Substrate processing apparatus

Abstract

The present application provides a kind of substrate processing device, can avoid that sliding resistance is excessively large when making heat treatment plate sliding movement.Guiding plate (151) is fixed to main frame (11), and extends along X direction.First plate (153) can be slidably moved along X direction relative to guiding plate (151).Second plate (155) is fixed relative to heat plate (20), and can be slidably moved along X direction relative to first plate (153).Linkage separation mechanism (70) makes first plate (153) and the second plate linkage in the case where heat plate (20) moves from processing position (P1) to intermediate position (P3), makes second plate (155) and first plate (153) separate in the case where heat plate (20) moves from intermediate position (P3) to maintenance position (P2).

Description

Technical Field

[0001] The subject matter disclosed in this specification relates to a substrate processing apparatus. Background Technology

[0002] For example, in the processing of various substrates such as glass substrates for display devices, the following process is sometimes performed: after coating the substrate with a coating liquid, the substrate is heated, thereby causing the components contained in the coating liquid to evaporate.

[0003] Furthermore, Patent Document 1 discloses a substrate processing apparatus in which multiple processing chambers, including a cooling plate for cooling a substrate, are stacked vertically. It also discloses a multi-stage substrate processing apparatus capable of extracting the processing chambers, facilitating maintenance of the processing chambers.

[0004] More specifically, the cooling plate is disposed on a sliding unit that can be pulled out relative to the outer cover. The sliding unit includes a pair of sliding members, each including a fixed side member mounted on the outer cover, a movable side member mounted on the slider of the sliding unit, and an intermediate member disposed between the fixed side member and the movable side member.

[0005] A ball holder is provided between the fixed-side component and the intermediate component, and between the movable-side component and the intermediate component, to hold multiple balls. Thus, the intermediate component can slide relative to the fixed-side component along the sliding direction, and the movable-side component can slide relative to the intermediate component along the sliding direction.

[0006] This structure allows the movable side component to slide relative to the fixed side component, thus enabling the sliding unit and cooling plate to be removed from the outer casing where the fixed side component is fixed.

[0007] [Existing Technical Documents]

[0008] [Patent Literature]

[0009] [Patent Document 1] Japanese Patent Application Publication No. 2000-012448 Summary of the Invention

[0010] [The problem the invention aims to solve]

[0011] However, in the prior art, when the cooling plate is pulled out from the processing position inside the outer casing to the outside of the outer casing, sometimes only the side components move first, followed by a delayed movement of the intermediate components. In this case, since the intermediate components move from a position away from the cooling plate, excessive load is applied to them. As a result, due to increased sliding resistance, smooth extraction may be difficult.

[0012] The purpose of this invention is to provide a technique that can prevent excessive sliding resistance when a heat treatment plate is slidably moved.

[0013] [Technical means to solve the problem]

[0014] To address the aforementioned problem, a first embodiment includes: a heat treatment plate for heat-treating a substrate; a main frame for supporting the heat treatment plate; and at least one sliding member for moving the heat treatment plate from a processing position inside the main frame to a maintenance position along a first direction intersecting the vertical direction. The sliding member has: a guide plate fixed to the main frame and extending along the first direction; a first plate slidably movable relative to the guide plate along the first direction; a second plate fixed relative to the heat treatment plate and slidably movable relative to the first plate along the first direction; and a linkage separation mechanism that, when the heat treatment plate moves from the processing position to an intermediate position between the processing position and the maintenance position, links the first plate and the second plate together; and, when the heat treatment plate moves from the intermediate position to the maintenance position, separates the second plate from the first plate.

[0015] The second embodiment is a substrate processing apparatus according to the first embodiment, which further includes a processing chamber for accommodating the heat treatment plate, and the second plate is fixed in the processing chamber.

[0016] The third embodiment is a substrate processing apparatus according to the first or second embodiment, wherein the guide plate has a guide rail extending along the first direction, the first plate has a guide block that engages with the guide rail and is capable of sliding along the guide rail, and the guide block is fixed in the middle of the first plate in the first direction.

[0017] The fourth embodiment is a substrate processing apparatus according to any one of the first to third embodiments, having a pair of sliding members, the pair of sliding members being separated from each other in a second direction that intersects the first direction and the vertical direction respectively.

[0018] The fifth embodiment is a substrate processing apparatus according to the fourth embodiment, wherein the heat treatment plate is located between the pair of sliding members in the second direction.

[0019] The sixth embodiment is a substrate processing apparatus according to the fifth embodiment, wherein the first plate is disposed between the guide plate and the second plate in the second direction, and the linkage separation mechanism includes: a movable pressing member disposed on the first plate and movable in the second direction; a limiting protrusion disposed on the first plate and protruding toward the second plate; a movable engaging protrusion disposed on the second plate, capable of engaging with the limiting protrusion and movable in the second direction; an elastic member disposed on the second plate and applying force to the movable engaging protrusion toward the first plate; and a cam member disposed on the guide plate and protruding toward the first plate. When the heat treatment plate moves from the processing position to the intermediate position, the movable engaging protrusion engages with the limiting protrusion in the first direction. When the heat treatment plate reaches the intermediate position, the movable pressing member is pressed by the cam member, thereby moving the movable pressing member toward the second plate. The movable engaging protrusion is pressed by the movable pressing member, thereby moving the movable engaging protrusion toward the second plate side closer than the limiting protrusion.

[0020] The seventh embodiment is a substrate processing apparatus according to the fifth embodiment, further comprising: a stop mechanism for stopping the first plate, which has been moved to a predetermined stop position, relative to the guide plate; the linkage separation mechanism having a locking member for engaging the second plate with the first plate; and when the second plate moves along the first direction after the first plate is stopped at the stop position by the stop mechanism, the locking member is released from engaging the first plate with the second plate.

[0021] The eighth embodiment is a substrate processing apparatus according to any one of the first to seventh embodiments, further comprising: a substrate lifting mechanism for lifting the substrate above the heat treatment plate, wherein the sliding member is capable of integrally extracting the heat treatment plate and the substrate lifting mechanism.

[0022] [The effects of the invention]

[0023] According to the substrate processing apparatus of the first to eighth embodiments, when the heat treatment plate is moved from the processing position to the intermediate position, the first plate can be moved in tandem with the heat treatment plate. This prevents the first plate from moving away from the heat treatment plate, thus reducing the load applied to the first plate. As a result, since the sliding resistance of the sliding member is reduced, the heat treatment plate can be extracted smoothly.

[0024] According to the substrate processing apparatus of the second embodiment, even if the load is increased by a amount corresponding to the processing chamber, the sliding resistance of the sliding member can be reduced, so the heat treatment plate and the processing chamber can be extracted well.

[0025] According to the substrate processing apparatus of the third embodiment, the guide block can be brought close to the heat treatment plate, thereby reducing the load applied to the guide block.

[0026] According to the substrate processing apparatus of the fourth embodiment, the load of the heat treatment plate can be applied to a pair of sliding members, so that the heat treatment plate can be extracted well.

[0027] According to the substrate processing apparatus of the fifth embodiment, a pair of sliding members are configured not to overlap with the heat treatment plate in the vertical direction, thereby reducing the device size in the vertical direction.

[0028] According to the substrate processing apparatus of the sixth embodiment, during the movement of the heat treatment plate from the processing position to the intermediate position, the movable engaging protrusion of the second plate engages with the restricting protrusion of the first plate. This allows the first and second plates to move together. Furthermore, when the heat treatment plate reaches the intermediate position, the movable engaging protrusion of the second plate moves further towards the second plate than the restricting protrusion of the first plate. This releases the engagement. Therefore, since the second plate can be separated from and moved from the first plate, the heat treatment plate and the second plate can be moved together from the intermediate position to the maintenance position.

[0029] According to the substrate processing apparatus of the seventh embodiment, the linkage and separation of the first board and the second board can be achieved with a relatively simple structure.

[0030] According to the substrate processing apparatus of the eighth embodiment, even if the load corresponding to the substrate lifting mechanism is increased, the sliding resistance of the sliding member can be reduced, so the heat treatment plate and the substrate lifting mechanism can be extracted well. Attached Figure Description

[0031] Figure 1 This is a perspective view of the substrate processing apparatus according to the first embodiment.

[0032] Figure 2 It means Figure 1 A perspective view of the processing unit of the substrate processing apparatus shown.

[0033] Figure 3 It means Figure 2 The diagram shows a schematic cross-sectional view of the structure of the processing unit.

[0034] Figure 4 It is an enlarged representation Figure 2 A perspective view of a portion of the sliding member included in the processing unit shown.

[0035] Figure 5 It means Figure 1 A top view of the stop mechanism included in the substrate processing apparatus shown.

[0036] Figure 6 (A) Figure 6(C) is a diagram showing the case where the processing unit is pulled out by the sliding member.

[0037] Figure 7 (A) Figure 7 (D) represents Figure 1 The diagram shows the operation of the linkage separation mechanism included in the substrate processing apparatus.

[0038] Figure 8 (A) Figure 8 (D) is a graph representing the load (kgf) applied to the sliding member during the extraction of the processing unit.

[0039] Figure 9 This is a perspective view showing the linkage separation mechanism of the substrate processing apparatus according to the second embodiment.

[0040] [Explanation of Symbols]

[0041] 1: Substrate processing device

[0042] 8: Control Department

[0043] 9: Substrate

[0044] 11: Main Framework

[0045] 13: Processing Unit

[0046] 15: Sliding component

[0047] 17: Processing Chamber

[0048] 20: Hot plate

[0049] 20a: Upper surface

[0050] 30: Substrate lifting mechanism

[0051] 31: Lifting pin

[0052] 33: Lifting pin lifting section

[0053] 40: Frame section

[0054] 41: Opening

[0055] 43: Sealing part

[0056] 50: cover

[0057] 61: First guide rail

[0058] 62: First bootstrap block

[0059] 63: Second guide rail

[0060] 64: Second bootstrap block

[0061] 65: Stopping mechanism

[0062] 70, 70a: Linkage separation mechanism

[0063] 71: Movable pressing component

[0064] 72: Restricting protrusion

[0065] 73: Movable locking protrusion

[0066] 74: Elastic Components

[0067] 75: Cam component

[0068] 76: Engaging protrusion (engaging component)

[0069] 77: Engaging recess (engaging component)

[0070] 151: Guide board

[0071] 153: First board

[0072] 155: Second board

[0073] 651: Stop the protrusion

[0074] 653: Contact protrusion

[0075] 721: Restricted Inclined Plane

[0076] 751: Cam Incline

[0077] P1: Processing Location

[0078] P2: Maintenance Location

[0079] P3: Middle position

[0080] X, Y, Z: Direction Detailed Implementation

[0081] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Furthermore, the constituent elements described in the embodiments are merely examples and are not intended to limit the scope of the invention to these. In the drawings, for ease of understanding, the dimensions or quantities of various parts are sometimes exaggerated or simplified as needed.

[0082] In addition, to facilitate understanding of the positional relationships of the components, arrows indicating the orthogonal XYZ coordinate axes are sometimes used in the accompanying drawings. In the XYZ coordinate system, the Z-axis corresponds to the vertical axis, and the XY plane, which intersects the Z-axis at right angles, corresponds to the horizontal plane. Furthermore, the (-Z) direction corresponds to vertically downward. In the following description, vertically upward is sometimes simply referred to as "upward" or "above," and vertically downward is sometimes simply referred to as "downward" or "below."

[0083] <1. First Implementation>

[0084] Figure 1 This is a perspective view of the substrate processing apparatus 1 according to the first embodiment. The substrate processing apparatus 1 is a processing chamber 17 (see reference 13) included in the processing unit 13. Figure 2 The substrate processing apparatus 1 heats a substrate 9 containing a coating liquid such as photoresist coated on its surface, thereby causing the solvent components in the coating liquid to evaporate. The substrate processing apparatus 1 can be used, for example, to form a photoresist film on the surface of the substrate 9. The substrate 9 is, for example, a various substrate to be processed for electronic devices, specifically, a glass substrate for semiconductor wafers, liquid crystal displays or plasma displays, a glass or ceramic substrate for magnetic disks or optical disks, a glass substrate for organic electroluminescence (EL) displays, a glass or silicon substrate for solar cells, a flexible substrate, a printed circuit board, etc.

[0085] The substrate processing apparatus 1 includes a main frame 11, multiple (five in this embodiment) processing units 13, and a control unit 8. For example... Figure 1 As shown, multiple processing units 13 are stacked in multiple layers along the Z direction. The main frame 11 supports the processing units 13. The processing unit 13 is a device for heating the substrate 9.

[0086] The control unit 8 is, for example, a computer, and includes a processor such as a central processing unit (CPU) and a memory electrically connected to the processor and storing programs. By executing the programs stored in the memory through the processor, the operation of each part in the substrate processing apparatus 1 is controlled. As a result, various processes such as heat treatment are performed in the substrate processing apparatus 1.

[0087] Figure 2 It means Figure 1 A perspective view of the processing unit 13 of the substrate processing apparatus 1 shown. Figure 2 As shown, the substrate processing apparatus 1 includes a pair of sliding members 15 for each processing unit 13. The processing unit 13 is disposed between the pair of sliding members 15 in the Y direction. The pair of sliding members 15 is a mechanism for moving the processing unit 13 in the X direction. More specifically, the pair of sliding members 15 are moved between a processing position P1 where the processing unit 13 is subjected to heat treatment and a maintenance position P2 where the processing unit 13 is maintained. The processing position P1 is inside the main frame 11 when viewed from above, and the maintenance position P2 is outside the main frame 11 (+X side) when viewed from above.

[0088] Figure 3 It means Figure 2 A schematic cross-sectional view of the structure of the processing unit 13 shown. Figure 3 As shown, the processing unit 13 includes a processing chamber 17, a hot plate 20, and a substrate lifting mechanism 30.

[0089] The processing chamber 17 has a generally rectangular parallelepiped shape. The processing chamber 17 has a frame portion 40 and a cover portion 50. The frame portion 40 has an opening 41 at the top. A hot plate 20 is housed inside the frame portion 40.

[0090] The cover 50 has a generally plate-like shape capable of closing the opening 41 at the top of the frame 40. The cover 50 is detachable from the top of the frame 40. The cover 50 is mounted on the top of the frame 40 via a sealing part 43. The sealing part 43 is a member that seals the gap between the frame 40 and the cover 50.

[0091] With the cover 50 removed from the frame 40, the inner surface of the frame 40 is exposed to the outside through the opening 41 of the frame 40. In this state, maintenance operations such as replacing parts or cleaning inside the frame 40 can be performed through the opening 41 of the frame 40.

[0092] A hot plate 20 is housed inside the processing chamber 17. The hot plate 20 has a flat upper surface 20a. A heater, such as a heating wire, is built into the hot plate 20. By driving the heater, the upper surface 20a of the hot plate 20 is heated to a predetermined temperature. As a result, the substrate 9 disposed above and near the upper surface 20a is heated. The heater is controlled by a control unit 8.

[0093] The substrate lifting mechanism 30 moves the substrate 9 up and down above the hot plate 20. The substrate lifting mechanism 30 has multiple lifting pins 31 and lifting pin lifting portions 33. The substrate lifting mechanism 30 is supported by a support frame (not shown). The support frame is a component connected to the processing chamber 17. That is, the substrate lifting mechanism 30 is connected to the processing chamber 17 via the support frame. Furthermore, the term "connection" includes not only direct connection through contact between components, but also indirect connection between components via other components.

[0094] Multiple lifting pins 31 extend vertically and are distributed horizontally. The multiple lifting pins 31 are inserted into the bottom wall of the frame portion 40 in the processing chamber 17 and into several through holes provided on the hot plate 20, penetrating both the bottom wall of the frame portion 40 and the hot plate 20. The multiple lifting pins 31 are held by the lifting pin lifting portion 33 in a state that protrudes upwards beyond the upper surface 20a of the hot plate 20.

[0095] The lifting pin lifting part 33 enables multiple lifting pins 31 to move up and down together. The lifting pin lifting part 33 is disposed on the outside and lower side of the processing chamber 17. The lifting pin lifting part 33 includes, for example, a rack and pinion mechanism or a ball screw mechanism containing a motor.

[0096] The substrate 9 is supported on the upper ends of a plurality of lifting pins 31. The lifting pin lifting part 33 moves the plurality of lifting pins 31 between a proximity position of the substrate 9 to the upper surface 20a of the hot plate 20 and an upper position further up than the proximity position. The operation of the lifting pin lifting part 33 is controlled by the control part 8.

[0097] <Sliding Member 15>

[0098] Next, the structure of the sliding member 15 will be described. Furthermore, in the following description, the sliding member 15 located on the +Y side of the pair of sliding members 15 will be described; the sliding member 15 on the -Y side also has the same structure. The pair of sliding members 15 are arranged symmetrically about an axis of symmetry parallel to the Z-axis passing between them.

[0099] Figure 4 It is an enlarged representation Figure 2 The diagram shows a perspective view of a portion of the sliding member 15 included in the processing unit 13. The sliding member 15 has a guide plate 151, a first plate 153, and a second plate 155. The first plate 153 is located between the guide plate 151 and the second plate 155 in the Y direction.

[0100] <Guideboard 151>

[0101] The guide plate 151 is fixed to the main frame 11. The guide plate 151 is a plate-shaped component extending in the X direction. The guide plate 151 has approximately the same dimensions as the processing chamber 17 in the X direction. On the side of the guide plate 151 facing the first plate 153 (the side on the -Y side), a plurality of (two in this example) first guide rails 61 extending in the X direction are fixed. Alternatively, there may be only one first guide rail 61.

[0102] <First Board 153>

[0103] The first plate 153 is a plate-shaped component extending along the X direction. In the X direction, the dimensions of the first plate 153 are approximately the same as those of the second plate 155. The first plate 153 is configured to slide relative to the guide plate 151 in the X direction. Specifically, a plurality of first guide blocks 62 are fixed to the surface of the first plate 153 facing the guide plate 151 (the +Y side surface). The first guide blocks 62 engage with and are movable along the first guide rail 61. Preferably, one of the plurality of first guide blocks 62 is fixed in the middle of the first plate 153 in the X direction, more preferably in the center of the first plate 153.

[0104] On the side of the first plate 153 facing the second plate 155 (the side on the -Y side), a plurality of second guide rails 63 extending in the X direction are fixed at intervals. Alternatively, there may be only one second guide rail 63.

[0105] <Second Board, Page 155>

[0106] The second plate 155 is a plate-shaped component extending along the X direction. In the X direction, the dimensions of the second plate 155 are approximately the same as those of the guide plate 151 and the first plate 153. The second plate 155 is configured to slide relative to the first plate 153 in the X direction. Specifically, a plurality of second guide blocks 64 are fixed to the face of the second plate 155 facing the first plate 153 (the face on the +Y side). The second guide blocks 64 engage with the second guide rail 63 of the first plate 153 and are movable along the second guide rail 63.

[0107] Alternatively, the first guide rail 61 can be disposed on the first plate 153, and the first guide block 62 can be disposed on the guide plate 151. Alternatively, the second guide rail 63 can be disposed on the second plate 155, and the second guide block 64 can be disposed on the first plate 153.

[0108] Figure 5 It means Figure 1 The diagram shows a top view of the stop mechanism 65 included in the substrate processing apparatus 1. The stop mechanism 65 is a mechanism that stops the first plate 153 relative to the guide plate 151 midway through the movement of the processing unit 13, including the hot plate 20, from the processing position P1 to the maintenance position P2.

[0109] like Figure 5 As shown, the stopping mechanism 65 has a stopping protrusion 651 and a contact protrusion 653. The stopping protrusion 651 is disposed on the guide plate 151 and protrudes towards the first plate 153. The contact protrusion 653 is disposed on the first plate 153 and protrudes towards the guide plate 151. When the first plate 153 moves relative to the guide plate 151 in the +X direction and reaches the stopping position, the contact protrusion 653 collides with the stopping protrusion 651. Therefore, the movement of the first plate 153 towards the +X side beyond the stopping position is restricted.

[0110] Additionally, a stop mechanism (not shown) is provided on the first plate 153 to restrict the movement of the second plate 155 in the X direction. This stop mechanism includes, for example, a stop protrusion on the first plate 153 and a contact protrusion on the second plate 155. When the second plate 155 reaches a predetermined position by moving relative to the first plate 153 towards the +X direction, the contact protrusion contacts the stop protrusion. Thus, the movement of the second plate 155 towards the +X direction is restricted.

[0111] Figure 6 (A) Figure 6 (C) is a diagram showing the case where the processing unit 13 is pulled out by the sliding member 15. Figure 6 (A) is a schematic top view showing the state of the processing unit 13 in the processing position P1. Figure 6(B) is a schematic top view showing the state of the processing unit 13 in the middle position P3. Figure 6 (C) is a schematic top view showing the state of processing unit 13 in maintenance position P2. The intermediate position P3 is the position between processing position P1 and maintenance position P2 in the X direction. Furthermore, in Figure 6 (A) Figure 6 In (C), only the sliding member 15 on the +Y side of a pair of sliding members 15 is shown.

[0112] like Figure 6 (A) Figure 6 As shown in (C), the sliding member 15 has a linkage separation mechanism 70. When the processing unit 13, including the hot plate 20, moves from the processing position P1 to the intermediate position P3, the linkage separation mechanism 70 links the first plate 153 and the second plate 155 together, causing the first plate 153 and the second plate 155 to move as a single unit. Thus, as... Figure 6 (A) and Figure 6 As shown in (B), during the period when the processing unit 13 moves from the processing position P1 to the intermediate position P3, the first plate 153 and the second plate 155 move together with the processing unit 13 toward the +X side.

[0113] Furthermore, when the processing unit 13, including the hot plate 20, moves from the intermediate position P3 to the maintenance position P2, the linkage separation mechanism 70 disconnects the second plate 155 from the first plate 153. Therefore, as... Figure 6 (B) and Figure 6 As shown in (C), the second plate 155 separates from the first plate 153 and moves toward the +X side. Furthermore, when the processing unit 13 is in the intermediate position P3, the movement of the first plate 153 toward the X side is restricted by the stop mechanism 65. Thus, only the second plate 155 moves toward the +X side together with the processing unit 13.

[0114] Furthermore, ideally, each of the pair of sliding members 15 has a linkage separation mechanism 70. However, it is also possible for only one of the pair of sliding members 15 to have a linkage separation mechanism 70.

[0115] Figure 7 (A) Figure 7 (D) represents Figure 1 The diagram shows the operation of the linkage separation mechanism 70 included in the substrate processing apparatus 1. Figure 7 (A) is a partial top view showing the state in which the linkage separation mechanism 70 links the first plate 153 and the second plate 155. Figure 7 (B) and Figure 7 (C) is a partial top view showing the process by which the linkage separation mechanism 70 separates the first plate 153 from the second plate 155. Figure 7(D) is a partial top view showing the state in which the linkage separation mechanism 70 separates the first plate 153 from the second plate 155.

[0116] like Figure 7 (A) Figure 7 As shown in (D), the linkage separation mechanism 70 has a movable pressing member 71, a limiting protrusion 72, a movable engaging protrusion 73, an elastic member 74, and a cam member 75.

[0117] The movable pressing member 71 is a rod-shaped member extending in the Y direction and disposed on the first plate 153. The movable pressing member 71 is inserted into a through hole provided on the first plate 153 and is held so as to be movable in the Y direction relative to the insertion hole.

[0118] The limiting protrusion 72 is provided on the side of the first plate 153 facing the second plate 155 (in Figure 7 (A) Figure 7 On the surface of (D) on the +Y side, it protrudes toward the second plate 155 compared to the surface of the first plate 153. The limiting protrusion 72 is approximately right-angled trapezoidal in shape when viewed from above. The surface of the limiting protrusion 72 facing the second plate 155 (+Y side) has a limiting slope 721 that is inclined toward the guide plate 151 (-Y side) in the +X direction.

[0119] A movable engaging protrusion 73 is provided on the second plate 155 and is held so as to be movable relative to the second plate 155 in the Y direction. The movable engaging protrusion 73 is configured to be movable from the second plate 155 toward the first plate 153 (in... Figure 7 (A) Figure 7 The (D) protrudes to the -Y side, and the movable engaging protrusion 73 can engage with the limiting protrusion 72.

[0120] An elastic member 74 is disposed on the second plate 155 and applies force to the movable engaging protrusion 73 toward the first plate 153. The elastic member 74 is, for example, a spring disposed in a concave hole provided on the second plate 155.

[0121] like Figure 7 (B) Figure 7 As shown in (D), the cam member 75 is disposed on the guide plate 151, extending from the guide plate 151 toward the first plate 153 (in Figure 7 (A) Figure 7 (D) is the -Y side protruding. The cam member 75 is approximately a right-angled trapezoid in top view. The surface of the cam member 75 facing the first plate 153 (+Y side) has a cam ramp 751 that is inclined toward the first plate 153 (+Y side) in the +X direction. Figure 6 (A) Figure 6As shown in (C), the cam member 75 is disposed in the middle of the guide plate 151 in the X direction, more preferably in the center of the guide plate 151.

[0122] In the processing unit 13 including the hot plate 20, from the processing position P1 (refer to...) Figure 6 (A)) towards the middle position P3 (refer to) Figure 6 During the movement of (B)), such as Figure 7 As shown in (A), the movable engaging protrusion 73 is positioned in a protruding position by being pressed by the elastic member 74. Furthermore, the movable engaging protrusion 73 in the protruding position contacts the limiting protrusion 72 in the X direction. That is, the movable engaging protrusion 73 engages with the limiting protrusion 72. Therefore, when the second plate 155 moves together with the processing unit 13 in the +X direction, the first plate 153 also moves in the +X direction in a corresponding manner.

[0123] When the processing unit 13, including the hot plate 20, reaches the intermediate position P3 (refer to...) Figure 6 (B)), such as Figure 7 As shown in (B), the movable pressing member 71 slides into contact with the cam ramp 751 of the cam member 75 while moving towards the +X side. Thus, the movable pressing member 71 is pressed by the cam member 75, thereby moving the movable pressing member 71 towards the second plate 155. Therefore, as... Figure 7 As shown in (C), the movable engaging protrusion 73 is pressed by the movable pressing member 71, thereby moving the movable engaging protrusion 73 further towards the second plate 155 side (+Y side) than the limiting protrusion 72. Thus, the engagement between the movable engaging protrusion 73 and the limiting protrusion 72 is released. Then, as... Figure 7 As shown in (D), the movable pressing member 71 moves in the +X direction past the limiting protrusion 72. This allows the second plate 155 to move in the +X direction relative to the first plate 153. Furthermore, the movement of the first plate 153 in the X direction is limited by the stop mechanism 65. Therefore, the movement of the movable pressing member 71 towards the +X side, which is closer to the cam member 75, is restricted.

[0124] Furthermore, when the processing unit 13 is returned from maintenance position P2 to processing position P1, the movable engaging protrusion 73 moves in the -X direction and simultaneously slides into contact with the limiting slope 721 of the limiting protrusion 72. Thus, the movable engaging protrusion 73 can move past the limiting protrusion 72 towards the -X side. Therefore, when the processing unit 13 is withdrawn to maintenance position P2 again, the movable engaging protrusion 73 can engage with the limiting protrusion 72.

[0125] <Effect of the linkage separation mechanism 70>

[0126] Figure 8 (A) Figure 8(D) is a graph showing the load (kgf) applied to the sliding member 15 during each process of the extraction processing unit 13. Furthermore, for ease of explanation, in Figure 8 (A) Figure 8 In (D), the processing unit 13 is configured to have a weight of 200 kg and a center of gravity located at the center of the processing unit 13 in the X direction. Furthermore, the second plate 155 is configured to have a second guide block 64 at the center position in the X direction and at the -X side end. Additionally, the first plate 153 is configured to have a first guide block 62 at the center position in the X direction and at the -X side end.

[0127] Figure 8 (A) is a diagram showing the load when the processing unit 13 is in the processing position P1. Figure 8 (B) is a diagram showing the load when the processing unit 13 is in the middle position P3. Figure 8 (C) is a diagram showing the load when the processing unit 13 is in the maintenance position P2. Figure 8 (D) is a diagram representing the load when processing unit 13 is in the intermediate position P3. Furthermore, in Figure 8 In (D), a comparative example is shown where the first plate 153 and the second plate 155 are not linked.

[0128] like Figure 8 As shown in (A), when the processing unit 13 is in the processing position P1, the positions of the central first guide block 62 and second guide block 64 are aligned with the center of gravity. Therefore, a load of 100 kgf (=980 N) is applied downwards equally to each. Furthermore, the load applied to the first guide block 62 and second guide block 64 at the -X side end is 0 kgf.

[0129] In addition, such as Figure 8 As shown in (C), when the processing unit 13 is in the maintenance position P2, a downward load of 200 kgf (=1960 N) is applied to the first guide block 62 at the center of the first plate 153, and an upward load of 100 kgf is applied to the first guide block 62 at the -X side end. This is because the center of gravity of the processing unit 13 moves away from the first plate 153 along the X direction, thereby subjecting each first guide block 62 to a rotational force.

[0130] In addition, such as Figure 8 As shown in (B), when the processing unit 13 is in the intermediate position P3, the load applied to each of the first guide blocks 62 and each of the second guide blocks 64 is... Figure 8The same applies to (A). That is, a downward load of 100 kgf is applied to the central first guide block 62 and second guide block 64, but no load is applied to the first guide block 62 and second guide block 64 at the -X side end. Therefore, the sliding resistance applied to the first plate 153 is constant during the period when the processing unit 13 moves from the processing position P1 to the intermediate position P3. Moreover, as the processing unit 13 moves from the maintenance position P2 to the intermediate position P3, the sliding resistance gradually increases.

[0131] On the other hand, such as Figure 8 As shown in (D), without the linkage separation mechanism 70 linking the first plate 153 and the second plate 155, at the moment when the processing unit 13 reaches the intermediate position P3, a downward load of 200 kgf is applied to the central first guide block 62, and an upward load of 100 kgf is applied to the first guide block 62 at the -X side end. That is, the same load as when the processing unit 13 is in the maintenance position P2 is applied to each of the first guide blocks 62. In the initial stage of extraction, the sliding resistance of the first plate 153 immediately increases. In the initial stage of extraction, since insufficient power is given to the processing unit 13, a relatively large force is required to extract the processing unit 13.

[0132] As described above, when the extraction of the processing unit 13, including the hot plate 20, begins, the first plate 153 and the second plate 155 are linked by the linkage separation mechanism 70, thereby allowing for extraction with relatively little force. Furthermore, although the sliding resistance increases after the processing unit 13 passes the intermediate position P3, sufficient power can be applied to the processing unit 13 before this point. Therefore, the processing unit 13 can be easily extracted to the maintenance position P2.

[0133] In addition, such as Figure 8 (A) Figure 8 As shown in (D), when the processing unit 13 is withdrawn from the processing position P1 to the maintenance position P2, a greater load is applied to the first plate 153 than to the second plate 155. Therefore, if the rigidity of the first plate 153 is low, it may deform due to stress. Furthermore, if the first plate 153 deforms midway through the sliding movement, the sliding resistance may increase. Therefore, as... Figure 4 As shown, the rigidity of the first plate 153 can also be improved by making the thickness (dimension in the Y direction) of the first plate 153 greater than that of the second plate 155.

[0134] As described above, the substrate processing apparatus 1 includes a hot plate 20 serving as a heat treatment plate, a main frame 11, and at least one sliding member 15. The hot plate 20 heat-treats the substrate 9. The main frame 11 supports the hot plate 20. The sliding member 15 moves the hot plate 20 from a processing position P1 inside the main frame 11 to a maintenance position P2 along an X direction, which is a first direction intersecting the vertical direction. The sliding member 15 includes a guide plate 151, a first plate 153, a second plate 155, and a linkage separation mechanism 70. The guide plate 151 is fixed to the main frame 11 and extends along the X direction. The first plate 153 is slidably movable relative to the guide plate 151 along the X direction. The second plate 155 is fixed relative to the hot plate 20 and is slidably movable relative to the first plate 153 along the X direction. When the hot plate 20 moves from the processing position P1 to an intermediate position P3 between the processing position P1 and the maintenance position P2, the linkage separation mechanism 70 links the first plate 153 and the second plate 155 together. When the hot plate 20 moves from the intermediate position P3 to the maintenance position P2, the linkage separation mechanism 70 separates the second plate 155 from the first plate 153. According to this structure, when the hot plate 20 moves from the processing position P1 to the intermediate position P3, the first plate 153 can move in tandem with the hot plate 20. This prevents the first plate 153 from moving away from the hot plate 20, thus reducing the load applied to the first plate 153. As a result, the hot plate 20 can be easily extracted because the sliding resistance of the sliding member 15 is reduced.

[0135] The substrate processing apparatus 1 also includes a processing chamber 17. The processing chamber 17 houses the hot plate 20. A second plate 155 is fixed to the processing chamber 17. According to this structure, even if the load corresponding to the processing chamber 17 increases, the sliding resistance of the sliding member 15 can be reduced, thus allowing the hot plate 20 and the processing chamber 17 to be extracted smoothly.

[0136] The guide plate 151 has a first guide rail 61 extending in the X direction. The first plate 153 has a first guide block 62. The first guide block 62 engages with the first guide rail 61 and is slidably movable along the first guide rail 61. The first guide block 62 is fixed in the middle of the first plate 153 in the X direction. According to this structure, since the first guide rail 61 can be brought closer to the hot plate 20, the load applied to the first guide block 62 can be reduced.

[0137] The substrate processing apparatus 1 has a pair of sliding members 15. The pair of sliding members 15 are separated from each other in the Y direction, which is a second direction intersecting the X direction and the vertical direction, respectively. According to this structure, since the load of the hot plate 20 can be applied to the pair of sliding members 15, the hot plate 20 can be effectively extracted.

[0138] The hot plate 20 is positioned between a pair of sliding members 15 in the Y direction. According to this structure, since the pair of sliding members 15 are configured not to overlap with the hot plate 20 in the vertical direction, the size of the device in the vertical direction can be reduced.

[0139] The first plate 153 is disposed between the guide plate 151 and the second plate 155 in the Y direction. The linkage separation mechanism 70 has a movable pressing member 71, a limiting protrusion 72, a movable engaging protrusion 73, an elastic member 74, and a cam member 75. The movable pressing member 71 is disposed on the first plate 153 and is movable in the Y direction. The limiting protrusion 72 is disposed on the first plate 153 and protrudes toward the second plate 155. The movable engaging protrusion 73 is disposed on the second plate 155, is capable of engaging with the limiting protrusion 72, and is movable in the Y direction. The elastic member 74 is disposed on the second plate 155 and applies force to the movable engaging protrusion 73 toward the first plate 153. The cam member 75 is disposed on the guide plate 151 and protrudes toward the first plate 153. When the hot plate 20 moves from the processing position P1 to the intermediate position P3, the movable engaging protrusion 73 engages with the limiting protrusion 72 in the X direction. When the hot plate 20 reaches the intermediate position P3, the movable pressing member 71 is pressed by the cam member 75, thereby moving the movable pressing member 71 towards the second plate 155. The movable engaging protrusion 73 is also pressed by the movable pressing member 71, causing the movable engaging protrusion 73 to move further towards the second plate 155 than the limiting protrusion 72. According to this structure, during the movement of the hot plate 20 from the processing position P1 to the maintenance position P2, the movable engaging protrusion 73 of the second plate 155 engages with the limiting protrusion 72 of the first plate 153. This allows the first plate 153 and the second plate 155 to move together. Furthermore, when the hot plate 20 reaches the intermediate position P3, the movable engaging protrusion 73 of the second plate 155 moves further towards the second plate 155 than the limiting protrusion 72 of the first plate 153. This releases the engagement. Therefore, since the second plate 155 can be separated from and moved from the first plate 153, the second plate 155 and the hot plate 20 can be moved together from the middle position P3 to the maintenance position P2.

[0140] The substrate processing apparatus 1 also includes a substrate lifting mechanism 30 that raises and lowers the substrate 9 above the hot plate 20. A sliding member 15 can pull out the hot plate 20 and the substrate lifting mechanism 30 as a single unit. According to this structure, even if the load corresponding to the substrate lifting mechanism 30 increases, the sliding resistance of the sliding member 15 can be reduced, thus allowing for efficient extraction of the hot plate 20 and the substrate lifting mechanism 30.

[0141] <2. Second Implementation>

[0142] Figure 9This is a perspective view showing the linkage separation mechanism 70a of the substrate processing apparatus 1 according to the second embodiment. The sliding member 15 of the second embodiment has the linkage separation mechanism 70a instead of the linkage separation mechanism 70. The linkage separation mechanism 70a has an engaging protrusion 76 and an engaging recess 77.

[0143] A locking protrusion 76 is provided on the second plate 155. In this example, the locking protrusion 76 is fixed to the +X side end of the second plate 155. The locking protrusion 76 protrudes from the second plate 155 toward the first plate 153. A locking recess 77 is provided on the first plate 153. In this example, the locking recess 77 is fixed to the +X side end of the first plate 153. The locking recess 77 is recessed toward the second plate 155. Alternatively, the locking protrusion 76 may be provided on the first plate 153, and the locking recess 77 may be provided on the second plate 155.

[0144] During the movement of the processing unit 13 from the processing position P1 to the intermediate position P3, the front end of the engaging protrusion 76 is positioned inside the engaging recess 77. Thus, the engaging protrusion 76 hooks onto the engaging recess 77, and the second plate 155 engages with the first plate 153. In this state, when the second plate 155 moves together with the processing unit 13 at the processing position P1 toward the +X side, the second plate 155 and the first plate 153 move in conjunction. The engaging protrusion 76 and the engaging recess 77 are examples of engaging members that engage the second plate 155 with the first plate 153.

[0145] Furthermore, when the processing unit 13 reaches the intermediate position P3, the first plate 153 is stopped at the stop position by the stop mechanism 65. After the first plate 153 stops at the stop position, as the second plate 155 moves in the +X direction, the engaging protrusion 76 disengages from the engaging recess 77, thereby releasing the engagement between the first plate 153 and the second plate 155. Therefore, the second plate 155 can separate from the first plate 153 and move in the +X direction.

[0146] Furthermore, at least one of the engaging protrusion 76 and the engaging recess 77 may be formed to be elastically deformable. In this case, by moving the engaging protrusion 76 relative to the engaging recess 77 in the X direction, the engaging and disengaging of the engaging protrusion 76 and the engaging recess 77 can be easily performed.

[0147] As described above, the substrate processing apparatus 1 includes a stop mechanism 65. The stop mechanism 65 stops the first plate 153, which has moved to a predetermined stop position, relative to the guide plate 151. The linkage separation mechanism 70a has a locking protrusion 76 and a locking recess 77 as locking members. The locking protrusion 76 and the locking recess 77 engage the second plate 155 with the first plate 153. When the second plate 155 moves in the +X direction after the first plate 153 has been stopped at the stop position by the stop mechanism 65, the engagement of the locking protrusion 76 and the locking recess 77 with the first plate 153 and the second plate 155 is released. According to the above structure, the linkage and separation of the first plate 153 and the second plate 155 can be achieved with a relatively simple structure.

[0148] <3. Variations>

[0149] The above describes several embodiments, but the present invention is not limited to the embodiments described and can be modified in various ways.

[0150] For example, the linkage separation mechanisms 70 and 70a are linked by engaging the first plate 153 with the second plate 155. However, the linkage structure is not limited to this structure. For example, the linkage can also be achieved by using the magnetic force of a magnet to connect the first plate 153 and the second plate 155.

[0151] Furthermore, the substrate processing apparatus 1 is configured to heat the substrate 9 via the hot plate 20. However, the substrate processing apparatus 1 may also be configured to cool the substrate 9. In this case, the substrate processing apparatus 1 may include a heat treatment plate (cooling plate) without a heater, or a heat treatment plate (cooling plate) with a cooling mechanism such as a cooling water flow path or a Peltier element, instead of the hot plate 20. In addition, the processing chamber 17 may not be present.

[0152] The present invention has been described in detail, but the description is exemplary in all respects and the invention is not limited thereto. It can be interpreted that numerous variations not illustrated can be contemplated without departing from the scope of the invention. The structures described in the various embodiments and variations may be appropriately combined or omitted as long as they do not contradict each other.

Claims

1. A substrate processing apparatus, comprising: Heat treatment plate, used to heat treat the substrate; The main frame supports the heat treatment plate; as well as At least one sliding member moves the heat treatment plate from the processing position to the maintenance position inside the main frame along a first direction intersecting the vertical direction. The sliding member has: A guide plate is fixed to the main frame and extends along the first direction; The first plate is capable of sliding relative to the guide plate along the first direction; The second plate is fixed relative to the heat treatment plate and can slide relative to the first plate along the first direction; as well as The linkage separation mechanism, when the heat treatment plate moves from the processing position to the intermediate position between the processing position and the maintenance position, causes the first plate and the second plate to move together, and when the heat treatment plate moves from the intermediate position to the maintenance position, causes the second plate to separate from the first plate; The sliding member is disposed on the side of the heat treatment plate in a direction orthogonal to the first direction; The substrate processing apparatus has a pair of sliding members. The pair of sliding members are separated from each other in a second direction that intersects both the first direction and the vertical direction. The heat treatment plate is located between the pair of sliding members in the second direction. The first plate is disposed between the guide plate and the second plate in the second direction. The linkage separation mechanism includes: A movable pressing member is disposed on the first plate and is capable of moving along the second direction; A limiting protrusion is provided on the first plate and protrudes toward the second plate; A movable engaging protrusion is provided on the second plate, which can engage with the restricting protrusion and can move along the second direction; An elastic member is disposed on the second plate and applies force to the movable engaging protrusion toward the first plate; and A cam component is disposed on the guide plate and protrudes towards the first plate. When the heat treatment plate moves from the processing position to the intermediate position, the movable engaging protrusion engages with the restricting protrusion in the first direction. When the heat treatment plate reaches the intermediate position, the movable pressing member is pressed by the cam member, thereby moving the movable pressing member toward the second plate side. The movable engaging protrusion is pressed by the movable pressing member, thereby moving the movable engaging protrusion further toward the second plate side than the limiting protrusion.

2. The substrate processing apparatus according to claim 1, further comprising: The processing chamber houses the heat-treated plate. The second plate is fixed to the processing chamber.

3. The substrate processing apparatus according to claim 1, wherein, The guide plate has a guide rail extending along the first direction. The first plate has a guide block that engages with the guide rail and is capable of sliding along the guide rail. The guide block is fixed in the middle of the first plate in a first direction.

4. The substrate processing apparatus according to claim 1 or 2, further comprising: A substrate lifting mechanism allows the substrate to move up and down above the heat treatment plate. The sliding member can pull out the heat treatment plate and the substrate lifting mechanism as a whole.

Images