Glue type selection method, system and equipment and medium thereof

Abstract

The invention relates to the technical field of base material bonding, in particular to a glue type selection method, system and equipment and a medium thereof. The method comprises the following steps: S1, determining a target assembly type corresponding to a glue using demand based on the glue using demand; s2, determining a glue type corresponding to the glue use demand in the target assembly type; s3, determining a requirement corresponding to the target glue in the glue type; and S4, matching the requirements with glue requirements in a database, and determining product information of target glue meeting the glue using requirements. According to the glue type selection method provided by the invention, the glue can be selected quickly and accurately.

Description

Technical Field

[0001] The invention relates to the technical field of substrate bonding, and in particular to a glue selection method, system, equipment and medium thereof. Background Art

[0002] In the field of electronics and electrical appliances, the current selection of glue is mainly recommended by engineers and glue suppliers. The specific process is that process engineers and glue suppliers select a specific type of glue based on the usage scenario and specific functional requirements, and then check the various technical parameters of the glue one by one to analyze whether it can meet the new functional requirements. However, this method has many disadvantages, mainly the following:

[0003] (1) Differences in levels: Different engineers and suppliers have different actual glue application experiences, resulting in uneven glue selection levels.

[0004] (2) Error-prone. The manual selection process is prone to errors, which may affect the quality of subsequent glue use.

[0005] (3) Low efficiency. The process of checking technical indicators one by one is time-consuming and labor-intensive, and the selection efficiency is low. Summary of the invention

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art.

[0007] To this end, the present invention provides a glue selection method, which can select glue quickly and accurately.

[0008] According to the glue selection method of the embodiment of the present invention, the method comprises the following steps:

[0009] S1, determining a target assembly type corresponding to the glue requirement based on the glue requirement;

[0010] S2, determining the glue type corresponding to the glue requirement within the target assembly type;

[0011] S3, determining the requirements corresponding to the target glue within the glue type;

[0012] S4, matching the requirement with the glue requirement in the database, and determining the product information of the target glue that meets the glue requirement.

[0013] The beneficial effect of the present invention is that the glue selection method of the present invention can quickly and accurately select glue according to glue usage requirements, reduce manual participation, reduce selection costs, avoid inconsistent selection results due to manual differences, and ensure the stability of product quality. In addition, the database set up integrates a large amount of glue data and experience to provide users with more comprehensive and accurate selection suggestions, which can better meet the needs of industry development.

[0014] According to one embodiment of the present invention, the target assembly types in step S1 include sealing and locking, structural bonding, sealing, potting and packaging, and functional coating.

[0015] According to one embodiment of the present invention, the types of glue used for sealing and locking include: thread locking sealant, pipe thread sealant, cylindrical retaining sealant and flat sealant;

[0016] The types of glue for structural bonding include structural adhesive, hot melt adhesive and UV curing adhesive;

[0017] The types of glue used for sealing include sealant and hot melt adhesive;

[0018] The types of glue used for potting include potting glue, hot melt glue and UV curing glue;.

[0019] According to one embodiment of the present invention, the requirements corresponding to the target glue in step S3 include one or more combinations of glue bonding strength, oil tolerance, process requirements, temperature resistance, process performance, adhesive materials, use environment, glue performance, melting temperature, color, thermal conductivity, flame retardancy, fluidity, filling gap, easy disassembly, aging resistance and glue hardness.

[0020] According to an embodiment of the present invention, the glue requirement includes functional parameter information of the glue;

[0021] Determining the requirements corresponding to the target glue in the glue type specifically includes: filling the functional parameter information of the glue into the corresponding requirements.

[0022] According to one embodiment of the present invention, the step S4 specifically includes: matching the functional parameter information of the required internal glue with the glue requirements in the database, determining whether there is product information of the target glue that meets the functional parameter information of the required internal glue in the database, and outputting it in the form of a list;

[0023] The product information of the target glue includes: brand, model, color, operating temperature range, viscosity, curing time, hardness and typical uses.

[0024] A glue selection system, the system comprising:

[0025] A first determining unit, which determines a target assembly type corresponding to the glue requirement based on the glue requirement;

[0026] A second determination unit, determining a glue type corresponding to the glue requirement within the target assembly type;

[0027] a third determining unit, determining requirements corresponding to a target glue within the glue type;

[0028] The matching and output unit matches the requirement with the glue requirement in the database, and determines the product information of the target glue that meets the glue requirement.

[0029] A computer device comprising:

[0030] processor;

[0031] A memory for storing executable instructions;

[0032] Wherein, the processor is used to read the executable instructions from the memory and execute the executable instructions to implement the glue selection method as described above.

[0033] A computer-readable storage medium stores a computer program. When the computer program is executed by a processor, the processor implements the glue selection method as described above.

[0034] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0035] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0037] Figure 1 It is a schematic diagram of the method flow of embodiment 1 of the present invention.

[0038] Figure 2 It is a schematic diagram of the glue result of the target glue product of Example 1 of the present invention.

[0039] Figure 3 It is a schematic diagram of the system structure of the second embodiment of the present invention.

[0040] Figure 4 It is a structural diagram of a computer device according to Embodiment 3 of the present invention.

[0041] In the figure, 20 is a first determination unit; 21 is a second determination unit; 23 is a third determination unit; 24 is a matching and output unit; 10 is a computer device; 1002 is a processor; 1004 is a memory; and 1006 is a transmission device. DETAILED DESCRIPTION

[0042] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0043] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0044] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] Example 1

[0046] The present application embodiment provides a method for selecting glue. Figure 1 As shown, the method comprises the following steps:

[0047] S1, determining a target assembly type corresponding to the glue requirement based on the glue requirement;

[0048] S2, determining the glue type corresponding to the glue requirement within the target assembly type;

[0049] S3, determining the requirements corresponding to the target glue within the glue type;

[0050] S4, matching the requirements with the glue requirements in the database, and determining the product information of the target glue that meets the glue requirements.

[0051] In an embodiment, the target assembly types in step S1 include sealing and locking, structural bonding, sealing, potting, and functional coating.

[0052] In the embodiment, different assembly types have different glue types, such as sealing and locking glue types include: thread locking sealant, pipe thread sealant, cylindrical retaining glue and flat sealant; structural bonding glue types include structural glue, hot melt glue and UV curing glue; sealing glue types include sealant and hot melt glue; potting glue types include potting glue, hot melt glue and UV curing glue;.

[0053] In an embodiment, the requirements corresponding to the target glue in step S3 include one or more combinations of glue bonding strength, oil tolerance, process requirements, temperature resistance, process performance, adhesive materials, use environment, glue performance, melting temperature, color, thermal conductivity, flame retardancy, fluidity, filling gap, easy disassembly, aging resistance and glue hardness.

[0054] Specifically, for example, the requirements for thread locking sealants must fully consider the glue bonding strength (glue bonding strength includes low strength, medium strength, and high strength). Among them, medium strength also needs to consider oil tolerance, and high strength needs to consider process requirements (such as whether pre-assembly is required) and temperature resistance.

[0055] The requirements for pipe thread sealants must take into account process requirements, such as whether it needs to be easily disassembled. If it cannot be disassembled, then distinguish between coarse threads and fine threads. If it is a coarse thread, temperature resistance must also be considered.

[0056] The requirements for cylindrical retaining glue must take into account the process requirements, such as whether it needs to be easily disassembled. If not, temperature resistance and clearance must also be considered.

[0057] The requirements for flat sealants should consider flexibility or rigidity. When choosing rigidity, temperature resistance should also be considered.

[0058] The requirements for structural adhesives must fully consider the bonding materials, use environment, and glue properties. The bonding materials are divided into bonding parts A and B. The use environment considers the use temperature and load type. The glue properties include color, hardness, fluidity, solvent resistance, and curing time.

[0059] The requirements for hot melt adhesives for structural bonding must fully consider the bonding material, melting temperature, and temperature resistance. The bonding material is divided into bonding parts A and B, the melting temperature is divided into low melting point and high melting point, and the temperature resistance includes low temperature, medium temperature, and high temperature.

[0060] The requirements for UV curing adhesives for structural bonding must fully consider the bonding material, color, and temperature resistance. The bonding material is divided into bonding parts A and B, and at least one of A and B is transparent.

[0061] The requirements for sealants should fully consider the bonding material, color, temperature resistance, fluidity, and thermal conductivity. The fluidity can be divided into flowing, semi-flowing, and paste.

[0062] The requirements for hot melt adhesives are similar to those for structural bonding and are not described here for the sake of brevity.

[0063] The requirements for potting glue should take into account temperature resistance, thermal conductivity, flame retardancy, color and glue hardness.

[0064] The requirements for hot melt adhesive for potting are basically the same as those for hot melt adhesive for structural bonding. The difference is that the bonding material of hot melt adhesive for potting is one type, and the rest are the same.

[0065] The requirements for UV curing adhesive for potting and UV curing adhesive for structural bonding are basically the same. The only difference is that the bonding material is one type, and the rest are the same.

[0066] In an embodiment, the glue usage requirement includes functional parameter information of the glue;

[0067] Determining the requirements corresponding to the target glue within the glue type specifically includes: filling the functional parameter information of the glue into the corresponding requirements.

[0068] In an embodiment, step S4 specifically includes: matching the functional parameter information of the required internal glue with the glue requirements in the database, determining whether there is product information of the target glue that meets the functional parameter information of the required internal glue in the database, and outputting it in the form of a list; wherein the product information of the target glue includes: brand, model, color, operating temperature range, hardness and typical uses.

[0069] Specifically, taking potting glue as an example, the functional parameter information of the glue is that the temperature resistance must be greater than 100°C, the hardness of the glue is soft, it has no thermal conductivity, no flame retardancy, and the color is black. Filling the functional parameter information of the glue into the corresponding requirements will directly match the glue requirements in the database, and the target glue product glue obtained can be found in Figure 2 As shown in the table below, the query will be output in a list format.

[0070] Table 1

[0071]

[0072] To sum up, the glue selection method of the present invention can quickly and accurately select glue according to glue demand, reduce manual participation, reduce selection costs, avoid inconsistent selection results due to manual differences, and ensure the stability of product quality. In addition, the database set up integrates a large amount of glue data and experience to provide users with more comprehensive and accurate selection suggestions, which can better meet the needs of industry development.

[0073] Example 2

[0074] Based on the same inventive concept as the glue selection method in the aforementioned embodiment, the present application embodiment provides a glue selection system, such as Figure 3 As shown, the system includes:

[0075] A first determining unit 20 determines a target assembly type corresponding to the glue requirement based on the glue requirement;

[0076] A second determination unit 21 determines the glue type corresponding to the glue requirement within the target assembly type;

[0077] A third determining unit 22 determines the requirements corresponding to the target glue within the glue type;

[0078] The matching and output unit 23 matches the requirement with the glue requirement in the database, and determines the product information of the target glue that meets the glue requirement.

[0079] The foregoing Figure 1 The various variations and specific examples of a glue selection method in Example 1 are also applicable to a glue selection device in this embodiment. Through the above detailed description of a glue selection method, those skilled in the art can clearly know the implementation method of a glue selection device in this embodiment, so for the sake of brevity of the specification, it will not be described in detail here.

[0080] Example 3

[0081] An embodiment of the present application provides a computer device, which includes a processor and a memory, wherein the memory stores at least one instruction or at least one program, and the at least one instruction or the at least one program is loaded and executed by the processor to implement a glue selection method provided in the above method embodiment.

[0082] Figure 4 The hardware structure diagram of a device for implementing a method for selecting glue provided in an embodiment of the present application is shown. The device may participate in or include the apparatus or system provided in an embodiment of the present application. Figure 4As shown, the computer device 10 may include one or more processors 1002 (the processor may include but is not limited to a processing device such as a microprocessor MCU or a programmable logic device FPGA), a memory 1004 for storing data, and a transmission device 1006 for communication functions. In addition, it may also include: a display, an input / output interface (I / O interface), a universal serial bus (USB) port (which may be included as one of the ports of the I / O interface), a network interface, a power supply and / or a camera. It can be understood by those skilled in the art that Figure 4 The structure shown is only for illustration and does not limit the structure of the above electronic device. Figure 4 More or fewer components as shown, or with Figure 4 Different configurations are shown.

[0083] It should be noted that the one or more processors and / or other data processing circuits described above may generally be referred to herein as "data processing circuits". The data processing circuits may be embodied in whole or in part as software, hardware, firmware, or any other combination thereof. In addition, the data processing circuit may be a single independent processing module, or may be incorporated in whole or in part into any of the other components in the computer device 10 (or mobile device). As described in the embodiments of the present application, the data processing circuit acts as a processor control (e.g., selection of a variable resistor terminal path connected to an interface).

[0084] The memory 1004 can be used to store software programs and modules of application software, such as a program instruction / data storage device corresponding to a method for selecting glue in an embodiment of the present application. The processor executes various functional applications and data processing by running the software programs and modules stored in the memory 1004, that is, implementing the above-mentioned method. The memory 1004 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 1004 may further include a memory remotely arranged relative to the processor, and these remote memories may be connected to the computer device 10 via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0085] The transmission device 1006 is used to receive or send data via a network. The specific example of the above network may include a wireless network provided by a communication provider of the computer device 10. In one example, the transmission device 1006 includes a network adapter (Network Interface Controller, NIC), which can be connected to other network devices through a base station so as to communicate with the Internet. In one example, the transmission device 1006 can be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0086] The display may be, for example, a touch screen liquid crystal display (LCD) that enables a user to interact with a user interface of the computer device 10 (or mobile device).

[0087] Example 4

[0088] An embodiment of the present application also provides a computer-readable storage medium, which can be set in a server to store at least one instruction or at least one program related to a glue selection method in a method embodiment. The at least one instruction or the at least one program is loaded and executed by the processor to implement a glue selection method provided in the above method embodiment.

[0089] Optionally, in this embodiment, the storage medium may be located in at least one of the multiple network servers of the computer network. Optionally, in this embodiment, the storage medium may include, but is not limited to, various media that can store program codes, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk, or an optical disk.

[0090] Example 5

[0091] The embodiment of the present invention further provides a computer program product or a computer program, which includes computer instructions stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device executes a method for selecting glue provided in the above various optional embodiments.

[0092] It should be noted that the above-mentioned sequence of the embodiments of the present application is only for description and does not represent the advantages and disadvantages of the embodiments. And the above-mentioned specific embodiments of the present application are described. Other embodiments are within the scope of the attached claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0093] Each embodiment in this application is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the device, equipment and storage medium embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0094] A person skilled in the art will understand that all or part of the steps to implement the above embodiments may be accomplished by hardware or by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium, and the above-mentioned storage medium may be a read-only memory, a disk or an optical disk, etc.

[0095] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A method for selecting glue, characterized in that: The method comprises the following steps: S1, determining a target assembly type corresponding to the glue requirement based on the glue requirement; S2, determining the glue type corresponding to the glue requirement within the target assembly type; S3, determining the requirements corresponding to the target glue within the glue type; S4, matching the requirement with the glue requirement in the database, and determining the product information of the target glue that meets the glue requirement.

2. The method for selecting glue according to claim 1, characterized in that: The target assembly types in step S1 include sealing and locking, structural bonding, sealing, potting and packaging, and functional coating.

3. The glue selection method according to claim 2, characterized in that: The types of glue used for sealing and locking include: thread locking sealant, pipe thread sealant, cylindrical retaining sealant and flat sealant; The types of glue for structural bonding include structural adhesive, hot melt adhesive and UV curing adhesive; The types of glue used for sealing include sealant and hot melt adhesive; The glue types for the potting package include potting glue, hot melt glue and UV curing glue.

4. The method for selecting glue according to claim 1, characterized in that: The requirements corresponding to the target glue in step S3 include one or more combinations of glue bonding strength, oil tolerance, process requirements, temperature resistance, process performance, adhesive materials, use environment, glue performance, melting temperature, color, thermal conductivity, flame retardancy, flowability, gap filling, easy disassembly, aging resistance and glue hardness.

5. The method for selecting glue according to claim 4, characterized in that: The glue usage requirement includes functional parameter information of the glue; Determining the requirements corresponding to the target glue in the glue type specifically includes: filling the functional parameter information of the glue into the corresponding requirements.

6. The method for selecting glue according to claim 5, characterized in that: The step S4 specifically includes: matching the functional parameter information of the required internal glue with the glue requirements in the database, determining whether there is product information of the target glue that meets the functional parameter information of the required internal glue in the database, and outputting it in the form of a list; The product information of the target glue includes: brand, model, color, operating temperature range, viscosity, curing time, hardness and typical uses.

7. A glue selection system, characterized in that: The system comprises: A first determining unit (20) determines a target assembly type corresponding to the glue requirement based on the glue requirement; A second determination unit (21) determines the glue type corresponding to the glue requirement within the target assembly type; A third determining unit (22) determines the requirements corresponding to the target glue within the glue type; A matching and output unit (23) matches the requirement with the glue requirement in the database to determine product information of the target glue that meets the glue requirement.

8. A computer device, characterized in that: include: processor; A memory for storing executable instructions; Wherein, the processor is used to read the executable instructions from the memory and execute the executable instructions to implement the glue selection method as described in any one of claims 1 to 7.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the processor implements the glue selection method according to any one of claims 1 to 7.

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