 1102: The first optical module converts the optical signal into an electrical signal.

[0154] For a description of the execution process of steps 1101 to 1102 shown in this embodiment, please refer to Figure 2 The corresponding steps 201 to 202 are shown and will not be described in detail.

[0155] Step 1103: The first optical module performs digital signal processing on the electrical signal and converts it into M second transmission data streams.

[0156] Step 1104: The first optical module sends M second transmission data streams to M switching chips.

[0157] The first optical module performs digital signal processing on the electrical signal to obtain a demapped signal. For a description of the process of the first optical module obtaining the demapped signal, see Figure 2 The description of obtaining the demapped signal shown in the corresponding step 203 is not described in detail.

[0158] Combination Fig.12 as well as Fig.13a The figure illustrates a process in which the first optical module obtains M second transmission data streams. Fig.12 This is the third example slice diagram provided for this application. Fig.13a for Fig.10 The first optical module 1001 shown in this embodiment specifically includes an input optical fiber 1301, an optical-to-electrical converter 1302, and a processor 1303. For details, see Figure 3 The corresponding description is omitted here. In the FIC shown in this embodiment, the slicing module, the overhead module and the sharing module are connected in sequence.

[0159] The slicing module slices the demapped signal to obtain K-channel slice signals. The slicing module shown in this embodiment sends K-channel slices to the overhead module, and the overhead module obtains K-channel service cells according to the K-channel slice signals. For an explanation of how the overhead module obtains K-channel service cells, see Figure 4aThe corresponding instructions are not repeated in detail. After the overhead module adds OH to each slice signal, it sends N first transmission data streams to the sharing module, and each first transmission data stream includes at least one service information element, and N is any integer not less than 1. For example, the first first transmission data stream obtained by the overhead module includes a first service information element and a second service information element. This embodiment does not limit the number of service information elements included in the first transmission data stream. This embodiment takes the example that each first transmission data stream includes at least one service information element. In other examples, the first transmission data stream may also include at least one service packet. For a description of the specific process, please refer to the description that the first transmission data stream includes service information elements, and the details are not repeated here.

[0160] The sharing module performs redundant protection on the N-channel first transmission data stream and converts it into M-channel second transmission data stream, where M is any integer greater than N. In this embodiment, M=P+Q is taken as an example. Among the M switching chips, if P switching chips fail, it can still ensure that the first optical module can successfully send the service to the second optical module, thereby ensuring the reliability of the first optical module transmitting the service to the second optical module. In order to ensure that the first optical module successfully transmits the service to the second optical module, it is necessary to ensure that at least Q switching chips among the M switching chips can normally exchange service cells or service packets. Specifically, the sharing module obtains the multiplied flow Y, Y=X*(P+Q) / Q. Among them, X is the total flow of the N-channel first transmission data stream. The multiplied flow Y is the total flow of the M-channel second transmission data stream. It can be understood that Y>X shown in this embodiment. The sharing module can add redundant information to the flow X. The sharing module pre-encodes the flow X according to a certain algorithm so that the added redundant information carries the signal characteristics of the N-channel first transmission data stream itself. The sharing module evenly divides the traffic Y into M second transmission data streams. Then, the sharing module can send M second transmission data streams to M electrical interfaces. It can be understood that the electrical interface 1011 sends the first second transmission data stream to the switching chip 1021, the electrical interface 1012 sends the second second transmission data stream to the switching chip 1022, and so on, the electrical interface 101M sends the Mth second transmission data stream to the switching chip 102M.

[0161] Fig.13a The description of the first optical module structure shown is an optional example and is not limited. For example, Fig.13b for Fig.10 Another exemplary structural diagram of an embodiment of the first optical module is shown. Fig.13b The first optical module 1001 shown includes an input optical fiber 1311, an optical-to-electrical converter 1312, and a processor 1313. For a description of the input optical fiber 1311, the optical-to-electrical converter 1312, and the processor 1313, see Fig.13a As shown, the details are not repeated here. Fig.13bThe FIC shown includes a slicing module, a sharing module and an overhead module which are connected in sequence, that is, the sharing module is located between the slicing module and the overhead module. Fig.13b The first optical module shown in the figure, after the slicing module obtains the demapped signal, slices the demapped signal to obtain N first transmission data streams, each of which includes at least one slice signal. The sharing module performs redundant protection on the N first transmission data streams to obtain M second transmission data streams. For a description of redundant protection, see Fig.13a The sharing module sends the M second transmission data streams to the overhead module, the overhead module adds OH to each slice signal in the second transmission data stream, and the overhead module sends the M second transmission data streams with OH added to the M switching chips. For the specific sending process, please refer to Fig.10 The corresponding instructions are not elaborated in detail.

[0162] Step 1105: M switching chips send M second transmission data streams to the second optical module.

[0163] Each switching chip shown in this embodiment switches the second transmission data stream according to the OH included in the second transmission data stream to transmit it to the second optical module. For a description of the specific process, see Figure 2 The corresponding step is shown in step 206 and will not be described in detail.

[0164] Step 1106: The second optical module performs digital signal processing on the Q-channel second transmission data stream to obtain an electrical signal.

[0165] Combination Fig.14 The figure illustrates the process of the second optical module performing digital signal processing on the Q-channel second transmission data stream. Fig.14 for Fig.10 The second optical module 1021 includes a processor 1401, an optoelectronic converter 1402, and an output optical fiber 1403. The processor 1401 shown in this embodiment specifically includes an FIC, a mapping module, and a DAC. For a description of the type of processor 1401, see Figure 3As shown, the details are not repeated here. The FIC of the second optical module 1021 shown in this embodiment specifically includes a recovery module, an overhead extraction module and a combination module connected in sequence. The recovery module receives Q-path second transmission data streams. In this embodiment, if P switching chips among M switching chips fail, the M switching chips include Q switching chips that can switch normally. The Q switching chips transmit the Q-path second transmission data stream to the second optical module. The recovery module of the second optical module can decode the Q-path second transmission data stream based on redundant protection, so that even if P-path second transmission data streams are lost in the M-path second transmission data streams, the recovery module of the second optical module can still recover the M-path first transmission data streams according to the Q-path second transmission data streams, so as to ensure that the recovery module can accurately recover all service cells or service packets (i.e., N-path first transmission data streams) sent by the first optical module to the second optical module from the Q-path second transmission data stream. For the description of the overhead extraction module and the combination module shown in this embodiment, as well as the description of the mapping module and DAC processing to obtain electrical signals, please refer to Figure 7 The corresponding instructions are not elaborated in detail.

[0166] It should be noted that the description of the second optical module in this embodiment is an optional example and is not limited. For example, Fig.15 for Fig.10 Another embodiment of the second optical module is shown in the structural example diagram. The second optical module 1021 includes a processor 1401, a photoelectric converter 1402 and an output optical fiber 1403. For details, see Fig.14 The FIC of the second optical module 1021 shown in this embodiment specifically includes an overhead extraction module, a recovery module, and a combination module connected in sequence. The overhead extraction module extracts OH from the M-channel second transmission data stream, and sends the M-channel second transmission data stream after extracting OH to the recovery module. The recovery module performs redundant protection on the M-channel second transmission data stream. For the redundant protection process, please refer to Fig.14 As shown, the details are not repeated here. It can be understood that the recovery module recovers the M-way first transmission data stream based on the Q-way second transmission data stream to ensure that the recovery module can accurately recover all service cells or service packets (i.e., N-way first transmission data stream) sent by the first optical module to the second optical module from the Q-way second transmission data stream. For the description of the overhead extraction module and the combination module shown in this embodiment, as well as the description of the mapping module and the DAC processing to obtain the electrical signal, please refer to Figure 7 The corresponding instructions are not elaborated in detail.

[0167] Step 1107: The second optical module converts the electrical signal into an optical signal and emits the optical signal.

[0168] For the description of the execution process of step 1107 shown in this embodiment, please refer to step 208, and the details are not repeated here.

[0169] By adopting the method shown in this embodiment, even if the types of services received by the first optical module increase with the continuous growth of fixed-line, mobile and dedicated line services, the first optical module can convert different services into service cells or service packets in a unified format. The second optical module directly receives service cells or service packets. Since the format of service cells or service packets is unified, the power consumption of the second optical module in processing service cells or service packets is reduced. Moreover, the FIC of the first optical module is connected to M switching chips. Even if some of the M switching chips fail, the second optical module can successfully recover the service cells or service packets sent by the first optical module to the second optical module based on redundant protection, thereby improving the reliability of the transmission of service cells or service packets.

[0170] Fig.11 In the illustrated embodiment, the first optical module converts N first transmission data streams into M second transmission data streams based on redundant protection to send to the second optical module as an example, without limitation. For example, when the sharing module receives a service cell or service packet, and when it is determined that the first optical module includes M electrical interfaces, the sharing module load balances the received service cells or service packets to obtain M second transmission data streams. The M in this example is an arbitrary integer greater than 1. Specifically, the sharing module obtains the total flow M1 of the service cell or service packet, then the sharing module determines that the flow used to send out by each of the M electrical interfaces of the first optical module is M1 / M. It can be understood that the flow of each second transmission data stream emitted by the first optical module is M1 / M. This embodiment takes the example of equal flow emitted by different electrical interfaces of the first optical module. In other examples, the flow emitted by different electrical interfaces of the first optical module may also be approximately equal. The first optical module shown in this embodiment sends M second transmission data streams to the switching chip by load balancing. Based on load balancing, the efficiency and flexibility of the switching chip in switching the M second transmission data streams are effectively improved, and the successful switching of the M second transmission data streams by the switching chip is ensured.

[0171] The above example shows that the sharing module sends N first transmission data streams based on redundant protection or load balancing. The sharing module shown in this example can send N first transmission data streams based on a fault event. The N shown in this example is not greater than M. For example, the first optical module has N (for example, 15) first electrical interfaces, and the sharing module of the first optical module can obtain N first transmission data streams. However, the N first electrical interfaces include a faulty first electrical interface. A faulty first electrical interface means that the data stream emitted by the first electrical interface cannot be successfully transmitted to the corresponding target port. The reasons for the faulty first interface may be that the first electrical interface itself fails to emit, the transmission medium connected between the first electrical interface and the switching chip fails, the switching chip itself fails and cannot exchange the data stream from the first electrical interface, the transmission medium between the switching chip and the target port fails, etc., which are not specifically limited in this embodiment. The first optical module determines that among the N first electrical interfaces, M (for example, 10) first electrical interfaces are working normally, then the sharing module converts 15 first transmission data streams into 10 second transmission data streams, and sends out 10 second transmission data streams through the 10 first electrical interfaces that are working normally, effectively ensuring the successful transmission of the M second transmission data streams in the switching device. The first optical module shown in this example can receive information indicating a faulty first electrical interface from a network management device or a device board. For example, the first optical module can periodically detect each first electrical interface to obtain a faulty first electrical interface.

[0172] The specific execution process of the service transmission method is described below in combination with the specific type of the optical module. Fig.16 This is a flowchart of the steps of the fourth embodiment of the method for transmitting the service provided in this application.

[0173] Step 1601: The first optical module receives an optical signal.

[0174] In this embodiment, the first optical module is taken as a coherent optical module as an example. Fig.17 As shown, Fig.17 This is an example diagram of the structure of an embodiment of the coherent optical module provided in this application. The first optical module 1700 includes an input optical fiber 1720, which is used to receive an optical signal, and the optical signal carries service data. For a description of service data, please refer to Figure 2 The corresponding step is shown in step 201 and will not be described in detail.

[0175] Step 1602: The first optical module converts the optical signal into an electrical signal.

[0176] Fig.17In the embodiment, the input optical fiber 1720, the mixer 1702 and the photoelectric converter 1703 of the first optical module 1700 are connected in sequence. The mixer 1702 is also connected to the local laser 1701. The mixer 1702 is used to decouple the optical signal from the input optical fiber 1720 to obtain the decoupled optical signal, and is also used to perform polarization separation on the decoupled optical signal to form a first modulated signal and a second modulated signal, and is also used to mix the optical signal from the local laser 1701 and the first modulated signal to restore them to the first analog signal and the second analog signal of the low-frequency baseband, and the mixer 1702 is also used to mix the optical signal from the local laser 1701 and the second modulated signal to restore them to the third analog signal and the fourth analog signal of the low-frequency baseband.

[0177] Step 1603: The first optical module converts the electrical signal into a digital signal.

[0178] Fig.17 In the embodiment, four ADCs, namely ADC1705, ADC1706, ADC1707 and ADC1708, are respectively connected to the photoelectric converter 1703. ADC1705, ADC1706, ADC1707 and ADC1708 are respectively used to perform analog-to-digital conversion on the first analog signal, the second analog signal, the third analog signal and the fourth analog signal to obtain four digital signals, namely the first digital signal, the second digital signal, the third digital signal and the fourth digital signal.

[0179] Step 1604: The first optical module processes the digital signal to obtain a demapped signal.

[0180] Fig.17 In the example, the processing module also includes a dispersion compensation module 1710 connected to ADC1705, ADC1706, ADC1707 and ADC1708 respectively. The dynamic equalization module 1711 is connected to the dispersion compensation module and the demapping module 1712 respectively. The dispersion compensation module 1710 is used to perform dispersion compensation on the first digital signal and the second digital signal to obtain a first dispersion compensated signal. The dispersion compensation module 1710 is also used to perform dispersion compensation on the third digital signal and the fourth digital signal to obtain a second dispersion compensated signal. The dynamic equalization module 1711 is used to dynamically equalize the first dispersion compensated signal and the second dispersion compensated signal, such as polarization compensation, phase recovery, post-filtering, sequence detection and deinterleaving, etc., which are not specifically limited. The dynamic equalization module 1711 emits four sequence signals to the demapping module 1712. The demapping module 1712 is used to perform constellation demapping on the four sequence signals to obtain demapped signals. For a description of constellation demapping, please refer to Figure 2 The corresponding step is shown in step 203 and will not be described in detail.

[0181] Step 1605: The first optical module performs FEC decoding on the demapped signal to obtain a first decoded signal.

[0182] Fig.17 In the embodiment, the first optical module further includes an FEC decoding module 1713 connected to the demapping module 1712, and the FEC decoding module 1713 is used to perform FEC decoding on the demapped signal to obtain a first decoded signal. Through the FEC decoding of the FEC decoding module 1713, the reliability of the optical signal transmission received by the first optical module can be improved, the bit error rate of the optical signal can be reduced, and the intersymbol interference (ISI) of the optical signal transmission path can be effectively suppressed.

[0183] Step 1606: The first optical module slices the first decoded signal to obtain a service cell or a service packet.

[0184] Fig.17 In the example, the FIC of the first optical module includes a slicing module 1714, an overhead module 1715, and an FEC encoding module 1716 connected in sequence. The slicing module 1714 is used to slice the first decoded signal and convert it into a plurality of slice signals. The overhead module 1715 adds OH to each slice signal to obtain a service cell. For a description of the specific process, please refer to Figure 2 The corresponding step is shown in step 204 and will not be described in detail.

[0185] Step 1607: The first optical module performs FEC encoding on the service cell or service packet to obtain a first coded signal.

[0186] The FEC encoding module 1716 of the first optical module is used to perform FEC encoding on the service cell or service packet to obtain the first coded signal. FEC encoding of the service cell or service packet can improve the reliability of the channel between the first optical module and the switching chip and reduce the bit error rate of the service cell or service packet transmitted to the switching chip.

[0187] The FIC of the first optical module shown in this embodiment may also include a sharing module. For a description of the sharing module, see Fig.13a as well as Fig.13b As shown, the details are not repeated here.

[0188] Step 1608: The first optical module sends a first coded signal to the switching chip.

[0189] Step 1609: The switching chip sends a first coded signal to the second optical module.

[0190] For descriptions of steps 1608 to 1609 shown in this embodiment, see Figure 2The corresponding steps 205 to 206 are shown in detail, and no further description is given. In this embodiment, the second optical module is a coherent optical module as an example.

[0191] Step 1610: The second optical module performs FEC decoding on the first coded signal to obtain a second decoded signal.

[0192] Fig.18 This is another structural example diagram of a coherent optical module provided in the present application. Fig.18 The second optical module shown includes an FIC, which specifically includes an FEC decoding module 1801, an overhead extraction module 1802, and a combination module 1803 connected in sequence. Among them, the FEC decoding module receives the first coded signal, and performs FEC decoding on the first coded signal to obtain a second decoded signal. Through the FEC decoding of the first coded signal by the FEC decoding module 1801, the reliability of the channel between the second optical module and the switching chip can be improved, and the bit error rate of the service cell or service packet transmitted between the second optical module and the switching chip can be reduced.

[0193] The FIC of the second optical module shown in this embodiment may also include a recovery module. For a description of the recovery module, see Fig.14 as well as Fig.15 As shown, the details are not repeated here.

[0194] Step 1611: The second optical module combines the second decoded signal into a service flow.

[0195] The overhead extraction module 1802 receives the second decoded signal and extracts the OH. The combination module 1803 combines the second decoded signal into a service flow according to the OH. For a detailed description of the process, please refer to Figure 2 The corresponding step is shown in step 207 and will not be described in detail.

[0196] Step 1612: The second optical module performs FEC encoding on the service flow to obtain a second encoded signal.

[0197] Fig.18 The second optical module shown also includes an FEC encoding module 1804 connected to the FIC, and the FEC encoding module 1804 is used to perform FEC encoding on the service flow to obtain a second encoded signal. Performing FEC encoding on the service flow by the FEC encoding module 1804 can improve the reliability of the transmission of the optical signal emitted from the second optical module and reduce the packet loss rate and bit error rate of the optical signal emitted from the second optical module.

[0198] Step 1613: The second optical module maps the second coded signal to obtain a mapped signal.

[0199] Fig.18The FEC encoding module 1804 shown may also interleave the second coded signal to obtain an interleaved sequence. The interleaving is used to change the information structure of the second coded signal to the maximum extent without changing the information content of the second coded signal. The FEC encoding module 1804 transmits the second coded signal to the mapping module 1806. The mapping module 1806 is used to map the second coded signal to obtain a mapped signal. For example, the mapping module 1806 performs constellation mapping on the second coded signal to obtain a mapped signal. For a description of the mapping module, see Figure 7 The corresponding instructions are not elaborated in detail.

[0200] The FEC encoding module 1804 may send a mapping signal to the compensation module 1807, and the compensation module 1807 may perform pre-filtering on the mapping signal, wherein the pre-filtering is a finite impulse response filter, and after the pre-filtering, the information of the filtered signal is not lost compared with the mapping signal before the pre-filtering, but the occupied bandwidth is narrowed. For another example, the compensation module 1807 may also perform channel compensation, MIMO equalization, and dispersion estimation on the mapping signal to output a compensated signal, which is not specifically limited.

[0201] Step 1614: The second optical module performs digital-to-analog conversion on the mapped signal to obtain an electrical signal.

[0202] Fig.18 As shown, DAC1812 is connected to 1804, and DAC1812 performs digital-to-analog conversion on the compensated signal from the compensation module 1807 to output an electrical signal, which is an analog signal.

[0203] Step 1615: The second optical module converts the electrical signal into an optical signal and emits the optical signal.

[0204] Fig.18 The second optical module shown includes an optoelectronic converter 1816 connected to the DAC 1812. For a description of the type of the optoelectronic converter 1816, see Figure 7 The corresponding description is not repeated in detail. The photoelectric converter 1816 is used to perform electro-optical conversion on the electrical signal from the DAC1812 to output an optical signal. For example, the photoelectric converter 1816 can modulate the electrical signal by coherent double-bias modulation, such as quadrature phase shift keying (QPSK) or quadrature amplitude modulation (QAM) to obtain an optical signal. The photoelectric converter 1816 also transmits the optical signal to the output optical fiber 1818 of the second optical module.

[0205] By adopting the method shown in this embodiment, the FIC can be adapted to the coherent optical module, the first optical module can perform photoelectric conversion and channel processing with the help of coherent technology, and obtain service cells or service packets, and the first optical module can convert different services into service cells or service packets in a unified format. The second optical module directly receives the service cells or service packets, and because the format of the service cells or service packets is unified, the power consumption of the second optical module in processing the service cells or service packets is reduced.

[0206] Using coherent optical modules, you can also perform Figure 2 , Fig. 9 , Fig.11 as well as Fig.15 The specific execution process of the method shown in any embodiment is not repeated here.

[0207] The present application does not limit the specific type of optical module for executing the transmission method of the service. For example, the direct detection optical module applied to the direct adjustment and direct detection system can also be used to execute the following Figure 2 , Fig. 9 , Fig.11 , Fig.15 as well as Fig.16 The transmission method of the service shown. Among them, the direct modulation and direct detection system is also called intensity modulation and direct detection system. If the first optical module and the second optical module are direct detection optical modules, the first optical module performs intensity demodulation on the optical signal to obtain an electrical signal. In the process of the second optical module receiving the service element or service packet from the first optical module for conversion, the optical signal is obtained by intensity modulating the electrical signal. The code type of the optical signal can be non-return to zero code (not return to zero, NRZ), four-level pulse amplitude modulation (4pulseampitude modulation, PAM4) or pulse amplitude modulation (pulse amplitude modulation, PAM), etc. If the direct detection optical module is applied to Fig.16 In the embodiment shown, the first optical module can be Fig.16 The second optical module can perform FEC decoding and FEC encoding as shown. Fig.16 As shown, FEC decoding and FEC encoding are performed. Optionally, the first optical module may perform FEC decoding only once, and the second optical module may perform FEC encoding only once. For a description of the FEC encoding and FEC decoding process, see Fig.16 As shown, the details are not repeated here.

[0208] The embodiment of the present application can also be performed by an Ethernet optical module as follows Figure 2 , Fig. 9 , Fig.11 , Fig.15 as well as Fig.16Then, the first optical module can convert the Ethernet service into a service cell or a service packet, and the second optical module can convert the service cell or service packet from the first optical module into an optical signal and send it outward. For the specific execution process, please refer to Figure 2 , Fig. 9 , Fig.11 , Fig.15 as well as Fig.16 The transmission method of the service shown in the figure, the specific execution process is not repeated. If the optical module shown in this embodiment is an Ethernet optical module, the Ethernet optical module may also include a network processor (network processor, NP) or a traffic management (traffic management, TM) module. The TM module mainly controls the quality of service (quality of service, QoS) of the service flow according to the transmission bandwidth of the network and the priority of the service flow. NP is the core chip for Ethernet service processing, and mainly performs forwarding processing tasks of various Ethernet services, such as packet processing, protocol analysis, and routing lookup of Ethernet service data. It can be understood that the NP and TM modules in the first optical module, after receiving the Ethernet data frame, perform forwarding processing and service quality control of the Ethernet data frame. The NP and TM modules in the second optical module complete the forwarding processing and service quality control to the output optical fiber.

[0209] The present application also provides a method for executing Figure 2 , Fig. 9 , Fig.11 as well as Fig.16 For the specific implementation process of the optical module in any embodiment, please refer to Figure 2 , Fig. 9 , Fig.11 as well as Fig.16 The structure of the optical module is shown in any embodiment, and no further details are given. Figure 3 , Figure 7 , Fig.13a , Fig.13b , Fig.14 , Fig.15 , Fig.17 as well as Fig.18 The structure description is not detailed here.

[0210] The present application also provides a method for executing Figure 2 , Fig. 9 , Fig.11 as well as Fig.16 For the specific implementation process of the transmission device of any embodiment, please refer to Figure 2 , Fig. 9 , Fig.11 as well as Fig.16The transmission device includes a device board and an optical module connected to the device board. The structure of the optical module is shown in FIG. Figure 3 , Figure 7 , Fig.13a , Fig.13b , Fig.14 , Fig.15 , Fig.17 as well as Fig.18 The structure description is not detailed here.

[0211] The present application also provides a method for executing Figure 2 , Fig. 9 , Fig.11 as well as Fig.16 For the specific implementation process of the switching device in any embodiment, please refer to Figure 2 , Fig. 9 , Fig.11 as well as Fig.16 The structure of the switching device is shown in any embodiment, and the details are not repeated here. Figure 1b As shown, the details are not repeated here.

[0212] The present application also provides a method for executing Figure 2 , Fig. 9 , Fig.11 as well as Fig.16 For the specific implementation process of the optical network of any embodiment, please refer to Figure 2 , Fig. 9 , Fig.11 as well as Fig.16 The structure of the optical network is shown in any embodiment, and the details are not repeated here. Figure 1a As shown, the details are not repeated here.

[0213] The present application also provides a computer-readable storage medium in which computer instructions are stored. When the computer instructions are executed on a computer, the computer executes Figure 2 , Fig. 9 , Fig.11 as well as Fig.16 Any method described in any embodiment.

[0214] The structure of the optical module provided in this application is described below from the perspective of hardware structure.

[0215] Fig.19The first embodiment of the optical module provided in the present application is a structural example diagram. The optical module shown in this embodiment includes a photoelectric converter and a processor connected in sequence. Among them, the photoelectric converter specifically includes a first optical modulator 1901 and a first optical demodulator 1902, and the processor includes a first digital-to-analog conversion interface 1903, a mapping module 1906 and a FIC1907 connected in sequence to the first optical modulator 1901. The processor also includes a first digital-to-analog conversion interface 1904, a demapping module 1905 and a FIC1907 connected in sequence to the first optical demodulator 1902. FIC1907 is also connected to a medium-range (MR) interface or a long-range (LR) interface 1908. The MR interface and the LR interface shown in this embodiment belong to a Serdes interface, which is an abbreviation for a serializer (serializer) / deserializer (deserializer).

[0216] Optionally, the processor shown in this embodiment further includes a clock interface and / or a control interface. For descriptions of the control interface and the clock interface, see Figure 3 or Figure 7 The corresponding instructions are not elaborated in detail.

[0217] The structure of the optical module shown in this embodiment is adopted. Since the first optical module directly sends the signal after digital signal processing by the processor to the outside through the MR interface or the LR interface 1908, the transmission of the MR interface or the LR interface 1908 effectively reduces the insertion loss of the signal after digital signal processing.

[0218] The following is a detailed description of several optional structures of the optical module, among which: Fig. 20 This is a diagram showing an example structure of a second embodiment of the optical module provided in this application.

[0219] The optical module shown in this embodiment includes a first photoelectric converter and a processor connected in sequence. The first photoelectric converter specifically includes a first optical modulator 1901 and a first optical demodulator 1902. For details, see Fig.19 The corresponding description is not repeated in detail. The processor shown in this embodiment specifically includes a digital signal processor and a framer. The digital signal processor specifically includes a first digital-to-analog conversion interface 1903 and a mapping module 1906 which are sequentially connected to the first optical modulator 1901. The digital signal processor also includes a first digital-to-analog conversion interface 1904 and a demapping module 1905 which are sequentially connected to the first optical demodulator 1902. The first optical demodulator 1902 and the mapping module 1906 are respectively connected to an ultra-short distance (XSR) interface or a very short distance (VSR) 2001. For a detailed description of the first digital-to-analog conversion interface 1903, the mapping module 1906, the first digital-to-analog conversion interface 1904, and the demapping module 1905, see Fig.19 The framer specifically includes an XSR interface or a VSR interface 2002, and the XSR interface or the VSR interface 2002 of the framer is connected to the XSR interface or the VSR interface 2001 of the digital signal processor. The framer also includes an FIC 1907 and an MR interface or an LR interface 1908 which are connected to the XSR interface or the VSR interface 2002 in sequence. For detailed descriptions of the FIC 1907 and the MR interface or the LR interface 1908, see Fig.19 The XSR interface or VSR interface shown in this embodiment belongs to a Serdes interface.

[0220] In this embodiment, the optical module includes a circuit board, and the digital signal processor and the framer are independently mounted on the circuit board. Specifically, the digital signal processor is mounted on the circuit board and is electrically connected to the wiring of the circuit board. Similarly, the framer is mounted on the circuit board and is electrically connected to the wiring of the circuit board. In this embodiment, the circuit board is a printed circuit board (PCB) as an example.

[0221] Optionally, the signal processor shown in this embodiment includes a clock interface and / or a control interface, and the framer includes a clock interface and / or a control interface. For example, the clock interface and / or the control interface of the signal processor, and the clock interface and / or the control interface of the framer, are both electrically connected to the device board, thereby receiving control signaling or clock information from the device board. For another example, the control interface of the framer is connected to the control interface of the digital signal processor, and the control interface of the framer forwards the control signaling from the device board to the control interface of the digital signal processor, and the clock interface of the framer is connected to the clock interface of the digital signal processor, and the clock interface of the framer forwards the clock information from the device board to the clock interface of the digital signal processor.

[0222] By adopting the structure of the optical module shown in this embodiment, the digital signal processor and the framer are connected through the XSR interface or the VSR interface, so the digital signal processor and the framer do not need to be connected through the connector of the circuit board, which effectively reduces the length of the electrical connection path between the digital signal processor and the framer (for example, centimeter level), thereby effectively reducing the insertion loss of the signal transmitted between the digital signal processor and the framer. In addition, because the first optical module directly sends the signal processed by the processor through the MR interface or the LR interface 1908, the transmission of the MR interface or the LR interface 1908 effectively reduces the insertion loss of the signal processed by the digital signal.

[0223] Fig.21 This is a structural example diagram of the third embodiment of the optical module provided in this application.

[0224] The optical module shown in this embodiment includes a first photoelectric converter and a processor connected in sequence. The first photoelectric converter specifically includes a first optical modulator 1901 and a first optical demodulator 1902. For details, see Fig.19 The corresponding description is not repeated in detail. The processor shown in this embodiment specifically includes a digital signal processor and a framer. The digital signal processor specifically includes a first digital-to-analog conversion interface 1903 and a mapping module 1906 which are sequentially connected to the first optical modulator 1901. The digital signal processor also includes a first digital-to-analog conversion interface 1904 and a demapping module 1905 which are sequentially connected to the first optical demodulator 1902. The first optical demodulator 1902 and the mapping module 1906 are respectively connected to the chiplet interconnect interface 2101. The type of the chiplet interconnect interface 2101 may be universal chiplet interconnect express (UCIe) or a privately defined interface for interconnection between chips. For a detailed description of the first digital-to-analog conversion interface 1903, the mapping module 1906, the first digital-to-analog conversion interface 1904, the demapping module 1905, the first optical demodulator 1902 and the mapping module 1906, please refer to Fig.19 The framer specifically includes a core interconnect interface 2102, and the core interconnect interface 2102 of the framer is connected to the core interconnect interface 2101 of the digital signal processor. The framer also includes a FIC 1907 and an MR interface or an LR interface 1908 which are sequentially connected to the core interconnect interface 2102. For details of the FIC 1907, the MR interface or the LR interface 1908, see Fig.19 As shown, the details are not repeated here.

[0225] The digital signal processor and the framer shown in this embodiment are installed as a whole on the circuit board of the optical module. For example, the optical module includes a circuit board and a substrate 2103 installed on the circuit board, the wiring of the substrate 2103 is electrically connected to the wiring of the circuit board, and the digital signal processor and the framer are installed as a whole on the substrate 2103, thereby forming a co-package. The co-package includes the substrate 2103, the signal processor and the framer. The co-package is installed as a whole on the circuit board of the optical module.

[0226] The digital signal processor and framer shown in this embodiment may include a control interface or a clock interface. For details, see Fig. 20 The corresponding instructions are not elaborated in detail.

[0227] With the structure of the optical module shown in this embodiment, the digital signal processor and the framer are connected through a core interconnection interface, which effectively reduces the length of the electrical connection path between the digital signal processor and the framer (for example, micrometer level or millimeter level), thereby effectively reducing the insertion loss of the signal transmitted between the digital signal processor and the framer. In addition, because the first optical module directly sends the signal processed by the processor through the MR interface or the LR interface 1908, the transmission of the MR interface or the LR interface 1908 effectively reduces the insertion loss of the signal processed by the digital signal.

[0228] Fig. 22 This is a structural example diagram of the fourth embodiment of the optical module provided in this application.

[0229] The optical module shown in this embodiment includes a first photoelectric converter and a processor connected in sequence. The first photoelectric converter specifically includes a first optical modulator 1901 and a first optical demodulator 1902. For details, see Fig.19 The processor shown in this embodiment includes a first digital-to-analog conversion interface 1903 connected to the first optical modulator 1901 in sequence, and the processor also includes a first digital-to-analog conversion interface 1904 connected to the first optical demodulator 1902. For the description of the first digital-to-analog conversion interface 1903 and the first digital-to-analog conversion interface 1904, please refer to Fig.19 The processor also includes an integrated processing module 2201 connected to the first digital-to-analog conversion interface 1903 and the first digital-to-analog conversion interface 1904, respectively. The integrated processing module 2201 is also connected to the MR interface or the LR interface 1908. For the description of the MR interface or the LR interface 1908, see Fig.19 The corresponding description is not repeated in detail. The integrated processing module 2201 shown in this embodiment is used to integrate a digital signal processor and a framer. Specifically, the integrated processing module 2201 integrates a mapping module, a demapping module and an FIC. For the description of the specific functions of the mapping module, the demapping module and the FIC, see Fig.19 The corresponding instructions are not elaborated in detail.

[0230] The digital signal processor and framer shown in this embodiment may include a control interface or a clock interface. For details, see Fig. 20 The corresponding instructions are not elaborated in detail.

[0231] With the structure of the optical module shown in this embodiment, since the integrated processing module 2201 integrates the functions of the digital signal processor and the framer, the information interaction between the digital signal processor and the framer does not need to be through a physical interface, but uses the application specific integrated circuit (ASIC) wiring connection inside the processor, thereby effectively reducing the bit error rate of the signal transmitted by the integrated processing module 2201. In addition, since the first optical module directly sends the signal processed by the processor through the MR interface or the LR interface 1908, the transmission of the MR interface or the LR interface 1908 effectively reduces the insertion loss of the signal processed by the digital signal.

[0232] Figures 19 to 22 In any embodiment, the MR interface or LR interface 1908 of the optical module is directly connected to the switching chip. For details, see Figure 5 or Fig.10 The corresponding instructions are not elaborated in detail. Figures 19 to 22 In any embodiment, the MR interface or LR interface 1908 of the optical module can also be directly connected to another optical module. For details, see Figure 8 The corresponding instructions are not elaborated in detail.

[0233] Fig.23 This is a structural example diagram of the fifth embodiment of the optical module provided in this application.

[0234] The optical module shown in this embodiment includes a first photoelectric converter and a processor connected in sequence. The first photoelectric converter specifically includes a first optical modulator 1901 and a first optical demodulator 1902. For details, see Fig.19 The processor shown in this embodiment specifically includes a first digital-to-analog conversion interface 1903, a mapping module 1906, a first digital-to-analog conversion interface 1904, a demapping module 1905, an MR interface or an LR interface 1908. For specific descriptions, see Fig.19 The corresponding description is not repeated here. The processor shown in this embodiment also includes a second digital-to-analog conversion interface 2301 and a second digital-to-analog conversion interface 2302 connected to the MR interface or the LR interface 1908 in sequence. The optical module also includes a second optical demodulator 2303 connected to the second digital-to-analog conversion interface 2301, and a second optical modulator 2304 connected to the second digital-to-analog conversion interface 2301. For a description of the processor structure shown in this embodiment, please refer to Figures 19 to 22 Any embodiment is shown and no further details are given.

[0235] The optical module shown in this embodiment can be applied to Figure 6 In the corresponding embodiment, if Fig.23 The optical module shown is the first optical module, and the MR interface or the LR interface 1908 sends the signal processed by the digital signal to the second digital-to-analog conversion interface 2302, and the second digital-to-analog conversion interface 2302 performs digital-to-analog conversion on the signal processed by the digital signal to obtain an analog signal, and sends the analog signal to the second optical modulator 2304, and the second optical modulator 2304 is used to perform electrical-to-optical conversion on the analog signal to emit an optical signal, which can be transmitted through an optical cable. For a specific description of the optical signal transmitted by the first optical module, see Figure 6 The corresponding embodiments are not described in detail. Fig.23 The optical module shown is the second optical module, then the second optical demodulator 2303 receives the optical signal, and performs photoelectric conversion on the optical signal to obtain an electrical signal, the second digital-to-analog conversion interface 2301 is used to perform digital-to-analog conversion on the electrical signal to obtain an analog signal, the second digital-to-analog conversion interface 2301 sends the analog signal to the MR interface or the LR interface 1908, the processor performs digital signal processing based on the analog signal to obtain a digital signal processed signal, and sends it to the first digital-to-analog conversion interface 1903, the first digital-to-analog conversion interface 1903 performs digital-to-analog conversion on the digital signal to obtain an analog signal, and sends the analog signal to the first optical modulator 1901, the first optical modulator 1901 performs electrical-to-optical conversion on the analog signal to emit an optical signal. For a specific description of the second optical module transmitting the optical signal, see Figure 6 The corresponding embodiments are not described in detail.

[0236] Figures 19 to 23 For the description of the processor structure shown in any embodiment, please refer to the above Figure 3 , Figure 7 , Fig.13a , Fig.13b , Fig.14 , Fig.15 , Fig.17 or Fig.18 Any embodiment is shown and no further details are given.

[0237] The embodiment of the present application also provides a switching device, Fig.24 This is another example structural diagram of a switching device provided in the present application.

[0238] The switching device shown in this embodiment includes a backplane 2411, an optical module 2401 mounted on the backplane 2411, and a switching chip 2402. For a description of the structure of the optical module 2401, see Figures 19 to 23As shown in any embodiment. The MR interface or LR interface of the optical module 2401 is connected to the switching chip 2402 through the backplane 2411. Specifically, the optical module 2401 shown in this embodiment is installed on the backplane 2411 through the first device single board 2412, the switching chip 2402 is installed on the backplane 2411 through the second device single board 2413, and the first device single board 2412 and the second device single board 2413 are connected through the backplane 2411.

[0239] exist Figure 2 In the embodiment shown, if Figures 19 to 23 If the optical module shown in any embodiment is used as the first optical module, the first optical demodulator 1902 is used to perform step 201 and step 202. The first digital-to-analog conversion interface 1904 and the demapping module 1905 are used to perform step 203. FIC1907 is used to perform step 204. The MR interface or LR interface 1908 is used to perform step 205, that is, the MR interface or LR interface 1908 is used to send the service cell or service packet from FIC1907 to the switching chip. Specifically, the MR interface or LR interface 1908 shown in this embodiment is connected to the Serdes interface of the switching chip through the first transmission medium. For a description of the first transmission medium, see Figure 5 The corresponding instructions are not detailed here. Figures 19 to 23 If the optical module shown in any embodiment is used as the second optical module, the MR interface or LR interface 1908 is used to receive the service cell or service packet from the switching chip. For instructions on how the switching chip sends the service cell or service packet to the second optical module, please refer to step 206. Specifically, the MR interface or LR interface 1908 shown in this embodiment is connected to the Serdes interface of the switching chip through the second transmission medium. FIC1907, mapping module 1906 and first digital-to-analog conversion interface 1903 are used to execute step 207. The first optical modulator 1901 is used to execute step 208. For instructions on the transmission method process of the first optical module and the second optical module executing the service, please refer to Figure 2 The corresponding instructions are not elaborated in detail.

[0240] exist Fig. 9 In the embodiment shown, if Figures 19 to 23If the optical module shown in any embodiment is used as the first optical module, the first optical demodulator 1902 is used to execute step 901 and step 902. The first digital-to-analog conversion interface 1904 and the demapping module 1905 are used to execute step 903. FIC1907 is used to execute step 904. The MR interface or LR interface 1908 is used to execute step 905, that is, the MR interface or LR interface 1908 is used to send the service cell or service packet from FIC1907 to the switching chip. Specifically, the MR interface or LR interface 1908 shown in this embodiment is connected to the Serdes interface of the switching chip via the first transmission medium. If Figures 19 to 23 If the optical module shown in any embodiment is used as the second optical module, the MR interface or LR interface 1908 is used to receive the service cell or service packet from the switching chip. For instructions on how the switching chip sends the service cell or service packet to the second optical module, please refer to step 905. Specifically, the MR interface or LR interface 1908 shown in this embodiment is connected to the Serdes interface of the switching chip through the second transmission medium. For instructions on the first transmission medium, please refer to Figure 5 The corresponding description is not repeated in detail. The MR interface or the LR interface 1908 sends a service cell or a service packet to the FIC 1907. The FIC 1907, the mapping module 1906 and the first digital-to-analog conversion interface 1903 are used to perform step 906. The first optical modulator 1901 is used to perform step 907. For a description of the transmission method process of the first optical module and the second optical module performing the service, please refer to Fig. 9 The corresponding instructions are not elaborated in detail.

[0241] exist Fig.11 In the embodiment shown, if Figures 19 to 23 If the optical module shown in any embodiment is used as the first optical module, the first optical demodulator 1902 is used to perform step 1101 and step 1102. The first digital-to-analog conversion interface 1904, the demapping module 1905 and the FIC 1907 are used to perform step 1103. The MR interface or the LR interface 1908 is used to perform step 1104. Figures 19 to 23 If the optical module shown in any embodiment is used as the second optical module, the MR interface or LR interface 1908 is used to receive the service cell or service packet from the switching chip. The MR interface or LR interface 1908 sends the service cell or service packet to the FIC 1907. The FIC 1907, the mapping module 1906 and the first digital-to-analog conversion interface 1903 are used to perform step 1106. The first optical modulator 1901 is used to perform step 1107. For a description of the transmission method process of the first optical module and the second optical module performing the service, please refer to Fig.11 The corresponding instructions are not elaborated in detail.

[0242] exist Fig.16 In the embodiment shown, if Figures 19 to 23 If the optical module shown in any embodiment is used as the first optical module, the first optical demodulator 1902 is used to perform steps 1601 and 1602. The first digital-to-analog conversion interface 1904 is used to perform step 1603. The demapping module 1905 is used to perform step 1604. The processor may also include an FEC decoding module (for details, see Fig.17 The FEC decoding module is used to execute step 1605. FIC1907 is used to execute step 1606. FIC1907 may also include an FEC encoding module, which is used to execute step 1607 (for details, see Fig.17 MR interface or LR interface 1908 is used to execute step 1608. Figures 19 to 23 If the optical module shown in any embodiment is used as the second optical module, the MR interface or LR interface 1908 is used to receive the service cell or service packet from the switching chip. The MR interface or LR interface 1908 sends the service cell or service packet to the FIC 1907. The FIC 1907 also includes an FEC decoding module, which is used to perform step 1610 (for details, see Fig.18 The FIC 1907 is used to execute step 1611. The processor also includes an FEC encoding module, which is used to execute step 1612 (for details, see Fig.18 The mapping module 1906 is used to execute step 1613, the first digital-to-analog conversion interface 1903 is used to execute step 1614, and the first optical modulator 1901 is used to execute step 1615. For a description of the transmission method process of the first optical module and the second optical module executing the service, please refer to Fig.16 The corresponding instructions are not elaborated in detail.

[0243] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0244] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0245] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0246] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

Claims

1. A method for transmitting a service, characterized in that: The method comprises: The optical module receives an optical signal, wherein the optical signal carries service data; The optical module converts the optical signal into an electrical signal; The optical module performs digital signal processing on the electrical signal to obtain a service cell or a service packet; The optical module sends the service cell or the service packet outwardly.

2. The method according to claim 1, characterized in that: The optical module performs digital signal processing on the electrical signal to obtain a service cell or a service packet, including: The optical module converts the electrical signal into a digital signal; The optical module demaps the digital signal to obtain a demapped signal; The optical module slices the demapped signal to obtain the service cell or the service packet.

3. The method according to claim 2, characterized in that The optical module slices the demapped signal to obtain the service cell or the service packet, comprising: The optical module slices the demapped signal according to the number of bytes or bits to obtain multiple service cells.

4. The method according to claim 2, characterized in that: The demapped signal includes a plurality of subframes, and the optical module slices the demapped signal to obtain the service cell or the service packet, including: The optical module slices the demapped signal according to the length of the subframe to obtain the service packet, where the service packet includes at least one subframe.

5. The method according to any one of claims 2 to 4, characterized in that: After the optical module slices the demapped signal to obtain the service cell or the service packet, the method further includes: The optical module adds overhead to the service cell or the service packet, and the overhead carries at least one of the following: Used to indicate information, operation and maintenance information, exchange information or timing information of the target port, wherein the exchange information is used to indicate the exchange method of the service cell or the service packet, and the timing information is used to indicate the timing of sending the service cell or the service packet.

6. The method according to any one of claims 1 to 5, characterized in that: The optical module sending the service cell or the service packet outwardly includes: The optical module sends the service cell or the service packet to the switching chip through the first transmission medium.

7. The method according to any one of claims 1 to 5, characterized in that: The optical module sending the service cell or the service packet outwardly includes: The optical module sends the service cell or the service packet to another optical module through a second transmission medium.

8. The method according to any one of claims 1 to 5, characterized in that: The optical module sending the service cell or the service packet outwardly includes: The optical module converts the service cell or the service packet into a transmission optical signal; The optical module sends the transmission optical signal outward through a first transmission medium or a second transmission medium, the first transmission medium is used to connect the optical module and a switching chip, and the second transmission medium is used to connect the optical module and another optical module.

9. The method according to any one of claims 2 to 5, characterized in that: The optical module is a direct detection optical module, and the optical module demaps the digital signal. After obtaining the demapped signal, the method further includes: The optical module performs forward error correction (FEC) decoding on the demapped signal to obtain a first decoded signal; The optical module slices the demapped signal to obtain the service cell or the service packet, comprising: The optical module slices the first decoded signal to obtain the service cell or the service packet.

10. The method according to any one of claims 2 to 5, characterized in that: The optical module is a direct detection optical module or a coherent optical module, and the optical module demaps the digital signal. After obtaining the demapped signal, the method further includes: The optical module performs FEC decoding on the demapped signal to obtain a first decoded signal; The optical module slices the demapped signal to obtain the service cell or the service packet, comprising: The optical module slices the first decoded signal to obtain the service cell or the service packet; After the optical module slices the demapped signal to obtain the service cell or the service packet, the method further includes: The optical module performs FEC encoding on the service cell or the service packet to obtain a first coded signal; The optical module sending the service cell or the service packet outwardly includes: The optical module sends the first coded signal externally.

11. The method according to any one of claims 1 to 10, characterized in that: The optical module performs digital signal processing on the electrical signal to obtain a service cell or a service packet, including: The optical module performs digital signal processing on the electrical signal to convert it into N first transmission data streams, each of which includes the service cell or the service packet, and N is an arbitrary integer not less than 1; The optical module performs redundancy protection on the N first transmission data streams and converts them into M second transmission data streams, where M is any integer greater than N; The optical module sending the service cell or the service packet outwardly includes: The optical module sends the M second transmission data streams outwardly.

12. A method for transmitting a service, characterized in that: The method comprises: The optical module receives a service cell or a service packet, where the service cell or the service packet is used to carry service data; The optical module performs digital signal processing on the service cell or the service packet to obtain an electrical signal; The optical module converts the electrical signal into an optical signal; The optical module sends the optical signal outwardly.

13. The method according to claim 12, characterized in that The optical module performs digital signal processing on the service cell or the service packet to obtain an electrical signal, which includes: The optical module combines the service cells or the service packets into a service flow according to the timing in which the service cells or the service packets are sent; The optical module maps the service flow to obtain a mapping signal; The optical module converts the mapping signal into the electrical signal, and the electrical signal is an analog signal.

14. The method according to claim 12 or 13, characterized in that The service information element or the service packet includes overhead, and the overhead carries at least one of the following: Used to indicate the information, operation and maintenance information, exchange information or timing information of the target port, wherein the exchange information is used to indicate the exchange method of the service cell or the service packet, and the timing information is used to indicate the timing of sending the service cell or the service packet.

15. The method according to any one of claims 12 to 14, characterized in that The optical module receiving the service cell or service packet includes: The optical module receives an optical signal through a first transmission medium or a second transmission medium, the second transmission medium is used to connect the optical module with another optical module, and the first transmission medium is used to connect the optical module with a switching chip; The optical module converts the optical signal into the service cell or the service packet.

16. The method according to claim 13, characterized in that The optical module is a direct detection optical module. After the optical module combines the service cells or the service packets into a service flow according to the timing in which the service cells or the service packets are sent, the method further includes: The optical module performs forward error correction FEC encoding on the service flow to obtain a second encoded signal; The optical module maps the service flow, and obtaining a mapping signal includes: The optical module maps the second coded signal to obtain the mapped signal.

17. The method according to claim 13, characterized in that The optical module is a direct detection optical module or a coherent optical module, and the optical module combines the service cells or the service packets into a service flow according to the timing of sending the service cells or the service packets, including: The optical module performs FEC decoding on the service cell or the service packet to obtain a second decoding signal; The optical module combines the second decoded signals into the service flow according to the timing in which the service cells or the service packets are sent.

18. The method according to any one of claims 12 to 17, characterized in that The optical module receiving the service cell or service packet includes: The optical module receives Q second transmission data streams, each of which includes the service cell or the service packet, and Q is an arbitrary integer not less than 1; The optical module performs redundant protection on the Q second transmission data streams to obtain N first transmission data streams, where N is any integer not less than 1, and Q is not less than N.

19. An optical module, characterized in that: The optical module includes a photoelectric converter and a processor connected in sequence; The photoelectric converter is used to receive the optical signal and convert the optical signal into an electrical signal, wherein the optical signal carries service data; The processor is used for performing digital signal processing on the electrical signal to obtain a service cell or a service packet, and sending the service cell or the service packet externally.

20. The optical module according to claim 19, characterized in that: The processor includes a digital signal processor and a switching network interface FIC; The digital signal processor is used to convert the electrical signal into a digital signal, and demap the digital signal to obtain a demapped signal; The FIC is used to slice the demapped signal to obtain the service cell or the service packet.

21. The optical module according to claim 19 or 20, characterized in that: The processor is further used to receive a service cell or a service packet, and perform digital signal processing on the service cell or the service packet to obtain an electrical signal, wherein the service cell or the service packet is used to carry service data; The photoelectric converter is used to convert the electrical signal into an optical signal and send the optical signal outward.

22. A transmission device, characterized in that: The transmission device includes a device board and an optical module connected to the device board, and the optical module is as described in any one of claims 19 to 20.

23. The transmission device according to claim 22, characterized in that The processor comprises a control interface, the control interface is connected to the device board, and the control interface is used to receive control signaling from the device board.

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