A double-sided BGA packaging structure

Abstract

The present invention belongs to the field of chip packaging technology, and specifically relates to a double-sided BGA packaging structure, comprising an upper shell, a lower shell welded to the bottom of the upper shell, a plurality of upper solder balls welded evenly and equidistantly to the top of the upper shell, and a plurality of lower solder balls welded evenly and equidistantly to the bottom of the lower shell; an anti-alignment device is provided on the inner wall of the upper shell, and the anti-alignment device comprises a plurality of vertical plates, and the vertical plates are all clamped on the inner wall of the upper shell. The present invention solves the problem that when the BGA is inspected after welding, the solder balls of the upper pins and the solder balls of the lower pins are aligned and overlapped in the upper and lower positions, and it is impossible to observe whether there are problems with the welding of the upper and lower pins through X-ray inspection, and it is impossible to detect welding quality and electrical faults, which affects subsequent quality control and reduces production efficiency, thereby reducing errors and the complexity of repeated inspections, and improving the efficiency and accuracy of inspections.

Description

Technical Field

[0001] The invention belongs to the technical field of chip packaging, and in particular relates to a double-sided BGA packaging structure. Background Art

[0002] The full name of BGA is ball array package, which makes solder balls at the bottom of the package substrate as the port of the circuit. This kind of pin port has great strength and will not be deformed or damaged. As the complexity of chip circuits and functions increases, the number of input and output ports of chips increases. In order to meet these increased ports, the number of BGA pins must also increase, and the size of BGA chips must be made larger and larger, so that after soldering on the PCB, the area occupied is larger, which is not conducive to the miniaturization of circuit boards.

[0003] However, the current structure has the following problems: when inspecting the BGA after soldering, the solder balls of the upper pins and the solder balls of the lower pins are aligned and overlapped, and it is impossible to observe whether there are any problems with the soldering of the upper and lower pins through X-ray inspection, and it is impossible to detect soldering quality and electrical faults, which affects subsequent quality control and reduces production efficiency. Therefore, we propose a double-sided BGA packaging structure. Summary of the invention

[0004] The purpose of the present invention is to provide a double-sided BGA packaging structure, which can solve the problem in the related art that when inspecting the BGA after welding, the solder balls of the upper pins and the solder balls of the lower pins are aligned and overlapped in the upper and lower positions, and it is impossible to observe whether there are problems with the welding of the upper and lower pins through X-ray inspection, and it is impossible to detect welding quality and electrical faults, which affects subsequent quality control and reduces production efficiency.

[0005] The technical solution adopted by the present invention is as follows:

[0006] A double-sided BGA packaging structure, comprising an upper shell, the bottom of the upper shell is welded with a lower shell, the top of the upper shell is uniformly and equidistantly welded with a plurality of upper solder balls, and the bottom of the lower shell is uniformly and equidistantly welded with a plurality of lower solder balls;

[0007] The inner wall of the upper shell is provided with an anti-alignment device, and the anti-alignment device includes multiple vertical plates, which are all clamped on the inner wall of the upper shell, and the bottoms of the multiple vertical plates are fixedly connected to the same bottom plate, and the side surface of one of the vertical plates is rotatably connected to a threaded rod, and the threaded rod is driven by a motor, and the motor is fixedly connected to the side surface of one of the vertical plates, and the outer wall of the threaded rod is threadedly connected to a threaded sleeve, and the side surface of one of the vertical plates is fixedly connected to a limiting rod, and the threaded sleeve is slidably connected to the circumferential surface of the limiting rod, and the side surface of the threaded sleeve is fixedly connected to a moving rod, and the circumferential surface of the moving rod is evenly and equidistantly fixedly connected with a plurality of electric telescopic rods, and the telescopic end of the electric telescopic rod is fixedly connected with a limiting cover, and the side surface of the threaded sleeve is fixedly connected to a connecting rod, and the circumferential surface of the connecting rod is evenly and equidistantly fixedly connected with a plurality of limiting blocks.

[0008] The threaded sleeve is in contact with the bottom plate, and a gap is left between the threaded rod and the limiting rod.

[0009] The limiting cover is in contact with the upper solder ball, and a gap is left between the limiting block and the lower solder ball.

[0010] A cleaning device is provided on the side of the threaded sleeve, and the cleaning device includes a C-shaped rod, the C-shaped rod is fixedly connected to the side of the threaded sleeve, one end of the C-shaped rod is fixedly connected to a stopper, the circumferential surface of the C-shaped rod is driven to be fixedly connected to a fixing ring, the circumferential surface of the C-shaped rod is slidably connected to a sliding rod, the bottom of the sliding rod is fixedly connected to a cleaning brush, a spring is provided between the sliding rod and the fixing ring, and the top of the vertical plate is fixedly connected to a connecting plate.

[0011] A gap is left between the stopper and the sliding rod, and the cleaning brush is in contact with the lower shell body.

[0012] A semicircular block is fixed to one end of the sliding rod away from the spring, and a plurality of semicircular blocks are evenly and equidistantly fixed to the side of the connecting plate. The circular surface of the semicircular block of the connecting plate is located on the movement track of the circular surface of the semicircular block of the sliding rod.

[0013] The technical effects achieved by the present invention are:

[0014] The present invention sets an anti-alignment device so that the vertical plate, bottom plate, threaded rod, threaded sleeve, limiting rod, movable rod, electric telescopic rod, limiting cover, connecting rod and limiting block cooperate to occupy the upper solder ball in the position corresponding to the lower shell, flip the structure, and continue to weld the lower solder ball to prevent the upper solder ball from being aligned with the lower solder ball. The welding conditions of the upper and lower pins will present different angles or fields of view. The difference in angle makes it easier for X-ray images to distinguish the welding status of the upper and lower pins, thereby helping to detect whether there are welding defects. Different levels of welding will be easier to distinguish during X-ray scanning, reducing errors and the complexity of repeated inspections, improving the efficiency and accuracy of inspections, making inspections more comprehensive, and reducing the risk of omissions.

[0015] The present invention arranges the cleaning device so that the C-shaped rod, the block, the fixing ring, the sliding rod, the cleaning brush, the spring and the connecting plate cooperate with each other, the sliding rod is reset under the action of the corresponding spring elastic force, and the sliding rod drives the cleaning brush to reset and move, so that the cleaning brush can move back and forth, repeatedly clean the surface of the lower shell body, remove impurities, ensure good contact between the solder ball and the solder pad, thereby improving the reliability and quality of welding, reducing the occurrence of welding defects, ensuring the reliability of the final product, reducing the later rework rate, and reducing the rework or inspection process caused by welding defects, thereby improving production efficiency, avoiding rework and quality problems, and reducing production costs and time. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the present invention as a whole;

[0017] Figure 2 It is a schematic diagram of the structure of the upper shell of the present invention;

[0018] Figure 3 It is a schematic diagram of the structure of the upper solder ball of the present invention;

[0019] Figure 4 It is a schematic diagram of the structure of the anti-alignment device of the present invention;

[0020] Figure 5 It is a schematic diagram of the structure of the cleaning device of the present invention.

[0021] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0022] 1. Upper shell; 2. Lower shell; 3. Upper solder ball; 4. Lower solder ball; 5. Anti-alignment device; 51. Vertical plate; 52. Bottom plate; 53. Threaded rod; 54. Threaded sleeve; 55. Limiting rod; 56. Moving rod; 57. Electric telescopic rod; 58. Limiting cover; 59. Connecting rod; 510. Limiting block; 6. Cleaning device; 61. C-shaped rod; 62. Stopper; 63. Fixed ring; 64. Sliding rod; 65. Cleaning brush; 66. Spring; 67. Connecting plate. DETAILED DESCRIPTION

[0023] In order to make the purpose and advantages of the present invention more clearly understood, the present invention is specifically described below in conjunction with embodiments. It should be understood that the following text is only used to describe one or several specific embodiments of the present invention, and does not strictly limit the scope of protection of the specific claims of the present invention.

[0024] like Figure 1-Figure 5 As shown, a double-sided BGA packaging structure includes an upper shell 1, a lower shell 2 is welded to the bottom of the upper shell 1, a plurality of upper solder balls 3 are evenly and equidistantly welded to the top of the upper shell 1, and a plurality of lower solder balls 4 are evenly and equidistantly welded to the bottom of the lower shell 2;

[0025] An anti-alignment device 5 is provided on the inner wall of the upper shell 1, and the anti-alignment device 5 includes a plurality of vertical plates 51, which are all clamped on the inner wall of the upper shell 1, and the bottoms of the plurality of vertical plates 51 are fixedly connected to the same bottom plate 52, and a threaded rod 53 is rotatably connected to the side of one of the vertical plates 51, and the threaded rod 53 is driven by a motor, and the motor is fixedly connected to the side of one of the vertical plates 51, and a threaded sleeve 54 is threadedly connected to the outer wall of the threaded rod 53, and a limiting rod 55 is fixedly connected to the side of one of the vertical plates 51, and the threaded sleeve 54 is slidably connected to the circumferential surface of the limiting rod 55, and a moving rod 56 is fixedly connected to the side of the threaded sleeve 54, and a plurality of electric telescopic rods 57 are evenly and equidistantly fixedly connected to the circumferential surface of the moving rod 56, and a limiting cover 58 is fixedly connected to the telescopic end of the electric telescopic rod 57, and a connecting rod 59 is fixedly connected to the side of the threaded sleeve 54, and a plurality of limiting blocks 510 are evenly and equidistantly fixedly connected to the circumferential surface of the connecting rod 59.

[0026] The threaded sleeve 54 is in contact with the bottom plate 52 , and a gap is left between the threaded rod 53 and the limiting rod 55 .

[0027] The limiting cover 58 is in contact with the upper solder ball 3 , and a gap is left between the limiting block 510 and the lower solder ball 4 .

[0028] According to the above structure, after the upper solder balls 3 are welded to the upper shell 1, the vertical plate 51 is clamped on the inner wall of the upper shell 1, and the motor corresponding to the threaded rod 53 is started. The rotation of the motor output shaft drives the rotation of the threaded rod 53, and the rotation of the threaded rod 53 drives the movement of the threaded sleeve 54. The limiting rod 55 limits the rotation of the threaded sleeve 54. The movement of the threaded sleeve 54 drives the movement of the moving rod 56. The movement of the moving rod 56 drives the movement of the electric telescopic rod 57. The movement of the electric telescopic rod 57 drives the movement of the limiting cover 58, and the limiting cover 58 is moved to the first row of upper solder balls 3, so that the electric telescopic rod 57 descends to cover the upper solder balls 3, and the movement of the threaded sleeve 54 drives the movement of the connecting rod 59. The movement of rod 59 drives the movement of limiting block 510, so that the upper solder ball 3 occupies the position corresponding to the lower shell 2, flips the structure, and continues to weld the lower solder ball 4 to prevent the upper solder ball 3 from being aligned with the lower solder ball 4. When using X-ray inspection after BGA welding, the welding quality of the upper and lower pins can be observed more conveniently. The welding conditions of the upper and lower pins will present different angles or fields of view. This difference in angle makes it easier for the X-ray image to distinguish the welding status of the upper and lower pins, thereby helping to detect whether there are welding defects. Different levels of welding will be easier to distinguish during X-ray scanning, reducing errors and the complexity of repeated inspections, improving the efficiency and accuracy of inspections, making inspections more comprehensive, and reducing the risk of omissions.

[0029] like Figure 1-Figure 5 As shown, a double-sided BGA packaging structure is provided, a cleaning device 6 is provided on the side of the threaded sleeve 54, the cleaning device 6 comprises a C-shaped rod 61, the C-shaped rod 61 is fixedly connected to the side of the threaded sleeve 54, one end of the C-shaped rod 61 is fixedly connected to a stopper 62, the circumferential surface of the C-shaped rod 61 is fixedly connected to a fixing ring 63, the circumferential surface of the C-shaped rod 61 is slidably connected to a sliding rod 64, a cleaning brush 65 is fixedly connected to the bottom of the sliding rod 64, a spring 66 is provided between the sliding rod 64 and the fixing ring 63, and a connecting plate 67 is fixedly connected to the top of the vertical plate 51.

[0030] A gap is left between the stopper 62 and the sliding rod 64 , and the cleaning brush 65 is in contact with the lower housing 2 .

[0031] A semicircular block is fixed to one end of the sliding rod 64 away from the spring 66 , and a plurality of semicircular blocks are evenly and equidistantly fixed to the side of the connecting plate 67 . The circular surface of the semicircular block of the connecting plate 67 is located on the movement trajectory of the semicircular block of the sliding rod 64 .

[0032] According to the above structure, the movement of the threaded sleeve 54 drives the movement of the C-shaped rod 61, the rotation of the C-shaped rod 61 drives the movement of the sliding rod 64, and the rotation of the sliding rod 64 drives the movement of the cleaning brush 65 to clean the surface of the lower shell 2. When the semicircular block of the sliding rod 64 moves to the semicircular block position of the connecting plate 67, the semicircular block circular surface of the connecting plate 67 pushes the semicircular block circular surface of the sliding rod 64 to drive the sliding rod 64 to move, and the rotation of the sliding rod 64 drives the movement of the cleaning brush 65. When the semicircular block circular surface of the connecting plate 67 no longer pushes the semicircular block circular surface of the sliding rod 64, the cleaning brush 65 is moved. When the block is formed, the sliding rod 64 is reset under the elastic force of the corresponding spring 66, and the sliding rod 64 drives the cleaning brush 65 to reset and move, so that the cleaning brush 65 can move back and forth, repeatedly cleaning the surface of the lower shell 2 to remove impurities and ensure good contact between the solder ball and the solder pad, thereby improving the reliability and quality of welding, reducing the occurrence of welding defects, ensuring the reliability of the final product, reducing the later rework rate, and reducing the rework or inspection process caused by welding defects, thereby improving production efficiency, avoiding rework and quality problems, and reducing production costs and time.

[0033] The above is only a preferred embodiment of the present invention. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principles of the present invention, and these improvements and modifications should also be considered as the protection scope of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to the conventional means in the art unless otherwise specified and limited.

Claims

1. A double-sided BGA packaging structure, comprising an upper shell (1), a lower shell (2) being welded to the bottom of the upper shell (1), a plurality of upper solder balls (3) being welded to the top of the upper shell (1) at uniform intervals, and a plurality of lower solder balls (4) being welded to the bottom of the lower shell (2) at uniform intervals; Features: The inner wall of the upper shell (1) is provided with an anti-alignment device (5), the anti-alignment device (5) comprising a plurality of vertical plates (51), the vertical plates (51) being all clamped on the inner wall of the upper shell (1), the bottoms of the plurality of vertical plates (51) being fixedly connected to a same bottom plate (52), the side surface of one of the vertical plates (51) being rotatably connected to a threaded rod (53), the threaded rod (53) being driven by a motor, and the motor being fixedly connected to the side surface of one of the vertical plates (51), the outer wall of the threaded rod (53) being threadedly connected to a threaded sleeve (54), and one of the vertical plates (51) being fixedly connected to the inner wall of the upper shell (1), A limiting rod (55) is fixedly connected to the side of the vertical plate (51); the threaded sleeve (54) is slidably connected to the circumferential surface of the limiting rod (55); a moving rod (56) is fixedly connected to the side of the threaded sleeve (54); a plurality of electric telescopic rods (57) are evenly and equidistantly fixedly connected to the circumferential surface of the moving rod (56); a limiting cover (58) is fixedly connected to the telescopic end of the electric telescopic rod (57); a connecting rod (59) is fixedly connected to the side of the threaded sleeve (54); a plurality of limiting blocks (510) are evenly and equidistantly fixedly connected to the circumferential surface of the connecting rod (59); After the upper welding ball (3) is welded to the upper shell (1), the vertical plate (51) is clamped on the inner wall of the upper shell (1), and the motor corresponding to the threaded rod (53) is started. The rotation of the motor output shaft drives the threaded rod (53) to rotate, and the rotation of the threaded rod (53) drives the movement of the threaded sleeve (54). The limiting rod (55) limits the rotation of the threaded sleeve (54), and the movement of the threaded sleeve (54) drives the movement of the moving rod (56). The movement of the moving rod (56) drives the electric telescopic rod ( The electric telescopic rod (57) moves, the movement of the electric telescopic rod (57) drives the movement of the limiting cover (58), the limiting cover (58) is moved to the first row of upper solder balls (3), the electric telescopic rod (57) is lowered to cover the upper solder balls (3), the movement of the threaded sleeve (54) drives the movement of the connecting rod (59), the movement of the connecting rod (59) drives the movement of the limiting block (510), the upper solder balls (3) occupy the position corresponding to the lower shell (2), the structure is turned over, and the lower solder balls (4) are continuously welded.

2. A double-sided BGA packaging structure according to claim 1, characterized in that: The threaded sleeve (54) is in contact with the bottom plate (52), and a gap is left between the threaded rod (53) and the limiting rod (55).

3. A double-sided BGA packaging structure according to claim 1, characterized in that: The limiting cover (58) is in contact with the upper solder ball (3), and a gap is left between the limiting block (510) and the lower solder ball (4).

4. The double-sided BGA packaging structure according to claim 1, characterized in that: A cleaning device (6) is provided on the side of the threaded sleeve (54), and the cleaning device (6) comprises a C-shaped rod (61), the C-shaped rod (61) is fixedly connected to the side of the threaded sleeve (54), one end of the C-shaped rod (61) is fixedly connected to a stopper (62), a circumferential surface of the C-shaped rod (61) is fixedly connected to a fixing ring (63), the circumferential surface of the C-shaped rod (61) is slidably connected to a sliding rod (64), a cleaning brush (65) is fixedly connected to the bottom of the sliding rod (64), a spring (66) is provided between the sliding rod (64) and the fixing ring (63), and a connecting plate (67) is fixedly connected to the top of the vertical plate (51).

5. A double-sided BGA packaging structure according to claim 4, characterized in that: A gap is left between the stopper (62) and the sliding rod (64), and the cleaning brush (65) is in contact with the lower housing (2).

6. A double-sided BGA packaging structure according to claim 4, characterized in that: A semicircular block is fixed to one end of the sliding rod (64) away from the spring (66), and a plurality of semicircular blocks are fixed to the side surface of the connecting plate (67) at even intervals. The circular surface of the semicircular block of the connecting plate (67) is located on the movement trajectory of the circular surface of the semicircular block of the sliding rod (64).

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