Finned water-cooled thermoelectric separation copper substrate and LED module manufacturing method

Abstract

The application relates to the technical field of LED lighting source packaging, and particularly discloses a fin type water-cooled thermoelectric separation copper substrate and an LED module manufacturing method, which comprises the following steps: step S1, selecting and cutting a copper plate; step S2, etching a boss; step S3, adhering a PCB circuit board; step S4, tooth shoveling; step S5, CNC processing; step S6, boss surface treatment; step S7, fixing LED chips; step S8, soldering wires; step S9, dotting and spraying powder; step S10, glass sheet protection; and step S11, testing and sorting. In the application, the traditional packaging carrier plate is changed, fins on the copper substrate are directly contacted with cooling liquid, the level of LED chips to the heat sink is reduced, the heat flow channel is shortened, the thermal resistance of the light source is reduced, and more advanced heat-conducting materials are adopted, so that the long-term stable and effective light output of the LED light source is ensured, and the heat dissipation structure and weight of the lighting device can be greatly reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of LED lighting source packaging, and in particular relates to a fin-type water-cooled thermal and electrical separation copper substrate and a method for manufacturing an LED module. Background Art

[0002] An LED consists of two components: a P-type semiconductor and an N-type semiconductor. When these two semiconductors are connected, they form a PN junction. When current flows through the conductors and acts on the chip, it emits energy in the form of photons, producing light. During LED operation, 15%-25% of the electrical energy is converted into light energy, while the remaining energy is converted into heat energy, which increases the temperature of the LED.

[0003] LED lighting sources in the existing technology basically use packaged LED devices, which are fixed to the heat sink with screws or other fastening devices for heat dissipation through thermal grease, thermal pads and other materials as the intermediate heat conduction layer. This traditional heat dissipation structure has too many layers and the thermal conductivity of the materials in each layer is different. As a result, after the heat emitted by the PN junction of the LED chip is transferred to the heat sink, the thermal resistance is too large, and a heat transfer bottleneck is formed in the entire heat channel, resulting in the temperature on the PN junction of the LED chip cannot be transferred quickly and smoothly in a timely manner. Therefore, it can only be used as a heat dissipation solution for light sources with low power or low power density.

[0004] With the widespread application of LED semiconductor lighting, more and more special fields require higher power density light output. As the light output power per unit area increases, the heat emitted per unit area of ​​the LED chip PN junction will also increase. (For lighting devices that require secondary optical processing or more, the larger the LED light-emitting surface, the larger the optical structure, the longer the focal length, and the greater the brightness demand, the larger the light-emitting surface must also be, which will inevitably affect the structural size of the device). Therefore, in order to achieve higher power light output in lighting devices that require higher light output, the LED power density must be as high as possible to reduce the size of the LED light source. The resulting problem is that if traditional heat dissipation structures are used for LED light sources with a power of more than 200W, it is difficult to smoothly dissipate the heat generated by the LED, thereby affecting the LED life and the stable light output of the lighting device.

[0005] With the continuous emergence of high-power density chips, their packaging and application technologies must also be improved accordingly. Traditional packaging methods, because their thermal management technology is not more perfectly integrated with the application end, result in high-power density chips not being able to achieve optimal light output. Their application in special lighting devices is also greatly reduced, and their efficiency, lifespan, appearance and other aspects are all limited. Summary of the Invention

[0006] The purpose of the present invention is to address the shortcomings of the existing technology and provide a fin-type water-cooled thermal and electrical separation copper substrate and an LED module manufacturing method to solve the technical problem in the existing technology that if a high-power LED light source uses a traditional heat dissipation structure, it is difficult to smoothly conduct the heat generated by the LED.

[0007] The purpose of the present invention can be achieved through the following technical solutions:

[0008] A method for manufacturing an LED module with a fin-type water-cooled thermal and electrical separation copper substrate, the method comprising the following steps:

[0009] Step S1: Select copper plates for cutting, and cut copper plates of appropriate thickness into panels or single pieces of appropriate size to obtain copper substrates;

[0010] Step S2: Etching the boss: coating the center of the cut copper substrate with a boss of the designed size, and etching the PCB circuit board pressing area outside the boss on the copper substrate using an etching process to expose the boss;

[0011] Step S3: PCB circuit board lamination, laminating or coating the adhesive material on the pressing area of ​​the PCB circuit board, then aligning the PCB circuit board of appropriate thickness with the adhesive material in the pressing area of ​​the PCB circuit board for lamination and installation, and finally heating and pressing the laminating PCB circuit board;

[0012] Step S4: skiving, placing the copper substrate on a skiving lathe with the side opposite to the boss facing upwards, and starting skiving on the area on this side to form fins;

[0013] Step S5: CNC machining, CNC machining the sealing area, that is, the area where the LED chip is to be sealed, machining the appropriate edge size, and drilling the required appropriate fixing holes;

[0014] Step S6: Surface treatment of the boss, performing metal plating treatment or roughening and cleaning treatment on the boss surface;

[0015] Step S7: Fix the LED chip, fix the LED chip on the boss, and bake the LED chip at a baking temperature within a specific range;

[0016] Step S8: Wire bonding: According to the designed serial-parallel circuit mode, gold wires are bonded to connect the PCB circuit board and the LED chip, and reflow soldering is performed to form a complete circuit;

[0017] Step S9: dotting / powder spraying, performing dotting / powder spraying operations on the LED chip to obtain a specific color temperature within the range of 1800-15000K, and baking it to finalize the color temperature;

[0018] Step S10: Protecting the glass sheet: After the chip is fixed and the color temperature and wavelength are determined, a concave high-temperature resistant glass sheet with air guide holes is placed upside down on the LED chip. The LED chip needs to be placed within the concave area. The glass sheet is bonded with high-temperature resistant glue and baked to set the shape.

[0019] Step S11: testing and sorting, testing electrical properties, optical parameters, void ratio, appearance and other technical parameters, and packaging qualified products for use.

[0020] A fin-type water-cooled thermal and electrical separation copper substrate, and a method for manufacturing an LED module using the above-mentioned fin-type water-cooled thermal and electrical separation copper substrate, comprising:

[0021] Copper substrate;

[0022] Boss, the copper substrate is provided with a boss integral with the copper substrate, the boss is provided with a package carrier, the package carrier has a chip area, and the LED chip is installed in the chip area;

[0023] Fins, a plurality of fins are provided on the side of the copper substrate opposite to the boss, and the plurality of fins are integrally scraped out and formed on the copper substrate by a scraping lathe;

[0024] A radiator is installed on the copper substrate, and a plurality of fins are located inside the radiator.

[0025] As a preferred embodiment of the above technical solution, the radiator includes a water pump, a water tank, coolant and a cooling fan.

[0026] As a preferred embodiment of the above technical solution, the fins have a thickness of 0.09-1 mm, a spacing of 0.08-2 mm, and a height of 0.5-20 mm.

[0027] As a preferred embodiment of the above technical solution, the boss portion is removed from the side of the copper substrate provided with the boss to etch out a PCB circuit board pressing area, and a PCB circuit board is pressed and installed in the PCB circuit board pressing area.

[0028] As a preferred embodiment of the above technical solution, after the PCB circuit board is pressed onto the PCB circuit board pressing area on the copper substrate, the PCB circuit board is flush with the boss, and the depth of the PCB circuit board pressing area after etching is between 0.08-2 mm and the thickness of the PCB circuit board.

[0029] As a preferred embodiment of the above technical solution, a bonding adhesive is filled between the package carrier on the boss and the LED chip, and a bonding gold wire is connected between the LED chip and the PCB circuit board.

[0030] As the preferred technical scheme of the above-mentioned technical scheme, the boss is spliced with the PCB circuit board and is provided with tin paste at the splicing part, the aluminum nitride ceramic substrate on which the LED chip is fixed is placed on the boss and the PCB circuit board, and the aluminum nitride ceramic substrate on which the LED chip is fixed is connected with the PCB circuit board through a bonding wire.

[0031] The present application has the following advantages:

[0032] 1. In the present application, the traditional packaging carrier plate is changed, the fins on the copper substrate are directly contacted with the cooling liquid, the level of the LED chip to the heat sink is reduced, the heat flow channel is shortened, the thermal resistance of the light source is reduced, and more advanced heat-conducting materials are used, so as to ensure the long-term stable and effective light output of the LED light source, and also greatly reduce the heat dissipation structure and weight of the lighting device.

[0033] 2. In the present application, the contact area of the copper substrate is greatly increased by the plurality of dense fins. In application, the fins are completely placed in the cooling liquid in the water tank, all surfaces are wrapped by the cooling liquid, so that the heat conducted by the fins is transferred to the water, the high-temperature water is circulated to contact the aluminum water tank through the water pump, the high temperature in the water is transferred to the surface of the aluminum water tank, and then the heat is dissipated through the heat dissipation fan, so that the temperature on the fins is always kept in a benign cycle, the temperature of the LED pin can also be controlled within 70 DEG C, and the temperature will not be gathered on the PN junction of the LED chip, so as to protect the LED chip and make the LED chip more stable, which can continuously operate in the best light output state.

[0034] 3. In the present application, the die bonding adhesive, the copper substrate and the aluminum nitride ceramic substrate on which the LED chip is fixed are all high-thermal-conductivity materials, so that in the whole heat dissipation channel, the heat flow can be smoothly transmitted to the fins on the copper substrate, and then the heat is dissipated by the heat sink, so that the heat dissipation effect is greatly improved.

[0035] 4. In the present application, the LED chip combination is more dense and compact, the same power can be achieved with a smaller light emitting surface, and for the lighting device requiring condensation, the focal length can be made shorter, so as to improve the condensation capacity and improve the lighting effect. Since the short focal length condensation system often needs smaller structure size in the case of realizing the same condensation effect, the short focal length optical element can reduce the overall volume and weight of the equipment, facilitate carrying and use, and also facilitate installation and integration of the equipment.

[0036] 5. In the present application, the packaging link is relatively simple, the material demand in the application link is more economical, the application amount of copper is greatly reduced, and the application plays a leading demonstration role in truly environmental and green lighting. BRIEF DESCRIPTION OF DRAWINGS

[0037] Figure 1 It is a top view structural schematic diagram of the copper substrate;

[0038] Figure 2 This is a schematic diagram of the cross-sectional structure of the copper substrate;

[0039] Figure 3 This is a schematic diagram of the structure after the boss die bonding method;

[0040] Figure 4 This is a schematic diagram of the structure after the boss SMT operation;

[0041] Figure 5 This is a schematic diagram of the enlarged structure of the fin;

[0042] Figure 6 This is a schematic diagram of the structure of the PCB circuit board pressing area;

[0043] Figure 7 Schematic diagram of the heat flow path structure;

[0044] Figure 8 This is a process flow chart of a fin-type water-cooled thermal and electrical separation copper substrate and LED module packaging manufacturing method of the present invention.

[0045] In the picture:

[0046] 1. LED chip; 2. Bonding gold wire; 3. Die-bonding adhesive; 4. Package carrier; 5. Solder paste; 8. PCB circuit board; 9. Copper base plate; 10. Fins; 11. Boss; 12. Heat sink; 13. Chip area; 14. PCB circuit board pressing area. DETAILED DESCRIPTION

[0047] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0048] like Figures 1-8 As shown, a method for manufacturing an LED module with a fin-type water-cooled thermal and electrical separation copper substrate comprises the following steps:

[0049] Step S1: Select copper plates for cutting, and cut copper plates of appropriate thickness into panels or single pieces of appropriate size to obtain copper base plates 9;

[0050] Specifically, a copper plate with a thickness of 2mm-10mm is selected. The material of the copper plate is pure copper, also known as red copper. It has good processing ductility and a thermal conductivity coefficient of 401W / MK. Such a high thermal conductivity coefficient can transfer heat well, thereby improving the heat dissipation effect.

[0051] Step S2: etching the boss 11. Coating the boss 11 of the designed size in the middle of the cut copper substrate 9. Using an etching process, etching the PCB circuit board pressing area 14 outside the boss 11 on the copper substrate 9 to expose the boss 11.

[0052] Specifically, a developing corrosion-resistant material is applied to the area of ​​the boss 11 on the surface of the copper substrate 9, and the area on the copper substrate 9 not coated with the developing corrosion-resistant material is etched; the depth of the PCB circuit board pressing area 14 is etched to 0.08-2mm; the area of ​​the boss 11 is 200-10000 square millimeters, which is determined by the specific power design; the boss 11 area is used to directly install the high thermal conductivity nano-silver glue solid-crystal LED chip 1 or the aluminum nitride ceramic substrate with the LED chip 1 bonded and fixed.

[0053] Step S3: PCB circuit board 8 is laminated, and adhesive material is laminated or coated on the PCB circuit board pressing area 14. Then, a PCB circuit board 8 of appropriate thickness is aligned with the adhesive material on the PCB circuit board pressing area 14 and mounted. Finally, the laminated PCB circuit board 8 is heated and pressed.

[0054] Specifically, the temperature during heating and pressing of the PCB circuit board 8 is 120-150 degrees, and the time is 60-150 minutes. The depth of the PCB circuit board pressing area 14 after etching is determined by the thickness of the PCB circuit board 8 it matches. The PCB circuit board 8 can match the depth of the PCB circuit board pressing area 14. Usually, the depth of the PCB circuit board pressing area 14 after etching and the thickness of the PCB circuit board 8 are between 0.08-2mm. After the PCB circuit board 8 is pressed onto the copper substrate 9, the height of the PCB circuit board 8 is flush with the height of the boss 11, and the error is ensured to be within 0.15mm, thereby reducing the void rate during welding. The PCB circuit board 8 and the LED chip 1 on the boss 11 form a complete circuit loop. The material of the PCB circuit board 8 can be all high-temperature and high-current resistant circuit board materials such as FR-4, TB, FPC, etc.

[0055] Step S4: skiving, placing the copper substrate 9 on a skiving lathe with the side opposite to the boss 11 facing upwards, and starting skiving on the area on this side to form the fin 10;

[0056] Specifically, the fins 10 have a thickness of 0.09-1 mm, a spacing of 0.08-2 mm, and a height of 0.5-20 mm.

[0057] Step S5: CNC machining, CNC machining a sealing area, that is, the area of ​​the LED chip 1 to be sealed, machining a suitable edge size, and drilling the required suitable fixing holes;

[0058] Step S6: Surface treatment of the boss 11, performing metal plating treatment or roughening and cleaning treatment on the surface of the boss 11;

[0059] Specifically, the metal plating material on the surface of the boss 11 can be gold, nickel, nickel-palladium-gold, silver, tin and other metals, which is determined according to the specific packaging application.

[0060] Step S7: Fix the LED chip 1 on the boss 11 and bake the LED chip 1 at a baking temperature within a specific range;

[0061] Specifically, the LED chip 1 can be fixed by a solid crystal method or an SMT operation method. If the solid crystal method is used, the LED chip 1 is used. If the SMT operation method is used, an aluminum nitride ceramic substrate with a solid LED chip 1 is used; wherein, when the solid crystal method is used, it is necessary to perform a metal plating process on the surface of the boss 11 in step S6, and then apply a solid crystal glue 3 on the boss 11. The solid crystal glue 3 can be a nano silver glue or a sintered silver paste, and then the LED chip 1 is placed on the boss 11 with the solid crystal glue 3 applied, and then the solid crystal glue 3 is baked at the corresponding material temperature. Baking fixation, wherein the curing temperature of the nano silver paste is 150°C and the curing time is 90-150 minutes, the sintering temperature of the sintered silver is 310°C and the sintering time is 90-150 minutes, the thermal conductivity of the nano silver paste is 220W / MK, and the thermal conductivity of the sintered silver is 310W / MK, both of which are high thermal conductivity materials, thereby improving the heat dissipation effect; in addition, when using the die bonding method, if the LED chip 1 is a horizontal structure, the die bonding can be directly performed, if the LED chip 1 is a vertical structure, the silicon wafer must be firstly bonded before the die bonding, so as to ensure thermal and electrical separation;

[0062] When using SMT, the surface of the boss 11 needs to be roughened and cleaned in step S6. Then, solder paste 5 is applied to the boss 11 and the PCB circuit board 8. The aluminum nitride ceramic substrate with the LED chip 1 fixed thereon is placed on the boss 11. Vacuum reflow soldering is then performed to ensure that the void ratio is less than 5%. The thermal conductivity of aluminum nitride ceramic is 320W / (m·K), and its high thermal conductivity can effectively transfer heat.

[0063] Step S8: Wire bonding: According to the designed serial-parallel circuit mode, bonding gold wires 2 are used to connect the PCB circuit board 8 and the LED chip 1 or the aluminum nitride ceramic substrate with the LED chip 1 fixed thereon, and reflow soldering is performed to form a complete circuit.

[0064] Specifically, the bonding gold wire 2 has a diameter of 1.0-2.0 mil and a purity of 99.99%. The bonding gold wire 2 serves as a conductor connection in the LED package. When current is turned on, the current enters the LED chip 1 through the bonding gold wire 2, thereby making the LED chip 1 .

[0065] Step S9: dotting / powder spraying: performing dotting / powder spraying on the LED chip 1 to obtain a specific color temperature within the range of 1800-15000K, and baking it to finalize the color temperature;

[0066] Specifically, according to market demand, a dot / powder spraying operation is performed above the LED chip 1, the purpose of which is to achieve the generation of white light and improve the light color consistency and yield rate of the LED product; this step S is limited to the LED white light process, and the LED chip 1 itself can skip this step S if it has light of different wavelengths.

[0067] Step S10: Protecting the glass sheet: After the chip is fixed and the color temperature and wavelength are determined, a concave high-temperature resistant glass sheet with air guide holes is placed upside down on the LED chip 1. The LED chip 1 needs to be placed within the concave area. The glass sheet is bonded with high-temperature resistant glue and baked to set the shape.

[0068] Specifically, the high temperature resistant glue uses AB components, which are mixed in a ratio of 1:1 and then used. The baking temperature is 150 degrees and the time is 60 minutes.

[0069] Step S11: testing and sorting, testing electrical properties, optical parameters, void ratio, appearance and other technical parameters, and packaging qualified products for use.

[0070] A fin-type water-cooled thermal and electrical separation copper substrate, and a method for manufacturing an LED module using the above-mentioned fin-type water-cooled thermal and electrical separation copper substrate, comprising:

[0071] Copper substrate 9;

[0072] Boss 11, the copper substrate 9 is provided with a boss 11 integral with the copper substrate 9, the boss 11 is provided with a package carrier 4, the package carrier 4 has a chip area 13, the chip area 13 is installed in the LED chip 1;

[0073] Fins 10, a plurality of fins 10 are provided on the copper substrate 9 on the side opposite to the boss 11, and the plurality of fins 10 are integrally shoveled out of the copper substrate 9 by a shovel-tooth lathe;

[0074] A heat sink 12 is mounted on the copper substrate 9 , and a plurality of fins 10 are located inside the heat sink 12 .

[0075] The radiator 12 includes a water pump, a water tank, coolant and a cooling fan.

[0076] In one case of this embodiment, the water tank is an aluminum water tank with good thermal conductivity; the coolant includes refrigerant, water-cooling liquid, water and other liquids that can quickly reduce the temperature; the water pump drives the high-temperature water circulation; the heat dissipation fan is in contact with the aluminum water tank to dissipate the heat conducted out of the aluminum water tank.

[0077] In actual application of this embodiment, the plurality of fins 10 greatly increases the contact area of ​​the copper substrate 9. During application, the fins 10 are completely placed in the coolant in the water tank, and all surfaces are covered by the coolant. In this way, the heat conducted by the fins 10 is transferred to the water. The high-temperature water is circulated by the water pump to contact the aluminum water tank. The high temperature in the water is transferred to the surface of the aluminum water tank, and then the heat is dissipated by the heat dissipation fan. The temperature on the fins 10 is always maintained in a virtuous cycle. The temperature of the LED pin can also be controlled within 70°C. The temperature will not accumulate on the PN junction of the LED chip 1, thereby protecting the LED chip 1, making the LED chip 1 more stable and able to operate continuously at the optimal light output state.

[0078] At the same time, the fins 10 on the copper substrate 9 are in direct contact with the coolant, which reduces the number of layers from the LED chip 1 to the radiator 12, shortens the heat flow channel, reduces the thermal resistance of the light source, and uses more advanced thermal conductive materials, thereby ensuring long-term stable and effective light output of the LED light source, and can also greatly reduce the heat dissipation structure and weight of the lighting device.

[0079] The fins 10 have a thickness of 0.09-1 mm, a pitch of 0.08-2 mm, and a height of 0.5-20 mm. In practical applications, the dense fins 10 greatly increase the contact area of ​​the copper substrate 9, thereby improving the heat dissipation effect.

[0080] On one side of the copper substrate 9 where the boss 11 is provided, the boss 11 is partially removed and etched to form a PCB circuit board pressing area 14 , and the PCB circuit board 8 is pressed and installed in the PCB circuit board pressing area 14 .

[0081] After the PCB circuit board 8 is pressed onto the PCB circuit board pressing area 14 on the copper substrate 9, the PCB circuit board 8 is flush with the boss 11, and the depth of the PCB circuit board pressing area 14 after etching is within a range of 0.08-2 mm from the thickness of the PCB circuit board 8.

[0082] A die-bonding adhesive 3 is filled between the package carrier 4 and the LED chip 1 on the boss 11 , and a bonding gold wire 2 is connected between the LED chip 1 and the PCB circuit board 8 .

[0083] The joint part of the boss 11 and the PCB circuit board 8 is dotted with solder paste 5, and the aluminum nitride ceramic substrate with the LED chip 1 fixed is placed on the boss 11 and the PCB circuit board 8. The aluminum nitride ceramic substrate with the LED chip 1 fixed is connected with the PCB circuit board 8 by bonding gold wire 2.

[0084] The above shows and describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above-mentioned embodiments, and the above-mentioned embodiments and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application.

Claims

1. A method for manufacturing a fin-type water-cooled thermal and electrical separation copper-based LED module, characterized in that: The method comprises the following steps S: Step S1: Select copper plates for cutting, and cut the copper plates of appropriate thickness into panels or single pieces of appropriate size to obtain copper substrates (9); Step S2: etching the boss (11), coating the boss (11) of designed size in the middle of the cut copper substrate (9), etching the PCB circuit board pressing area (14) outside the boss (11) on the copper substrate (9) by an etching process, and exposing the boss (11); Step S3: PCB circuit board (8) is laminated, and adhesive material is laminated or coated on the PCB circuit board pressing area (14), and then a PCB circuit board (8) of appropriate thickness is aligned with the adhesive material on the PCB circuit board pressing area (14) for lamination and installation, and finally the laminated PCB circuit board (8) is heated and pressed; Step S4: skiving, placing the copper substrate (9) on a skiving lathe with the side opposite to the boss (11) facing upwards, and starting skiving on the area on this side to form fins (10); Step S5: CNC machining, CNC machining a sealing area, i.e., the area of ​​the LED chip (1) to be sealed, machining a suitable edge size, and drilling the required suitable fixing holes; Step S6: Surface treatment of the boss (11). When the LED chip (1) is fixed by a solid crystal method, the surface of the boss (11) is subjected to metal plating treatment. When the LED chip (1) is fixed by an SMT operation method, the surface of the boss (11) is subjected to roughening and cleaning treatment. Step S7: Fixing the LED chip (1) and fixing the LED chip (1) on the boss (11); Step S8: soldering wires, bonding gold wires (2) to connect the PCB circuit board (8) and the LED chip (1) according to the designed serial-parallel circuit mode, and performing reflow soldering to form a complete circuit; Step S9: dotting / powder spraying, performing dotting / powder spraying operations on the LED chip (1) to obtain a specific color temperature within the range of 1800-15000k, and baking the powder to set the shape; Step S10: Protecting the glass sheet: Protecting the product with the chip fixed and the color temperature and wavelength determined, using a concave high-temperature resistant glass sheet with air guide holes and placing it upside down on the LED chip (1). The LED chip (1) needs to be placed within the concave range, and the glass sheet is bonded with high-temperature resistant glue and baked to shape; Step S11: testing and sorting, testing electrical parameters, optical parameters, void ratio parameters and appearance parameters, and packaging qualified products for use.

2. A fin-type water-cooled thermal and electrical separation copper substrate, characterized in that: A method for manufacturing an LED module using a fin-type water-cooled thermal and electrical separation copper substrate as described in claim 1, comprising: Copper substrate (9); A boss (11), wherein the copper substrate (9) is provided with a boss (11) integral with the copper substrate (9), a package carrier (4) is provided on the boss (11), a chip area (13) is provided on the package carrier (4), and an LED chip (1) is installed in the chip area (13); Fins (10), a plurality of fins (10) are provided on a side of the copper base plate (9) opposite to the boss (11), and the plurality of fins (10) are integrally scraped out and formed on the copper base plate (9) by a scraping lathe; A radiator (12) is installed on the copper substrate (9), a plurality of fins (10) are located in the radiator (12), a water tank is provided in the radiator (12), the plurality of fins (10) extend into the water tank and contact the coolant in the water tank, a water pump in the water tank causes the coolant after absorbing heat to circulate and contact the outer wall of the water tank, and then the heat is dissipated through a cooling fan outside the water tank.

3. The fin-type water-cooled thermal and electrical separation copper substrate according to claim 2, characterized in that: The fins (10) have a thickness of 0.09-1 mm, a spacing of 0.08-2 mm, and a height of 0.5-20 mm.

4. The fin-type water-cooled thermal and electrical separation copper substrate according to claim 2, characterized in that: On one side of the copper substrate (9) provided with the boss (11), the boss (11) is partially removed and a PCB circuit board pressing area (14) is etched out, and a PCB circuit board (8) is pressed and installed in the PCB circuit board pressing area (14).

5. The fin-type water-cooled thermal and electrical separation copper substrate according to claim 4, characterized in that: After the PCB circuit board (8) is pressed onto the PCB circuit board pressing area (14) on the copper base plate (9), the PCB circuit board (8) is flush with the boss (11), and the depth of the PCB circuit board pressing area (14) after etching is within a range of 0.08-2 mm from the thickness of the PCB circuit board (8).

6. The fin-type water-cooled heat and electricity separation copper substrate according to claim 2, characterized in that: A crystal bonding adhesive (3) is filled between the package carrier (4) on the boss (11) and the LED chip (1), and a bonding gold wire (2) is connected between the LED chip (1) and the PCB circuit board (8).

7. The fin-type water-cooled thermal and electrical separation copper substrate according to claim 2, characterized in that: The joint portion between the boss (11) and the PCB circuit board (8) is dotted with solder paste (5), an aluminum nitride ceramic substrate with the LED chip (1) fixed thereon is placed on the boss (11) and the PCB circuit board (8), and a bonding gold wire (2) is connected between the aluminum nitride ceramic substrate with the LED chip (1) fixed thereon and the PCB circuit board (8).

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