Shaping method of optical module shell

Abstract

The invention relates to the technical field of structure shaping, in particular to an optical module shell shaping method, which comprises the following steps of: placing an upper shell on a lower die holder; the first interface mounting area is clamped with the first clamping structure, the component mounting area is clamped with the second clamping structure, and the second interface mounting area is clamped with the third clamping structure; the upper die base is controlled to move downwards, so that the upper die base and the lower die base are closed; the outer surface is extruded through a fourth clamping structure of the upper die base; the upper die base and the lower die base are heated, and the stress of the upper shell in the extrusion process is released; and the upper die base is controlled to move upwards, the upper shell is taken out, and in this way, the yield during correction of the surface of the upper shell can be increased.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of structural shaping, and in particular to a shaping method for an optical module housing. Background Art

[0002] Among them, the optical module shell is usually produced by a die-casting process. During the production and subsequent processing, the surface flatness and other dimensions of the optical module shell will deviate. For example, the optical module shell is usually produced by a die-casting process. During the manufacturing process, due to the complex structure of the optical module shell and the push of the ejection system of the die-casting mold, it is impossible to ensure that the optical module shell remains in its original shape after die-casting, resulting in deformation of the optical module shell. In the post-processing process, the optical module shell will also be deformed, making the surface flatness and other dimensions of the optical module shell not meet the use standards. Due to the precision requirements of the optical module, the optical module shell cannot be used, increasing the production cost.

[0003] Therefore, a shaping mold is needed to shape the surface flatness of the optical module housing. However, the prior art lacks a suitable mold and shaping method for shaping the optical film block housing, resulting in an insufficient yield of the optical module. Summary of the invention

[0004] In view of the above-mentioned defects of the prior art, an embodiment of the present invention provides a shaping method for an optical module housing, which can increase the yield rate when correcting the surface of the upper housing.

[0005] In order to solve the above technical problems, a technical solution adopted in an embodiment of the present invention is: providing a shaping method for an optical module housing, comprising: using a shaping mold, the shaping mold comprising an upper mold base and a lower mold base, the lower mold base comprising a first clamping structure, a second clamping structure and a third clamping structure, and the upper mold base comprising a fourth clamping structure; the optical module housing comprises an upper housing, the upper housing comprises an inner surface and an outer surface, the inner surface has a first interface installation area for installing an adapter, a component installation area for installing an optoelectronic component, and a second interface installation area for accessing a switch electrical port;

[0006] The shaping method comprises the following steps:

[0007] placing the upper shell on the lower die base;

[0008] Engage the first interface installation area with the first engagement structure, engage the component installation area with the second engagement structure, and engage the second interface installation area with the third engagement structure;

[0009] Controlling the upper die base to move downward so that the upper die base and the lower die base are molded together;

[0010] Extruding the outer surface by means of a fourth engaging structure of the upper die seat;

[0011] Heating the upper die base and the lower die base to release the stress of the upper shell during the extrusion process;

[0012] The upper die seat is controlled to move upward to take out the upper shell.

[0013] Optionally, the engagement of the component installation area with the second engagement structure includes:

[0014] Mounting the first mounting surface in the component mounting area on the first bearing surface in the second engaging structure;

[0015] Mounting the second mounting surface in the component mounting area on the second bearing surface in the second engaging structure;

[0016] Ensure that the first mounting surface is fully engaged with the first bearing surface, and ensure that the second mounting surface is fully engaged with the second bearing surface by moving the upper housing;

[0017] Wherein, the first mounting surface is used for mounting the optical interface system and the heat sink device in the optoelectronic component, and the second mounting surface is used for mounting the circuit mainboard in the optoelectronic component.

[0018] Optionally, extruding the outer surface through the fourth engaging structure of the upper die seat includes:

[0019] Setting a first extrusion surface on the upper die seat to be opposite to the first surface of the outer surface;

[0020] Setting a second extrusion surface on the upper die seat to be opposite to the second surface of the outer surface;

[0021] The third extrusion surface on the upper die seat is arranged to be opposite to the third surface of the outer surface;

[0022] When the upper die base is molded with the lower die base, the first extrusion surface contacts the first surface, the second extrusion surface contacts the second surface, and the third extrusion surface contacts the third surface;

[0023] Among them, the first surface is the surface on the outer surface corresponding to the first interface installation area, the second surface is the surface on the outer surface corresponding to the component installation area, and the third surface is the groove surface on the second surface for attaching product labels.

[0024] Optionally, placing the upper shell on the lower mold base includes:

[0025] Fitting the frame of the upper shell to the first reference surface on the lower mold base;

[0026] The first reference plane is a planar structure surrounding the first clamping structure and the second clamping structure, and the first frame is provided with screw holes, and the lower shell and the upper shell in the optical module shell are fixed by setting screws in the screw holes.

[0027] Optionally, heating the upper die base and the lower die base includes:

[0028] Mounting holes are arranged on the upper die base and the lower die base, and the heating pipes are connected to the mounting holes.

[0029] Optionally, controlling the upper mold base to move downward so that the upper mold base and the lower mold base are molded together includes:

[0030] Set the mold closing time and mold closing pressure;

[0031] Set the heating time and heating temperature.

[0032] Optionally, controlling the upper mold base to move upward to remove the upper shell includes:

[0033] measuring the flatness of the outer surface;

[0034] If the flatness meets the preset flatness requirement, the upper shell is judged to be a good product, and the upper shell is taken out, and the shaping is completed;

[0035] If the flatness does not meet the preset flatness requirement, the upper shell is placed on the lower die base again and reshaped again.

[0036] Optionally, if the flatness does not meet the set requirements, placing the upper shell on the lower die base again and performing reshaping again includes:

[0037] The shaping operation is repeated. If the flatness of the outer surface of the upper shell still does not meet the requirements, the upper shell is judged to be a defective product.

[0038] Optionally, the shaping mold includes an upper mold plate and a lower mold plate;

[0039] Installing a plurality of the upper die seats on the upper die plate;

[0040] Installing a plurality of the lower die seats on the lower die plate, with the centers of the plurality of the lower die seats being in a straight line;

[0041] Setting the number of the upper die base and the number of the lower die base to be equal;

[0042] The third engaging structures on each of the lower mold bases are connected to each other to form a plane.

[0043] Optionally, the upper die base and the lower die base are made of copper.

[0044] Among them, an embodiment of the present invention provides a shaping method for an optical module housing, the shaping method comprising the following steps: placing an upper shell on the lower die seat; engaging the first interface installation area with the first engaging structure, engaging the component installation area with the second engaging structure, engaging the second interface installation area with the third engaging structure; controlling the upper die seat to move downward so that the upper die seat and the lower die seat are molded together; extruding the outer surface through the fourth engaging structure of the upper die seat; heating the upper die seat and the lower die seat to release the stress of the upper shell during the extrusion process; controlling the upper die seat to move upward to remove the upper shell. By using this method and steps to adjust the shaping mold, the yield rate when correcting the surface of the upper shell can be increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the specific embodiments or the prior art description. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual scale.

[0046] Figure 1 A shaping method of an optical module housing in one embodiment of the present invention is shown;

[0047] Figure 2 A structural diagram of a lower die base in one embodiment of the present invention is shown;

[0048] Figure 3 The figure shows a bottom view and a D-direction view of an upper die base in one embodiment of the present invention;

[0049] Figure 4 A structural diagram of an upper housing in one embodiment of the present invention is shown;

[0050] Figure 5 A bottom view of an upper housing in one embodiment of the present invention is shown.

[0051] 1. Upper die base; 2. Lower die base; 3. Upper shell; 101. Fourth clamping structure; 1011. First extrusion surface; 1012. Second extrusion surface; 1013. Third extrusion surface; 201. First clamping structure; 202. Second clamping structure; 203. Third clamping structure; 204. First reference surface; 2021. First bearing surface; 2022. Second bearing surface; 301. First interface mounting area; 302. Component mounting area; 303. Second interface mounting area; 304. First surface; 305. Second surface; 306. Third surface; 307. Limiting block; 308. Second frame; 309. First frame; 3021. First mounting surface; 3022. Second mounting surface. DETAILED DESCRIPTION

[0052] The following embodiments of the technical solution of the present invention are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and are therefore only used as examples, and cannot be used to limit the protection scope of the present invention.

[0053] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by those skilled in the art to which the present invention belongs.

[0054] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0055] In addition, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present invention, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0056] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0057] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0058] Figure 1 A shaping method for an optical module housing is shown, using a shaping mold, the shaping mold comprising an upper mold base 1 and a lower mold base 2, referring to Figure 2 The lower mold base 2 includes a first locking structure 201, a second locking structure 202 and a third locking structure 203, and the upper mold base 1 includes a fourth locking structure 101; the optical module housing includes an upper housing 3, and the upper housing 3 includes an inner surface and an outer surface, and the inner surface has a first interface installation area 301 for installing an adapter, a component installation area 302 for installing an optoelectronic component, and a second interface installation area 303 for accessing a switch electrical port.

[0059] Among them, reference Figure 2 Each structure on the lower mold base 2 is an upwardly protruding structure, and the protruding distance can be set according to actual needs. In one embodiment, according to the different depths of the optoelectronic element embedded in the upper shell 3, the first clamping structure 201, the second clamping structure 202 and the third clamping structure 203 on the lower mold base 2 have different heights. In one implementation, the first clamping structure 201, the second clamping structure 202, and the third clamping structure 203 present a multi-level stepped surface, and the upward protruding distance increases successively, so that the contact between the lower mold base 2 and the inner surface of the upper shell 3 is more closely fitted, thereby improving the calibration accuracy.

[0060] The downward protrusion distance of each structure on the upper die base 1 can be made according to actual needs, refer to Figure 3In one embodiment, according to the shape contour of the outer surface of the upper shell 3, the outer surface includes a first surface 304, a second surface 305 and a third surface 306; the first surface 304 is a surface on the outer surface corresponding to the first interface mounting area 301, the second surface 305 is a surface on the outer surface corresponding to the component mounting area 302, and the third surface 306 is a groove surface on the second surface 305, which is used to attach a product label; correspondingly, the fourth locking structure 101 includes a first extrusion surface 1011, a second extrusion surface 1012 and a third extrusion surface 1013, the first extrusion surface 1011 is locked with the first surface 304, the second extrusion surface 1012 is locked with the second surface 305, and the third extrusion surface 1013 is locked with the third surface 306, so that the contact between the lower mold base 2 and the outer surface of the upper shell 3 is more fitted, thereby improving the calibration accuracy. Among them, in this embodiment, the upper surface of the upper shell 3 is relatively flat, and each of the first extrusion surfaces 1011 can be connected to each other, and each of the second extrusion surfaces 1012 can be connected to each other. The first extrusion surface 1011, the second extrusion surface 1012, and the third extrusion surface 1013 present a multi-level structure of stepped surfaces, and the downward protrusion distance increases successively. Such a setting can reduce the processing difficulty of the upper die seat, reduce the cutting amount of the upper die seat, save materials, and reduce costs.

[0061] The shaping method using the shaping mold comprises the following steps:

[0062] S101: placing the upper shell 3 on the lower mold base 2 .

[0063] Among them, ensure that the upper mold base 1 and the lower mold base 2 of the shaping mold are clean and free of foreign matter, prepare the upper shell 3 to be shaped, check whether its appearance and size meet the requirements, place the upper shell 3 of the optical module on the lower mold base 2, ensure its correct position, avoid tilting or imbalance, and check the alignment of the first interface mounting area 301, component mounting area 302, second interface mounting area 303 of the upper shell 3 with the first snap-fit ​​structure 201, second snap-fit ​​structure 202 and third snap-fit ​​structure 203 of the lower mold base 2.

[0064] The step of placing the upper shell 3 on the lower mold base 2 includes:

[0065] S1011: Fit the frame of the upper shell 3 to the first reference surface 204 on the lower mold base 2 .

[0066] The first reference plane 204 is a planar structure surrounding the first engaging structure 201 and the second engaging structure 202. The first frame 309 is provided with screw holes, and screws are provided in the screw holes to fix the lower shell and the upper shell 3 in the optical module shell. The first reference plane 204 can prevent the side frames of the upper shell 3 from deforming to both sides during the correction process of the upper shell 3, and the upper surface of the first frame 309 is a key controlled dimension, which is required to be controlled within the dimension range. The first reference plane 204 can make the dimension within the dimension range.

[0067] S102 : Engage the first interface mounting area 301 with the first engaging structure 201 , engage the component mounting area 302 with the second engaging structure 202 , and engage the second interface mounting area 303 with the third engaging structure 203 .

[0068] Align the first interface mounting area 301 with the first snap-fit ​​structure 201 and apply pressure lightly to snap it in place, ensuring that the component mounting area 302 is tightly combined with the second snap-fit ​​structure 202 to avoid gaps in subsequent processes. Similarly, snap the second interface mounting area 303 with the third snap-fit ​​structure 203 to ensure a firm connection.

[0069] Among them, reference Figure 4 , Figure 5 , the engagement of the component installation area 302 with the second engagement structure 202 includes:

[0070] S1201: Install the first mounting surface 3021 in the component mounting area 302 on the first bearing surface 2021 in the second locking structure 202; install the second mounting surface 3022 in the component mounting area 302 on the second bearing surface 2022 in the second locking structure 202; ensure that the first mounting surface 3021 is fully engaged with the first bearing surface 2021 and ensure that the second mounting surface 3022 is fully engaged with the second bearing surface 2022 by moving the upper shell 3.

[0071] The first mounting surface 3021 is used to mount the optical interface system and heat sink device in the optoelectronic component, and the second mounting surface 3022 is used to mount the circuit board in the optoelectronic component. Place the upper shell 3 above the component mounting area 302, ensure that it is aligned with the first bearing surface 2021 and the second bearing surface 2022 of the second engaging structure 202, and gently apply downward pressure to gradually contact the first mounting surface 3021 in the component mounting area 302 with the first bearing surface 2021 in the second engaging structure 202. Similarly, apply pressure to gradually contact the second mounting surface 3022 in the component mounting area 302 with the second bearing surface 2022 in the second engaging structure 202, and ensure that there are no impurities between the upper shell 3 and the lower mold base 2, and ensure that the two are completely fitted and there is no gap.

[0072] S103: Control the upper mold base 1 to move downward so that the upper mold base 1 and the lower mold base 2 are molded together.

[0073] Control the upper die base 1 to move downward to ensure that the upper die base 1 and the lower die base 2 are completely closed. When closing the mold, observe the uniformity of the mold closing to ensure that the contact surface of the upper and lower die bases 2 is flat. Ensure that the clamping structure of the upper die base 1 and the lower die base 2 is correctly docked to prevent deviation during subsequent extrusion.

[0074] Wherein, controlling the upper die base 1 to move downward so that the upper die base 1 and the lower die base 2 are molded together includes:

[0075] S1301: Set the mold closing time and mold closing pressure.

[0076] The appropriate mold closing time and mold closing pressure are determined according to the material of the upper shell 3. The pressure needs to be set according to the yield strength of the material of the upper shell 3 and the design of the mold to ensure effective forming without damaging the material, thereby improving the shaping effect.

[0077] Among them, in this implementation, the upper shell 3 is die-casted by zinc alloy. According to the material properties of the zinc alloy, the mold pressure can be set to 10-50 tons, and the mold time can be set to 10-30 seconds to ensure sufficient pressing.

[0078] S1302: Set the heating time and heating temperature.

[0079] The heating time can be set according to the heat conduction performance of the upper shell 3, the upper mold base 1 and the lower mold base 2 and the heating requirements of the materials used.

[0080] In this implementation, the upper shell 3 is die-casted from zinc alloy. According to the material properties of the zinc alloy, the heating time can be set to 30-60 seconds and the heating temperature to 150-250° C. to ensure that the mold reaches the optimal temperature.

[0081] Use the temperature control system to monitor the mold temperature to ensure uniform heating of the mold and avoid local overheating or overcooling.

[0082] S104: Extruding the outer surface through the fourth engaging structure 101 of the upper die base 1 .

[0083] The fourth engaging structure 101 of the upper die base 1 applies a uniform extrusion force to the outer surface of the upper shell 3. The extrusion force is adjusted according to the material properties, and the extrusion time and force can be reasonably set according to the fluidity and shaping requirements of the material to ensure that the upper shell 3 obtains the desired shape and size.

[0084] Among them, reference Figure 3 , extruding the outer surface through the fourth engaging structure 101 of the upper die base 1 includes:

[0085] S1041: Set the first extrusion surface 1011 on the upper die base 1 to be opposite to the first surface 304 of the outer surface; set the second extrusion surface 1012 on the upper die base 1 to be opposite to the second surface 305 of the outer surface; set the third extrusion surface 1013 on the upper die base 1 to be opposite to the third surface 306 of the outer surface.

[0086] When the upper die holder 1 and the lower die holder 2 are in mold closing, the first extrusion surface 1011 contacts the first surface 304, the second extrusion surface 1012 contacts the second surface 305, and the third extrusion surface 1013 contacts the third surface 306;

[0087] Wherein, the first surface 304 is the surface on the outer surface corresponding to the first interface installation area 301, the second surface 305 is the surface on the outer surface corresponding to the component installation area 302, and the third surface 306 is the groove surface on the second surface 305, which is used to attach product labels. Wherein, during the mold closing process, the upper mold base 1 is slowly moved downward by a mechanical device (such as a hydraulic cylinder or an electric drive) to gradually contact the lower mold base 2. During the contact process, the first extrusion surface 1011 of the upper mold base 1 is in contact with the first surface 304, the second extrusion surface 1012 is in contact with the second surface 305, and the third extrusion surface 1013 is in contact with the third surface 306, and the first surface 304, the second surface 305 and the third surface 306 are shaped at the same time. When all three groups of extrusion surfaces contact their corresponding outer surfaces, a closed mold state is formed. At this time, the space between the upper mold base 1 and the lower mold base 2 is fully compressed, so that in the subsequent molding process, the outer surface can be well molded and of stable quality. In this state, stable contact is formed between the first surface 304 and the first extrusion surface 1011 , between the second surface 305 and the second extrusion surface 1012 , and between the third surface 306 and the third extrusion surface 1013 , ensuring that the material can be evenly stressed during the heating or cooling process.

[0088] Wherein, in step S1041, the shaping mold includes an upper template and a lower template, and before the shaping step is performed, the following steps are performed:

[0089] S1041: Install the plurality of upper mold bases 1 on the upper mold plate.

[0090] Among them, a suitable number of upper mold bases 1 are set according to the length and width of the upper mold plate and various parameters on the shaping mold equipment. On the premise of meeting the shaping requirements of the upper shell 3, multiple upper shells 3 are shaped at one time to improve the shaping efficiency.

[0091] S1042: Install the plurality of lower mold bases 2 on the lower mold plate, and the centers of the plurality of lower mold bases 2 are in a straight line.

[0092] The lower mold bases 2 are arranged in a straight line so as to fully utilize the space on the lower mold plate.

[0093] S1043: Set the number of the upper die base 1 and the number of the lower die base 2 to be equal.

[0094] Among them, one upper die base 1 corresponds to one lower die base 2, and the positions of the upper die base 1 and the lower die base 2 are perpendicular to each other.

[0095] S1044: Connect the third engaging structures 203 on each of the lower mold bases 2 to form a plane.

[0096] Such an arrangement can reduce the manufacturing difficulty and cost of the upper die set and the lower die base 2 , while also not affecting the installation of the upper shell 3 on the lower die base 2 .

[0097] Similarly, each of the first extrusion surfaces 1011 can be connected to each other, and each of the second extrusion surfaces 1012 can be connected to each other. Such an arrangement can reduce the difficulty of processing the upper die holder 1, reduce the amount of cutting on the upper die holder 1, save materials, reduce costs, and does not affect the upper die holder 1 to shape the upper shell 3.

[0098] S105: heating the upper die base 1 and the lower die base 2 to release the stress of the upper shell 3 during the extrusion process.

[0099] During the extrusion process, the upper die base 1 and the lower die base 2 are heated by the mold heating system to ensure that the mold temperature reaches the required processing temperature. Heating can release the stress generated by the upper shell 3 during the extrusion process and reduce the risk of deformation or cracking.

[0100] Wherein, heating the upper die base 1 and the lower die base 2 includes:

[0101] S1051: Setting mounting holes on the upper die base 1 and the lower die base 2, and connecting the heating tubes to the mounting holes.

[0102] The heating tube is installed in the mounting hole, and the heating tube is made of a high-resistance alloy material with excellent resistance heating performance, such as nickel-chromium alloy or other suitable alloys. The heating tube contains a resistance wire inside. After power is turned on, the resistance wire generates heat and transfers it to the upper die base 1 and the lower die base 2 through the tube wall to release the stress of the upper shell 3 during the extrusion process. Furthermore, the material of the upper die base 1 and the lower die base 2 is copper. Copper can quickly transfer heat to the upper shell 3, speed up the time to release stress, and reduce the shaping time.

[0103] S106: Control the upper mold base 1 to move upward to remove the upper shell 3.

[0104] Control the upper die base 1 to move up slowly, gently release the mold pressure, separate the upper shell 3 from the mold, and pay attention to the mold separation process to avoid damage to the upper shell 3 when taking it out. Take the upper shell 3 that has been shaped out from the lower die base 2, measure the flatness of the outer surface, and check whether its appearance and size meet the preset flatness requirements. If any defects are found, record them in time and make adjustments.

[0105] If the flatness meets the preset flatness requirement, the upper shell 3 is judged to be a good product, and the upper shell 3 is taken out, and the shaping is completed.

[0106] If the flatness does not meet the preset flatness requirement, the upper shell 3 is placed on the lower die base 2 again and reshaped again.

[0107] If the flatness does not meet the set requirements, the upper shell 3 is placed on the lower die base 2 again, and the shaping is performed again, including:

[0108] S1061: Repeat the shaping operation. If the flatness of the outer surface of the upper shell 3 still does not meet the requirements, the upper shell 3 is judged to be a defective product.

[0109] Among them, in addition to directly using the mold for shaping, the shaping operation can also be performed by manual pre-processing before placing it in the shaping mold for shaping.

[0110] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be included in the scope of the claims and specification of the present invention. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A method for shaping an optical module housing, characterized in that: A shaping mold is used, the shaping mold comprising an upper mold base (1) and a lower mold base (2), the lower mold base (2) comprising a first clamping structure (201), a second clamping structure (202) and a third clamping structure (203), and the upper mold base (1) comprising a fourth clamping structure (101); the optical module housing comprises an upper housing (3), the upper housing (3) comprising an inner surface and an outer surface, the inner surface having a first interface installation area (301) for installing an adapter, a component installation area (302) for installing an optoelectronic component, and a second interface installation area (303) for accessing a switch electrical port; The shaping method comprises the following steps: Placing the upper shell (3) on the lower mold base (2); The first interface installation area (301) is engaged with the first engaging structure (201), the component installation area (302) is engaged with the second engaging structure (202), and the second interface installation area (303) is engaged with the third engaging structure (203); Controlling the upper die base (1) to move downward so that the upper die base (1) and the lower die base (2) can be molded together; Extruding the outer surface through a fourth engaging structure (101) of the upper die seat (1); The upper die base (1) and the lower die base (2) are heated to release the stress of the upper shell (3) during the extrusion process; The upper die base (1) is controlled to move upward, and the upper shell (3) is taken out.

2. The method according to claim 1, characterized in that The engagement of the component installation area (302) with the second engagement structure (202) comprises: Mounting the first mounting surface (3021) in the component mounting area (302) on the first bearing surface (2021) in the second clamping structure (202); Installing the second mounting surface (3022) in the component mounting area (302) on the second bearing surface (2022) in the second clamping structure (202); By moving the upper shell (3), ensuring that the first mounting surface (3021) is completely engaged with the first bearing surface (2021), and ensuring that the second mounting surface (3022) is completely engaged with the second bearing surface (2022); The first mounting surface (3021) is used to mount the optical interface system and the heat sink device in the optoelectronic component, and the second mounting surface (3022) is used to mount the circuit mainboard in the optoelectronic component.

3. The method according to claim 1, characterized in that Extruding the outer surface through the fourth engaging structure (101) of the upper die seat (1) comprises: A first extrusion surface (1011) on the upper die seat (1) is arranged to be opposite to the first surface (304) of the outer surface; The second extrusion surface (1012) on the upper die seat (1) is arranged to be opposite to the second surface (305) of the outer surface; The third extrusion surface (1013) on the upper die seat (1) is arranged to be opposite to the third surface (306) of the outer surface; When the upper die base (1) and the lower die base (2) are closed, the first extrusion surface (1011) contacts the first surface (304), the second extrusion surface (1012) contacts the second surface (305), and the third extrusion surface (1013) contacts the third surface (306); Among them, the first surface (304) is the surface on the outer surface corresponding to the first interface installation area (301), the second surface (305) is the surface on the outer surface corresponding to the component installation area (302), and the third surface (306) is a groove surface on the second surface (305) for attaching a product label.

4. The method according to claim 1, characterized in that: Placing the upper shell (3) on the lower mold base (2) comprises: Fitting the frame of the upper shell (3) to the first reference surface (204) on the lower mold base (2); The first reference plane (204) is a planar structure surrounding the first locking structure (201) and the second locking structure (202), and the first frame (309) is provided with screw holes, and the lower shell and the upper shell (3) in the optical module shell are fixed by screws arranged in the screw holes.

5. The method according to claim 1, characterized in that The heating of the upper die base (1) and the lower die base (2) comprises: Mounting holes are provided on the upper die base (1) and the lower die base (2), and the heating tubes are connected to the mounting holes.

6. The method according to claim 1, characterized in that The controlling the upper die base (1) to move downward so that the upper die base (1) and the lower die base (2) are molded together comprises: Set the mold closing time and mold closing pressure; Set the heating time and heating temperature.

7. The method according to claim 1, characterized in that The controlling the upper die seat (1) to move upward to remove the upper shell (3) comprises: measuring the flatness of the outer surface; If the flatness meets the preset flatness requirement, the upper shell (3) is judged to be a good product, and the upper shell (3) is taken out, and the shaping is completed; If the flatness does not meet the preset flatness requirement, the upper shell (3) is placed on the lower die base (2) again and reshaped.

8. The method according to claim 7, characterized in that If the flatness does not meet the set requirements, the upper shell (3) is placed on the lower mold base (2) again, and the shaping is performed again, including: The shaping operation is repeated, and if the flatness of the outer surface of the upper shell (3) still does not meet the requirements, the upper shell (3) is judged to be a defective product.

9. The method according to claim 3, characterized in that: The shaping mold comprises an upper mold plate and a lower mold plate; Installing a plurality of upper mold bases (1) on the upper mold plate; Installing a plurality of the lower die seats (2) on the lower die plate, with the centers of the plurality of the lower die seats (2) being on a straight line; The number of the upper die bases (1) and the number of the lower die bases (2) are equal; The third engaging structures (203) on each of the lower mold bases (2) are connected to each other to form a plane.

10. The method according to claim 1, characterized in that The upper die base (1) and the lower die base (2) are made of copper.

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