Glass tape chamfering cutting method

Abstract

The invention provides a glass tape chamfering cutting method which comprises the following steps: S1, configuring a first cutting line and a second cutting line which are intersected, the first cutting line is used for cutting glass to be cut to form a first chamfering surface, and the second cutting line is used for cutting the glass to be cut to form a first longitudinal cutting surface; s2, a third cutting line and a fourth cutting line which intersect with each other are configured, the third cutting line is used for cutting the to-be-cut glass to form a second chamfer surface, and the fourth cutting line is used for cutting the to-be-cut glass to form a second longitudinal cutting surface which is coplanar with the first longitudinal cutting surface; wherein the first cutting line and the third cutting line can be mutually converted, the second cutting line and the fourth cutting line can be mutually converted, and the first cutting line, the second cutting line, the third cutting line and the fourth cutting line are all generated by a DOE system. According to the invention, the DOE scheme is applied to cutting the glass, and chamfering cutting of the glass with various thickness specifications can be adapted without replacing the DOE lens.

Description

Technical Field

[0001] The invention relates to the technical field of glass processing, and in particular to a glass ribbon chamfering cutting method. Background Art

[0002] In the consumer electronics industry, chamfered glass cutting is very common. Conventional CNC cutting methods are prone to glass edge chipping and poor cutting surface roughness; for this reason, the industry generally uses laser cutting to achieve chamfered glass cutting, among which the ultrafast laser multi-point DOE cutting solution can effectively overcome the defects of traditional CNC cutting methods, but the versatility of DOE lenses is poor, and the DOE lens design must be determined according to the glass thickness. Once the design is determined, the thickness of the cut glass cannot be changed. Summary of the invention

[0003] In view of the shortcomings of the prior art, the object of the present invention is to provide a glass chamfer cutting method, which uses a DOE cutting solution and can adapt to the chamfer cutting of glass with various thickness specifications without replacing the DOE lens.

[0004] The embodiments of the present invention are implemented by the following technical solutions:

[0005] A glass ribbon chamfering cutting method comprises the following steps: step S1: configuring a first cutting line and a second cutting line intersecting each other, wherein the first cutting line is used for cutting the glass to be cut to form a first chamfered surface, and the second cutting line is used for cutting the glass to be cut to form a first longitudinal cutting surface; step S2: configuring a third cutting line and a fourth cutting line intersecting each other, wherein the third cutting line is used for cutting the glass to be cut to form a second chamfered surface, and the fourth cutting line is used for cutting the glass to be cut to form a second longitudinal cutting surface coplanar with the first longitudinal cutting surface; wherein the first cutting line and the third cutting line can be converted to each other, and the second cutting line and the fourth cutting line can be converted to each other, and the first cutting line, the second cutting line, the third cutting line and the fourth cutting line are all generated by a DOE system. First, a cutting line is generated on the upper or lower side of the glass to be cut through the DOE system. After completing the cutting of the upper or lower side in the thickness direction of the glass to be cut, the cutting line is converted to the opposite side of the glass to be cut to complete the cutting of the opposite side. In this way, the DOE system can adapt to the chamfered cutting of the glass to be cut within the thickness range of twice the second cutting line or twice the fourth cutting line.

[0006] According to a preferred embodiment, the first cutting line and the second cutting line originate from the same DOE system and are composed of a plurality of focal points.

[0007] According to a preferred embodiment, a quarter wave plate is configured to switch the polarization direction of the laser beam to achieve mutual conversion between the first cutting line and the third cutting line, and mutual conversion between the second cutting line and the fourth cutting line.

[0008] According to a preferred embodiment, the first cutting line and the second cutting line are defined on a side close to the light source, then: the step S2 is performed first, and then the step S1 is performed.

[0009] According to a preferred embodiment, the first longitudinal cutting plane at least partially overlaps with the second longitudinal cutting plane.

[0010] According to a preferred embodiment, the laser beam is an infrared ultrafast laser.

[0011] According to a preferred embodiment, the power of the laser beam is 10W-30W.

[0012] According to a preferred embodiment, the DOE system includes a 1 / 4 wave plate lens, a DOE lens and an objective lens arranged in sequence along the laser beam transmission path, and the laser beam passes through the 1 / 4 wave plate lens, the DOE lens and the objective lens in sequence to reach the glass to be cut.

[0013] According to a preferred embodiment, the DOE system also includes a first carrier, and the 1 / 4 wave plate lens is arranged on the first carrier; there are two 1 / 4 wave plates, and the first carrier can move relative to the transmission path of the laser beam so that the two 1 / 4 wave plates are not in the transmission path of the laser beam at the same time.

[0014] According to a preferred embodiment, the DOE system further comprises a second wafer carrier, the DOE lens is mounted on the second wafer carrier, and the second wafer carrier is rotatable so that the DOE lens can rotate with the laser beam as the axis. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0016] Figure 1 This is a schematic structural diagram of a finished glass ribbon chamfering cut product in an embodiment of the present invention;

[0017] Figure 2 A schematic diagram of a glass ribbon chamfering and cutting process provided in an embodiment of the present invention;

[0018] Figure 3 Schematic diagram of the spatial assembly structure of the DOE system and the glass to be cut in an embodiment of the present invention.

[0019] Icons: 1. Glass to be cut; 11. First chamfered surface; 12. First longitudinal cutting surface; 13. Second chamfered surface; 14. Second longitudinal cutting surface; 2. Objective lens; 3. Second slide holder; 31. DOE lens; 4. First slide holder; 41. 1 / 4 wave plate lens; 5. Laser beam; a. Third cutting line; b. Fourth cutting line; c. First cutting line; d. Second cutting line; e. Cutting seam; A. DOE system. DETAILED DESCRIPTION

[0020] For better understanding and implementation, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0021] In the description of the present invention, it should be noted that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0023] Please refer to Figures 1 to 3 , a glass ribbon chamfering cutting method, comprising the following steps:

[0024] Step S1: configuring a first cutting line c and a second cutting line d that intersect, wherein the first cutting line c is used to cut the glass 1 to be cut to form a first chamfered surface 11, and the second cutting line d is used to cut the glass 1 to be cut to form a first longitudinal cutting surface 12;

[0025] Step S2: configuring a third cutting line a and a fourth cutting line b that intersect, wherein the third cutting line a is used to cut the glass 1 to be cut to form a second chamfered surface 13, and the fourth cutting line b is used to cut the glass 1 to be cut to form a second longitudinal cutting surface 14 that is coplanar with the first longitudinal cutting surface 12; wherein,

[0026] The first cutting line c and the third cutting line a can be converted to each other, and the second cutting line d and the fourth cutting line b can be converted to each other. The first cutting line c, the second cutting line d, the third cutting line a and the fourth cutting line b are all generated by the DOE system A.

[0027] In this embodiment, the DOE system A provides focal lines corresponding to the shapes of the first cutting line c, the second cutting line d, the third cutting line a and the fourth cutting line b, so as to achieve chamfered cutting of the glass 1 to be cut. Figure 1 shown.

[0028] Since the first cutting line c and the third cutting line a can be switched to each other, the second cutting line d and the fourth cutting line b can be switched to each other. Figure 2-1 and Figure 2-2 As shown, the first cutting line c and the second cutting line d are on the same side of the glass 1 to be cut, and the third cutting line a and the fourth cutting line b are on the same side of the glass 1 to be cut. More specifically, the first cutting line c and the second cutting line d are on the upper side of the glass 1 to be cut, and the third cutting line a and the fourth cutting line b are on the lower side of the glass 1 to be cut. When in use, the cutting line on the upper side or the lower side of the glass 1 to be cut is first generated by the DOE system A, and after the cutting of the upper side or the lower side is completed in the thickness direction of the glass 1 to be cut, the cutting line is switched to the opposite side of the glass 1 to be cut to complete the opposite side cutting.

[0029] For example, the third cutting line a and the fourth cutting line b are first formed by the DOE system A to complete the cutting of the lower side of the glass 1 to be cut, and then the third cutting line a and the fourth cutting line b are converted to form the first cutting line c and the second cutting line d to complete the cutting of the upper side of the glass 1 to be cut, thereby realizing the chamfered cutting of the glass 1 to be cut.

[0030] In this way, the DOE system A can adapt to the chamfered cutting of the glass 1 to be cut within the thickness range of twice the second cutting line d or twice the fourth cutting line b.

[0031] Preferably, the first cutting line c and the second cutting line d originate from the same DOE system A and are composed of several focal points. Specifically, the first cutting line c, the second cutting line d, the third cutting line a and the fourth cutting line b are all focal lines provided by the DOE system A and are composed of several focal points.

[0032] Optionally, in this embodiment, the DOE system A includes a quarter wave plate lens 41, a DOE lens 31 and an objective lens 2 arranged in sequence along the transmission path of the laser beam 5, and the laser beam 5 passes through the quarter wave plate lens 41, the DOE lens 31 and the objective lens 2 in sequence to reach the glass to be cut 1. The quarter wave plate lens 41 here is used to switch the polarization direction of the laser beam 5 to achieve the conversion between the first cutting line c and the third cutting line a, and the conversion between the second cutting line d and the fourth cutting line b. The focusing objective lens 2 is used to focus the laser beam 5 into a focal line.

[0033] Specifically, by modifying the DOE lens 31 and focusing the objective lens 2, the laser beam 5 forms multiple focal points at specific positions in the 3D space. These focal points are accumulated to form a certain shape, which corresponds to the shape in this embodiment. Figure 2-1 The intersecting first cutting line c and second cutting line d are shown, and Figure 2-2 The intersecting third cutting line a and fourth cutting line b are shown.

[0034] Furthermore, in order to improve the cutting quality, the first cutting line c and the second cutting line d are defined to be close to the light source, then: first perform step S2, and then perform step S1. Figure 2-1 and Figure 2-2 As shown, the DOE system A, i.e., the light source, is located on the upper side of the glass 1 to be cut. Step S2 is first performed to cut the lower side of the glass 1 to be cut. At this time, the upper side structure of the glass 1 to be cut is complete. When the subsequent step S1 is performed, it is beneficial for the focal lines corresponding to the first cutting line c and the second cutting line d to be smoothly conducted in the glass 1 to be cut. Since the lower side of the glass 1 to be cut has formed as shown in FIG. Figure 2-2 As shown in the slit e, the refractive index of air and the glass 1 to be cut is different. Therefore, if step S1 is performed first and then step S2 is performed, when cutting the lower side of the glass 1 to be cut, that is, when step S2 is performed, the laser beam 5 will first pass through the slit e formed in step S1 and then enter the glass 1 to be cut, which will affect the formation of the third cutting line a and the fourth cutting line b and the cutting quality. In summary, when this method is performed, the glass 1 to be cut is first cut away from the light source side and then cut close to the light source side. The light source here refers to the laser beam 5 focused by the objective lens 2.

[0035] like Figure 3As shown, the DOE system A further includes a first slide holder 4, and a quarter wave plate lens 41 is disposed on the first slide holder 4. In this embodiment, there are two quarter wave plate lenses 41, corresponding to the first cutting line c and the second cutting line d for cutting the upper side of the glass 1 to be cut, and the third cutting line a and the fourth cutting line b for cutting the lower side of the glass 1 to be cut. The first slide holder 4 can move relative to the transmission path of the laser beam 5 so that the two quarter wave plate lenses 41 are not on the transmission path of the laser beam 5 at the same time. The first slide holder 4 here can be driven by a cylinder to move linearly, or it can be driven by a motor to move in a circular motion, without specific limitation.

[0036] Furthermore, the DOE system A also includes a second wafer carrier 3 , and a DOE lens 31 is mounted on the second wafer carrier 3 , and the DOE lens 31 is located on the transmission path of the laser beam 5 .

[0037] In some embodiments, the glass 1 to be cut moves relative to the focused laser beam 5 .

[0038] In another embodiment, the second carrier 3 can be driven by a motor to rotate the DOE lens 31 to a certain angle, so as to achieve chamfering in different directions of the glass 1 to be cut. Specifically, when the second carrier 3 rotates, the DOE lens 31 rotates with the laser beam 5 as the axis.

[0039] In this embodiment, the first longitudinal cutting surface 12 and the second longitudinal cutting surface 14 at least partially overlap, so as to ensure that the glass 1 to be cut is completely cut through in the thickness direction.

[0040] In this embodiment, the laser beam 5 is an infrared ultrafast laser with a power of 10W-30W.

[0041] The technical means disclosed in the scheme of the present invention are not limited to the technical means disclosed in the above-mentioned implementation mode, but also include technical schemes composed of any combination of the above-mentioned technical features. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications are also regarded as the protection scope of the present invention.

Claims

1. A glass ribbon chamfering cutting method, characterized in that: The steps include: Step S1: configuring a first cutting line and a second cutting line that intersect, wherein the first cutting line is used to cut the glass to be cut to form a first chamfered surface, and the second cutting line is used to cut the glass to be cut to form a first longitudinal cutting surface; Step S2: configuring a third cutting line and a fourth cutting line intersecting each other, wherein the third cutting line is used to cut the glass to be cut to form a second chamfered surface, and the fourth cutting line is used to cut the glass to be cut to form a second longitudinal cutting surface coplanar with the first longitudinal cutting surface; wherein, The first cutting line and the third cutting line can be converted to each other, and the second cutting line and the fourth cutting line can be converted to each other, and the first cutting line, the second cutting line, the third cutting line and the fourth cutting line are all generated by a DOE system.

2. The glass ribbon chamfering cutting method according to claim 1, characterized in that: The first cutting line and the second cutting line originate from the same DOE system and are composed of a plurality of focal points.

3. The glass ribbon chamfering cutting method according to claim 2, characterized in that: A 1 / 4 wave plate lens is configured to switch the polarization direction of the laser beam to achieve mutual conversion between the first cutting line and the third cutting line, and mutual conversion between the second cutting line and the fourth cutting line.

4. The glass ribbon chamfering cutting method according to claim 2, characterized in that: The first cutting line and the second cutting line are defined on the side close to the light source, then: Execute step S2 first, and then execute step S1.

5. The glass ribbon chamfering cutting method according to claim 1, characterized in that: The first longitudinal cutting plane at least partially overlaps with the second longitudinal cutting plane.

6. The glass ribbon chamfering cutting method according to claim 3, characterized in that: The laser beam is an infrared ultrafast laser.

7. The glass ribbon chamfering cutting method according to claim 6, characterized in that: The power of the laser beam is 10W-30W.

8. The glass ribbon chamfering cutting method according to claim 1, characterized in that: The DOE system includes a 1 / 4 wave plate lens, a DOE lens and an objective lens arranged in sequence along the laser beam transmission path, and the laser beam passes through the 1 / 4 wave plate lens, the DOE lens and the objective lens in sequence to reach the glass to be cut.

9. The glass ribbon chamfering cutting method according to claim 8, characterized in that: The DOE system further comprises a first slide holder, and the quarter wave plate lens is arranged on the first slide holder; There are two 1 / 4 wave plates, and the first carrier can move relative to the transmission path of the laser beam so that the two 1 / 4 wave plates are not in the transmission path of the laser beam at the same time.

10. The glass ribbon chamfering cutting method according to claim 8, characterized in that: The DOE system further comprises a second carrier, the DOE lens is mounted on the second carrier, and the second carrier is rotatable so that the DOE lens can rotate with the laser beam as an axis.

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