UV curing light source apparatus, UV curing apparatus, and light intensity real-time measurement method

Abstract

The application provides a UV curing light source device, a UV curing device and a light intensity real-time measuring method. The UV curing light source device comprises a light emitting assembly and a power supply controller. The light emitting assembly comprises a lamp tube, an optical probe and a light detection plate. The optical probe comprises a high-temperature area acquisition unit, a low-temperature area acquisition unit and a transmission medium; the high-temperature area acquisition unit is fixed on the light emitting area of the lamp tube and acquires signals of required spectral bands emitted by the lamp tube; the transmission medium transmits the signals acquired by the high-temperature area acquisition unit to the low-temperature area acquisition unit; the low-temperature area acquisition unit is circuit-integrated with the light detection plate; the light detection plate feeds back the light intensity value obtained by the low-temperature area acquisition unit to the power supply controller. The power supply controller displays and monitors the light intensity value fed back by the light detection plate in real time, and when the light intensity value is lower than a preset value, the output power of the power supply is adjusted in real feedback to adjust the light intensity of the light emitting assembly.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment manufacturing, and in particular to an ultraviolet curing apparatus. Background Technology

[0002] With the continuous advancement of semiconductor process technology, when semiconductor devices are shrunk to the deep submicron range, low-dielectric materials are needed to reduce the RC delay time caused by parasitic capacitance. Currently, the formation process of low-dielectric materials is usually achieved by ultraviolet (UV) curing.

[0003] Industrial ultraviolet light wavelengths range from 200nm to 450nm. The process of using ultraviolet light to irradiate curable materials to harden them is called UV curing. UV curing requires UV curing equipment, but the light intensity of UV curing equipment fluctuates. Currently, there is no equipment or solution that can stably measure light intensity or measure it in real time. When unstable process results occur, they cannot be predicted in advance, resulting in a large amount of wasted wafers and time.

[0004] The aforementioned technical issues can be broken down into the following three questions:

[0005] First, when UV curing equipment is performing the process, the light intensity cannot be measured in real time. The intensity of the reflected light can only be measured from the side, but this light intensity does not directly affect the silicon wafer.

[0006] Secondly, during measurement, the rotation of the two reflective elements intermittently blocks the probe, causing the measured light intensity to be intermittent and making it impossible to effectively determine whether it is usable.

[0007] Furthermore, existing equipment cannot automatically adjust the power of the measured light; it requires manual modification. This approach suffers from slow response and wastes human resources. Summary of the Invention

[0008] In order to overcome the above-mentioned technical problems in the prior art, the present invention provides a UV curing light source device, a UV curing device, and a method for real-time measurement of light intensity.

[0009] This invention provides a UV curing light source device, including a light-emitting component and a power controller.

[0010] The light-emitting components include lamp tubes, optical probes, and light detection boards.

[0011] The optical probe includes a high-temperature acquisition unit, a low-temperature acquisition unit, and a transmission medium; the high-temperature acquisition unit is fixed in the light-emitting area of ​​the lamp tube and acquires the signal of the required spectral band emitted by the lamp tube; the transmission medium transmits the signal acquired by the high-temperature acquisition unit to the low-temperature acquisition unit; the low-temperature acquisition unit is integrated with the light detection board circuit; the light detection board feeds back the light intensity value obtained by the low-temperature acquisition unit to the power controller.

[0012] The power controller displays and monitors the light intensity value fed back by the light detection board in real time. When the light intensity value is lower than a preset value, it automatically adjusts the output power of the power supply to adjust the light intensity of the light-emitting component.

[0013] In one embodiment, the high-temperature zone acquisition unit is an optical fiber probe, the low-temperature zone acquisition unit is a photoelectric sensor, and the transmission medium is an optical fiber.

[0014] In one embodiment, the light-emitting component further includes a microwave cavity within the light-emitting area, and the fiber optic probe is mounted on a probe mounting hole in the microwave cavity, the fiber optic probe directly receiving the direct light emitted by the lamp tube.

[0015] In one embodiment, the probe mounting hole is a specially designed mounting hole on the microwave cavity.

[0016] In one embodiment, the probe mounting hole utilizes one of a plurality of existing heat dissipation holes on the microwave cavity as the mounting hole.

[0017] In one embodiment, the optical fiber transmits the optical signal collected by the optical fiber probe to the photoelectric sensor, which converts the optical signal into an electrical signal to obtain the light intensity value and sends it to the light detection board.

[0018] In one embodiment, a reflecting device is further included, the reflecting device comprising:

[0019] A first reflection module is used to reflect a portion of the light emitted by the lamp tube in the desired spectral range; and

[0020] The second reflective module has an upper surface with a finely polished coating area for reflecting the direct light from the lamp tube and the reflected light from the first reflective module, so as to converge the direct light and the reflected light into a certain range.

[0021] In one embodiment, the probe mounting hole of the fiber optic probe is located within the light-emitting area, outside the first reflective module, and above the second reflective module, and the position of the probe mounting hole is set to align with the range so as to receive all the light within the range.

[0022] In one embodiment, the upper surface of the second reflection module has a finely polished coating area for screening out the desired spectral band.

[0023] In one embodiment, the first reflective module is arc-shaped and has a coating layer on the side facing the lamp tube.

[0024] In one embodiment, the desired spectral range is ultraviolet light.

[0025] In one embodiment, when the desired spectral band is not ultraviolet light, the intensity value of ultraviolet light is calculated based on the intensity value measured by the light-emitting component.

[0026] The present invention also provides a UV curing device, including the UV curing light source device as described above.

[0027] The present invention also provides a method for real-time measurement of light intensity in a UV curing light source device as described above.

[0028] The real-time light intensity measurement method includes:

[0029] Set a preset value to the light intensity value of the required spectral band corresponding to the process operation.

[0030] The optical probe is used to collect light signals in the required spectral range, and the light intensity value of the light-emitting component is obtained.

[0031] The light intensity value is fed back to the power controller for real-time display and monitoring.

[0032] Determine whether the light intensity value is lower than the preset value;

[0033] When the light intensity value is lower than the preset value, the power controller adjusts the output power of the power supply to adjust the light intensity value of the light-emitting component;

[0034] When the output power of the power controller is adjusted to the maximum value, but the light intensity value is still lower than the preset value, a prompt will be made to replace the consumable parts.

[0035] The technical solution of the present invention has the following technical effects:

[0036] Firstly, the optical probe of this invention is designed as a split unit, comprising two parts: a high-temperature acquisition unit (a fiber optic probe in the high-temperature zone) and a low-temperature acquisition unit (a photoelectric sensor in the low-temperature zone). This is because the light-emitting area around the lamp tube typically has a high temperature, for example, ≥100℃. Meanwhile, the light processing area, such as the light detection board, is in a low-temperature zone, for example, around 47℃. Therefore, this invention uses a high-temperature resistant fiber optic probe and optical fiber as the devices for receiving and transmitting light, transmitting the light signal to the low-temperature zone for photoelectric conversion and light intensity detection. Compared to the traditional method of using a photoelectric sensor only in the low-temperature zone to receive the light signal, this invention can measure the light intensity directly acting on the silicon wafer at the high-temperature zone of the lamp tube, thus resulting in more accurate light intensity measurement.

[0037] Secondly, traditional external light intensity measurement devices can only measure from the side. During measurement, the rotation of the reflector intermittently blocks the probe, resulting in discontinuous light intensity measurements that cannot effectively determine whether the light is sufficient. The fiber optic probe of this invention can be fixed inside the light-emitting component, and the optical probe rotates with the lamp head (lamp tube). Therefore, the measured light intensity is continuous and real-time.

[0038] Thirdly, this invention integrates the photoelectric converter of the optical probe adapted to the low temperature zone with the circuit board (e.g., the light detection board) inside the lamp head. It converts the light signal into an electrical signal and transmits the electrical signal to the power controller through the circuit board, thus optimizing the spatial structure and saving costs.

[0039] Fourth, since light intensity is the core parameter of the UV curing process, this invention can change the chip film preparation method from controlling power to controlling light intensity.

[0040] Fifth, the optical probe is installed in the UV curing light source equipment and is powered and controlled by the power controller to achieve self-feedback control of the light intensity on the equipment power, which can ensure the stability of the light source energy of the curing equipment. Attached Figure Description

[0041] The above-described invention and the following detailed description will be better understood when read in conjunction with the accompanying drawings. It should be noted that the drawings are merely examples of the claimed invention. In the drawings, the same reference numerals represent the same or similar elements.

[0042] Figure 1 A schematic diagram of a UV curing light source device according to an embodiment of the present invention is shown;

[0043] Figure 2 Show Figure 1 The location of the probe mounting hole on the microwave cavity;

[0044] Figure 3A schematic diagram of a UV curing light source device according to an embodiment of the present invention is shown;

[0045] Figure 4 The mounting hole positions of the fiber optic probe according to an embodiment of the present invention are shown;

[0046] Figure 5 A top view of a second reflection module according to an embodiment of the present invention is shown;

[0047] Figure 6 The finely polished coating areas on both sides of the reflection area of ​​the second reflection module according to an embodiment of the present invention are shown.

[0048] Figure 7 A schematic diagram of a UV curing light source device according to an embodiment of the present invention is shown;

[0049] Figure 8 A flowchart illustrating a real-time light intensity measurement method according to an embodiment of the present invention is shown. Detailed Implementation

[0050] The following detailed description of the features and advantages of the present invention provides sufficient information for any person skilled in the art to understand and implement the invention. Furthermore, based on the specification, claims, and drawings disclosed herein, those skilled in the art can easily understand the related objectives and advantages of the invention. Although the description of the invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may arise based on the claims of the invention. To provide a thorough understanding of the invention, numerous specific details will be included in the following description. The invention may also be implemented without using these details. Moreover, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0051] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0052] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0053] It is understood that while terms such as "first," "second," and "third" may be used herein to describe various components, channels, assemblies, regions, layers, and / or parts, these components, channels, assemblies, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, channels, assemblies, regions, layers, and / or parts. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0054] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" are not specifically singular and may include plural forms. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0055] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of scope in some embodiments of this application are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0056] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0057] Figure 1 A schematic diagram of a UV curing light source device according to an embodiment of the present invention is shown. The UV curing light source device includes a power controller (not shown) and a light-emitting component. Furthermore, the UV curing light source device also includes a reflective device.

[0058] The light-emitting components include a lamp tube 101, an optical probe, a microwave cavity 102, and a light detection plate 103.

[0059] The power controller provides power to the light-emitting components (the optical probe is also powered by the power controller), displays and monitors the light intensity value obtained by the light detection board in real time, and adjusts the output power of the power supply in a self-feedback manner when the light intensity value is lower than the preset value, so as to adjust the light intensity of the light-emitting components.

[0060] Lamp 101 is used to provide a light source. The light source includes visible light, infrared light, and / or ultraviolet light, etc.

[0061] In one embodiment, lamp 101 emits ultraviolet light.

[0062] The optical probe is used to collect the light signal of the desired spectral range emitted by the lamp tube 101 and convert the light signal into an electrical signal. The optical probe is fixed inside the light-emitting component, so that the optical probe rotates together with the light-emitting component.

[0063] In one embodiment, the desired spectral range is ultraviolet light. Of course, the optical probe of this invention can also collect non-ultraviolet light, such as infrared light, and then the ultraviolet light intensity can be calculated based on the ratio between the intensity of the infrared light and the ultraviolet light. Therefore, although the following description uses ultraviolet light measurement as an example, those skilled in the art should understand that the UV curing light source device, UV curing device, and real-time light intensity measurement method of this invention can also be applied to the light intensity measurement of other light besides ultraviolet light, and the final ultraviolet light intensity can be calculated by the ratio between its intensity and the ultraviolet light intensity.

[0064] The microwave cavity 102 is a sheet metal structure capable of conducting microwaves. It transmits the microwaves emitted by the magnetron to the location of the lamp tube, causing resonance. It is designed with heat dissipation holes, such as... Figure 2 As shown.

[0065] The light detection board 103 is connected to the power controller of the UV curing light source equipment. The light detection board 103 is used to feed back the light intensity value of the desired spectral band (e.g., ultraviolet light) measured by the optical probe to the power controller, which then displays and monitors the value in real time. When the detected light intensity value is lower than a preset value, the power controller automatically adjusts the output power of the power supply (e.g., increases the output power) to further adjust the light intensity of the light-emitting component.

[0066] The optical probe includes a high-temperature acquisition unit 104, a low-temperature acquisition unit 106, and a transmission medium 105. The low-temperature acquisition unit 106 is located in the light processing area 109 of the light-emitting component and is integrated with the circuit board of the light detection board 103. The high-temperature acquisition unit 104 is fixed to the light-emitting area 108 of the lamp tube 101 and rotates with the lamp tube. The transmission medium 105 transmits the signal acquired by the high-temperature acquisition unit 104 to the low-temperature acquisition unit 106.

[0067] In one embodiment, the high-temperature zone acquisition unit 104 is an optical fiber probe.

[0068] In one embodiment, the transmission medium 105 is an optical fiber.

[0069] In one embodiment, the low-temperature zone acquisition unit 106 is a photoelectric sensor.

[0070] In one embodiment, the fiber optic probe 104 can directly receive the direct light emitted by the lamp tube 101 and transmit the optical signal to the photoelectric sensor 106 through the optical fiber 105.

[0071] In one embodiment, the fiber optic probe 104 is mounted on the probe mounting hole 107 on the microwave cavity 102.

[0072] In one embodiment, the probe mounting hole 107 can be as follows: Figure 2 The mounting hole 107 shown is specially made on the microwave cavity 102.

[0073] In one embodiment, the probe mounting hole 107 can utilize one of the multiple heat dissipation holes of the existing microwave cavity 102 as the mounting hole.

[0074] In one embodiment, the optical fiber 105 transmits the optical signal of the desired spectral band (e.g., ultraviolet light) collected by the optical fiber probe 104 to the photoelectric sensor 106. The photoelectric sensor 106 converts the optical signal into an electrical signal, obtains the light intensity value, and sends it to the light detection board 103. The light detection board 103 is integrated with the light sensor 106 and feeds back the light intensity value to the power controller in real time.

[0075] The technical effects of the above structure are as follows:

[0076] Firstly, the optical probe of this invention is designed as a split unit, comprising two parts: a high-temperature acquisition unit (a fiber optic probe in the high-temperature zone) and a low-temperature acquisition unit (a photoelectric sensor in the low-temperature zone). This is because the light-emitting area 108 around the lamp tube typically has a high temperature, for example, ≥100℃. The light processing area 109, such as the light detection board, is in a low-temperature zone, for example, around 47℃. Therefore, this invention uses a high-temperature resistant fiber optic probe and optical fiber as the devices for receiving and transmitting light, transmitting the light signal to the low-temperature zone for photoelectric conversion and light intensity detection. Compared to the traditional method of using only a photoelectric sensor to collect ultraviolet light signals, this invention can measure the light signal directly acting on the silicon wafer at the high-temperature zone of the lamp tube, thus resulting in more accurate light intensity measurement.

[0077] Secondly, traditional external light intensity measurement devices can only measure from the side. During measurement, the rotation of the reflector intermittently blocks the probe, resulting in discontinuous light intensity measurements that cannot effectively determine whether the light is sufficient. The fiber optic probe of this invention can be fixed inside the light-emitting component, and the optical probe rotates with the lamp head (lamp tube). Therefore, the measured light intensity is continuous and real-time.

[0078] Thirdly, this invention integrates the photoelectric converter of the optical probe adapted to the low temperature zone with the circuit board (e.g., the light detection board) inside the lamp head. It converts the light signal into an electrical signal and transmits the electrical signal to the power controller through the circuit board, thus optimizing the spatial structure and saving costs.

[0079] Fourth, since light intensity is the core parameter of the UV curing process, this invention can change the chip film preparation method from controlling power to controlling light intensity.

[0080] Fifth, the optical probe is installed in the UV curing light source equipment and is powered and controlled by the power controller to achieve self-feedback control of the light intensity on the equipment power, which can ensure the stability of the light source energy of the curing equipment.

[0081] Figure 3 A schematic diagram of a UV curing light source device according to an embodiment of the present invention is shown. The UV curing light source device includes a power controller (not shown), a light-emitting component, and a reflective device.

[0082] The light-emitting components include a lamp tube 301, an optical probe, a microwave cavity, and a light detection plate 303.

[0083] The power controller provides power to the light-emitting components (the optical probe is also powered by the power controller), displays and monitors the light intensity value fed back by the light detection board in real time, and adjusts the output power of the power supply in a self-feedback manner when the light intensity value is lower than the preset value, so as to adjust the light intensity of the light-emitting components.

[0084] Lamp 301 is used to provide a light source. The light source includes visible light, infrared light, and / or ultraviolet light, etc.

[0085] In one embodiment, lamp 301 emits ultraviolet light.

[0086] The optical probe is used to collect the light signal of the desired spectral range emitted by the lamp tube 301 and convert the light signal into an electrical signal. The optical probe is fixed inside the light-emitting component, so that the optical probe rotates together with the light-emitting component.

[0087] In one embodiment, the desired spectral range is ultraviolet light. Of course, the optical probe of this invention can also collect non-ultraviolet light, such as infrared light, and then the ultraviolet light intensity can be calculated based on the ratio between the intensity of the infrared light and the ultraviolet light. Therefore, although the following description uses ultraviolet light measurement as an example, those skilled in the art should understand that the UV curing light source device, UV curing device, and real-time light intensity measurement method of this invention can also be applied to the light intensity measurement of other light besides ultraviolet light, and the final ultraviolet light intensity can be calculated by the ratio between its intensity and the ultraviolet light intensity.

[0088] A microwave cavity is a sheet metal structure that can conduct microwaves. It conducts the microwaves emitted by the magnetron to the location of the lamp tube to resonate, and it is designed with heat dissipation holes.

[0089] The light detection board 303 is connected to the power controller of the UV curing light source equipment. The light detection board 303 is used to feed back the light intensity value of the required spectral band (e.g., ultraviolet light) measured by the optical probe to the power controller, which then displays and monitors the value in real time. When the detected light intensity value is lower than a preset value, the power controller automatically adjusts the output power of the power supply (e.g., increases the output power) to further adjust the light intensity of the light-emitting component.

[0090] The optical probe includes a high-temperature acquisition unit 304, a low-temperature acquisition unit 306, and a transmission medium 305. The low-temperature acquisition unit 306 is located in the light processing area of ​​the light-emitting component and is integrated with the circuit board of the light detection board 303. The high-temperature acquisition unit 304 is fixed to the light-emitting area of ​​the lamp tube 301 and rotates with the lamp tube. The transmission medium 305 transmits the signal acquired by the high-temperature acquisition unit 304 to the low-temperature acquisition unit 306.

[0091] In one embodiment, the high-temperature zone acquisition unit 304 is an optical fiber probe.

[0092] In one embodiment, the transmission medium 305 is an optical fiber.

[0093] In one embodiment, the low-temperature zone acquisition unit 306 is a photoelectric sensor.

[0094] In one embodiment, the optical fiber 305 transmits the optical signal of the desired spectral band (e.g., ultraviolet light) collected by the optical fiber probe 304 to the photoelectric sensor 306. The photoelectric sensor 306 converts the optical signal into an electrical signal, obtains the light intensity value, and sends it to the light detection board 303. The light detection board 303 is integrated with the light sensor 106 and feeds back the light intensity value to the power controller in real time.

[0095] The reflection device includes a first reflection module 308 and a second reflection module 302.

[0096] The first reflection module 308 is used to reflect a portion of the light emitted by the lamp tube in the desired spectral range (e.g., ultraviolet light).

[0097] In one embodiment, the first reflective module 308 is arc-shaped and has a coating layer on the side facing the lamp tube. This coating layer is a special reflective film used to filter out light of non-desired spectral ranges and obtain reflected light 310 of the desired spectral range.

[0098] It is important to understand that the light emitted by lamp tube 301 consists of two parts: direct light 309 emitted directly from the lamp tube and reflected light 310 reflected after hitting the first reflection module 308. Due to the presence of a special reflective film on the first reflection module, the direct light 309 and the reflected light 310 differ in their spectra.

[0099] The second reflection module 302 generally reflects light beyond the wafer area back into the wafer area. Specifically, the second reflection module 302 has an upper surface with a finely polished coating area to filter out light of the desired spectral range. This finely polished coating area is used to reflect the direct light 309 from the lamp tube and the reflected light 310 from the first reflection module 308, so as to converge the direct light 309 and the reflected light 310 into a single area.

[0100] The probe mounting hole of the fiber optic probe 304 is located in the light-emitting area of ​​the lamp tube 301, outside the first reflection module 308, and above the second reflection module 302. The position of the probe mounting hole 307 is aligned with the range so that the fiber optic probe 304 can receive all the light within the range.

[0101] Figure 4 The mounting hole locations of an optical fiber probe according to an embodiment of the present invention are shown. Different from... Figure 1 As shown, in this embodiment, the fiber optic probe 304 is disposed outside the first reflection module and above the second reflection module. Specifically, the mounting hole 307 of the fiber optic probe is positioned to receive all the light reflected and focused by the finely polished coating area of ​​the second reflection module.

[0102] It should be understood that the light intensity detected in this embodiment includes both direct light emitted from the lamp and reflected light; therefore, the light intensity value is greater than [the specified value]. Figure 1 The light intensity value of the embodiment shown ( Figure 1 The embodiment shown is a direct light intensity value.

[0103] Figure 5 A top view of a second reflective module according to an embodiment of the present invention is shown. Figure 5 As shown, the second reflection module 302 has reflection areas 501 on both sides. The area of ​​the reflection area 501 is large enough to receive both direct light 309 and reflected light 310. After the direct light 309 and reflected light 310 illuminate the reflection area, they are reflected and converged towards the direction of the fiber optic probe mounting hole 307.

[0104] Figure 6 The diagram shows the polished coating areas 501 on both sides of the second reflective module according to an embodiment of the present invention. The upper surface of the reflective area has a polished coating area 601, the coating being used to filter out specific wavelengths of light to effectively reflect light of the desired spectral range (e.g., ultraviolet light).

[0105] The technical effects of the above structure are as follows:

[0106] Firstly, the optical probe of this invention is designed as a split type, comprising a fiber optic probe in a high-temperature zone and a photoelectric sensor in a low-temperature zone. This is because the light-emitting area 108 around the lamp tube typically has a high temperature, for example, ≥100℃. The light processing area 109, such as the light detection board, is in a low-temperature zone, for example, around 47℃. Therefore, this invention uses a high-temperature resistant fiber optic probe and optical fiber as the devices for receiving and transmitting light, transmitting the light signal to the low-temperature zone for photoelectric conversion and light intensity detection. Compared to the traditional method of using a photoelectric sensor only in the low-temperature zone to receive the light signal, this invention can measure the light intensity directly acting on the silicon wafer in the high-temperature zone of the lamp tube, thus resulting in more accurate light intensity measurement.

[0107] Secondly, traditional external light intensity measurement devices can only measure from the side. During measurement, the rotation of the reflector intermittently blocks the probe, resulting in discontinuous light intensity measurements that cannot effectively determine whether the light is sufficient. The fiber optic probe of this invention can be fixed inside the light-emitting component, and the optical probe rotates along with the second reflective module. Therefore, the measured light intensity is continuous and real-time.

[0108] Thirdly, this invention integrates the photoelectric converter of the optical probe adapted to the low temperature zone with the circuit board (e.g., the light detection board) inside the lamp head. It converts the light signal into an electrical signal and transmits the electrical signal to the power controller through the circuit board, thus optimizing the spatial structure and saving costs.

[0109] Fourth, since light intensity is the core parameter of the UV curing process, this invention can change the chip film preparation method from controlling power to controlling light intensity.

[0110] Fifth, the optical probe is installed in the UV curing light source equipment and is powered and controlled by the power controller to achieve self-feedback control of the light intensity on the equipment power, which can ensure the stability of the light source energy of the curing equipment.

[0111] Sixth, compared to the present invention Figure 1 The fiber optic probe only measures the direct light from the lamp. Figure 3 The illustrated embodiment is capable of detecting both direct and reflected light emitted from the light source, and the measured light intensity value is greater than [missing value]. Figure 1 The measured light intensity value was also higher than Figure 1 The measured light intensity values ​​are more accurate.

[0112] Figure 7 A schematic diagram of a UV curing light source device according to an embodiment of the present invention is shown. The UV curing light source device includes a power controller 701, a light-emitting component 702, and a reflective device 703.

[0113] The light intensity signal of the light-emitting component 702 can be displayed and monitored by the power controller 701. The power controller 701 has a control unit. The detected light intensity signal is fed back to the control unit, where the power controller displays the signal and adjusts the light intensity of the light-emitting component. Specifically, when the detected light intensity value is lower than a preset value, the power controller automatically increases the output power of the power supply to further increase the light intensity of the light-emitting component.

[0114] The present invention also provides a UV curing device, including the UV curing light source device as described above.

[0115] Figure 8 A flowchart illustrating a real-time light intensity measurement method according to an embodiment of the present invention is shown. The method includes the following steps:

[0116] Step 801: Set the light intensity value of the required spectral band (e.g., ultraviolet light) corresponding to the process operation to the preset value.

[0117] Step 802: Perform the process run, i.e., produce the chip.

[0118] Step 803: Determine whether the light intensity value of the light-emitting component is lower than the preset value. If yes (e.g., light-emitting component attenuation occurs), proceed to step 804; otherwise, the process result is stable.

[0119] Step 804: The power controller automatically adjusts the output power of the power supply to further increase the light intensity of the light-emitting components.

[0120] Step 805: Display and record the light intensity value and part replacement prompts via the display screen (or GUI).

[0121] Step 806: The power controller increases the output power until the output power is 100%. If the light intensity is still less than the preset value, then proceed to step 807.

[0122] Step 807: Replace consumable parts.

[0123] Those skilled in the art will understand that the various illustrative components, modules, blocks, units, circuits, systems, and steps described in conjunction with the embodiments disclosed herein can be implemented in hardware, software (including firmware, resident software, microcode, etc.), or a combination of both. To clearly illustrate this interchangeability between hardware and software, the various illustrative components, modules, blocks, units, circuits, systems, and steps described above are generalized in their functional form. Whether such functionality is implemented in hardware or software depends on the specific application and the design constraints imposed on the overall system. Those skilled in the art may implement the described functionality in different ways for each specific application, but such implementation decisions should not be construed as departing from the scope of the invention.

[0124] This application uses flowcharts to illustrate the operations or steps performed by a system according to embodiments of this application. It should be understood that the preceding or following operations or steps are not necessarily performed in exact order. Instead, various operations or steps can be processed in reverse order or simultaneously. Furthermore, other operations or steps may be added to these processes, or one or more operations or steps may be removed from these processes.

[0125] Unless expressly stated in the claims, the order of processing elements and sequences, the use of numbers and letters, or the use of other names described in this application are not intended to limit the order of the processes and methods of this application.

[0126] Furthermore, aspects of this application may be manifested as a computer product located on one or more computer-readable media, the product including computer-readable program code.

[0127] A computer-readable signal medium may contain a propagated data signal containing computer program encoding, for example, on baseband or as part of a carrier wave. This propagated signal may take various forms, including electromagnetic, optical, and so on, or suitable combinations thereof. A computer-readable signal medium can be any computer-readable medium other than a computer-readable storage medium, which can be connected to an instruction execution system, apparatus, or device to enable communication, propagation, or transmission of a program for use. The program encoding located on the computer-readable signal medium can be propagated through any suitable medium, including radio, cable, fiber optic cable, RF, or similar media, or any combination of the above media.

[0128] The computer program code required for the operation of each part of this application can be written in any one or more programming languages, including object-oriented programming languages ​​such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.NET, Python, etc., conventional procedural programming languages ​​such as C, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages ​​such as Python, Ruby, and Groovy, or other programming languages. This program code can run entirely on the user's computer, or as a standalone software package on the user's computer, or partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the latter case, the remote computer can be connected to the user's computer through any network, such as a local area network (LAN) or wide area network (WAN), or connected to an external computer (e.g., via the Internet), or in a cloud computing environment, or used as a service such as Software as a Service (SaaS).

[0129] Those skilled in the art will understand that information, signals, and data can be represented using any of a variety of different techniques and arts. For example, the data, instructions, commands, information, signals, bits, symbols, and chips described throughout the above description can be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, light fields or optical particles, or any combination thereof.

[0130] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of both. The software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor so that the processor can read and write information to / from the storage medium. In an alternative, the storage medium may be integrated into the processor. In an alternative, the processor and storage medium may reside as discrete components in the user terminal.

[0131] In one or more exemplary embodiments, the described functionality may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software as a computer program product, the functionality may be stored or transmitted as one or more instructions or code on or through a computer-readable medium. A computer-readable medium includes both computer storage media and communication media, encompassing any medium that facilitates the transfer of a computer program from one location to another. A storage medium may be any available medium accessible to a computer. By way of example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disc storage, disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and is accessible to a computer. Any connection is also legitimately referred to as a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of a medium. As used in this article, disk and disc include compact discs (CDs), laser discs, optical discs, digital multi-purpose discs (DVDs), floppy disks, and Blu-ray discs. Disks typically reproduce data magnetically, while discs reproduce data optically using lasers. Combinations of these should also be included within the scope of computer-readable media.

[0132] The terminology and expressions used above are for descriptive purposes only, and the invention should not be limited to these terms and expressions. The use of these terms and expressions does not mean excluding any illustrative and descriptive equivalent features (or parts thereof), and it should be recognized that various modifications that may exist should also be included within the scope of the claims. Other modifications, variations, and substitutions may also exist. Accordingly, the claims should be considered to cover all such equivalents.

[0133] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the present application requires more features than those mentioned in the claims.

[0134] Similarly, it should be noted that although the present invention has been described with reference to the specific embodiments described above, those skilled in the art should recognize that the above embodiments are only used to illustrate the present invention, and various equivalent changes or substitutions can be made without departing from the spirit of the present invention. Therefore, any changes or modifications to the above embodiments within the scope of the essential spirit of the present invention will fall within the scope of the claims of this application.

Claims

1. A UV curing light source apparatus, characterized by, The light-emitting assembly and the power supply controller are included. The light-emitting assembly includes a lamp tube, an optical probe and a light detection board. The optical probe includes a high-temperature area collection unit, a low-temperature area collection unit and a transmission medium. The high-temperature area collection unit is fixed on the light-emitting area of the lamp tube to collect signals of a required spectrum band emitted by the lamp tube. The transmission medium transmits the signals collected by the high-temperature area collection unit to the low-temperature area collection unit.

2. The UV curing light source apparatus of claim 1, wherein, The low-temperature area collection unit is circuit-integrated with the light detection board.

3. The UV curing light source apparatus of claim 2, wherein, The light detection board feeds back light intensity values obtained by the low-temperature area collection unit to the power supply controller.

4. The UV curing light source apparatus of claim 3, wherein, The power supply controller displays and monitors the light intensity values fed back by the light detection board in real time.

5. The UV curing light source apparatus of claim 3, wherein, When the light intensity values are lower than a preset value, the power supply controller adjusts the output power of the power supply to adjust the light intensity of the light-emitting assembly.

6. The UV curing light source apparatus of claim 2, wherein, The high-temperature area collection unit is an optical fiber probe, the low-temperature area collection unit is a photoelectric sensor, and the transmission medium is an optical fiber.

7. The UV curing light source apparatus of claim 2, wherein, The light-emitting assembly further includes a microwave cavity in the light-emitting area. The optical fiber probe is installed on a probe mounting hole on the microwave cavity to directly receive direct light emitted by the lamp tube. The probe mounting hole is a mounting hole specially formed on the microwave cavity.

8. The UV curing light source apparatus of claim 7, wherein, The probe mounting hole uses one of a plurality of existing heat dissipation holes on the microwave cavity as the mounting hole.

9. The UV curing light source apparatus of claim 7, wherein, The optical fiber transmits the optical signals collected by the optical fiber probe to the photoelectric sensor.

10. The UV curing light source apparatus of claim 7, wherein, The reflection device includes:

11. The UV curing light source apparatus of claim 1, wherein, A first reflection module for reflecting part of the light of the required spectrum band emitted by the lamp tube; and 12. The UV curing light source apparatus of claim 1, wherein, A second reflection module having an upper surface with a precision polishing and plating film area for reflecting the direct light of the lamp tube and the reflected light from the first reflection module to converge the direct light and the reflected light into a range. The probe mounting hole of the optical fiber probe is located outside the first reflection module and above the second reflection module in the light-emitting area, and the position of the probe mounting hole is set to align with the range so as to receive all the light in the range.

14. A light intensity real-time measurement method for the UV curing light source apparatus according to any one of claims 1 to 12, characterized by, The upper surface of the second reflection module has a precision polishing and plating film area for screening the required spectrum band. The first reflection module is arc-shaped and has a plating layer on one side facing the lamp tube. The required spectrum band is ultraviolet light. When the required spectrum band is not ultraviolet light, the light intensity value of the ultraviolet light is calculated according to the light intensity value measured by the light-emitting assembly.

13. A UV curing device including the UV curing light source device according to any one of claims 1 to 12. The method includes: Setting the light intensity value of the process operation corresponding to the required spectrum band as a preset value; Collecting optical signals of the required spectrum band by using the optical probe to obtain the light intensity value of the light-emitting assembly; Feeding back the light intensity value to the power supply controller for real-time display and monitoring; Determining whether the light intensity value is lower than the preset value; and Adjusting the output power of the power supply to adjust the light intensity of the light-emitting assembly when the light intensity value is lower than the preset value. When the light intensity value is lower than the preset value, the power supply controller adjusts the output power of the power supply to adjust the light intensity value of the light emitting component; When the output power of the power supply controller is adjusted to the maximum value and the light intensity value is still lower than the preset value, it is prompted to replace the consumable.

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