A partitioned laser-assisted bonding system

Abstract

The application discloses a partitioned laser-assisted bonding system, comprising: a light source assembly for emitting light; at least one light guide, the light emitting end of which is arranged in a two-dimensional array, the light emitted by the light source assembly is incident to the light guide and is emitted from the light emitting end of the light guide after conduction; an optical assembly, the light emitted by the at least one light guide is incident to the optical assembly and is projected after passing through the optical assembly; and a light control assembly for controlling whether the light source assembly emits light to any light guide in the at least one light guide, so that the light source assembly emits light to a selected light guide; or the light control assembly is used for controlling whether any light guide in the at least one light guide emits light, so that the selected light guide emits light, the light spot formed by the light beam projected by the optical assembly is matched with a core particle to be bonded, and the arrangement shape of the light emitting end of the selected light guide is matched with the core particle to be bonded. The partitioned laser-assisted bonding system can more flexibly adjust the light spot corresponding to the projected light beam, and has higher flexibility and efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of laser application, in particular to a partitioned laser-assisted bonding system. BACKGROUND

[0002] With the continuous shrinkage of wafer foundry process, Moore's law is approaching the limit, and advanced packaging is the inevitable choice in the post-Moore era. One of the important technologies of advanced packaging is flip chip, and there are three kinds of bonding packaging technologies for flip chip solder balls: mass reflow, thermo compression bonding (TCB) and laser-assisted bonding (LAB). Currently, laser-assisted bonding usually uses a single laser, uses a microlens array to homogenize the light beam, and shapes the light beam into the required spot shape and size through some optical elements, such as using a cylindrical lens or a general lens. However, in this laser-assisted bonding solution, the adjustment range of the shape and size of the light spot is relatively fixed, the adjustment range is limited, and the flexibility is insufficient. SUMMARY

[0003] The purpose of the present application is to provide a partitioned laser-assisted bonding system, which can more flexibly adjust the light spot corresponding to the light beam projected to the chip to be bonded, and has higher flexibility and efficiency.

[0004] To achieve the above purpose, the present application provides the following technical solutions:

[0005] A laser-assisted bonding system, comprising:

[0006] A light source assembly for emitting light;

[0007] At least one light guide arranged on the light-emitting side of the light source assembly, and the light-emitting end of the at least one light guide is arranged in a two-dimensional array, so that the emitted light of the light source assembly is incident to the light guide and is conducted by the light guide and emitted from the light-emitting end of the light guide;

[0008] An optical assembly arranged on the light-emitting side of the at least one light guide, so that the emitted light of the at least one light guide is incident to the optical assembly and projected out after passing through the optical assembly;

[0009] A light control assembly connected to the light source assembly for controlling whether the light source assembly emits light to any light guide in the at least one light guide, so that the light source assembly emits light to the selected light guide in the at least one light guide, and the selected light guide in the at least one light guide emits light, and the light spot formed by the light beam projected by the optical assembly matches the chip to be bonded;

[0010] Alternatively, the light control component is connected with the at least one light guide, and is configured to control whether any of the at least one light guide emits light, so that selected light guides of the at least one light guide emit light, and a light spot formed by a light beam projected by the optical component matches the to-be-bonded core particle.

[0011] The arrangement shape of the light emitting end of the selected light guide matches the shape of the to-be-bonded core particle.

[0012] Alternatively, the arrangement shape of the light emitting end of the selected light guide matches the shape of the to-be-bonded core particle.

[0013] Alternatively, the number of the selected light guides satisfies that a light spot formed by a light beam projected by the optical component matches the size of the to-be-bonded core particle.

[0014] Alternatively, the light source component includes at least one light source, the light source is configured to emit light, and the light guide of the at least one light guide is arranged in one-to-one correspondence with the light source of the at least one light source, so that the emitted light of the light source is incident to the corresponding light guide, conducted by the corresponding light guide, and emitted from the light emitting end of the light guide.

[0015] The light control component includes at least one light control component, the light control component of the at least one light control component is connected with the light source of the at least one light source in one-to-one correspondence, and the light control component is configured to control whether the corresponding light source emits light, so as to control whether the light source emits light to the corresponding light guide.

[0016] Alternatively, a plurality of to-be-bonded core particles exist on the carrier plate.

[0017] A plurality of groups of selected light guides are selected from the at least one light guide, the plurality of groups of selected light guides correspond to the plurality of to-be-bonded core particles in one-to-one correspondence, the arrangement shape of the light emitting end of any group of selected light guides matches the corresponding to-be-bonded core particle, so that the emitted light of the any group of selected light guides is projected by the optical component, and a light beam projected to the corresponding to-be-bonded core particle, and a light spot formed by the light beam projected by the optical component matches the corresponding to-be-bonded core particle.

[0018] Alternatively, the arrangement shape of the light emitting end of the any group of selected light guides matches the shape of the corresponding to-be-bonded core particle.

[0019] Or / and, the number of the selected light guides included in the any group of selected light guides satisfies that a light spot formed by a light beam projected by the optical component after the emitted light of the any group of selected light guides passes through the optical component matches the size of the corresponding to-be-bonded core particle.

[0020] Optionally, the light source assembly comprises at least one light source for emitting light, and the at least one light guide is arranged one-to-one corresponding to the at least one light source, so that the light emitted by the light source is incident to the corresponding light guide, conducted by the corresponding light guide and emitted from the light emitting end of the light guide.

[0021] The light emitting end of the selected light guide forms a two-dimensional array, and the light emitting power of the light source corresponding to the selected light guide at the edge of the two-dimensional array is greater than the light emitting power of the light source corresponding to the selected light guide at the inside of the two-dimensional array.

[0022] Optionally, the pressure assembly further comprises a pressure applying member arranged on the side of the optical assembly close to the to-be-bonded core particle for applying pressure to the to-be-bonded core particle and making the light beam projected by the optical assembly pass through the pressure applying member and project to the to-be-bonded core particle, and a pressure sensor for measuring the pressure applied by the pressure applying member to the to-be-bonded core particle.

[0023] Optionally, the temperature measuring assembly further comprises a temperature sensor arranged on the side of the optical assembly for measuring the temperature of the position where the to-be-bonded core particle is located when the light beam projected by the optical assembly irradiates to the to-be-bonded core particle, and a feedback controller connected with the light source assembly for controlling the light emitting power of the light source assembly according to the temperature signal returned by the temperature sensor.

[0024] Optionally, the temperature measuring assembly further comprises a temperature sensor arranged on the side of the optical assembly for measuring the temperature of the position where the to-be-bonded core particle is located when the light beam projected by the optical assembly irradiates to the to-be-bonded core particle, and a feedback controller connected with the light source assembly for controlling the light emitting power of the light source assembly according to the temperature signal returned by the temperature sensor.

[0025] The camera is arranged on the side of the optical assembly for acquiring the image of the to-be-bonded core particle.

[0026] The observation device is connected with the camera for displaying the acquired image of the to-be-bonded core particle to monitor the working condition of the bonding area of the to-be-bonded core particle.

[0027] The alignment device is connected with the camera for controlling the movement of the to-be-bonded core particle according to the acquired image of the to-be-bonded core particle, so that the light beam projected by the optical assembly projects to the to-be-bonded core particle.

[0028] From the above technical scheme can be known, the partition laser auxiliary bonding system provided by the application, including: light source assembly, for emitting light;At least one light guide, set in the light emitting side of the light source assembly and the light emitting end of the at least one light guide is arranged in two-dimensional array form, so that the light emitting light of the light source assembly is incident to the light guide, conducted by the light guide and emitted from the light emitting end of the light guide;Optical assembly, set in the light emitting side of the at least one light guide, so that the light emitting light of the at least one light guide is incident to the optical assembly, and the light spot formed by the light beam projected by the optical assembly after passing through the optical assembly matches the to-be-bonded core particle;Or, the light control assembly is connected with the at least one light guide, for controlling whether any light guide in the at least one light guide emits light, so that the selected light guide in the at least one light guide emits light, and the light spot formed by the light beam projected by the optical assembly matches the to-be-bonded core particle;Wherein, the arrangement shape of the light emitting end of the selected light guide matches the to-be-bonded core particle.

[0029] The partition laser auxiliary bonding system of the application is provided with at least one light guide, and the light emitting end thereof is arranged in two-dimensional array form, so that the light emitting of the light guide can be controlled in partition, and the selected light guide is selected according to the to-be-bonded core particle, so that the arrangement shape of the light emitting end of the selected light guide matches the to-be-bonded core particle, and the light spot formed by the light beam projected by the optical assembly after passing through the optical assembly matches the to-be-bonded core particle. Compared with the existing laser auxiliary bonding scheme, the partition laser auxiliary bonding system of the application can more flexibly adjust the light spot corresponding to the projected light beam, and has higher flexibility and efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical scheme in the embodiments of the application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0031] Figure 1 A schematic diagram of a partition laser auxiliary bonding system provided by an embodiment of the application;

[0032] Figure 2 A schematic diagram of the arrangement of the optical fiber light emitting end of the optical fiber array of a partition laser auxiliary bonding system provided by an embodiment of the application;

[0033] Figure 3A schematic view of a laser-assisted bonding system provided by an embodiment of the present application applied to a die and a carrier;

[0034] Figure 4 A schematic view of a laser-assisted bonding system provided by an embodiment of the present application applied to a die and a carrier; Figure 3 A schematic view of a laser-assisted bonding system provided by an embodiment of the present application applied to a die and a carrier;

[0035] Figure 5 A schematic view of a laser-assisted bonding system provided by an embodiment of the present application applied to a die and a carrier;

[0036] Figure 6 A schematic view of a laser-assisted bonding system provided by an embodiment of the present application applied to a die and a carrier;

[0037] Figure 7 A schematic view of a laser-assisted bonding system provided by an embodiment of the present application applied to a die and a carrier; Figure 6 A schematic view of a laser-assisted bonding system provided by an embodiment of the present application applied to a die and a carrier;

[0038] Figure 8 A schematic view of a laser-assisted bonding system provided by an embodiment of the present application applied to a die and a carrier.

[0039] The reference signs in the drawings of the specification include:

[0040] 101 - light control member, 102 - light source, 103 - fiber coupler, 104 - optical fiber, 105 - optical assembly, 106 - third carrier table, 110 - first set of optical fibers, 111 - second set of optical fibers, 112 - first outgoing light beam, 113 - second outgoing light beam;

[0041] 201 - first die, 202 - second die, 203 - bare chip, 204 - copper pillar, 205 - solder ball, 206 - non-conductive film, 207 - carrier;

[0042] 301 - loading and unloading device, 302 - patch control device, 303 - human-machine interface, 304 - bonding control device, 305 - suction and flipping assembly, 306 - first camera and alignment device, 307 - suction and patch assembly, 308 - glue dipping assembly, 309 - second camera and alignment device, 310 - third camera and alignment device, 311 - temperature measuring assembly, 312 - first carrier table, 313 - second carrier table, 314 - conveying device. DETAILED DESCRIPTION

[0043] In order to make the technical solution in the present application better understood by the person skilled in the art, the technical solution in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the present application.

[0044] The present embodiment provides a partitioned laser-assisted bonding system, comprising:

[0045] a light source assembly for emitting light;

[0046] at least one light guide arranged on the light emitting side of the light source assembly, and the light emitting ends of the at least one light guide are arranged in a two-dimensional array, so that the light emitted by the light source assembly is incident to the light guide, conducted by the light guide and emitted from the light emitting ends of the light guide;

[0047] an optical assembly arranged on the light emitting side of the at least one light guide, so that the light emitted by the at least one light guide is incident to the optical assembly and projected after passing through the optical assembly;

[0048] a light control assembly connected with the light source assembly, for controlling whether the light source assembly emits light to any light guide in the at least one light guide, so that the light source assembly emits light to the selected light guide in the at least one light guide, and the light spot formed by the light beam projected by the optical assembly matches the core particle to be bonded;

[0049] Alternatively, the light control assembly is connected with the at least one light guide, for controlling whether any light guide in the at least one light guide emits light, so that the selected light guide in the at least one light guide emits light, and the light spot formed by the light beam projected by the optical assembly matches the core particle to be bonded;

[0050] wherein the arrangement shape of the light emitting end of the selected light guide matches the core particle to be bonded.

[0051] The light emitted by the light source assembly is incident to the at least one light guide, and for any light guide, the light is conducted by the light guide and emitted from the light emitting end of the light guide when the light is incident to the light guide.

[0052] In one embodiment, the light control component is connected to the light source component, and controls whether the light source component emits light to any of the at least one light guide. For any light guide, when the light source component emits light to the light guide, the light emitted by the light source component is incident on the light guide, conducted by the light guide, and emitted from the light emission end of the light guide.

[0053] In another embodiment, the light control component is connected to the at least one light guide, and controls whether any of the at least one light guide emits light. For any light guide, when the light guide emits light, light is emitted from the light emission end of the light guide.

[0054] The light emission ends of the at least one light guide are arranged in a two-dimensional array. The light guides can be controlled to emit light in a partitioned manner. The selected light guides can be selected according to the to-be-bonded core particle. The arrangement shape of the light emission ends of the selected light guides matches the to-be-bonded core particle. Then, the selected light guides emit light. The light spot formed by the light beam projected after the light emitted by the selected light guides passes through the optical assembly matches the to-be-bonded core particle. Thus, the to-be-bonded core particle is subjected to a bonding operation. Compared with the existing laser-assisted bonding scheme, the partitioned laser-assisted bonding system of the embodiment can more flexibly adjust the light spot corresponding to the projected light beam, and has higher flexibility and efficiency.

[0055] In some embodiments, the arrangement shape of the light emission ends of the selected light guides matches the shape of the to-be-bonded core particle, so that the light spot formed by the light beam projected after the light emitted by the selected light guides passes through the optical assembly matches the shape of the to-be-bonded core particle.

[0056] In some embodiments, the number of the selected light guides satisfies that the size of the light spot formed by the light beam projected through the optical assembly matches the size of the to-be-bonded core particle. The light guides can be controlled to emit light in a partitioned manner according to the shape and size of the to-be-bonded core particle. The two-dimensional array formed by the light emission ends of the at least one light guide is partitioned. The light guides in the partitions are the selected light guides. The arrangement shape of the light emission ends of the selected light guides matches the shape of the to-be-bonded core particle. The number of the selected light guides can satisfy that the light emitted by the selected light guides passes through the optical assembly to be projected, and the size of the light spot formed matches the size of the to-be-bonded core particle.

[0057] In some embodiments, the light power of the light source component is adjustable. The light power and light emission duration of the light source component can be controlled according to the material of the to-be-bonded core particle and the required bonding temperature. The light power of the light source component satisfies that, when the light emitted by the selected light guides passes through the optical assembly to be projected to the to-be-bonded core particle, the temperature reached conforms to the required bonding temperature of the to-be-bonded core particle.

[0058] In some embodiments, the light guide comprises optical fibers, the light input end of the optical fibers is arranged corresponding to the light source assembly, so that the light emitted by the light source assembly is incident into the optical fibers, the light output ends of the plurality of optical fibers are arranged in a two-dimensional array to form an optical fiber surface array.

[0059] In some embodiments, the light source assembly can comprise at least one light source for emitting light, the light guide of the at least one light guide is arranged corresponding to the light source of the at least one light source, so that the light emitted by the light source is incident into the corresponding light guide, conducted by the corresponding light guide and emitted from the light output end of the light guide; the light control assembly comprises at least one light control component, the light control component of the at least one light control component is connected corresponding to the light source of the at least one light source, the light control component is used to control whether the corresponding light source emits light, so as to control whether the light source emits light to the corresponding light guide.

[0060] The light guide of the at least one light guide is arranged corresponding to the light source of the at least one light source, so that the light emitted by the light source is incident into the corresponding light guide, conducted by the corresponding light guide and emitted from the light output end of the light guide. The light control component of the at least one light control component is connected corresponding to the light source of the at least one light source, the light control component is used to control whether the corresponding light source emits light. The light output end of the at least one light guide is arranged in a two-dimensional array, according to the selected light guide selected from the to-be-bonded core particles, the light source corresponding to the selected light guide is controlled to emit light, so that the selected light guide outputs light.

[0061] In some embodiments, the light emitted by the light source is adjustable. The light emitted by the light source corresponding to each selected light guide satisfies that, when the light emitted by the selected light guide is projected to the to-be-bonded core particles through the optical assembly, the temperature reached meets the required bonding temperature of the to-be-bonded core particles. In some embodiments, the light control component is also used to control the light emitted by the corresponding light source. The light control component can adopt a laser controller. In some embodiments, the light source can adopt a laser that can output laser.

[0062] For example, reference can be made to Figure 1 , Figure 1A schematic diagram of a partitioned laser-assisted bonding system is provided in an embodiment, as shown in the figure, the partitioned laser-assisted bonding system comprises a plurality of light control members 101, a plurality of light sources 102, and a plurality of optical fibers 104, the plurality of light sources 102 are connected to the plurality of light control members 101 one by one, and the plurality of optical fibers 104 are arranged one by one with the plurality of light sources 102. The light source 102 can be connected to the corresponding optical fiber 104 through the corresponding optical fiber coupler 103. The light emitted by any light source 102 enters the corresponding optical fiber 104 and can be emitted from the light emitting end of the optical fiber 104. The optical assembly 105 is arranged on the light emitting side of the plurality of optical fibers 104, and the emitted light of the plurality of optical fibers 104 is projected after passing through the optical assembly 105. The light control member 101 can control whether the corresponding light source 102 emits light and the power of the emitted light.

[0063] For example, refer to Figure 2 , Figure 2 A schematic diagram of the arrangement of the light emitting ends of the optical fiber array of a partitioned laser-assisted bonding system is provided in an embodiment, as shown in the figure, the light emitting ends of the plurality of optical fibers 104 are arranged in a two-dimensional array.

[0064] The partitioned laser-assisted bonding system can be applied to bond a single die to a carrier. For example, in a specific example, the light source is a laser, and the light guide is an optical fiber. For a silicon-based die with a size of 2x2x0.2mm, each of the NxN closely adjacent optical fibers is arranged to output laser light, and the light beams form a square spot with a size of 2x2mm after passing through the optical assembly 105. For example, refer to Figure 2 The right partition of the middle right side, that is, the selected right group of optical fibers, N=5. In actual application, in combination with the output power of the selected laser, the total number of rows and columns of the laser array, and the magnification of the optical assembly 105, N can be selected to be other values such as 2, 3, 4, 6, 7, or 8 according to the needs of process configuration. The optical assembly 105 can also overlap the light spots of each optical fiber to fill the gap between the light spots corresponding to adjacent optical fibers caused by the distance between adjacent cores of the optical fiber array, and the output power and duration of the laser can be set according to the thickness of the chip and the size of the solder ball to achieve the required bonding temperature and meet the time required for solder melting and welding. The laser output and processing duration here are usually in seconds, so compared with thermal compression bonding, the bonding efficiency and hourly bonding capacity can be greatly improved.

[0065] In some embodiments, the die to be bonded includes a bare chip and a solder ball arranged on the bare chip, and the die to be bonded is welded to a carrier. For example, refer to Figure 3 , Figure 3 A schematic diagram of a partitioned laser-assisted bonding system applied to a die to be bonded and a carrier is provided in an embodiment, Figure 4 isFigure 3 A schematic diagram of the first-to-be-bonded core particle and the carrier plate being bonded is shown. As shown in the figure, the first-to-be-bonded core particle 201 includes a bare chip 203, a copper pillar 204, and a tin ball 205, and is further provided with a non-conductive film 206. To weld the first-to-be-bonded core particle 201 to the carrier plate 207, the carrier plate 207 is provided with a solder pad, and before bonding, the first-to-be-bonded core particle 201 needs to be aligned with the carrier plate 207, specifically, the tin ball 205 of the first-to-be-bonded core particle 201 needs to be aligned with the solder pad of the carrier plate 207. The alignment operation can be performed by using the third camera and alignment device 310. As shown in the figure, the generated light beam is irradiated to the first-to-be-bonded core particle 201 for the bonding operation. Figure 3 Figure 4

[0066] In actual applications, according to the shape, length, and width of the to-be-bonded core particle, a corresponding number and arrangement shape of light guides can be selected from the array of light guides to emit light, and according to the thickness, tin ball size, and material of the to-be-bonded core particle, the light source can be determined to have a certain light power and the selected light guides can be determined to have a certain light emission duration.

[0067] In some embodiments, there are a plurality of to-be-bonded core particles on the carrier plate; a plurality of groups of selected light guides are selected from the at least one light guide, the plurality of groups of selected light guides correspond one-to-one to the plurality of to-be-bonded core particles, and the arrangement shape of the light emission end of any group of selected light guides matches the corresponding to-be-bonded core particle, so that the light beam projected by the emitted light of the any group of selected light guides after passing through the optical assembly 105 is projected to the corresponding to-be-bonded core particle, and the light spot formed by the light beam projected by the emitted light of the any group of selected light guides after passing through the optical assembly 105 matches the corresponding to-be-bonded core particle.

[0068] ​​Exemplarily, there are M die to be bonded on the carrier, according to the shape and size of each of the M die to be bonded and the relative position between the M die to be bonded, M groups of selected light guides are selected from the array of light guides, the arrangement shape of the light emitting end of the mth group of selected light guides matches the mth die to be bonded on the carrier, the position of the mth group of selected light guides in the two-dimensional array formed by the light emitting end of the light guide corresponds to the position of the mth die to be bonded on the carrier, m ∈ [1, M], and M is a positive integer greater than or equal to 2. Then, the emergent light of the mth group of selected light guides corresponds to the mth light beam after passing through the optical assembly 105, the mth light beam is projected onto the mth die to be bonded on the carrier, and the light spot formed by the mth light beam projected onto the mth die to be bonded matches the mth die to be bonded. In this embodiment, for the plurality of die to be bonded on the carrier, according to the shape and size of the plurality of die to be bonded on the carrier and the relative position between the die to be bonded, the light guides in the array of light guides are controlled to emit light in different regions, and the pattern of the light spot corresponding to the light beam projected by the system is realized. A group of selected light guides corresponds to a region, and corresponds to a die to be bonded on the carrier. According to the shape and size of the plurality of die to be bonded on the carrier and the relative position between the die to be bonded, the arrangement shape of the light emitting end of the light guide in each region and the number of light guides are selected respectively, so that the emergent light of the selected light guides in any region is projected onto the corresponding die to be bonded on the carrier after passing through the optical assembly 105, and the light beam projected by the emergent light of the light guide in any region after passing through the optical assembly 105 matches the corresponding die to be bonded on the carrier. Then, the present laser-assisted bonding system can perform bonding operation on the plurality of die to be bonded on the carrier, can significantly reduce the packaging steps, improve the efficiency, and multiply the packaging efficiency and hourly productivity.

[0069] In some embodiments, the arrangement shape of the light emitting end of any group of selected light guides matches the shape of the corresponding die to be bonded. For any die to be bonded on the carrier, a group of selected light guides can be selected from the array of light guides according to the shape of the die to be bonded, so that the arrangement shape of the light emitting end of the selected group of selected light guides matches the shape of the die to be bonded, so that the light spot formed by the light beam projected by the emergent light of the selected group of selected light guides after passing through the optical assembly 105 matches the shape of the die to be bonded.

[0070] In some embodiments, the number of the selected light guides in any of the selected groups of light guides is selected to satisfy that the light spot formed by the light beams projected by the exiting light of the selected light guides after passing through the optical assembly 105 matches the size of the corresponding bonded core particle. For any of the bonded core particles on the carrier plate, the shape and size of the bonded core particle can be used to select the light guides in the light guide array, so that the arrangement shape of the light exiting ends of the selected light guides matches the shape of the bonded core particle, and the number of the selected light guides can satisfy that the light spot formed by the light beams projected by the exiting light of the selected light guides after passing through the optical assembly 105 matches the size of the bonded core particle.

[0071] In some embodiments, the light source assembly can include at least one light source for emitting light, and the light guides of the at least one light guide are arranged one-to-one corresponding to the light sources of the at least one light source, so that the exiting light of the light sources is incident to the corresponding light guides, conducted by the corresponding light guides, and exits from the light exiting ends of the light guides. In this embodiment, the exiting light power of the light source corresponding to each of the selected light guides in any of the selected groups of light guides is adjusted to satisfy that the temperature reached by the light beams projected by the exiting light of the selected light guides after passing through the optical assembly 105 to the corresponding bonded core particle matches the bonding temperature required by the corresponding bonded core particle. In this embodiment, any of the light guides is provided with a corresponding light source, and the exiting light power of the light source can be adjusted, so that the exiting light power of the corresponding light guide can be adjusted. For any of the bonded core particles on the carrier plate, the exiting light power of the light source corresponding to each of the light guides in the selected group of light guides corresponding to the bonded core particle can be controlled according to the bonding temperature required by the bonded core particle, so that the light beams projected by the exiting light of the selected group of light guides corresponding to the bonded core particle after passing through the optical assembly 105 to the bonded core particle reach the bonding temperature required by the bonded core particle.

[0072] The shapes of the plurality of bonded core particles on the carrier plate can be the same or different. The sizes of the plurality of bonded core particles on the carrier plate can be the same or different. The bonding temperatures required by the plurality of bonded core particles on the carrier plate can be the same or different. The sub-regional laser-assisted bonding system can perform bonding operations on a plurality of bonded core particles, which can improve the efficiency, and for each bonded core particle, the shape and size of the light spot corresponding to the light beams projected to the bonded core particle can be adjusted more flexibly, which has higher flexibility. For example, refer to Figure 2 A right group of optical fibers and a left group of optical fibers are selected from the optical fiber array, which are the first group of optical fibers 110 and the second group of optical fibers 111, respectively. The first group of optical fibers 110 includes five rows and five columns of optical fibers 104, and the arrangement shape is square. The second group of optical fibers 111 includes five rows and nine columns of optical fibers 104, and the arrangement shape is rectangular.

[0073] This partitioned laser-assisted bonding system can also be applied to bonding multiple core particles onto the same carrier plate, and can be applied to bonding multiple core particles of different shapes and / or different sizes and / or different materials onto the same carrier plate. For example, the carrier plate contains a first core particle to be bonded and a second core particle to be bonded. A first set of selected light guides and a second set of selected light guides are selected from the at least one light guide. In a two-dimensional array formed at the light-emitting ends of the light guide array, the first set of selected light guides corresponds to one partition, and the arrangement shape of the light-emitting ends of the first set of selected light guides matches the first core particle to be bonded. The second set of selected light guides corresponds to another partition, and the arrangement shape of the light-emitting ends of the second set of selected light guides matches the second core particle to be bonded. This ensures that the light emitted from the first set of selected light guides, after passing through the optical component 105, is projected onto the first core particle to be bonded on the carrier plate, and the light emitted from the second set of selected light guides, after passing through the optical component 105, is projected onto the second core particle to be bonded on the carrier plate. For example, see [reference needed]. Figure 5 , Figure 5 This is a schematic diagram of a partitioned laser-assisted bonding system according to another embodiment. The solid lines with arrows indicate the direction of light propagation. The light guide is an optical fiber 104. As shown, a first group of optical fibers and a second group of optical fibers are selected from the fiber array. The first group of optical fibers includes three columns of optical fibers 104, and the light source 102 corresponding to these three columns is in a light-emitting state. The second group of optical fibers includes four columns of optical fibers 104, and the light source 102 corresponding to these four columns is in a light-emitting state. The emitted light from the first group of optical fibers forms a first emitted beam 112 of the fiber array, and the emitted light from the second group of optical fibers forms a second emitted beam 113 of the fiber array. The first emitted beam 112 is projected onto the first core granule 201 to be bonded after passing through the optical component 105, and the second emitted beam 113 is projected onto the second core granule 202 to be bonded after passing through the optical component 105.

[0074] For example, two cores of different sizes are bonded to the same carrier plate, which can be combined with a reference. Figure 5 and Figure 6 , Figure 6 This is a schematic diagram illustrating a partitioned laser-assisted bonding system applied to bonding two bonding particles onto the same carrier plate, specifically bonding a first bonding particle 201 and a second bonding particle 202 onto a carrier plate 207. See also... Figure 7 , Figure 7 for Figure 6 The image shows a top view of two bonding granules being bonded to a carrier substrate. In this specific example, a laser is used as the light source, and an optical fiber is used as the light guide. For example, one granule is 2×2×0.2mm with a solder ball diameter of 80μm, and the other granule is 4×3×0.4mm with a solder ball diameter of 160μm. The distance between the two granules is 1mm. (See reference...) Figure 2As shown, a right group of optical fibers is selected, 5x5 optical fibers in a square arrangement are selected to output laser light, and a left group of optical fibers is selected to output laser light after being arranged in a rectangle of 9x5 optical fibers with two columns of optical fibers in between. The output light power of each laser corresponding to the left group of optical fibers is greater than the output light power of each laser corresponding to the right group of 5x5 optical fibers. Different process curves can be applied to two different specifications of core particles and their solder balls in the same processing time, so as to achieve different welding temperatures and time lengths.

[0075] In some embodiments, the light source assembly includes at least one light source for emitting light, and the at least one light guide is arranged one-to-one with the at least one light source, so that the light emitted by the light source is incident to the corresponding light guide, conducted by the corresponding light guide, and emitted from the light outlet end of the light guide. In a two-dimensional array formed by the light outlet ends of the selected light guides, the output light power of the light source corresponding to the selected light guide at the edge of the two-dimensional array is greater than the output light power of the light source corresponding to the selected light guide at the inside of the two-dimensional array. In this embodiment, the output light power of the light source corresponding to the selected light guide arranged at the edge of the two-dimensional array is greater, that is, a greater output light power is arranged at the edge of the light spot, so as to make up for the temperature loss of the edge of the projected light spot, and help to form a processing area with uniform temperature in the bonding pattern area, and improve the bonding yield and quality.

[0076] In some embodiments, the magnification of the optical assembly 105 can be small, and the depth of focus can be large, which can provide a millimeter-level depth of focus and good bonding performance in the vertical height difference of core particles and solder balls of different thicknesses. Since the light beams emitted by the light guide array form an inverted real image after passing through the optical assembly 105, the positions of the light beams projected to the core particles to be bonded and the corresponding light guides in the light guide array are reversed.

[0077] In this embodiment, the structure of the optical assembly 105 is not limited, and the optical assembly 105 can include a convex lens or a concave lens. In some embodiments, the magnification of the optical assembly 105 can be adjusted, so that the light beams emitted from the light guide array can form light spots of corresponding sizes when projected to the core particles to be bonded after passing through the optical assembly 105.

[0078] In some embodiments, the output light power of the light source assembly can be adjusted according to a preset gradient. In this embodiment, the preset gradient is not limited, and the range of the preset gradient can be 1 / 100 power gradient to 1 / 1000 power gradient. In some embodiments, considering the optimal thermal efficiency, the output light of the light source assembly can be infrared light.

[0079] In some embodiments, the partitioned laser-assisted bonding system can further comprise a pressure assembly, which comprises a pressure applying member arranged on the side of the to-be-bonded die close to the optical assembly 105 for applying pressure to the to-be-bonded die and allowing the light beam projected by the optical assembly 105 to pass through the pressure applying member and be projected to the to-be-bonded die, and a pressure sensor for measuring the pressure applied by the pressure applying member to the to-be-bonded die. The pressure applying member can be transparent to light so as to cause less energy loss. While the laser is heating, the pressure applying member is transparent to light, and a certain pressure is applied to the die, so that the warping and soldering tightness in the bonding process are controlled by external force. The pressure applying member can be, but is not limited to, a quartz crystal, so that the light beam can pass through the crystal.

[0080] In some embodiments, the partitioned laser-assisted bonding system can further comprise a temperature measuring assembly, which comprises a temperature sensor arranged on the side of the optical assembly 105 for measuring the temperature of the position where the to-be-bonded die is located when the light beam projected by the optical assembly 105 irradiates the to-be-bonded die, and a feedback controller connected to the light source assembly for controlling the output light power of the light source assembly according to the temperature signal returned by the temperature sensor. In this way, the partitioned laser-assisted bonding system can monitor the temperature of the position where the to-be-bonded die is located in real time, and feedback control the output light power of the light source assembly, so as to ensure that the required bonding temperature can be reached when the to-be-bonded die is bonded. In the embodiment in which the light source assembly comprises at least one light source, the light guide of the at least one light guide is arranged in one-to-one correspondence with the light source of the at least one light source, and the light control assembly comprises at least one light control member, the light control member of the at least one light control member is connected in one-to-one correspondence with the light source of the at least one light source, and the light control member is used for controlling whether the corresponding light source emits light, the feedback controller can be connected to the at least one light control member, and the output light power of the corresponding light source can be controlled by the light control member according to the temperature signal returned by the temperature sensor.

[0081] In some embodiments, the partitioned laser-assisted bonding system can further comprise a camera arranged on the side of the optical assembly 105 for acquiring an image of the to-be-bonded die, and an observation device connected to the camera for displaying the acquired image of the to-be-bonded die to monitor the working condition of the bonding area of the to-be-bonded die.

[0082] In some embodiments, the partitioned laser-assisted bonding system can further comprise a camera arranged on the side of the optical assembly 105 for acquiring an image of the to-be-bonded die, and an alignment device connected to the camera for controlling the movement of the to-be-bonded die according to the acquired image of the to-be-bonded die, so that the light beam projected by the optical assembly 105 is projected to the to-be-bonded die.

[0083] In some embodiments, the partitioned laser-assisted bonding system can further comprise a suction and patch assembly 307, a glue dipping assembly 308, a carrying assembly comprising a third carrying stage 106 and a second carrying stage 313 arranged below the suction and patch assembly 307 and the glue dipping assembly 308, and a transfer device 314 arranged between the second carrying stage 313 and the third carrying stage 106 for transferring the to-be-bonded die from the second carrying stage 313 to the third carrying stage 106.

[0084] For example, reference can be made to Figure 8 , Figure 8 A schematic diagram of a partitioned laser-assisted bonding system according to yet another embodiment is shown in the figure. The system comprises a suction and flipping assembly 305, a suction and patch assembly 307, and a glue dipping assembly 308. A first carrying stage 312 is arranged below the suction and flipping assembly 305. A second carrying stage 313 is arranged below the suction and patch assembly 307 and the glue dipping assembly 308. A third carrying stage 106 is arranged below an optical assembly 105. A transfer device 314 is arranged between the second carrying stage 313 and the third carrying stage 106.

[0085] A first camera and alignment device 306 is arranged corresponding to the suction and flipping assembly 305. A second camera and alignment device 309 is arranged corresponding to the suction and patch assembly 307 and the glue dipping assembly 308. A third camera and alignment device 310 is arranged corresponding to the optical assembly 105. The first camera and alignment device 306, the second camera and alignment device 309, and the third camera and alignment device 310 are respectively configured to acquire images for performing alignment operations based on the acquired images.

[0086] The partitioned laser-assisted bonding system can further comprise a temperature measuring assembly 311 arranged at one side of the optical assembly 105 for measuring the temperature of the position where the to-be-bonded die is located. A carrier 207 comprising the to-be-bonded die is placed on the third carrying stage 106. During the process of bonding the to-be-bonded die to the carrier 207, the temperature of the position where the to-be-bonded die is located is monitored. The output power of the corresponding light source can be adjusted in real time according to the temperature to avoid excessively high or low temperature, thereby ensuring the bonding quality.

[0087] The present partition laser-assisted bonding system includes two parts, a patching part and a bonding part. The patching part includes a patching control device 302, a feeding and discharging device 301, a suction and turnover assembly 305, a suction and patching assembly 307, a glue dipping assembly 308, a first camera and alignment device 306, a second camera and alignment device 309, a first carrier table 312, and a second carrier table 313. According to actual application needs, each of the above devices or assemblies can be configured with one set, two sets, or even more sets. For example, if two different chiplets are simultaneously packaged on the same carrier, it is desired to complete patching and bonding at one time. In order to improve the patching efficiency, at least two wafer carrier tables are needed.

[0088] The bonding part includes a bonding control device 304, an array of light control members, an array of light sources, an array of light guides, an optical assembly 105, a third camera and alignment device 310, a pressure assembly, and a temperature measuring assembly 311. For the same carrier on which different chiplets are mounted, by setting the spot shape, size, and power of different regions as needed, bonding can be completed at one time. The present partition laser-assisted bonding system can further include a human-machine interface 303.

[0089] For the existing laser bonding scheme, a single laser is usually used, a micro-lens array is used to homogenize the light beam, and some optical elements are used to shape the light beam into the spot shape and size required for bonding, such as a cylindrical lens or a general lens. First, the adjustment range of the spot shape and size is relatively fixed, the adjustment range is limited, and the flexibility is insufficient. Moreover, some adjustment methods are mechanical operation methods such as rotating the lens barrel, the adjustment speed is slow, and the adjustment range is limited. Second, since a single laser is used as the light source to form the spot, only one laser power can be set each time. For the scenario of packaging multiple chiplets with different power requirements on the same carrier, the corresponding laser power needs to be set for each chiplet with different power requirements to independently perform laser bonding once, resulting in a large number of bonding times and low efficiency. Third, the micro-lens array is used for light beam mixing and homogenization. Since the light beams come from the same light source, the micro-lens exit light is coherent, which is easy to form a power density difference between different regions. If the laser irradiation power of a part of the region is low, the welding temperature is insufficient, which will cause a poor contact defect. While in another part of the region, a bridge defect is generated due to receiving a high-power laser irradiation. In some extreme cases, the chiplet may even be burned.

[0090] The laser-assisted bonding system of the present embodiment has the following advantages:

[0091] Firstly, the light beam generated by the light guide can be quickly patterned and lit, and has flexibility and speediness: any light spot pixel can be selected to have laser output or be completely turned off; the output power of a single light guide light spot can be set through the light control component, so that the light spot pattern and the pattern gray scale can be flexibly formed. Therefore, different shapes and sizes of flip chip particles can be flexibly packaged, or multiple different types and sizes of flip chip particles can be packaged on one carrier board, significantly reducing the packaging steps and doubling the packaging efficiency and hourly capacity.

[0092] Secondly, because the light guide is used to output the laser beam, the heat compensation of the bonding pattern edge can be conveniently performed. When the laser light spot irradiates the processed material, the material edge irradiated by the light spot has a large temperature gradient, the inside of the light spot is the processed area, and the outside of the light spot is the non-processed area. Due to the heat transfer effects such as heat conduction and heat radiation, the temperature of the material irradiated by the edge of the flat-top light beam is relatively low compared with the inside of the light spot. The laser beam formed by the light guide can set the laser output of the light spot edge to be larger to compensate for the temperature loss of the light spot edge. A uniform temperature processing area is formed in the light spot to avoid insufficient processing temperature and processing quality problems.

[0093] Thirdly, because the light beams of the light source array come from different light sources, each light beam does not have coherence, so there is no interference effect between the light spots output by the light guide, the light spot uniformization effect is better, the heating temperature of the solder is more uniform, and the packaging quality can be significantly improved.

[0094] Finally, because the light source array is used, the total output power is synthesized by multiple light sources, the power requirement of a single light source in the array is low, and a cheaper laser can be used; in addition, when a light source in the array is damaged, only the damaged light source needs to be replaced, and the entire light source array does not need to be replaced, so the light source maintenance cost is lower.

[0095] The above describes in detail the partitioned laser-assisted bonding system provided by the present application. The principles and implementation modes of the present application are described by using specific examples in this paper. The above examples are only used to help understand the method of the present application and its core idea. It should be pointed out that, for those skilled in the art, without departing from the principles of the present application, the present application can be improved and modified in many ways, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A zoned laser-assisted bonding system, comprising: The application relates to a light source assembly, at least one light guide, an optical assembly and a light control assembly. The light source assembly is used for emitting light. The at least one light guide is arranged on the light emitting side of the light source assembly, and the light emitting ends of the at least one light guide are arranged in a two-dimensional array, so that the light emitted by the light source assembly is incident on the light guide, conducted by the light guide and emitted from the light emitting ends of the light guide. The optical assembly is arranged on the light emitting side of the at least one light guide, so that the light emitted by the at least one light guide is incident on the optical assembly, and the light emitted by the at least one light guide is imaged and projected after passing through the optical assembly. The light control assembly is connected with the light source assembly and is used for controlling whether the light source assembly emits light to any light guide in the at least one light guide, so that the light source assembly emits light to selected light guides in the at least one light guide, the selected light guides in the at least one light guide emit light, and the light spot formed by the light beam projected by the optical assembly matches the to-be-bonded core particle. Alternatively, the light control assembly is connected with the at least one light guide and is used for controlling whether any light guide in the at least one light guide emits light, so that the selected light guides in the at least one light guide emit light, and the light spot formed by the light beam projected by the optical assembly matches the to-be-bonded core particle. The arrangement shape of the light emitting ends of the selected light guides matches the to-be-bonded core particle, the arrangement shape of the light emitting ends of the selected light guides matches the shape of the to-be-bonded core particle, the light spot formed by the light beam projected by the optical assembly matches the shape of the to-be-bonded core particle, and the number of the selected light guides satisfies the condition that the size of the light spot formed by the light beam projected by the optical assembly matches the size of the to-be-bonded core particle.

2. The zoned laser-assisted bonding system of claim 1, wherein, The light source assembly comprises at least one light source used for emitting light, the light guide of the at least one light guide is arranged in one-to-one correspondence with the light source of the at least one light source, so that the light emitted by the light source is incident on the corresponding light guide, conducted by the corresponding light guide and emitted from the light emitting end of the light guide. The light control assembly comprises at least one light control component, the light control component of the at least one light control component is connected with the light source of the at least one light source in one-to-one correspondence, and the light control component is used for controlling whether the corresponding light source emits light to control whether the light source emits light to the corresponding light guide.

3. The zoned laser-assisted bonding system of claim 1, wherein, There are a plurality of to-be-bonded core particles on a carrier plate. A plurality of groups of selected light guides are selected from the at least one light guide, the plurality of groups of selected light guides correspond to the plurality of to-be-bonded core particles in one-to-one correspondence, the arrangement shape of the light emitting ends of any group of selected light guides matches the to-be-bonded core particle corresponding thereto, so that the light beam projected by the light emitted by the any group of selected light guides after passing through the optical assembly is projected to the to-be-bonded core particle corresponding thereto, and the light spot formed by the light beam projected by the light emitted by the any group of selected light guides after passing through the optical assembly matches the to-be-bonded core particle corresponding thereto.

4. The zoned laser-assisted bonding system of claim 3, wherein, The arrangement shape of the light emitting ends of the any group of selected light guides matches the shape of the to-be-bonded core particle corresponding thereto. Or / and, the number of the selected light guides in the any one group of the selected light guides satisfies that the light spot formed by the light beam projected by the emergent light of the any one group of the selected light guides after passing through the optical assembly matches the size of the corresponding to-be-bonded core particle.

5. The zoned laser-assisted bonding system of claim 1, wherein, The light source assembly comprises at least one light source for emitting light, and the light guide of the at least one light guide is arranged in one-to-one correspondence with the light source of the at least one light source, so that the emergent light of the light source is incident to the corresponding light guide, conducted by the corresponding light guide and emitted from the light emitting end of the light guide; In the two-dimensional array formed by the light emitting ends of the selected light guides, the emergent light power of the light source corresponding to the selected light guide at the edge of the two-dimensional array is greater than the emergent light power of the light source corresponding to the selected light guide at the inside of the two-dimensional array.

6. The zoned laser-assisted bonding system of any of claims 1 to 5, wherein, Further comprising a pressure assembly, the pressure assembly comprises a pressure applying member and a pressure sensor, the pressure applying member is arranged on the side of the to-be-bonded core particle close to the optical assembly, for applying pressure to the to-be-bonded core particle and making the light beam projected by the optical assembly pass through the pressure applying member and project to the to-be-bonded core particle, and the pressure sensor is used for measuring the pressure applied by the pressure applying member to the to-be-bonded core particle.

7. The zoned laser-assisted bonding system of any of claims 1 to 5, wherein, Further comprising a temperature measuring assembly, the temperature measuring assembly comprises a temperature sensor and a feedback controller, the temperature sensor is arranged on the side of the optical assembly, for measuring the temperature of the position where the to-be-bonded core particle is located when the light beam projected by the optical assembly irradiates to the to-be-bonded core particle, and the feedback controller is connected with the light source assembly, for controlling the emergent light power of the light source assembly according to the temperature signal returned by the temperature sensor.

8. The zoned laser-assisted bonding system of any of claims 1 to 5, wherein, Further comprising: a camera arranged on the side of the optical assembly, for acquiring the image of the to-be-bonded core particle; an observation device connected with the camera, for displaying the acquired image of the to-be-bonded core particle, so as to monitor the working condition of the bonding area of the to-be-bonded core particle; an alignment device connected with the camera, for controlling the movement of the to-be-bonded core particle according to the acquired image of the to-be-bonded core particle, so that the light beam projected by the optical assembly projects to the to-be-bonded core particle.

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