High-brightness and high-strength LED support

Abstract

The invention discloses a high-brightness and high-strength LED support which comprises a substrate, two bonding pads and two pins are formed on the substrate, a groove is formed between the two bonding pads, a cup body is arranged on the substrate in an injection molding mode, a separation strip is formed in the groove to separate the two bonding pads, the bonding pads are arranged at the groove bottom of the cup body, and the side wall of the cup body is an inclined face. At least one supporting strip is arranged perpendicular to the separation strip, the two ends of the supporting strip are connected with the two side walls of the cup body respectively, an inner cavity of the cup body is divided into at least two chip binding parts, the two side walls of the supporting strip are inclined planes, the height of the supporting strip is 1 / 3-1 / 2 of the embedded height, and light rays emitted by adjacent lamp beads are converged in the inner cavity of the cup body. In addition, if the supporting strip is in a special shape, a dark area can be formed above the supporting strip, but due to the fact that the area is in the cup body, the dark area can be covered in the mode that the side wall of the cup body reflects light, the effect of eliminating the dark area is achieved, and on the premise that the structure of the cup body is reinforced, the overall display effect is further improved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor packaging brackets, in particular to a high-brightness and high-intensity LED bracket. Background Art

[0002] The LED package bracket is mainly used as the main bearing component for binding the light-emitting chip. In addition to being conductive and easy to install, the LED package bracket also plays a role in protecting the light-emitting chip. Therefore, the strength of the LED package bracket is crucial.

[0003] With the continuous advancement of technology, the existing LED package bracket usually binds more than two light-emitting chips in a cup body. In order to increase the light extraction rate and strengthen the strength of the LED package bracket, a partition part is usually added to the cup body, as shown in the public technical document "CN209963084U, a double-cup LED bracket". In its technical solution, a partition part 3 is provided inside the cup cavity, and the partition part 3 is integrally formed with the injection molded body 1 and divides the cup cavity into a first chamber and a second chamber located on both sides thereof, so that the LED bracket can achieve three color temperature sections of 3000K color temperature, 4000K color temperature and 6500K color temperature through the double-chamber structure, and can also meet the automatic switching of color temperature at different times, different environments and different occasions;

[0004] Based on the literature in the background technology and Figure 2 As shown, the height of the partition part 3 is flush with the surface of the cup body, so the angle of light emitted by the two lamp beads is affected by the partition part 3, and the light beams will intersect above the partition part 3. At this time, a dark area will be formed between the partition part 3 and the intersection point. Although the overall brightness will be improved, the position of the dark area will be particularly obvious, affecting the display effect. Summary of the invention

[0005] The object of the present invention is to provide a high-brightness and high-intensity LED bracket to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A high-brightness and high-intensity LED bracket, comprising a substrate, the substrate is formed with two pads and two pins, a groove is provided between the two pads, a cup body is injection-molded on the substrate, and a separator is formed in the groove to separate the two pads, the pad is located at the bottom of the groove of the cup body, and the side wall of the cup body is an inclined surface;

[0008] At least one support bar is provided perpendicular to the dividing bar, and the two ends of the support bar are respectively connected to the two side walls of the cup body, dividing the inner cavity of the cup body into at least two chip binding parts. The two side walls of the support bar are inclined surfaces, and the height of the support bar is 1 / 3 to 1 / 2 of the embedded height, so that the light emitted by adjacent lamp beads converges in the inner cavity of the cup body.

[0009] According to a further technical solution, the cross section of the support bar is an isosceles triangle or an equilateral trapezoid.

[0010] According to a further technical solution, there are two support bars which are arranged in parallel.

[0011] According to a further technical solution, the inclined surface of the support bar is symmetrical to the inclined surface of the side wall of the cup body, and the angle formed between the two inclined surfaces is 60°-120°.

[0012] According to a further technical solution, the support bar is made of a translucent material.

[0013] According to a further technical solution, the pad is flush with the pin, steps are provided on both sides of the pad to fit with the cup body, and the support bar fits the surface of the pad.

[0014] Beneficial effects of the present invention:

[0015] Although the light emitted by the lamp beads in the present invention will be limited by the inclined surface of the support bar, the light emitted by adjacent lamp beads will converge in the inner cavity of the cup body. If the support bar adopts a special shape, a dark area will be formed above it. However, since the area is within the cup body, this part of the dark area will be covered by reflecting light from the side wall of the cup body to achieve the effect of eliminating the dark area. On the premise of strengthening the cup body structure, the overall display effect is further improved.

[0016] Other features and advantages of the present invention will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 : Schematic diagram of the prior art.

[0018] Figure 2 : The main structural diagram of the present invention.

[0019] Figure 3 : Rear view structural diagram of the present invention.

[0020] Figure 4 : The cross-sectional structure of the present invention Figure 1 .

[0021] Figure 5 : The cross-sectional structure of the present invention Figure 2 .

[0022] Figure 6: Schematic diagram of several support strip structures of the present invention Figure 1 .

[0023] Figure 7 : Schematic diagram of several support strip structures of the present invention Figure 2 .

[0024] Figure 8 : Light reflection effect simulation diagram of the present invention. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0026] Please refer to Figure 2-8 ;

[0027] The packaging bracket described in the present invention is used to bind white light source chips, aiming to strengthen the overall structure and improve the brightness, and specifically includes a substrate. The substrate is formed with two soldering pads 11 and two pins 12. A groove is provided between the two soldering pads 11, which are respectively used to connect to the positive electrode and the negative electrode. Preferably, a silver layer is provided on the soldering pad 11 to make the conductive performance better. A cup body 21 is injection molded on the substrate. During the injection molding process, in addition to forming the cup body 21, the molten slurry will also enter the groove to form a dividing strip 22 to separate the two soldering pads 11. The dividing strip 22 and the cup body 21 are injection molded as a whole. The cup body 21 wraps the outer periphery of the soldering pad 11. At the same time, combined with the setting of the dividing strip 22, the relative positions of the two soldering pads 11 can be fixed. A groove is provided in the cup body 21, and the soldering pad 11 is located at the bottom of the groove of the cup body 21. The side wall of the cup body 21 is an inclined surface; the inclined surface is used to limit the range of light irradiation outward.

[0028] According to the prior art, the separate partition bar 22 is not sufficient to increase the strength of the LED package bracket. Therefore, in the present technical solution, at least one support bar 3 is provided perpendicular to the partition bar 22. The two ends of the support bar 3 are respectively connected to the two side walls of the cup body 21. The support bar 3 is located above the partition bar 22 and is staggered to form an upper and lower support structure, so that the overall strength of the cup body 21 is enhanced. At the same time, the pad 11 is divided into at least two areas for binding the chip. Each area contains a positive electrode and a negative electrode. The number of binding parts depends on the number of support bars 3, and the relationship between the two is n and n+1. The two side walls of the support bar 3 are inclined surfaces, and the height of the support bar 3 is 1 / 3 to 1 / 2 of the embedded height.

[0029] Although the light emitted by the lamp beads will be limited by the inclined surface of the support bar 3, the light emitted by adjacent lamp beads will converge in the inner cavity of the cup body 21. If the support bar 3 adopts a special shape, a dark area will be formed above it. However, since the area is inside the cup body 21, this part of the dark area will be covered by reflecting light from the side wall of the cup body 21 to achieve the effect of eliminating the dark area. On the premise of strengthening the structure of the cup body 21, the overall display effect is further improved.

[0030] Preferably, the cross-section of the support bar 3 is an isosceles triangle or an equilateral trapezoid. When an isosceles trapezoid is adopted, there is a gap at the intersection of the end face of the support bar 3 and the light, and when an isosceles triangle is adopted, the intersection of the light rays is located at the top of the triangle. At this time, there is no condition for forming a dark area, and the display effect is better.

[0031] In one embodiment, the support bar 3 and the cup body 21 are made by integral injection molding, and the color is white. In addition to having a supporting function, it also has a good reflective effect. In another embodiment, the support bar 3 is formed by secondary injection molding and is made of a translucent material, which can be frosted transparent or white transparent. Usually, the light-emitting chip is close to a plane, and its emission angle is in the range of 160°, while the inclination angle of the side wall of the cup body 21 is generally 120°, that is to say, some light needs to be reflected multiple times before it can be emitted out of the cup body 21, and this part of the light will lose energy during the reflection process and be converted into heat on the cup body 21. Its energy is weaker than the light directly irradiated to the outside world. Superposition together cannot enhance the brightness, or the effect of superposition to increase the brightness is very limited, so this part of the light is wasted.

[0032] In this embodiment, the translucent support bar 3 can not only reflect the light, but also absorb part of the light to emit light. The light from two adjacent light-emitting chips irradiates the support bar 3 to form a secondary light source. For special shapes, such as an equilateral trapezoid, the dark area can be covered by the light emitted by this secondary light source.

[0033] Preferably, a large number of focusing points can be formed on the side walls of the support bar 3. The arrangement of these focusing points is similar to the effect of making the brightness distribution uniform and absorbing light to increase the brightness in the duct plate assembly, so as to increase the light absorption effect of the support bar 3, improve the utilization rate of light, and make the brightness emitted by it higher, which can achieve a certain light superposition effect and improve the overall brightness.

[0034] In the embodiment of the present invention, there are two support bars 3, which are arranged in parallel. In other words, three binding areas are formed, which greatly increases the utilization rate of the packaging bracket. It should be noted that one chip or two chips can be set in one binding area, depending on the usage.

[0035] Furthermore, the inclined surface of the support bar 3 is symmetrical with the inclined surface of the side wall of the cup body 21, and the angle formed between the two inclined surfaces is 60°-120°.

[0036] The pad 11 is flush with the pin 12, and steps 13 are provided on both sides of the pad 11. During the injection molding process of the cup body 21, the slurry enters the step 13 to form a shape adapted to the cup body 21. In addition, the support bar 3 fits the surface of the pad 11. In addition to providing support, it can also press the pad 11 to prevent it from warping.

[0037] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0038] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A high brightness and high intensity LED bracket, characterized by: The invention comprises a substrate, wherein the substrate is formed with two pads (11) and two pins (12), a groove is provided between the two pads (11), a cup body (21) is injection-molded on the substrate, and a separation strip (22) is formed in the groove to separate the two pads (11), the pads (11) are located at the bottom of the groove of the cup body (21), and the side wall of the cup body (21) is an inclined surface; At least one support bar (3) is provided perpendicular to the dividing bar (22), and the two ends of the support bar (3) are respectively connected to the two side walls of the cup body (21), dividing the inner cavity of the cup body (21) into at least two chip binding parts, the two side walls of the support bar (3) are inclined surfaces, and the height of the support bar (3) is 1 / 3 to 1 / 2 of the embedded height, so that the light emitted by adjacent lamp beads is located in the inner cavity of the cup body (21) and converges.

2. A high brightness and high intensity LED bracket according to claim 1, characterized in that: The cross section of the support bar (3) is an isosceles triangle or an equilateral trapezoid.

3. The high brightness and high intensity LED bracket according to claim 1, characterized in that: The support bars (3) have two sections and are arranged in parallel.

4. The high brightness and high intensity LED bracket according to claim 1, characterized in that: The inclined surface of the support strip (3) is symmetrical to the inclined surface of the side wall of the cup body (21), and the angle formed between the two inclined surfaces is 60°-120°.

5. The high brightness and high intensity LED bracket according to claim 1, characterized in that: The support bar (3) is made of a translucent material.

6. The high brightness and high intensity LED bracket according to claim 1, characterized in that: The pad (11) is flush with the lead (12), steps (13) are provided on both sides of the pad (11) and fit with the cup body (21), and the support bar (3) fits the surface of the pad (11).

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