Housing, semiconductor module comprising housing, and method for assembling semiconductor module

Abstract

The present disclosure relates to a housing, a semiconductor module including the housing, and a method for assembling the semiconductor module. A housing for a semiconductor module includes a first housing member and a second housing member, where in an unmounted state of the housing, the first housing member and the second housing member are separated and discrete from each other, and in an assembled state of the housing, the first housing member and the second housing member are attached to each other and together form a closed frame, and a closed frame formed by the first housing member and the second housing member includes a mounting section for mounting the housing to the substrate such that the closed frame extends around the substrate.

Description

Technical Field

[0001] The present disclosure relates to a housing, a semiconductor module including the housing, and a method for assembling a semiconductor module. Background Art

[0002] The power semiconductor module arrangement often includes at least one substrate arranged in a housing. A semiconductor arrangement including a plurality of controllable semiconductor elements (e.g., two IGBTs in a half-bridge configuration) or non-controllable semiconductor elements (e.g., an arrangement of diodes) is arranged on each of the at least one substrate. Each substrate often includes a substrate layer (e.g., a ceramic layer), a first metallization layer deposited on a first side of the substrate layer, and a second metallization layer deposited on a second side of the substrate layer. For example, the controllable semiconductor elements are mounted on the first metallization layer. The second metallization layer can optionally be attached to a base plate.

[0003] The housing may be glued to the substrate. Gluing the housing to the substrate requires a pre-treatment step (e.g., plasma treatment of the substrate), a step of applying the glue to the substrate, and a hardening step of hardening the originally viscous glue, thereby permanently attaching the housing to the substrate. Each additional step during the assembly process requires additional process time and increases the overall cost of the power semiconductor module arrangement.

[0004] There is a need for a housing and a power semiconductor module arrangement including a housing that can be assembled in an efficient and cost-effective manner. Summary of the invention

[0005] A housing for a semiconductor module comprises: a first housing member and a second housing member, wherein, in an unmounted state of the housing, the first housing member and the second housing member are separated and discrete from each other, and in an assembled state of the housing, the first housing member and the second housing member are attached to each other and together form a closed frame, and the closed frame formed by the first housing member and the second housing member comprises a mounting section, which is used to mount the housing to the substrate so that the closed frame extends around the substrate.

[0006] A semiconductor module includes: a housing in its assembled shape; and a substrate, wherein the housing forms a closed frame around the substrate and applies pressure to at least some of the plurality of side surfaces of the substrate along the periphery of the substrate.

[0007] A method for assembling a semiconductor module includes arranging a housing to surround a substrate, wherein arranging the housing to surround the substrate includes: moving a first housing member and a second housing member toward each other, wherein the substrate is arranged between the first housing member and the second housing member; and attaching the first housing member to the second housing member so that the first housing member and the second housing member together form a closed frame around the substrate and apply pressure to at least some of the multiple side surfaces of the substrate along the periphery of the substrate.

[0008] The present invention can be better understood with reference to the following drawings and descriptions. The components in the drawings are not necessarily drawn to scale, but rather the emphasis is placed on illustrating the principles of the present invention. In addition, in the drawings, similar reference numerals throughout the different drawings represent corresponding parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a cross-sectional view of a semiconductor module in which a housing is glued to a substrate.

[0010] Figure 2 is a cross-sectional view of a semiconductor module including a housing according to an embodiment of the present disclosure.

[0011] Figure 3 is a top view of a semiconductor module including a housing according to an embodiment of the present disclosure during assembly of the semiconductor module.

[0012] Figure 4 Schematically shown is a cross-sectional view of a section of a semiconductor module according to an embodiment of the present disclosure.

[0013] Figure 5A and Figure 5B Schematically shows a cross-sectional view of a section of a semiconductor module according to an embodiment of the present disclosure ( Figure 5A ) and top view ( Figure 5B ).

[0014] Fig. 6A and Figure 6B Schematically shown is a cross-sectional view of a section of a semiconductor module according to an embodiment of the present disclosure.

[0015] Figure 7 A three-dimensional view of a semiconductor module including a housing according to an embodiment of the present disclosure is schematically shown.

[0016] Figure 8 A top view of a semiconductor module including a housing according to an embodiment of the present disclosure is schematically shown.

[0017] Fig. 9A and Fig. 9BSchematically shows a top view of a semiconductor module according to an embodiment of the present disclosure ( Fig. 9A ) and a three-dimensional cross-sectional view of a section of a semiconductor module ( Fig. 9B ).

[0018] Fig.10 is a top view of a semiconductor module including a housing according to other embodiments of the present disclosure during assembly of the semiconductor module.

[0019] Fig.11 is a top view of a semiconductor module including a housing according to further embodiments of the present disclosure during assembly of the semiconductor module.

[0020] Fig.12 is a top view of a semiconductor module including a housing according to further embodiments of the present disclosure during assembly of the semiconductor module. DETAILED DESCRIPTION

[0021] Reference will be made to the accompanying drawings in the detailed description below. The accompanying drawings show specific examples in which the present invention can be practiced. It should be understood that the features and principles described in connection with the various examples can be combined with each other unless otherwise specifically indicated. In the specification and claims, the designation of certain elements as "first element", "second element", "third element", etc. should not be understood as being used as an enumeration. On the contrary, such designation is only for the purpose of referring to different "elements". That is, for example, the presence of a "third element" does not require the presence of a "first element" and a "second element". The electrical lines or electrical connections described herein may be a single conductive element or may include at least two individual conductive elements connected in series and / or in parallel. The electrical lines and electrical connections may include metal and / or semiconductor materials and may be permanently conductive (i.e., non-switchable). The semiconductor body as described herein may be made of (doped) semiconductor material and may be a semiconductor chip or included in a semiconductor chip. The semiconductor body has an electrical connection pad and includes at least one semiconductor element having an electrode.

[0022] refer to Figure 1 , which shows a cross-sectional view of a semiconductor module 100. The semiconductor module 100 comprises a housing 7 and a substrate 10. The substrate 10 comprises a dielectric insulating layer 11, a (structured) first metallization layer 111 attached to the dielectric insulating layer 11, and a (structured) second metallization layer 112 attached to the dielectric insulating layer 11. The dielectric insulating layer 11 is disposed between the first metallization layer 111 and the second metallization layer 112.

[0023] Each of the first and second metallization layers 111, 112 may be made of or include one of the following materials: copper; copper alloy; aluminum; aluminum alloy; any other metal or alloy that remains solid during operation of the power semiconductor module arrangement. The substrate 10 may be a ceramic substrate, i.e., a substrate in which the dielectric insulating layer 11 is a ceramic (e.g., a thin ceramic layer). The ceramic may be made of or include one of the following materials: aluminum oxide; aluminum nitride; zirconium oxide; silicon nitride; boron nitride or any other dielectric ceramic. For example, the dielectric insulating layer 11 may be made of or include one of the following materials: Al2O3, AlN, SiC, BeO, or Si3N4. For example, the substrate 10 may be (for example) a direct copper bonding (DCB) substrate, a direct aluminum bonding (DAB) substrate, or an active metal brazing (AMB) substrate. In addition, the substrate 10 may be an insulated metal substrate (IMS). For example, an insulated metal substrate generally includes a dielectric insulating layer 11 containing a (filled) material such as epoxy or polyimide. For example, ceramic particles may be used to fill the material of the dielectric insulating layer 11. Such particles may include, for example, SiO2, Al2O3, AlN, or BN, and may have a diameter between about 1 μm and about 50 μm. The substrate 10 may also be a conventional printed circuit board (PCB) having a non-ceramic dielectric insulating layer 11. For example, the non-ceramic dielectric insulating layer 11 may be composed of or may include a cured resin.

[0024] The substrate 10 is arranged in the housing 7. Figure 1 In the example illustrated in , the substrate 10 forms a base surface of the housing 7 , while the housing 7 itself comprises side walls and a cover alone. In some power semiconductor module arrangements 100 , more than one substrate 10 is arranged within the same housing 7 .

[0025] One or more semiconductor bodies 20 may be arranged on the substrate 10. Each of the semiconductor bodies 20 arranged on the substrate 10 may include a diode, an IGBT (insulated gate bipolar transistor), a MOSFET (metal oxide semiconductor field effect transistor), a JFET (junction field effect transistor), a HEMT (high electron mobility transistor), or any other suitable controllable or uncontrollable semiconductor element.

[0026] The one or more semiconductor bodies 20 may form a semiconductor arrangement on the substrate 10. Figure 1 In FIG. 2 , only two semiconductor bodies 20 are shown by way of example. Figure 1 The second metallization layer 112 of the substrate 10 is a continuous layer. Figure 1In the example shown, the first metallization layer 111 is a structured layer. By "structured layer" it is meant that the first metallization layer 111 is not a continuous layer, but includes recesses between different sections of the layer. Figure 1 . Such a recess is schematically shown in . The first metallization layer 111 in this example includes four different sections. Different semiconductor bodies 20 can be mounted to the same section or different sections of the first metallization layer 111. The different sections of the first metallization layer may not have any electrical connection, or may be electrically connected to one or more other sections using (for example) bonding wires 3. For example, to give a few examples, the electrical connection 3 may also include a connecting plate or a connecting rail. The one or more semiconductor bodies 20 can be electrically and mechanically connected to the substrate 10 via a conductive connection layer 30. For example, such a conductive connection layer can be a solder layer, a conductive adhesive layer, or a sintered metal powder (for example, a sintered silver powder) layer.

[0027] Figure 1 The semiconductor module 100 shown in further includes a terminal element 4. The terminal element 4 is electrically connected to the first metallization layer 111 and provides an electrical connection between the inside and the outside of the housing 7. The terminal element 4 can be electrically connected to the first metallization layer 111 by means of a first end 41, while the second end 42 of the terminal element 4 extends from the housing 7. The terminal element 4 can be electrically contacted at the second end 42 of the terminal element 4 from the outside. However, Figure 1 The terminal elements 4 shown are examples only. The terminal elements 4 may be implemented in any other manner and may be arranged in any other position. For example, one or more terminal elements 4 may be arranged close to or adjacent to the side walls of the housing 7. Any other suitable implementation is possible. For example, the terminal elements 4 may include or may be composed of a metal such as copper, aluminum, gold, silver, or an alloy thereof. The terminal elements 4 may be electrically and mechanically connected to the substrate 10 via a conductive connecting layer (not specifically shown for the terminal elements 4). For example, such a conductive connecting layer may generally be a solder layer, a conductive adhesive layer, or a sintered metal powder (e.g., sintered silver powder) layer. According to other examples, the terminal elements 4 may be inserted into a hollow sleeve attached to the substrate 10 (not shown in the figure). Figure 1 Specific sleeve shown in FIG.

[0028] The conventional semiconductor module 100 generally further comprises an encapsulant or casting compound 5. For example, the casting compound 5 may consist of or may include a cured silicone gel, or may be a rigid molding compound. The casting compound 5 may at least partially fill the interior of the housing 7, thereby covering the components and electrical connections arranged on the substrate 10. The terminal element 4 may be partially embedded in the casting compound 5. However, at least its second end 42 is not covered by the casting compound 5 and extends from the casting compound 5 through the housing 7 to the outside of the housing 7. The casting compound 5 is configured to protect the components and electrical connections within the semiconductor module 100, especially within the housing 7, from certain environmental conditions and mechanical damage.

[0029] The housing 7 may be glued to the substrate 10 so as to maintain a desired position relative to the substrate 10. The glue joint 32 (glue layer) between the housing 7 and the substrate 10 is often sufficient to fix the housing 7 in its desired position relative to the substrate 10. However, gluing the housing 7 to the substrate 10 requires an additional pre-treatment step (e.g., plasma treatment of the substrate 10), a step of applying the glue to the substrate 10, and a hardening step of hardening the originally viscous glue, thereby attaching the housing 7 to the substrate 10. Each additional step during the assembly process requires additional process time and increases the overall cost of the power semiconductor module arrangement 100.

[0030] Reference now Figure 2 , which schematically shows a cross-sectional view of a power semiconductor module arrangement 100 according to an embodiment of the present disclosure. The housing 7 will not be glued to the substrate 10, but will be arranged to surround and clamp the substrate 10 from all sides. That is, the housing 7 forms a closed frame around the substrate 10, and applies pressure to at least some of the multiple side surfaces of the substrate 10 along the periphery of the substrate 10. The top surface of the substrate 10 is the surface on which the semiconductor body 20 is mounted, and the bottom surface of the substrate 10 is the surface opposite to the top surface and facing away from the semiconductor body 20. The side surface is the surface of the substrate extending from the top surface to the bottom surface. Although in the assembled state of the housing 7 and the power semiconductor module arrangement 100, the housing 7 forms a closed frame around the substrate 10, in its non-assembled state, it includes a first housing member 702 and a second housing member 704 that are separated and discrete from each other. In Figure 3 This is schematically illustrated in the top view of FIG.

[0031] During assembly of the housing 7, the housing 7 is arranged around the substrate 10. Arranging the housing 7 around the substrate 10 includes moving the first housing member 702 and the second housing member 704 toward each other, wherein the substrate 10 is arranged between the first housing member 702 and the second housing member 704. Figure 3The arrows in FIG. 700 schematically illustrate this. The substrate 10 is arranged between the first shell member 702 and the second shell member 704 so that the first side surface faces the first shell member 702 and the second side surface opposite to the first side surface faces the second shell member 704. When the first shell member 702 and the second shell member 704 are directly in contact with each other, the first shell member 702 can be attached to the second shell member 704 so that the first shell member 702 and the second shell member 704 form a closed frame around the substrate 10 and apply pressure to at least some of the side surfaces of the substrate 10 along the periphery of the substrate 10.

[0032] exist Figure 3 In the illustrated example, each of the first shell member 702 and the second shell member 704 includes a base portion 7022, 7042, a first arm 7024a, 7044a extending from a first end of the corresponding base portion 7022, 7042, and a second arm 7024b, 7044b extending from a second end of the corresponding base portion 7022, 7042, wherein the first arm 7024a of the first shell member 702 is configured to be coupled to the second arm 7044b of the second shell member 704, and the second arm 7024b of the first shell member 702 is configured to be coupled to the first arm 7044a of the second shell member 704. That is, each of the first shell member 702 and the second shell member 704 in this example is generally U-shaped. In its assembled state, each of the base portions 7022, 7042 forms one of the side surfaces of the housing 7. In their assembled state, the first arm 7024a of the first housing member 702 together with the second arm 7044b of the second housing member 704 and vice versa form other side surfaces of the housing 7. However, this is only an example.

[0033] For example, it is also generally possible that the first housing member 702 includes only the base portion 7022, while the second housing member 704 includes the base portion 7042, the first arm 7044a and the second arm 7044b, wherein the first arm 7044a and the second arm 7044b of the second housing member 704 are configured to be directly coupled to the base portion 7022 of the first housing member 702. According to a further example, each of the first housing member 702 and the second housing member 704 may include respective base portions 7022, 7042 and first arms 7024a, 7044a. That is, the first housing member 702 and the second housing member 704 may be substantially L-shaped. In this example, the first arm 7024a of the first housing member 702 may be configured to be directly coupled to the base portion 7042 of the second housing member 704. Similarly, the first arm 7044a of the second housing member 704 may be configured to be directly coupled to the base portion 7022 of the first housing member 702. Alternatively, any other suitable implementation is generally possible.

[0034] The closed frame formed by the first shell member 702 and the second shell member 704 includes a mounting section for mounting the shell 7 to the substrate 10. This mounting section can be arranged at a predetermined distance d10 from the lower ends of the first shell member 702 and the second shell member 704. For example, the lower ends of the first shell member 702 and the second shell member 704 are opposite to the upper ends of the first shell member 702 and the second shell member 704, wherein a cover or cap of the shell 7 can be attached to the upper ends of the first shell member 702 and the second shell member 704.

[0035] Since the closed frame formed by the first shell member 702 and the second shell member 704 applies a certain pressure (through Figure 2 ), so that the substrate 10 is fixed to the desired position relative to the housing 7. However, the pressure that can be applied to the substrate 10 by the housing 7 may be limited. That is, there is a risk that the clamping of the substrate 10 between the first housing member 702 and the second housing member 704 is insufficient to permanently fix the substrate 10 to the desired position relative to the housing 7.

[0036] Therefore, the housing 7 may include a fixing mechanism configured to prevent the substrate 10 disposed within the closed frame formed by the first housing member 702 and the second housing member 704 from moving out of its intended position or even falling out of the housing 7. Such a fixing mechanism may generally be implemented in any suitable manner. Figure 4 , FIG. 5 and FIG. 6 describe several possible examples of different fixing mechanisms.

[0037] According to some examples, the fixing mechanism includes a groove extending along the inner side of the closed frame formed by the first housing member 702 and the second housing member 704. Figure 4 In the illustrated example, the groove is implemented as a channel 76. The channel 76 may have a thickness t76 along the vertical direction y, which is similar to the dimension (i.e., thickness) of the substrate 10 in the same direction (e.g., the thickness of the dielectric insulating layer 11). In the assembled state, the channel 76 may extend along at least one of the side walls of the housing 7. According to one example, the channel 76 is a continuous channel extending around the entire inner periphery of the housing 7. During the assembly of the housing 7, the substrate 10 may be slid into the channel 76, such as by Figure 4 In this way, when the housing 7 is arranged to surround the substrate 10, the substrate 10 can be prevented from moving vertically. The channel 76 prevents the substrate 10 from moving in both the upward direction and the downward direction.

[0038] However, it is not necessarily required that the channel 76 extends continuously around the inner periphery of the housing 7 in its assembled state. According to other examples, the channel 76 may have two or more separate sections. For example, the first section may extend along a first side wall of the housing 7 (e.g., along the base portion 7022 of the first housing member 702), and the second section may extend along a second side wall of the housing 7 opposite to the first side wall (e.g., along the base portion 7042 of the second housing member 704). It is sufficient that the two opposite ends of the substrate 10 are arranged in different sections of the channel 76, so as to, for example, fix the substrate 10 to its intended position.

[0039] Reference now Figure 5A and Figure 5B As an alternative to or in addition to the grooves, the fixing mechanism may include one or more gripping elements 744 attached to the first housing member 702 and / or the second housing member 704 and configured to engage with corresponding mating elements attached to the substrate 10. According to one example, the fixing mechanism includes four gripping elements 744, for example, Figure 8 and Fig. 9AA schematic illustration is given. That is, for example, one gripping element 744 can be arranged in each of the four corners of a rectangular or square semiconductor module 100. However, it may be sufficient, for example, if the fixing mechanism consists of only two gripping elements 744 arranged on opposite sides of the housing 7. Any other number of gripping elements 744 is generally possible. In some semiconductor modules, a single gripping element 744 (just one) may be sufficient. The number of gripping elements 744 may depend on the size of the housing 7 and the size of the substrate 10 to be arranged in the housing 7. For example, the larger the housing 7 and the substrate 10, the more gripping elements 744 may be required to prevent the substrate 10 from moving out of its intended position. If the gripping elements 744 are combined with other kinds of fixing mechanisms (for example, Figure 4 In combination with the channel 76), a lower number of gripping elements 744 may be required.

[0040] Each gripping element 744 may have a fork-like geometry, for example, Figure 5B An exemplary representation of this is given in the top view of FIG. Each gripping element 744 can be configured to be fastened or engaged with a corresponding mating element attached to the substrate 10. The mating element can be a dedicated component that does not have any other function except providing a mating element for the gripping element 744. However, it is also possible that the role of the mating element can be played by an element with a different function in the power semiconductor module.

[0041] According to one example, the mating element includes a sleeve 44 having a collar 442 formed at an end of the sleeve 44 facing away from the substrate 10. The gripping element 744 having a fork-like geometry can be configured to grip the sleeve 44 in a section directly adjacent to the collar 442 and located between the collar and the substrate 10 (see, for example, Figure 5A ). The collar 442 may have a diameter that is larger than the diameter of the fork-shaped gripping element 744. In this way, the substrate 10 may be prevented from unexpectedly sliding out of the housing 7, because the collar 442 will not be able to slide through the gripping element 744.

[0042] As has been described above, the sleeve 44 may be a dedicated element that only functions as a counterpart element of the gripping element 744. However, the sleeve is often used in the semiconductor module 100, for example, to attach the terminal element 4 to the substrate 10. Figure 5AThe terminal element 4 inserted into the sleeve 44 is schematically shown by dotted lines. That is, the terminal element 4 can be inserted into the sleeve 44, and the sleeve 44 provides a mechanical and electrical connection between the terminal element 4 and the substrate 10. Using the sleeve 44 or any other component that already exists on the substrate 10 for other reasons as a matching component has the advantage of not requiring additional space to provide a matching element on the substrate 10. The gripping element 744 can be configured to fasten or engage any other element that exists on the substrate 10 and is suitable for being fastened as a substitute for the sleeve 44. While the first shell member 702 and the second shell member 704 are attached to each other (the substrate 10 with the matching element arranged thereon is arranged therebetween), a connection between one or more gripping elements 744 and the corresponding matching elements can be easily formed.

[0043] exist Figure 5A In the illustrated example, the second housing member 704 includes a groove, which is not a channel but is implemented as a recess 78 (or step) formed at the lower end of the second housing member 704. The recess 78 can be similarly formed at the lower end of the first housing member 702. The recess 78 prevents the substrate 10 from unexpectedly sliding into the housing 7 in the vertical direction y. At the same time, pressure can be applied to the corresponding side surface of the substrate 10 along the horizontal direction x perpendicular to the vertical direction y. In this way, the substrate 10 is firmly fixed in its intended position and cannot move in the horizontal plane or move into the housing 7 in the vertical direction y.

[0044] From Figure 4 The channel 76 and the Figure 5A As can be seen from the difference between the recesses 78 illustrated in FIG. 1 and FIG. 2 , the channel 76 contacts the substrate 10 from above, from below and from the side, and is therefore able to prevent the substrate 10 from moving in all directions in the space when the substrate 10 is arranged in its final installation position in the housing 7. The recess 78 contacts the substrate 10 only from above and from the side. Therefore, it is possible to prevent the substrate 10 from moving in most directions in the space, but not in all directions. Specifically, the recess 78 does not prevent the substrate 10 from moving outside the housing 7 in the vertical direction y.

[0045] Reference now Fig. 6A and Figure 6B , which schematically shows another example of a fixing mechanism. In this example, the second housing member 704 (and the first housing member 702, but it is not in Fig. 6A and Figure 6B5 . By means of the recess 78, the substrate 10 is prevented from unexpectedly moving in the horizontal plane and from unexpectedly moving in the vertical direction y toward the housing 7. In order to also prevent the substrate 10 from unexpectedly sliding out of the housing 7 in the vertical direction, the first housing member 702 and / or the second housing member 704 may further include one or more grooves 7046 extending vertically from the bottom end of the corresponding housing member into the housing member. The fixing mechanism in this example further includes one or more plug elements 7048, each of which includes a first section configured to be inserted into one of the one or more grooves 7046 and a second section configured to push the substrate 10 toward the housing 7, wherein the substrate 10 is arranged in the recess 78 and is located between the second section of the plug element 7048 and the housing 7. Fig. 6A The plug element 7048 is shown in an uninstalled state, and Figure 6B Plug element 7048 is shown in the installed state. It can be seen that in the installed state, plug element 7048 and groove 78 together form a channel, which is similar to the above connection. Figure 4 Similar to the description. Fig. 6A and Figure 6B In the illustrated example, plug element 7948 is generally L-shaped. However, plug element 7048 may alternatively have any other suitable shape.

[0046] In general, the first shell member 702 can be attached to the second shell member 704 by any suitable means. According to one example, the first shell member 702 can be attached to the second shell member 704 by an adhesive connection or a welding connection. However, bonding or welding the shell members 702, 704 to each other requires additional steps to form the connection. Therefore, according to another example, the first shell member 702 and the second shell member 704 are attached to each other by the first snap connection portion 720a and the second snap connection portion 720b in the assembled state of the shell 7. For example, Figure 7 , Figure 8 and Fig. 9AA schematic illustration is given for this. The first snap connection 720a may include a first snap joint 722a attached to or integrally formed with the first housing member 702, and a first mating component 724a attached to or integrally formed with the second housing member 704, wherein the first snap joint 722a and the first mating component 724a are configured to engage with each other to form the first snap connection 720a. The second snap connection 720b may include a second snap joint 722b attached to or integrally formed with the second housing member 704, and a second mating component 724b attached to or integrally formed with the first housing member 702, wherein the second snap joint 722b and the second mating component 724b are configured to engage with each other to form the second snap connection 720b.

[0047] from Figure 8 As can be seen, the first snap joint 722a can be attached to or integrally formed with the end of the first arm 7024a of the first housing member 702, and the first mating component 724a can be attached to or integrally formed with the end of the second arm 7044b of the second housing member 704. Similarly, the second snap joint 722b can be attached to or integrally formed with the end of the first arm 7044a of the second housing member 704, and the second mating component 724b can be attached to or integrally formed with the end of the second arm 7024b of the first housing member 702. When the first housing member 702 and the second housing member 704 are moved toward each other during assembly of the power semiconductor module arrangement, the snap joints 722a, 722b can easily engage with the corresponding mating components 724a, 724b. The snap connections 720a, 720b are generally known and can be implemented in many different suitable ways. Most snap connections generally have in common that they can be easily formed without much effort, but cannot be easily disengaged again. Some snap connections are even permanent and cannot be disengaged without damaging the elements of the snap connections. However, most snap connections are generally disengageable, but require a certain amount of force to do so. If the snap connections 720a, 720b for attaching the first housing member 702 and the second housing member 704 to each other are not intentionally opened, the probability that the snap connections 720a, 720b are unexpectedly disengaged during the handling and normal operation of the power semiconductor module arrangement is generally close to zero.

[0048] Figure 71 shows a three-dimensional view of a semiconductor module according to an embodiment of the present disclosure in a mounted state of a housing 7. A schematic illustration of exemplary snap-fit ​​connections 720a, 720b is given in more detail. However, as mentioned above, the snap-fit ​​connections 720a, 720b may be implemented in any other suitable manner and are not limited to Figure 7 The specific geometric structure is shown as an example in FIG. Figure 8 Schematically shows the Figure 7 Top view of a semiconductor module. Figure 8 In the illustrated example, the snap connections 720a, 720b have not yet been formed. Furthermore, the gripping element 744 has not yet engaged with the corresponding mating element (sleeve 44) on the substrate 10. Fig. 9A Schematically shows the Figure 7 top view of arrangement of Fig. 9B The three-dimensional cross-sectional view through a section of the semiconductor module schematically shows in more detail the connection formed between the gripping element 744 and a corresponding counter-element arranged on the substrate 10 , namely the sleeve 44 .

[0049] Reference now Fig.10 , Fig.11 and Fig.12 , the snap-fit ​​connector and the mating component may have different shapes when viewed from above. For example, Fig.10 A snap-fit ​​connection of what may be referred to as a "maze design" is schematically shown. In this example, the snap-fit ​​joint may have a fork-like geometry, and the mating component may generally have the shape of a single finger, for example, which may engage with the fork-like snap-fit ​​joint. Fig.11 In the illustrated example, the snap-fit ​​connector and the mating component all have a single-finger shape, which may be referred to as a "single overlap design," for example. Fig.12 In the illustrated examples, on the other hand, the snap-fit ​​joints and the mating components all have a fork-like geometry, which can be referred to as a "multi-tooth design," for example. In all examples, the first housing member 702 and the second housing member 704 (particularly the snap-fit ​​joints and the corresponding mating components) have some degree of overlap in their final installed positions. For example, in Fig.12 In the illustrated example (multi-tooth design), the creepage distance of the snap-in connection in the region between the interior and the exterior of the housing 7 is shorter due to the bifurcated geometry (multi-tooth design). Fig.11 The single overlap design of is significantly longer. That is, the specific implementation of the snap connection can be selected based on the requirements regarding creepage distance.

[0050] exist Fig.10 , Fig.11 and Fig.12In the illustrated examples, both snap-fit ​​connectors are attached to or integrally formed with the second shell member 704, and both mating components are attached to or integrally formed with the first shell member 702. This is generally possible. However, in these examples, the first shell member 702 and the second shell member 704 are inevitably different from each other. That is, during the assembly of the shell 7, careful attention must be paid to using the correct elements, i.e., a first shell member 702 and a second shell member 704. Furthermore, two different shell members need to be manufactured. That is, if the shell members 702, 704 are formed by a molding method, two different formats (e.g., molds) are required. This situation can be avoided if the first shell member 702 and the second shell member 704 are identical to each other. The first shell member 702 and the second shell member 704 are identical to each other meaning that they have the same shape, the same size and are formed of the same material. In this way, the first shell member 702 can be easily replaced by the second shell member 704, and vice versa, thereby obtaining the same shell 7. In other words, Figure 7 , Figure 8 and Fig. 9A The identical first housing member 702 and second housing member 704 in the illustrated example are rotationally symmetric about a rotation axis (the rotation axis is not specifically illustrated in the drawings).

Claims

1. A housing (7) for a semiconductor module (100), comprising: A first housing member (702) and a second housing member (704), wherein In an unmounted state of the housing (7), the first housing member (702) and the second housing member (704) are separated and discrete from each other. In the assembled state of the housing (7), the first housing member (702) and the second housing member (704) are attached to each other and together form a closed frame, and The closed frame formed by the first housing member (702) and the second housing member (704) includes a mounting section for mounting the housing (7) to a substrate (10) such that the closed frame extends around the substrate (10).

2. The housing (7) according to claim 1, wherein: Each of the first housing member (702) and the second housing member (704) comprises: Basic part (7022, 7042), a first arm (7024a, 7044a) extending from a first end of the corresponding base portion (7022, 7042), and A second arm (7024b, 7044b) extending from a second end of the corresponding base portion (7022, 7042), wherein The first arm (7024a) of the first housing member (702) is configured to be coupled to the second arm (7044b) of the second housing member (704), and The second arm (7024b) of the first housing member (702) is configured to be coupled to the first arm (7044a) of the second housing member (704).

3. The housing (7) according to claim 1 or 2 further comprises a fixing mechanism, which is configured to prevent the substrate (10) arranged in the closed frame formed by the first housing member (702) and the second housing member (704) from falling out of the housing (7).

4. The housing (7) according to claim 3, wherein: The securing mechanism includes a groove extending along the inner side of the closed frame formed by the first housing member (702) and the second housing member (704).

5. The housing (7) according to claim 4, wherein: The grooves include channels (76) or depressions (78).

6. The housing (7) according to claim 3, 4 or 5, wherein: The securing mechanism comprises one or more gripping elements (744) attached to the first housing member (702) and / or the second housing member (704) and configured to engage with corresponding mating elements attached to the substrate (10).

7. The housing (7) according to claim 6, wherein: The mating element comprises a sleeve (44) having a collar (442) formed at an end of the sleeve (44) facing away from the substrate (10), and wherein the gripping element (744) comprises a fork-like geometry and is configured to clasp the sleeve (44) in a section directly adjacent to the collar (442) and located between the collar and the substrate (10).

8. The housing (7) according to any one of claims 3 to 7, wherein: The first shell member (702) and / or the second shell member (704) include one or more grooves (7046), and the fixing mechanism includes one or more plug elements (7048), each of the one or more plug elements (7048) includes a first section and a second section, the first section is configured to be inserted into one of the one or more grooves (7046), and the second section is configured to push the substrate (10) arranged between the second section and the corresponding shell member (702, 704) toward the shell (7).

9. The housing (7) according to any one of the preceding claims, wherein The first housing member (702) and the second housing member (704) are attached to each other by a first snap-fit ​​connection portion (720a) and a second snap-fit ​​connection portion (720b) ​​in an assembled state of the housing (7).

10. The housing (7) according to claim 9, wherein The first buckle connection portion (720a) comprises: a first snap-fit ​​joint (722a) attached to or integrally formed with the first housing member (702), and a first mating component (724a) attached to or integrally formed with the second housing member (704), wherein the first snap-fit ​​joint (722a) and the first mating component (724a) are configured to engage with each other to form the first snap-fit ​​connection (720a), and The second snap-on connection portion (720b) ​​includes: a second snap-on joint (722b) attached to the second shell member (704) or formed integrally with the second shell member (704), and a second mating component (724b) attached to the first shell member (702) or formed integrally with the first shell member (702), wherein the second snap-on joint (722b) and the second mating component (724b) are configured to engage with each other to form the second snap-on connection portion (720b).

11. The housing (7) according to any one of the preceding claims, wherein The first housing member (702) and the second housing member (704) are identical to each other.

12. A semiconductor module (100), comprising: A housing (7) according to any one of claims 1 to 11 in its assembled shape; as well as A substrate (10), wherein The housing (7) forms a closed frame surrounding the substrate (10) and applies pressure to at least some of the plurality of side surfaces of the substrate (10) along the periphery of the substrate (10).

13. A method for assembling a semiconductor module (100), the method comprising arranging a housing (7) according to any one of claims 1 to 11 around a substrate (10), wherein: Arranging the housing (7) to surround the substrate (10) comprises: moving the first housing member (702) and the second housing member (704) toward each other, wherein the substrate (10) is disposed between the first housing member (702) and the second housing member (704), and The first shell member (702) is attached to the second shell member (704) so ​​that the first shell member (702) and the second shell member (704) together form a closed frame around the substrate (10) and apply pressure to at least some of the multiple side surfaces of the substrate (10) along the periphery of the substrate (10).

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