Electroplating process of extensible nickel

Abstract

The invention discloses an electroplating process of extensible nickel, and relates to the technical field of electroplating, nickel aminosulfonate or nickel sulfate is selected as a main component of an electroplating solution, and an ultrasonic technology is used in the electroplating process to help remove bubbles and gas in electrolyte. The design of the ultrasonic vibration plate can ensure the propagation efficiency and the cleaning effect of ultrasonic waves, additives and wetting agents are omitted, carbon and sulfur components in a plating layer are reduced, the plating layer appearance problem and the hydrogen evolution problem caused by the additives and the wetting agents are omitted, the nickel ductility can be remarkably improved, electroplated workpieces are free of cracks and pinholes, and the service life of the workpieces is prolonged. In the electroplating process, oxidation of an electroplating solution can be effectively reduced through matched arrangement of the sealing assembly and the triggering assembly, the stability and purity of the solution are improved, the automatic switch passing function is achieved, automation of the electroplating process can be achieved, and the electroplating efficiency is improved. The electroplating process is combined with advanced chemical formula, equipment technology and automatic control, the high-quality and high-efficiency electroplating process can be realized, and the appearance and performance of the product are improved.

Description

Technical Field

[0001] The invention relates to the technical field of electroplating, in particular to an electroplating process for ductile nickel. Background Art

[0002] At present, the metal parts that constitute electronic connectors usually need to be plated with nickel, tin, gold or other precious metals to achieve corrosion protection and electrical connection performance. After electroplating, the metal terminals or shell frames need to be stamped or assembled for secondary molding. The ductility of nickel as the intermediate plating layer determines whether the plating layer will crack during secondary molding, resulting in exposure of the substrate and loss of corrosion protection. The latter can directly affect the decline or loss of electrical performance and assembly performance;

[0003] In order to improve the ductility of the nickel layer, special additives and wetting agents are usually used in the electroplating solution, but the effect is often not obvious and difficult to maintain. After a period of use, the ductility of nickel will become worse and worse.

[0004] The result of not using additives or wetting agents is that pinholes appear in the coating, the coating in the high current area is rough, gray or even burnt. In addition, there are inevitable side reactions in the nickel plating process. In addition to hydrogen evolution, other non-nickel components are also included and deposited in the nickel layer, resulting in a decrease in the ductility of the coating.

[0005] Meanwhile, during the electroplating process, the tin plating solution usually contains tin salts, additives and other chemical components, which can oxidize when exposed to air or other oxidants. For example, tin (II) ions in the solution may be converted into tin (IV) ions under oxidizing conditions. This oxidation may change the chemical properties of the solution, thereby affecting the quality of electroplating.

[0006] In order to solve the above problems and improve the electroplating process, it is necessary to improve the existing technology. To this end, we propose a ductile nickel electroplating process to solve the above problems. Summary of the invention

[0007] The object of the present invention is to provide a ductile nickel electroplating process to solve the problems raised in the above background technology.

[0008] In order to achieve the above-mentioned invention object, the present invention adopts the following technical scheme:

[0009] The present invention provides a ductile nickel electroplating process, which specifically comprises the following steps:

[0010] S101, prepare degreasing solution, degreasing solution: sodium hydroxide 20g / L, sodium carbonate 15g / L, sodium phosphate 20g / L, sodium pyrophosphate 5g / L, sodium dodecylbenzene sulfonate 0.02g / L;

[0011] S102, preparing an acid activation solution, wherein the acid activation solution is a 20% sulfuric acid solution;

[0012] S103, pre-treatment of the workpiece before nickel plating, degreasing and acid activation using a degreasing solution and an acid activation solution, and rinsing three times before entering the next process;

[0013] S104, equipped with electroplating solution, nickel sulfamate or nickel sulfate, nickel ion 60-90g / L, nickel chloride 10-30g / L, boric acid 35-45g / L, pH 3.8-4.2, temperature 50-60°C, no organic additives or wetting agents;

[0014] S105, filling the electroplating device with a nickel plating solution, using the electroplating device to perform nickel plating, selecting a pure nickel sulfur-free anode as the anode, the current parameter is 5-10A / dm2, the current is kept continuous and uninterrupted during the nickel plating process, the ultrasonic parameter is 40-100kHz, and the vibration source direction is kept perpendicular to the surface of the workpiece;

[0015] S106, post-processing: rinsing and drying the workpiece.

[0016] Preferably, the electroplating device includes an electroplating pool, wherein a quartz cylinder for filling an electroplating solution is built into the electroplating pool, the quartz cylinder coincides with the axis of the electroplating pool, there is a gap between the quartz cylinder and the electroplating pool, the gap between the quartz cylinder and the electroplating pool is filled with pure water, an ultrasonic vibration plate is installed at the bottom of the inner cavity of the electroplating pool, the ultrasonic vibration plate is placed in pure water, nickel anodes for electroplating workpieces are installed on both sides of the inner wall of the quartz cylinder, a closing component for reducing oxidation of the electroplating solution is arranged on the top of the electroplating pool, a stage for fixing the workpiece is arranged on the top of the closing component, and a trigger component for cooperating with the stage to change its own working state is arranged on the top of the closing component.

[0017] Preferably, the closed component includes a plurality of connecting platforms, one end of each connecting platform is fixedly connected to the top of the electroplating pool, and the plurality of connecting platforms are evenly distributed around the axis of the electroplating pool. A guide groove running through the connecting platform is provided in the middle of the connecting platform, and a guide seat is built into the guide groove. The guide seat is slidably connected to the wall of the guide groove, and a mating plate is fixedly connected to the top of the guide seat.

[0018] Preferably, the mosaic plate is placed on the top of the electroplating pool, and the bottom of the mosaic plate is slidably connected to the electroplating pool and the top of the quartz cylinder, multiple mosaic plates are evenly distributed around the axis of the electroplating pool, and multiple mosaic plates are combined to completely enclose the electroplating pool, and an assembly cylinder is fixedly connected to the side of the bottom of the mosaic plate away from the electroplating pool.

[0019] Preferably, the assembly tube has a built-in positioning spring, and the multiple assembly tubes and the mosaic plate are connected by the positioning spring. A rubber seat is fixedly connected to one side of the mosaic plate, and an assembly groove matching the rubber seat is opened on the other side of the mosaic plate. The rubber seats between the multiple mosaic plates are slidably connected to the wall of the assembly groove.

[0020] Preferably, a driving member for driving the stage to move is installed on the top of the stage, a plurality of connecting holes for facilitating the circulation of the electroplating solution are provided around the stage, and inclined surfaces are provided around the bottom of the stage.

[0021] Preferably, the trigger assembly includes a plurality of top seats, the bottoms of the plurality of top seats are respectively fixedly connected to the tops of a plurality of interlocking plates, the plurality of top seats are evenly distributed around the axis of the electroplating pool, and the tops of the top seats are provided with trigger slopes that match the inclined surfaces.

[0022] Preferably, the trigger slope is in contact with the inclined surface and is slidably connected thereto, a hydraulic seat is installed on the top of the top seat, a liquid storage tank is provided at the bottom of the hydraulic seat, the hydraulic seat is slidably connected to the top seat, and the end of the liquid storage tank away from the hydraulic seat is connected to a hydraulic tappet through a pipeline.

[0023] Preferably, the hydraulic tappet is placed in an assembly cylinder, and the assembly cylinder is an arc-shaped structure. Movable push cylinders are fixedly connected at both ends of the hydraulic tappet. The movable push cylinders at both ends are symmetrically distributed along the axis of the hydraulic tappet. The movable push cylinders are slidingly connected to the inner wall of the assembly cylinder, and the end of the movable push cylinder away from the hydraulic tappet is sleeved on the surface of the positioning spring.

[0024] Preferably, the moving push cylinder is fixedly connected to the positioning spring, and one end of the moving push cylinder close to the positioning spring is fixedly connected to a guide rod, the curvature of the guide rod matches the assembly cylinder and the positioning spring, and the positioning spring is sleeved on the surface of the guide rod without contacting it.

[0025] Compared with the prior art, one or more of the above technical solutions have the following beneficial effects:

[0026] In the present invention, the electroplating solution selects nickel sulfamate or nickel sulfate as the main component of the electroplating solution, which can provide high-purity nickel ions to ensure the quality and stability of the electroplating layer. The use of ultrasonic technology during the electroplating process can help remove bubbles and gases in the electrolyte to ensure the stability and uniformity of the electroplating process. Ultrasonic vibration can effectively clean the surface of the workpiece and improve the efficiency and quality of electroplating. The quartz cylinder and ultrasonic vibration plate in the electroplating device are designed to ensure the corrosion resistance and stability of the equipment. The quartz material has excellent corrosion resistance and can ensure the long-term stable operation of the equipment. The design of the ultrasonic vibration plate can ensure the propagation efficiency and cleaning effect of the ultrasonic wave. By eliminating additives and wetting agents, the carbon and sulfur components in the coating are reduced, and the coating appearance problems and hydrogen evolution problems caused by additives and wetting agents are eliminated and solved by ultrasonic waves, which can significantly improve the ductility of nickel. After electroplating, the workpiece has no cracks and pinholes, which improves the overall electroplating quality. After electroplating, the workpiece has no cracks and pinholes, which improves the overall electroplating quality. It is a low-cost and easy-to-control electroplating process;

[0027] In the electroplating device, the combination of the sealing component and the trigger component can effectively reduce the oxidation of the electroplating solution, improve the stability and purity of the solution, and have an automatic switch function to realize the automation of the electroplating process, reduce manual operations, and improve production efficiency;

[0028] This electroplating process combines advanced chemical formulas, equipment technology and automated control to achieve a high-quality, high-efficiency electroplating process, improve the appearance and performance of the product, while reducing labor costs and environmental pollution, and has broad application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0030] Figure 1 It is a schematic diagram of the electroplating process flow of ductile nickel of the present invention;

[0031] Figure 2 It is a schematic structural diagram of the electroplating device of the present invention;

[0032] Figure 3 is a cross-sectional view of the internal structure of the electroplating pool of the present invention;

[0033] Figure 4 is a schematic diagram of the structure of the closure assembly of the present invention;

[0034] Figure 5 It is a schematic diagram of the assembly structure of the interlocking plate and the electroplating pool of the present invention;

[0035] Figure 6It is a schematic diagram of the assembly structure of the closing component and the trigger component of the present invention;

[0036] Figure 7 It is a schematic diagram of the assembly structure of the loading platform and the top seat of the present invention;

[0037] Figure 8 It is a schematic diagram of the bottom structure of the mosaic plate of the present invention;

[0038] Fig. 9 It is a cross-sectional view of the internal structure of the assembly tube of the present invention;

[0039] Fig.10 The present invention Fig. 9 Enlarged structural diagram at A in the middle.

[0040] In the figure:

[0041] 1. Electroplating tank; 101. Quartz cylinder; 102. Pure water; 103. Ultrasonic vibration plate; 104. Nickel anode; 2. Closing assembly; 201. Connecting platform; 202. Guide groove; 203. Engaging plate; 204. Guide seat; 205. Assembly cylinder; 206. Positioning spring; 207. Rubber seat; 208. Assembly groove; 3. Stage; 301. Driving member; 302. Connecting hole; 303. Inclined surface; 4. Trigger assembly; 401. Top seat; 402. Trigger inclined surface; 403. Hydraulic seat; 404. Liquid storage tank; 405. Hydraulic push rod; 406. Motion push cylinder; 407. Guide rod. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0043] See also Figure 1-Figure 10The present invention provides a ductile nickel electroplating process, which first prepares a degreasing solution, the degreasing solution includes 20 g / L sodium hydroxide, 15 g / L sodium carbonate, 20 g / L sodium phosphate, 5 g / L sodium pyrophosphate, and 0.02 g / L sodium dodecylbenzene sulfonate, and then prepares an acid activation solution, the acid activation is a 20% sulfuric acid solution, pre-treats the workpiece before nickel plating, uses the degreasing solution and the acid activation solution to degrease and acid activate, and needs to be rinsed three times before entering the next process, and is equipped with an electroplating solution, nickel sulfamate or nickel sulfate, nickel ions 60-90 g / L, nickel chloride 10-30 g / L, boric acid 35-45 g / L, pH 3 .8~4.2, temperature 50~60C, no organic additives or wetting agents are used, the electroplating device is filled with nickel plating solution, nickel is plated using the electroplating device, a pure nickel sulfur-free anode is selected as the anode, the current parameter is 5~10A / dm2, the current is kept continuous and uninterrupted during the nickel plating process, the ultrasonic parameter is 40~100kHz, the vibration source direction is kept perpendicular to the surface of the workpiece, and finally post-processing is performed: rinsing and drying the workpiece; by eliminating additives and wetting agents, the carbon and sulfur components in the coating are reduced, and the coating appearance problems and hydrogen evolution problems caused by the elimination of additives and wetting agents are solved by ultrasound, so that the electroplating is free of cracks and pinholes, and the electroplating quality is improved.

[0044] Meanwhile, an electroplating pool 1 is provided in the electroplating device. A quartz cylinder 101 for filling an electroplating solution is provided in the electroplating pool 1. The axis of the quartz cylinder 101 coincides with the axis of the electroplating pool 1. There is a gap between the quartz cylinder 101 and the electroplating pool 1. The gap between the quartz cylinder 101 and the electroplating pool 1 is filled with pure water 102. An ultrasonic vibration plate 103 is installed at the bottom of the inner cavity of the electroplating pool 1. The ultrasonic vibration plate 103 is placed in the pure water 102. Nickel anodes 104 for electroplating workpieces are installed on both sides of the inner wall of the quartz cylinder 101. A sealing component 2 for reducing oxidation of the electroplating solution is provided on the top of the electroplating pool 1. A stage 3 for fixing the workpiece is arranged on the top of the closed component 2, and a trigger component 4 for cooperating with the stage 3 to change its own working state is arranged on the top of the closed component 2; the ultrasonic vibration plate generates ultrasonic vibration and transmits the vibration to the electrolyte solution. The high-frequency vibration generated by the ultrasonic vibration plate can form tiny bubbles in the electrolyte solution. These bubbles burst when they come into contact with the surface of the workpiece, releasing energy to generate impact force and eddy current, effectively cleaning the dirt, grease and impurities on the surface of the workpiece. During the electroplating process, the presence of gas may affect the flow of electrolyte and the quality of electroplating. The vibration of the ultrasonic vibration plate can help remove bubbles and gas in the electrolyte and ensure the stability of the environment during the electroplating process. The ultrasonic vibration can increase the contact frequency between the metal ions in the electrolyte solution and the surface of the workpiece, accelerate the electrochemical reactions such as anodic oxidation and cathode reduction, thereby improving the efficiency and quality of electroplating. The ultrasonic vibration can improve the fluidity of the electrolyte solution in the electroplating tank, so that the electrolyte solution is more evenly distributed on the surface of the workpiece, thereby improving the uniformity and quality of the electroplating layer. The ultrasonic vibration plate plays an important role in the electroplating device, which can improve the efficiency and quality of the electroplating process and ensure that the final electroplated product has a good appearance and performance;

[0045] The sonic vibration plate is usually installed in pure water 102. In pure water 102, the propagation efficiency of ultrasonic waves is higher, which helps to ensure that ultrasonic waves are evenly propagated throughout the water and produce a uniform cleaning effect on the surface of the workpiece. The chemical properties of pure water 102 are stable and easy to control and adjust, which can ensure consistent cleaning effects in different electroplating processes. Installing an ultrasonic vibration plate in pure water 102 can improve the propagation efficiency of ultrasonic waves and ensure the cleaning effect and quality during the electroplating process.

[0046] The quartz tank 101 is selected because the quartz material has a strong corrosion resistance to most chemicals, including strong acids and strong bases. The electroplating process usually involves acidic or alkaline electrolytes. The use of a quartz electroplating cell 1 can ensure that the cell body is not corroded by these chemicals, extending the service life of the equipment. During the electroplating process, the use of a quartz electroplating cell 1 can reduce the risk of impurities entering the electrolyte, thereby ensuring the purity of the electroplating process. This is particularly critical for electroplating applications that require high purity and high precision. Quartz is an insulating material, so it will not interfere with the flow of current or produce electrochemical reactions during the electroplating process. The use of quartz material can improve the corrosion resistance, heat resistance and purity of the electroplating process, while ensuring the safety and stability of the process.

[0047] In order to reduce the problem of oxidation of the tin plating solution, a plurality of connecting platforms 201 are arranged in the closed component 2, one end of the connecting platform 201 is fixedly connected to the top of the electroplating pool 1, and the plurality of connecting platforms 201 are evenly distributed around the axis of the electroplating pool 1. A guide groove 202 is provided in the middle of the connecting platform 201, and a guide seat 204 is built in the guide groove 202. The guide seat 204 is slidably connected to the groove wall of the guide groove 202. A mosaic plate 203 is fixedly connected to the top of the guide seat 204. The mosaic plate 203 is placed on the top of the electroplating pool 1, and the bottom of the mosaic plate 203 is slidably connected to the electroplating pool 1 and the top of the quartz cylinder 101. The plurality of mosaic plates 203 are evenly distributed around the axis of the electroplating pool 1, and the plurality of mosaic plates 203 surround the combination to seal the electroplating pool 1. The plating pool 1 is completely closed, and an assembly cylinder 205 is fixedly connected to one side of the bottom of the interlocking plate 203 away from the plating pool 1, and a positioning spring 206 is built in the assembly cylinder 205. Multiple assembly cylinders 205 and the interlocking plate 203 are connected through the positioning spring 206. A rubber seat 207 is fixedly connected to one side of the interlocking plate 203, and an assembly groove 208 matching the rubber seat 207 is provided on the other side of the interlocking plate 203. The rubber seats 207 between the multiple interlocking plates 203 are slidably connected to the groove wall of the assembly groove 208. When the electroplating of the workpiece is completed or the electroplating device is not used, the multiple interlocking plates 203 are driven by the elastic force of the positioning spring 206 to approach each other, thereby completing the closure of the plating pool 1 and reducing the time the solution is exposed to the air.

[0048] In order to automatically open and close the electroplating pool when in use, a driving member 301 for driving the platform 3 to move is installed on the top of the platform 3, a plurality of connecting holes 302 are provided around the platform 3 to facilitate the circulation of the electroplating solution, and an inclined surface 303 is provided around the bottom of the platform 3, wherein a plurality of top seats 401 are provided in the trigger assembly 4, the bottoms of the plurality of top seats 401 are respectively fixedly connected to the tops of the plurality of interlocking plates 203, the plurality of top seats 401 are evenly distributed around the axis of the electroplating pool 1, and a trigger inclined surface 402 matching the inclined surface 303 is provided on the top of the top seat 401 The trigger slope 402 contacts the inclined surface 303 and is slidably connected therewith. A hydraulic seat 403 is installed on the top of the top seat 401. A liquid storage tank 404 is arranged at the bottom of the hydraulic seat 403. The hydraulic seat 403 is slidably connected to the top seat 401. The end of the liquid storage tank 404 away from the hydraulic seat 403 is connected to a hydraulic tappet 405 through a pipeline. The hydraulic tappet 405 is placed in the assembly cylinder 205. The assembly cylinder 205 is an arc-shaped structure. The two ends of the hydraulic tappet 405 are fixedly connected with a moving push cylinder 406. The moving push cylinders 406 at both ends are symmetrically distributed along the axis of the hydraulic tappet 405. The cylinder 406 is slidably connected to the inner wall of the assembly cylinder 205, and the end of the motion push cylinder 406 away from the hydraulic tappet 405 is sleeved on the surface of the positioning spring 206, and the motion push cylinder 406 is fixedly connected to the positioning spring 206, and the end of the motion push cylinder 406 close to the positioning spring 206 is fixedly connected to the guide rod 407, and the curvature of the guide rod 407 matches the assembly cylinder 205 and the positioning spring 206, and the positioning spring 206 is sleeved on the surface of the guide rod 407 without contacting it, and the worktable 3 fixed with the workpiece is driven to move downward, so that its bottom is aligned with the multiple top seats 4 01 contact, it will first be squeezed to the hydraulic seat 403, and the hydraulic oil will flow back to the hydraulic push rod 405 through the liquid storage tank 404, so that the connection force between the multiple positioning springs 206 becomes smaller, and as the worktable 3 continues to move downward, the bottom and the top seat 401 are completely in contact and squeezed, driving the multiple mosaic plates 203 to move away from each other and spread out, so that they can move themselves to the electroplating tank 1 for electroplating, and move upward after completion. The multiple mosaic plates 203 will return to their original position to complete the closure, reducing the time the solution is exposed to the air, preventing the electroplating solution from oxidizing, and fully automatic operation, reducing labor requirements.

[0049] How it works

[0050] In actual use, the degreasing solution is prepared to remove grease and dirt from the surface of the workpiece, so as to ensure the cleanliness and adhesion of the workpiece surface during the subsequent electroplating process. The components in the degreasing solution have the effect of decontamination and surface activation, preparing for electroplating;

[0051] Secondly, the use of acid activation solution can further clean and activate the workpiece surface, improve the adhesion and uniformity of the coating, and the sulfuric acid in the acid activation solution can remove surface oxides. The three-time rinsing process helps to thoroughly clean the workpiece surface and avoid the influence of residues on the electroplating quality.

[0052] Electroplating solution selection: nickel sulfamate or nickel sulfate as the main component of the electroplating solution can provide high-purity nickel ions to ensure the quality and stability of the electroplating layer. In addition, precise control of the solution composition and process parameters, such as pH value and temperature, are also key factors in ensuring the quality of electroplating.

[0053] The use of ultrasonic technology in the electroplating process can help remove bubbles and gases in the electrolyte, ensuring the stability and uniformity of the electroplating process. Ultrasonic vibration can effectively clean the surface of the workpiece and improve the efficiency and quality of electroplating. The quartz cylinder 101 and ultrasonic vibration plate 103 in the electroplating device are designed to ensure the corrosion resistance and stability of the equipment. The quartz material has excellent corrosion resistance and can ensure the long-term stable operation of the equipment. The design of the ultrasonic vibration plate 103 can ensure the propagation efficiency and cleaning effect of the ultrasonic wave;

[0054] By setting up multiple connecting platforms 201, guide grooves 202, interlocking plates 203, hydraulic seats 403 and other components, the functions of complete closure and automatic opening and closing of the electroplating pool 1 are realized, thereby reducing the time the solution is exposed to the air, effectively preventing the oxidation of the electroplating solution, and realizing full automatic operation, reducing the need for manual labor. The driving member 301 and the hydraulic system on the stage 3 enable the device to open and close automatically, reducing manual intervention, and by completely closing the electroplating pool 1, the time the solution is exposed to the air is reduced, effectively preventing the oxidation of the electroplating solution. The electroplating process improves the stability and purity of the solution, and combines advanced chemical formulas, equipment technology and automated control to achieve high-quality and efficient electroplating processes, improve the appearance and performance of products, and reduce labor costs and environmental pollution, with broad application prospects.

[0055] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A process for electroplating ductile nickel, characterized in that: The specific steps are: S101, prepare degreasing solution, degreasing solution: sodium hydroxide 20g / L, sodium carbonate 15g / L, sodium phosphate 20g / L, sodium pyrophosphate 5g / L, sodium dodecylbenzene sulfonate 0.02g / L; S102, preparing an acid activation solution, wherein the acid activation solution is a 20% sulfuric acid solution; S103, pre-treatment of the workpiece before nickel plating, degreasing and acid activation using a degreasing solution and an acid activation solution, and rinsing three times before entering the next process; S104, equipped with electroplating solution, nickel sulfamate or nickel sulfate, nickel ion 60-90g / L, nickel chloride 10-30g / L, boric acid 35-45g / L, pH 3.8-4.2, temperature 50-60°C, no organic additives or wetting agents; S105, filling the electroplating device with a nickel plating solution, using the electroplating device to perform nickel plating, selecting a pure nickel sulfur-free anode as the anode, the current parameter is 5-10A / dm2, the current is kept continuous and uninterrupted during the nickel plating process, the ultrasonic parameter is 40-100kHz, and the vibration source direction is kept perpendicular to the surface of the workpiece; S106, post-processing: rinsing and drying the workpiece.

2. A process for electroplating ductile nickel according to claim 1, characterized in that: The electroplating device comprises an electroplating pool (1), wherein a quartz cylinder (101) for filling an electroplating solution is built into the electroplating pool (1), the axis of the quartz cylinder (101) and the electroplating pool (1) coincide with each other, a gap exists between the quartz cylinder (101) and the electroplating pool (1), the gap between the quartz cylinder (101) and the electroplating pool (1) is filled with pure water (102), an ultrasonic vibration plate (103) is installed at the bottom of the inner cavity of the electroplating pool (1), the ultrasonic vibration plate (103) is placed in the pure water (102), nickel anodes (104) for electroplating a workpiece are installed on both sides of the inner wall of the quartz cylinder (101), a sealing component (2) for reducing oxidation of the electroplating solution is arranged on the top of the electroplating pool (1), a loading platform (3) for fixing the workpiece is arranged on the top of the sealing component (2), and a trigger component (4) for cooperating with the loading platform (3) to change its own working state is arranged on the top of the sealing component (2).

3. A process for electroplating ductile nickel according to claim 2, characterized in that: The closure assembly (2) comprises a plurality of connection platforms (201), one end of each connection platform (201) being fixedly connected to the top of the electroplating tank (1) at four sides, and the plurality of connection platforms (201) being evenly distributed around the axis of the electroplating tank (1). A guide groove (202) penetrating the connection platform (201) is provided in the middle of the connection platform (201), a guide seat (204) is built in the guide groove (202), the guide seat (204) is slidably connected to the groove wall of the guide groove (202), and a mosaic plate (203) is fixedly connected to the top of the guide seat (204).

4. A process for electroplating ductile nickel according to claim 3, characterized in that: The interlocking plate (203) is placed on the top of the electroplating pool (1), and the bottom of the interlocking plate (203) is slidably connected to the electroplating pool (1) and the top of the quartz cylinder (101). A plurality of the interlocking plates (203) are evenly distributed around the axis of the electroplating pool (1). The plurality of the interlocking plates (203) are combined to completely enclose the electroplating pool (1), and a mounting tube (205) is fixedly connected to the side of the bottom of the interlocking plate (203) away from the electroplating pool (1).

5. A process for electroplating ductile nickel according to claim 4, characterized in that: The assembly tube (205) has a built-in positioning spring (206); a plurality of the assembly tubes (205) and the interlocking plate (203) are connected via the positioning spring (206); a rubber seat (207) is fixedly connected to one side of the interlocking plate (203); an assembly groove (208) matching the rubber seat (207) is provided on the other side of the interlocking plate (203); and the rubber seats (207) between the plurality of interlocking plates (203) are slidably connected to the groove wall of the assembly groove (208).

6. A process for electroplating ductile nickel according to claim 2, characterized in that: A driving member (301) for driving the stage (3) to move is installed on the top of the stage (3), a plurality of connecting holes (302) for facilitating the circulation of electroplating solution are provided around the stage (3), and inclined surfaces (303) are provided around the bottom of the stage (3).

7. A process for electroplating ductile nickel according to claim 2, characterized in that: The trigger assembly (4) comprises a plurality of top seats (401), the bottoms of the plurality of top seats (401) are respectively fixedly connected to the tops of a plurality of interlocking plates (203), the plurality of top seats (401) are evenly distributed around the axis of the electroplating pool (1), and a trigger inclined surface (402) matching the inclined surface (303) is provided on the top of the top seat (401).

8. A process for electroplating ductile nickel according to claim 7, characterized in that: The trigger slope (402) is in contact with the inclined surface (303) and is slidably connected thereto; a hydraulic seat (403) is installed on the top of the top seat (401); a liquid storage tank (404) is arranged at the bottom of the hydraulic seat (403); the hydraulic seat (403) is slidably connected to the top seat (401); and one end of the liquid storage tank (404) away from the hydraulic seat (403) is connected to a hydraulic tappet (405) through a pipeline.

9. A process for electroplating ductile nickel according to claim 8, characterized in that: The hydraulic tappet (405) is placed in the assembly cylinder (205), and the assembly cylinder (205) is an arc-shaped structure. The two ends of the hydraulic tappet (405) are fixedly connected with movable push cylinders (406). The movable push cylinders (406) at the two ends are symmetrically distributed along the axis of the hydraulic tappet (405). The movable push cylinder (406) is slidably connected to the inner wall of the assembly cylinder (205), and one end of the movable push cylinder (406) away from the hydraulic tappet (405) is sleeved on the surface of the positioning spring (206).

10. A process for electroplating ductile nickel according to claim 9, characterized in that: The moving push cylinder (406) is fixedly connected to the positioning spring (206); one end of the moving push cylinder (406) close to the positioning spring (206) is fixedly connected to a guide rod (407); the curvature of the guide rod (407) matches the assembly cylinder (205) and the positioning spring (206); the positioning spring (206) is sleeved on the surface of the guide rod (407) without contacting it.

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