Temperature control method of earphone, terminal equipment and storage medium

Abstract

The embodiment of the invention provides an earphone temperature control method, terminal equipment and a storage medium, and belongs to the field of terminal equipment. The method comprises the following steps: determining the initial shell temperature of the earphone, and obtaining the working parameters of the earphone for playing audio; determining the current shell temperature of the earphone according to the initial shell temperature and the working parameters; and adjusting the audio playing volume of the earphone according to the current shell temperature. According to the technical scheme, the earphone can be prevented from being too hot.

Description

Technical Field

[0001] The present application relates to the field of terminal devices, and in particular to a temperature control method for headphones, a terminal device, and a storage medium. Background Art

[0002] With the development of terminal equipment technology, there are more and more styles and types of headphones that match them. Headphones are mainly used for the transmission of audio resources. For example, when Bluetooth technology is applied to headphones, after the headphones establish a Bluetooth connection with the mobile terminal, users can listen to the audio played by the mobile terminal through the Bluetooth headphones, so that users can make and receive calls through Bluetooth headphones without the hindrance of headphone wires. However, headphones need to be worn close to the body, which can easily cause overheating and burn the user's skin. Summary of the invention

[0003] The embodiments of the present application provide a temperature control method for headphones, a terminal device, and a storage medium, aiming to prevent the headphones from overheating.

[0004] In a first aspect, an embodiment of the present application provides a temperature control method for headphones, comprising: determining an initial shell temperature of the headphones and obtaining working parameters of the headphones for playing audio; determining a current shell temperature of the headphones based on the initial shell temperature and the working parameters; and adjusting a playback volume of the audio played by the headphones based on the current shell temperature.

[0005] In a second aspect, an embodiment of the present application further provides a terminal device, which is communicatively connected to the headset; the terminal device includes a processor, a memory, a computer program stored in the memory and executable by the processor, and a data bus for realizing a connection and communication between the processor and the memory, wherein when the computer program is executed by the processor, any method for controlling the temperature of the headset provided in the embodiment of the present application is realized.

[0006] In a third aspect, an embodiment of the present application further provides a storage medium for computer-readable storage, characterized in that the storage medium stores one or more programs, and the one or more programs can be executed by one or more processors to implement any temperature control method of headphones provided in an embodiment of the present application.

[0007] The embodiment of the present application provides a method for controlling the temperature of headphones, a terminal device, and a storage medium. The embodiment of the present application needs to determine the initial shell temperature of the headphones and obtain the working parameters of the headphones playing audio; determine the current shell temperature of the headphones according to the initial shell temperature and the working parameters; and adjust the playback volume of the headphones playing audio according to the current shell temperature. The embodiment of the present application can dynamically adjust the volume of the headphones according to the initial shell temperature and the working parameters of the headphones during the use of the headphones, thereby reducing the heating of the headphones and avoiding the risk of burns caused by overheating of the headphones. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 A schematic flow chart of the steps of a method for controlling the temperature of an earphone provided in an embodiment of the present application;

[0009] Figure 2 A schematic diagram of the structure of a terminal device provided in an embodiment of the present application;

[0010] Figure 3 for Figure 1 A schematic flow chart of sub-steps of the temperature control method in FIG.

[0011] Figure 4 A schematic diagram of a scenario for implementing the earphone temperature control method provided in an embodiment of the present application;

[0012] Figure 5 A schematic block diagram of a terminal device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0013] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0014] The flowcharts shown in the accompanying drawings are only examples and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may also be decomposed, combined or partially merged, so the actual execution order may change according to actual conditions.

[0015] It should be understood that the terms used in this application specification are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in this application specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0016] Currently, mobile phones can connect to Bluetooth headsets, but Bluetooth headsets are just a Bluetooth chip + power amplifier circuit + battery + charging module, and cannot provide real-time feedback of the real-time temperature of the Bluetooth headset to mobile phones and other terminal devices. Therefore, in abnormal scenarios (such as long-term high-intensity audio playback and other noisy environments), it may cause burns when worn close to the body.

[0017] The embodiment of the present application provides a method for controlling the temperature of an earphone, a terminal device, and a storage medium. The method for controlling the temperature of an earphone can be applied to a terminal device, which can be an electronic device such as a mobile phone, a tablet computer, a laptop computer, a desktop computer, a personal digital assistant, and a wearable device.

[0018] The terminal device can be connected to the headset in communication, and the communication connection mode includes wired communication connection and wireless communication connection. The headset can be a wired headset or a wireless headset. For example, the headset can be a Bluetooth headset, and the Bluetooth headset is connected to the terminal device via Bluetooth.

[0019] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0020] Please refer to Figure 1 , Figure 1 A schematic flow chart of the steps of a method for controlling the temperature of headphones provided in an embodiment of the present application.

[0021] like Figure 1 As shown, the earphone temperature control method includes steps S101 to S103.

[0022] Step S101: determining an initial housing temperature of the earphone and obtaining working parameters of the earphone for playing audio.

[0023] The initial housing temperature of the headset may refer to the housing temperature when the headset starts to play audio. For example, when it is detected that the headset starts to work, that is, when it is detected that the headset starts to play audio, the housing temperature of the headset is determined as the initial housing temperature. For another example, when the terminal device detects that the user has called the Bluetooth module to play audio, the ambient temperature at this time is determined as the initial housing temperature of the headset.

[0024] Among them, the working parameters of the earphone playing audio may include the working time, and the playback volume corresponding to each working time. The working parameters may also include parameters such as the loudness of the played audio and the working current of the earphone speaker. When the earphone plays audio, the working time of the earphone and the working parameters such as the playback volume of the audio played at each working time can be recorded. Among them, the playback volumes corresponding to different working times can be the same or different, and the same playback volume can correspond to multiple working times of the earphone playing audio.

[0025] In one embodiment, the ambient temperature is obtained and used as the initial shell temperature of the earphone. It should be noted that when the earphone starts working, the shell temperature of the earphone is substantially equal to the ambient temperature. Therefore, the ambient temperature can be obtained as the initial shell temperature of the earphone, thereby solving the problem that the earphone cannot feedback the real-time temperature in the earphone in real time, and the initial shell temperature of the earphone can be accurately obtained without installing a temperature acquisition device in the earphone.

[0026] Exemplarily, obtaining the ambient temperature includes: collecting the ambient temperature through a thermistor in a terminal device, and the terminal device is communicatively connected to the headset. The thermistor can be arranged within a preset area of ​​the terminal device, and the temperature within the preset area is not affected by the heating device in the terminal device. Therefore, the thermistor within the preset area can accurately collect the ambient temperature.

[0027] It should be noted that due to the limitations of the headset solution, for example, a Bluetooth headset cannot add a thermistor to the internal integrated circuit chip or detect the corresponding impedance value to detect the shell temperature in real time like other electronic devices. The embodiment of the present application collects the ambient temperature through the thermistor in the terminal device, which can solve the problem that the headset cannot feedback the real-time temperature in the headset in real time and improve the detection accuracy of the ambient temperature.

[0028] Exemplarily, the terminal device periodically reads the NTC resistance of the thermistor (NTC resistor) and converts it through the NTC resistance corresponding table set by the software to obtain the ambient temperature. The NTC resistance corresponding table includes the corresponding relationship between the NTC resistance and the ambient temperature, and the NTC resistance corresponding table may be obtained according to the specification of the NTC resistor.

[0029] It is understandable that the embodiments of the present application may not be limited to collecting the ambient temperature through the thermistor in the terminal device, but may also use other detection methods to obtain the ambient temperature, for example, the ambient temperature may be obtained by a thermometer set in the same environment as the headset, or the ambient temperature may be obtained from a server through the terminal device.

[0030] In one embodiment, when it is detected that the headset starts working, the interval time between the current working and the last working of the headset is obtained; when the interval time is greater than or equal to the preset interval time, the ambient temperature is obtained as the initial shell temperature of the headset. In another embodiment, when it is detected that the headset starts working, the interval time between the current working and the last working of the headset is obtained; when the interval time is less than the preset interval time, the initial shell temperature of the headset is determined according to the interval time and the shell temperature of the headset when the last working ended.

[0031] The headset starting to work may refer to the headset starting to play audio, and the interval between the headset working this time and the last time may refer to the interval between the headset starting to play audio and the last time the headset finished playing audio. The preset interval time can be set according to actual conditions, and the preset interval time can be one minute, for example.

[0032] It should be noted that, when the interval time is greater than or equal to the preset interval time, the initial shell temperature of the earphone can be consistent with the ambient temperature, so the ambient temperature can be obtained as the initial shell temperature of the earphone. When the interval time is less than the preset interval time, the initial shell temperature of the earphone can be higher than the ambient temperature, so the initial shell temperature of the earphone can be determined based on the interval time and the shell temperature of the earphone when the last operation was completed.

[0033] Exemplarily, when the interval time is less than the preset interval time, the calculation method of the initial shell temperature can be determined by thermal simulation. For example, a correspondence table of the initial shell temperature of the earphones for different interval times and the shell temperature of the earphones when the work was last completed at different ambient temperatures is determined by thermal simulation. Then, based on the correspondence table and information such as the interval time obtained and the shell temperature of the earphones when the work was last completed, the initial shell temperature of the earphones is determined.

[0034] In one embodiment, the working parameters of the headset playing audio may include working hours and the playback volume corresponding to each working time. The working hours of the headset playing audio and the playback volume corresponding to each working time may be obtained at regular intervals. For example, the playback volume of the headset playing audio at the working hours at intervals of a preset time. In another embodiment, the working hours of the headset playing audio and the playback volume corresponding to each working time may be obtained in real time, and the embodiment of the present application does not specifically limit this.

[0035] Exemplarily, the working time of the audio decoder is read through the application chip in the terminal device, and the volume of each time period is obtained, so as to obtain the working time of the earphone playing audio and the playback volume corresponding to each working time as the working parameters of the earphone playing audio.

[0036] For example, Figure 2As shown, the terminal device 10 includes a thermistor 110, an application chip 120, a decoding chip 130 and a Bluetooth module 140. Among them, the thermistor 110 is arranged within the preset area of ​​the mainboard of the terminal device 10, and the resistance of the thermistor 110 changes with the change of the ambient temperature. The application chip 120 can obtain the resistance of the thermistor 110, and determine the ambient temperature of the current environment according to the resistance of the thermistor 110, thereby simulating the temperature of the Bluetooth headset body. The application chip 120 can also read the opening time of the music playback chip in the Bluetooth headset and the volume of each time period through the decoding chip 130. The decoding chip 130 also decodes audio files such as MP3, generates digital signals and sends them to the Bluetooth headset through the Bluetooth module 140.

[0037] It should be noted that, assuming that determining the initial housing temperature of the headset is taken as step one, and obtaining the working parameters of the headset playing audio is taken as step two, step one can be executed synchronously with step two, for example, by synchronously executing step one and step two through two threads, thereby improving the data processing speed. Step two can also be executed earlier or later than step one, and this embodiment of the application does not specifically limit this.

[0038] Step S102: determining the current shell temperature of the earphone according to the initial shell temperature and the operating parameters.

[0039] Among them, different initial shell temperatures and working parameters of the earphones have different effects on the current shell temperature of the earphones. For example, the higher the initial shell temperature, the longer the working time, and the louder the playback volume, the higher the current shell temperature of the earphones. Conversely, if the initial shell temperature is lower, the working time is shorter, and the playback volume is lower, the current shell temperature of the earphones will be lower. Therefore, according to the initial shell temperature, working time, and playback volume of the earphones, the current shell temperature of the earphones can be accurately determined.

[0040] In one embodiment, a mapping relationship table between the initial shell temperature, the working time, the playback volume and the current shell temperature of the earphone is determined through thermal simulation; the current shell temperature corresponding to the initial shell temperature, the working time and the playback volume is searched in the mapping relationship table, so that the current shell temperature of the earphone can be quickly and accurately known.

[0041] In one embodiment, if Figure 3 As shown, step S102 includes: sub-step S1021 to sub-step S1022.

[0042] Sub-step S1021, determining the shell temperature change data of the earphone according to the initial shell temperature, the working time and the playing volume.

[0043] It should be noted that, as the earphone works, the temperature of the earphone shell may increase. Therefore, the earphone shell temperature change data may be the earphone temperature rise value or temperature rise data.

[0044] In one embodiment, a built-in truth table is called, and the built-in truth table is obtained by setting different working times and playback volumes under multiple shell temperature environments of the earphone to detect different shell temperature change data; the shell temperature change data of the earphone is determined based on the built-in truth table, the initial shell temperature, the working time and the playback volume.

[0045] The multiple shell temperature environments may refer to environments where the earphone is in different shell temperatures, and the shell temperature of the earphone may be the same as or different from the ambient temperature. By searching the shell temperature change data corresponding to the initial shell temperature, the working time, and the playback volume in the built-in truth table, the shell temperature change data of the earphone can be accurately determined.

[0046] Exemplarily, the built-in truth table may include, for example, test data obtained by using mobile phone matching tests within the R&D department. For example, at an ambient temperature of 25°, the Bluetooth headset plays audio at the maximum volume for 30 minutes, and uses a thermal imager to detect the surface hot spots of the Bluetooth headset to find the 5 hottest points. Then use a thermocouple to monitor the 5 hot spots found previously in real time, and find the temperature rise value of the Bluetooth headset measured per minute at each volume level. By summarizing the corresponding temperature rise values ​​under multiple ambient temperatures, you can get the built-in truth table.

[0047] In one embodiment, the built-in truth table includes a first built-in truth table and a second built-in truth table; the first built-in truth table is generated when the earphone is worn, and the second built-in truth table is generated when the earphone is not worn; calling the built-in truth table includes: when it is detected that the earphone is worn, calling the first built-in truth table as the built-in truth table; when it is detected that the earphone is not worn, calling the second built-in truth table as the built-in truth table.

[0048] It should be noted that the earphone can be in a wearing state or an unworn state, so the built-in truth table may include a first built-in truth table generated when the earphone is worn, and a second built-in truth table generated when the earphone is not worn. When calling the built-in truth table, it is necessary to determine whether the earphone is in a wearing state or an unworn state. When it is detected that the earphone is worn, the first built-in truth table is called as the built-in truth table, and when it is detected that the earphone is not worn, the second built-in truth table is called as the built-in truth table, thereby ensuring the numerical accuracy of the called built-in truth table, which is conducive to accurately determining the shell temperature change data of the earphone.

[0049] Sub-step S1022: determining the current shell temperature of the earphone according to the initial shell temperature and the shell temperature change data.

[0050] It should be noted that after obtaining the earphone shell temperature change data, the current earphone shell temperature can be determined according to the earphone initial shell temperature and the earphone shell temperature change data. For example, the earphone initial shell temperature and the earphone shell temperature change data are added to obtain the earphone shell temperature.

[0051] In one embodiment, the initial shell temperature and the shell temperature change data are input into a preset shell temperature calculation formula to obtain the current shell temperature of the earphone. The shell temperature calculation formula can be set according to actual conditions, and the embodiment of the present application does not specifically limit this.

[0052] For example, the terminal device obtains that the playback volume of the earphone is continuously 60%. After every 1 minute, the terminal device will call the temperature rise data corresponding to the 60% volume in the built-in truth table, and then add the obtained temperature rise data to the earphone shell temperature of the previous minute, to simulate the current shell temperature of the earphone in real time.

[0053] For example, the terminal device obtains that the playback volume of the earphone is 60%, and after an interval of 1 minute, the playback volume of the earphone is 80%. The terminal device will call the temperature rise data corresponding to the 60% volume in the first minute in the built-in truth table, and then obtain the temperature rise data corresponding to the 80% volume after 1 minute. The initial shell temperature of the earphone and each temperature rise data are accumulated according to the interval time, so as to accurately simulate the current shell temperature of the earphone.

[0054] Step S103: adjusting the volume of the audio played by the earphone according to the current shell temperature.

[0055] After determining the current shell temperature of the earphone, the playback volume of the audio played by the earphone is adjusted according to the current shell temperature. In extreme scenarios, such as when the earphone plays audio at a high volume for a long time, the user will not experience abnormal heating of the earphone, while in normal scenarios, the audio loudness of the earphone will not be sacrificed, thereby avoiding burns to the skin when wearing the earphone.

[0056] In one embodiment, when the current shell temperature is greater than or equal to the first temperature threshold, the playback volume of the audio played by the earphone is adjusted to the first target playback volume; wherein the current shell temperature of the earphone remains unchanged at the first target playback volume. The first temperature threshold and the first target playback volume can be set according to actual conditions. The first target playback volume can be determined, for example, according to the initial shell temperature of the earphone, and the higher the initial shell temperature, the lower the first target playback volume. The first temperature threshold is, for example, 44 degrees, and the first target playback volume is, for example, 40%.

[0057] It should be noted that the first temperature threshold and the first target playback volume can be obtained according to the aforementioned built-in truth table, for example, the playback volume at which the shell temperature of the earphone remains unchanged is determined from the first built-in truth table or the second built-in truth table as the first target playback volume. Under different ambient temperatures, the playback volume corresponding to the current shell temperature of the earphone remaining unchanged may be different, and the playback volume can also be obtained by testing at different ambient temperatures through thermocouple lines. For example, if the ambient temperature is 25 degrees, the playback volume is below 60% and the current shell temperature of the earphone remains unchanged. If the ambient temperature is 30 degrees, the playback volume is below 40% and the current shell temperature of the earphone remains unchanged.

[0058] In one embodiment, when the current shell temperature is greater than or equal to the second temperature threshold, the playback volume of the audio played by the earphone is adjusted to the second target playback volume; wherein the current shell temperature of the earphone decreases at the second target playback volume. The second temperature threshold may be greater than the first temperature threshold, and the second target playback volume may be less than the first target playback volume. The second temperature threshold and the second target playback volume may be set according to actual conditions. The second target playback volume may be determined, for example, based on the initial shell temperature of the earphone, and the higher the initial shell temperature, the lower the second target playback volume. The second temperature threshold is, for example, 48 degrees, and the second target playback volume is, for example, 30%.

[0059] It should be noted that the second temperature threshold and the second target playback volume can be obtained based on the aforementioned built-in truth table, such as determining the playback volume at which the shell temperature of the earphone drops from the first built-in truth table or the second built-in truth table as the second target playback volume. Under different ambient temperatures, the playback volume corresponding to the drop in the current shell temperature of the earphone may be different, and the playback volume can also be obtained by testing at different ambient temperatures using thermocouple wires. For example, if the ambient temperature is 25 degrees, the playback volume is below 40% when the current shell temperature of the earphone drops. If the ambient temperature is 30 degrees, the playback volume is below 35% when the current shell temperature of the earphone drops.

[0060] In one embodiment, when the current shell temperature is greater than or equal to the first temperature threshold, the volume of the audio played by the earphone is adjusted to the first target volume; when the current shell temperature is greater than or equal to the second temperature threshold, the volume of the audio played by the earphone is adjusted to the second target volume. The second temperature threshold is greater than the first temperature threshold, the second target volume is less than the first target volume, and the current shell temperature of the earphone decreases at the second target volume.

[0061] It should be noted that, when the current shell temperature is greater than or equal to the first temperature threshold, the terminal device can automatically adjust the playback volume of the audio played by the headset to the first target playback volume. However, the user can manually adjust the playback volume on this basis, for example, adjusting the playback volume of the headset to a volume greater than the first target playback volume, thereby causing the headset to continue to heat up until the current shell temperature of the headset is greater than or equal to the second temperature threshold. When the current shell temperature is greater than or equal to the second temperature threshold, the terminal device can automatically adjust the playback volume of the audio played by the headset to the second target playback volume, so that the current shell temperature of the headset at the second target playback volume decreases, reducing the risk of burns that may occur in the headset.

[0062] Exemplarily, the first temperature threshold is, for example, 44 degrees, the second temperature threshold is, for example, 48 degrees, the first target playback volume is 50%, and the second target playback volume is 40%. When the terminal device detects that the current shell temperature of the headset is greater than or equal to the first temperature threshold of 44 degrees, it adjusts the playback volume of the headset from the current 70% to 50% of the first target playback volume, and the current shell temperature of the headset at the first target playback volume of 50% remains unchanged. However, as the user manually adjusts the playback volume of the headset or for other reasons, the headset continues to heat up to the second temperature threshold of 48 degrees. At this time, the terminal device adjusts the playback volume of the audio played by the headset to 40% of the second target playback volume, and the current shell temperature of the headset at the second target playback volume of 40% decreases.

[0063] In one embodiment, after adjusting the playback volume of the audio played by the earphone to the second target playback volume, it also includes: when the current shell temperature is greater than or equal to the second temperature threshold, adjusting the playback volume of the audio played by the earphone to the second target playback volume; when the current shell temperature is between the third temperature threshold and the second temperature threshold, adjusting the playback volume of the audio played by the earphone to the third target playback volume. Wherein, the rate of decrease of the current shell temperature of the earphone at the third target playback volume is lower than the rate of decrease of the current shell temperature of the earphone at the second target playback volume. Wherein, the third temperature threshold may be the same as or different from the first temperature threshold. The third target playback volume may be between the second target playback volume and the first target playback volume, and the third target playback volume may be set according to actual conditions, and the third target playback volume may be inversely proportional to the initial shell temperature of the earphone, such as the third target playback volume is, for example, 30%.

[0064] It should be noted that, when the current shell temperature is greater than or equal to the second temperature threshold, the terminal device can automatically adjust the playback volume of the audio played by the headset to the second target playback volume to reduce the current shell temperature of the headset. When the current shell temperature of the headset drops to between the third temperature threshold and the second temperature threshold, the terminal device can automatically adjust the playback volume of the audio played by the headset to the third target playback volume, so that the current shell temperature of the headset continues to drop at the third target playback volume, but the third target playback volume at this time is higher than the second target playback volume, thereby reducing the risk of burns that may occur in the headset while ensuring that the volume of the audio played by the headset is not too low.

[0065] Exemplarily, when the current shell temperature is greater than or equal to the first temperature threshold, the volume of the audio played by the earphone is adjusted to the first target volume; when the current shell temperature is greater than or equal to the second temperature threshold, the volume of the audio played by the earphone is adjusted to the second target volume; when the current shell temperature is between the first temperature threshold and the second temperature threshold, the volume of the audio played by the earphone is adjusted to the third target volume. The third target volume is between the second target volume and the first target volume, and the rate of decrease of the current shell temperature of the earphone at the third target volume is lower than the rate of decrease of the current shell temperature of the earphone at the second target volume.

[0066] It should be noted that, when the current shell temperature is greater than or equal to the first temperature threshold, the playback volume of the audio played by the headset is adjusted to the first target playback volume. If the user continues to increase the volume of the headset at this time, when the current shell temperature is greater than or equal to the second temperature threshold, the terminal device can automatically adjust the playback volume of the audio played by the headset to the second target playback volume, in the hope of lowering the current shell temperature of the headset. When the current shell temperature of the headset drops, that is, when it is between the first temperature threshold and the second temperature threshold, the terminal device can adjust the playback volume of the audio played by the headset to the third target playback volume, thereby slowing down the rate of decrease of the current shell temperature, while reducing the risk of burns that may occur in the headset, it can also ensure that the volume of the audio played by the headset is not too low.

[0067] In one embodiment, after adjusting the playback volume of the audio played by the headset to the third target playback volume, it also includes: when the current shell temperature is less than the first temperature threshold, adjusting the playback volume of the audio played by the headset to the first target playback volume. It should be noted that after adjusting the playback volume of the audio played by the headset to the third target playback volume, the current shell temperature of the headset may drop. When the current shell temperature drops to less than the first temperature threshold, the terminal device can adjust the playback volume of the audio played by the headset to the first target playback volume. At this time, burns will not occur, and the user experience of the headset playing audio can be guaranteed.

[0068] In one embodiment, when it is detected that the earphone is not playing audio, the step of adjusting the playback volume of the audio played by the earphone according to the current shell temperature is stopped. It should be noted that if it is detected that the earphone is not playing audio, the earphone will not continue to generate heat, so the earphone shell will not continue to heat up, and then the step of adjusting the playback volume of the audio played by the earphone according to the current shell temperature can be stopped, and there is no need to adjust the playback volume of the audio played by the earphone.

[0069] Please refer to Figure 4 , Figure 4 A schematic diagram of a scenario for implementing the earphone temperature control method provided in an embodiment of the present application, such as Figure 4 As shown, the terminal device 10 collects the ambient temperature of the current environment through a thermistor to obtain the initial shell temperature of the earphone 20; the terminal device 10 reads the working time of the earphone 20 playing audio and the playback volume corresponding to each working time through a decoding chip; the terminal device 10 then determines the current shell temperature of the earphone 20 according to the initial shell temperature, working time and playback volume of the earphone 20, and finally adjusts the playback volume of the audio played by the earphone 20 according to the current shell temperature of the earphone 20.

[0070] The earphone temperature control method provided in the above embodiment determines the initial shell temperature of the earphone and obtains the working parameters of the earphone for playing audio; determines the current shell temperature of the earphone according to the initial shell temperature and the working parameters; and adjusts the volume of the audio played by the earphone according to the current shell temperature. The embodiment of the present application can dynamically adjust the volume of the earphone according to the initial shell temperature and the working parameters of the earphone during the use of the earphone, thereby reducing the heating of the earphone and avoiding the risk of burns caused by overheating of the earphone.

[0071] See also Figure 5 , Figure 5 A schematic block diagram of a terminal device provided in an embodiment of the present application.

[0072] like Figure 5As shown, the terminal device 300 includes a processor 301 and a memory 302, and the processor 301 and the memory 302 are connected via a bus 303, such as an I2C (Inter-integrated Circuit) bus.

[0073] Specifically, the processor 301 is used to provide computing and control capabilities to support the operation of the entire terminal device. The processor 301 can be a central processing unit (CPU), and the processor 301 can also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, etc. Among them, the general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc.

[0074] Specifically, the memory 302 may be a Flash chip, a read-only memory (ROM) disk, an optical disk, a USB flash drive, or a mobile hard disk.

[0075] Those skilled in the art will understand that Figure 5 The structure shown in the figure is merely a block diagram of a partial structure related to the embodiments of the present application, and does not constitute a limitation on the terminal device to which the embodiments of the present application are applied. The specific terminal device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0076] The processor is used to run a computer program stored in the memory, and implement any one of the earphone temperature control methods provided in the embodiments of the present application when executing the computer program.

[0077] In one embodiment, the processor is used to run a computer program stored in the memory, and implements the following steps when executing the computer program:

[0078] Determining an initial housing temperature of the earphone, and obtaining working parameters of the earphone for playing audio;

[0079] Determining a current shell temperature of the headset according to the initial shell temperature and the operating parameter;

[0080] The volume of the audio played by the earphone is adjusted according to the current shell temperature.

[0081] In one embodiment, when implementing the determining of the initial housing temperature of the earphone, the processor is configured to implement:

[0082] Acquire the ambient temperature, and use the ambient temperature as the initial shell temperature of the earphone.

[0083] In one embodiment, when the processor implements the acquiring of the ambient temperature, it is used to implement:

[0084] The ambient temperature is collected by a thermistor in a terminal device, and the terminal device is communicatively connected with the earphone.

[0085] In one embodiment, when implementing the determining of the initial housing temperature of the earphone, the processor is configured to implement:

[0086] When it is detected that the headset starts to work, obtaining the interval between the current work and the last work of the headset;

[0087] When the interval time is greater than or equal to the preset interval time, obtaining the ambient temperature as the initial housing temperature of the earphone; or

[0088] In the case that the interval time is less than the preset interval time, the initial shell temperature of the earphone is determined according to the interval time and the shell temperature of the earphone when the operation is ended last time.

[0089] In one embodiment, the operating parameters include operating time and playback volume; when the processor determines the current shell temperature of the headset according to the initial shell temperature and the operating parameters, it is configured to implement:

[0090] Determining shell temperature change data of the earphone according to the initial shell temperature, the working time and the playing volume;

[0091] The current shell temperature of the earphone is determined according to the initial shell temperature and the shell temperature change data.

[0092] In one embodiment, when the processor determines the housing temperature change data of the headset according to the initial housing temperature, the working time, and the playback volume, it is configured to implement:

[0093] Calling a built-in truth table, wherein the built-in truth table is obtained by setting different working times and playing volumes under multiple shell temperature environments of the headset to detect different shell temperature change data;

[0094] The shell temperature change data of the earphone is determined according to the built-in truth table, the initial shell temperature, the working time and the playing volume.

[0095] In one embodiment, the built-in truth table includes a first built-in truth table and a second built-in truth table; the first built-in truth table is generated when the headset is worn, and the second built-in truth table is generated when the headset is not worn; when the processor implements the calling of the built-in truth table, it is used to implement:

[0096] In a case where it is detected that the headset is being worn, calling the first built-in truth table as the built-in truth table;

[0097] In a case where it is detected that the earphone is not worn, the second built-in truth table is called as the built-in truth table.

[0098] In one embodiment, when the processor adjusts the volume of the audio played by the headset according to the current housing temperature, it is configured to implement:

[0099] When the current shell temperature is greater than or equal to a first temperature threshold, the playback volume of the audio played by the earphone is adjusted to a first target playback volume; wherein the current shell temperature of the earphone remains unchanged at the first target playback volume.

[0100] In one embodiment, when the processor adjusts the volume of the audio played by the earphone according to the current housing temperature, it is configured to implement:

[0101] When the current shell temperature is greater than or equal to the second temperature threshold, the playback volume of the audio played by the earphone is adjusted to a second target playback volume; wherein the current shell temperature of the earphone decreases at the second target playback volume.

[0102] In one embodiment, after implementing the step of adjusting the playback volume of the audio played by the headset to the second target playback volume, the processor is further configured to implement:

[0103] When the current shell temperature is between a third temperature threshold and the second temperature threshold, the playback volume of the audio played by the earphone is adjusted to a third target playback volume; wherein a decreasing speed of the current shell temperature of the earphone at the third target playback volume is lower than a decreasing speed of the current shell temperature of the earphone at the second target playback volume.

[0104] It should be noted that those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the terminal device described above can refer to the corresponding process in the aforementioned embodiment of the temperature control method of the earphone, and will not be repeated here.

[0105] An embodiment of the present application also provides a storage medium for computer-readable storage, wherein the storage medium stores one or more programs, and the one or more programs can be executed by one or more processors to implement the steps of any temperature control method of headphones provided in the embodiment of the present application.

[0106] The storage medium may be an internal storage unit of the terminal device described in the foregoing embodiment, such as a hard disk or memory of the terminal device. The storage medium may also be an external storage device of the terminal device, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (SecureDigital, SD) card, a flash card (Flash Card), etc., equipped on the terminal device.

[0107] It will be appreciated by those skilled in the art that all or some of the steps, systems, and functional modules / units in the methods disclosed above may be implemented as software, firmware, hardware, and appropriate combinations thereof. In hardware implementations, the division between the functional modules / units mentioned in the above description does not necessarily correspond to the division of physical components; for example, a physical component may have multiple functions, or a function or step may be performed by several physical components in cooperation. Some or all physical components may be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or implemented as hardware, or implemented as an integrated circuit, such as an application-specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium (or non-transitory medium) and a communication medium (or temporary medium). As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to store the desired information and can be accessed by a computer. In addition, it is well known to those of ordinary skill in the art that communication media typically contain computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0108] The serial numbers of the embodiments of the present application are for description only and do not represent the advantages and disadvantages of the embodiments. The above description is only a specific implementation mode of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A method for controlling the temperature of an earphone, characterized in that: include: Determining an initial housing temperature of the earphone, and obtaining working parameters of the earphone for playing audio; Determining a current shell temperature of the headset according to the initial shell temperature and the operating parameter; The volume of the audio played by the earphone is adjusted according to the current shell temperature.

2. The temperature control method according to claim 1, characterized in that: The determining the initial housing temperature of the earphone comprises: Acquire the ambient temperature, and use the ambient temperature as the initial shell temperature of the earphone.

3. The temperature control method according to claim 2, characterized in that: The obtaining of the ambient temperature comprises: The ambient temperature is collected by a thermistor in a terminal device, and the terminal device is communicatively connected with the earphone.

4. The temperature control method according to claim 1, characterized in that: The determining the initial housing temperature of the earphone comprises: When it is detected that the headset starts to work, obtaining the interval between the current work and the last work of the headset; When the interval time is greater than or equal to the preset interval time, obtaining the ambient temperature as the initial housing temperature of the earphone; or In the case that the interval time is less than the preset interval time, the initial shell temperature of the earphone is determined according to the interval time and the shell temperature of the earphone when the operation is ended last time.

5. The temperature control method according to claim 1, characterized in that: The working parameters include working time and playback volume; and determining the current shell temperature of the headset according to the initial shell temperature and the working parameters includes: Determining shell temperature change data of the earphone according to the initial shell temperature, the working time and the playing volume; The current shell temperature of the earphone is determined according to the initial shell temperature and the shell temperature change data.

6. The temperature control method according to claim 5, characterized in that: The determining, according to the initial shell temperature, the working time, and the playing volume, the shell temperature change data of the earphone includes: Calling a built-in truth table, wherein the built-in truth table is obtained by setting different working times and playing volumes under multiple shell temperature environments of the headset to detect different shell temperature change data; The shell temperature change data of the earphone is determined according to the built-in truth table, the initial shell temperature, the working time and the playing volume.

7. The temperature control method according to claim 6, characterized in that: The built-in truth table includes a first built-in truth table and a second built-in truth table; the first built-in truth table is generated when the headset is worn, and the second built-in truth table is generated when the headset is not worn; The calling of the built-in truth table includes: In a case where it is detected that the headset is being worn, calling the first built-in truth table as the built-in truth table; In a case where it is detected that the earphone is not worn, the second built-in truth table is called as the built-in truth table.

8. The temperature control method according to any one of claims 1 to 7, characterized in that: The step of adjusting the volume of the audio played by the earphone according to the current shell temperature includes: When the current shell temperature is greater than or equal to a first temperature threshold, the playback volume of the audio played by the earphone is adjusted to a first target playback volume; wherein the current shell temperature of the earphone remains unchanged at the first target playback volume.

9. The temperature control method according to any one of claims 1 to 7, characterized in that: The step of adjusting the volume of the audio played by the earphone according to the current shell temperature includes: When the current shell temperature is greater than or equal to the second temperature threshold, the playback volume of the audio played by the earphone is adjusted to a second target playback volume; wherein the current shell temperature of the earphone decreases at the second target playback volume.

10. The temperature control method according to claim 9, characterized in that: After adjusting the playback volume of the audio played by the earphone to the second target playback volume, the method further includes: When the current shell temperature is between a third temperature threshold and the second temperature threshold, the playback volume of the audio played by the earphone is adjusted to a third target playback volume; wherein a decreasing speed of the current shell temperature of the earphone at the third target playback volume is lower than a decreasing speed of the current shell temperature of the earphone at the second target playback volume.

11. A terminal device, characterized in that: The terminal device is communicatively connected to the earphone; the terminal device includes a processor, a memory, a computer program stored in the memory and executable by the processor, and a data bus for realizing connection and communication between the processor and the memory, wherein when the computer program is executed by the processor, the temperature control method as described in any one of claims 1 to 10 is realized.

12. A storage medium for computer-readable storage, characterized in that: The storage medium stores one or more programs, and the one or more programs can be executed by one or more processors to implement the temperature control method according to any one of claims 1 to 10.

Images