Noise minimization structure of high-intensity focused ultrasound generating device

Abstract

According to the high-intensity focused ultrasonic wave generation device of the present invention, since the ultrasonic wave emission frame, the transducer holder, and the transducer constitute an integrated electrode, it is possible to minimize noise by causing electromagnetic interference (EMI) noise, which is only concentrated on the transducer, to flow to the ultrasonic wave emission frame, and to prevent signal loss due to the noise, thereby improving the reliability of the high-intensity focused ultrasonic wave generation device. Therefore, it is possible to apply an RF signal more stably. Moreover, since the ultrasonic radiation frame, the transducer holder, and the transducer constitute an integrated electrode, the cathode of the power supply unit can be connected to the ultrasonic radiation frame or the cathode of a single transducer, and the circuit configuration can be made very simple compared to the configuration connected to each of the plurality of transducers.

Description

Technical Field

[0001] The present invention relates to a noise minimizing structure of a high-intensity focused ultrasonic wave generator, and more specifically, to the following noise minimizing structure of a high-intensity focused ultrasonic wave generator: a plurality of transducers are individually mounted on an ultrasonic wave radiation frame through a transducer bracket, and the transducers, the transducer bracket and the ultrasonic wave radiation frame are grounded to act as an integrated electrode, thereby minimizing the noise concentrated only on the transducers. Background Art

[0002] Generally, a high-intensity focused ultrasound (HIFU) generator generates high-intensity ultrasonic energy by focusing ultrasonic waves generated by a transducer and irradiates the energy to a patient's affected part to increase the temperature of the affected part, thereby treating the affected part without surgical operation.

[0003] For the existing high-intensity focused ultrasonic generating device, when using dozens or hundreds of transducers, multiple transducers are installed on the front surface of the ultrasonic radiating frame, and then the entire front surface of the ultrasonic radiating frame is coated with glue to form a waterproof layer, thereby fixing multiple transducers by the waterproof layer and preventing water leakage at the same time.

[0004] However, since the ultrasonic energy generated forward from the transducer is absorbed by the waterproof layer, there is not only the problem of increasing the input voltage to compensate for this, but also the problem of generating electromagnetic interference (EMI) noise in multiple transducers, and the problem of needing to replace the ultrasonic radiating frame even if only one of the multiple transducers fails. Summary of the invention

[0005] Technical issues

[0006] An object of the present invention is to provide a noise minimizing structure of a high-intensity focused ultrasound generating device that can easily replace and repair a transducer and improve stability by minimizing the generation of noise.

[0007] Technical Solution

[0008] The noise minimization structure of the high-intensity focused ultrasonic generating device according to the present invention includes: an ultrasonic radiation frame, which is formed with a recessed front surface and has a plurality of coupling holes; a plurality of transducer brackets, which are respectively inserted into the plurality of coupling holes in front of the ultrasonic radiation frame and penetrate the ultrasonic radiation frame to be detachably coupled; and a plurality of transducers, which are respectively mounted on the plurality of transducer brackets in a manner of exposing the front surfaces, wherein the ultrasonic radiation frame, the transducer bracket and the transducer are formed to have conductivity and are integrated electrodes that are in contact with each other and electrically connected.

[0009] At least one of the ultrasonic radiation frame and the cathode of the transducer is connected to a cathode of a power supply unit and is grounded, and the transducers are respectively connected to an anode of the power supply unit.

[0010] The ultrasonic radiation frame, the transducer support and the transducer are formed by using conductive materials.

[0011] At least a portion of the ultrasonic radiation frame, the transducer support and the transducer are formed of non-conductive material and the surface of the non-conductive material is coated with conductive material.

[0012] The conductive material includes at least one of chromium, nickel, cadmium, iron, copper, platinum, gold, silver, lead, and alloy.

[0013] The transducer bracket includes: a head portion, which is arranged on the front surface of the ultrasonic radiation frame and has a placement groove for inserting and placing the transducer; and a main body portion, which is formed to extend backward from the head portion and pass through the combining hole, and is combined at the rear of the ultrasonic radiation frame by a fastening component.

[0014] The electrode wire hole is formed in the main body of the transducer bracket, and the electrode wire connected to the transducer is passed through the electrode wire hole, and the electrode wire can be led out to the rear of the ultrasonic radiation frame, and the electrode wire and the electrode wire hole are sealed by waterproof glue.

[0015] In the head portion of the transducer holder, at least a portion of a side surface of the seating groove is formed as an opening.

[0016] At least one supporting platform is formed at the head of the transducer bracket. The at least one supporting platform protrudes from the bottom surface of the placement groove to support the lower surface of the transducer and is used to form a separation space between the transducer and the bottom surface.

[0017] A clamping platform is formed at the head of the transducer bracket. The clamping platform is formed to protrude from the bottom surface of the placement groove, and the front end of the clamping platform is bent inward to prevent the transducer inserted into the placement groove from falling off.

[0018] The main body of the transducer bracket includes: a shaft portion extending backward from the head portion and pressed into the coupling hole; and a screw portion extending backward from the shaft portion and passing through the coupling hole, and then coupling with the fastening component at the rear of the ultrasonic radiation frame.

[0019] The system further comprises: an RF board, which is equipped on the ultrasonic radiation frame and is electrically connected to the plurality of transducers respectively to supply RF power to the transducers.

[0020] The invention comprises: a plurality of electrode wires respectively connected to the plurality of transducers; and a plurality of board connectors respectively provided in the RF board corresponding to the electrode wires and respectively combined with the electrode wires in a detachable manner.

[0021] The plurality of board connectors are detachably coupled to the RF board.

[0022] The invention comprises: a monitoring sensor, which is equipped on the RF board and is used to independently monitor the operation status of the transducer by sensing the power supply status of the electrode wires respectively connected to the transducer.

[0023] The invention comprises an insulating cover formed to cover the outer side of the RF board.

[0024] The RF board includes: a power supply device for supplying RF power to the RF board; and a power cable connecting the RF board and the power supply device and detachably combined with the RF board.

[0025] The invention comprises a probe coupled to the center of the ultrasonic radiation frame, wherein the RF board is provided on the remaining part of the rear surface of the ultrasonic radiation frame except for the coupling part coupled to the probe.

[0026] According to another aspect of the present invention, the noise minimization structure of the high-intensity focused ultrasonic generating device includes: an ultrasonic radiation frame, a probe is arranged in the center of the front surface, and a plurality of coupling holes are formed with the probe as the center; a plurality of transducer brackets are respectively inserted into the plurality of coupling holes in front of the ultrasonic radiation frame and penetrate the ultrasonic radiation frame, and are detachably combined at the rear of the ultrasonic radiation frame; and a plurality of transducers are respectively installed on the open front surface of at least a part of the plurality of transducer brackets, wherein the transducer bracket includes: a head portion, which is arranged on the front surface of the ultrasonic radiation frame and is formed with a placement groove for inserting and placing the transducer; and a main body portion, which extends from the head portion to the rear. Extending and passing through the combining hole, and being combined at the rear of the ultrasonic radiation frame by a fastening component, wherein a plurality of support platforms are formed on the head, and the plurality of support platforms protrude from the bottom surface of the mounting groove to support the lower surface of the transducer, and are used to form a separation space between the transducer and the bottom surface, the ultrasonic radiation frame, the transducer bracket and the transducer are formed as electrodes that are respectively conductive and are in contact with each other and electrically connected as an integral whole, at least one of the cathodes of the ultrasonic radiation frame and the transducer is connected to the cathode of the power supply unit and is grounded, the anode of the transducer is connected to the anode of the power supply unit, and the ultrasonic radiation frame, the transducer bracket and the transducer are formed using conductive materials.

[0027] According to another aspect of the present invention, the noise minimization structure of the high-intensity focused ultrasonic generating device includes: an ultrasonic radiation frame, a probe is arranged in the center of the front surface, and a plurality of coupling holes are formed with the probe as the center; a plurality of transducer brackets are respectively inserted into the plurality of coupling holes in front of the ultrasonic radiation frame and penetrate the ultrasonic radiation frame, and are detachably combined at the rear of the ultrasonic radiation frame; and a plurality of transducers are respectively installed on the open front surface of at least a part of the plurality of transducer brackets, wherein the transducer bracket includes: a head portion, which is arranged on the front surface of the ultrasonic radiation frame and is formed with a placement groove for inserting and placing the transducer; and a main body portion, which extends rearward from the head portion and penetrates the combination hole, The ultrasonic radiation frame is connected to the rear of the ultrasonic radiation frame by a fastening component, wherein a plurality of support platforms are formed on the head, and the plurality of support platforms protrude from the bottom surface of the placement groove to support the lower surface of the transducer and are used to form a space between the transducer and the bottom surface. The ultrasonic radiation frame, the transducer bracket and the transducer are formed as electrodes that are respectively conductive and are in contact with each other and electrically connected as an integral whole. At least one of the cathodes of the ultrasonic radiation frame and the transducer is connected to the cathode of the power supply unit and is grounded, and the anode of the transducer is connected to the anode of the power supply unit. At least a portion of the ultrasonic radiation frame, the transducer bracket and the transducer are formed using non-conductive materials and the surfaces are coated with conductive materials.

[0028] According to another aspect of the present invention, the noise minimization structure of the high-intensity focused ultrasonic generating device includes: an ultrasonic radiating frame, a probe is arranged in the center of the front surface, and a plurality of coupling holes are formed with the probe as the center; a plurality of transducer brackets are respectively inserted into the plurality of coupling holes in front of the ultrasonic radiating frame and penetrate the ultrasonic radiating frame, and are detachably coupled to the rear of the ultrasonic radiating frame; and a plurality of transducers are respectively mounted on the open front surfaces of at least a portion of the plurality of transducer brackets, wherein the ultrasonic radiating frame, the transducer bracket and the transducer are formed into separate The high-intensity focused ultrasound generating device further comprises: an RF board, which is equipped with the ultrasound radiation frame and is used to supply RF power to the transducer; a plurality of electrode wires, which are respectively connected to the plurality of transducers; a plurality of board connectors, which are respectively equipped with the electrode wires in the RF board and are respectively combined with the electrode wires in a detachable manner; and a monitoring sensor, which is equipped with the RF board and is used to independently monitor the operating status of the transducer by sensing the power supply status of the electrode wires respectively connected to the transducers.

[0029] According to another aspect of the present invention, the noise minimization structure of the high-intensity focused ultrasonic generator comprises: an ultrasonic radiation frame, which is formed with a concave front surface and has a plurality of coupling holes; a plurality of transducer brackets, which are respectively inserted into the plurality of coupling holes in front of the ultrasonic radiation frame and penetrate the ultrasonic radiation frame to be detachably coupled; and a plurality of transducers, which are respectively mounted on the plurality of transducer brackets in a manner of exposing the front surfaces, wherein the ultrasonic radiation frame, the transducer brackets and the transducers are formed as electrodes that are respectively conductive and are in contact with each other and electrically connected as one body, and the noise minimization structure of the high-intensity focused ultrasonic generator also comprises: an RF board, which is equipped on the ultrasonic radiation frame and is respectively electrically connected to the plurality of transducers to supply RF power to the transducers; a plurality of electrode wires. , respectively connected to the multiple transducers; multiple board connectors, which are respectively equipped in the RF board corresponding to the electrode wires, and are respectively combined with the electrode wires in a detachable manner; and a monitoring sensor, which is equipped on the RF board to monitor the operating status of the transducers; and an insulating cover, which is formed to cover the outside of the RF board, wherein the transducer bracket includes: a head, which is arranged on the front surface of the ultrasonic radiation frame and is formed with a placement groove for inserting and placing the transducer; and a main body, which extends backward from the head and passes through the combination hole, and is combined at the rear of the ultrasonic radiation frame by a fastening component, wherein an electrode wire hole is formed in the main body of the transducer bracket, and the electrode wire hole is for the electrode wire to pass through, and the electrode wire can be led out to the rear of the ultrasonic radiation frame.

[0030] Technical Effects

[0031] According to the high-intensity focused ultrasonic generating device of the present invention, since the ultrasonic radiation frame, the transducer bracket and the transducer constitute an integrated electrode, the electromagnetic interference (EMI: ElectroMagnetic Interference) noise concentrated only on the transducer can flow to the ultrasonic radiation frame, thereby minimizing the noise. Since the signal loss caused by noise is prevented, it has the advantage of being able to apply the RF signal more stably.

[0032] Furthermore, since the ultrasonic radiation frame, the transducer holder and the transducer constitute an integrated electrode, the cathode of the power supply unit can be connected to the cathode of the ultrasonic radiation frame or a single transducer. Therefore, compared with a structure connected to each of a plurality of transducers, the circuit structure has the advantage that it can be very simple.

[0033] Furthermore, since the transducer holder and the transducer are formed as an integrated electrode, the loss of acoustic waves when the transducer vibrates can be minimized.

[0034] Furthermore, since a plurality of transducers are individually mounted on the ultrasonic radiation frame via a transducer bracket, and the transducer bracket and the transducer are in contact with each other and electrically connected, there is no need to weld the electrode wire to the front surface of the transducer, thereby preventing water leakage due to the welding structure and making it easier to manufacture.

[0035] Furthermore, since an RF board for applying RF power is provided on the rear surface of the ultrasonic radiation frame, and a plurality of transducers are individually connected to the RF board through a board connector, when it is necessary to repair or replace a portion of the plurality of transducers, it is easy to repair or replace only the relevant transducers.

[0036] Furthermore, since the RF board is equipped with a monitoring sensor, the states of the plurality of transducers can be monitored individually, so there is an advantage that the transducers that need to be repaired or replaced can be more easily identified and promptly responded to. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 FIG. 1 is a perspective view showing a head module of a high-intensity focused ultrasound generator according to a first embodiment of the present invention.

[0038] Figure 2 1 is an exploded perspective view showing a combined structure of an ultrasonic radiation frame and a transducer support according to a first embodiment of the present invention.

[0039] Figure 3 FIG. 1 is a cross-sectional view showing a combined structure of an ultrasonic radiation frame and a transducer support according to a first embodiment of the present invention.

[0040] Figure 4 yes Figure 3 Magnified view of part A.

[0041] Figure 5 4 is a front perspective view of a transducer support according to a first embodiment of the present invention.

[0042] Figure 6 yes Figure 5 A rear perspective view of the transducer holder is shown.

[0043] Figure 7 2 is a diagram showing an electrode structure using a transducer holder according to a second embodiment of the present invention.

[0044] Figure 8 is a rear view showing an ultrasound radiation frame and an RF board according to a third embodiment of the present invention.

[0045] Fig. 9 yes Figure 8 Cross-section diagram along line AA. DETAILED DESCRIPTION

[0046] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0047] The high-intensity focused ultrasound generator according to an embodiment of the present invention is a device that uses high-intensity focused ultrasound (HIFU). The high-intensity focused ultrasound generator includes dozens or hundreds of transducers arranged in a radial transducer array, which can not only treat the affected part of a patient with a tumor, but also stimulate the brain for the treatment of Alzheimer's disease or depression, and can also improve immunity by heating a specific part.

[0048] Figure 1 FIG. 1 is a perspective view showing a head module of a high-intensity focused ultrasound generator according to a first embodiment of the present invention. Figure 2 1 is an exploded perspective view showing a combined structure of an ultrasonic radiation frame and a transducer support according to a first embodiment of the present invention.

[0049] Reference Figure 1 and Figure 2 The head module of the high-intensity focused ultrasound generating device includes an ultrasound radiation frame 10 , a plurality of transducers 20 and a plurality of transducer supports 100 .

[0050] The ultrasonic radiation frame 10 is formed to have conductivity. The ultrasonic radiation frame 10 is described by taking the case where it is formed by using a conductive material as an example. The conductive material is described by taking the case where a conductive metal is used as an example. However, it is not limited to this, and of course it can also be realized that the ultrasonic radiation frame 10 is formed by using a non-conductive material and then the surface is coated with the conductive material. In the case of coating with the conductive material, the thickness of the coating layer will be set to the skin depth that can conduct electricity.

[0051] In the ultrasound irradiation frame 10, a probe 11 is coupled to the center of the front surface 10a, and a plurality of coupling holes 12 are arranged radially around the probe 11. The ultrasound irradiation frame 10 is formed such that the front surface is concave and formed into a disk shape so that the ultrasound irradiated from the plurality of transducers 20 is focused and irradiated to one place.

[0052] The plurality of coupling holes 12 are through holes formed at predetermined intervals from each other, and the number of the coupling holes 12 is set according to the number of the transducers 20 .

[0053] The plurality of transducers 20 are formed to have conductivity. The plurality of transducers 20 include piezoelectric elements. When the transducers 20 receive voltage, ultrasonic waves are generated. The transducers 20 are described by taking the case where they are formed in a circular plate shape as an example. Dozens or hundreds of the transducers 20 are arranged radially to form a transducer array. The number of the transducers 20 can be set according to the ultrasonic energy to be radiated.

[0054] Each surface of the plurality of transducers 20 is coated with an electrode substance as a conductive material. That is, the inside of each of the transducers 20 is formed with a piezoelectric element substance, and the surface is coated with an electrode substance.

[0055] The plurality of transducer holders 100 are formed to have conductivity. In this embodiment, the case where the transducer holders 100 are formed by non-conductive materials and then coated with conductive materials on their surfaces is taken as an example for description. That is, the case where the transducer holders 100 are formed by resin materials and the surfaces are coated with the conductive materials is taken as an example for description.

[0056] The conductive material is described by taking as an example a case where the conductive material includes at least one of chromium, nickel, cadmium, iron, copper, platinum, gold, silver, lead and alloys, but is not limited thereto, and any material can be used as long as it is conductive.

[0057] In this embodiment, a case where a chromium coating layer 170 is formed on the surface of the transducer holder 100 is taken as an example for description.

[0058] The transducer bracket 100 is detachably coupled to each of the plurality of coupling holes 12 of the ultrasound radiation frame 10 .

[0059] The transducers 20 are respectively coupled to the transducer holders 100. The transducer holders 100 and the transducers 20 are integrated electrodes that are in contact with each other and electrically connected. The electrodes are connected to a power supply unit described later to receive power.

[0060] Reference Figures 3 to 6 The transducer bracket 100 includes: a head portion 110 , which is formed with a placement groove 110 a for inserting and placing the transducer 20 ; and a body portion 120 , which is extended from the rear of the head portion 110 and combined with the combination hole 12 .

[0061] The head 110 has a diameter larger than that of the coupling hole 12 so as to be mounted on the front surface 10a of the ultrasound radiation frame 10. The head 110 is formed with the mounting groove 110a, the support platform 110b, the clamping platform 110c and the opening 110d.

[0062] The seating groove 110 a is formed with a front surface opened in front of the head 110 , and is formed as a groove in which the transducer 20 is seated.

[0063] The support platform 110b is formed to protrude forward from the bottom surface of the placement groove 110a by a predetermined height and is formed as a step to support the lower surface of the transducer 20. The support platform 110b forms a space S between the lower surface of the transducer 20 and the bottom surface of the placement groove 110a, so that not only a channel for the electrode wire 180 combined with the transducer 20 to pass through can be formed to stably realize the electrode structure, but also the vibration wave energy of the transducer 20 can be maximized by realizing the vibration of the transducer 20. The support platform 110b is described as an example in which it is constituted as a plurality of support platforms 110b and is formed to be spaced from each other at a predetermined interval. However, it is not limited to this, and it can also be realized by equipping one support platform 110b at the center of the bottom surface of the placement groove 110a. In addition, the support platform 110b can also be formed integrally with the head 110.

[0064] The clamping platform 110c may be formed to protrude from the bottom surface of the placement groove 110a and be bent inward at the front end, so as to prevent the transducer 20 inserted into the placement groove 110a from being disengaged. The front end of the clamping platform 110c may be changed as long as it is a hook shape or other shape that can prevent the transducer 20 from being disengaged. The clamping platform 110c is formed so that a plurality of the clamping platforms 110c are spaced apart from each other at predetermined intervals. In this embodiment, the case where a portion of the plurality of clamping platforms 110c protrudes from the support platform 110b is taken as an example for description.

[0065] The opening portion 110d is formed as an opening cut into the side surface of the seating groove 110a. The opening portion 110d has the advantage of being easy to assemble. In addition, the opening portion 110d enables the transducer 20 to vibrate inside the seating groove 110a, thereby maximizing the vibration wave energy of the transducer 20.

[0066] Preferably, the body 120 is formed to extend backward from the head 110 and pass through the coupling hole 12. The diameter of the body 120 is formed to be smaller than the diameter of the head 110. An electrode wire hole is formed in the center of the body 120 for passing an electrode wire described later.

[0067] The main body 120 includes a shaft portion 121 and a screw portion 122 .

[0068] The shaft portion 121 is formed in a cylindrical shape so as to extend rearward from the head portion 110 and be pressed into the coupling hole 12 .

[0069] The screw portion 122 extends rearward from the shaft portion 121 and has a thread formed on an outer circumferential surface thereof so as to be fastened by the fastening member 150 .

[0070] Preferably, the fastening component 150 is a nut, but is not limited thereto.

[0071] in addition, Figure 3 2 is a cross-sectional view showing a combined structure of an ultrasonic radiation frame and a transducer support according to an embodiment of the present invention. The bonding component is described by taking a flexible adhesive as an example. A flexible adhesive layer 200 formed by the flexible adhesive is formed between at least one of the rear surface and the side surface of the transducer 20 and the head 110. The flexible adhesive can be silicone or epoxy series adhesive, and any flexible material can be used.

[0072] In this embodiment, the flexible adhesive layer 200 is formed between the rear surface of the transducer 20 and the support platform 110b as an example for description. However, it is not limited thereto, and the flexible adhesive layer 200 may also be formed between the side surface of the transducer 20 and the inner side surface of the clamping platform 110c. That is, as long as the front surface of the transducer 20 is not blocked, the flexible adhesive layer 200 may be applied to any position.

[0073] Since the transducer 20 is bonded and fixed to the transducer holder 100 by the flexible adhesive, the transducer 20 can vibrate while the position of the transducer 20 is fixed inside the transducer holder 100, thereby minimizing the loss of vibration wave energy of the transducer 20. In addition, since the front surface of the transducer 20 is not coated with adhesive, the loss of ultrasonic energy radiated forward from the transducer 20 can be prevented. That is, the flexible adhesive layer 200 is only formed on the rear surface or the side surface of the transducer 20, and therefore does not cover the front surface of the transducer 20, so that the ultrasonic energy radiation through the front surface is not restricted.

[0074] Furthermore, the transducer support 100 and the ultrasound radiation frame 10 are sealed by a sealing member.

[0075] The sealing member includes: a first sealing member 210 for sealing between the head portion 110 of the transducer holder 100 and the front surface 10 a of the ultrasound radiation frame 10 ; and a second sealing member 220 for sealing between the body portion 120 and the rear surface 10 b of the ultrasound radiation frame 10 .

[0076] The first sealing member 210 is described by taking as an example a case where it includes two O-rings (a first O-ring 211 and a second O-ring 212) inserted into and coupled to the rear surface of the head 110. However, the present invention is not limited thereto, and the number of the first sealing member 210 can be varied and applied. Furthermore, the first sealing member 210 can be any structure as long as it is formed of various materials such as silicone rubber and rubber and can perform sealing, except for the O-ring.

[0077] Preferably, the first O-ring 211 and the second O-ring 212 are formed to have different diameters. The first O-ring 211 and the second O-ring 212 are inserted into the annular groove 110e formed on the rear surface of the head 110 and tightly adhere to the front surface 10a of the ultrasound radiation frame 10 for sealing.

[0078] The second sealing member 220 includes a third O-ring 221 inserted into the shaft portion 121 of the body portion 120 and an O-ring pressing member 222 inserted into the shaft portion 121 behind the third O-ring 221 to closely attach the third O-ring 221 to the rear surface 10 b of the ultrasound irradiation frame 10 .

[0079] The O-ring pressing member 222 is formed in a ring shape and has an inclined surface 222 a formed on the front surface thereof for a portion of the third O-ring 221 to be seated.

[0080] The second sealing member 220 may further include a gasket 223 provided between the O-ring pressurizing member 222 and the fastening member 150. The gasket 223 is not an essential component of the second sealing member 220, and the second sealing member 220 may additionally include the gasket 223. The gasket 223 may perform the functions of sealing the third O-ring 221 and the O-ring pressurizing member 222 and holding the transducer holder 100.

[0081] The second sealing member 220 may be any structure other than an O-ring or a gasket as long as it is formed of various materials such as silicone resin, rubber, etc. and can seal.

[0082] Furthermore, a waterproof adhesive layer 250 formed by waterproof adhesive is formed between the electrode wire hole 120a of the transducer support 100 and the electrode wire 180 described later. The waterproof adhesive can use the same adhesive as the flexible adhesive. Moreover, of course, the waterproof adhesive layer 250 can also be formed to fill the space S with the waterproof adhesive.

[0083] In addition, refer to Figure 4The electrode structure using the transducer holder 100 is described as follows.

[0084] In the present invention, the ultrasound radiation frame 10 , the transducer support 100 , and the transducer 20 are all formed to have conductivity and are integrated electrodes that are in contact with each other and electrically connected.

[0085] The ultrasound radiation frame 10 is connected to the cathode of a power supply unit for supplying power and is grounded. However, this is not limited thereto, and the anode and cathode of the power supply unit may also be connected to the transducer 20, respectively.

[0086] The transducers 20 are respectively connected to the anodes of the power supply unit. The transducer 20 is connected to the power supply unit through an electrode wire 180. The electrode wire 180 can be connected to any one of the transducer holder 100 and the transducer 20. In the present embodiment, the case where the electrode wire 180 is an electric wire connected to the center of the rear surface of the transducer 20 by welding is used as an example for explanation. The electrode wire 180 is led out to the rear of the ultrasonic radiation frame 10 through the electrode wire hole of the transducer holder 100 and is connected to a separate circuit substrate. However, this is not limited to this, and any power supply unit such as a pin, a connector, etc. can be used as long as it can supply power.

[0087] The ultrasound irradiation frame 10 is grounded, and the transducer 20 is configured to receive power from the electrode wire 180 so that current is supplied to the transducer 20 by applying a potential difference to the ultrasound irradiation frame 10 and the transducer 20 , respectively.

[0088] As described above, in the present invention, the ultrasonic radiation frame 10, the transducer support 100 and the transducer 20 form an integrated electrode, and the ultrasonic radiation frame 10 is constructed to be grounded, so that when both the anode and the cathode are connected to the transducer 20, only the noise concentrated in the transducer 20 can flow to the ultrasonic radiation frame 10, thereby minimizing the noise.

[0089] Furthermore, when the generation of noise is minimized, signal loss due to noise can be prevented, so that the RF signal can be applied more stably, and thus high-intensity focused ultrasound can be irradiated to the accurate lesion position of the patient.

[0090] Furthermore, when each of the multiple transducers 20 is grounded individually, there is a problem that the structure becomes complicated due to the increase in electrode wires for grounding. However, since the cathode of the power supply unit can be connected to only one ultrasonic radiation frame 10 and grounded, the power connection and circuit structure can be simplified.

[0091] Furthermore, the transducer holder 100 and the transducer 20 are used as an integrated electrode, thereby minimizing the loss of acoustic waves when the transducer vibrates.

[0092] Therefore, since it is not necessary to weld the electrode wire on the front surface of the transducer 20, it is possible to prevent water leakage caused by the welding structure on the front surface of the transducer 20. That is, it is possible to prevent water leakage from the front surface of the transducer 20 exposed to the front surface of the ultrasonic radiation frame 10 and in contact with the liquid to the inside.

[0093] Furthermore, since there is no need to weld electrode wires on the front surface of the transducer 20 , there is an advantage that the electrode structure is simplified and damage to the transducer 20 can be prevented.

[0094] Furthermore, in the high-intensity focused ultrasonic generating device constructed as above, since the plurality of transducers 20 are mounted on the ultrasonic radiation frame 10 using the transducer bracket 100, and the transducers 20 and the transducer bracket 100 are bonded and sealed using the flexible glue, even if the front surface of the ultrasonic radiation frame 10 is not completely coated with glue, water leakage from the front surface of the ultrasonic radiation frame 10 to the inside can be prevented.

[0095] Furthermore, since the front surface of the ultrasonic radiation frame 10 is not completely coated with glue, the entire front surface of the transducer 20 is exposed, thereby preventing the loss of ultrasonic energy radiated forward from the transducer 20. In the case where the front surface of the transducer 20 is blocked by the glue layer as in the past, there is a problem that the ultrasonic energy is absorbed by the glue layer, but in the present invention, since the entire front surface of the transducer 20 is exposed, this problem can be prevented.

[0096] Furthermore, the flexible adhesive is used to bond the transducer 20 to the inside of the transducer bracket 100 , thereby preventing play by fixing the position of the transducer 20 . Meanwhile, the transducer 20 can vibrate, thereby reducing the vibration wave energy loss of the transducer 20 .

[0097] Furthermore, since the plurality of transducers 20 are individually mounted through the transducer holder 100 and the transducer holder 100 is detachably coupled to the ultrasound radiation frame 10 , there is an advantage that the transducers 20 can be individually repaired and replaced.

[0098] Furthermore, since the plurality of transducers 20 are individually mounted by the transducer holder 100, there is an advantage that the capacity of at least a part of the plurality of transducers 20 can be configured to be different. For example, the capacity of the transducer arranged on the central side of the ultrasound radiation frame 10 can be increased, and of course, the voltages applied to the plurality of transducers 20 can be controlled to be different from each other.

[0099] Furthermore, since the transducer holder 100 and the ultrasonic radiation frame 10 are sealed by a sealing member such as an O-ring, it has the advantage of not only preventing water leakage from the front surface of the ultrasonic radiation frame 10 to the rear, but also allowing the transducer holder to be easily removed from the ultrasonic radiation frame.

[0100] In addition, in the embodiment, the case where the transducers 20 are all combined with the combination holes 12 of the ultrasonic radiation frame 10 is used as an example for explanation, but it is not limited to this. Of course, the transducers 20 can also be provided only in at least a part of the combination holes 12 according to the capacity of the high-intensity focused ultrasonic wave generator. In the case where the transducers 20 are provided only in at least a part of the combination holes 12, the transducer bracket 100 can be combined in the entire combination hole 12, and a bracket cover (not shown) for covering the opened front surface can also be detachably combined in the transducer bracket of the transducer bracket 100 to which the transducer 20 is not combined. The bracket cover (not shown) can be formed of a material different from that of the transducer 20, but formed in the same shape as that of the transducer 20, and can be combined by glue. Therefore, the number of transducers 20 installed can be adjusted, so that the energy capacity of the high-intensity focused ultrasonic wave generator can be adjusted.

[0101] in addition, Figure 7 2 is a diagram showing an electrode structure using a transducer holder according to a second embodiment of the present invention.

[0102] Reference Figure 7 The electrode structure of the transducer support according to the second embodiment of the present invention is different from the first embodiment in that the entire transducer support 300 is formed of conductive material, while the rest of the structure and function are the same as those of the first embodiment. Therefore, detailed description of similar structures is omitted and the description focuses on the differences.

[0103] The transducer support 300 is formed by using the conductive material, and the structure or shape is applied to the one embodiment.

[0104] The conductive material may be any material as long as it is a conductive material such as metal.

[0105] The surface of the transducer 20 is coated with an electrode material. The electrode material may be any material as long as it is a material that can be used as an electrode, such as a metal such as silver.

[0106] The ultrasound radiation frame 10 , the transducer support 100 , and the transducer 20 are formed as integrated electrodes that are conductive and in contact with each other and electrically connected.

[0107] The ultrasound irradiation frame 10 is connected to a cathode of a power supply unit for supplying power and is grounded.

[0108] The transducers 20 are respectively connected to the anodes of the power supply unit. The transducer 20 is connected to the power supply unit through an electrode wire 180. The electrode wire 180 can be connected to any one of the transducer holder 100 and the transducer 20. In the present embodiment, the case where the electrode wire 180 is an electric wire connected to the center of the rear surface of the transducer 20 by welding is used as an example for explanation. The electrode wire 180 is led out to the rear of the ultrasonic radiation frame 10 through the electrode wire hole of the transducer holder 100 and is connected to a separate circuit substrate. However, this is not limited to this, and any power supply unit such as a pin, a connector, etc. can be used as long as it can supply power.

[0109] The transducer 20 is placed on the support platform 110b, and the separation space S is formed between the transducer 20 and the bottom surface of the placement groove of the transducer bracket 100, thereby preventing the electrode wire 180 from contacting the surface of the transducer bracket 300, thereby preventing a short circuit from occurring.

[0110] The ultrasound irradiation frame 10 is grounded, and the transducer 20 is configured to receive power from the electrode wire 180 so that current is supplied to the transducer 20 by a potential difference applied to the ultrasound irradiation frame 10 and the transducer 20 .

[0111] As described above, in the present invention, the ultrasonic radiation frame 10, the transducer support 100 and the transducer 20 form an integrated electrode, and the ultrasonic radiation frame 10 is constructed to be grounded, so that when both the anode and the cathode are connected to the transducer 20, only the noise concentrated in the transducer 20 can flow to the ultrasonic radiation frame 10, thereby minimizing the noise.

[0112] Furthermore, when the generation of noise is minimized, signal loss due to noise can be prevented, so that the RF signal can be applied more stably, and thus high-intensity focused ultrasound can be irradiated to the accurate lesion position of the patient.

[0113] Furthermore, when each of the multiple transducers 20 is grounded individually, there is a problem that the structure becomes complicated due to the increase in electrode wires for grounding. However, since the cathode of the power supply unit can be connected to only one ultrasonic radiation frame 10 and grounded, the power connection and circuit structure can be simplified.

[0114] Furthermore, since it is not necessary to weld the electrode wire on the front surface of the transducer 20, it is possible to prevent water leakage caused by the welding structure on the front surface of the transducer 20. In other words, it is possible to prevent water leakage from the front surface of the transducer 20 that is exposed on the front surface of the ultrasonic radiation frame 10 and in contact with the liquid to the inside.

[0115] Furthermore, since there is no need to weld electrode wires on the front surface of the transducer 20, the electrode structure is simplified and damage to the transducer 20 can be prevented. Furthermore, at least a portion of the side surface and the rear surface of the transducer 20 are coated with a waterproof material, thereby preventing corrosion or power value fluctuations caused by water infiltration.

[0116] in addition, Figure 8 is a rear view showing an ultrasound radiation frame and an RF board according to a third embodiment of the present invention. Fig. 9 yes Figure 8 Cross-section diagram along line AA.

[0117] Reference Figure 8 and Fig. 9 The high-intensity focused ultrasonic generating device according to the third embodiment of the present invention is different from the first and second embodiments in that it also includes an RF board 260 that is equipped on the ultrasonic radiation frame 10 and is electrically connected to the multiple transducers 20 respectively to supply RF power to the transducers 20. Other structures and functions are similar. Therefore, the following description focuses on different structures and omits detailed descriptions of similar structures.

[0118] The following description takes as an example a case where the transducer support 100 is connected to the cathode of the RF board 260 and is grounded, and the transducer 20 is connected to the anode of the RF board 260 and receives the RF power.

[0119] The transducer support 100 and the transducer 20 are respectively connected to the board connector 261 of the RF board 260 through the electrode wires.

[0120] The electrode wires include a first electrode wire (not shown) for connecting the transducer support 100 and the board connector 261 and a second electrode wire 180 for connecting the transducer 20 and the board connector 261 .

[0121] The second electrode wire 180 is an electric wire that is bonded to the center of the rear surface of the transducer 20 by welding and is used to supply RF power to the transducer 20. The second electrode wire 180 is arranged to pass through the electrode wire hole 120a of the transducer holder 100. The second electrode wire 180 is led out to the rear of the ultrasound radiation frame 10 through the electrode wire hole 120a to be connected to the RF board 260.

[0122] The RF board 260 is detachably coupled to the rear surface of the ultrasound radiation frame 10 , and is connected to a plurality of first electrode wires (not shown) respectively connected to the plurality of transducer holders 100 and a plurality of second electrode wires 180 respectively connected to the plurality of transducers 20 .

[0123] The RF plate 260 is arranged at the rear of the ultrasound radiation frame 10 in the remaining part except the center, so as to prevent interference between the RF plate 260 and the probe 11 when the probe 11 is combined with the ultrasound radiation frame 10. In addition, the RF plate 260 can be formed in multiples. In this embodiment, the case where four RF plates 260 are respectively in arc shape and connected to each other to form a ring shape is described as an example. In the case where the RF plates 260 are formed in multiples, the RF plates 260 can be connected to each other, and of course, can also be arranged at predetermined intervals. In addition, the number or shape of the RF plates 260 can be changed in many ways as long as it can prevent interference with the probe 11. That is, the shape of the RF plate 260 can be changed in many ways as long as it is arranged in the remaining part of the ultrasound radiation frame 10 except the central part as the combination part with the probe 11. For example, one or more RF plates 260 can be arranged in the remaining part of the ultrasound radiation frame 10 except the central part in the shape of a quadrilateral, a triangle, a half moon, etc.

[0124] Furthermore, when the number of the RF boards 260 is n, the plurality of transducers 20 may be divided into n groups according to positions, and the plurality of transducers 20 may be connected to the n RF boards 260 according to the groups. Therefore, the RF boards 260 may be replaced and repaired individually.

[0125] The RF board 260 is provided with a plurality of board connectors 261 .

[0126] The board connector 261 is a connector equipped on the RF board 260 and detachably coupled to the first electrode wire and the second electrode wire 180. The board connector 261 is formed to correspond to the number of the transducers 20 so as to be independently connected to the transducers 20. However, it is not limited thereto, and at least two or more transducers 20 may be coupled to one board connector 261, and of course, the number of the board connectors 261 may also be equipped to be greater than the number of the transducers 20. In addition, the board connector 261 may be integrally equipped on the RF board 260, and may also be detachably coupled to the RF board 260.

[0127] The RF board 260 also includes a monitoring sensor (not shown).

[0128] The monitoring sensor (not shown) is a sensor equipped on the RF board 260 and used to independently monitor the operating state of the transducer 20. In the present embodiment, the monitoring sensor (not shown) senses the normal operation or abnormal operation of the transducer 20 by sensing the power supply state of the second electrode wire 180 respectively connected to the transducer 20 as an example for description. For example, the monitoring sensor (not shown) is a current sensor or a voltage sensor for sensing overcurrent, overvoltage or current cutoff of the electrode wire 180 as an example for description. However, it is not limited to this, and any sensor can be applied as long as it is a temperature sensor or a sensor capable of sensing the abnormal state of the transducer 20.

[0129] An insulating cover 270 is provided on the outer side surface of the RF board 260 .

[0130] The insulating cover 270 is provided to cover the outer surface of the RF board 260, thereby playing an insulating role. In this embodiment, the insulating cover 270 is described as a polyimide film, but it is not limited to this. Any material can be used as long as it can be insulated. The insulating cover 270 can be combined with the RF board 260 using a fastening component or the like, and can also be attached to the RF board 260 using a separate adhesive component.

[0131] In addition, the RF board 260 is connected to a power supply device (not shown) for supplying the RF power.

[0132] The RF board 260 and the power supply device (not shown) may be connected using a plurality of power cables (not shown) detachably coupled to the RF board 260. The power cables (not shown) are described by taking a BNC cable equipped with a Bayonet Neil-Concelman (BNC: Bayonet Neil-Concelman) connector as an example, but are not limited thereto and may be applied in various ways.

[0133] As described above, in the present embodiment, the transducer 20 is connected to the RF board 260 and receives the RF power through the RF board 260 .

[0134] Since the plurality of transducers 20 are respectively connected to the board connector 261 of the RF board 260, when any one of the plurality of transducers 20 is damaged or needs to be replaced, only the corresponding transducer 20 can be repaired or replaced. That is, when the plurality of electrode wires respectively connected to the transducers 20 are bundled at one time and connected to a separate power supply device, there is a problem that not only the state of the transducer cannot be confirmed individually, but also the transducer cannot be repaired or replaced individually. On the contrary, in the present invention, the RF board 260 is provided between the transducer 20 and the power supply device (not shown) and the second electrode wires 180 connected to the plurality of transducers 20 are respectively connected to the RF board 260 through the board connector, so that the transducer 20 can be repaired or replaced individually.

[0135] Furthermore, since the status of the plurality of transducers 20 can be individually monitored using a monitoring sensor (not shown) provided on the RF board 260, it is possible to more easily and quickly identify the transducers 20 that only need to be repaired or replaced and take prompt action.

[0136] Therefore, since the plurality of transducers 20 can be independently monitored and repaired or maintained, maintenance and repair are easy to perform.

[0137] Furthermore, since the RF plate 260 can be used interchangeably according to the probe 11, various lesions can be easily treated.

[0138] In addition, in the embodiment, the transducer holder 100 is grounded and only RF power is applied to the transducer 20. However, the present invention is not limited thereto, and of course, the transducer holder 100 may be connected to the cathode of the RF board 260 and the transducer 20 may be connected to the anode of the RF board 260 to provide a potential difference between the transducer holder 100 and the transducer 20.

[0139] In addition, in the embodiment, the case where the surface of the transducer holder 100 is coated with a conductive material or the entire transducer holder 100 is formed with a conductive material so that the transducer holder 100 and the transducer 20 function as an integrated electrode is described as an example. However, it is not limited to this, and of course, the transducer holder 100 can also be formed with a non-conductive material (i.e., an insulating material). In the case where the transducer holder 100 is formed with an insulating material, a first electrode line (not shown) and a second electrode line are connected to the upper end and the lower end of the transducer 20, respectively, and the first electrode line (not shown) and the second electrode line are connected to the RF board 260.

[0140] The present invention is described with reference to the embodiments shown in the accompanying drawings, but this is only exemplary, and anyone with ordinary knowledge in the technical field can understand that various modifications and other equivalent embodiments can be implemented. Therefore, the true technical protection scope of the present invention should be determined based on the technical ideas of the attached claims.

[0141] Industrial Applicability

[0142] According to the present invention, a high-intensity focused ultrasound generating device capable of minimizing noise can be manufactured.

Claims

1. A noise minimization structure for a high-intensity focused ultrasound generator, comprising: The ultrasonic radiation frame is formed with a concave front surface and is formed with a plurality of coupling holes; A plurality of transducer brackets are respectively inserted into the plurality of coupling holes in front of the ultrasonic radiation frame and penetrate the ultrasonic radiation frame to be detachably coupled; and A plurality of transducers are respectively mounted on a plurality of transducer brackets in a manner of exposing the front surfaces thereof, The ultrasonic radiation frame, the transducer support and the transducer are formed as integrated electrodes which are respectively conductive and in contact with each other and electrically connected.

2. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 1, wherein: At least one of the ultrasonic radiation frame and the cathode of the transducer is connected to the cathode of the power supply unit and is grounded. The transducers are respectively connected to anodes of the power supply unit.

3. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 1, wherein: The ultrasonic radiation frame, the transducer support and the transducer are formed by using conductive materials.

4. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 1, wherein: At least a portion of the ultrasonic radiation frame, the transducer support and the transducer are formed of non-conductive material and the surface of the non-conductive material is coated with conductive material.

5. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 3, wherein: The conductive material includes at least one of chromium, nickel, cadmium, iron, copper, platinum, gold, silver, lead, and alloy.

6. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 4, wherein: The conductive material includes at least one of chromium, nickel, cadmium, iron, copper, platinum, gold, silver, lead, and alloy.

7. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 1, wherein: The transducer support comprises: a head, which is arranged on the front surface of the ultrasonic radiation frame and is formed with a placement groove for inserting and placing the transducer; and The main body is formed to extend rearward from the head and pass through the coupling hole, and is coupled to the rear of the ultrasonic radiation frame by a fastening member.

8. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 7, wherein: The electrode wire hole is formed in the body of the transducer support, and the electrode wire connected to the transducer is passed through the electrode wire hole, and the electrode wire can be led out to the rear of the ultrasonic radiation frame. The electrode wires and the electrode wire holes are sealed by waterproof glue.

9. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 7, wherein: In the head portion of the transducer holder, at least a portion of a side surface of the seating groove is formed as an opening.

10. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 7, wherein: At least one supporting platform is formed at the head of the transducer bracket, and the at least one supporting platform protrudes from the bottom surface of the mounting groove to support the lower surface of the transducer and is used to form a separation space between the transducer and the bottom surface.

11. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 7, wherein: A clamping platform is formed at the head of the transducer bracket. The clamping platform is formed to protrude from the bottom surface of the placement groove, and the front end of the clamping platform is bent inward to prevent the transducer inserted into the placement groove from falling off.

12. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 7, wherein: The main body of the transducer support comprises: a shaft portion extending rearward from the head portion and pressed into the coupling hole; and The screw portion extends rearward from the shaft portion and passes through the coupling hole, and then is coupled to the fastening component at the rear of the ultrasonic radiation frame.

13. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 1, further comprising: The RF board is equipped on the ultrasonic radiation frame and is electrically connected to the plurality of transducers respectively to supply RF power to the transducers.

14. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 13, further comprising: A plurality of electrode wires, respectively connected to the plurality of transducers; as well as A plurality of board connectors are respectively provided in the RF board corresponding to the electrode wires and are respectively combined with the electrode wires in a detachable manner.

15. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 14, wherein: The plurality of board connectors are detachably coupled to the RF board.

16. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 13, further comprising: A monitoring sensor, equipped on the RF board, is used to independently monitor the operating status of the transducer by sensing the power supply status of the electrode wires respectively connected to the transducer.

17. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 13, further comprising: An insulating cover is formed to cover the outer side of the RF board.

18. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 13, further comprising: A power supply device, used for supplying RF power to the RF board; as well as A power cable connects the RF board and the power supply device and is detachably combined with the RF board.

19. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 13, further comprising: The probe is combined in the center of the ultrasonic radiation frame, The RF board is provided on the rear surface of the ultrasound radiation frame except for the joint portion to which the probe is joined.

20. A noise minimization structure for a high-intensity focused ultrasound generator, comprising: An ultrasonic radiation frame, wherein a probe is arranged at the center of the front surface and a plurality of coupling holes are formed with the probe as the center; A plurality of transducer brackets are respectively inserted into the plurality of coupling holes in front of the ultrasonic radiation frame and penetrate the ultrasonic radiation frame, and are detachably coupled to the rear of the ultrasonic radiation frame; as well as A plurality of transducers are respectively mounted on the opened front surfaces of at least a portion of the plurality of transducer brackets, Wherein, the transducer support comprises: a head, which is arranged on the front surface of the ultrasonic radiation frame and is formed with a placement groove for inserting and placing the transducer; and The main body extends backward from the head and passes through the coupling hole, and is coupled to the rear of the ultrasonic radiation frame by a fastening member. A plurality of support platforms are formed on the head portion, and the plurality of support platforms protrude from the bottom surface of the placement groove to support the lower surface of the transducer and to form a space between the transducer and the bottom surface. The ultrasonic radiation frame, the transducer support, and the transducer are formed as integrated electrodes that are respectively conductive and in contact with each other and electrically connected. At least one of the ultrasonic radiation frame and the cathode of the transducer is connected to the cathode of the power supply unit and is grounded. The anode of the transducer is connected to the anode of the power supply unit, The ultrasonic wave radiating frame, the transducer support and the transducer are formed by using conductive materials.

21. A noise minimization structure of a high-intensity focused ultrasound generator, comprising: An ultrasonic radiation frame, wherein a probe is arranged at the center of the front surface and a plurality of coupling holes are formed with the probe as the center; A plurality of transducer brackets are respectively inserted into the plurality of coupling holes in front of the ultrasonic radiation frame and penetrate the ultrasonic radiation frame, and are detachably coupled to the rear of the ultrasonic radiation frame; as well as A plurality of transducers are respectively mounted on the opened front surfaces of at least a portion of the plurality of transducer brackets, Wherein, the transducer support comprises: a head, which is arranged on the front surface of the ultrasonic radiation frame and is formed with a placement groove for inserting and placing the transducer; and The main body extends backward from the head and passes through the coupling hole, and is coupled to the rear of the ultrasonic radiation frame by a fastening member. A plurality of support platforms are formed on the head portion, and the plurality of support platforms protrude from the bottom surface of the placement groove to support the lower surface of the transducer and to form a space between the transducer and the bottom surface. The ultrasonic radiation frame, the transducer support, and the transducer are formed as integrated electrodes that are respectively conductive and in contact with each other and electrically connected. At least one of the ultrasonic radiation frame and the cathode of the transducer is connected to the cathode of the power supply unit and is grounded. The anode of the transducer is connected to the anode of the power supply unit, At least a portion of the ultrasonic radiation frame, the transducer support and the transducer are formed of non-conductive material and the surface of the non-conductive material is coated with conductive material.

22. A noise minimization structure for a high-intensity focused ultrasound generator, comprising: An ultrasonic radiation frame, wherein a probe is arranged at the center of the front surface and a plurality of coupling holes are formed with the probe as the center; a plurality of transducer brackets, which are respectively inserted into the plurality of coupling holes in front of the ultrasonic radiation frame and penetrate the ultrasonic radiation frame, and are detachably coupled to the rear of the ultrasonic radiation frame; and A plurality of transducers are respectively mounted on the opened front surfaces of at least a portion of the plurality of transducer brackets, The ultrasonic radiation frame, the transducer support and the transducer are formed as integrated electrodes which are respectively conductive and contact each other and are electrically connected. The noise minimization structure of the high-intensity focused ultrasound generator also includes: an RF board, which is provided on the ultrasonic radiation frame and is used to supply RF power to the transducer; A plurality of electrode wires, respectively connected to the plurality of transducers; a plurality of board connectors, which are respectively provided in the RF board corresponding to the electrode wires and are respectively combined with the electrode wires in a detachable manner; and A monitoring sensor, equipped on the RF board, is used to independently monitor the operating status of the transducer by sensing the power supply status of the electrode wires respectively connected to the transducer.

23. A noise minimization structure for a high-intensity focused ultrasound generator, comprising: The ultrasonic radiation frame is formed with a concave front surface and is formed with a plurality of coupling holes; A plurality of transducer brackets are respectively inserted into the plurality of coupling holes in front of the ultrasonic radiation frame and penetrate the ultrasonic radiation frame to be detachably coupled; and A plurality of transducers are respectively mounted on a plurality of transducer brackets in a manner of exposing the front surfaces thereof, The ultrasonic radiation frame, the transducer support and the transducer are formed as integrated electrodes which are respectively conductive and contact each other and are electrically connected. The noise minimization structure of the high-intensity focused ultrasound generator also includes: an RF board, equipped on the ultrasonic radiation frame, and electrically connected to the plurality of transducers respectively to supply RF power to the transducers; A plurality of electrode wires, respectively connected to the plurality of transducers; a plurality of board connectors, which are respectively provided in the RF board corresponding to the electrode wires and are respectively combined with the electrode wires in a detachable manner; and a monitoring sensor, provided on the RF board, to monitor the operating status of the transducer; and an insulating cover formed to cover the outer side of the RF board, Wherein, the transducer support comprises: a head, which is arranged on the front surface of the ultrasonic radiation frame and is formed with a placement groove for inserting and placing the transducer; and The main body extends backward from the head and passes through the coupling hole, and is coupled to the rear of the ultrasonic radiation frame by a fastening member. An electrode wire hole is formed in the main body of the transducer bracket, and the electrode wire is passed through the electrode wire hole, and the electrode wire can be led out to the rear of the ultrasonic radiation frame.

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